Chip multilayer film manufacturing device and method

Abstract

The application relates to the chip film coating technical field and discloses a chip multilayer film manufacturing device and method, which comprises a base; a fixing base is arranged on the base, and a first cavity with two open sides is arranged in the fixing base; a placing rack is arranged in the first cavity, a steering shaft is fixedly connected to the axis of the placing rack, the steering shaft is rotationally connected to the fixing base, a plurality of cavities are circumferentially arranged on the placing rack, and the cavities are used for assembling chips; a pair of deposition chambers are slidably arranged on the base, a second cavity is arranged in the deposition chamber and opens towards the fixing base; a first driving mechanism is used for driving the steering shaft to rotate; a second driving mechanism is used for driving the pair of deposition chambers to slide along the base; when the pair of deposition chambers are attached to the fixing base, the first cavity and the pair of second cavities are in sealed communication, so that the chips can alternately move in the pair of second cavities when the placing rack rotates, and the application can alternately form multilayer films on the chip surfaces and guarantees the film coating quality.

Description

TECHNICAL FIELD

[0001] The present application relates to the chip film coating technology field, in particular to a kind of chip multilayer film production device and method. BACKGROUND

[0002] Current semiconductor process is increasingly developed, for example, light-emitting diode chip is widely used in lighting, traffic, advertising and instrument and meter, liquid crystal backlight illumination and other displays due to its high brightness, low power consumption, long life, high reliability, easy driving, energy saving, environmental protection and other characteristics.The production and use of LED chips in the world show a rapid upward trend, and higher requirements are put forward for the light extraction efficiency of LED chips, so higher requirements are put forward for the manufacturing process of chip.

[0003] In the process of LED preparation, LED chip is the core component of LED, in order to prevent the acid-base corrosion and oxidation of external environment, usually coating film on the chip surface, avoid the chip aging caused by external corrosion and oxidation.Due to the protection effect of single film deposition is not obvious, often multilayer film deposition is carried out, and when the medium of multilayer film layer uses the same film, it will cause the wafer surface to crack, affect the use effect. SUMMARY

[0004] The purpose of the present application is to provide a kind of chip multilayer film production device and method, to solve or improve at least one of the above technical problems.

[0005] To achieve the above purpose, the present application provides the following scheme: the present application provides a kind of chip multilayer film production device, comprising:

[0006] Base;

[0007] Fixed seat, set on the base, first cavity with both sides open is arranged in the fixed seat;

[0008] Placing rack, set in the first cavity, the shaft center of the placing rack is fixedly connected with steering shaft, the steering shaft is rotatably connected with the fixed seat, a plurality of cavities are peripherally arranged on the placing rack, and the cavity is used for assembling chip;

[0009] A pair of deposition chambers, slidably arranged on the base, a pair of deposition chambers are respectively located on both sides of the fixed seat, second cavity is arranged in the deposition chamber and opens towards the fixed seat;

[0010] First driving mechanism, for driving the steering shaft to rotate;

[0011] Second driving mechanism, for driving a pair of deposition chambers to slide along the base;

[0012] When a pair of the deposition chambers are attached to the fixed seat, the first cavity and a pair of the second cavities are in sealed communication, so that the chip can be moved in the pair of the second cavities alternately when the placing frame rotates.

[0013] Optionally, the first driving mechanism comprises:

[0014] A steering motor is fixedly installed on the fixed seat.

[0015] A first bevel gear is connected with the steering shaft.

[0016] A second bevel gear is connected with the output shaft of the steering motor, and the second bevel gear is engaged with the first bevel gear.

[0017] Optionally, the second driving mechanism comprises:

[0018] A stroke slot is arranged on the base.

[0019] A screw rod motor is fixedly installed on one end of the stroke slot.

[0020] A bidirectional screw rod is connected with the output shaft of the screw rod motor, and the directions of the threads on the two sections of the bidirectional screw rod are opposite.

