Dispensing method and system for printed circuit board

Abstract

The present invention provides a dispensing processing method and system for a printed circuit board, which visually recognizes the spatial shape feature information of all dispensing areas on the surface of the printed circuit board; also tracks and recognizes the relative position between the dispensing nozzle and the surface of the printed circuit board, thereby determining the dispensing area matching the dispensing nozzle, and controlling the spatial sequence of the dispensing operation of the dispensing nozzle on the printed circuit board; based on the spatial shape feature information of the dispensing area, determines the movement path of the dispensing nozzle, and visually recognizes the shape information of the corresponding dispensing position during the movement of the dispensing nozzle, thereby adjusting the aiming posture of the dispensing nozzle relative to the dispensing position to ensure that the dispensing nozzle accurately outputs glue to the dispensing position and avoid mis-dispensing; also adjusts the glue output state of the dispensing nozzle based on the spatial shape feature information of the dispensing area, and adjusts the curing operation state of the glue based on the glue form information of the dispensing position, so as to avoid insufficient dispensing and glue overflow, and improve the production efficiency and the yield rate of the printed circuit board.

Description

Technical Field

[0001] The present invention relates to the field of printed circuit board manufacturing, and particularly to a dispensing method and system for printed circuit boards. Background Art

[0002] Dispensing is an important process in printed circuit board manufacturing. Conductive epoxy resin and other adhesive liquids are spot-coated onto corresponding positions on the surface of the printed circuit board, thereby electrically connecting and fixedly installing electronic components on the printed circuit board to achieve electrical connection between different electronic components. The manufacturing of printed circuit boards has high precision requirements for the dispensing process, and the volume of the dispensing adhesive liquid is gradually developing towards the micron level. The existing dispensing treatment of printed circuit boards usually uses a dispensing manipulator to perform multi-point synchronous dispensing on the printed circuit board. This method cannot flexibly perform fine dispensing on different positions of the printed circuit board, and it is easy to have the situation of insufficient dispensing amount or excessive overflow of the dispensing amount, resulting in the interruption or short circuit of the connection between different electronic components on the printed circuit board, reducing the production efficiency and the yield rate of the printed circuit board. Summary of the Invention

[0003] The purpose of the present invention is to provide a dispensing method and system for printed circuit boards, visually identify the spatial shape feature information of all dispensing areas on the surface of the printed circuit board; also track and identify the relative position between the dispensing nozzle and the surface of the printed circuit board, thereby determining the dispensing area matching the dispensing nozzle, controlling the spatial sequence of the dispensing operation of the dispensing nozzle on the printed circuit board; based on the spatial shape feature information of the dispensing area, determine the movement path of the dispensing nozzle, and visually identify the shape information of the corresponding dispensing position during the movement of the dispensing nozzle, thereby adjusting the aiming posture of the dispensing nozzle relative to the dispensing position to ensure that the dispensing nozzle accurately outputs the adhesive liquid to the dispensing position and avoid mis-dispensing; also, based on the spatial shape feature information of the dispensing area, adjust the adhesive liquid output state of the dispensing nozzle, and based on the adhesive liquid morphology information of the dispensing position, adjust the curing operation state of the adhesive liquid to avoid insufficient dispensing amount and overflow of the adhesive, and improve the production efficiency and the yield rate of the printed circuit board.

[0004] The present invention is realized through the following technical solutions:

[0005] A dispensing method for a printed circuit board, comprising:

[0006] Visually identify the surface of the printed circuit board to determine the spatial shape feature information of each dispensing area on the surface of the printed circuit board; track and identify the dispensing nozzle to obtain the relative position information between the dispensing nozzle and the surface of the printed circuit board, and based on the relative position information, determine the dispensing area matching the dispensing nozzle;

[0007] Based on the spatial shape feature information of the matched dispensing area, determine the movement path of the dispensing nozzle above the matched dispensing area; perform visual recognition on the movement of the dispensing nozzle along the movement path to obtain the shape information of the current dispensing position corresponding to the dispensing nozzle; based on the shape information of the dispensing position, adjust the aiming posture of the dispensing nozzle relative to the dispensing position;

[0008] Based on the spatial shape feature information, adjust the glue output state of the dispensing nozzle at the dispensing position during the movement of the dispensing nozzle along the movement path; then based on the glue shape information of the dispensing position, adjust the curing operation state of the dispensing position.

