Wafer flaw detection device and method for wafer production

Abstract

The invention discloses a wafer flaw detection device and method for wafer production, and belongs to the technical field of wafer detection, the wafer flaw detection device comprises a detection cabinet and a camera assembled on the inner top wall of the detection cabinet, a rotating unit is assembled on the inner bottom wall of the detection cabinet by forming a mounting groove, and the rotating unit comprises an annular frame rotationally connected in the mounting groove; by arranging the camera, the rotating unit and the cam piece, automatic rotation and inclination of the wafer in the detection process are achieved, so that flaws on the surface and the edge of the wafer can be detected at the same time, and the detection efficiency is remarkably improved; meanwhile, the wafer can present different detection visual angles in the process of gradually inclining to the vertical state from the horizontal state in the detection process, and the vacuum chuck drives the wafer to rotate under the driving of the face gear in the process of continuing to revolve along with the ring frame in the vertical state, so that all positions at the edge of the wafer can be shot by the camera; under the cooperative use, the camera can more comprehensively capture flaw scattering signals on the surface and the edge of the wafer.

Description

Technical Field

[0001] The present invention relates to the field of wafer detection technology, and in particular to a wafer defect detection device and method for wafer production. Background Art

[0002] Wafer defect detection is a vital part of semiconductor manufacturing. During the manufacturing process, various defects may appear on the wafer, such as surface defects, structural defects and chemical defects. These defects will affect the function and performance of the chip and even cause chip failure. Therefore, effective detection and analysis of wafer defects is very necessary.

[0003] Traditional defect detection methods mainly rely on visual inspection methods. However, in actual operation, this method usually requires the detection of the wafer surface and the edge to be performed separately, which undoubtedly reduces the overall efficiency of the detection. It is particularly worth noting that when inspecting the wafer surface, although the wafer only needs to be laid flat and fixed, there are many types of defects on the wafer surface, such as scratches, burrs, damage and bubbles. These different types of defects show different optical scattering characteristics, including significant differences in the intensity and angular distribution of scattered light. Since the wafer is always kept flat during the inspection process, this fixed inspection angle may not be able to fully capture the scattered signals of all defects, resulting in an increased risk of missed detection or false detection. Summary of the invention

[0004] The purpose of the present invention is to propose a wafer defect detection device and method for wafer production in order to solve the problem that the wafer is always kept flat during the detection process, and this fixed detection angle may not be able to fully capture the scattered signals of all defects, thereby increasing the risk of missed detection or false detection.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: A wafer defect detection device for wafer production, comprising a detection cabinet and a camera mounted on the top wall of the detection cabinet, wherein the inner bottom wall of the detection cabinet is equipped with a rotating unit by opening a mounting groove, the rotating unit comprises a ring frame rotatably connected to the mounting groove, and a plurality of mounting seats are mounted at the opening of the ring frame; The wafer to be inspected is fixed during the inspection process by being rotated and adsorbed by the vacuum suction cup in the mounting seat; An angle adjustment frame is mounted on the inner bottom wall of the ring frame, and the angle adjustment frame is connected to the mounting seat via an inclined crank; A support seat is installed at the bottom of the detection cabinet, and a cam member is installed in the support seat. When the angle adjustment frame follows the rotation of the ring frame, the cam member drives the mounting seat to drive the wafer on the surface of the vacuum suction cup to gradually tilt from a horizontal state to a vertical state, thereby realizing the detection of the wafer surface and edge.

[0006] As a further description of the above technical solution: The angle adjustment frame includes a slide rail fixed on the inner bottom wall of the ring frame, a slider is slidably installed on the slide rail, a guide rod with one end abutting against the outer wall of the cam member is fixed on the top of the slider, and a roller is rotatably connected to the end of the guide rod abutting against the cam member, so that the guide rod moves more smoothly on the cam member.

[0007] As a further description of the above technical solution: A guide groove is provided on the outer wall of the inclined crank, and the other end of the guide rod is rotatably connected to a guide column adapted to the guide groove, and the other end of the guide rod is slidably installed in the guide groove through the guide column.

