Slit valve assembly for vacuum chamber, such as vacuum chamber of substrate processing system
By introducing a device with stray particle interaction elements into the slit valve assembly, the problem of stray particles entering the vacuum processing chamber is solved, and effective protection of the wafer substrate is achieved.
Patent Information
- Application Number
- CN202380069032.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-03-03
- Filing Date
- 2023-10-02
- Publication Date
- 2025-05-06
AI Technical Summary
In a wafer substrate vacuum processing system, the seals of the slit valve wear out cause stray particles to enter the vacuum processing chamber, damaging the substrate process.
A slit valve assembly is designed to contain a device that acts as a stray particle interaction element that prevents it from reaching the wafer substrate by interacting with stray particles.
It effectively prevents stray particles from entering the vacuum processing chamber, protects the wafer substrate, and avoids damage to the substrate process.
Smart Images
Figure CN119948282A_ABST
Abstract
Description
[0001] CROSS-REFERENCE TO RELATED APPLICATIONS
[0002] This application claims priority to NL application 2033346 filed on October 18, 2022 and EP application 23160068.5 filed on March 3, 2023, the entireties of which are incorporated herein by reference in their entirety. Background Art
[0003] In a wafer substrate vacuum processing system, for example, vacuum processing chambers are typically arranged in a cluster arrangement, a tandem arrangement, or a cluster / tandem combination arrangement to process wafer substrates. These systems can process wafer substrates in a single substrate or batch substrate manner. During processing, wafer substrates can be transferred to and from vacuum processing chambers, and a vacuum must be maintained or established in the vacuum processing chambers. In order to allow access to the interior of the vacuum processing chamber and to enable vacuum operations, a substrate transfer port is formed in one of the side walls of the vacuum processing chamber housing.
[0004] Typically, such a substrate transfer port has the shape of a slit that can be aligned parallel to a horizontal plane so as to allow a wafer substrate to enter the vacuum processing chamber. Thus, the substrate transfer port is opened and closed (e.g., sealed) by a slit valve via an actuator. In the open position, the slit valve leaves the substrate transfer port, and one or more wafer substrates can be transferred through the substrate transfer port.
[0005] With one or more wafer substrates in the vacuum processing chamber and the substrate transfer port closed and sealed by the slit valve, the vacuum processing chamber is in a vacuum. In common applications, the slit valve is pressed against the substrate transfer port by an actuator to maintain a proper seal and the vacuum applied in the vacuum processing chamber.
[0006] In addition to stray particles (air molecules) entering the vacuum process chamber during these opening and closing actions, the seal of the slit valve door is continuously subjected to pressure, deformation forces and temperature changes, and the wear of the sealing material can cause seal particles to loosen from the seal. Due to wear, such particles originating from the seal can be divided into ballistic particles and airborne particles, and the two types of particles show different propagation behaviors through the vacuum process chamber. Obviously, such stray particles (such as stray air molecules) entering the vacuum process chamber may disrupt substrate processes, such as lithography or metrology processes performed on wafer substrates.
[0007] It is an object of the present disclosure to prevent such stray particles from landing on a wafer substrate and adversely affecting or destroying a substrate process performed on the wafer substrate. Summary of the invention
[0008] To meet this objective, a slit valve assembly for a vacuum chamber (e.g., a vacuum chamber of a substrate processing system) is proposed, wherein the slit valve assembly comprises: a housing having a sidewall and at least one substrate delivery port formed in the sidewall, the housing having an interior volume defined by the sidewall; a slit valve door disposed within the housing and capable of being positioned between an open position and a closed position, in which the slit valve door is away from the substrate delivery port, and in which the slit valve door abuts and seals the substrate delivery port along a sealing perimeter; an actuator coupled to the slit valve door and operable to move the slit valve door between the open position and the closed position; and a device in the form of a stray particle interaction element for reducing particle kinetic energy of stray particles. Such stray particles may originate from the slit valve door. Alternatively or additionally, such particles may enter the interior volume through the at least one substrate delivery port.
