Packaging structure, optical module and optical system

Abstract

The invention provides a packaging structure, an optical module and an optical system, the packaging structure comprises an optical fiber unit and a chip unit, the chip unit comprises a photon chip and a chip cover plate, the photon chip is buckled with the chip cover plate, a spot size converter is arranged in the photon chip, and the spot size converter is composed of a cantilever beam waveguide and a first groove; the optical fiber unit comprises an optical fiber, a bottom plate and an optical fiber cover plate bottom plate; the waveguide is coupled with the optical fiber; wherein a first bonding part is arranged between the chip cover plate and the bottom plate, and a second bonding part is arranged between the photon chip and the optical fiber cover plate; or a first bonding part is arranged between the chip cover plate and the optical fiber cover plate, and a second bonding part is arranged between the photon chip and the bottom plate. In the packaging structure, a chip cover plate is arranged on a photon chip to form a chip unit, so that the bonding area between the chip unit and an optical fiber array is increased, the mechanical stability of the packaging structure is improved, and alignment of waveguides in the photon chip and optical fibers in the optical fiber array is realized.

Description

Technical Field

[0001] The present application relates to the field of optical communications, and in particular to a packaging structure, an optical module and an optical system. Background Art

[0002] With the rapid development of big data and cloud computing, the network traffic of data centers has shown a rapid growth trend, which has posed more severe challenges to data center networks and optical interconnection technologies. The core of silicon photonics technology is to use silicon as the basic material for optical devices and to build optical components such as optical waveguides, modulators, optical switches, etc. on photonic chips with the help of advanced manufacturing processes. These devices can realize functions such as the generation, transmission, regulation and detection of optical signals.

[0003] The packaging of photonic integrated circuit (PIC) and fiber array (FA) is one of the important technical difficulties in silicon photonic technology. Since the mode field diameter of the waveguide in the photonic chip is small and does not match the mode field diameter of the standard optical fiber, direct coupling of the waveguide with the optical fiber will result in large coupling loss. At present, the packaging structure of the photonic chip and the optical fiber can be divided into end-face coupling packaging structure and grating coupling packaging structure. As a packaging form of end-face coupling structure, a spot size converter (SSC) can be set at the edge of the photonic chip, or it can also be understood as one end of the photonic chip, so that the waveguide spot is matched with the optical fiber spot. The spot converter can be in the form of a cantilever beam. The bottom of the cantilever beam spot converter is etched to form a first groove. The waveguide is suspended relative to the first groove to form a cantilever beam waveguide. The air in the first groove is used to limit the transmitted optical signal to the cantilever beam waveguide for transmission, thereby achieving mode field matching and reducing packaging loss. The packaging method of the cantilever beam spot converter is end-face bonding coupling. However, the cantilever beam structure has the characteristic of stress sensitivity. For example, changes in ambient temperature, application of external forces, movement of packaging structures, etc. may cause stress to act on the cantilever beam waveguide, which will cause the optical transmission characteristics of the cantilever beam waveguide to change, and high stress will cause damage to the mechanical structure of the waveguide. In addition, if the photonic chip and the optical fiber array are directly packaged, the optical fiber will easily move out of place, and the packaging mechanical reliability will be poor.

[0004] Therefore, in the end-face coupling packaging structure including the cantilever beam type spot converter, how to achieve the stress balance of the cantilever beam structure and ensure that the optical fiber is not easily displaced is an urgent problem to be solved. Summary of the invention

[0005] The present application provides a packaging structure, an optical module and an optical system, which form a chip unit by arranging a chip cover on a photonic chip, thereby increasing the bonding area between the chip unit and the optical fiber array, increasing the mechanical stability of the packaging structure, and achieving stress balance of the cantilever beam waveguide.