[0008] As a further description of the above technical solution: A connecting seat is fixed at the center of the bottom of the mounting seat, and shaft columns are fixed on both sides of the connecting seat. One end of the shaft column is rotatably connected to a retaining seat, and one end of the retaining seat is fixed to the opening of the ring frame so that the mounting seat can be rotatably connected to the ring frame. One end of the inclined crank is fixed to the connecting seat, and when the inclined crank moves toward the edge under the drive of the guide rod, it can drive the mounting seat to gradually tilt to a vertical state.

[0009] As a further description of the above technical solution: A telescopic rod is mounted on one side of the slide block, one end of the telescopic rod is fixed on the inner wall of the ring frame, and a spring is sleeved on the outer surface of the telescopic rod so that the telescopic rod can reset itself after contraction.

[0010] As a further description of the above technical solution: The rotating unit also includes a vacuum pump fixed on the inner wall of the ring frame, a connecting pipe is fixed to one end of the vacuum pump, one end of the connecting pipe is fixedly connected to an annular pipe, the annular pipe is fixed to the inner wall of the ring frame through a pipe clamp, a rotating joint is fixed to the bottom of the vacuum suction cup, an air pipe is fixed to the bottom end of the rotating joint, and one end of the air pipe passes through the mounting seat and is fixedly connected to the annular pipe.

[0011] As a further description of the above technical solution: The rotating unit further comprises a driving assembly, which comprises a motor fixed to one side of the bottom wall of the detection cabinet, a retaining frame is fixed to one side of the motor, and a driving gear is rotatably connected to the retaining frame.

[0012] As a further description of the above technical solution: The output end of the motor is spline-connected with one end of the driving gear, and an outer gear ring meshing with the driving gear is fixedly sleeved on the outer wall of the ring frame, so that the ring frame can rotate under the drive of the motor.

[0013] As a further description of the above technical solution: An inner gear ring is fixedly sleeved on the outer wall of the vacuum suction cup, and a face gear meshing with the inner gear ring in a vertical state is detachably fixed on the top of the outer wall of the cam member, so that the vacuum suction cup can rotate to a vertical state under the cooperation of the guide rod and the cam member and can rotate under the drive of the face gear while following the revolution of the ring frame.

[0014] A wafer defect detection method for wafer production comprises the following steps: S1, preparation stage: Place the wafer to be inspected on the surface of the vacuum chuck, start the vacuum pump, evacuate the vacuum chuck through the connecting pipe, annular pipe and air pipe, so that the wafer is adsorbed and fixed on the vacuum chuck, and then ensure that the camera has been correctly installed and debugged, and can clearly capture the wafer; S2, start the rotation unit: start the motor to drive the active gear to rotate, and drive the ring frame and the wafer to start rotating; S3. Wafer tilting and inspection: During the rotation of the ring frame, the guide rod rotates along the outer wall of the cam member. The shape of the cam member is designed so that the guide rod gradually moves toward the edge of the ring frame during the rotation. The movement of the guide rod drives the mounting seat together with the vacuum suction cup to gradually tilt downward to a vertical state through the cooperation of the inclined crank and the guide groove. During the wafer tilting process, the camera shoots the wafer at multiple angles to capture the scattering signals of defects with different scattering characteristics. S4. Wafer rotation and edge detection: When the wafer is tilted to a vertical state, the ring frame continues to rotate, and the inner gear ring gradually contacts and meshes with the face gear. Driven by the face gear, the inner gear ring drives the vacuum suction cup to rotate, causing the wafer to rotate in a vertical state. During the wafer rotation, the camera takes pictures of the edge of the wafer to ensure that defects at the edge can also be detected; S5. Wafer resetting and re-inspection: When the ring frame continues to rotate to a certain angle, the trajectory of the cam part becomes concave inward, reducing the resistance to the spring. Under the action of the spring restoring force, the telescopic rod gradually unfolds, driving the guide rod and the inclined crank to gradually move toward the center of the ring frame. The movement of the inclined crank drives the mounting seat and the vacuum suction cup to gradually return to a horizontal state. During the wafer resetting process, the camera can re-inspect the wafer surface to further improve the accuracy of the inspection; S6, end of detection: turn off the power of the motor and vacuum pump, release the adsorption force of the vacuum suction cup, remove the wafer after detection, and proceed to the next step of processing or analysis.