[0009] Optionally, perform visual recognition on the surface of the printed circuit board to determine the spatial shape feature information of each dispensing area on the surface of the printed circuit board; perform tracking recognition on the dispensing nozzle to obtain the relative position information between the dispensing nozzle and the surface of the printed circuit board, and based on the relative position information, determine the dispensing area matched with the dispensing nozzle, including:

[0010] Perform three-dimensional visual recognition on the surface of the printed circuit board to obtain the three-dimensional contour feature information of all dispensing areas on the surface of the printed circuit board; based on the three-dimensional contour feature information, determine the spatial shape feature information of each dispensing area on the surface of the printed circuit board; wherein, the spatial shape feature information includes the three-dimensional shape feature information of the glue accommodation space of the dispensing area;

[0011] Based on the characteristic structure of the dispensing nozzle, perform tracking recognition on the dispensing nozzle to obtain the relative distance information and relative azimuth information between the dispensing nozzle and the surface of the printed circuit board; based on the relative distance information and relative azimuth information, determine the dispensing area closest to the dispensing nozzle as the dispensing area matched with the dispensing nozzle.

[0012] Optionally, based on the spatial shape feature information of the matched dispensing area, determine the movement path of the dispensing nozzle above the matched dispensing area; perform visual recognition on the movement of the dispensing nozzle along the movement path to obtain the shape information of the current dispensing position corresponding to the dispensing nozzle; based on the shape information of the dispensing position, adjust the aiming posture of the dispensing nozzle relative to the dispensing position, including:

[0013] Based on the three-dimensional shape feature information of the glue accommodation space included in the spatial shape feature information of the matched dispensing area, obtain the extension path of the matched dispensing area on the surface of the printed circuit board, and thereby determine the movement path of the dispensing nozzle above the matched dispensing area;

[0014] Visually identify the movement of the dispensing nozzle along the movement path to obtain the surface contour shape information of the current dispensing position corresponding to the dispensing nozzle; based on the surface contour shape information, determine the angular offset between the glue output end of the dispensing nozzle and the dispensing position, so as to adjust the aiming attitude angle of the dispensing nozzle relative to the dispensing position.

[0015] Optionally, based on the spatial shape feature information, adjust the glue output state of the dispensing nozzle to the dispensing position during the movement along the movement path; then, based on the glue form information of the dispensing position, adjust the curing operation state of the dispensing position, including:

[0016] Based on the three-dimensional shape feature information of the glue accommodation space included in the spatial shape feature information of the matched dispensing area, determine the glue filling volume of the glue accommodation space; based on the glue filling volume and the movement speed of the dispensing nozzle along the movement path, adjust the glue output flow rate of the dispensing nozzle to the dispensing position during the movement along the movement path;

[0017] Based on the range of the glue coverage area of the dispensing position, adjust the ultraviolet radiation intensity and radiation range of the ultraviolet curing operation for the dispensing position.

[0018] Optionally, based on the spatial shape feature information, adjust the glue output state of the dispensing nozzle to the dispensing position during the movement along the movement path, including:

[0019] Step S1, using the following formula (1), according to whether there is glue wire drawing in the glue output state of the dispensing nozzle to the dispensing position during the movement along the movement path, the length of the glue wire drawing, and the thickness state of the wire drawing, control the enabling of the dispensing nozzle, (1) In the above formula (1), represents the enabling control value of the dispensing nozzle at time represents the presence recognition value of the glue wire drawing at time, if , it means that there is glue wire drawing at time , if , it means that there is no glue wire drawing at time ; represents the cross-sectional diameter of the glue wire drawing at time represents the length value of the glue wire drawing at time represents logical AND. If all the arithmetic expressions between the logical ANDs are established, the overall output value is 1. If there is one or more arithmetic expressions that do not hold among all the arithmetic expressions between the logical ANDs, the overall output value is 0; Represents the minimum cross-sectional diameter of the glue thread drawing; Represents the minimum length of the glue thread drawing;

[0020] Step S2, when the dispensing nozzle is enabled and opened, using the following formula (2), according to the length of the glue thread drawing and the thickness state of the drawing, control the rotation speed of the dispensing nozzle, (2) In the above formula (2), Represents when the dispensing nozzle is enabled and opened, The rotation speed of the dispensing nozzle at the moment; Represents the maximum controllable rotation speed of the dispensing nozzle; Represents the natural constant;

[0021] Step S3, using the following formula (3), according to the stagnation duration of the glue at the previous dispensing position, the longest length of the glue thread drawing, and the thickness state of the drawing, control the stagnation duration of the glue when dispensing at the next dispensing position, (3) In the above formula (3), Represents the stagnation duration of the glue when dispensing at the next dispensing position. If it is the first dispensing position, the stagnation duration of the glue when dispensing is the initial set duration; Represents the stagnation duration of the glue when dispensing at the previous dispensing position; Represents the longest length of the glue thread drawing at the previous dispensing position; Represents the maximum cross-sectional diameter of the glue thread drawing at the previous dispensing position; Represents obtaining And The maximum value in.