[0006] In the first aspect, a packaging structure is provided, comprising a chip unit and an optical fiber unit, wherein: the chip unit comprises a photon chip and a chip cover plate, the photon chip is buckled with the chip cover plate, a pattern spot converter is arranged in the photon chip, the pattern spot converter is composed of a cantilever beam waveguide and a first groove, wherein there is a gap between the cantilever beam waveguide and the first groove; the optical fiber unit comprises an optical fiber, a bottom plate and an optical fiber cover plate, a second groove is arranged in the bottom plate, the second groove is used to accommodate the optical fiber, and the optical fiber cover plate is buckled with the bottom plate; wherein the cantilever beam waveguide is coupled and connected with the optical fiber; wherein a first bonding portion is arranged between the chip cover plate and the bottom plate, and a second bonding portion is arranged between the photon chip and the optical fiber cover plate; or a first bonding portion is arranged between the chip cover plate and the optical fiber cover plate, and a second bonding portion is arranged between the photon chip and the bottom plate. In the packaging structure, by arranging the chip cover plate on the photon chip, the bonding area between the chip unit and the optical fiber array is increased, the mechanical stability of the packaging structure is increased, the optical fiber position movement or even falling off caused by the change of ambient temperature is improved, and the alignment of the cantilever beam waveguide and the optical fiber is achieved. In addition, the addition of the chip cover plate can also balance the stress above and below the first groove position near the first bonding portion, so as to achieve low-stress packaging of the cantilever beam waveguide.

[0007] In combination with the first aspect, in certain implementations of the first aspect, the bottom of the optical fiber unit is suspended, and the coupling connection between the cantilever beam waveguide and the optical fiber includes: the end of the cantilever beam waveguide is butted against the end of the optical fiber. Thus, by directly butting the waveguide in the chip unit with the optical fiber in the optical fiber unit, the transmission distance of the optical signal can be shortened and the packaging loss can be reduced. In addition, due to the provision of the chip cover plate, the bonding area between the chip unit and the optical fiber unit can be increased, and even if the bottom of the optical fiber unit is suspended for precise alignment of the waveguide and the optical fiber, the mechanical stability of the packaging structure can be ensured.

[0008] In combination with the first aspect, in certain implementations of the first aspect, the projection of the optical fiber and the projection of the photonic chip have an overlapping portion on the plane where the bottom of the photonic chip is located, and the projection of the optical fiber cover plate or the bottom plate with a first bonding portion disposed between the chip cover plate at least partially covers the overlapping portion. That is, the optical fiber and the bottom plate or the optical fiber cover plate extend to the photonic chip together. In the chip preparation process, in order to separate the chips from each other, it is necessary to cut the chip with a knife or a laser. Therefore, during waveguide etching, the waveguide will be retracted to avoid damage to the waveguide end face caused by cutting. By extending the optical fiber to the photonic chip, the transmission loss of the optical signal can be reduced and the coupling efficiency can be optimized. In addition, since the optical fiber cover plate or the bottom plate also extends to the photonic chip, the contact area between the chip unit and the optical fiber unit is guaranteed to be constant, thereby increasing the mechanical stability of the packaging structure.

[0009] In combination with the first aspect, in certain implementations of the first aspect, wherein: on the plane where the bottom of the photonic chip is located, the projection of the optical fiber and the projection of the photonic chip have an overlapping portion, and the projection of the chip cover at least partially covers the overlapping portion; wherein the chip cover has a cut angle, and the cut angle is used to avoid the optical fiber. In the chip preparation process, in order to separate the chips from each other, it is necessary to cut the chip with a knife or laser. Therefore, during waveguide etching, the waveguide will be retracted to avoid damage to the waveguide end face caused by cutting. By extending the optical fiber to the photonic chip, the transmission loss of the optical signal can be reduced and the coupling efficiency can be optimized. In addition, in order to ensure that the contact area between the chip unit and the optical fiber unit is constant and does not affect the transmission of the optical signal, it is necessary to set a cut angle on the chip cover.

[0010] In combination with the first aspect, in certain implementations of the first aspect, the first bonding portion and / or the second bonding portion is made of epoxy resin or acrylic acid; and / or the shrinkage rate of the first bonding portion and / or the second bonding portion is less than 0.3%, thereby preventing displacement between the chip unit and the optical fiber unit, ensuring accurate alignment between the waveguide and the optical fiber, reducing packaging loss, ensuring a stable connection between the chip unit and the optical fiber unit, and increasing the mechanical stability of the packaging structure.

[0011] In combination with the first aspect, in some implementations of the first aspect, the photonic chip includes N cantilever beam waveguides, the optical fiber unit includes N optical fibers, the N cantilever beam waveguides correspond to the N optical fibers one by one, the cantilever beam waveguides in the N cantilever beam waveguides are coupled and connected to the corresponding optical fibers, and N is a positive integer. In some implementations, N is a positive integer greater than or equal to 2. In the case where the packaging structure is a multi-channel packaging structure, by adding a chip cover plate, the bonding area of ​​the chip unit and the optical fiber unit is increased, the stability of the packaging structure is increased, and the precise alignment of the multi-waveguides and the multi-optical fibers is achieved.

