Liquid supply spraying device for wafer cleaning

Abstract

The invention belongs to the technical field of wafer cleaning, and particularly relates to a wafer cleaning liquid supply spraying device which comprises mounting racks, an open cleaning chamber, a spraying chamber and an open filtering chamber, the bottoms of the cleaning chamber and the spraying chamber are fixedly connected with a plurality of mounting racks, and the spraying chamber is located on the right side of the cleaning chamber; and the filtering chamber is positioned below the cleaning chamber. According to the device, a rotating shaft rotates to drive a driven rotating shaft to rotate through a linkage chain wheel and a transmission chain, the driven rotating shaft drives a sector gear to rotate, the sector gear firstly drives a power frame to move upwards and then move downwards, the action is reciprocated, and a Z-axis drawing rod drives an inner piston to slide up and down in a first cavity; cleaning water in the filtering chamber is sucked through the water inlet pipeline, and is fed into the second cavity through the water supplementing pipe until the cleaning water is sprayed into the cleaning chamber through the spraying pipeline and the water spraying head, so that the effect of continuously supplying liquid is achieved, the cleaning process is carried out continuously, the liquid is supplied while cleaning is carried out, and the cleaning benefit is improved.

Description

Technical Field

[0001] The invention relates to a spray device, in particular to a liquid supply spray device for wafer cleaning. Background Art

[0002] Wafer is one of the key materials in semiconductor manufacturing, usually a round silicon substrate. It is the basis for manufacturing integrated circuits (ICs) and other semiconductor devices; wafers are usually made of high-purity single-crystal silicon materials, with a very flat surface, and are precisely processed and cleaned. Wafer cleaning is one of the most important steps in semiconductor manufacturing, which aims to remove various contaminants and residues on the surface of the wafer to ensure high-quality semiconductor products in subsequent process steps.

[0003] The cleaning process usually includes multiple steps, such as using specific solvents, ultrasonic cleaning, pure water washing, etc., to ensure that the wafer surface is clean and dust-free. Only after the wafer is cleaned can it proceed to key steps such as deposition, etching, and photolithography, thereby ensuring the manufacture of semiconductor devices that meet the requirements. Wafer cleaning fixtures are equipment used in the semiconductor manufacturing process to maintain the stable position of the wafer during the cleaning process. There are many types of wafer cleaning fixtures on the market, but most of the fixtures currently use a fixed structure design. In actual use, the wafer fixture is directly immersed in the cleaning tank, so that the wafer is cleaned in the cleaning tank. Although this static immersion cleaning method can also achieve the cleaning purpose, because the wafer is in a static state, it will affect the quality of its cleaning to a certain extent; and during the cleaning process, liquid cannot be supplied while cleaning, and an additional liquid supply device is required, resulting in poor cleaning efficiency.

[0004] In view of this, the present invention designs a liquid supply spraying device for wafer cleaning. Summary of the invention

[0005] The main purpose of the present disclosure is to provide a liquid supply spraying device for wafer cleaning, so as to effectively solve the problems raised by the inventor in the above-mentioned background technology.

[0006] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0007] A liquid supply spray device for wafer cleaning, comprising a mounting frame, an open cleaning chamber, a spray chamber and an open filter chamber, the bottoms of the cleaning chamber and the spray chamber are fixedly connected with a plurality of mounting frames, the spray chamber is located on the right side of the cleaning chamber, the filter chamber is located below the cleaning chamber, a drainage pipe is fixedly connected to the bottom of the cleaning chamber, a first manual valve is installed on the drainage pipe, the lower end of the drainage pipe faces the filter chamber, both sides of the inner wall in the cleaning chamber are rotatably installed with a rotating shaft, and the ends of the two rotating shafts close to each other are fixedly connected with a mounting plate, and four groups of wafer placement devices distributed in a ring array are arranged between the two mounting plates;

[0008] Each group of the wafer placement devices includes eight wafer storage frames and eight external movable frames;