[0021] A pair of nut seats are threadedly matched on the threads on the two ends of the bidirectional screw rod, and the nut seats are slidingly matched in the stroke slot, and the pair of the nut seats are connected with a pair of the deposition chambers respectively.

[0022] Optionally, a bolt is threadedly matched in the cavity, one end of the bolt is fixedly connected with a limiting block slidingly matched in the cavity, and the limiting block is used for abutting against the chip.

[0023] Optionally, a counterbore is arranged on the outer edge of the placing frame at the end of the cavity away from the steering shaft, and the end of the bolt is located in the counterbore.

[0024] Optionally, a sealing strip is arranged on the open end of the second cavity.

[0025] Optionally, a plurality of air guide pipes are arranged on the deposition chamber and are in communication with the second cavity.

[0026] Optionally, a control valve is arranged on the air guide pipe.

[0027] Optionally, a vacuum pump is arranged on the deposition chamber and is in communication with the second cavity.

[0028] The application further provides a chip multilayer film manufacturing device, comprising the following steps:

[0029] Chip cleaning pretreatment, cleaning and drying the chip surface;

[0030] Chip mounting positioning, assembling the chip in the cavity;

[0031] Device folding sealing, driving a pair of the deposition chambers to move close to the fixed seat and fit through the second driving mechanism, so that a pair of the second cavities are in sealed communication with the first cavity;

[0032] Deposition chamber vacuumizing, vacuumizing the second cavity and introducing nitrogen;

[0033] Introducing plating gas, respectively introducing different reaction gases into a pair of the second cavities;

[0034] Alternating stack plating, driving the placing rack to rotate through the first driving mechanism, so that the chip can move in a pair of the second cavities alternately, so that the chip is in contact with different reaction gases for plating;

[0035] Device resetting and discharging, driving a pair of the deposition chambers to move away from the fixed seat through the second driving mechanism, and taking out the chip in the cavity.

[0036] The present application discloses the following technical effects: by assembling the chip in the cavity and fitting a pair of deposition chambers to the fixed seat, the placing rack is covered in the first cavity and a pair of second cavities, so that by respectively supplying different plating gases into the second cavities of a pair of deposition chambers, and cooperating with the rotation of the placing rack, the chip can move in a pair of second cavities alternately, so that the chip alternately contacts different plating gases, and a plurality of thin films are alternately formed on the surface of the chip, ensuring the stability and accuracy of the plating process, and guaranteeing the plating quality. BRIEF DESCRIPTION OF DRAWINGS

[0037] The accompanying drawings, which form a part of this application, are included to provide a further understanding of the application and are incorporated in and constitute a part of this application. The embodiments illustrated in the drawings are provided to explain the present application and are not intended to limit the present application. In the drawings:

[0038] Fig. 1 It is a schematic diagram of the manufacturing method of the present application;

[0039] Fig. 2 It is a front view of the present application;

[0040] Fig. 3 It is a sectional view of the present application.

[0041] In the figure: 1, base; 2, fixed seat; 3, deposition chamber; 5, rack; 6, cavity; 7, bolt; 8, limit block; 9, bidirectional screw rod; 10, nut seat; 11, vacuum pump; 12, steering shaft; 14, sealing strip; 15, air guide pipe; 16, control valve; 17, first bevel gear; 18, steering motor; 19, second bevel gear; 20, stroke groove; 21, counterbore; 22, screw rod motor. DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0043] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0044] Reference Figs. 1-3 The present application provides a kind of chip multilayer film production device, comprising:

[0045] Base 1;

[0046] Fixed seat 2 is arranged on base 1, and a first cavity with both sides open is arranged in fixed seat 2;

[0047] Rack 5 is arranged in the first cavity, and steering shaft 12 is fixedly connected to the axis of rack 5, steering shaft 12 is rotatably connected to fixed seat 2, and a plurality of cavities 6 are arranged circumferentially on rack 5, and the cavities 6 are used for assembling chips;

[0048] A pair of deposition chambers 3 are slidably arranged on base 1, and the deposition chambers 3 are respectively located on both sides of fixed seat 2, and a second cavity open to fixed seat 2 is arranged in deposition chamber 3;

[0049] First driving mechanism is used to drive steering shaft 12 to rotate;

[0050] Second driving mechanism is used to drive a pair of deposition chambers 3 to slide along base 1;

[0051] When a pair of deposition chambers 3 and fixed seat 2 are attached, the first cavity and a pair of second cavities are in sealed communication, so that the chips can move alternately in a pair of second cavities when the rack 5 rotates.