[0009] The present disclosure is directed to a stray particle interaction element that prevents any stray particles (particularly so-called ballistic particles) from reaching or landing on a wafer substrate. This is achieved by interacting with those stray particles, where the interaction (contact by collision, deflection, bounce, or capture) causes the stray particles to lose particle kinetic energy and, therefore, propagation velocity. Slowing down the propagation velocity to near zero (cm / sec) will prevent any stray particles (particularly so-called ballistic particles that are loose from the door seal) from reaching or landing on a wafer substrate.
[0010] In an example, the device in the form of a stray particle interaction element is mounted to the slit valve door, and in particular, the device in the form of a stray particle interaction element is mounted to the slit valve door at a side of the slit valve door facing the substrate transfer port. In another example according to the present disclosure, the device in the form of a stray particle interaction element is mounted to the slit valve door at a side of the slit valve door opposite to the substrate transfer port.
[0011] In particular, in the latter example, the means in the form of a stray particle interaction element comprises at least one wall element extending from the slit valve door towards the inner volume, wherein the at least one wall element is provided with a cavity facing the substrate transfer port.
[0012] In another advantageous example, the device in the form of a stray particle interaction element is mounted at the housing side wall at the side facing the inner volume, in particular the device in the form of a stray particle interaction element is mounted near at least one substrate transfer opening. In further details of the latter example, the device in the form of a stray particle interaction element comprises at least one wall element extending from the housing side wall towards the inner volume, wherein a free end of the at least one wall element faces the slit valve at the slit valve side opposite to the substrate transfer opening.
[0013] In all the examples according to the present disclosure outlined above, the stray particle interaction surface of the device in the form of a stray particle interaction element can be provided with a sticky material, such as a polymer layer with high adhesion properties. Alternatively, the stray particle interaction surface of the device can be provided with a particle retaining layer, such as a mesh layer or a mesh fabric.
[0014] All of these examples result in a modified slit valve assembly where the interaction (through collision, deflection, bouncing or captured contact) causes the stray particles to lose particle kinetic energy and therefore propagation velocity, thereby preventing any stray particles (especially so-called ballistic particles) from reaching or landing on the wafer substrate. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The present invention will now be discussed with reference to the accompanying drawings, which show:
[0016] Figure 1 is an example of a slit valve assembly according to the prior art;
[0017] Figure 2 is an example of a slit valve of a slit valve assembly according to the present disclosure;
[0018] Figure 3 are additional details of an example of a slit valve door of a slit valve assembly according to the present disclosure;
[0019] Figure 4 are additional details of an example of a slit valve door of a slit valve assembly according to the present disclosure;
[0020] Figure 5 are additional details of an example of a slit valve door of a slit valve assembly according to the present disclosure. DETAILED DESCRIPTION
[0021] For proper understanding of the present invention, in the following detailed description, corresponding elements or components of the present invention will be denoted by the same reference numerals in the accompanying drawings.
[0022] Figure 1 An example of a slit valve assembly according to the prior art is depicted, which is indicated by reference numeral 100. In a wafer substrate vacuum processing system, for example, a vacuum processing chamber is typically arranged in a cluster arrangement, a tandem arrangement, or a cluster / tandem combination arrangement to process wafer substrates. These systems can process wafer substrates in a single substrate or batch substrate manner. During processing, a wafer substrate 60 can be transferred to and from a vacuum processing chamber, which is herein indicated by reference numeral 200, in which a vacuum must be maintained or established. In order to allow access to the interior of the vacuum processing chamber 200, and in order to achieve vacuum operation, a substrate transfer port 11 is formed in one of the side walls 12 of the vacuum processing chamber housing 10.
[0023] Typically, such a substrate transfer port 11 has the shape of a slit, which can be aligned parallel to a horizontal plane so as to allow a wafer substrate 60 to enter the vacuum processing chamber 200. Accordingly, the substrate transfer port 11 is opened and closed (e.g., sealed) by the slit valve door 20 through an actuator (actuator device) 30. In one example, the slit valve door 20 may be mounted to an actuator arm 30a, which may be displaced by the actuator 30 in a so-called L motion. The L motion applied to the slit valve door 20 begins with a displacement away from the substrate transfer port 11 in a horizontal direction, so that the slit valve door 20 is disengaged from the substrate transfer port 11. In a subsequent displacement, the actuator arm 30a is retracted or displaced in a downward vertical direction, and the slit valve door 20 (now disengaged from the substrate transfer port 11) is displaced in the same vertical manner and opens the substrate transfer port 11.