[0009] The wafer storage frame is used to place wafers to be cleaned, and the outer movable frame is used to limit the movement of the wafers in the wafer storage frame to prevent the wafers from escaping from the wafer storage frame;

[0010] A driving mechanism, the driving mechanism is used to drive the rotating shaft to rotate;

[0011] A suction mechanism, the suction mechanism is used to transport the cleaning water in the spray chamber into the cleaning chamber;

[0012] A filtering mechanism, the filtering mechanism being used to purify the cleaning water discharged from the cleaning chamber;

[0013] A linkage mechanism is used in conjunction with the driving mechanism and the suction mechanism.

[0014] Preferably, adjacent wafer storage frames are fixedly connected with a connecting shaft, the outer movable frame is rotatably mounted on the connecting shaft, and the wafer storage frame is located inside the outer movable frame, and the two wafer storage frames on the left and right sides that are away from each other are fixedly connected with a supporting shaft on one side, and the two supporting shafts are respectively fixed on two mounting plates, the wafer storage frame and the outer movable frame are both water filtering mesh frame structures, and the outer movable frame is cylindrical and the wafer storage frame is semi-cylindrical, an entrance is provided at the top of the outer movable frame, and the entrance leads to the opening of the wafer storage frame, a limiting threaded barrel is inlaid at the bottom of the wafer storage frame, a circular hole is provided at the bottom of the outer movable frame, a T-shaped threaded column is threadedly connected to the inner thread of the limiting threaded barrel, and the T-shaped threaded column passes through the circular hole and abuts against the outer movable frame.

[0015] Preferably, the driving mechanism comprises a driving motor, the driving motor is fixedly installed on the left side of the cleaning chamber, and the output end of the driving motor is fixedly connected to the rotating shaft on the left side.

[0016] Preferably, the suction mechanism includes an inner sealing plate, a spray pipeline, a water supply pipe, a Z-axis suction rod, an inner piston, and a power frame. The inner sealing plate is fixedly installed in the spray chamber, and the inner sealing plate divides the spray chamber into a first chamber and a second chamber. The lower end portion of the inner sealing plate is inlaid with a water supply pipe, and the water supply pipe connects the first chamber and the second chamber. A spray pipeline is installed through the top of the spray chamber, and the lower end of the spray pipeline extends to the bottom of the second chamber. The upper end of the spray pipeline extends into the cleaning chamber and is fixedly connected to a water spray head. An inner piston is slidably installed in the first chamber, and A Z-axis pumping rod is fixedly connected to the top of the inner piston, and the Z-axis pumping rod is movably installed on the top of the spray chamber. The power frame is fixedly installed on the end of the Z-axis pumping rod outside the spray chamber. A water inlet pipe is fixedly connected to the bottom of the first chamber, and the other end of the water inlet pipe is fixedly connected to the lower side of the filter chamber. A No. 1 one-way valve is installed in the water inlet pipe, and the No. 1 one-way valve only allows fluid to enter the first chamber from the filter chamber through the water inlet pipe. A No. 2 one-way valve is installed on the water supply pipe, and the No. 2 one-way valve only allows fluid to enter the second chamber from the first chamber through the water supply pipe.

[0017] Preferably, a water supply pipe communicating with the second chamber is fixedly connected to the top of the spray chamber, and a second manual valve is installed on the water supply pipe.

[0018] Preferably, the linkage mechanism includes a driven rotating shaft, a sector gear, a linkage sprocket and a transmission chain. The driven rotating shaft is rotatably installed on the outside of the cleaning chamber, and the driven rotating shaft and the end of the right rotating shaft extending outside the cleaning chamber are fixedly connected with a linkage sprocket. The two linkage sprockets are connected by a transmission chain. The right end of the driven rotating shaft extends into the power frame and is fixedly connected with the sector gear. Racks are fixedly installed on both side walls in the power frame, and the sector gear meshes with the gear table on one side for transmission.