[0015] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are: The camera, rotating unit and cam are set up to realize automatic rotation and tilt of the wafer during the inspection process, so that defects on the surface and edge of the wafer can be detected at the same time, avoiding the cumbersome steps of separate inspection in traditional methods and significantly improving the inspection efficiency; At the same time, during the inspection process, the wafer can present different inspection angles as it gradually tilts from a flat state to a vertical state. In addition, when the wafer continues to follow the orbital rotation of the ring frame in a vertical state, the vacuum suction cup drives the wafer to rotate under the drive of the face gear, so that all positions on the edge of the wafer can be photographed by the camera. When used in conjunction, the camera can more comprehensively capture the defect scattering signals on the surface and edge of the wafer, thereby reducing the risk of missed detection and false detection. In the process of restoring from the vertical state to the horizontal state, the camera can be used to re-inspect the surface of the wafer after inspection, further improving the accuracy of the inspection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It shows a schematic diagram of the overall structure provided by an embodiment of the present invention; Figure 2 It shows a schematic diagram of the internal structure of the ring frame after being cut open according to an embodiment of the present invention; Figure 3 The embodiment of the present invention provides Figure 2 The enlarged view of point A in the middle; Figure 4 A schematic structural diagram of a ring frame provided in an embodiment of the present invention is shown; Figure 5 It shows a schematic structural diagram of a vacuum suction cup in a horizontal state provided by an embodiment of the present invention; Figure 6 The embodiment of the present invention provides Figure 2 The enlarged view of point B in the middle; Figure 7 It shows a schematic structural diagram of a mounting base and a vacuum suction cup after being cut apart according to an embodiment of the present invention; Figure 8 A schematic diagram showing the installation position of a support base provided according to an embodiment of the present invention is shown; Fig. 9 A schematic structural diagram of a cam member provided according to an embodiment of the present invention is shown; Fig.10 A schematic structural diagram of a vacuum suction cup in a vertical state at a first viewing angle according to an embodiment of the present invention is shown; Fig.11 A schematic structural diagram of a vacuum suction cup in a vertical state at a second viewing angle according to an embodiment of the present invention is shown.

[0017] Legend: 10. Testing cabinet; 20. Camera; 30. Rotating unit; 31. Ring frame; 32. Mounting seat; 33. Angle adjustment frame; 331. Slide rail; 332. Sliding block; 333. Guide rod; 334. Telescopic rod; 335. Spring; 336. Oblique crank; 337. Guide groove; 34. Vacuum pump; 35. Vacuum suction cup; 36. Rotating joint; 37. Air pipe; 38. Driving assembly; 381. Motor; 382. Driving gear; 383. External gear ring; 384. Internal gear ring; 385. Face gear; 39. Ring tube; 40. Support seat; 50. Cam parts. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] like Figure 1 - Fig.11 As shown, the present invention provides: A wafer defect detection device for wafer production includes a detection cabinet 10 and a camera 20 mounted on the inner top wall of the detection cabinet 10, and a rotating unit 30 is mounted on the inner bottom wall of the detection cabinet 10 by opening a mounting groove; The rotating unit 30 includes a ring frame 31 rotatably connected to the mounting groove, and a plurality of mounting seats 32 are installed at the opening of the ring frame 31. The wafer to be inspected is fixed during the inspection process by being adsorbed by a vacuum suction cup 35 rotatably connected to the mounting seat 32; The rotating unit 30 further includes a vacuum pump 34 fixed on the inner wall of the ring frame 31, a connecting pipe is fixed on one end of the vacuum pump 34, and an annular pipe 39 is fixed on one end of the connecting pipe, and the annular pipe 39 is fixed on the inner wall of the ring frame 31 through a pipe hoop, a rotating joint 36 is fixed on the bottom of the vacuum suction cup 35, and an air pipe 37 is fixed on the bottom end of the rotating joint 36, and one end of the air pipe 37 passes through the mounting seat 32 and is fixedly connected with the annular pipe 39, preferably, a solenoid valve is provided on the connecting pipe for opening and closing the connecting pipe, and a power box is provided on one side of the inner wall of the ring frame 31 close to the vacuum pump 34, and a battery for powering the vacuum pump 34 is provided in the power box; In further detail, the camera 20 is located at a position corresponding to the axis of the ring frame 31 on the top wall of the detection cabinet 10, so that the camera 20 can completely capture the wafer during the movement of the wafer. In particular, a plurality of balls are embedded on the lower surface of the ring frame 31, and the bottom of the balls is in contact with the support seat 40, which can provide a certain support force for the ring frame 31, making the ring frame 31 more stable when rotating, and at the same time will not affect the rotation of the ring frame 31; Specifically, before the test, the wafer to be tested is placed on the surface of the vacuum chuck 35, and then the vacuum pump 34 is started to evacuate the vacuum chuck 35, so that the wafer is adsorbed and fixed on the surface of the vacuum chuck 35, and the design of the rotary joint 36 enables the wafer to maintain a vacuum adsorption state during the self-rotation of the vacuum chuck 35, thereby ensuring the stability of the test. After the test is completed, the power supply of the vacuum pump 34 is turned off to release the adsorption force of the vacuum chuck 35, and then the wafer is removed; It is worth noting that the vacuuming force of the vacuum pump 34 and the shooting parameters of the camera 20 need to be adjusted in advance according to the material and size of the wafer to obtain the best detection effect.