[0022] The dispensing processing system for a printed circuit board includes:

[0023] The dispensing area shape recognition module is used to perform visual recognition on the surface of the printed circuit board to determine the spatial shape feature information of each dispensing area on the surface of the printed circuit board;

[0024] The dispensing area matching and determining module is used to perform tracking recognition on the dispensing nozzle to obtain the relative position information between the dispensing nozzle and the surface of the printed circuit board, and based on the relative position information, determine the dispensing area matching the dispensing nozzle;

[0025] The nozzle movement path determining module is used to determine the movement path of the dispensing nozzle above the matching dispensing area based on the spatial shape feature information of the matching dispensing area;

[0026] The nozzle aiming attitude adjustment module is used to perform visual recognition on the movement of the dispensing nozzle along the movement path to obtain the shape information of the current dispensing position corresponding to the dispensing nozzle; based on the shape information of the dispensing position, adjust the aiming attitude of the dispensing nozzle relative to the dispensing position.

[0027] The glue output adjustment module is used to adjust the glue output state of the dispensing nozzle to the dispensing position during the movement of the dispensing nozzle along the movement path based on the spatial shape feature information.

[0028] The dispensing curing operation adjustment module is used to adjust the curing operation state of the dispensing position based on the glue form information of the dispensing position.

[0029] Optionally, the dispensing area shape recognition module is used to perform visual recognition on the surface of the printed circuit board to determine the spatial shape feature information of each dispensing area on the surface of the printed circuit board, including:

[0030] Perform three-dimensional visual recognition on the surface of the printed circuit board to obtain the three-dimensional contour feature information of all dispensing areas on the surface of the printed circuit board; based on the three-dimensional contour feature information, determine the spatial shape feature information of each dispensing area on the surface of the printed circuit board; wherein, the spatial shape feature information includes the three-dimensional shape feature information of the glue accommodation space of the dispensing area.

[0031] The dispensing area matching determination module is used to perform tracking recognition on the dispensing nozzle to obtain the relative position information between the dispensing nozzle and the surface of the printed circuit board, and based on the relative position information, determine the dispensing area matched with the dispensing nozzle, including:

[0032] Based on the characteristic structure of the dispensing nozzle, perform tracking recognition on the dispensing nozzle to obtain the relative distance information and relative azimuth information between the dispensing nozzle and the surface of the printed circuit board; based on the relative distance information and relative azimuth information, determine the dispensing area closest to the dispensing nozzle as the dispensing area matched with the dispensing nozzle.

[0033] Optionally, the nozzle movement path determination module is used to determine the movement path of the dispensing nozzle above the matched dispensing area based on the spatial shape feature information of the matched dispensing area, including:

[0034] Based on the three-dimensional shape feature information of the glue accommodation space included in the spatial shape feature information of the matched dispensing area, obtain the extension path of the matched dispensing area on the surface of the printed circuit board, and thereby determine the movement path of the dispensing nozzle above the matched dispensing area.

[0035] The nozzle aiming attitude adjustment module is used to perform visual recognition on the movement of the dispensing nozzle along the movement path to obtain the shape information of the current dispensing position corresponding to the dispensing nozzle; based on the shape information of the dispensing position, adjust the aiming attitude of the dispensing nozzle relative to the dispensing position, including:

[0036] Perform visual recognition on the movement of the dispensing nozzle along the movement path to obtain the surface contour shape information of the current dispensing position corresponding to the dispensing nozzle; based on the surface contour shape information, determine the angular offset between the glue output end of the dispensing nozzle and the dispensing position, so as to adjust the aiming attitude angle of the dispensing nozzle relative to the dispensing position.

[0037] Optionally, the glue output adjustment module is used to adjust the glue output state of the dispensing nozzle at the dispensing position during the movement along the movement path based on the spatial shape feature information, including:

[0038] Based on the three-dimensional shape feature information of the glue accommodation space included in the spatial shape feature information of the matched dispensing area, determine the glue filling volume of the glue accommodation space; based on the glue filling volume and the movement speed of the dispensing nozzle along the movement path, adjust the glue output flow rate of the dispensing nozzle at the dispensing position during the movement along the movement path.

[0039] The dispensing curing operation adjustment module is used to adjust the curing operation state of the dispensing position based on the glue state information of the dispensing position, including:

[0040] Based on the range of the glue coverage area of the dispensing position, adjust the ultraviolet radiation intensity and radiation range of the ultraviolet curing operation of the dispensing position.