[0019] Preferably, the filtering mechanism comprises a purification filter screen, which is overlapped on the top of the open filter chamber, and the bottom of the cleaning chamber is fixedly connected with a threaded rod, and a threaded sleeve is screwed on the threaded rod, and the bottom of the threaded sleeve is against the edge of the purification filter screen.

[0020] In view of this, compared with the prior art, the beneficial effects of the present invention are:

[0021] (i) In the present application, the wafer to be cleaned is moved into the wafer storage frame through the entrance so that its movement is restricted to a small range. The T-shaped threaded column is unscrewed, and the outer movable frame is rotated 180 degrees so that the round hole faces upward, and the entrance is moved to the bottom of the wafer storage frame, so that the wafer is limited in the wafer storage frame to prevent the wafer inside the wafer storage frame from falling out during subsequent movement. The T-shaped threaded column is then screwed into the limiting threaded barrel, and the T-shaped threaded column presses the outer movable frame to limit the movement of the outer movable frame, thereby effectively preventing the wafer from being thrown out.

[0022] (ii) In the present application, during cleaning, cleaning water is poured into the cleaning chamber so that the wafers are initially irrigated, the first manual valve is opened to allow the cleaning water to enter the filter chamber through the drainage pipe, and then the first manual valve is closed. At this time, the cleaning chamber still contains cleaning water, and the purification filter purifies and filters the used cleaning water and retains it in the filter chamber so that it can be reused, avoiding waste and achieving the purpose of water saving and environmental protection.

[0023] (III) In the present application, the rotation of the rotating shaft drives the driven rotating shaft to rotate through the interlocking sprocket and the transmission chain, and the driven rotating shaft drives the fan gear to rotate, so that it first drives the power frame to move upward and then downward, and repeats this action, so that the Z-axis pump rod drives the inner piston to slide up and down in the first chamber, and then sucks the cleaning water in the filter chamber through the water inlet pipe, and sends the cleaning water into the second chamber through the water supply pipe, until the cleaning water is sprayed into the cleaning chamber through the spray pipe and the water spray head, so as to achieve the effect of continuous liquid supply, so that the cleaning process can be carried out continuously, and liquid can be supplied while cleaning, thereby improving the cleaning efficiency.

[0024] (IV) In the present application, the threaded sleeve initially contacts the edge of the purification filter, so that it is fixed at the open end of the filter chamber. When cleaning the filtered impurities, the threaded sleeve is rotated to rotate and move upward along the threaded rod and detach from the purification filter. The purification filter is then lifted upward to complete its removal operation. The use is very convenient and the purification filter is easy to clean. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Shown is a schematic diagram of the internal structure of the liquid supply spray device for wafer cleaning provided by the present invention;

[0026] Figure 2 Shown is a schematic diagram of the internal structure of the filter chamber;

[0027] Figure 3 Shown is a schematic diagram of the internal structure of the spray room;

[0028] Figure 4 Shown is a side view of the power frame and sector gear;

[0029] Figure 5 Shown Figure 1 Schematic diagram of the local structure in;

[0030] Figure 6 Shown Figure 5 Schematic diagram of the local structure in;

[0031] Figure 7 Shown is a side cross-sectional view of the wafer storage frame and the outer movable frame;

[0032] Figure 8 Shown Figure 7 Schematic diagram of the Chinese and foreign moving frames after rotating 180 degrees;

[0033] Fig. 9 Shown is a three-dimensional view of a T-thread column;

[0034] Fig.10 Shown is a side view of the layout of the mounting plate and the outer movable frame.