[0012] In combination with the first aspect, in some implementations of the first aspect, the packaging structure includes M optical fiber units, the photonic chip includes M spot converters, the M optical fiber units correspond to the M spot converters one by one, the optical fiber units in the M optical fiber units are coupled to the corresponding spot converters, and M is a positive integer. In some implementations, M is a positive integer greater than or equal to 2. The packaging structure can be a co-packaging structure, thereby shortening the transmission distance of the optical signal, reducing packaging loss, and reducing system cost and energy loss.

[0013] In a second aspect, a packaging structure and an optical component including the first aspect and any possible implementation of the first aspect are provided. The optical component is optically connected to the packaging structure, and the optical component is used to receive and / or send optical signals.

[0014] In a third aspect, an optical system is provided, comprising an optoelectronic device and the second aspect and any possible optical module, wherein the optoelectronic device is connected to the optical module, and the optoelectronic device is any one of an optical switch, an optical fiber router, and an optical fiber network card. The optoelectronic device may include multiple ports, each of the multiple ports corresponds to an optical transmission channel, and the ports of the multiple ports are connected to the optical module, thereby realizing multi-channel, high-speed data transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of a packaging structure provided in an embodiment of the present application.

[0016] Figure 2 It is a schematic diagram of a pattern spot converter provided in an embodiment of the present application.

[0017] Figure 3 It is a schematic diagram of another packaging structure provided in an embodiment of the present application.

[0018] Figure 4 It is a schematic diagram of another packaging structure provided in an embodiment of the present application.

[0019] Figure 5 It is a schematic diagram of an optical module provided in an embodiment of the present application.

[0020] Figure 6 It is a schematic diagram of an optical system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0021] The technical solution in this application will be described below in conjunction with the accompanying drawings.

[0022] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0023] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0024] In the description of the embodiments of the present application, the terms "upper", "lower", "vertical", "horizontal", etc. indicate orientations or positional relationships that are defined relative to the orientations or positions of the components schematically placed in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative descriptions and clarifications, rather than indicating or implying that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. They may change accordingly according to changes in the orientations of the components placed in the drawings, and therefore cannot be understood as limitations on the present application.

[0025] The terms "including" and "having" and any variations thereof in the embodiments of the present application shown below are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units that are not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0026] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions, and embodiments or designs described as "exemplary" or "for example" should not be interpreted as being more preferred or more advantageous than other embodiments or designs. The use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way for easy understanding.

[0027] With the rapid development of big data and cloud computing, the network traffic of data centers has shown a rapid growth trend, which has posed more severe challenges to data center networks and optical interconnection technologies. In traditional data center networks, there are some limitations in the use of electronic interconnection technology, such as high power consumption, limited bandwidth, and high latency. In order to meet the requirements of high bandwidth, low latency, and energy saving, silicon photonics technology has attracted much attention. The core of silicon photonics technology is to use silicon as the basic material for optical devices, and to use advanced manufacturing processes to build optical components such as optical waveguides, modulators, and optical switches on photonic chips. These devices can realize functions such as the generation, transmission, regulation, and detection of optical signals. Compared with traditional optical devices, silicon photonics technology has the advantages of low manufacturing cost, high integration, and strong compatibility.

[0028] The packaging of photonic chips (photonics integrated circuit, PIC) and fiber arrays (fiber array, FA) is one of the important technical difficulties in silicon photonics technology. Since the mode field diameter of the waveguide in the photonic chip is small and does not match the mode field diameter of the standard optical fiber, direct coupling of the waveguide with the optical fiber will result in large coupling losses. At present, the packaging structure of photonic chips and optical fibers can be divided into end-face coupling packaging structure and grating coupling packaging structure. Among them, the end-face coupling packaging structure can refer to a packaging structure formed by directly or indirectly connecting the end face of the photonic chip and the end face of the optical fiber. The grating coupling packaging structure can refer to a packaging structure formed by optically connecting the photonic chip and the optical fiber through a grating. Although the grating coupling packaging structure has the advantages of large tolerance and easy adjustment, the grating itself will cause loss of optical signals. The end-face coupling packaging structure has the advantages of low packaging loss and small size, and has become the main form of coupling packaging structure.