[0024] In the open position, the slit valve door 20 is away from the substrate transfer port 11, and one or more wafer substrates 60 can be transferred into the vacuum processing chamber 200 through the substrate transfer port 11. With the one or more wafer substrates 60 located in the vacuum processing chamber 200, the substrate transfer port 11 is closed, during which the slit valve door 20 is displaced in a similar L motion, but in reverse order. The actuator arm 30a is displaced in the opposite upward direction by the actuator 30, and the slit valve door 20 is pressed toward and against the substrate transfer port 11 in a sealing manner.
[0025] The vacuum processing chamber 200 is always in vacuum, and the chamber upstream of the substrate transfer port 11 is in vacuum or in ambient pressure conditions. Therefore, before the slit valve door 20 is opened, there is still a pressure difference on both sides of the substrate transfer port 11, causing stray particles to enter the vacuum processing chamber 200. It is desirable to prevent stray particles (such as stray air molecules represented by reference numeral 70) from entering the vacuum processing chamber 200 and prevent them from disrupting substrate processes, such as photolithography or metrology processes performed on the wafer substrate 60.
[0026] In common applications, the slit valve door 20 is provided with a door seal 20z which is applied at and rounds the valve periphery of the slit valve door 20. When closing the substrate transfer port 11, the door seal 20z is pressed against the periphery 11z of the substrate transfer port 11 by the actuator device 30 in order to maintain a proper seal and the vacuum applied in the vacuum processing chamber 200. In addition to the stray particles (air molecules) 70 that enter the vacuum processing chamber 200 during these opening and closing actions (due to the small pressure difference on both sides of the substrate transfer port 11), the door seal 20z of the slit valve door 20 is continuously subjected to pressure, deformation forces and temperature changes, and the wear of the sealing material may cause the sealing particles to loosen from the seal. Due to wear, such particles originating from the seal can be divided into ballistic particles and airborne particles, and the two types of particles show different propagation behaviors through the vacuum processing chamber.
[0027] For the sake of clarity and explanation, such ballistic particles and airborne particles originating from the door seal 20z are also indicated by reference numeral 70. In fact, it should be noted that throughout the present application, reference numeral 70 may represent any ballistic and / or airborne particles that are released from the door seal 20z due to the repeated opening and closing action of the slit valve door 20 as stray air molecules that enter the vacuum processing chamber 200 (from the outside) through the substrate transfer port 11 and / or are released from the door seal 20z due to the repeated opening and closing action of the slit valve door 20.
[0028] An object of the present disclosure is to prevent such stray particles 70 from landing on a wafer substrate 60 present in a vacuum processing chamber 200 and from adversely affecting or destroying a substrate process performed in the vacuum processing chamber.
[0029] exist Figure 2 In FIG. 1 , a first example of a slit valve assembly according to the present disclosure is depicted. Figure 1 In a manner similar to the prior art examples of the present invention, such a slit valve assembly is used in a vacuum chamber, such as a vacuum chamber used in a substrate processing system. Figure 2 The slit valve assembly is indicated by reference numeral 100' and includes a housing 10 having a sidewall 12 and at least one substrate transfer port 11 formed in the housing. The sidewall 12 of the housing 10 defines an inner volume, which serves as a vacuum processing chamber 200.
[0030] The modified slit valve door 20' is disposed in the housing 10 and is positioned between an open position, in which the slit valve door 20' is away from the substrate transfer port 11, and a closed position, in which the slit valve door 20' abuts against the port periphery 11z with its door periphery. The slit valve door 20' is provided with a first valve side 20a and a second valve side 20b opposite to the first valve side 20a. The first valve side 20a faces the external environment of the substrate transfer port 11 and the slit valve assembly 100' and may also be labeled as an external valve side 20a. The second valve side 20b faces the vacuum processing chamber 200 and is referred to as an internal valve side 20b.
