Lightweight flow channel heat dissipation equipment and preparation method thereof

Abstract

The invention discloses light-weight flow channel heat dissipation equipment and a preparation method thereof.The light-weight flow channel heat dissipation equipment comprises a liquid guide pipe sleeve and a heat conduction core, the liquid guide pipe sleeve is in a flow channel shape with openings in the two ends, and the liquid guide pipe sleeve is used for allowing cooling liquid to flow; the heat conduction core is arranged in the liquid guide pipe sleeve, the heat conduction core is provided with a plurality of gap holes, the gap holes are communicated so that cooling liquid in the liquid guide pipe sleeve can circulate, the gap holes in the outer surface of the heat conduction core form a plurality of antennas on the outer surface of the heat conduction core, and the antennas are connected with the inner surface of the liquid guide pipe sleeve; the liquid guide pipe sleeve and the heat conduction core are both made of metal materials, and the liquid guide pipe sleeve and the antennas are connected through metal. The LED lamp has the advantages of light weight and high heat dissipation efficiency.

Description

Technical Field

[0001] The present invention belongs to the technical field of heat dissipation, and in particular relates to a lightweight flow channel heat dissipation device and a preparation method thereof. Background Art

[0002] In the development of modern industry and technology, the requirements for heat dissipation performance are increasing day by day, especially in the fields of electronic products, servers, heat exchangers and other fields with high heat dissipation requirements. The heat dissipation efficiency directly affects the stability and life of the equipment. For example, according to industry research reports, in the field of high-performance servers, about 30% of failures are caused by poor heat dissipation, which fully demonstrates the urgency of improving heat dissipation performance.

[0003] Liquid cooling technology is one of the most effective heat dissipation solutions. It uses the coolant to flow inside the device to quickly remove heat. It has the characteristics of large heat capacity and high heat transfer efficiency. It can significantly reduce the temperature of the device and ensure the stable operation of the system. The liquid cooling system can also effectively reduce the size of the device, which is suitable for high-density installation scenarios and further meets the industry's stringent requirements for heat dissipation performance. In liquid cooling technology, fins are currently added to the heat pipe to increase the liquid-solid contact area and improve the overall mechanical strength of the heat dissipation module, so that the heat conduction speed is accelerated and the heat dissipation efficiency is further improved. However, the fins inevitably increase the weight of the device. In order to achieve lightweight equipment, a lightweight flow channel heat dissipation device and its preparation method are proposed. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art.

[0005] To this end, the present invention proposes a lightweight flow channel heat dissipation device and a preparation method thereof, wherein the lightweight flow channel heat dissipation device has the advantages of light weight and high heat dissipation efficiency.

[0006] A lightweight flow channel heat dissipation device according to an embodiment of the present invention comprises: a liquid guide tube sleeve and a heat conductive core, wherein the liquid guide tube sleeve is in the shape of a flow channel with openings at both ends, and the liquid guide tube sleeve is used for flowing coolant; the heat conductive core is arranged inside the liquid guide tube sleeve, and the heat conductive core has a plurality of gap holes, and the plurality of gap holes are connected to allow the coolant in the liquid guide tube sleeve to flow, and the plurality of gap holes located on the outer surface of the heat conductive core form a plurality of tentacles on the outer surface of the heat conductive core, and the plurality of tentacles are connected to the inner surface of the liquid guide tube sleeve; the liquid guide tube sleeve and the heat conductive core are both made of metal, and the liquid guide tube sleeve and the tentacles are connected by metal.

[0007] According to one embodiment of the present invention, the thermally conductive core is a metal sponge.

[0008] According to one embodiment of the present invention, the liquid catheter sleeve and the heat conductive core are made of the same metal material.

[0009] According to one embodiment of the present invention, the catheter sleeve is composed of a plurality of metal plates, the plurality of metal plates are arranged in sequence around a circular array, and two adjacent metal plates are connected end to end.

[0010] A method for preparing a lightweight flow channel heat dissipation device, using any of the lightweight flow channel heat dissipation devices described above, comprises the following steps:

[0011] S1. Grinding the inner surface of the catheter sleeve and the surface of the thermal core to increase the fit between the catheter sleeve and the surface of the thermal core;

[0012] S2. Clamp the liquid guide tube sleeve and the thermal conductive core so that the liquid guide tube sleeve contacts the thermal conductive core;

[0013] S3. Connecting the clamped catheter sleeve to the thermal core so that the antennae on the thermal core are bonded to the inner surface of the catheter sleeve or connected by crystal tissue growth;

[0014] S4. Perform a mechanical strength test on the liquid guide tube sleeve after connecting the thermal core.