[0052] By assembling the chip into the cavity 6, and fixing the pair of deposition chambers 3 to the seat 2, the placing rack is covered in the first cavity and the pair of second cavities, so that the chip can be moved in the pair of second cavities alternately by supplying different plating gases into the second cavities of the pair of deposition chambers 3 respectively, and cooperating with the rotation of the placing rack 5, so that the chip alternately contacts different plating gases, and a plurality of thin films are alternately formed on the surface of the chip, thereby ensuring the stability and accuracy of the plating process, and guaranteeing the plating quality.

[0053] Further, the turning shaft 12 is rotatably connected to the seat 2 through a sealing bearing, which ensures that the gas in the deposition chamber 3 does not leak to the outside, and allows the turning shaft 12 to rotate smoothly.

[0054] In an embodiment of the present application, the first driving mechanism comprises:

[0055] The turning motor 18 is fixedly installed on the seat 2.

[0056] The first bevel gear 17 is connected to the turning shaft 12.

[0057] The second bevel gear 19 is connected to the output shaft of the turning motor 18, and the second bevel gear 19 is engaged with the first bevel gear 17.

[0058] The second bevel gear 19 is driven to rotate by the turning motor 18, and the first bevel gear 17 engaged with the second bevel gear 19 is driven to rotate, thereby driving the turning shaft 12 to rotate and making the placing rack 5 rotate.

[0059] In an embodiment of the present application, the second driving mechanism comprises:

[0060] The stroke groove 20 is provided on the base 1.

[0061] The lead screw motor 22 is fixedly installed at one end of the stroke groove 20.

[0062] The bidirectional lead screw 9 is connected to the output shaft of the lead screw motor 22, and the two threads on the bidirectional lead screw 9 are in opposite directions.

[0063] The pair of nut seats 10 are threadedly engaged with the threads at the two ends of the bidirectional lead screw 9 respectively, and the nut seats 10 are slidingly engaged in the stroke groove 20, and the pair of nut seats 10 are connected to the pair of deposition chambers 3 respectively.

[0064] The bidirectional lead screw 9 is driven to rotate by the lead screw motor 22, and the pair of nut seats 10 are moved close to or away from each other by the cooperation of the threads in opposite directions on the bidirectional lead screw 9, and the side walls of the nut seats 10 are in abutment with the side walls of the stroke groove 20, thereby achieving the guiding and limiting of the nut seats 10.

[0065] In one embodiment of the present application, the cavity 6 is threadedly fitted with a bolt 7, one end of the bolt 7 is fixedly connected with a limiting block 8 which is slidingly fitted in the cavity 6, the limiting block 8 is used to abut against the chip.

[0066] By rotating the bolt 7, the limiting block 8 can be driven to move in the cavity 6, the chip is clamped and fixed, and the chip is stably fixed in the cavity 6 during the film plating process, so as to prevent movement or misplacement caused by rotation or gas flow.

[0067] In one embodiment of the present application, the cavity 6 is threadedly fitted with a bolt 7, one end of the bolt 7 is fixedly connected with a limiting block 8 which is slidingly fitted in the cavity 6, the limiting block 8 is used to abut against the chip.

[0068] In one embodiment of the present application, the open end of the second cavity is provided with a sealing strip 14, and the sealing strip 14 is arranged to ensure that the gas inside the deposition chamber does not leak when the inlet is closed.

[0069] In one embodiment of the present application, the deposition chamber 3 is provided with a plurality of gas introduction pipes 15 which are connected to the second cavity, and the gas introduction pipes 15 are used to introduce the gas required for film plating.