[0041] Compared with the prior art, the present invention has the following beneficial effects:

[0042] The dispensing processing method and system for printed circuit boards provided in this application visually recognize the spatial shape feature information of all dispensing areas on the surface of the printed circuit board; also track and recognize the relative position between the dispensing nozzle and the surface of the printed circuit board, so as to determine the dispensing area matched with the dispensing nozzle and control the spatial sequence of the dispensing operation of the dispensing nozzle on the printed circuit board; based on the spatial shape feature information of the dispensing area, determine the movement path of the dispensing nozzle, and visually recognize the shape information of the corresponding dispensing position during the movement of the dispensing nozzle, so as to adjust the aiming attitude of the dispensing nozzle relative to the dispensing position, ensure that the dispensing nozzle accurately outputs glue to the dispensing position, and avoid mis-dispensing; also based on the airborne shape feature information of the dispensing area, adjust the glue output state of the dispensing nozzle, and based on the glue state information of the dispensing position, adjust the curing operation state of the glue, avoid insufficient glue dispensing and glue overflow, and improve the production efficiency and qualified product rate of the printed circuit board. Brief Description of the Drawings

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings. Among them:

[0044] Figure 1 It is a schematic flow chart of the dispensing process for the printed circuit board provided by the present invention.

[0045] Figure 2 It is a schematic structural diagram of the dispensing system for the printed circuit board provided by the present invention. Detailed Description of the Embodiments

[0046] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will provide a detailed description of the specific embodiments of the present application in conjunction with the drawings. It can be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. Additionally, it should be noted that for the sake of convenience of description, only the parts related to the present application are shown in the drawings, rather than all the structures. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0047] The terms "include" and "have" and any variations thereof in the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products, or devices.

[0048] Referring to "embodiments" herein means that the specific features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0049] Please refer to Figure 1 As shown, a dispensing process for a printed circuit board provided by an embodiment of the present application. The dispensing process for the printed circuit board includes:

[0050] Visually identify the surface of the printed circuit board to determine the spatial shape feature information of each dispensing area on the surface of the printed circuit board; track and identify the dispensing nozzle to obtain the relative position information between the dispensing nozzle and the surface of the printed circuit board, and based on this relative position information, determine the dispensing area that matches the dispensing nozzle;

[0051] Based on the spatial shape feature information of the matching dispensing area, determine the movement path of the dispensing nozzle above the matching dispensing area; visually identify the movement of the dispensing nozzle along the movement path to obtain the shape information of the current dispensing position corresponding to the dispensing nozzle; based on the shape information of the dispensing position, adjust the aiming posture of the dispensing nozzle relative to the dispensing position;

[0052] Based on the spatial shape feature information, adjust the glue output state of the dispensing nozzle at the dispensing position during the movement along the movement path; and then based on the glue form information of the dispensing position, adjust the curing operation state of the dispensing position.

[0053] The beneficial effects of the above embodiments are that the dispensing processing method of the printed circuit board visually identifies the spatial shape feature information of all dispensing areas on the surface of the printed circuit board; it also tracks and identifies the relative position between the dispensing nozzle and the surface of the printed circuit board, thereby determining the dispensing area that matches the dispensing nozzle and controlling the spatial sequence of the dispensing operation of the dispensing nozzle on the printed circuit board; based on the spatial shape feature information of the dispensing area, determine the movement path of the dispensing nozzle, and visually identify the shape information of the corresponding dispensing position during the movement of the dispensing nozzle, so as to adjust the aiming posture of the dispensing nozzle relative to the dispensing position, ensure that the dispensing nozzle accurately outputs glue to the dispensing position, and avoid mis-dispensing; it also adjusts the glue output state of the dispensing nozzle based on the airborne shape feature information of the dispensing area, and adjusts the curing operation state of the glue based on the glue form information of the dispensing position, avoiding insufficient glue dispensing and glue overflow, and improving the production efficiency and yield rate of the printed circuit board.

[0054] In another embodiment, visually identify the surface of the printed circuit board to determine the spatial shape feature information of each dispensing area on the surface of the printed circuit board; track and identify the dispensing nozzle to obtain the relative position information between the dispensing nozzle and the surface of the printed circuit board, and based on this relative position information, determine the dispensing area that matches the dispensing nozzle, including:

[0055] Perform three-dimensional visual identification on the surface of the printed circuit board to obtain the three-dimensional contour feature information of all dispensing areas on the surface of the printed circuit board; based on this three-dimensional contour feature information, determine the spatial shape feature information of each dispensing area on the surface of the printed circuit board; wherein, the spatial shape feature information includes the three-dimensional shape feature information of the glue accommodation space of the dispensing area;

[0056] Based on the characteristic structure of the dispensing nozzle, the dispensing nozzle is tracked and identified to obtain the relative distance information and relative orientation information between the dispensing nozzle and the surface of the printed circuit board; based on the relative distance information and relative orientation information, the dispensing area closest to the dispensing nozzle is determined, and this is used as the dispensing area matched with the dispensing nozzle.