[0029] As a packaging form of end-face coupling structure, a spot size converter (SSC) can be set at the edge of the photonic chip, or it can also be understood as one end of the photonic chip, so that the waveguide spot and the optical fiber spot match. The spot converter can be in the form of a cantilever beam. The bottom of the cantilever beam spot converter is etched to form a first groove. The waveguide is suspended relative to the first groove to form a cantilever beam waveguide. The air in the first groove is used to limit the transmitted optical signal to be transmitted in the cantilever beam waveguide, thereby achieving mode field matching and reducing packaging losses. The packaging method using the cantilever beam spot converter is end-face bonding coupling. However, the cantilever beam structure is sensitive to stress. For example, changes in ambient temperature, application of external forces, movement of the packaging structure, etc. may cause stress to act on the cantilever beam waveguide, which will cause the optical transmission characteristics of the cantilever beam waveguide to change, and the high stress will cause damage to the mechanical structure of the waveguide. In addition, if the photonic chip and the optical fiber array are directly packaged, the optical fiber will easily move out of place, and the packaging mechanical reliability is poor.

[0030] Therefore, in the end-face coupling packaging structure including the cantilever beam type spot converter, how to achieve the stress balance of the cantilever beam structure and ensure that the optical fiber is not easily displaced is an urgent problem to be solved.

[0031] In view of this, the embodiments of the present application provide a packaging structure, an optical module and an optical system, which form a chip unit by setting a chip cover on the photonic chip, increase the bonding area between the chip unit and the optical fiber array, increase the mechanical stability of the packaging structure, and achieve stress balance of the cantilever beam waveguide.

[0032] Figure 1 It is a schematic diagram of a packaging structure provided in an embodiment of the present application. Figure 1 (a) and (b) show the side view of the packaging structure. Figure 1 (c) shows a top view of the packaging structure. Figure 1 As shown, the packaging structure may include a chip unit and an optical fiber unit. The chip unit includes a photonic chip 111 and a chip cover plate 112. The photonic chip 111 is buckled with the chip cover plate 112, and the buckling method may be glue bonding or other methods. A pattern spot converter is provided in the photonic chip, and the pattern spot converter is composed of a cantilever beam waveguide 114 and a first groove 115, wherein the cantilever beam waveguide 114 is not in contact with the first groove 115.

[0033] The cantilever beam waveguide 114 may specifically refer to the suspended portion of the waveguide 113 relative to the first groove 115. Alternatively, the cantilever beam waveguide 114 and the waveguide 113 may also be separate optical components, and optical elements such as a coupler and a beam splitter are provided between the cantilever beam waveguide 114 and the waveguide 113, which is not limited in the present application. There is a gap between the cantilever beam waveguide 114 and the first groove 115, or it can also be understood that there is a gap or no contact between the cantilever beam waveguide 114 and the first groove 115. In addition, the first groove may also be referred to as an undercut.

[0034] The optical fiber unit includes a bottom plate 121, an optical fiber cover plate 122, and an optical fiber 123. A second groove is provided in the bottom plate 121, and the second groove may be a V-groove, and the second groove is used to accommodate the optical fiber. The optical fiber cover plate 122 is buckled with the bottom plate 121, and the buckling method may be glue bonding or other methods. The optical fiber unit may also be called an optical fiber array.

[0035] The cantilever beam waveguide 114 is coupled to the optical fiber 123. The coupling connection between the cantilever beam waveguide 114 and the optical fiber 123 may specifically refer to a direct optical connection or an indirect optical connection between the cantilever beam waveguide 114 and the optical fiber 123. The indirect optical connection may refer to an adapter, a lens, a polymer waveguide, etc. being provided between the cantilever beam waveguide 114 and the optical fiber 123.

[0036] In some implementations, such as Figure 1 As shown in (a), a first bonding portion 130 is provided between the chip cover plate 112 and the optical fiber cover plate 122 , and a second bonding portion 140 is provided between the photonic chip 111 and the base plate 121 .

[0037] In some implementations, such as Figure 1 As shown in (b), a first bonding portion 130 is disposed between the chip cover plate 112 and the base plate 121 , and a second bonding portion 140 is disposed between the photonic chip 111 and the optical fiber cover plate 122 .

