Semiconductor automatic test equipment

Abstract

The invention relates to the technical field of semiconductor testing, and provides semiconductor automatic testing equipment. The semiconductor automatic test equipment at least comprises a feeding machine table module, a test machine table module and a material receiving machine table module, and all the modules jointly define a circulation path. The modules are mutually independent, each module comprises an installation substrate and an operation part arranged on the corresponding installation substrate, and the installation substrates are detachably connected in the direction of the circulation path; the semiconductor automatic test equipment further comprises material transferring shuttles, one material transferring shuttle is detachably connected between at least part of any two adjacent mounting substrates in the flowing path direction, and each material transferring shuttle is at least used for carrying the semiconductor on the corresponding upstream module to the downstream module. According to the semiconductor automatic test equipment provided by the invention, the test efficiency and the test precision are ensured, timely adjustment is facilitated when the technological process is changed, the overall modification cost is reduced, and the consumed time is short.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a semiconductor automatic testing device. Background Art

[0002] At present, when testing IGBT (Insulate-Gate Bipolar Transistor) modules, two modes are mainly used: manually assisted semi-automatic equipment or integrated fully automatic equipment. In manually assisted semi-automatic equipment, an independent heating table is used to preheat the IGBT, and multiple different manual processes are configured according to the product process flow. A turnover cart is used to circulate the IGBT between different processes. Due to the addition of manual operation, this method has low overall efficiency and low test accuracy. The integrated fully automatic equipment configures all process flow mechanisms on the integrated machine platform, and uses a manipulator to circulate the IGBT between each process flow mechanism. In this way, the overall equipment is relatively rigid and has low flexibility. It is not conducive to timely adjustment when the product process flow changes, and the overall transformation cost is high and the cycle is long. Summary of the invention

[0003] Based on this, it is necessary to provide a semiconductor automatic testing equipment that can ensure test efficiency and test accuracy while facilitating timely adjustments when the process changes, reducing overall transformation costs and shortening time.

[0004] A semiconductor automatic testing equipment at least comprises a loading machine module, a testing machine module and a receiving machine module, wherein a flow path is defined between the modules; the modules are independent of each other, and each module comprises an installation substrate and an operating component arranged on the corresponding installation substrate, wherein each installation substrate is detachably connected along the flow path; the semiconductor automatic testing equipment further comprises a plurality of transfer shuttles, wherein at least some of any two adjacent installation substrates are detachably connected with one transfer shuttle along the flow path, and each transfer shuttle is at least used to transport a semiconductor located on a corresponding upstream module to a downstream module.

[0005] It can be understood that the semiconductors to be tested are moved to the test machine module via the loading machine module for performance testing, and the tested semiconductors can be collected via the receiving machine module. In this process, the setting of the transfer shuttle is utilized to facilitate the transfer of semiconductors between the modules. Due to the detachable connection between the modules, it is convenient to disassemble and reposition the corresponding modules relative to other modules when the process flow changes; and, precisely because the modules are independent of each other, other modules will not be affected when they are disassembled and replaced. Therefore, the semiconductor automatic testing equipment provided by the present application can automatically implement semiconductor performance testing without human intervention, improve test efficiency and test accuracy, and facilitate timely disassembly and adjustment when the process flow changes, reduce modification costs, and shorten modification time.

[0006] In some embodiments, the transfer shuttle includes a supporting base plate having a length direction, a conveying mechanism arranged on the supporting base plate and a bearing seat arranged on the conveying mechanism, and the bearing seat can reciprocate relative to the supporting base plate along the length direction under the action of the conveying mechanism; along the direction of the flow path, a part of each of the supporting base plates along the length direction can be detachably connected to the corresponding upstream module, and another part can be detachably connected to the corresponding downstream module.

[0007] In some embodiments, the testing machine module includes an insulation testing machine, an AC testing machine and a DC testing machine, which are arranged along the direction of the flow path, each machine is independent of each other and corresponds to an installation substrate and an operating component arranged on the corresponding installation substrate; between the loading machine module and the insulation testing machine, between the insulation testing machine and the AC testing machine, between the AC testing machine and the DC testing machine, and between the receiving machine module and the DC testing machine, there is respectively a corresponding detachable connection with a transfer shuttle.

[0008] In some embodiments, the test machine module also includes a preheating machine, which is arranged between the feeding machine module and the insulation testing machine, and the part of the feeding machine module corresponding to the feeding shuttle is detachably connected to the mounting substrate of the preheating machine, and a feeding shuttle is detachably connected between the preheating machine and the insulation testing machine; and / or, the test machine module also includes a cooling machine, which is arranged between the receiving machine module and the DC testing machine, and the part of the feeding shuttle corresponding to the receiving machine module is detachably connected to the mounting substrate of the cooling machine, and a feeding shuttle is detachably connected between the cooling machine and the DC testing machine.

[0009] In some embodiments, the testing machine module also includes an appearance inspection machine, which is arranged downstream of the cooling machine along the flow path; a transfer shuttle is detachably connected between the appearance inspection machine and the cooling machine, and the part of the transfer shuttle corresponding to the receiving machine module is detachably connected to the mounting substrate of the appearance inspection machine.

[0010] In some of the embodiments, along the direction of the flow path, the transfer shuttle located upstream of each machine is an incoming material shuttle, and the transfer shuttle located downstream of each machine is a transfer material shuttle; the operating components corresponding to each machine include at least an operating mechanism and a handling robot, and each handling robot is used to handle semiconductors between the corresponding incoming material shuttle, the operating mechanism and the transfer material shuttle; the operating components corresponding to the AC test machine and the DC test machine also include a rotating mechanism having a first axis and at least two supporting platforms arranged at intervals around the first axis; each of the supporting platforms is connected to the rotating mechanism, and rotates around the first axis under the action of the rotating mechanism, so that one of each of the supporting platforms is located at the operating mechanism, and the other one is close to the transfer shuttle.

[0011] In some embodiments, the operating components corresponding to the appearance inspection machine also include a Y-axis conveying mechanism, an X-axis conveying mechanism arranged on the Y-axis conveying mechanism, and a flipping mechanism arranged on the X-axis conveying mechanism; the operating mechanism corresponding to the appearance inspection machine includes a first image collector and a second image collector arranged at intervals; the flipping mechanism can flow between the first image collector, the second image collector and the corresponding handling robot under the action of the X-axis conveying mechanism and the Y-axis conveying mechanism; the flipping mechanism includes a flipping power source and a flipping table arranged on the flipping power source and having a second axis, and the flipping table can rotate around the second axis under the action of the flipping power source.

[0012] In some embodiments, the loading machine module corresponds to the operating components including a loading and handling robot and a loading trolley, the loading machine module also includes a loading area, the loading trolley is used to transfer the semiconductor to be tested to the loading area, and the loading and handling robot is used to move the semiconductor in the loading area to the corresponding transfer shuttle.

[0013] In some embodiments, the loading machine module also includes a loading buffer table and an empty tray placement area, the empty tray placement area, the loading area and the loading buffer table are arranged at intervals, and at least the loading area and the loading buffer table are both arranged close to the corresponding transfer shuttle; the operating component corresponding to the loading machine module also includes a loading visual detector, which is arranged above the corresponding transfer shuttle and is used to collect image information of the semiconductor on the transfer shuttle.

[0014] In some embodiments, the operating components corresponding to the material receiving machine module include a material receiving and handling robot, a material receiving trolley and an NG sorting component, and the material receiving and handling robot is used to transport the semiconductors conveyed via the corresponding transfer shuttle to the material receiving trolley and / or the NG sorting component.

[0015] In some embodiments, the material receiving machine module also includes a sorting buffer table, a material receiving buffer table and an empty tray incoming area arranged at intervals, the material receiving buffer table is arranged between the material receiving trolley and the corresponding material transfer shuttle, and the sorting buffer table is arranged between the NG sorting component and the corresponding material transfer shuttle.

[0016] In some embodiments, the material transfer shuttle is arranged between the testing machine module and the material receiving machine module; the operating components corresponding to the material receiving machine module include a material receiving and handling robot, at least two visual detectors and a material receiving bin assembly, at least two of the visual detectors are arranged at intervals along the conveying direction of the material transfer shuttle, and the material receiving and handling robot is used to transport the semiconductor corresponding to the material transfer shuttle to the material receiving bin assembly.

[0017] In some embodiments, the operating components corresponding to the loading machine module include a loading bin assembly, a loading handling robot and a unloading table, and the loading handling robot is used to transport the semiconductors from the loading bin assembly to the unloading table; the operating components corresponding to the testing machine module include a testing handling robot and a testing mechanism, and the testing handling robot is used to transport the semiconductors from the unloading table to the testing mechanism, and transport the semiconductors at the testing mechanism to the transfer shuttle.