[0020] like Figure 2 , Figure 8 and Fig. 9 As shown, the rotating unit 30 further includes a driving assembly 38, and the driving assembly 38 includes a motor 381 fixed to one side of the bottom wall of the detection cabinet 10, and a retaining frame is fixed to one side of the motor 381, and a driving gear 382 is rotatably connected to the retaining frame; The output end of the motor 381 is spline-connected to one end of the driving gear 382. An outer gear ring 383 meshing with the driving gear 382 is fixedly sleeved on the outer wall of the ring frame 31, so that the ring frame 31 can rotate under the drive of the motor 381. An inner gear ring 384 is fixedly sleeved on the outer wall of the vacuum suction cup 35, and a face gear 385 meshing with the inner gear ring 384 in a vertical state is detachably fixed on the top of the outer wall of the cam member 50. Preferably, the inner gear ring 384 is a cylindrical gear, so that the vacuum suction cup 35 can rotate under the drive of the face gear 385 while following the revolution of the ring frame 31 after rotating to a vertical state under the cooperation of the guide rod 333 and the cam member 50. In further detail, after the wafer is adsorbed and fixed on the surface of the vacuum suction cup 35, the motor 381 is started to drive the driving gear 382 to rotate, and then drive the outer gear ring 383 to drive the ring frame 31 and the wafer to rotate. During the rotation process, the angle adjustment frame 33 cooperates with the cam member 50 to gradually drive the wafer to gradually tilt from a flat state to a vertical state. No manual adjustment or step-by-step operation is required, so that continuous detection of surface and edge defects is achieved, the time loss of traditional step-by-step detection is reduced, and the efficiency is significantly improved. In the process of gradual tilting, the angle changes continuously, so that the camera 20 can capture the scattering signals of defects with different scattering characteristics, avoiding missed detection or false detection caused by a fixed viewing angle; It is worth noting that when the wafer is just tilted to a vertical state, the inner gear ring 384 and the face gear 385 are in a non-meshing state, and will gradually contact and mesh during the continued rotation. The automatic meshing design of the face gear 385 and the inner gear ring 384 allows the wafer to rotate in a vertical state, and no additional drive is required for edge detection. The vacuum suction cup 35 is connected to the annular tube 39 through a rotating joint 36 to ensure that the wafer is firmly adsorbed during rotation and tilting.