[0035] icon:

[0036] 1- Install the rack;

[0037] 2-cleaning chamber; 201-swivel shaft; 202-mounting plate; 203-driving motor; 204-driven shaft; 205-sector gear; 206-linked sprocket; 207-transmission chain; 208-drainage pipe; 209-first manual valve;

[0038] 3-spray chamber; 300-inner sealing plate; 301-spray pipeline; 3011-spray head; 302-water supply pipe; 303-Z-axis pumping rod; 304-inner piston; 305-power frame; 306-water supply pipeline; 307-second manual valve;

[0039] 4-filter chamber; 401-purification filter; 402-water inlet pipe;

[0040] 5-wafer storage frame; 501-connection shaft; 502-support shaft; 503-limiting threaded cylinder;

[0041] 6-external movable frame; 601-entrance; 602-round hole; 603-T-type threaded column;

[0042] 7-threaded rod;

[0043] 8-Threaded sleeve. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] See also Figure 1-10 , the present invention provides the following embodiments:

[0046] A liquid supply spray device for wafer cleaning, comprising a mounting frame 1, an open cleaning chamber 2, a spray chamber 3 and an open filter chamber 4, the bottoms of the cleaning chamber 2 and the spray chamber 3 are fixedly connected with a plurality of mounting frames 1, the spray chamber 3 is located on the right side of the cleaning chamber 2, the filter chamber 4 is located below the cleaning chamber 2, a drainage pipe 208 is fixedly connected to the bottom of the cleaning chamber 2, and a first manual valve 209 is installed on the drainage pipe 208, the lower end of the drainage pipe 208 faces the filter chamber 4, both sides of the inner wall of the cleaning chamber 2 are rotatably installed with a rotating shaft 201, and the ends of the two rotating shafts 201 close to each other are fixedly connected with a mounting plate 202, and four groups of wafer placement devices distributed in a ring array are arranged between the two mounting plates 202;

[0047] Each set of wafer placement devices includes eight wafer storage frames 5 and eight external movable frames 6;

[0048] The wafer storage frame 5 is used to place the wafers to be cleaned, and the outer movable frame 6 is used to limit the movement of the wafers in the wafer storage frame 5 to prevent the wafers from escaping from the wafer storage frame 5;

[0049] A driving mechanism, the driving mechanism is used to drive the rotating shaft 201 to rotate;

[0050] A suction mechanism, the suction mechanism is used to transport the cleaning water in the spray chamber 3 to the cleaning chamber 2;

[0051] A filtering mechanism, the filtering mechanism is used to purify the cleaning water discharged from the cleaning chamber 2;

[0052] The linkage mechanism is used in conjunction with the driving mechanism and the suction mechanism.

[0053] Specifically, a connecting shaft 501 is fixedly connected between adjacent wafer storage frames 5, and the outer movable frame 6 is rotatably installed on the connecting shaft 501, and the wafer storage frame 5 is located in the outer movable frame 6, and the two wafer storage frames 5 on the left and right sides that are away from each other are fixedly connected with a supporting shaft 502, and the two supporting shafts 502 are respectively fixed on two mounting plates 202, and the wafer storage frame 5 and the outer movable frame 6 are both mesh frame structures for filtering water, and the outer movable frame 6 is cylindrical and the wafer storage frame 5 is semi-cylindrical, an entrance 601 is provided at the top of the outer movable frame 6, and the entrance 601 leads to the opening of the wafer storage frame 5, and a limiting threaded barrel 503 is inlaid at the bottom of the wafer storage frame 5, and a circular hole 602 is provided at the bottom of the outer movable frame 6, and the limiting threaded barrel 503 is internally threadedly connected with a T-shaped threaded column 603, and the T-shaped threaded column 603 passes through the circular hole 602 and abuts against the outer movable frame 6.

[0054] Specifically, the driving mechanism includes a driving motor 203 , which is fixedly installed on the left side of the cleaning chamber 2 , and an output end of the driving motor 203 is fixedly connected to the rotating shaft 201 on the left side.

[0055] Specifically, the filtering mechanism includes a purification filter 401, which is overlapped on the top of the open filter chamber 4. The bottom of the cleaning chamber 2 is fixedly connected with a threaded rod 7, and a threaded sleeve 8 is screwed on the threaded rod 7. The bottom of the threaded sleeve 8 is against the edge of the purification filter 401. The purification filter 401 can be disassembled for cleaning to keep the filtered water unobstructed.