[0031] The first or outer valve side 20a of the slit valve door 20' is provided with a door seal 20z at the door periphery, which abuts and seals the substrate transfer port 11 along a sealing periphery 11z located on the inner side of the side wall 12 facing the vacuum processing chamber 200.
[0032] As in Figure 1 In a prior art example of the present invention, the actuator 30 is coupled to the slit valve door 20' via the actuator arm 30a. In a similar manner known in the art, the actuator arm 30a can be displaced by the actuator 30 in the so-called L motion described above. To open, the slit valve door 20' is displaced or disengaged in a horizontal manner away from the substrate transfer port 11, and then displaced in a vertical direction so that the substrate transfer port 11 is opened. In the open position, the slit valve door 20 is away from the substrate transfer port 11, and one or more wafer substrates 60 can be transferred into the vacuum processing chamber 200 through the substrate transfer port 11. With the one or more wafer substrates 60 located in the vacuum processing chamber 200, the actuator arm 30a is displaced in the opposite vertical upward direction by the actuator 30, and then the slit valve door 20' is pressed against the substrate transfer port 11 in a sealing manner (in the horizontal direction). Subsequently, with the vacuum processing chamber 200 in a vacuum, several photolithography processes can be performed on the wafer substrate 60.
[0033] In order to prevent stray particles 70 (stray air molecules entering the vacuum processing chamber 200 from the external environment through the substrate transfer port 11 and / or any ballistic and / or airborne particles 70 released from the door seal 20z) from landing on the wafer substrates 60 present in the vacuum processing chamber 200 and adversely affecting or disrupting the substrate processing performed in the vacuum processing chamber, Figure 2 The slit valve assembly 100 ′ also includes means in the form of a stray particle interaction element 50 that is configured to reduce the particle kinetic energy of those stray particles 70 that enter the interior volume of the vacuum processing chamber 200 .
[0034] The stray particle interaction element 50 is intended to prevent any stray particles 70 (particularly so-called ballistic particles originating from the door seal 20z) from reaching or landing on the wafer substrate 60 present in the vacuum processing chamber 200. This is achieved by interacting with these stray particles 70, wherein the interaction (by collision, deflection, bouncing or captured contact) causes the stray particles 70 to lose particle kinetic energy and thus propagation speed. Such stray particles that have lost particle kinetic energy and propagation speed and therefore cannot reach or land on the wafer substrate 60 are indicated by reference numeral 70' (depicting the imaginary propagation path of the captured or slowed stray particles).
[0035] In the first and second examples, the stray particle interaction element 50 is mounted to the modified slit valve door 20 ′ according to the present disclosure and is denoted by reference numerals 501 and 502 .
[0036] In a first example, the stray particle interaction element 501 is mounted to the modified slit valve door 20' at the first outer slit valve door side 20a facing the substrate transfer port 11. Figure 2 shown and in Figure 3 As shown in more detail in FIG. 5 , the stray particle interaction element 501 is formed as a shielding plate mounted at the first outer slit valve side 20a and between (surrounded by) the peripheral door seal 20z. Thus, a small intermediate gap 401 ( Figure 3 ), stray particles 70 (in Figure 3 Due to repeated collision and bouncing interactions between the trapped stray particles 70 and the shielding plate 501 within the gap 401, any trapped stray particles 701 will quickly lose particle kinetic energy and particle propagation speed.
[0037] In another second example according to the present disclosure, a stray particle interaction element is denoted by 502 and is mounted to the modified slit valve door 20' at the slit valve door side opposite to the substrate transfer port 11 (particularly at the slit valve door side facing the vacuum processing chamber 200). In particular, the shape of the stray particle interaction element 502 is designed to be a wall element or plate element 502 extending from the slit valve door 20' to the inner volume formed by the vacuum processing chamber 200. Figure 2 and Figure 3 In the example of FIG. 5 , the plate member 502 extends from the slit valve door 20 ′ in a direction entering the vacuum processing chamber 200 but parallel to the inner surface of the side wall 12 of the housing 10 in which the substrate transfer port 11 exists.