[0057] The beneficial effects of the above embodiments are as follows. Different types of electronic components are arranged on the surface of the printed circuit board according to the corresponding circuit structure. These electronic components are electrically connected and fixed to the printed circuit board through conductive epoxy resin, and the different electronic components are also connected by conductive wires formed by conductive epoxy resin. In order to ensure that the conductive epoxy resin glue can be accurately output to the specified area on the surface of the printed circuit board, a number of recesses for accommodating and loading the glue are formed on the surface of the printed circuit board. During the actual dispensing operation, the dispensing nozzle only needs to be aligned with the recesses to inject the glue to achieve the electrical connection and fixation of the electronic components. In order to enable the dispensing nozzle to continuously and dynamically inject glue into all the recesses on the printed circuit board for accommodating and loading the glue, three-dimensional vision recognition is performed on the surface of the printed circuit board to obtain the three-dimensional contour feature information of all the dispensing areas on the surface of the printed circuit board, that is, the three-dimensional contour feature information of all the recesses on the surface of the printed circuit board. Based on this three-dimensional contour feature information, the three-dimensional shape features such as the depth and the shape and size of the caliber of the glue accommodating space of all the dispensing areas on the surface of the printed circuit board are comprehensively characterized, providing a reliable basis for adjusting the dispensing action of the dispensing nozzle in the future. In addition, for the characteristic structures such as the glue output port of the dispensing nozzle itself, visual tracking and recognition are performed on the dispensing nozzle to obtain the relative distance information and relative orientation information between the dispensing nozzle and the surface of the printed circuit board. By comparing this with the distribution position information of all the dispensing areas on the surface of the printed circuit board, the dispensing area closest to the dispensing nozzle is determined. In this way, the dispensing nozzle is controlled to preferentially perform the dispensing operation on the dispensing area closest to it, and this is used as the dispensing area matched with the dispensing nozzle to ensure that the dispensing nozzle orderly performs the dispensing operation on all the dispensing areas on the surface of the printed circuit board.

[0058] In another embodiment, based on the spatial shape feature information of the matched dispensing area, the movement path of the dispensing nozzle above the matched dispensing area is determined; visual recognition is performed on the movement of the dispensing nozzle along the movement path to obtain the shape information of the current dispensing position corresponding to the dispensing nozzle; based on the shape information of the dispensing position, the aiming posture of the dispensing nozzle relative to the dispensing position is adjusted, including:

[0059] Based on the three-dimensional shape feature information of the glue accommodating space included in the spatial shape feature information of the matched dispensing area, the extension path of the matched dispensing area on the surface of the printed circuit board is obtained, and based on this, the movement path of the dispensing nozzle above the matched dispensing area is determined;

[0060] Perform visual recognition on the movement of the dispensing nozzle along the movement path to obtain the surface contour shape information of the current dispensing position corresponding to the dispensing nozzle; based on the surface contour shape information, determine the angular offset between the glue output end of the dispensing nozzle and the dispensing position, so as to adjust the aiming attitude angle of the dispensing nozzle relative to the dispensing position.

[0061] The beneficial effects of the above embodiments are as follows. The dispensing area includes multiple glue accommodating spaces (i.e., recessed parts) that need to be filled with glue, and the sizes and shapes of each glue accommodating space are different. In order to continuously and stably inject glue into all the glue accommodating spaces in the dispensing area by the dispensing nozzle, based on the three-dimensional shape feature information of the glue accommodating spaces included in the spatial shape feature information of the matching dispensing area, obtain the extension path of the matching dispensing area on the surface of the printed circuit board, and determine the movement path of the dispensing nozzle above the matching dispensing area with this extension path as the reference, which is convenient to control the dispensing nozzle to continuously inject glue into all the glue accommodating cavities in the matching dispensing area during the movement along the movement path. Also, perform visual recognition on the movement of the dispensing nozzle along the movement path to obtain the surface contour shape information of the current dispensing position corresponding to the dispensing nozzle, where the surface contour shape information can be but is not limited to the surface contour inclination angle information of the dispensing position (i.e., at least part of the spatial position of the glue accommodating space), etc.; then based on the surface contour shape information, determine the angular offset between the glue output end of the dispensing nozzle and the dispensing position (i.e., the included angle between the central axis of the glue output end of the dispensing nozzle and the surface normal of the dispensing position), so as to adjust the aiming attitude angle of the dispensing nozzle relative to the dispensing position, so that the central axis of the glue output end of the dispensing nozzle coincides with the surface normal of the dispensing position, ensuring that the glue output by the dispensing nozzle is accurately injected into the dispensing position and preventing the glue output by the dispensing nozzle from being mis-injected into other positions.