[0038] In such Figure 1 In the packaging structure shown, by setting a chip cover plate on the photonic chip, the bonding area between the chip unit and the optical fiber unit is increased, the mechanical stability of the packaging structure is increased, the optical fiber position movement or even falling off caused by ambient temperature changes is improved, and the waveguide in the photonic chip and the optical fiber in the optical fiber array are aligned. In addition, the addition of the chip cover plate can also balance the stress above and below the first groove position near the first bonding portion to achieve low-stress packaging of the cantilever beam waveguide. Among them, the chip cover plate can be a square cover plate or a special-shaped cover plate, and this application does not limit this.

[0039] In some implementations, such as Figure 1 As shown in , the bottom of the optical fiber unit is suspended, and the coupling connection between the cantilever beam waveguide 114 and the optical fiber 123 includes: the end of the cantilever beam waveguide 114 is butted against the end of the optical fiber 123. Thus, the coupling components are reduced, the transmission distance of the optical signal is shortened, and the packaging loss is reduced. In addition, due to the setting of the chip cover plate, the bonding area between the chip unit and the optical fiber unit can be increased, and even if the bottom of the optical fiber unit is suspended for precise alignment of the waveguide and the optical fiber, the mechanical stability of the packaging structure can be guaranteed.

[0040] In some implementations, the total area of ​​the first bonding portion 130 and the second bonding portion 140 is greater than 1.5 mm 2 , thereby ensuring that the bonding area between the chip unit and the optical fiber array is increased and the mechanical stability of the packaging structure is increased. Among them, the area of ​​the first bonding portion 130 can be greater than 0.75mm 2 The area of ​​the second bonding portion 140 may be greater than 0.75 mm 2 .

[0041] In some implementations, the shrinkage rate of the first adhesive portion 130 and / or the second adhesive portion 140 may be less than 0.3%, thereby preventing displacement between the chip unit and the optical fiber array unit, ensuring accurate alignment between the waveguide and the optical fiber, and reducing packaging loss. The first adhesive portion 130 and / or the second adhesive portion 140 may be made of epoxy resin or acrylic, thereby preventing displacement between the chip unit and the optical fiber unit, ensuring accurate alignment between the waveguide and the optical fiber, reducing packaging loss, and ensuring a stable connection between the chip unit and the optical fiber unit, thereby increasing the mechanical stability of the packaging structure. The first adhesive portion 130 and the second adhesive portion 140 may be formed together by a glue during the packaging process, or may be formed separately by multiple bondings. The first adhesive portion 130 and the second adhesive portion 140 may be made of the same material or different materials, and this application does not limit this.

[0042] In some implementations, due to the provision of the first adhesive portion, the corresponding adhesive material will be filled into the first groove 115. That is, a third adhesive portion is provided in the first groove 115, and the third adhesive portion may be made of epoxy resin or acrylic acid. The third adhesive portion may contact the cantilever beam waveguide 114, or the third adhesive portion covers the cantilever beam waveguide 114. The thickness of the third adhesive portion below the cantilever beam waveguide 114 may be the same as the thickness of the third adhesive portion above the cantilever beam waveguide 114, thereby further ensuring the stress balance at the cantilever beam waveguide.

[0043] In some implementations, the photonic chip includes N cantilever beam waveguides, the optical fiber unit includes N optical fibers, the N cantilever beam waveguides correspond to the N optical fibers one by one, the cantilever beam waveguides in the N cantilever beam waveguides are coupled and connected with the corresponding optical fibers, and N is a positive integer. In some implementations, N is a positive integer greater than or equal to 2. In the case where the packaging structure is a multi-channel packaging structure, by adding a chip cover plate, the bonding area of ​​the chip unit and the optical fiber unit is increased, the stability of the packaging structure is increased, and the precise alignment of the multiple cantilever beam waveguides and the multiple optical fibers is achieved.