[0038] During the opening and closing action of the modified slit valve door 20', the plate element 502 is displaced in the L motion described above, and the downward and upward vertical directions of the plate element 502 are close to and parallel to the inner surface 12a of the side wall 12 of the housing 10 in which the substrate transfer port 11 exists. In the latter example, the stray particle interaction element 502 includes at least one wall element 502 extending from the slit valve door 20' toward the inner volume 200. The wall element 502 is provided with a cavity 502-a, and the cavity 502-a faces the substrate transfer port 11 or more specifically faces the inner surface 12a of the side wall 12 of the housing 10 in which the substrate transfer port 11 exists. The inner surface 12a of the housing side wall 12 faces the vacuum processing chamber 200.
[0039] The intermediate gap 402 (see FIG. 1 ) is formed between the wall member 502 and the inner surface 12a of the side wall 12 of the housing 10 in which the substrate transfer port 11 is located. Figure 3 ) together, cavity 502-a serves as a shield for any stray particles 70 (in Figure 3 200). Thus, for example, any so-called ballistic particle 702 that is loosened from the door seal 20z due to repeated opening and closing actions of the slit valve door 20' will be captured. Due to repeated collision and bouncing interactions between the captured stray particle 702 and the wall element 502 and the inner surface 12a of the side wall 12 of the housing 10 in which the substrate transfer port 11 is present, the stray particle 70 will quickly lose particle kinetic energy and particle propagation speed. Therefore, such decelerated stray particles 702 are prevented from reaching or landing on the wafer substrate 60 present in the vacuum processing chamber 200, as shown in FIG. Figure 3 As shown in the figure 702', the figure 702' shows the hypothetical propagation path of such a ballistic particle 70 without being captured and decelerated with the help of the stray particle interaction element 502.
[0040] The shielding plate 501 and / or the wall element 502 may be made of the same material as the slit valve door 20'. Alternatively, the shielding plate 501 and / or the wall element 502 may be a component of the slit valve door 20'.
[0041] In the third example, the stray particle interaction element is indicated by reference numeral 503 and is mounted at the inner surface of the housing side wall 12 facing the inner volume 200. Figure 2 and Figure 3As shown, the stray particle interaction element 503 is installed near at least one substrate transfer port 11. In particular, the stray particle interaction element 503 includes at least one wall element 503. A first wall portion 503-a of the wall element 503 extends from the inner surface 12a of the housing side wall 12 toward the inner volume of the vacuum processing chamber 200. Additionally, as shown, a free wall end portion 503-b of the at least one wall element 503 is formed to surround the slit valve door 20' so that the free end portion 503-b faces the second inner slit valve side 20b of the slit valve door 20' opposite to the substrate transfer port 11 and faces the inner volume of the vacuum processing chamber 200.
[0042] Likewise, the space-forming wall element 503 formed by the first wall portion 503-a and the free wall end 503-b, which is angled, preferably at right angles, to the first wall portion 503-a, serves as a shield or capture enclosure for the slit valve door 20'. A small intermediate gap 403 is formed between the space-forming wall element 503 and the slit valve door 20'. In the gap 403, any stray particles 70 (in Figure 3 Due to repeated collision and bouncing interactions between the trapped stray particles 703 and the space-forming wall element 503 and the slit valve door 20', the trapped stray particles 703 will quickly lose particle kinetic energy and particle propagation speed.
[0043] The material from which the space-forming wall element 503 (the first wall portion 503 - a and the free wall end 503 - b ) is produced can be the same as the material from which the housing wall 12 is produced and can alternatively be a component of the housing wall 12 .
[0044] Alternatively, if Figure 4 As shown, in the fourth example, the stray particle interaction element is denoted by reference numeral 504 and has a similar configuration to the stray particle interaction element 503. However, unlike the third example, in this fourth example, the stray particle interaction element 504 is mounted to the surface of the slit valve door 20' facing the inner volume 200. Figure 4 As shown, the stray particle interaction element 504 is also installed near the at least one substrate transfer port 11. In particular, the stray particle interaction element 504 includes at least one wall element 504. A first wall portion 504-a of the wall element 504 protrudes from the slit valve door 20' and away from the inner surface 12a of the housing sidewall 12 toward the inner volume of the vacuum processing chamber 200. The first wall portion 504-a of the wall element 504 is directly connected to the slit valve door 20' through a mounting point 504-c.