[0018] In some embodiments, there are multiple testing mechanisms, and each of the testing mechanisms is arranged at intervals along the direction of the flow path; the operating component corresponding to the testing machine module also includes a testing linear drive group, and the testing transport robot is connected to the testing linear drive group, and under the action of the testing linear drive group, the semiconductor is transported between the loading machine module, each of the testing mechanisms and the transfer shuttle.

[0019] In some embodiments, the operating component corresponding to the testing machine module also includes an NG product placement area, and the NG product placement area and the multiple testing mechanisms are arranged on both sides of the testing linear drive group along a first direction, and the first direction is set at an angle to the direction of the flow path.

[0020] In some embodiments, the testing mechanism includes a test unloading table, a dehydration structure and a crimping insulation test structure, which are arranged at intervals along a first direction; the testing mechanism also includes an auxiliary transport robot, which is used to transport semiconductors between the test unloading table, the dehydration structure and the crimping insulation test structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 A schematic diagram of a semiconductor automatic test equipment provided by an embodiment of the present application;

[0023] Figure 2 for Figure 1 A first schematic diagram of a loading machine module in a semiconductor automatic test equipment is provided;

[0024] Figure 3 for Figure 1 A second schematic diagram of a loading machine module in a semiconductor automatic test equipment is provided;

[0025] Figure 4 for Figure 1 A schematic diagram of a receiving machine module in a semiconductor automatic test equipment is provided;

[0026] Figure 5 for Figure 4 Schematic diagram of the NG sorting component in the receiving machine module provided;

[0027] Figure 6 for Figure 1 Provided schematic diagram of AC / DC test bench in semiconductor automatic test equipment;

[0028] Figure 7 for Figure 6 Provided schematic diagram of the rotary mechanism in the AC / DC test machine;

[0029] Figure 8 for Figure 1A schematic diagram of an appearance inspection machine in a semiconductor automatic test equipment is provided;

[0030] Fig. 9 for Figure 8 A partial enlarged view of the middle A;

[0031] Fig.10 for Figure 1 The intention of preheating the machine in the semiconductor automatic test equipment provided;

[0032] Fig.11 for Fig.10 A schematic diagram of the pre-heating platform in the pre-heating machine provided;

[0033] Fig.12 for Figure 1 A second schematic diagram of a cooling station in a semiconductor automatic test equipment is provided;

[0034] Fig.13 for Figure 1 A second schematic diagram of an insulation test station in a semiconductor automatic test equipment is provided;

[0035] Fig.14 for Fig.13 A schematic diagram of the insulation test structure in the insulation test machine provided;

[0036] Fig.15 A schematic diagram of a semiconductor automatic test equipment provided by another embodiment of the present application;

[0037] Fig.16 for Fig.15 A schematic diagram of a loading machine module in a semiconductor automatic test equipment is provided;

[0038] Fig.17 A schematic diagram of a handling robot in a semiconductor automatic test equipment provided by an embodiment of the present application;

[0039] Fig.18 A partial schematic diagram of a pickup component is provided for one embodiment of the present application;

[0040] Fig.19 for Fig.15 A schematic diagram of a receiving machine module in a semiconductor automatic test equipment is provided;

[0041] Fig. 20 for Fig.15 A schematic diagram of a test machine module in a semiconductor automatic test equipment is provided;

[0042] Fig.21 for Fig. 20 A schematic diagram of the test handling robot in the test machine module provided;

[0043] Fig. 22 A schematic diagram of a material transfer shuttle in a semiconductor automatic test equipment provided by an embodiment of the present application;

[0044] Fig.23 A schematic diagram of a material transfer shuttle in a semiconductor automatic test equipment provided by another embodiment of the present application. DETAILED DESCRIPTION

[0045] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0046] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0048] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0049] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0050] See also Figure 1 The present application provides a semiconductor automatic testing equipment, which at least includes a loading machine module 10, a testing machine module 20 and a receiving machine module 30, and each module jointly defines a flow path; each module is independent of each other, and each module includes a mounting substrate 50 and an operating component arranged on the corresponding mounting substrate 50, and each mounting substrate 50 is detachably connected along the flow path direction; the semiconductor automatic testing equipment also includes a plurality of transfer shuttles 40, and along the flow path direction, at least some of any two adjacent mounting substrates 50 are detachably connected with a transfer shuttle 40, and each transfer shuttle 40 is at least used to transport the semiconductor on the corresponding upstream module to the downstream module.

[0051] It can be understood that the semiconductors to be tested are moved to the test machine module 20 via the loading machine module 10 for performance testing, and the tested semiconductors can be collected via the receiving machine module 30. In this process, the setting of the transfer shuttle 40 is utilized to facilitate the transfer of semiconductors between the modules. Due to the detachable connection between the modules, it is convenient to disassemble and reposition the corresponding modules relative to other modules when the process flow changes; and, precisely because the modules are independent of each other, other modules will not be affected when they are disassembled and replaced. Therefore, the semiconductor automatic testing equipment provided by the present application can automatically implement semiconductor performance testing without human intervention, improve test efficiency and test accuracy, and facilitate timely disassembly and adjustment when the process flow changes, reduce modification costs, and shorten modification time.

[0052] Please combine Figure 1 and Fig. 22 Exemplarily, the transfer shuttle 40 includes a supporting base plate 41 having a length direction, a conveying mechanism 42 arranged on the supporting base plate 41, and a bearing seat 43 arranged on the conveying mechanism 42. The bearing seat 43 can reciprocate relative to the supporting base plate 41 along the length direction under the action of the conveying mechanism 42; along the direction of the flow path, a part of each supporting base plate 41 along the length direction can be detachably connected to the corresponding upstream module, and the other part can be detachably connected to the corresponding downstream module.

[0053] Taking the case where a transfer shuttle 40 is provided between the loading machine module 10 and the testing machine module 20 as an example, a part of the support substrate 41 of the transfer shuttle 40 can be detachably connected to the mounting substrate 50 corresponding to the loading machine module 10, and another part can be detachably connected to the mounting substrate 50 corresponding to the testing machine module 20. In this way, the support seat 43 can transport the semiconductors of the loading machine module 10 to the testing machine module 20 under the action of the conveying mechanism 42. Moreover, if the testing machine module 20 does not need to be loaded, the semiconductors can be temporarily stored on the transfer shuttle 40 without unloading, thereby ensuring the smoothness of subsequent test loading. Among them, the two mounting substrates 50 of the support substrate 41, which are arranged in the length direction of the support substrate 41, can be detachably connected, so as to facilitate the disassembly and assembly of the loading machine module 10 and the testing machine module 20 relative to the transfer shuttle 40 as a whole, thereby adjusting the layout and product process flow of the semiconductor automatic testing equipment. In actual use, a transfer shuttle 40 is also provided between the test machine module 20 and the receiving machine module 30 for transferring the semiconductors tested by the test machine module 20 to the receiving machine module 30 .

[0054] Therefore, as for the loading machine module 10, the testing machine module 20 and the receiving machine module 30, the semiconductor to be tested is first loaded by the loading machine module 10 and stored in the loading machine module 10, and then transported to the testing machine module 20 via the corresponding transfer shuttle 40; after the testing machine module 20 completes the test, it is transported to the receiving machine module 30 by the corresponding transfer shuttle 40. Therefore, for the testing machine module 20, the loading machine module 10 is used as an upstream module, and the receiving machine module 30 is used as a downstream module; for the transfer shuttle 40 set between the loading machine module 10 and the testing machine module 20, the loading machine module 10 is used as an upstream module, and the testing machine module 20 is used as a downstream module. In other words, the upstream module and the downstream module are divided according to the conveying direction of the semiconductor in the entire process flow.

[0055] In some specific embodiments, the conveying mechanism 42 can be driven by a linear module, and a slider is used to connect with the bearing seat 43 to realize linear driving of the bearing seat 43. The bearing seat 43 is provided with a plurality of positioning columns 2635, which are connected with the material tray through the positioning columns 2635 to ensure the stability of the material tray during the conveying process. A plurality of material trays can be loaded on the bearing seat 43, and are arranged adjacently or at intervals along the moving direction of the bearing seat 43. Each material tray can store a plurality of semiconductors. After the material tray on the bearing seat 43 is loaded, it does not need to be disassembled during the semiconductor conveying process.

[0056] See also Figures 1 to 3As some optional options, the corresponding operating components of the loading machine module 10 include a loading and handling robot 11 and a loading trolley 12. The loading machine module 10 also includes a loading area 13. The loading trolley 12 is used to transfer the semiconductor to be tested to the loading area 13. The loading and handling robot 11 is used to move the semiconductor in the loading area 13 to the corresponding transfer shuttle 40.

