Flexible heat dissipation structure and application thereof

Abstract

A flexible heat dissipation structure disclosed by the present invention comprises a sheet-type heat dissipation sheet, the heat dissipation sheet comprises a plurality of fixed parts and convex parts which are distributed at intervals, a first air channel is formed between the fixed parts and the convex parts, the fixed parts are used for being fixed on a carrier, the convex parts are formed by upwards protruding and bending the heat dissipation sheet, and the convex parts form a second air channel. And a deformable flexible heat dissipation structure is formed by the plurality of fixed parts and the plurality of convex parts which are distributed at intervals. The flexible heat dissipation structure is formed by a plurality of fixing parts and protruding parts which are distributed at intervals, the length and the width of the heat dissipation fins can be cut according to actual use, the fixing parts can be attached to carriers of different shapes due to the light, thin and deformable characteristics, heat is effectively dispersed and discharged, the stability and the performance of the carriers during operation are ensured, and the service life of the carriers is prolonged. The arrangement of the first air duct and the second air duct increases the contact area between the heat dissipation structure and air and air flow, and the heat dissipation effect is better. The invention further discloses application of the flexible heat dissipation structure.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation structures, and in particular to a flexible heat dissipation structure and applications thereof. Background Art

[0002] Most of the existing heat dissipation structures are of fixed shape. For example, the Chinese utility model patent with application number CN202420165880.7 discloses a temperature-averaging plate heat sink for dissipating heat from chips on PCB boards, including a heat sink body and a temperature-averaging plate, wherein the temperature-averaging plate is arranged between the heat sink body and the chip, and the temperature-averaging plate includes a first temperature-averaging plate portion and a second temperature-averaging plate portion of an integrated structure, the first temperature-averaging plate portion is fixedly connected to the heat sink body, the second temperature-averaging plate portion is connected to the heat sink body through an elastic component, and the second temperature-averaging plate portion is bonded to the chip. This rigid heat dissipation structure can only be applied to carriers of specific shapes, and has poor applicability. In addition, the heat needs to be transferred to the heat dissipation substrate and then dissipated through the heat sink. There are many heat conduction links, the heat dissipation effect is poor, and the thermal resistance is high. Summary of the invention

[0003] In view of the shortcomings of the background technology, the technical problem to be solved by the present invention is to provide a flexible heat dissipation structure.

[0004] To this end, the present invention is implemented by adopting the following technical solutions:

[0005] A flexible heat dissipation structure, characterized in that: it includes a one-piece heat sink, the heat sink includes a plurality of fixed portions and raised portions distributed at intervals, a first air duct is formed between the fixed portions and the raised portions, the fixed portion is used to be fixed to a carrier, the raised portion is formed by the heat sink protruding upward and bending, the raised portion forms a second air duct, and the plurality of fixed portions and raised portions distributed at intervals form a deformable flexible heat dissipation structure.

[0006] Furthermore, the protrusion is in a straight strip shape or a wavy shape.

[0007] Furthermore, the heat sink is a thin metal sheet punched by a stamping machine.

[0008] Furthermore, the material of the heat sink is copper, aluminum, stainless steel, titanium, aluminum-copper alloy, copper-nickel alloy, or chromium-nickel-iron alloy.

[0009] After adopting the above technical scheme, several fixed parts and raised parts distributed at intervals are a one-piece heat sink, and the raised part is composed of the heat sink that is raised and bent upward, so that the several fixed parts and raised parts distributed at intervals form a flexible heat dissipation structure that can be deformed. This light and deformable feature enables the fixed part of the heat dissipation structure to be fitted and applied to carriers of different shapes, effectively dissipating and dissipating heat to ensure the stability and performance of the carrier during operation. In addition, since the raised part is composed of the heat sink that is raised and bent upward, the raised part forms a second air duct, and the heat of the carrier can be directly dissipated by convection through the second air duct, reducing the heat conduction link, lowering the thermal resistance, and facilitating heat dissipation. The setting of the first air duct and the second air duct increases the contact area between the heat dissipation structure and the air and windflow, so that the heat dissipation structure can dissipate the heat generated by the carrier more quickly, and the heat dissipation effect is better.