[0015] According to one embodiment of the present invention, in S3, the clamped liquid guiding tube sleeve and the heat conducting core are placed in an electroplating solution for metal tissue growth, so that each antenna is in full contact with the liquid guiding tube sleeve for connection.

[0016] According to one embodiment of the present invention, in S3, the liquid-conducting tube sleeve and the heat-conducting core grown after electroplating are vacuum sintered to obtain metal bonding or metallurgical bonding to increase the firmness of the connection and reduce thermal resistance.

[0017] According to one embodiment of the present invention, in S3, the liquid-conducting tube sleeve and the heat-conducting core are placed in the electroplating solution for electroplating growth by partial immersion growth.

[0018] According to an embodiment of the present invention, in S3, if the liquid-conducting tube sleeve is composed of a plurality of metal plates, electroplating growth is performed on the contact areas between each metal plate and the thermally conductive core respectively to reduce the contact area between the thermally conductive core and the electroplating solution.

[0019] According to one embodiment of the present invention, in S3, if the liquid guiding tube sleeve is composed of multiple metal plates, after the liquid guiding tube sleeve is connected to the thermal conductive core, the gaps between the multiple metal plates are sealed to complete the end-to-end connection of two adjacent metal plates.

[0020] The beneficial effect of the present invention is that the present invention arranges the heat-conducting core inside the liquid guiding tube sleeve, utilizes a plurality of gap holes to increase the contact area between the heat-conducting core and the coolant, utilizes a plurality of tentacles to transfer heat to the liquid guiding tube sleeve to achieve rapid heat dissipation, and at the same time, because the heat-conducting core has a plurality of gap holes, the weight of the heat-conducting core is reduced, thereby achieving lightweighting of the device.

[0021] Other features and advantages of the present invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practicing the present invention.

[0022] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0024] Figure 1 It is a schematic diagram of the preparation process when the catheter sleeve of the present invention is a pipe with openings at both ends and a square cross section;

[0025] Reference numerals:

[0026] 1. Liquid guide tube sleeve; 2. Heat conductive core. DETAILED DESCRIPTION

[0027] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0029] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] The lightweight flow channel heat dissipation device and the preparation method thereof according to the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0031] A lightweight flow channel heat dissipation device according to an embodiment of the present invention comprises: a liquid guide tube sleeve 1 and a heat conductive core 2, wherein the liquid guide tube sleeve 1 is in the shape of a flow channel with openings at both ends, and the liquid guide tube sleeve 1 is used to flow coolant; the heat conductive core 2 is arranged inside the liquid guide tube sleeve 1, and the heat conductive core 2 has a plurality of gap holes, and the plurality of gap holes are connected to each other for the coolant in the liquid guide tube sleeve 1 to flow, and the plurality of gap holes located on the outer surface of the heat conductive core 2 form a plurality of tentacles on the outer surface of the heat conductive core 2, and the plurality of tentacles are connected to the inner surface of the liquid guide tube sleeve 1; the liquid guide tube sleeve 1 and the heat conductive core 2 are both made of metal, and the liquid guide tube sleeve 1 and the tentacles are connected by metal.

[0032] The material of the liquid guiding tube sleeve 1 and the heat conducting core 2 is not limited to common heat dissipation materials such as pure copper and pure aluminum, and can also be applied to other materials such as nickel, copper alloy, aluminum alloy and nickel alloy.

[0033] In this embodiment, the liquid guide tube sleeve 1 is a liquid pipeline in the liquid cooling system, which is used to guide the coolant and dissipate the heat of the coolant. The coolant flows in the liquid guide tube sleeve 1, and the heat-conducting core 2 is arranged inside the liquid guide tube sleeve 1. A plurality of gap holes are used to increase the contact area between the heat-conducting core 2 and the coolant, and a plurality of tentacles are used to transfer heat to the liquid guide tube sleeve 1 to achieve rapid heat dissipation. At the same time, since the heat-conducting core 2 has a plurality of gap holes, the weight of the heat-conducting core 2 is reduced, thereby achieving lightweighting of the device.

[0034] The heat conducting core 2 is a metal sponge.