[0044] Figure 2 Schematic diagram of a pattern spot converter provided by an embodiment of the present application. The pattern spot converter is composed of a cantilever beam waveguide 210 and a second groove 220, and the cantilever beam waveguide 210 is not in contact with the second groove 220. The second groove 220 in the pattern spot converter can also be called an undercut. The second groove 220 can be formed by etching the bottom of the photonic chip, so that the cantilever beam waveguide 210 is suspended relative to the second groove 220, forming a cantilever beam waveguide. Figure 2As shown, the cantilever beam waveguide can be supported by a bracket 230. In the spot converter, the air in the second groove 220 can be used to limit the optical signal transmitted in the packaging structure to be transmitted in the cantilever beam waveguide, thereby achieving mode field matching and reducing packaging loss. In some implementations, other media, such as polymer media, etc., can also be provided in the second groove 220, and this application does not limit this. In the packaging structure provided in the embodiment of the present application, the spot converter can expand the spot of the cantilever beam waveguide 210 to 9μm, the same as that of the optical fiber.

[0045] When a spot converter is provided in the photonic chip, the cantilever beam waveguide is sensitive to stress. For example, changes in ambient temperature, application of external forces, movement of the packaging structure, etc. may cause stress to act on the cantilever beam waveguide, which will cause the optical transmission characteristics of the waveguide to change, and the high stress will cause damage to the mechanical structure of the waveguide. By adding a chip cover plate and increasing the bonding area between the chip unit and the optical fiber unit, the mechanical stability of the packaging structure can be ensured, and the stress changes near the cantilever beam waveguide caused by temperature changes, displacements, external forces, etc. in the packaging structure can be reduced, thereby achieving low-stress packaging.

[0046] When the photonic chip includes a cantilever beam waveguide, it is difficult to use grinding and polishing to ensure that the end faces of the chip cover and the photonic chip are aligned because the cantilever beam waveguide is relatively fragile. At this time, a precision fixture can be used to fix the relative position of the chip cover and the photonic chip so that the chip cover can be snapped together with the photonic chip.

[0047] In some implementations, the pattern spot converter includes N cantilever beam waveguides. In this case, the lateral dimension of the second groove 220 can be extended accordingly, and the bracket 230 is used to support the N cantilever beam waveguides. The optical fiber unit includes N optical fibers in one-to-one correspondence with the N cantilever beam waveguides of the pattern spot converter. The waveguides in the N cantilever beam waveguides are coupled with the corresponding optical fibers. In the case where the packaging structure is a multi-channel packaging structure, by adding a chip cover plate, the bonding area of ​​the chip unit and the optical fiber unit is increased, and the stress changes near the waveguide caused by temperature changes, displacements, external forces, etc. in the packaging structure are reduced, low-stress packaging is achieved, the stability of the packaging structure is increased, the packaging loss is reduced, and precise alignment of multiple waveguides and multiple optical fibers is achieved. Using the packaging structure of the present application, an optical fiber with an outer diameter of 127μm and an inner diameter of 125μm can be used as a transmission medium for optical signals to achieve a high-density lateral pitch arrangement scheme without using a conventional 250μm size optical fiber.

[0048] Figure 3 It is a schematic diagram of another packaging structure provided in an embodiment of the present application. Figure 3The packaging structure includes a chip unit and an optical fiber unit. The chip unit includes a photonic chip 311, a chip cover plate 312, a waveguide 313, a cantilever beam waveguide 314 and a first groove 315. The pattern optical fiber unit includes a bottom plate 321, an optical fiber cover plate 322 and an optical fiber 323. Figure 1 The same is true in , so I will not repeat it here.

[0049] In some implementations, such as Figure 3 As shown in (a), on the plane where the bottom of the photonic chip 311 is located, the projection of the optical fiber 323 and the projection of the photonic chip 311 have an overlapping part, and the projection of the bottom plate 321 at least partially covers the overlapping part. That is, the optical fiber 323 and the bottom plate 321 extend together to the photonic chip 311. During the chip preparation process, in order to separate the chips from each other, it is necessary to cut the chips with a knife or laser. Therefore, during waveguide etching, the waveguide will be retracted to avoid damage to the waveguide end face caused by cutting. By extending the optical fiber to the photonic chip, the transmission distance of the optical signal can be shortened and the coupling efficiency can be optimized. In addition, since the bottom plate also extends above the photonic chip, the contact area between the chip unit and the optical fiber unit is guaranteed to be constant, thereby increasing the mechanical stability of the packaging structure. In addition, Figure 3 (a) shows only the case where the bottom plate 321 is extended to the photonic chip 311. When a first bonding portion is provided between the chip cover plate and the optical fiber cover plate, the projection of the optical fiber overlaps with the projection of the photonic chip, and the projection of the optical fiber cover plate at least partially covers the overlapping portion. That is, the optical fiber and the optical fiber cover plate extend together to the photonic chip.