[0010] The present invention also provides an application of the above-mentioned flexible heat dissipation structure in a lamp, wherein the fixing portion of the heat sink is fixed to the housing or circuit board of the lamp by gluing or welding.

[0011] Furthermore, the housing or circuit board of the lamp is planar, curved or barrel-shaped.

[0012] The present invention also provides an application of the above-mentioned flexible heat dissipation structure on a light strip, wherein the fixing portion of the heat sink is fixed to the back of the light strip by gluing.

[0013] Furthermore, the light strip is a rigid light strip or a flexible light strip.

[0014] The present invention also provides an application of the above-mentioned flexible heat dissipation structure in an air conditioner, wherein the fixing portion of the heat sink is fixed to the air conditioner housing by gluing or welding.

[0015] The present invention also provides an application of the above-mentioned flexible heat dissipation structure in high-power electronic equipment, computer hardware, and industrial equipment, which is characterized in that the fixing part of the heat sink is fixed to the heat source of the high-power electronic equipment, computer hardware, and industrial equipment by gluing or welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention has the following accompanying drawings:

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the flexible heat dissipation structure (the raised portion is in the shape of a straight strip) in the present invention;

[0018] Figure 2 It is a schematic diagram of the three-dimensional structure of the flexible heat dissipation structure (the raised portion is wavy) in the present invention;

[0019] Figure 3It is a schematic diagram of the structure in which the flexible heat dissipation structure (the raised part is in the shape of a straight strip) in the present invention is surrounded by a circle;

[0020] Figure 4 It is a schematic diagram of the structure of the flexible heat dissipation structure (the raised portion is a straight strip) in the present invention forming a curved shape;

[0021] Figure 5 It is a schematic diagram of the structure in which the flexible heat dissipation structure (the raised portion is a straight strip) in the present invention forms a fan-shaped structure;

[0022] Figure 6 It is a schematic diagram of the structure in which the flexible heat dissipation structure (the raised portion is a straight strip) in the present invention is formed into a spiral shape and applied to a flexible light strip.

[0023] Figure numerals: 1. fixing portion; 2. raised portion; 3. first air duct; 4. second air duct; 5. flexible light strip. DETAILED DESCRIPTION

[0024] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation mode, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0025] Referring to the above-mentioned drawings, a flexible heat dissipation structure provided by the present invention includes a one-piece heat sink, wherein the heat sink includes a plurality of fixed portions 1 and raised portions 2 that are spaced apart, a first air duct 3 is formed between the fixed portion 1 and the raised portion 2, the fixed portion 1 is used to be fixed to a carrier, the raised portion 2 is formed by the heat sink bulging upward and bending, the raised portion 2 forms a second air duct 4, a plurality of fixed portions 1 and raised portions 2 that are spaced apart form a deformable flexible heat dissipation structure, the raised portion 2 is in a straight strip shape or a wavy shape, the heat sink is a thin metal sheet stamped by a stamping machine, and the material of the heat sink is copper or aluminum or stainless steel or titanium or aluminum-copper alloy or copper-nickel alloy or chromium-nickel-iron alloy.

[0026] In this embodiment, a plurality of fixed portions 1 and raised portions 2 that are distributed at intervals are a one-piece heat sink, and the raised portion 2 is formed by the heat sink bulging upward and bending, so that the fixed portions 1 and raised portions 2 that are distributed at intervals form a deformable flexible heat dissipation structure, and the length and width of the heat sink can be cut according to actual use. This thin and deformable characteristic enables the fixed portion 1 of the heat dissipation structure to be applied to carriers of different shapes, effectively dispersing and discharging heat to ensure the stability and performance of the carrier during operation. In addition, since the raised portion 2 is formed by the heat sink bulging upward and bending The folded structure has a protruding portion 2 forming a second air duct 4, and the heat of the carrier can be directly dissipated by convection through the second air duct 4, which reduces the heat conduction link, has lower thermal resistance, and is convenient for heat dissipation. The setting of the first air duct 3 and the second air duct 4 increases the contact area between the heat dissipation structure and the air and wind flow, so that the heat dissipation structure can dissipate the heat generated by the carrier faster and the heat dissipation effect is better; the straight or wavy protruding portions 2 have a certain deformation range, and the wavy protruding portions 2 have a larger contact area with the air and wind flow than the straight protruding portions 2, which further increases the heat dissipation effect.