[0057] In actual use, the loading machine module 10 also includes a loading rack 14, which is arranged on the corresponding mounting substrate 50, and the loading rack 14 is provided with a pull-out mechanism for driving the loading trolley 12. The semiconductors to be tested are stored in a tray, and the tray is stored on the support frame 53 of the loading trolley 12. The loading trolley 12 moves to a position close to the loading area 13, and the pull-out mechanism is activated to drag the loading trolley 12 to the loading area 13 for storage. Then, the loading and handling robot 11 picks up the semiconductors in the loading tray of the loading trolley 12 and moves it to the empty tray on the corresponding transfer shuttle 40; when the transfer shuttle 40 is fully loaded, the conveying mechanism 42 is activated to drive the carrier 43 to move for semiconductor conveyance. In this way, the loading operation of the semiconductor can be realized.

[0058] like Figure 2 and Fig.17 As shown, the loading and handling robot 11 includes a base 601, a robot arm 602 and a picking component 603, one end of the robot arm 602 is connected to the base 601, and the other end is connected to the picking component 603. The base 601 is fixed to the mounting substrate 50 of the loading machine module 10, and the picking component is used to pick up the semiconductor, and circulate between the loading area 13 and the transfer shuttle 40 under the action of the robot arm 602. The picking component can pick up the semiconductor by adsorption, or by clamping with a clamp. This is just an example. The robot arm 602 can adopt a six-axis robot arm, which has a combination of multiple rotational degrees of freedom, and is more convenient to operate.

[0059] like Figure 2 , Figure 3 and Fig. 22As shown, further, the loading machine module 10 also includes a loading buffer table 15 and an empty tray placement area 16, and the empty tray placement area 16, the loading area 13 and the loading buffer table 15 are arranged at intervals, and at least the loading area 13 and the loading buffer table 15 are both arranged close to the corresponding transfer shuttle 40. It can be understood that due to the limited storage capacity of the loading tray on the transfer shuttle 40, when the tray is fully loaded, there are still some semiconductors on the loading trolley 12. At this time, the transfer shuttle 40 drives the satisfied tray to be transported toward the test machine module 20 and loaded, and the loading and handling manipulator 11 can pick up the semiconductor on the loading trolley 12 and move it to the loading buffer table 15 for temporary storage of the semiconductor. When the transfer shuttle 40 completes the loading, and the empty tray on the support seat 43 is transferred to the loading machine module 10, the loading and handling manipulator 11 can move the semiconductor on the loading buffer table 15 to the support seat 43. After the semiconductors in the trays at the loading trolley 12 are removed, the remaining empty trays can be moved to the empty tray placement area 16 by the loading and handling robot 11 for empty tray recovery.

[0060] Among them, the picking parts of the loading and handling manipulator 11 can be set in two groups and staggered, one group of picking parts is used to pick up semiconductors, and the other group of picking parts is used to pick up trays. Therefore, the staggered arrangement of the two groups of picking parts can reduce the interference of their respective picking actions. At the same time, the aforementioned loading area 13, loading buffer table 15 and empty tray placement area 16 are all spaced apart, and interference can also be avoided. The two groups of picking parts are respectively a tray picking part and a semiconductor picking part, both of which include two clamping arms that are arranged oppositely and spaced apart, and are both installed on the same picking support seat. The clamping space enclosed by the clamping arm corresponding to the tray picking part is larger than the clamping space enclosed by the clamping arm corresponding to the semiconductor picking part, and the clamping arm corresponding to the semiconductor picking part is located on the inner side of the clamping arm corresponding to the tray picking part. Each group of clamping arms is connected to a clamping drive cylinder to meet the two relative clamping arms approaching and moving away from each other, so as to achieve clamping and relaxation.

[0061] like Figure 2 and Figure 3 As shown, in some specific embodiments, the mounting substrate 50 corresponding to the loading machine module 10 is provided with two notches arranged at intervals along a first direction, and the first direction is set at an angle to the conveying direction of the transfer shuttle 40. One of the notches defines a loading area 13 for storing the loading trolley 12, and the other notch defines an empty tray placement area 16 for users to store empty trays. Among them, the empty tray storage can also correspond to a recycling trolley for transferring the empty trays to other processes or positions. The loading buffer table 15 and the corresponding transfer shuttle 40 are arranged between the two notches, and the loading buffer table 15 is arranged close to the loading area 13. The loading buffer table 15 includes a plurality of legs arranged at intervals and a support plate connected to the plurality of legs, and a plurality of trays are arranged on the support plate for convenient storage of semiconductors.

[0062] like Figure 2 and Figure 3 As shown, further, the operating components corresponding to the loading machine module 10 also include a loading visual detector 17, which is arranged above the corresponding transfer shuttle 40 and is used to collect image information of the semiconductor on the transfer shuttle 40. When the loading and transporting robot 11 transports the semiconductor to the corresponding transfer shuttle 40, before the transfer shuttle 40 sends the semiconductor out, the loading visual detector 17 is used to collect image information of the semiconductor for detecting the appearance of the semiconductor, such as pin inspection. Among them, the loading visual detector 17 includes a bracket and a camera connected to the bracket, which is convenient for taking images of the semiconductor.

[0063] The mounting base plate 50 corresponding to the loading machine module 10 includes a bottom plate and a support plate, both of which are connected to the loading machine frame 14, and the bottom plate is located below the support plate. The transfer shuttle 40 can be installed on the support plate so that the transfer shuttle 40 is installed at a moderate position relative to the loading trolley 12, which is convenient for semiconductor handling.

[0064] See also Figure 1 , Figure 4 and Figure 5 As another option, the operating components corresponding to the receiving machine module 30 include a receiving and handling robot 31, a receiving trolley 32 and an NG sorting component 33. The receiving and handling robot 31 is used to transport the semiconductors transported by the corresponding transfer shuttle 40 to the receiving trolley 32 and / or the NG (no good) sorting component. It can be understood that the receiving machine module 30 is used to receive the semiconductors after testing, and is provided with a receiving area 36 for storing the receiving trolley 32. The transfer shuttle 40 moves the semiconductors tested by the test machine module 20 to the receiving machine module 30, and unloads them through the receiving and handling robot 31. Specifically, the receiving and transporting robot 31 will transport the semiconductors that have passed the test by the testing machine module 20 to the material tray on the receiving trolley 32. After the material tray is full, the receiving trolley 32 will transport it to the receiving position or other process. At the same time, the semiconductors that have failed the test by the testing machine module 20 will be transported to the NG sorting component 33 by the receiving and transporting robot 31, and the sorting category can be determined according to different test purposes.

[0065] The structure of the receiving and handling robot 31 is the same as that of the aforementioned loading and handling robot 11, and the structure of the receiving and handling trolley 32 is the same as that of the aforementioned loading trolley 12, which will not be described in detail here. Figure 4As shown, in this embodiment, the receiving machine module 30 also includes a receiving slide 34, which is installed on the mounting base plate 50 corresponding to the receiving machine module 30. The base in the receiving and handling manipulator 31 is connected to the receiving slide 34 through a slider, and the receiving slide 34 is used to drive the receiving and handling manipulator 31 to move along the conveying direction of the feeding shuttle 40. Among them, the receiving slide 34 is a linear drive module. For example, a lead screw drive can be used. At this time, a guide rail is installed on the mounting base plate 50, and the motor is installed on the mounting base plate 50, and drives the lead screw to rotate, and is connected to the base through the slider by a lead screw nut, so as to realize the drive. The slider is slidably connected to the guide rail to play a role in moving and guiding.

[0066] like Figure 4 and Figure 5 As shown, at the same time, the NG sorting component 33 includes a plurality of sorting tracks 331 arranged at intervals along the conveying direction of the transfer shuttle 40. Each sorting track 331 includes a material receiving section 3311 and a plurality of material storage sections 3312, and the plurality of material storage sections 3312 are arranged at intervals along the vertical direction, and each material storage section 3312 can be used to store a type of NG semiconductor. A material receiving lifting mechanism 3313 is provided at the bottom of each material receiving section 3311, which is used to drive the corresponding material receiving section 3311 to move in the vertical direction, so as to select one of the plurality of material storage sections 3312 to realize the collection of materials in different material storage sections 3312. Among them, the material receiving lifting mechanism 3313 is driven by a screw or a cylinder, as long as it can realize reciprocating lifting in the vertical direction. Each material storage section 3312 and each material receiving section 3311 are conveyed by belts. In some specific embodiments, the NG sorting assembly 33 is provided with four sorting tracks 331, and each sorting track 331 includes three storage sections 3312 arranged at intervals in the vertical direction. Therefore, the NG sorting assembly 33 can be used to sort NG semiconductors of 12 categories.