[0021] like Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, an angle adjustment frame 33 is mounted on the inner bottom wall of the ring frame 31, and the angle adjustment frame 33 is connected to the mounting seat 32 through an inclined crank 336. A support seat 40 is mounted at the bottom of the detection cabinet 10, and a cam member 50 is mounted in the support seat 40. When the angle adjustment frame 33 follows the rotation of the ring frame 31, the cam member 50 drives the mounting seat 32 to drive the wafer on the surface of the vacuum suction cup 35 to gradually tilt from a horizontal state to a vertical state, thereby realizing the detection of the wafer surface and edge; In further detail, the angle adjustment frame 33 includes a slide rail 331 fixed on the inner bottom wall of the ring frame 31, a slider 332 is slidably mounted on the slide rail 331, a guide rod 333 having one end in contact with the outer wall of the cam member 50 is fixed to the top of the slider 332, and a roller is rotatably connected to the end of the guide rod 333 in contact with the cam member 50, so that the guide rod 333 moves more smoothly on the cam member 50; A guide groove 337 is provided on the outer wall of the inclined crank 336, and the other end of the guide rod 333 is rotatably connected to a guide post adapted to the guide groove 337, and the other end of the guide rod 333 is slidably installed in the guide groove 337 through the guide post; A connecting seat is fixed at the center of the bottom of the mounting seat 32, and shaft columns are fixed on both sides of the connecting seat. One end of the shaft column is rotatably connected to a retaining seat, and one end of the retaining seat is fixed to the opening of the ring frame 31, so that the mounting seat 32 can be rotatably connected to the ring frame 31. One end of the inclined crank 336 is fixed to the connecting seat. When the inclined crank 336 moves toward the edge under the drive of the guide rod 333, it can drive the mounting seat 32 to gradually tilt to a vertical state; Specifically, during the rotation of the ring frame 31, the guide rod 333 rotates along the cam member 50 and gradually moves toward the edge of the ring frame 31 driven by the cam member 50. During the movement toward the edge, the guide rod 333 pushes the inclined crank 336 to move toward the edge, thereby driving the mounting seat 32 and the vacuum suction cup 35 to gradually tilt downward to a vertical state. During the tilting process, the camera 20 is used to shoot wafers at multiple angles to avoid missed detection or false detection caused by a fixed viewing angle. At the same time, while continuing to rotate in the vertical state, when the inner gear ring 384 engages with the surface gear 385, the inner gear ring 384 will drive the vacuum suction cup 35 to rotate under the drive of the fixed surface gear 385, so that the wafer on the surface of the suction cup rotates, so that the edge of the wafer can be fully exposed during the rotation process, and then photographed by the camera 20, and finally analyzed by image processing technology, so that the surface and edge of the wafer can be detected to avoid missed defects.

[0022] like Figure 5 , Fig.10 and Fig.11 As shown, a telescopic rod 334 is mounted on one side of the slider 332, one end of the telescopic rod 334 is fixed to the inner wall of the ring frame 31, and a spring 335 is sleeved on the outer surface of the telescopic rod 334, so that the telescopic rod 334 can reset itself after contraction; In particular, in the process of the guide rod 333 moving toward the edge, the telescopic rod 334 will be driven to contract and the spring 335 will be gradually compressed. After the guide rod 333 rotates 270°, when it continues to rotate, the trajectory of the cam member 50 is concave inward at this time, which will gradually reduce the resistance to the spring 335. In the process, the telescopic rod 334 is driven to gradually expand under the action of the restoring force of the spring 335, and then the guide rod 333 is driven to drive the inclined crank 336 to gradually move toward the center of the ring frame 31, thereby gradually driving the vertical wafer to gradually return to the horizontal state. It is worth noting that in this process, the wafer surface can be re-inspected by the camera 20 to further improve the accuracy of the detection.

[0023] A wafer defect detection method for wafer production comprises the following steps: S1, preparation stage: Place the wafer to be inspected on the surface of the vacuum chuck 35, start the vacuum pump 34, evacuate the vacuum chuck 35 through the connecting pipe, the annular pipe 39 and the air pipe 37, so that the wafer is adsorbed and fixed on the vacuum chuck 35, and then ensure that the camera 20 has been correctly installed and debugged, and can clearly capture the wafer; S2, start the rotating unit 30: start the motor 381 to drive the driving gear 382 to rotate, and drive the ring frame 31 and the wafer to start rotating; S3. Wafer tilting and detection: During the rotation of the ring frame 31, the guide rod 333 rotates along the outer wall of the cam member 50. The shape design of the cam member 50 enables the guide rod 333 to gradually move toward the edge of the ring frame 31 during the rotation. The movement of the guide rod 333 drives the mounting seat 32 together with the vacuum suction cup 35 to gradually tilt downward to a vertical state through the cooperation of the inclined crank 336 and the guide groove 337. During the wafer tilting process, the camera 20 shoots the wafer at multiple angles to capture the scattering signals of defects with different scattering characteristics. S4, wafer rotation and edge detection: When the wafer is tilted to a vertical state, the ring frame 31 continues to rotate, and the inner gear ring 384 gradually contacts and meshes with the face gear 385. Driven by the face gear 385, the inner gear ring 384 drives the vacuum chuck 35 to rotate, so that the wafer rotates in a vertical state. During the wafer rotation, the camera 20 takes pictures of the edge of the wafer to ensure that defects at the edge can also be detected; S5, wafer resetting and re-inspection: When the ring frame 31 continues to rotate to a certain angle, the trajectory of the cam member 50 is inwardly concave, reducing the resisting force on the spring 335. Under the action of the restoring force of the spring 335, the telescopic rod 334 is gradually unfolded, driving the guide rod 333 and the inclined crank 336 to gradually move toward the center of the ring frame 31. The movement of the inclined crank 336 drives the mounting seat 32 and the vacuum suction cup 35 to gradually return to a horizontal state. During the wafer resetting process, the camera 20 can re-inspect the wafer surface to further improve the accuracy of the inspection; S6, end the detection: turn off the power of the motor 381 and the vacuum pump 34, release the adsorption force of the vacuum chuck 35, remove the wafer after the detection, and proceed to the next step of processing or analysis.