[0050] In some implementations, such as Figure 3 As shown in (b), on the plane where the bottom of the photonic chip 311 is located, the projection of the optical fiber 323 and the projection of the photonic chip 311 have an overlapping portion, and the projection of the chip cover 312 at least partially covers the overlapping portion. Among them, the chip cover 312 has a cut angle, and the cut angle is used to avoid the optical fiber 323. In the chip preparation process, in order to separate the chips from each other, it is necessary to cut the chip with a knife or laser. Therefore, during the waveguide etching, the waveguide will be retracted to avoid the damage to the waveguide end face caused by cutting. By extending the optical fiber to the photonic chip, the transmission distance of the optical signal can be shortened and the coupling efficiency can be optimized. In addition, in order to ensure that the contact area between the chip unit and the optical fiber unit is constant and does not affect the transmission of the optical signal, it is necessary to set a cut angle on the chip cover.

[0051] Figure 4 Schematic diagram of another packaging structure provided by an embodiment of the present application. Figure 4As shown, the packaging structure includes M optical fiber units 420, and the photonic chip includes M spot converters 410. The M optical fiber units 420 correspond to the M spot converters 410 one by one. The optical fiber units in the M optical fiber units are coupled with the corresponding spot converters, and M is a positive integer. In some implementations, M is a positive integer greater than or equal to 2. The packaging structure can be a co-package structure (coupled package optics, CPO), thereby shortening the transmission distance of the optical signal, reducing packaging loss, and reducing system cost and energy loss. It should be understood that Figure 4 Only the case where M is equal to 4 is shown, and the specific form of the packaging structure should not be limited.

[0052] In some implementations, the optical fiber unit in the M optical fiber units includes an optical fiber, and the spot converter in the M spot converters includes a cantilever beam waveguide. In this case, the optical fiber unit and the spot converter are specifically used for single-channel optical signal transmission.

[0053] In some implementations, the optical fiber unit in the M optical fiber units includes N optical fibers, and the pattern spot converter in the M pattern spot converters includes N cantilever beam waveguides, where N is a positive integer greater than or equal to 2. The number of optical fibers included in each of the M optical fiber units may be the same or different, and correspondingly, the number of cantilever beam waveguides included in each of the M pattern spot converters may be the same or different. In this case, the optical fiber unit and the pattern spot converter are specifically used for multi-channel optical signal transmission.

[0054] Figure 5 Schematic diagram of an optical module provided in an embodiment of the present application. Figure 5 As shown, the optical module may include an optical component 510 and a packaging structure 520, the optical component 510 is optically connected to the packaging structure 520, and the optical component 510 is used to receive and / or send optical signals. The specific configuration of the packaging structure 520 is as follows Figures 1 to 5 As shown. When the optical component 510 is used to send an optical signal, the optical component 510 may include a light source, a modulator, a filter, etc. When the optical component 510 is used to receive an optical signal, the optical component 510 may include a processor, a detector, etc. In some implementations, the optical component 510 includes a light source of multiple wavelengths, and the corresponding packaging structure 520 is used to send and / or receive optical signals of multiple wavelengths.

[0055] The components included in the optical component can be arranged in the photonic chip in the packaging structure, or the components included in the optical component and the photonic chip and optical fiber unit in the packaging structure are discrete components, and the specific optical module form is determined according to the actual situation. The optical connection between the optical component 510 and the packaging structure 520 can refer to a direct optical connection or an indirect optical connection. The indirect optical connection can refer to the provision of optical elements such as couplers and beam splitters between the components in the optical component 510 and the photonic chip or optical fiber unit in the packaging structure 520.

[0056] In some implementations, the optical module also includes a printed circuit board (PCB), and the PCB is electrically connected to the photonic chip in the packaging structure 520. The specific electrical connection method can be through wires, wire welding, wire bonding, or through sockets, pin connections, etc. The PCB can be used to process optical signals sent and / or received by the photonic chip. For example, the PCB is used to send electrical signals, and the photonic chip is used to convert electrical signals into optical signals for transmission. Alternatively, the photonic chip is used to receive optical signals, and the PCB is used to convert optical signals into electrical signals and process them.