[0067] like Figure 4 and Figure 5 As shown, further, the material receiving machine module 30 also includes a sorting buffer table 35, a material receiving buffer table and an empty tray incoming material area 37 arranged at intervals. The material receiving buffer table is arranged between the material receiving trolley 32 and the corresponding transfer material shuttle 40, and the sorting buffer table 35 is arranged between the NG sorting component 33 and the corresponding transfer material shuttle 40.

[0068] It can be understood that the sorting buffer station 35 is used to temporarily store NG semiconductors, the receiving buffer station 307 is used to temporarily store qualified semiconductors, and the empty tray incoming area 37 is used to store empty trays for subsequent loading of qualified semiconductors. In actual use, the mounting substrate 50 corresponding to the receiving machine module 30 is also provided with two gaps arranged at intervals along the first direction, one of which is used as a receiving area 36 for cooperating with the receiving trolley 32, and the other gap is used as an empty tray incoming area 37 for storing empty trays to be loaded. Among them, the empty trays to be loaded can be stored on a mobile robot, such as an AGV (Automated Guided Vehicle).

[0069] Among them, the sorting buffer station 35 is arranged between the NG sorting component 33 and the transfer material shuttle 40, and the receiving material buffer station 307 is arranged between the receiving area 36 and the transfer material shuttle 40. The empty tray incoming area 37 and the receiving area 36 are arranged opposite to each other and spaced apart along the first direction, and the transfer material shuttle 40 is located between the two. Among them, the conveying direction of the transfer material shuttle 40 is the X-axis direction, and the first direction is the Y-axis direction. The NG sorting component 33 and the sorting buffer station 35 are both installed on the same support plate, and the transfer material shuttle 40 can be set on the bottom plate of the mounting substrate 50. Such an arrangement makes full use of the space in the vertical direction, reduces the occupied area in the horizontal direction, and reduces the interference between the various structures. Of course, the receiving machine module 30 also includes a receiving frame 38, and the mounting substrate 50 is connected to the receiving frame 38 to jointly support the operating components corresponding to the receiving machine module 30.

[0070] In actual use, the AGV is used to load the empty tray and move it to the empty tray incoming area 37. The receiving and handling manipulator 31 picks up the empty tray in the empty tray incoming area 37 and places it on the receiving trolley 32 in the receiving area 36. The corresponding transfer shuttle 40 transports the tested semiconductor to the receiving machine module 30, and the receiving and handling manipulator 31 picks up the semiconductor for receiving. If it is a qualified semiconductor, it is transported to the receiving trolley 32 in the receiving area 36; if it is an NG semiconductor, it is transported to the corresponding receiving section 3311 of the NG sorting component 33 according to the category of NG, and is transferred to the corresponding storage section 3312 through the receiving section 3311. When the tray at the receiving trolley 32 is fully loaded, the qualified semiconductor can be placed on the receiving buffer table 307 first. When there is an empty tray on the receiving trolley 32, the receiving and handling manipulator 31 is used to transport the qualified semiconductor on the receiving buffer table 307 to the empty tray. Meanwhile, if the corresponding receiving section 3311 in the NG sorting component 33 is fully loaded or is transporting NG semiconductors, they can be temporarily stored in the sorting buffer station 35 and then transported to the corresponding receiving section 3311 later.

[0071] The sorting buffer station 35 also includes legs and a support plate connected to the legs, and the support plate is provided with the same number of empty trays as the sorting tracks 331 in the NG sorting component 33 for temporarily storing NG semiconductors.

[0072] See also Figure 1 and Figure 6 As some optional options, the test machine module 20 includes an insulation test machine 21, an AC test (at-speed testing) machine and a DC test (static testing) machine, the three of which are arranged along the direction of the flow path, each machine is independent of each other and corresponds to a mounting substrate 50 and an operating component arranged on the corresponding mounting substrate 50; between the loading machine module 10 and the insulation test machine 21, between the insulation test machine 21 and the AC test machine 22, between the AC test machine 22 and the DC test machine 23, and between the receiving machine module 30 and the DC test machine 23, there is a corresponding detachable connection with a transfer shuttle 40.

[0073] It can be understood that the semiconductor transfer between the various machines is performed by using the transfer shuttle 40, which is more convenient to operate. Both ends of the transfer shuttle 40 along its own conveying direction can be detachably connected to the mounting substrate 50 on the corresponding machine, so as to facilitate the disassembly of each machine to adjust the process sequence. For example, the insulation test machine 21 can be disassembled, leaving only the AC test machine 22 and the DC test machine 23 between the loading machine module 10 and the unloading machine module; or, the AC test machine 22 and the DC test machine 23 can be disassembled, leaving only the insulation test machine 21 between the loading machine module 10 and the unloading machine module. This is just an example.

[0074] The AC test machine 22 and the DC test machine 23 both include normal temperature testing and high temperature testing.

[0075] See also Figure 1 and Fig.10 Furthermore, the test machine module 20 also includes a preheating machine 24, which is arranged between the feeding machine module 10 and the insulation test machine 21. The part of the transfer shuttle 40 corresponding to the feeding machine module 10 is detachably connected to the mounting base plate 50 of the preheating machine 24, and the transfer shuttle 40 is detachably connected between the preheating machine 24 and the insulation test machine 21. In other words, it is precisely because the subsequent tests involve tests under different temperature environments that the setting of the preheating machine 24 can be used to preheat the semiconductor first, so that it can adapt to high-temperature testing, and avoid excessive thermal impact on the semiconductor due to subsequent sudden heating.

[0076] See also Figure 1 and Fig.12Furthermore, the test machine module 20 also includes a cooling machine 25, which is arranged between the receiving machine module 30 and the DC test machine 23. The part of the transfer shuttle 40 corresponding to the receiving machine module 30 is detachably connected to the mounting base plate 50 of the cooling machine 25, and the transfer shuttle 40 is detachably connected between the cooling machine 25 and the DC test machine 23. That is, after the temperature test, the semiconductor needs to be cooled, and then transported to the corresponding transfer shuttle to be transferred to the receiving machine module 30. Therefore, the setting of the cooling machine 25 is used to cool and dissipate the heat of the semiconductor after the high temperature test.

[0077] See also Figure 1 and Figure 8 Optionally, the test machine module 20 also includes an appearance inspection machine 26, which is arranged downstream of the cooling machine 25 along the flow path; a transfer shuttle 40 is detachably connected between the appearance inspection machine 26 and the cooling machine 25, and the part of the transfer shuttle 40 corresponding to the receiving machine module 30 is detachably connected to the mounting substrate 50 of the appearance inspection machine 26. It can be understood that the appearance inspection machine 26 is used to detect the appearance of the semiconductor, such as whether there are scratches, pins, etc. Therefore, after the high-temperature test, it can be cooled by the cooling machine 25 and then sent to the appearance inspection machine 26 for appearance inspection. As mentioned above, the transfer shuttle 40 corresponding to each machine is detachable, and the appearance inspection machine 26 can also be disassembled and installed between the loading machine module 10 and the insulation test machine 21, or between the loading machine module 10 and the preheating machine 24 module. Of course, after the appearance inspection, multiple performance tests are required. During the test, bumps and collisions are inevitable, resulting in damage to the appearance. Therefore, the appearance inspection machine 26 can be set at the last node of the test machine module 20 to improve the inspection accuracy.

[0078] In actual use, along the direction of the flow path, the transfer shuttle 40 located upstream of each machine is the incoming material shuttle 40a, and the transfer shuttle 40 located downstream of each machine is the transfer material shuttle 40b; the operating components corresponding to each machine include at least an operating mechanism and a transport robot, and each transport robot is used to transport semiconductors between the corresponding incoming material shuttle 40a, the operating mechanism and the transfer material shuttle 40b.

[0079] like Figure 1As shown, the flow direction of semiconductors is: loading machine module 10 - preheating machine 24 - insulation test machine 21 - AC test machine 22 - DC test machine 23 - cooling machine 25 - appearance inspection machine 26 - receiving machine module 30. Therefore, a transfer shuttle 40 is provided between the loading machine module 10 and the preheating machine 24, between the preheating machine 24 and the insulation test machine 21, between the AC test machine 22 and the DC test machine 23, between the DC test machine 23 and the cooling machine 25, between the cooling machine 25 and the appearance inspection machine 26, and between the appearance inspection machine 26 and the receiving machine module 30 to meet the semiconductor transportation between the various machines. The structure of each transfer shuttle 40 is basically the same.