[0024] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A wafer defect detection device for wafer production, comprising a detection cabinet (10) and a camera (20) mounted on the top wall of the detection cabinet (10), characterized in that: The inner bottom wall of the detection cabinet (10) is provided with a rotating unit (30) by providing a mounting groove, wherein the rotating unit (30) comprises a ring frame (31) rotatably connected to the mounting groove, and a plurality of mounting seats (32) are installed at the opening of the ring frame (31); The wafer to be inspected is connected to the vacuum suction cup (35) in the mounting seat (32) by rotation and adsorbed to achieve fixation during the inspection process; An angle adjustment frame (33) is mounted on the inner bottom wall of the ring frame (31), and the angle adjustment frame (33) is connected to the mounting seat (32) via an inclined crank (336); The bottom of the inspection cabinet (10) is equipped with a support seat (40), and a cam member (50) is installed in the support seat (40). When the angle adjustment frame (33) follows the rotation of the ring frame (31), the cam member (50) drives the mounting seat (32) to drive the wafer on the surface of the vacuum suction cup (35) to gradually tilt from a horizontal state to a vertical state, thereby realizing the detection of the surface and edge of the wafer.

2. The wafer defect detection device for wafer production according to claim 1, characterized in that: The angle adjustment frame (33) comprises a slide rail (331) fixed on the inner bottom wall of the ring frame (31), a slider (332) being slidably mounted on the slide rail (331), a guide rod (333) having one end in contact with the outer wall of the cam member (50) being fixed to the top end of the slider (332), and a roller is rotatably connected to the end of the guide rod (333) in contact with the cam member (50), so that the guide rod (333) moves more smoothly on the cam member (50).

3. The wafer defect detection device for wafer production according to claim 2, characterized in that: A guide groove (337) is provided on the outer wall of the inclined crank (336); the other end of the guide rod (333) is rotatably connected to a guide column matched with the guide groove (337); the other end of the guide rod (333) is slidably installed in the guide groove (337) via the guide column.

4. The wafer defect detection device for wafer production according to claim 3, characterized in that: A connecting seat is fixed at the center of the bottom of the mounting seat (32), shaft columns are fixed on both sides of the connecting seat, one end of the shaft column is rotatably connected to a retaining seat, one end of the retaining seat is fixed to the opening of the ring frame (31), so that the mounting seat (32) can be rotatably connected to the ring frame (31), one end of the inclined crank (336) is fixed to the connecting seat, and when the inclined crank (336) moves toward the edge under the drive of the guide rod (333), it can drive the mounting seat (32) to gradually tilt to a vertical state.

5. The wafer defect detection device for wafer production according to claim 3, characterized in that: A telescopic rod (334) is mounted on one side of the slider (332), one end of the telescopic rod (334) is fixed to the inner wall of the ring frame (31), and a spring (335) is sleeved on the outer surface of the telescopic rod (334) so ​​that the telescopic rod (334) can reset itself after contraction.