[0035] In this embodiment, the metal sponge is a metal material with a three-dimensional mesh structure. There are many gap holes between the mesh structure, which not only meets the smoothness of the coolant circulation, but also achieves sufficient contact with the coolant. At the same time, its overall texture is relatively light. Therefore, while achieving the lightweight of the equipment, the heat dissipation speed is guaranteed. In addition, the setting of the metal sponge makes the lightweight flow channel heat dissipation device have higher mechanical strength.

[0036] The liquid guiding tube sleeve 1 and the thermal conductive core 2 can be made of the same metal material or different metal materials. When different metal materials are used, two metals that are easy to connect can be selected to improve the convenience of connecting the liquid guiding tube sleeve 1 and the thermal conductive core 2. When the same metal material is used, the thermal resistance conversion between different metal materials is avoided, thereby ensuring the heat conduction speed.

[0037] The catheter sleeve 1 is composed of a plurality of metal plates, which are arranged in sequence around the direction of a circular array, and two adjacent metal plates are connected end to end.

[0038] In this embodiment, the liquid guide tube sleeve 1 can be a pipe with openings at both ends and a circular cross section, or a pipe with openings at both ends and a square cross section, or a pipe with openings at both ends and a polygonal cross section, etc. For example, if the pipe is a pipe with openings at both ends and a circular cross section, then the multiple metal plates are arranged in sequence along the circumferential direction of the pipe. The liquid guide tube sleeve 1 is composed of multiple metal plates to facilitate the installation and connection of the heat conductive core 2, so that each antenna can fully contact the liquid guide tube sleeve 1, achieve the firmness of the connection, and ensure the speed of heat dissipation.

[0039] The catheter sleeve 1 can also be formed by bending or rolling a metal plate into a flow channel shape with openings at both ends, such as a square, circular, triangular, etc. cross-section.

[0040] A method for preparing a lightweight flow channel heat dissipation device, using the above-mentioned lightweight flow channel heat dissipation device, comprises the following steps:

[0041] S1. Grind the inner surface of the liquid guide tube sleeve 1 and the surface of the thermal core 2 to increase the fit between the liquid guide tube sleeve 1 and the surface tentacles of the thermal core 2. After grinding, perform preliminary cleaning. For the materials of the liquid guide tube sleeve 1 and the thermal core 2 with high chemical activity, perform acid / alkali washing to remove the oxide layer, and then dilute and clean the residual acid / alkali again;

[0042] S2. Clamp the catheter sleeve 1 and the thermal conductive core 2 so that the catheter sleeve 1 is in contact with the thermal conductive core 2;

[0043] S3. Connect the clamped liquid guiding tube sleeve 1 and the heat conducting core 2 so that the antennae on the heat conducting core 2 are bonded to the inner surface of the liquid guiding tube sleeve 1 or connected by crystal tissue growth.

[0044] In S3, the clamped liquid guide tube sleeve 1 and the thermal conductive core 2 are placed in an electroplating solution for metal tissue growth, so that each tentacles are fully in contact with the liquid guide tube sleeve 1 for connection. Since the tentacles of the thermal conductive core 2 have a small length difference, some tentacles still cannot contact the liquid guide tube sleeve 1 after clamping, so the electroplating growth method is adopted to make the tentacles grow and achieve contact with the liquid guide tube sleeve 1, so as to ensure that each tentacles are fully connected with the liquid guide tube sleeve 1.

[0045] In S3, the liquid guide tube sleeve 1 and the heat conductive core 2 after electroplating growth are vacuum sintered to obtain metal bonding or metallurgical bonding to increase the firmness of the connection and reduce thermal resistance. The connection between the feeler and the liquid guide tube sleeve 1 after electroplating growth is relatively loose, and the feeler and the liquid guide tube sleeve 1 are deeply connected by vacuum sintering to make the connection between the two more firm. Combined with the good pressure bearing capacity of the metal sponge, it is not easy to deform or break under high pressure conditions, which ensures the mechanical strength of the metal sponge and the liquid guide tube sleeve 1.

[0046] The sintering temperature is preferably between the Tigh temperature of the metal or metal alloy or the solid phase sintering temperature and the melting point of the metal or metal alloy to accelerate the formation of metal bonding or metallurgical bonding; sintering includes but is not limited to vacuum sintering, and can also be sintered in an atmosphere such as nitrogen or argon; the sintering temperature can be sintered in a vacuum muffle furnace or by medium frequency induction, high frequency induction heating and other methods.