[0080] Among them, as for the preheating machine 24, along the above-mentioned flow direction, the feeding machine module 10 is the upstream and the insulation test machine 21 is the downstream, then the transfer shuttle 40 connected between the feeding machine module 10 and the preheating machine 24 is used as the incoming material shuttle 40a of the preheating machine 24, and the transfer shuttle 40 connected between the preheating machine 24 and the insulation test machine 21 is used as the transfer material shuttle 40b of the preheating machine 24. For another example, the cooling machine 25 is the upstream of the appearance inspection machine 26. Compared with the cooling machine 25, the transfer shuttle 40 connected between the DC test machine 23 and the cooling machine 25 is used as the incoming material shuttle 40a of the cooling machine 25, and the transfer shuttle 40 connected between the cooling machine 25 and the appearance inspection machine 26 is used as the transfer material shuttle 40b of the cooling machine 25.

[0081] That is, the incoming shuttle 40a is used to transfer semiconductors from the upstream to the corresponding machine, and the transfer shuttle 40b is used to transfer the semiconductors of the corresponding machine to the downstream.

[0082] The operating components on each machine are described in detail below.

[0083] The structures of the AC test machine 22 and the DC test machine 23 are basically the same, and the AC test machine 22 is taken as an example for description. Figure 6 and Figure 7 As shown, in some embodiments, the operating components corresponding to the AC testing machine 22 also include a rotating mechanism 224 having a first axis and at least two supporting platforms 223 arranged at intervals around the first axis; each supporting platform 223 is connected to the rotating mechanism 224, and rotates around the first axis under the action of the rotating mechanism 224, so that one of the supporting platforms 223 is located in the operating mechanism, and the other one is close to the transfer shuttle 40.

[0084] In actual use, the operating mechanism corresponding to the AC test machine 22 includes a test head 221, which is used to perform a crimping test on the semiconductor, and the temperature at the test head 221 can be adjusted to room temperature or high temperature to meet the test requirements of different temperatures. The test head 221 is a connector tester. Among them, the test head 221 in the AC test and the DC test is an existing mature technology and will not be described here.

[0085] The AC test machine 22 is provided with two carriers 223, which can be arranged oppositely and at intervals. The two transfer shuttles 40 (i.e., the incoming material shuttle 40a and the transfer material shuttle 40b) corresponding to the AC test machine 22 are arranged at intervals along the X-axis direction and are basically the same in the Y-axis direction. The test head 221 and the corresponding two transfer shuttles 40 are arranged at intervals along the Y-axis direction, and the test head 221 is located as much as possible in the middle of the two transfer shuttles 40 along the X-axis direction. The semiconductor transferred by the incoming material shuttle 40a corresponding to the AC test machine 22 can be transferred to the carrier 223 near the incoming material shuttle 40a by the test transfer robot 227; then, the rotary mechanism 224 is started to drive the two carriers 223 to rotate 180 degrees, so that the carrier 223 carrying the semiconductor rotates to the test head 221, and the AC test is performed by the test head 221, and the other carrier 223 rotates to the transfer shuttle 40 to receive the semiconductor passed through the incoming material shuttle 40a. After the previous semiconductor is tested, the rotary mechanism 224 continues to rotate to exchange the positions of the two carriers 223, so that the tested semiconductor can be transferred to the transfer shuttle 40b by the test transfer robot 227, so as to be transferred to the downstream machine by the transfer shuttle 40b, and the other semiconductor is moved to the test head 221 for testing. In this way, the cycle is repeated until all semiconductor tests are completed.

[0086] like Figure 7As shown, further, the operating mechanism corresponding to the AC test machine 22 also includes a lifting assembly 225, and the lifting assembly 225 is connected to the bearing platform 223, and is used to drive the bearing platform 223 to rise and fall in the vertical direction. Specifically, the rotating mechanism 224 includes a rotating motor 2241 and a rotating table 2242 connected to the rotating motor 2241, and the rotating table 2242 is provided with two bearing arms 2243 protruding outward along its own radial direction, and the two bearing arms 2243 are 180 degrees apart. Each bearing arm 2243 is provided with a support arm 2244 in the vertical direction. Each bearing arm 2243 corresponds to a group of lifting assemblies 225 and bearing platforms 223, and the lifting assemblies 225 and bearing platforms 223 of the same group are arranged on opposite sides along the thickness direction of the support arm 2244, so as to make full use of the assembly space on both sides of the thickness of the support arm 2244. Taking one of the support arms 2244 as an example, a guide rail is convexly provided on one side of the support arm 2244 along its thickness direction, and the guide rail is connected to the corresponding bearing platform 223 by means of a slider to guide the bearing platform 223 to move; and a lifting assembly 225 is provided on the other side of the support arm 2244 along its thickness direction. The lifting assembly 225 includes a lifting motor, a transmission screw and a screw nut. The lifting motor is installed on the support arm 2244 and / or the bearing arm 2243 and connected to the transmission screw. The screw nut is threadedly driven with the transmission screw. The support arm 2244 is provided with an avoidance notch 2245, and the screw nut can pass through the avoidance notch 2245 to connect with the corresponding bearing platform 223. In this way, the transmission screw rotates under the action of the lifting motor to drive the bearing platform 223 to rise and fall through the screw nut.

[0087] The lifting motor can be connected to the driving screw by belt transmission. One pulley is coaxially assembled with the driving screw, and the other pulley is connected to the motor shaft of the lifting motor, and the driving belt is tensioned between the two pulleys. The aforementioned support arm 2244 can be provided with reinforcing ribs to ensure structural strength.

[0088] Alternatively, the aforementioned supporting arms 2243 may be provided in three, four, etc., evenly spaced around the central axis of the turntable 2242 (i.e., the aforementioned first axis, along the Z-axis direction), and each supporting arm 2243 is correspondingly provided with a set of support arms 2244, a lifting assembly 225 and a supporting platform 223.

[0089] like Figure 6As shown, it should be supplemented that the mounting substrate 50 corresponding to the AC test machine 22 includes an upper substrate 51, a lower substrate 52 and a support frame 53. The upper substrate 51 and the lower substrate 52 are arranged in a vertical direction with a spacing, and the support frame 53 is supported between the upper substrate 51 and the lower substrate 52. The aforementioned incoming material shuttle 40a and the transfer material shuttle 40b are both mounted on the upper substrate 51. The AC test machine 22 also includes a test frame 226, the lower substrate 52 is connected to the test frame 226, and the lower surface of the lower substrate 52 and the test frame 226 are jointly surrounded by an electrical structure cavity for mounting the corresponding electrical structure. The test frame 226 is provided with heat dissipation holes for heat dissipation of the electrical structure.

[0090] See also Figure 1 , Figure 8 and Fig. 9 As some of the examples, the operating components corresponding to the appearance inspection machine 26 also include a Y-axis conveying mechanism 261, an X-axis conveying mechanism 262 arranged on the Y-axis conveying mechanism 261, and a flipping mechanism 263 arranged on the X-axis conveying mechanism 262; the operating mechanism corresponding to the appearance inspection machine 26 includes a first image collector 264 and a second image collector 265, which are arranged at intervals; the flipping mechanism 263 can flow between the first image collector 264, the second image collector 265 and the corresponding appearance handling robot 266 under the action of the X-axis conveying mechanism 262 and the Y-axis conveying mechanism 261; the flipping mechanism 263 includes a flipping power source 2631 and a flipping table 2632 arranged on the flipping power source 2631 and having a second axis, and the flipping table 2632 can rotate around the second axis under the action of the flipping power source 2631.

[0091] The Y-axis conveying mechanism 261 is arranged between the incoming material shuttle 40a and the transfer material shuttle 40b, the X-axis conveying mechanism 262 is connected to the power output end of the Y-axis conveying mechanism 261, and the flip mechanism 263 is arranged at the power delivery end of the X-axis conveying mechanism 262. The appearance handling robot 266 is arranged at the angle between the Y-axis conveying mechanism 261 and the transfer material shuttle 40, and is elevated by the robot bracket. The appearance handling robot 266 includes an X-axis drive, a Y-axis drive, and a Z-axis drive to meet the semiconductor handling.

[0092] In actual use, the incoming material shuttle 40a transfers the semiconductor of the upstream machine to the appearance handling robot 266, which picks up the semiconductor and transports it to the flip table 2632 of the flip mechanism 263. After the flip table 2632 is fixed, the Y-axis conveying mechanism 261 is started to drive the flip table 2632 to move to the bottom of the first image collector 264 through the X-axis conveying mechanism 262, and the center of the semiconductor is aligned with the optical axis of the first image collector 264 by adjusting the X-axis conveying mechanism 262 and the Y-axis conveying mechanism 261, and then the front image of the semiconductor is collected by the first image collector 264; after the front image is collected, the flip table 2632 rotates 180 degrees under the action of the flip power source 2631, so that the back of the semiconductor faces the first image collector 264, and the back image of the semiconductor is collected by the first image collector 264. Then, the Y-axis conveying mechanism 261 is started again to drive the flip table 2632 to move to the bottom of the second image collector 265 through the X-axis conveying mechanism 262, and the X-axis conveying mechanism 262 is started to drive the flip table 2632 to move along the X-axis direction, so as to complete the curvature detection of the back side of the semiconductor using the second image collector 265; then, the flip table 2632 rotates 180 degrees under the action of the flip power source 2631, and the above operation is repeated to complete the curvature detection of the front side of the semiconductor. After the above two tests are completed, the Y-axis conveying mechanism 261 conveys it to the transfer shuttle 40b, and the semiconductor is transported to the transfer shuttle 40b by the appearance handling robot 266 to be transported to the next machine.