[0070] In one embodiment of the present application, the gas introduction pipe 15 is provided with a control valve 16, and the control valve 16 can accurately control the flow and on-off of the gas.

[0071] In one embodiment of the present application, the deposition chamber 3 is provided with a vacuum pump 11 which is connected to the second cavity, and the vacuum pump 11 is used to pump out the gas in the deposition chamber 3 before film plating to form a vacuum environment.

[0072] The present application also provides a chip multilayer film manufacturing device, comprising the following steps:

[0073] The chip is cleaned and pretreated, the chip surface is cleaned and dried, specifically, the chip surface is cleaned and treated by using an ultrasonic cleaner, and after cleaning, the chip is placed in a vacuum drying machine for drying treatment; the dirt and impurities on the chip surface are removed by ultrasonic cleaning, and then the chip is dried by the vacuum drying machine to remove water, so as to provide a clean and dry surface for the subsequent film plating process, and a proper amount of surfactant can be added in the cleaning liquid to enhance the cleaning effect, so that the dirt and grease on the chip surface can be quickly and effectively removed, and the subsequent repeated and alternating film plating is facilitated.

[0074] Further, the ultrasonic cleaning machine is provided with anhydrous ethanol, and the cleaning time is 10 minutes, which has good decontamination ability and volatility, can quickly and effectively remove the dirt and oil on the surface of the chip, and the vacuum drying machine has a working temperature of 90°C and a drying time of 5 minutes, which can accelerate the evaporation of water and avoid high temperature from causing heat damage to the chip.

[0075] Chip mounting and positioning, the chip is assembled in the cavity 6. Specifically, the limiting block 8 is moved by rotating the bolt 7, so as to limit and fix the chip. By limiting and fixing the chip, the spacing between the chips is ensured to be uniform, so as to avoid mutual interference in the plating process and ensure the uniformity of plating.

[0076] Device folding and sealing, a pair of deposition chambers 3 are driven by the second driving mechanism to move close to the fixed seat 2 and fit together, so as to realize the sealed communication between the pair of second cavities and the first cavity.

[0077] Deposition chamber vacuumizing, the second cavity is vacuumized and nitrogen is introduced. Specifically, a pair of deposition chambers 3 are respectively vacuumized by cooperating with the vacuum pump 11, and nitrogen is introduced to replace the air. The vacuumizing treatment can remove the air in the deposition chamber 3, so as to avoid the influence of oxygen and water vapor on the plating process. The replacement by introducing nitrogen can further ensure the purity of the plating environment.

[0078] Introducing plating gas, different reaction gases are respectively introduced into the pair of second cavities, so as to form evaporation films on the surface of the chip. Specifically, the evaporation source material in the deposition chamber 3 is heated and evaporated into gas, and then the gas reacts with the introduced reaction gas, so as to form the required film on the surface of the chip. Different reaction gases will result in different types of films.

[0079] Alternating stack plating, the placing rack 5 is driven to rotate by the first driving mechanism, so that the chip can be alternately moved in the pair of second cavities, so that the chip is in contact with different reaction gases for plating, thereby forming multiple layers of films on the surface of the chip alternately. Specifically, different deposition chambers 3 are respectively introduced with different reaction gases or materials, the placing rack 5 is rotated by the rotating shaft 12, the chip enters different deposition chambers for plating in turn, and each deposition chamber is provided with a corresponding deposition device and control system to ensure the uniformity and quality of the film.

[0080] Device resetting and unloading, the pair of deposition chambers 3 are driven by the second driving mechanism to move away from the fixed seat 2, and the chip in the cavity 6 is taken out.

[0081] The method ensures the stability and accuracy of the plating process, and the cooperative work of various components enables the chip to alternately pass through a pair of deposition chambers 3, thereby forming multiple layers of films on the surface of the chip alternately.

[0082] In the description of the present application, it needs to be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0083] The above-described embodiments are only to describe the preferred modes of the present application, and not to limit the scope of the present application. Without departing from the design spirit of the present application, various modifications and improvements to the technical solutions of the present application made by those skilled in the art shall fall within the protection scope determined by the claims of the present application.