[0047] By combining electroplating growth with vacuum sintering, the liquid guide tube sleeve 1 is quickly connected to multiple tentacles, reducing the welding time and labor costs. At the same time, the electronic and atomic pathways between the liquid guide tube sleeve 1 and the thermal core 2 are guaranteed, making the conduction speed faster. Compared with the connection of colloid, the connection firmness is increased and the temperature requirement is reduced.

[0048] In S3, the liquid-conducting tube sleeve 1 and the thermal core 2 are placed in the electroplating solution for electroplating growth by full immersion growth or partial immersion growth. Preferably, partial immersion growth is adopted to reduce the area of ​​the thermal core 2 immersed in the electroplating solution, so that most of the gap holes on the thermal core 2 maintain the original size, thereby ensuring the smoothness of the flow of the coolant.

[0049] In S3, if the liquid-conducting tube sleeve 1 is composed of a plurality of metal plates, the contact areas between each metal plate and the thermally conductive core 2 are respectively electroplated to reduce the contact area between the thermally conductive core 2 and the electroplating solution. Preferably, the plurality of metal plates are all planes, so as to minimize the contact between the thermally conductive core 2 and the electroplating solution during electroplating. For example, the liquid-conducting tube sleeve 1 is a pipe with openings at both ends and a square cross-section, and the pipe is composed of four planar metal plates. During electroplating, the four planar metal plates and the thermally conductive core 2 are respectively electroplated.

[0050] In S3, if the liquid guiding tube sleeve 1 is composed of multiple metal plates, after the liquid guiding tube sleeve 1 is connected to the heat conductive core 2, the gaps where the multiple metal plates are spliced ​​are welded and sealed to complete the end-to-end connection of the two adjacent metal plates. The gaps where the adjacent metal plates are spliced ​​can be welded and sealed by brazing or inert gas shielded tungsten electrode welding, or by gluing or other connection methods.

[0051] If the liquid guiding tube sleeve 1 is formed by bending or rolling a metal plate, after the liquid guiding tube sleeve 1 is connected to the heat conducting core 2 , the two ends of the joint of the metal plate are welded and sealed.

[0052] The liquid catheter sleeve 1 can also be a straight tube or a curved tube with a certain angle. When it is a curved tube, taking the liquid catheter sleeve 1 as a pipe with openings at both ends and a square cross-section as an example, the upper and lower surfaces of the thermal core 2 are preferentially connected to the metal plates in sequence to form an ABA sandwich structure from top to bottom. The left and right sides of the sandwich structure are then cut according to the required bending angle of the liquid catheter sleeve 1. After completion, the metal plates are connected to the left and right sides of the thermal core 2 in sequence, and then the gaps where multiple metal plates are spliced ​​are welded and sealed.

[0053] S4. After welding, the liquid-conducting tube sleeve 1 connected to the heat-conducting core 2 is subjected to a mechanical strength test, a sealing test, etc.

[0054] If necessary, both ends of the catheter sleeve 1 can be sealed.

[0055] like Figure 1 As shown, take a pipe with openings at both ends and a square cross section as an example:

[0056] First, the metal sponge and the metal sheet are pre-treated: the opposing surfaces of the metal sponge and the metal sheet are ground until the surface roughness reaches Ra0.8-Ra1.6μm;

[0057] Use a deoxidation solution made of silicone oil and 5% to 10% hydrochloric acid to treat the metal sponge and metal sheet, and then use low-viscosity silicone oil to clean it;

[0058] Then use a PVC plastic clamp to fix the metal sponge to one of the metal plates so that the opposing surfaces of the two are tightly fixed until they fit completely.

[0059] (1) Place the fixed metal sponge and metal plate into the experimental tank, then connect the metal sponge and metal plate to the cathode and the anode rod to the anode;

[0060] Pour copper sulfate electroplating solution into the experimental tank, make the liquid level slightly higher than the contact plane between the metal sponge and the metal plate, and keep the plating solution temperature at 20℃~30℃;

[0061] Connect the other end of the cathode and anode to an adjustable DC regulated power supply, pre-plating for 1 hour at a current of 1A and a voltage of 3V, then adjust the current to 3A, keep the voltage constant, and continue electroplating for a certain period of time;

[0062] After the electroplating is completed, take out the metal sponge and metal plate, wash them repeatedly with alcohol or other organic solvents and dry them at 80-100°C.

[0063] (2) Place the dried sample in a vacuum muffle furnace and perform vacuum sintering at 800°C for 2-3 hours. The heating rate is controlled at 5-10°C / min to ensure that the material is evenly heated during the sintering process and reduce the influence of thermal stress. During the sintering process, stress can be applied to the outside of the plate.