[0093] Among them, the X-axis conveying mechanism 262, the Y-axis conveying mechanism 261, and the X-axis drive, Y-axis drive and Z-axis drive on the appearance handling robot 266 can all adopt linear motion modules.

[0094] like Fig. 9 As shown, further, the flip table 2632 is provided with a through hole 2633 that penetrates in the vertical direction, so as to fully expose the back side of the semiconductor. The flip table 2632 is also provided with a plurality of clamping columns 2634 arranged at intervals along the circumference of the through hole 2633, and each clamping column 2634 can be driven by a cylinder. The through hole 2633 protrudes inwardly at the vertex corner corresponding to the semiconductor to form a protrusion. One group of two diagonal protrusions is provided with a positioning column 2635, and the other group of two diagonal protrusions is provided with a clamping column 2634, and each clamping column 2634 can move in the vertical direction and the horizontal direction. When the semiconductor is placed on the flip table 2632, the positioning column 2635 is inserted into the positioning hole at the top corner of the semiconductor for assembly and positioning, and then each clamping column 2634 is pressed on the side of the semiconductor away from the flip table 2632 to achieve the fixation of the semiconductor relative to the flip table 2632.

[0095] like Fig. 9As shown, further, the flip mechanism 263 also includes a flip frame 2636, which is supported on the corresponding mounting substrate 50. The flip frame 2636 is surrounded by a flip space that runs through the vertical direction. The flip table 2632 is located in the flip space, which is convenient for fully exposing the front and back sides of the semiconductor on the flip table 2632. The flip power source 2631 is installed on the flip frame 2636, and the flip table 2632 is rotatably connected to the flip frame 2636 through a rotating shaft to meet the flipping requirements of the flip table 2632.

[0096] like Figure 8 As shown, in some specific embodiments, the appearance inspection machine 26 also includes an appearance bracket 267, the mounting substrate 50 is connected to the inner wall of the appearance bracket 267, and an electrical structure cavity is also provided below the mounting substrate 50 for installing an electrical structure.

[0097] See also Figure 1 , Fig.10 and Fig.11 In some optional embodiments, the operating mechanism corresponding to the preheating machine 24 includes a preheating connector 241 and a preheating carrier 242. The preheating carrier 242 is arranged on the corresponding mounting substrate 50. The preheating connector 241 is mounted on the mounting substrate 50 through a preheating moving component 243, and moves closer to or farther from the preheating carrier 242 under the action of the preheating moving component 243. When the semiconductor needs to be transported to the preheating carrier 242, the preheating connector 241 is located away from the preheating carrier 242 to avoid causing transportation interference. The incoming material shuttle 40a corresponding to the preheating machine 24 transfers the semiconductor to the transportation range of the preheating transport manipulator 244, and the semiconductor is picked up by the preheating transport manipulator 244 and transported to the preheating carrier 242. Then, the preheating connector 241 is moved closer to the preheating carrier 242 under the action of the preheating moving component 243, so that the preheating connector 241 contacts the semiconductor for heating and preheating.

[0098] like Fig.10 As shown, in actual use, multiple pre-temperature connecting parts 241 and multiple pre-temperature carrying platforms 242 can be set, each pre-temperature carrying platform 242 corresponds to a pre-temperature connecting part 241, and each pre-temperature connecting part 241 corresponds to a pre-temperature moving component 243.

[0099] like Fig.11As shown, each pre-temperature connection member 241 includes a pre-temperature support plate 2411, a pre-temperature carrying plate 2412 and a lap connection foot 2413. The pre-temperature support plate 2411 is connected to the aforementioned pre-temperature moving component 243 through a slider, the pre-temperature carrying plate 2412 is connected to the pre-temperature support plate 2411, and the lap connection foot 2413 is connected to the pre-temperature carrying plate 2412. The pre-temperature carrying plate 2412 can also be connected to a pre-temperature lifting cylinder 2414 to achieve vertical movement. The pre-temperature lifting cylinder 2414 is installed on the pre-temperature support plate 2411. When preheating is required, the preheating support plate 2411 drives the preheating carrying plate 2412 and the overlapping connecting pin 2413 close to the semiconductor under the action of the preheating moving component 243, and then the preheating carrying plate 2412 drives the overlapping connecting pin 2413 to move vertically downward under the action of the preheating lifting cylinder 2414, so that the overlapping connecting pin 2413 is connected to the components on the semiconductor for preheating.

[0100] See also Figure 1 and Fig.12 Alternatively, the operating mechanism corresponding to the cooling station 25 includes a plurality of cooling stations 251 arranged at intervals, and each cooling station 251 is mounted on a corresponding mounting substrate 50. The incoming material shuttle 40a corresponding to the cooling station 25 moves the semiconductor after the high temperature test to the cooling and transporting manipulator 252 corresponding to the cooling station 25, and the cooling and transporting manipulator 252 picks up the semiconductor and transports it to the cooling station 251 for cooling; after the cooling is completed, the cooling and transporting manipulator 252 picks up the semiconductor again and transports it to the transfer material shuttle 40b corresponding to the cooling station 25, and then uses the transfer material shuttle 40b to move the semiconductor to the downstream appearance inspection station 26.

[0101] Among them, the cooling stage 251 corresponding to the cooling machine 25 can use liquid cooling to cool the semiconductor, or it can use air cooling. Taking the liquid cooling method as an example, each cooling stage 251 is constructed with a cooling groove. After the semiconductor is positioned in the cooling groove, it is sealed with the groove wall of the cooling groove by pressing a sealing ring to form a closed cooling space. The coolant in the liquid cooling pipe connected to the cooling stage 251 can flow to the cooling groove to cool each pin, pin card, etc. of the semiconductor. After liquid cooling, the semiconductor can also be dried by air flow. Alternatively, when air cooling is used, the cooling groove is hollow so that the air flow can be blown to the aforementioned cooling space to cool the semiconductor. This is just an example.

[0102] See also Figure 1 , Fig.13 and Fig.17Alternatively, the operating mechanism corresponding to the insulation test machine 21 includes a pre-heating structure 211 and an insulation test structure 212, which are arranged at intervals along the Y-axis direction, and the incoming material shuttle 40a and the transfer material shuttle 40b corresponding to the insulation test machine 21 are both arranged on the side of the pre-heating structure 211 away from the insulation test structure 212 along the Y-axis direction. The handling manipulator corresponding to the insulation test machine 21 (i.e., the insulation handling manipulator 213) is installed between the incoming material shuttle 40a and the transfer material shuttle 40b. The insulation handling manipulator 213 includes a base 601, a robot arm 602, and a picking component 603, and the robot arm 602 is connected between the base 601 and the picking component 603, and the robot arm 602 can be a four-axis robot arm.

[0103] In actual use, the incoming material shuttle 40a transfers the semiconductor preheated by the preheating machine 24 to the handling range of the insulation handling robot 213, picks up the semiconductor by the insulation handling robot 213, and carries it to the insulation test structure 212 to perform insulation testing at the insulation test structure 212. After the test, the semiconductor is carried to the preheating structure 211 by the insulation handling robot 213 for secondary preheating to prevent the semiconductor temperature from being too low. Then the insulation handling robot 213 picks up the semiconductor at the preheating structure 211 and carries it to the transfer material shuttle 40b, and transfers it to the AC test machine 22 via the transfer material shuttle 40b.

[0104] The pre-heating structure 211 may be the same as the pre-heating connector and the pre-heating platform carrier on the pre-heating machine 24 , and it can mainly meet the secondary pre-heating of the semiconductor.

[0105] like Fig.13 and Fig.14 As shown, further, the insulation test structure 212 includes a driving electric cylinder 2121, a test bracket 2122, a carrier substrate 2123 and a test seat 2124. The driving electric cylinder 2121 and the test seat 2124 are both installed on the test bracket 2122. The test bracket 2122 is surrounded by a test space. The carrier substrate 2123 is slidably connected to the test bracket 2122 and connected to the driving electric cylinder 2121. The carrier substrate 2123 is lifted and lowered in the vertical direction under the action of the driving electric cylinder 2121 to move closer to or away from the test seat 2124. The semiconductor to be tested for insulation is placed on the carrier substrate 2123, and the driving electric cylinder 2121 drives the carrier substrate 2123 to move up in the vertical direction so that the semiconductor is pressed against the test seat 2124 to perform an insulation test. After the test is completed, the driving electric cylinder 2121 drives the carrier substrate 2123 to move down in the vertical direction to move away from the test seat 2124, and the insulation handling manipulator 213 picks up the semiconductor to be transported to the pre-heating structure 211.