Claims

1. An apparatus for fabricating a multilayer thin film chip, characterized in that, The utility model relates to a chip cleaning and drying device, including: Base (1); Fixed seat (2) are set up on base (1), first cavity that is open on both sides is provided with in fixed seat (2); Place frame (5) are set up in first cavity, the fixed connection of pivot shaft (12) is established at the axle center of place frame (5), pivot shaft (12) is rotatably connected with fixed seat (2), a plurality of cavity (6) are set up in place frame (5) and are used for assembling chip in cavity (6); A pair of deposition chamber (3) are slidably set up on base (1), a pair of deposition chamber (3) are located fixed seat (2) both sides respectively, second cavity that is open towards fixed seat (2) is provided with in deposition chamber (3); First drive mechanism is used for driving pivot shaft (12) rotation; Second drive mechanism is used for driving a pair of deposition chamber (3) along base (1) sliding; When a pair of deposition chamber (3) and fixed seat (2) adhere, the sealed communication between first cavity and a pair of second cavity makes that when place frame (5) rotates, chip can move alternately in a pair of second cavity; The open end of second cavity is provided with sealing strip (14); A plurality of gas ducts (15) are provided on the deposition chamber (3) and are connected with the second cavity; Control valve (16) is provided on the gas duct (15); Vacuum pump (11) is provided on the deposition chamber (3) and is connected with the second cavity.

2. The apparatus of claim 1, wherein The first drive mechanism includes: Steering motor (18) is fixedly installed on fixed seat (2); First bevel gear (17) is connected with pivot shaft (12); Second bevel gear (19) is connected with the output shaft of steering motor (18), and second bevel gear (19) is engaged with first bevel gear (17).

3. The apparatus of claim 1, wherein the plurality of chips are stacked in a plurality of layers. The second drive mechanism includes: Stroke groove (20) is opened in base (1); Lead screw motor (22) is fixedly installed on one end of stroke groove (20); Bidirectional screw rod (9) is connected with the output shaft of lead screw motor (22), and the thread direction of two sections of bidirectional screw rod (9) is opposite; A pair of nut seats (10) are respectively threaded on the two end threads of bidirectional screw rod (9), and the nut seats (10) are slidingly fitted in the stroke groove (20), and a pair of nut seats (10) are respectively connected with a pair of deposition chambers (3).

4. The apparatus of claim 1, wherein The threaded bolt (7) is fitted in the cavity (6), one end of the threaded bolt (7) is fixedly connected with the limiting block (8) slidingly fitted in the cavity (6), and the limiting block (8) is used for abutting against the chip.

5. The apparatus of claim 4, wherein the plurality of chips are stacked in a plurality of layers. The counterbore (21) is provided on the outer edge of the placing rack (5) away from the pivot shaft (12), and the end of the threaded bolt (7) is located in the counterbore (21).

6. A method for manufacturing a chip multilayer film, based on the manufacturing apparatus for a chip multilayer film according to any one of claims 1 to 5, characterized by, The utility model relates to a chip cleaning and drying device, including following steps: Chip cleaning pretreatment, clean and dry chip surface; Chip mounting and positioning, assemble chip in cavity (6). The device is folded and sealed, a second driving mechanism is used to drive a pair of the deposition chambers (3) to move close to the fixed seat (2) and to be attached, so that a pair of the second cavities are in sealed communication with the first cavity; The deposition chamber is vacuumized, the second cavity is vacuumized and nitrogen is introduced; The coating gas is introduced, different reaction gases are respectively introduced into a pair of the second cavities; The coating is alternately stacked, a first driving mechanism is used to drive the placing rack (5) to rotate, so that the chip can be alternately moved in a pair of the second cavities, so that the chip is in contact with different reaction gases for coating; The device is reset and unloaded, the second driving mechanism is used to drive a pair of the deposition chambers (3) to move away from the fixed seat (2), and the chip in the cavity (6) is taken out.

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