[0064] (3) Repeat the above steps to fix another metal plate to the other side of the metal sponge so that the two metal plates are arranged opposite to each other, and then electroplate and sinter the other metal plate and the metal sponge to form an ABA sandwich structure.

[0065] (4) According to the design requirements, use high-precision CNC cutting equipment to cut out the required flow channel.

[0066] (5) Use the above method to connect the metal plates to the other two sides of the metal sponge.

[0067] (6) Finally, welding technology is used to weld and seal the gaps between adjacent metal plates.

[0068] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0069] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A lightweight flow channel heat dissipation device, characterized in that: include: A liquid guide tube sleeve (1), the liquid guide tube sleeve (1) being in the shape of a flow channel with openings at both ends, and the liquid guide tube sleeve (1) is used for flowing cooling liquid; A heat-conducting core (2), the heat-conducting core (2) being arranged inside the liquid-conducting tube sleeve (1), the heat-conducting core (2) having a plurality of gap holes, the plurality of gap holes being interconnected so as to allow the coolant in the liquid-conducting tube sleeve (1) to circulate, the plurality of gap holes located on the outer surface of the heat-conducting core (2) forming a plurality of antennae on the outer surface of the heat-conducting core (2), the plurality of antennae being connected to the inner surface of the liquid-conducting tube sleeve (1); The liquid guiding tube sleeve (1) and the heat conducting core (2) are both made of metal, and the liquid guiding tube sleeve (1) and the antenna are connected by metal.

2. The lightweight flow channel heat dissipation device according to claim 1, characterized in that: The heat-conducting core (2) is a metal sponge.

3. The lightweight flow channel heat dissipation device according to claim 2, characterized in that: The liquid-conducting tube sleeve (1) and the heat-conducting core (2) are made of the same metal material.

4. The lightweight flow channel heat dissipation device according to claim 3, characterized in that: The catheter sleeve (1) is composed of a plurality of metal plates, which are arranged in sequence in a circular array direction, and two adjacent metal plates are connected end to end.

5. A method for preparing a lightweight flow channel heat dissipation device, used for preparing the lightweight flow channel heat dissipation device as described in any one of claims 1 to 4, characterized in that: The following steps are involved: S1. Grinding the inner surface of the catheter sleeve (1) and the surface of the thermal core (2) to increase the fit between the catheter sleeve (1) and the surface of the thermal core (2); S2. The catheter sleeve (1) and the thermal core (2) are clamped so that the catheter sleeve (1) and the thermal core (2) are in contact; S3. The clamped catheter sleeve (1) is connected to the thermal core (2) so that the antennae on the thermal core (2) are bonded to the inner surface of the catheter sleeve (1) or connected by crystal tissue growth; S4. Perform a mechanical strength test on the liquid-conducting tube sleeve (1) after being connected to the heat-conducting core (2).

6. The method for preparing a lightweight flow channel heat dissipation device according to claim 5, characterized in that: In S3, the clamped liquid guide tube sleeve (1) and the heat conductive core (2) are placed in an electroplating solution for metal tissue growth, so that each antenna is in full contact with the liquid guide tube sleeve (1) for connection.

7. The method for preparing a lightweight flow channel heat dissipation device according to claim 6, characterized in that: In S3, the liquid-conducting tube sleeve (1) and the heat-conducting core (2) after electroplating growth are vacuum sintered to obtain metal bonding or metallurgical bonding, so as to increase the firmness of the connection and reduce thermal resistance.

8. The method for preparing a lightweight flow channel heat dissipation device according to claim 6, characterized in that: In S3, the liquid-conducting tube sleeve (1) and the heat-conducting core (2) are placed in an electroplating solution by a partial immersion growth method for electroplating growth.

9. The method for preparing a lightweight flow channel heat dissipation device according to claim 8, characterized in that: In S3, if the liquid-conducting tube sleeve (1) is composed of a plurality of metal plates, the contact areas between each metal plate and the heat-conducting core (2) are respectively subjected to electroplating growth to reduce the contact area between the heat-conducting core (2) and the electroplating liquid.

10. The method for preparing a lightweight flow channel heat dissipation device according to claim 9, characterized in that: In S3, if the liquid guiding tube sleeve (1) is composed of a plurality of metal plates, after the liquid guiding tube sleeve (1) is connected to the heat conducting core (2), the gaps between the plurality of metal plates are sealed to complete the end-to-end connection of two adjacent metal plates.

Images