[0106] The test seat 2124 is installed on the top of the test bracket 2122, and a spring assembly 2126 is provided between the test bracket 2122 to buffer the pressure connection between the semiconductor and the test seat 2124 and protect the semiconductor. The test bracket 2122 is provided with a plurality of guide posts 2125 arranged circumferentially of the test seat 2124, each guide post 2125 is penetrated through the carrier substrate 2123, and a linear bearing is provided between the two to guide the vertical lifting of the carrier substrate 2123. Gratings are provided on both sides of the test bracket 2122 along the Y-axis direction to prevent the semiconductor from being exposed outside the carrier substrate 2123.

[0107] It should be added that the insulation tester 21 further comprises an insulation frame 214 connected to the corresponding mounting substrate 50. An electrical structure cavity is formed under the mounting substrate 50 and the insulation frame 214 to install the electrical structure.

[0108] See also Fig.15 , Fig.19 and Fig.23 Another embodiment of the present application further provides a semiconductor automatic test equipment, wherein a transfer shuttle 40 is disposed between the test machine module 20 and the receiving machine module 30. The operating components corresponding to the receiving machine module 30 include a receiving material handling manipulator 31, at least two visual detectors, and a receiving material bin assembly 306. The at least two visual detectors are arranged at intervals along the conveying direction of the transfer shuttle 40. The receiving material handling manipulator 31 is used to carry the semiconductor corresponding to the transfer shuttle 40 to the receiving material bin assembly 306.

[0109] The visual detectors on the receiving machine module 30 include a third visual detector 301, a fourth visual detector 302, a fifth visual detector 303 and a sixth visual detector 304, which are arranged at intervals along the conveying direction (i.e., the X-axis direction) of the transfer shuttle 40. The semiconductor tested by the test machine module 20 is transported to the transfer shuttle 40, and then transported to the receiving machine module 30 by the transfer shuttle 40. In the receiving machine module 30, the semiconductor can pass through the aforementioned four visual detectors in sequence for visual inspection, and then be transported to the receiving bin assembly 306 for collection by the receiving and transporting robot 31 according to needs.

[0110] In this embodiment, the support seat 43 on the transfer shuttle 40 is connected with a rotating structure 44, which is used to drive the support seat 43 to rotate around its own axis. At the same time, in this embodiment, the transfer shuttle 40 may not include the supporting substrate 41, and the conveying mechanism 42 in the transfer shuttle 40 may be directly installed on the corresponding mounting substrate 50. Therefore, when the semiconductor passes through the third visual detector 301 under the action of the transfer shuttle 40, the support seat 43 can be rotated ±180° under the action of the rotating structure 44 to perform visual inspection on the two sides of the semiconductor; then, as the transfer shuttle 40 continues to transport, the semiconductor moves to the bottom of the fourth visual detector 302, and the first front visual inspection is performed through the fourth visual detector 302. Then, the transfer shuttle 40 continues to transport it to the bottom of the fifth visual detector 303, and the second front visual inspection is performed through the fifth visual detector 303; then, under the action of the transfer shuttle 40, it moves to the top of the sixth visual detector 304, and the back visual inspection is performed through the sixth visual detector 304. After the detection is completed, the material receiving and transporting robot 31 picks up the chip and moves it to the material receiving bin assembly 306 to complete the material receiving.

[0111] like Fig.15 and Fig.19 As shown, the receiving machine module 30 is also provided with a discharge area 305 for storing semiconductors after the above-mentioned inspection. When the material tray in the discharge area 305 is fully loaded, it can be pushed into the receiving material bin assembly 306, and another empty tray can be placed in the discharge area 305 to continue to carry. At the same time, the receiving machine module 30 is also provided with a receiving buffer table 307. When the discharge area 305 is fully loaded, the semiconductors transported by the transfer shuttle 40 can be placed on the receiving buffer table 307 by the receiving material handling robot 31. When there is an empty tray in the discharge area 305, the semiconductors in the receiving buffer table 307 are transported to the discharge area 305.

[0112] The aforementioned rotating structure 44 can be driven by a servo motor.

[0113] See also Fig.15 and Fig.16 Optionally, the operating components corresponding to the loading machine module 10 include a loading bin assembly 101, a loading and handling robot 11 and a discharge table 102, and the loading and handling robot 11 is used to transport the semiconductors from the loading bin assembly 101 to the discharge table 102; the operating components corresponding to the testing machine module 20 include a testing and handling robot 227 and a testing mechanism 201, and the testing and handling robot 227 is used to transport the semiconductors from the discharge table 102 to the testing mechanism 201, and transport the semiconductors at the testing mechanism 201 to the transfer shuttle 40.

[0114] The staff can place the fully loaded tray in the loading bin assembly 101, and the loading bin assembly 101 is lifted and lowered to the handling range of the loading and handling robot 11. The loading and handling robot 11 picks up the semiconductor and carries it to the unloading table 102. After the unloading table 102 is fully loaded, the test handling robot 227 on the test machine module 20 can pick up the semiconductor on the unloading table 102 and carry it to the test mechanism 201 for testing. At the same time, a loading buffer table 15 is provided on the loading machine module 10. If the unloading table 102 is fully loaded, the loading and handling robot 11 can also move the semiconductor to the loading buffer table 15. Then, after the unloading table 102 is unloaded, the loading and handling robot 11 carries the semiconductor on the loading buffer table 15 to the unloading table 102 to be carried by the test handling robot 227.

[0115] Among them, the loading silo assembly 101 and the receiving silo assembly 306 are both existing mature technologies and will not be described in detail here.

[0116] like Figures 16 to 19 As shown, in some embodiments, the structures of the loading and handling robot 11 and the receiving and handling robot 31 are basically the same, both of which include a base 601, a mechanical arm 602 and a picking component 603. The mechanical arm 602 is connected between the base 601 and the picking component 603. The mechanical arm 602 can be a four-axis mechanical arm or a six-axis mechanical arm. The picking component 603 includes a connecting main arm 1101, a hook 1102 and a suction cup 1103. The hook 1102 and the suction cup 1103 are both connected to the connecting main arm 1101, and the connecting main arm 1101 is connected to the mechanical arm 602. Two hooks 1102 are provided and arranged oppositely and at intervals, and the suction cup 1103 is arranged between the two hooks 1102. The suction cup 1103 can move in the vertical direction relative to the connecting main arm 1101, and is used to absorb and pick up semiconductors, and the hook 1102 is used to drag the material tray. At the same time, the picking component 603 also includes a barcode scanner and a photoelectric sensor connected to the main arm 1101. The photoelectric sensor is used to detect whether there is material, and the barcode scanner is used to scan and identify the tray and semiconductor.

[0117] Furthermore, the structures of the unloading platform 102 and the loading buffer platform 15 can also be the same, both of which ensure the legs and the support plate connected to the support, and the semiconductor is placed on the support plate.

[0118] See also Fig.15 , Fig. 20 and Fig.21Exemplarily, there are multiple test mechanisms 201, which are arranged at intervals along the direction of the flow path; the operating components corresponding to the test machine module 20 also include a test linear drive group 202, and the test transport robot 227 is connected to the test linear drive group 202, and under the action of the test linear drive group 202, the semiconductor is transported between the loading machine module 10, each test mechanism 201 and the transfer shuttle 40.

[0119] Furthermore, the operating components corresponding to the test machine module 20 also include an NG product placement area 204. The NG product placement area 204 and the multiple test mechanisms 201 are arranged on both sides of the test linear drive group 202 along a first direction, and the first direction is arranged at an angle to the direction of the flow path. The first direction is the Y-axis direction.

[0120] Furthermore, the testing mechanism 201 includes a testing unloading table 203, a dehydration structure and a crimping test structure, which are arranged at intervals along the first direction; the testing mechanism 201 also includes an auxiliary transport robot, which is used to transport semiconductors between the testing unloading table 203, the dehydration structure and the crimping test structure.