[0062] In another embodiment, based on the spatial shape feature information, adjust the glue output state of the dispensing nozzle to the dispensing position during the movement along the movement path; then based on the glue state information of the dispensing position, adjust the curing operation state of the dispensing position, including:

[0063] Based on the three-dimensional shape feature information of the glue accommodating spaces included in the spatial shape feature information of the matching dispensing area, determine the glue filling volume of the glue accommodating space; based on the glue filling volume and the movement speed of the dispensing nozzle along the movement path, adjust the glue output flow rate of the dispensing nozzle to the dispensing position during the movement along the movement path.

[0064] Based on the glue coverage area range of the dispensing position, adjust the ultraviolet radiation intensity and radiation range of the ultraviolet curing operation for the dispensing position.

[0065] The beneficial effects of the above embodiments are as follows. The dispensing area includes a plurality of glue liquid accommodation spaces (i.e., recessed parts) that need to be filled with glue liquid. The sizes and shapes of each glue liquid accommodation space are different, so the volume of glue liquid to be injected into each glue liquid accommodation space is also different. Among them, if the injected volume of glue liquid is too small, the effective and stable electrical connection of the electronic components cannot be ensured; if the injected volume of glue liquid is too large, the glue liquid is likely to overflow, resulting in a short circuit in the connection of the electronic components. The actual filled volume of glue liquid in each glue liquid accommodation space directly affects the dispensing quality. In order to accurately control the filled volume of glue liquid in each glue liquid accommodation space, based on the three-dimensional shape feature information of the glue liquid accommodation space included in the spatial shape feature information of the matching dispensing area, the filled volume of glue liquid in the glue liquid accommodation space is determined. Based on the filled volume of glue liquid and the movement speed of the dispensing nozzle along the movement path, the glue output flow rate at the dispensing position during the movement of the dispensing nozzle along the movement path is adjusted to ensure that the glue liquid is uniformly output and injected into the glue liquid accommodation space during the movement of the dispensing nozzle, ensuring that the glue liquid accommodation space is effectively filled with glue liquid. Also, when the dispensing is completed, the glue liquid needs to be irradiated with ultraviolet light to cure and form. In order to improve the curing and forming speed of the glue liquid, based on the coverage area range of the glue liquid at the dispensing position, the ultraviolet radiation intensity and radiation range of the ultraviolet curing operation at the dispensing position are adjusted to improve the production efficiency and the yield rate of the printed circuit board. In another embodiment, based on the spatial shape feature information, the glue output state at the dispensing position during the movement of the dispensing nozzle along the movement path is adjusted, including:

[0066] Step S1, using the following formula (1), according to whether there is glue liquid drawing, the length of the glue liquid drawing, and the thickness state of the drawing during the movement of the dispensing nozzle along the movement path to control the enabling of the dispensing nozzle, (1) In the above formula (1), represents the enabling control value of the dispensing nozzle at time represents the presence recognition value of the glue liquid drawing at time. If , it means that there is glue liquid drawing at time . If , it means that there is no glue liquid drawing at time ; represents the cross-sectional diameter of the glue liquid drawing at time represents the length value of the glue liquid drawing at time represents logical AND. If all the arithmetic expressions between the logical ANDs are established, the overall output value is 1. If there is one or more arithmetic expressions that do not hold among all the arithmetic expressions between the logical ANDs, the overall output value is 0; Represents the minimum cross-sectional diameter of the glue filament drawn; Represents the minimum length of the glue filament drawn;

[0067] Step S2, when the dispensing nozzle is enabled and opened, using the following formula (2), according to the length of the glue filament drawn and the thickness state of the drawn filament, control the rotation speed of the dispensing nozzle, (2) In the above formula (2), Represents when the dispensing nozzle is enabled and opened, The rotation speed of the dispensing nozzle at this moment; Represents the maximum controllable rotation speed of the dispensing nozzle; Represents the natural constant;

[0068] Step S3, using the following formula (3), according to the stagnation duration of the glue at the previous dispensing position, the longest length of the drawn filament, and the thickness state of the drawn filament, control the stagnation duration of the glue when dispensing at the next dispensing position, (3) In the above formula (3), Represents the stagnation duration of the glue when dispensing at the next dispensing position. If it is the first dispensing position, the stagnation duration of the glue when dispensing is the initially set duration; Represents the stagnation duration of the glue when dispensing at the previous dispensing position; Represents the longest length of the glue filament drawn at the previous dispensing position; Represents the maximum cross-sectional diameter of the glue filament drawn at the previous dispensing position; Represents obtaining and The maximum value in.

[0069] The beneficial effects of the above embodiments are as follows: Using the above formula (1), according to whether there is a situation of glue filament drawing in the glue output state of the dispensing position during the movement of the dispensing nozzle along the movement path, the length of the glue filament drawn, and the thickness state of the drawn filament, control the enabling of the dispensing nozzle, so as to turn off the enabling to reduce the system power consumption when no filament drawing control is required; then using the above formula (2), according to the length of the glue filament drawn and the thickness state of the drawn filament, control the rotation speed of the dispensing nozzle, and further avoid glue splashing caused by too fast rotation when the filament is long during the process of breaking the filament by rotation; then using the above formula (3), according to the stagnation duration of the glue at the previous dispensing position, the longest length of the drawn filament, and the thickness state of the drawn filament, control the stagnation duration of the glue when dispensing at the next dispensing position, so as to continuously optimize the system through the algorithm to reduce the generation of filaments.