[0057] Among them, the packaging structure is as follows Figure 4 In the case of the CPO package shown, the optical module can also be called an optical engine.

[0058] Figure 6 Schematic diagram of an optical system provided in an embodiment of the present application. Figure 6 As shown, the optical system may include optoelectronic devices and Figure 6 The optical module shown. The optoelectronic device can be any one of an optical switch, an optical fiber router, and an optical fiber network card, and the optoelectronic device is connected to the optical module.

[0059] The optoelectronic device may include multiple ports, each of which corresponds to an optical transmission channel, and the ports of the multiple ports are connected to optical modules, thereby realizing multi-channel, high-speed data transmission. The optical switch can be used to realize data exchange between multiple optical transmission channels. The optical fiber router can be used to convert optical signals into data signals and realize the forwarding and routing of data signals. The optical fiber network card can be used in an Ethernet network to realize the connection between a computer and an optical fiber.

[0060] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A packaging structure, characterized in that: It includes a chip unit and an optical fiber unit, wherein: The chip unit comprises a photonic chip and a chip cover plate, wherein the photonic chip is buckled with the chip cover plate, and a pattern spot converter is arranged in the photonic chip, wherein the pattern spot converter is composed of a cantilever beam waveguide and a first groove, wherein a gap is provided between the cantilever beam waveguide and the first groove; The optical fiber unit comprises an optical fiber, a bottom plate and an optical fiber cover plate, wherein a second groove is provided in the bottom plate, the second groove is used to accommodate the optical fiber, and the optical fiber cover plate is buckled with the bottom plate; Wherein, the cantilever beam waveguide is coupled and connected with the optical fiber; Wherein, a first bonding portion is provided between the chip cover plate and the base plate, and a second bonding portion is provided between the photonic chip and the optical fiber cover plate; or A first bonding portion is provided between the chip cover plate and the optical fiber cover plate, and a second bonding portion is provided between the photonic chip and the base plate.

2. The packaging structure according to claim 1, characterized in that: The bottom of the optical fiber unit is suspended in the air, and the coupling connection between the cantilever beam waveguide and the optical fiber includes: the end of the cantilever beam waveguide is butted against the end of the optical fiber.

3. The packaging structure according to claim 1 or 2, characterized in that: in: On the plane where the bottom of the photonic chip is located, the projection of the optical fiber and the projection of the photonic chip have an overlapping part, and the projection of the optical fiber cover plate or the bottom plate having a first adhesive portion arranged between the chip cover plate at least partially covers the overlapping part.

4. The packaging structure according to claim 1 or 2, characterized in that: in: On the plane where the bottom of the photonic chip is located, the projection of the optical fiber and the projection of the photonic chip have an overlapping portion, and the projection of the chip cover at least partially covers the overlapping portion; Wherein, the chip cover plate has a cut corner, and the cut corner is used to avoid the optical fiber.

5. The packaging structure according to any one of claims 1 to 4, characterized in that: in: The first adhesive portion and / or the second adhesive portion are made of epoxy resin or acrylic acid; and / or The shrinkage rate of the first adhesive portion and / or the second adhesive portion is less than 0.3%.

6. The packaging structure according to any one of claims 1 to 5, characterized in that: The pattern spot converter includes N cantilever beam waveguides, the optical fiber unit includes N optical fibers, the N cantilever beam waveguides correspond to the N optical fibers one by one, the cantilever beam waveguides in the N cantilever beam waveguides are coupled with the corresponding optical fibers, and N is a positive integer.

7. The packaging structure according to any one of claims 1 to 6, characterized in that: in: The packaging structure includes M optical fiber units, the photonic chip includes M spot converters, the M optical fiber units correspond to the M spot converters one by one, the optical fiber units in the M optical fiber units are coupled with the corresponding spot converters, and M is a positive integer.

8. An optical module, characterized in that: It comprises a packaging structure as claimed in any one of claims 1 to 7 and an optical component, wherein the optical component is optically connected to the packaging structure, and the optical component is used to receive and / or send optical signals.

9. An optical system, characterized in that: It comprises an optoelectronic device and the optical module as claimed in claim 8, wherein the optoelectronic device is connected to the optical module, and the optoelectronic device is any one of an optical switch, an optical fiber router, and an optical fiber network card.

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