[0056] Specifically, the suction mechanism includes an inner sealing plate 300, a spray pipeline 301, a water supply pipe 302, a Z-axis suction rod 303, an inner piston 304, and a power frame 305. The inner sealing plate 300 is fixedly installed in the spray chamber 3, and the inner sealing plate 300 divides the spray chamber 3 into a first chamber and a second chamber. The lower end of the inner sealing plate 300 is inlaid with a water supply pipe 302, and the water supply pipe 302 connects the first chamber and the second chamber. The top of the spray chamber 3 is penetrated by a spray pipeline 301, and the lower end of the spray pipeline 301 extends to the bottom of the second chamber. The upper end of the spray pipeline 301 extends into the cleaning chamber 2 and is fixedly connected to a water spray head 3011. An inner sealing plate 300 is slidably installed in the first chamber. The piston 304 is fixedly connected to the top of the inner piston 304 with a Z-axis draw rod 303, which is movably installed on the top of the spray chamber 3. The power frame 305 is fixedly installed on one end of the Z-axis draw rod 303 outside the spray chamber 3. The bottom of the first chamber is fixedly connected to a water inlet pipe 402, and the other end of the water inlet pipe 402 is fixedly connected to the lower side of the filter chamber 4. A No. 1 one-way valve is installed in the water inlet pipe 402, and the No. 1 one-way valve only allows fluid to enter the first chamber from the filter chamber 4 through the water inlet pipe 402. A No. 2 one-way valve is installed on the water supply pipe 302, and the No. 2 one-way valve only allows fluid to enter the second chamber from the first chamber through the water supply pipe 302.

[0057] Specifically, the linkage mechanism includes a driven shaft 204, a sector gear 205, a linkage sprocket 206 and a transmission chain 207. The driven shaft 204 is rotatably installed on the outside of the cleaning chamber 2, and the driven shaft 204 and the end of the right rotating shaft 201 extending outside the cleaning chamber 2 are fixedly connected with a linkage sprocket 206. The two linkage sprockets 206 are connected by a transmission chain 207. The right end of the driven shaft 204 extends into the power frame 305 and is fixedly connected with the sector gear 205. Racks are fixedly installed on both side walls in the power frame 305, and the sector gear 205 is meshed with a gear table on one side for transmission.

[0058] Specifically, a water supply pipe 306 communicating with the second chamber is fixedly connected to the top of the spray chamber 3, and a second manual valve 307 is installed on the water supply pipe 306. When the second manual valve 307 is opened, cleaning water is injected into the second chamber through the water supply pipe 306.

[0059] The specific implementation of this embodiment is as follows: the wafer to be cleaned is moved into the wafer storage frame 5 through the entrance 601 to limit its movement within a small range, the T-shaped threaded column 603 is screwed down, the outer movable frame 6 is rotated 180 degrees to make the round hole 602 face upward, and the entrance 601 is moved to the bottom of the wafer storage frame 5, so that the wafer is limited in the wafer storage frame 5 to prevent the wafer in the wafer storage frame 5 from falling out during the subsequent movement, and then the T-shaped threaded column 603 is screwed into the limiting threaded cylinder 503, and the T-shaped threaded column 603 presses the outer movable frame 6 to limit the movement of the outer movable frame 6, thereby effectively preventing the wafer from being thrown out;

[0060] During cleaning, the cleaning water is poured into the cleaning chamber 2 to make the wafers get preliminary watering, the first manual valve 209 is opened to make the cleaning water enter the filter chamber 4 through the drainage pipe 208, and then the first manual valve 209 is closed. At this time, the cleaning chamber 2 still contains cleaning water, and the purification filter 401 purifies and filters the used cleaning water and retains it in the filter chamber 4, so that it can be reused, avoiding waste, and achieving the purpose of water saving and environmental protection;