6. The wafer defect detection device for wafer production according to claim 1, characterized in that: The rotating unit (30) further comprises a vacuum pump (34) fixed to the inner wall of the ring frame (31); a connecting pipe is fixed to one end of the vacuum pump (34); one end of the connecting pipe is fixedly connected to an annular pipe (39); the annular pipe (39) is fixed to the inner wall of the ring frame (31) via a pipe clamp; a rotating joint (36) is fixed to the bottom of the vacuum suction cup (35); an air pipe (37) is fixed to the bottom end of the rotating joint (36); one end of the air pipe (37) passes through the mounting seat (32) and is fixedly connected to the annular pipe (39).

7. The wafer defect detection device for wafer production according to claim 1, characterized in that: The rotating unit (30) further comprises a driving assembly (38), wherein the driving assembly (38) comprises a motor (381) fixed to one side of the inner bottom wall of the detection cabinet (10), a retaining frame being fixed to one side of the motor (381), and a driving gear (382) being rotatably connected to the retaining frame.

8. The wafer defect detection device for wafer production according to claim 7, characterized in that: The output end of the motor (381) is spline-connected to one end of the driving gear (382), and an outer gear ring (383) meshing with the driving gear (382) is fixedly sleeved on the outer wall of the ring frame (31), so that the ring frame (31) can rotate under the drive of the motor (381).

9. The wafer defect detection device for wafer production according to claim 8, characterized in that: An inner gear ring (384) is fixedly sleeved on the outer wall of the vacuum suction cup (35), and a face gear (385) meshing with the inner gear ring (384) in a vertical state is detachably fixed on the top of the outer wall of the cam member (50), so that the vacuum suction cup (35) can rotate to a vertical state under the cooperation of the guide rod (333) and the cam member (50) and can rotate under the drive of the face gear (385) while following the revolution of the ring frame (31).

10. A detection method of a wafer defect detection device for wafer production, using a wafer defect detection device for wafer production as claimed in any one of claims 1 to 9, characterized in that: The detection method includes the following steps: S1, preparation stage: placing a wafer to be inspected on the surface of the vacuum suction cup (35), starting the vacuum pump (34), evacuating the vacuum suction cup (35) through the connecting pipe, the annular pipe (39) and the air pipe (37), so that the wafer is adsorbed and fixed on the vacuum suction cup (35), and then ensuring that the camera (20) has been correctly installed and debugged, so that the wafer can be clearly photographed; S2, starting the rotating unit (30): starting the motor (381) to drive the driving gear (382) to rotate, thereby driving the ring frame (31) and the wafer to start rotating; S3. Wafer tilting and detection: During the rotation of the ring frame (31), the guide rod (333) rotates along the outer wall of the cam member (50). The shape design of the cam member (50) enables the guide rod (333) to gradually move toward the edge of the ring frame (31) during the rotation. The movement of the guide rod (333) drives the mounting seat (32) together with the vacuum suction cup (35) to gradually tilt downward to a vertical state through the cooperation of the inclined crank (336) and the guide groove (337). During the wafer tilting process, the camera (20) takes pictures of the wafer at multiple angles to capture the scattering signals of defects with different scattering characteristics. S4, wafer rotation and edge detection: when the wafer is tilted to a vertical state, the ring frame (31) continues to rotate, and the inner gear ring (384) gradually contacts and meshes with the face gear (385). Driven by the face gear (385), the inner gear ring (384) drives the vacuum suction cup (35) to rotate, so that the wafer rotates in a vertical state. During the wafer rotation, the camera (20) takes a picture of the edge of the wafer to ensure that defects at the edge can also be detected; S5, wafer resetting and re-inspection: when the ring frame (31) continues to rotate to a certain angle, the trajectory of the cam member (50) is concave inward, reducing the resisting force on the spring (335). Under the action of the restoring force of the spring (335), the telescopic rod (334) gradually unfolds, driving the guide rod (333) and the inclined crank (336) to gradually move toward the center of the ring frame (31). The movement of the inclined crank (336) drives the mounting seat (32) and the vacuum suction cup (35) to gradually return to a horizontal state. During the wafer resetting process, the camera (20) can re-inspect the wafer surface to further improve the accuracy of the inspection; S6, end the test: turn off the power of the motor (381) and the vacuum pump (34), release the adsorption force of the vacuum suction cup (35), remove the wafer after the test, and proceed to the next step of processing or analysis.

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