[0070] Please refer to Figure 2As shown in the figure, a dispensing processing system for a printed circuit board provided by an embodiment of the present application. The dispensing processing system for the printed circuit board includes:

[0071] A dispensing area shape recognition module, which is used to perform visual recognition on the surface of the printed circuit board to determine the spatial shape feature information of each dispensing area on the surface of the printed circuit board;

[0072] A dispensing area matching and determination module, which is used to track and recognize the dispensing nozzle to obtain the relative position information between the dispensing nozzle and the surface of the printed circuit board, and based on the relative position information, determine the dispensing area that matches the dispensing nozzle;

[0073] A nozzle movement path determination module, which is used to determine the movement path of the dispensing nozzle above the matching dispensing area based on the spatial shape feature information of the matching dispensing area;

[0074] A nozzle aiming attitude adjustment module, which is used to perform visual recognition on the movement of the dispensing nozzle along the movement path to obtain the shape information of the current dispensing position corresponding to the dispensing nozzle; based on the shape information of the dispensing position, adjust the aiming attitude of the dispensing nozzle relative to the dispensing position;

[0075] A glue output adjustment module, which is used to adjust the glue output state of the dispensing nozzle at the dispensing position during the movement along the movement path based on the spatial shape feature information;

[0076] A dispensing curing operation adjustment module, which is used to adjust the curing operation state of the dispensing position based on the glue form information of the dispensing position.

[0077] The beneficial effects of the above embodiment are that the dispensing processing system for the printed circuit board visually recognizes the spatial shape feature information of all dispensing areas on the surface of the printed circuit board; it also tracks and recognizes the relative position between the dispensing nozzle and the surface of the printed circuit board, thereby determining the dispensing area that matches the dispensing nozzle, and controlling the spatial sequence of the dispensing operation of the dispensing nozzle on the printed circuit board; based on the spatial shape feature information of the dispensing area, determine the movement path of the dispensing nozzle, and visually recognize the shape information of the corresponding dispensing position during the movement of the dispensing nozzle, thereby adjusting the aiming attitude of the dispensing nozzle relative to the dispensing position to ensure that the dispensing nozzle accurately outputs glue to the dispensing position and avoid mis-dispensing; it also adjusts the glue output state of the dispensing nozzle based on the airborne shape feature information of the dispensing area, and adjusts the curing operation state of the glue based on the glue form information of the dispensing position, avoiding insufficient glue dispensing and glue overflow, and improving the production efficiency and product qualification rate of the printed circuit board.

[0078] In another embodiment, the dispensing area shape recognition module is used to perform visual recognition on the surface of the printed circuit board to determine the spatial shape feature information of each dispensing area on the surface of the printed circuit board, including:

[0079] Perform three-dimensional visual recognition on the surface of the printed circuit board to obtain the three-dimensional contour feature information of all the dispensing areas on the surface of the printed circuit board; based on the three-dimensional contour feature information, determine the spatial shape feature information of each of the dispensing areas on the surface of the printed circuit board; wherein, the spatial shape feature information includes the three-dimensional shape feature information of the glue accommodating space of the dispensing area.

[0080] The dispensing area matching determination module is used to perform tracking recognition on the dispensing nozzle to obtain the relative position information between the dispensing nozzle and the surface of the printed circuit board, and based on the relative position information, determine the dispensing area matching the dispensing nozzle, including:

[0081] Based on the characteristic structure of the dispensing nozzle, perform tracking recognition on the dispensing nozzle to obtain the relative distance information and relative orientation information between the dispensing nozzle and the surface of the printed circuit board; based on the relative distance information and relative orientation information, determine the dispensing area closest to the dispensing nozzle, and use this as the dispensing area matching the dispensing nozzle.