[0045] Additionally, as shown, the free wall end 504-b of at least one wall element 503 is formed to surround the slit valve door 20' so that the free end 504-b faces the second inner slit valve side 20b of the slit valve door 20' opposite the substrate transfer port 11 and faces the inner volume of the vacuum processing chamber 200. As with the third example, the space-forming wall element 504 formed by the first wall portion 504-a and the free wall end 504-b is formed at an angle, preferably at a right angle, to the first wall portion 504-a. A small intermediate gap 403 is formed between the space-forming wall element 504 and the slit valve door 20'. In the gap 403, any stray particles 70 (in Figure 4 703) will be captured.
[0046] The material from which the space-forming wall element 504 (first wall portion 504 - a and free wall end 504 - b ) is manufactured can be the same material from which the housing wall 12 is manufactured and can alternatively be a component of the housing wall 12 (together with the mounting point 504 - c ).
[0047] In all four examples according to the present disclosure outlined above, the surfaces of the stray particle interaction elements 501-502 (502-a)-503 (503-a, 503-b)-504 (504-a, 504-b) that can interact with the stray particles 70 can be provided with adhesive material layers 501-z, 502-z, 503-z and 504-z, respectively, such as polymer layers with high adhesion properties.
[0048] Alternatively, if Figure 5 As shown in more detail in FIG. 1 , one or all stray particle interaction surfaces of stray particle interaction elements 501-502 (502-a)-503 (503-a, 503-b) that interact with stray particles 70 may be provided with a particle retaining layer, such as a mesh layer or a mesh fabric. Several examples of particle retaining layers may be represented by reference numerals 501-y, 502-y, and 503-y, respectively, depending on whether they are part of or installed with the first, second, or third examples of stray particle interaction elements 501-502 (502-a)-503 (503-a, 503-b)-504 (504-a, 504-b). For illustrative purposes, Figure 5 , only the particle retaining layers 501 - y and 503 - y are shown, which are parts of the first and third examples of the stray particle interaction elements 501 and 503 ( 503 - a , 503 - b ).
[0049] However, it should be noted that in a similar manner, the stray particle interaction elements 502 and 504 ( Figure 2 and Figure 3 A second example of the present disclosure shown in Figure 4 The fourth example of the present disclosure shown in ) may also be provided with a particle retaining layer, such as a mesh layer or a mesh fabric.
[0050] Several examples of particle retention layers 501-y, 502-y and 503-y can be constructed as metal mesh material layers with an open three-dimensional structure. Any stray particles 70 that enter or impact the metal mesh material layer will be retained and will lose their particle kinetic energy and particle propagation speed due to interaction, collision or impact with several mesh wires of the metal mesh layer.
[0051] Similarly, when a mesh fabric is used as the particle retaining layer 501-y, 502-y, and 503-y, the mesh fabric can be made of polyester, nylon, or spandex. Likewise, the open three-dimensional structure of the mesh fabric will capture any stray particles 70 as they enter, causing the particle kinetic energy and particle propagation speed to be lost due to interaction, collision, or impact with the several mesh wires of the fabric.
[0052] All of these examples result in a modified slit valve assembly 100' where the interaction (by collision, deflection, bounce or captured contact) causes the stray particles to lose particle kinetic energy and, therefore, propagation velocity. The slowing down of the propagation velocity to near zero (cm / sec) will prevent any stray particles 70 (particularly so-called ballistic particles that have escaped from the door seal 20z) from reaching or landing on the wafer substrate 60.