[0061] The driving motor 203 works to drive the rotating shaft 201 to rotate, that is, the mounting plate 202 drives all the wafer storage frames 5 to rotate, so that the wafers inside can be moved in the cleaning chamber 2 for cleaning, and the wafer storage frame 5 and the outer movable frame 6 are both mesh frame structures for filtering water to ensure the cleaning effect and avoid the situation of cleaning blind areas;

[0062] The rotation of the rotating shaft 201 drives the driven rotating shaft 204 to rotate through the linkage sprocket 206 and the transmission chain 207, and the driven rotating shaft 204 drives the sector gear 205 to rotate, so that it first drives the power frame 305 to move upward and then downward, and this reciprocating action causes the Z-axis pumping rod 303 to drive the inner piston 304 to slide up and down in the first chamber, and then suck the cleaning water in the filter chamber 4 through the water inlet pipe 402, and send the cleaning water into the second chamber through the water supply pipe 302, until the cleaning water is sprayed into the cleaning chamber 2 through the spray pipe 301 and the water spray head 3011, so as to achieve the effect of continuous liquid supply, so that the cleaning process can be carried out continuously, and liquid is supplied while cleaning, thereby improving the cleaning efficiency;

[0063] Initially, the threaded sleeve 8 contacts the edge of the purification filter 401, so that it is fixed at the open end of the filter chamber 4. When cleaning the filtered impurities, the threaded sleeve 8 is rotated to rotate and move upward along the threaded rod 7 and detach from the purification filter 401. The purification filter 401 is then lifted upward to complete its removal operation. The use is very convenient and the purification filter 401 is easy to clean.

[0064] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0065] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A liquid supply spraying device for wafer cleaning, characterized in that: The invention comprises a mounting frame (1), an open cleaning chamber (2), a spray chamber (3) and an open filter chamber (4), wherein the bottoms of the cleaning chamber (2) and the spray chamber (3) are fixedly connected to a plurality of mounting frames (1), the spray chamber (3) is located on the right side of the cleaning chamber (2), the filter chamber (4) is located below the cleaning chamber (2), the bottom of the cleaning chamber (2) is fixedly connected to a drainage pipe (208), and a first manual valve (209) is installed on the drainage pipe (208), the lower end of the drainage pipe (208) faces the filter chamber (4), the inner walls on both sides of the cleaning chamber (2) are rotatably mounted with rotating shafts (201), and the ends of the two rotating shafts (201) close to each other are fixedly connected to mounting plates (202), and four groups of wafer placement devices distributed in a ring array are arranged between the two mounting plates (202); Each group of the wafer placement devices comprises eight wafer storage frames (5) and eight external movable frames (6); The wafer storage frame (5) is used to place wafers to be cleaned, and the outer movable frame (6) is used to limit the movement of the wafers in the wafer storage frame (5) to prevent the wafers from escaping from the wafer storage frame (5); A driving mechanism, the driving mechanism being used to drive the rotating shaft (201) to rotate; A suction mechanism, the suction mechanism being used to transport the cleaning water in the spray chamber (3) into the cleaning chamber (2); A filtering mechanism, the filtering mechanism being used to purify the cleaning water discharged from the cleaning chamber (2); A linkage mechanism is used in conjunction with the driving mechanism and the suction mechanism.

2. The wafer cleaning liquid supply spraying device according to claim 1, characterized in that: A connecting shaft (501) is fixedly connected between adjacent wafer storage frames (5), the outer movable frame (6) is rotatably mounted on the connecting shaft (501), and the wafer storage frame (5) is located inside the outer movable frame (6). The two wafer storage frames (5) on the left and right sides that are away from each other are fixedly connected to a supporting shaft (502), and the two supporting shafts (502) are respectively fixed on two mounting plates (202). The wafer storage frame (5) and the outer movable frame (6) are both water-filtering mesh frame structures, and the outer movable frame (6) is cylindrical and the wafer storage frame (5) is semi-cylindrical. An entrance (601) is provided at the top of the outer movable frame (6), and the entrance (601) leads to the opening of the wafer storage frame (5).