[0121] The test mechanism 201 is mainly used for performing reactive aging tests on semiconductors. Under the action of the test linear drive group 202, the test handling manipulator 227 moves to a position close to the discharge table 102 to pick up the semiconductor on the discharge table 102 and transport it to the insulation test structure 212 for reactive aging tests. Since there are multiple test mechanisms 201, the test efficiency is improved. Take one of the test mechanisms 201 as an example. The test handling manipulator 227 places the semiconductor on the test discharge table 203, and the test handling manipulator 227 can carry out the next semiconductor transportation to transport it to the test discharge table 203 of another test mechanism 201. The auxiliary handling manipulator corresponding to the previous test mechanism 201 picks up the semiconductor on the corresponding test discharge table 203 and transports it to the crimping test structure for reactive aging tests. The crimping test structure includes a crimping test seat and a crimping support table, and the crimping support table is provided with liquid cooling to dissipate heat from the semiconductor under test. Therefore, after the test, the auxiliary manipulator can move the semiconductor on the test support table, move it to the dewatering structure, perform the dewatering operation, and then move it to the test unloading table 203 to wait. Then the test transport manipulator 227 can pick up the semiconductor on the test unloading table 203, and according to the test results, move the qualified semiconductor to the transfer shuttle 40, and move the unqualified semiconductor to the NG product placement area 204 (i.e., the unqualified product placement area).

[0122] There are multiple NG product placement areas 204 , which are arranged at intervals along the conveying direction of the test linear drive group 202 .

[0123] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0124] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. A semiconductor automatic test equipment, characterized in that: At least includes a loading machine module, a testing machine module and a receiving machine module, and each module together defines a flow path; Each module is independent of each other, and each module includes a mounting substrate and an operating component provided on the corresponding mounting substrate, and each mounting substrate is detachably connected along the flow path direction; The semiconductor automatic testing equipment also includes multiple transfer shuttles. Along the flow path direction, at least some of the adjacent two mounting substrates are detachably connected with a transfer shuttle, and each transfer shuttle is at least used to transport the semiconductor on the corresponding upstream module to the downstream module.

2. The semiconductor automatic test equipment according to claim 1, characterized in that: The transfer shuttle includes a support base plate having a length direction, a conveying mechanism provided on the support base plate, and a bearing seat provided on the conveying mechanism, wherein the bearing seat can reciprocate relative to the support base plate along the length direction under the action of the conveying mechanism; Along the direction of the circulation path, a portion of each support substrate along the length direction can be detachably connected to a corresponding upstream module, and another portion can be detachably connected to a corresponding downstream module.

3. The semiconductor automatic test equipment according to claim 1 or 2, characterized in that: The test machine module includes an insulation test machine, an AC test machine and a DC test machine, which are arranged along the direction of the flow path, and each machine is independent of each other and corresponds to a mounting substrate and an operating component arranged on the corresponding mounting substrate; A transfer shuttle is detachably connected between the loading machine module and the insulation testing machine, between the insulation testing machine and the AC testing machine, between the AC testing machine and the DC testing machine, and between the receiving machine module and the DC testing machine.

4. The semiconductor automatic test equipment according to claim 3, characterized in that: The test machine module also includes a pre-heating machine, which is arranged between the feeding machine module and the insulation test machine, and the part of the transfer shuttle corresponding to the feeding machine module is detachably connected to the mounting base plate of the pre-heating machine, and a transfer shuttle is detachably connected between the pre-heating machine and the insulation test machine; And / or, the testing machine module also includes a cooling machine, which is arranged between the receiving machine module and the DC testing machine, and the part of the transfer shuttle corresponding to the receiving machine module is detachably connected to the mounting substrate of the cooling machine, and a transfer shuttle is detachably connected between the cooling machine and the DC testing machine.

5. The semiconductor automatic test equipment according to claim 4, characterized in that: The testing machine module further includes an appearance inspection machine, which is arranged downstream of the cooling machine along the circulation path; A transfer shuttle is detachably connected between the appearance inspection machine and the cooling machine, and a portion of the transfer shuttle corresponding to the receiving machine module is detachably connected to the mounting base plate of the appearance inspection machine.

6. The semiconductor automatic test equipment according to claim 5, characterized in that: Along the direction of the flow path, the transfer shuttle located upstream of each machine is an incoming material shuttle, and the transfer shuttle located downstream of each machine is a transfer material shuttle; The operating components corresponding to each machine at least include an operating mechanism and a transport robot, and each transport robot is used to transport semiconductors between the corresponding incoming material shuttle, the operating mechanism and the transfer material shuttle; The operating components corresponding to the AC test machine and the DC test machine further include a slewing mechanism having a first axis and at least two bearing platforms spaced apart around the first axis; Each of the supporting platforms is connected to the rotating mechanism and rotates around the first axis under the action of the rotating mechanism, so that one of the supporting platforms is located at the operating mechanism and the other one is close to the transfer shuttle.

7. The semiconductor automatic test equipment according to claim 6, characterized in that: The operating components corresponding to the appearance inspection machine also include a Y-axis conveying mechanism, an X-axis conveying mechanism provided on the Y-axis conveying mechanism, and a flipping mechanism provided on the X-axis conveying mechanism; The operating mechanism corresponding to the appearance inspection machine includes a first image collector and a second image collector arranged at intervals; The flip mechanism can be transferred between the first image collector, the second image collector and the corresponding transport robot under the action of the X-axis conveying mechanism and the Y-axis conveying mechanism; The turning mechanism comprises a turning power source and a turning platform which is arranged on the turning power source and has a second axis. The turning platform can rotate around the second axis under the action of the turning power source.

8. The semiconductor automatic test equipment according to claim 3, characterized in that: The loading machine module corresponds to the operating components including a loading and handling robot and a loading trolley. The loading machine module also includes a loading area. The loading trolley is used to transfer the semiconductor to be tested to the loading area. The loading and handling robot is used to move the semiconductor in the loading area to the corresponding transfer shuttle.

9. The semiconductor automatic test equipment according to claim 8, characterized in that: The loading machine module further includes a loading buffer table and an empty tray placement area, wherein the empty tray placement area, the loading area and the loading buffer table are arranged at intervals, and at least the loading area and the loading buffer table are both arranged close to the corresponding transfer shuttle; The operating component corresponding to the loading machine module also includes a loading visual detector, which is arranged above the corresponding transfer shuttle and is used to collect image information of the semiconductor on the transfer shuttle.

10. The semiconductor automatic test equipment according to claim 3, characterized in that: The operating components corresponding to the material receiving machine module include a material receiving and handling robot, a material receiving trolley and an NG sorting component. The material receiving and handling robot is used to transport the semiconductors conveyed via the corresponding transfer shuttle to the material receiving trolley and / or the NG sorting component.

11. The semiconductor automatic test equipment according to claim 10, characterized in that: The material receiving machine module also includes a sorting buffer table, a material receiving buffer table and an empty tray incoming material area arranged at intervals. The material receiving buffer table is arranged between the material receiving trolley and the corresponding material transfer shuttle, and the sorting buffer table is arranged between the NG sorting component and the corresponding material transfer shuttle.

12. The semiconductor automatic test equipment according to claim 1 or 2, characterized in that: The material transfer shuttle is arranged between the testing machine module and the receiving machine module; The operating components corresponding to the material receiving machine module include a material receiving and handling robot, at least two visual detectors and a material receiving and storing bin assembly, at least two of the visual detectors are arranged at intervals along the conveying direction of the transfer shuttle, and the material receiving and handling robot is used to transport the semiconductor corresponding to the transfer shuttle to the material receiving and storing bin assembly.

13. The semiconductor automatic test equipment according to claim 12, characterized in that: The operating components corresponding to the loading machine module include a loading bin assembly, a loading and handling robot and a discharge table, wherein the loading and handling robot is used to transport the semiconductors of the loading bin assembly to the discharge table; The operating components corresponding to the test machine module include a test transport robot and a test mechanism. The test transport robot is used to transport the semiconductors on the unloading table to the test mechanism, and to transport the semiconductors at the test mechanism to the transfer shuttle.

14. The semiconductor automatic test equipment according to claim 13, characterized in that: There are multiple testing mechanisms, and each of the testing mechanisms is arranged at intervals along the direction of the circulation path; The operating components corresponding to the test machine module also include a test linear drive group. The test transport robot is connected to the test linear drive group and transports semiconductors between the loading machine module, each of the test mechanisms and the transfer shuttle under the action of the test linear drive group.

15. The semiconductor automatic test equipment according to claim 14, characterized in that: The operating component corresponding to the test machine module also includes an NG product placement area, and the NG product placement area and the multiple test mechanisms are arranged on both sides of the test linear drive group along a first direction, and the first direction is set at an angle to the direction of the flow path.

16. The semiconductor automatic test equipment according to claim 13, characterized in that: The testing mechanism comprises a testing unloading table, a water removal structure and a crimping insulation testing structure arranged at intervals along a first direction; The testing mechanism also includes an auxiliary transport robot, which is used to transport semiconductors between the testing unloading platform, the dewatering structure and the crimping insulation testing structure.

Images