[0027] The present invention also provides an application of the above-mentioned flexible heat dissipation structure on a lamp, which is characterized in that: the fixing portion 1 of the heat sink is fixed to the housing or circuit board of the lamp by gluing or welding, and the housing or circuit board of the lamp is flat, curved or barrel-shaped.

[0028] In this embodiment, the heat dissipation structure is applied to the lamp. Since the heat dissipation structure has flexible deformation ability, the heat dissipation structure can be applied to lamps of various shapes, including flat lamps (floodlights, ceiling lamps, wall washers, etc.) or curved lamps (arc lamps, special-shaped lamps, etc.) or barrel-shaped lamps. When the heat sink is fixed directly to the circuit board through the fixing part 1, the heat conduction link is reduced, the thermal resistance is lower, the heat dissipation is convenient, the heat dissipation effect of the floodlight is better, and the thickness of the floodlight is thinner.

[0029] The present invention also provides an application of the above-mentioned flexible heat dissipation structure on a light strip, which is characterized in that: the fixing portion 1 of the heat sink is fixed to the back of the light strip by gluing, and the light strip is a rigid light strip or a flexible light strip.

[0030] In this embodiment, after the heat dissipation structure is fixed to the flexible light strip, it can be transformed into other various shapes together with the flexible light strip, such as arc, ring, spiral, curve, etc.

[0031] The present invention also provides an application of the above-mentioned flexible heat dissipation structure in an air conditioner, which is characterized in that the fixing portion 1 of the heat sink is fixed to the air conditioner housing by gluing or welding.

[0032] The present invention also provides an application of the above-mentioned flexible heat dissipation structure in high-power electronic equipment, computer hardware, and industrial equipment, which is characterized in that the fixing portion 1 of the heat sink is fixed to the heat source of the high-power electronic equipment, computer hardware, and industrial equipment by gluing or welding.

[0033] In this embodiment, the flexible heat dissipation structure can flexibly fit heat sources of different shapes, dissipate heat for the heat sources in a timely, stable and efficient manner, and ensure stable operation under various working conditions.

[0034] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A flexible heat dissipation structure, characterized by: It includes a one-piece heat sink, which includes a plurality of fixed portions and raised portions distributed at intervals, a first air duct is formed between the fixed portions and the raised portions, the fixed portion is used to be fixed to a carrier, the raised portion is formed by the heat sink protruding upward and bending, the raised portion forms a second air duct, and the plurality of fixed portions and raised portions distributed at intervals form a deformable flexible heat dissipation structure.

2. A flexible heat dissipation structure according to claim 1, characterized in that: The protrusion is in a straight strip shape or a wave shape.

3. A flexible heat dissipation structure according to claim 2, characterized in that: The heat sink is a thin metal sheet punched by a punching machine.

4. A flexible heat dissipation structure according to claim 3, characterized in that: The material of the heat sink is copper, aluminum, stainless steel, titanium, aluminum-copper alloy, copper-nickel alloy, or chromium-nickel-iron alloy.

5. The application of a flexible heat dissipation structure according to any one of claims 1 to 4 in a lamp is characterized in that: The fixing portion of the heat sink is fixed to the housing or circuit board of the lamp by gluing or welding.

6. The application of a flexible heat dissipation structure in a lamp according to claim 5 is characterized in that: The housing or circuit board of the lamp is in a plane shape, a curved shape or a barrel shape.

7. The application of a flexible heat dissipation structure according to any one of claims 1 to 4 to a light strip is characterized in that: The fixing portion of the heat sink is fixed to the back of the light strip by gluing.

8. The application of a flexible heat dissipation structure in a lamp according to claim 7 is characterized in that: The light strip is a rigid light strip or a flexible light strip.

9. Application of a flexible heat dissipation structure according to any one of claims 1 to 4 in an air conditioner, characterized in that: The fixing part of the heat sink is fixed to the air conditioner housing by gluing or welding.

10. Application of a flexible heat dissipation structure according to any one of claims 1 to 4 in high-power electronic equipment, computer hardware, and industrial equipment, characterized in that: The fixing part of the heat sink is fixed to the heat source of high-power electronic equipment, computer hardware, and industrial equipment by gluing or welding.

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