[0053] Reference numerals list
[0054] 100 Slit valve assembly (prior art)
[0055] 100' Slit Valve Assembly (According to the Disclosure)
[0056] 200 Vacuum Processing Chamber
[0057] 10 Housing
[0058] 11 Substrate transfer port (existing technology)
[0059] 12 Shell side wall
[0060] 12a Surface of the housing side wall (facing the vacuum processing chamber)
[0061] 11z Sealing periphery of substrate transfer port
[0062] 20 Slit valve
[0063] 20' Slit Valve (according to the present disclosure)
[0064] 20a First slit valve door side (facing the substrate transfer port)
[0065] 20b Second slit valve side (facing the vacuum processing chamber)
[0066] 20z Sealing periphery of slit valve
[0067] 30 Actuator
[0068] 30a Actuator arm
[0069] 401-402-403 Capture chamber (according to the first example, the second example, the third example of the present disclosure)
[0070] 501-502-503-504 Stray particle interaction element (according to the first example, the second example, the third example, the fourth example of the present disclosure)
[0071] 501 Shielding Plate (First Example)
[0072] 501-y Particle retaining mesh layer or fabric (first example)
[0073] 501-z sticky surface layer (first example)
[0074] 502 Wall element (second example)
[0075] 502-a Cavity in wall element (second example)
[0076] 502-y Particle retaining mesh layer or fabric (second example)
[0077] 502-z adhesive surface layer (second example)
[0078] 503 Wall element (third example)
[0079] 503-a First wall portion of the wall element 503 (third example)
[0080] 503-b Free end of the wall element 503 (third example)
[0081] 503-y Particle retaining mesh layer or fabric (third example)
[0082] 503-z sticky surface layer (third example)
[0083] 504 wall element (fourth example)
[0084] 504-a First wall portion of the wall element 504 (fourth example)
[0085] 504-b Free end of the wall element 504 (fourth example)
[0086] 504-c Mounting point of wall element 504 (fourth example)
[0087] 504-z adhesive surface layer (fourth example)
[0088] 60 chips
[0089] 70 (701-702-703) Stray particles
[0090] 70' (702') Stray particles passing through failure (hypothetical propagation path)
Claims
1. A slit valve assembly for use in a vacuum chamber, such as a vacuum chamber of a substrate processing system, the slit valve assembly comprising: a housing having a sidewall and at least one substrate transfer port formed in the sidewall, the housing having an interior volume defined by the sidewall; a slit valve door disposed in the housing and capable of being positioned between an open position and a closed position, wherein the slit valve door is away from the substrate transfer port and the slit valve door abuts and seals the substrate transfer port along a sealing perimeter; an actuator coupled to the slit valve door and operable to move the slit valve door between the open position and the closed position; and Means in the form of a stray particle interaction element for reducing the particle kinetic energy of stray particles.
2. The slit valve assembly for use in a vacuum chamber according to claim 1, wherein the stray particles originate from the slit valve door.
3. The slit valve assembly for use in a vacuum chamber according to claim 1 and / or claim 2, wherein the stray particles enter the internal volume space through at least one substrate delivery port.
4. A slit valve assembly for use in a vacuum chamber according to any one of the preceding claims, wherein the device is mounted to the slit valve door.
5. The slit valve assembly for use in a vacuum chamber according to claim 4, wherein the device is mounted to the slit valve door at a side of the slit valve door facing the substrate transfer port.
6. The slit valve assembly for use in a vacuum chamber according to claim 4 or 5, wherein the device is mounted to the slit valve door at a side of the slit valve door opposite to the substrate transfer port.
7. The slit valve assembly for use in a vacuum chamber according to claim 6, wherein the device comprises at least one wall element extending from the slit valve door towards the inner volume space, wherein the at least one wall element is provided with a cavity facing the substrate transfer port.
8. A slit valve assembly for use in a vacuum chamber according to any one or more of the preceding claims, wherein the device is mounted at a housing side wall on the side facing the inner volume.
9. A slit valve assembly for use in a vacuum chamber according to any one or more of claims 6-8, wherein the device is mounted adjacent to at least one substrate transfer port.
10. The slit valve assembly for use in a vacuum chamber according to claim 8 or 9, wherein the device comprises at least one wall element protruding from the housing side wall toward the inner volume space, wherein a free end of the at least one wall element faces the slit valve door at a side of the slit valve door opposite to the substrate transfer port.
11. A slit valve assembly for use in a vacuum chamber according to any one or more of the preceding claims, wherein the stray particle interaction surface of the device is provided with a sticky material, such as a polymer layer having adhesive properties.
12. A slit valve assembly for use in a vacuum chamber according to any one or more of claims 1-10, wherein the stray particle interaction surface of the device is provided with a particle retaining layer, such as a mesh layer or a mesh fabric.