3. The wafer cleaning liquid supply spraying device according to claim 2, characterized in that: A limiting threaded cylinder (503) is embedded in the bottom of the wafer storage frame (5), a circular hole (602) is opened at the bottom of the outer movable frame (6), the limiting threaded cylinder (503) is internally threadedly connected to a T-shaped threaded column (603), and the T-shaped threaded column (603) passes through the circular hole (602) and abuts against the outer movable frame (6).

4. The wafer cleaning liquid supply spraying device according to claim 3, characterized in that: The driving mechanism comprises a driving motor (203), the driving motor (203) is fixedly mounted on the left side of the cleaning chamber (2), and the output end of the driving motor (203) is fixedly connected to the rotating shaft (201) on the left side.

5. The wafer cleaning liquid supply spraying device according to claim 4, characterized in that: The suction mechanism comprises an inner sealing plate (300), a spray pipeline (301), a water supply pipe (302), a Z-axis suction rod (303), an inner piston (304), and a power frame (305); the inner sealing plate (300) is fixedly installed in the spray chamber (3), and the inner sealing plate (300) divides the spray chamber (3) into a first chamber and a second chamber; the lower end of the inner sealing plate (300) is inlaid with a water supply pipe (302), and the water supply pipe (302) connects the first chamber and the second chamber; the top of the spray chamber (3) is penetrated by a spray pipeline (301), and the lower end of the spray pipeline (301) extends into the second chamber. The top end of the spray pipe (301) extends into the cleaning chamber (2) and is fixedly connected to a water spray head (3011); an inner piston (304) is slidably installed in the first chamber, and the top of the inner piston (304) is fixedly connected to a Z-axis pumping rod (303); the Z-axis pumping rod (303) is movably installed through the top of the spray chamber (3); the power frame (305) is fixedly installed on one end of the Z-axis pumping rod (303) located outside the spray chamber (3); the bottom of the first chamber is fixedly connected to a water inlet pipe (402), and the other end of the water inlet pipe (402) is fixedly connected to the lower side of the filter chamber (4).

6. The wafer cleaning liquid supply spraying device according to claim 5, characterized in that: A No. 1 one-way valve is installed in the water inlet pipe (402), and the No. 1 one-way valve only allows fluid to enter the first chamber from the filter chamber (4) through the water inlet pipe (402), and a No. 2 one-way valve is installed on the water supply pipe (302), and the No. 2 one-way valve only allows fluid to enter the second chamber from the first chamber through the water supply pipe (302).

7. The wafer cleaning liquid supply spraying device according to claim 6, characterized in that: The top of the spray chamber (3) is fixedly connected to a water supply pipe (306) communicating with the second chamber, and a second manual valve (307) is installed on the water supply pipe (306).

8. The wafer cleaning liquid spraying device according to claim 7, characterized in that: The linkage mechanism comprises a driven rotating shaft (204), a sector gear (205), a linkage sprocket (206) and a transmission chain (207); the driven rotating shaft (204) is rotatably mounted on the outside of the cleaning chamber (2); and the driven rotating shaft (204) and one end of the right rotating shaft (201) extending outside the cleaning chamber (2) are both fixedly connected with a linkage sprocket (206); the two linkage sprockets (206) are connected via a transmission chain (207); the right end of the driven rotating shaft (204) extends into a power frame (305) and is fixedly connected with a sector gear (205); racks are fixedly mounted on both side walls in the power frame (305), and the sector gear (205) meshes with a gear table on one side for transmission.

9. The wafer cleaning liquid supply spraying device according to claim 8, characterized in that: The filtering mechanism comprises a purification filter (401), wherein the purification filter (401) is overlapped on the top of the open filter chamber (4), and the bottom of the cleaning chamber (2) is fixedly connected with a threaded rod (7), and a threaded sleeve (8) is screwed on the threaded rod (7), and the bottom of the threaded sleeve (8) is against the edge of the purification filter (401).

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