[0082] The beneficial effects of the above embodiments are as follows. Different types of electronic components are arranged on the surface of the printed circuit board according to the corresponding circuit structure. These electronic components are electrically connected and fixed to the printed circuit board through conductive epoxy resin, and the conductive wires formed by the conductive epoxy resin are also used to connect between different electronic components. In order to ensure that the conductive epoxy resin glue can be accurately output to the designated area on the surface of the printed circuit board, several recesses for accommodating and loading the glue are formed on the surface of the printed circuit board. During the actual dispensing operation, the dispensing nozzle only needs to be aligned with the recesses to inject the glue to achieve the electrical connection and fixation of the electronic components. In order to enable the dispensing nozzle to continuously and dynamically inject the glue into all the recesses on the printed circuit board for accommodating and loading the glue, perform three-dimensional visual recognition on the surface of the printed circuit board to obtain the three-dimensional contour feature information of all the dispensing areas on the surface of the printed circuit board, that is, the three-dimensional contour feature information of all the recesses on the surface of the printed circuit board, and based on this three-dimensional contour feature information, comprehensively characterize the three-dimensional shape features such as the depth and the size of the diameter shape of the glue accommodating space of all the dispensing areas on the surface of the printed circuit board, providing a reliable basis for adjusting the dispensing action of the dispensing nozzle subsequently. Moreover, for the characteristic structures such as the glue output port of the dispensing nozzle itself, perform visual tracking recognition on the dispensing nozzle to obtain the relative distance information and relative orientation information between the dispensing nozzle and the surface of the printed circuit board, and compare this with the distribution position information of all the dispensing areas on the surface of the printed circuit board to determine the dispensing area closest to the dispensing nozzle. In this way, control the dispensing nozzle to preferentially perform the dispensing operation on the dispensing area closest to this distance, and use this as the dispensing area matching the dispensing nozzle to ensure that the dispensing nozzle orderly performs the dispensing operation on all the dispensing areas on the surface of the printed circuit board.

[0083] In another embodiment, the nozzle movement path determination module is configured to determine the movement path of the dispensing nozzle above the matched dispensing area based on the spatial shape feature information of the matched dispensing area, including:

[0084] Based on the three-dimensional shape feature information of the glue storage space included in the spatial shape feature information of the matched dispensing area, obtain the extension path of the matched dispensing area on the surface of the printed circuit board, and thereby determine the movement path of the dispensing nozzle above the matched dispensing area;

[0085] The nozzle aiming attitude adjustment module is configured to perform visual recognition on the movement of the dispensing nozzle along the movement path to obtain the shape information of the current dispensing position corresponding to the dispensing nozzle; based on the shape information of the dispensing position, adjust the aiming attitude of the dispensing nozzle relative to the dispensing position, including:

[0086] Perform visual recognition on the movement of the dispensing nozzle along the movement path to obtain the surface contour shape information of the current dispensing position corresponding to the dispensing nozzle; based on the surface contour shape information, determine the angular offset between the glue output end of the dispensing nozzle and the dispensing position, thereby adjusting the aiming attitude angle of the dispensing nozzle relative to the dispensing position.

[0087] The beneficial effects of the above embodiment are as follows. The dispensing area includes multiple glue storage spaces (i.e., recessed parts) that need to be filled with glue, and the sizes and shapes of each glue storage space are different. In order to enable the dispensing nozzle to continuously and stably inject glue into all the glue storage spaces in the dispensing area, based on the three-dimensional shape feature information of the glue storage space included in the spatial shape feature information of the matched dispensing area, obtain the extension path of the matched dispensing area on the surface of the printed circuit board, and determine the movement path of the dispensing nozzle above the matched dispensing area based on this extension path, which is convenient for controlling the dispensing nozzle to continuously inject glue into all the glue storage cavities in the matched dispensing area during the movement along this movement path. Additionally, perform visual recognition on the movement of the dispensing nozzle along the movement path to obtain the surface contour shape information of the current dispensing position corresponding to the dispensing nozzle, where the surface contour shape information can be, but is not limited to, the surface contour inclination angle information of the dispensing position (i.e., at least part of the spatial position of the glue storage space), etc.; then based on the surface contour shape information, determine the angular offset between the glue output end of the dispensing nozzle and the dispensing position (i.e., the included angle between the central axis of the glue output end of the dispensing nozzle and the surface normal of the dispensing position), thereby adjusting the aiming attitude angle of the dispensing nozzle relative to the dispensing position, so that the central axis of the glue output end of the dispensing nozzle coincides with the surface normal of the dispensing position, ensuring that the glue output by the dispensing nozzle is accurately injected into the dispensing position and avoiding the glue output by the dispensing nozzle from being wrongly injected into other positions.

[0088] In another embodiment, the glue output adjustment module is configured to adjust the glue output state at the dispensing position during the movement of the dispensing nozzle along the movement path based on the spatial shape feature information, including:

[0089] Determine the glue filling volume of the glue accommodation space based on the three-dimensional shape feature information of the glue accommodation space included in the spatial shape feature information of the matched dispensing area; adjust the glue output flow rate at the dispensing position during the movement of the dispensing nozzle along the movement path based on the glue filling volume and the movement speed of the dispensing nozzle along the movement path.

[0090] The glue curing operation adjustment module is configured to adjust the curing operation state at the dispensing position based on the glue morphology information at the dispensing position, including:

[0091] Adjust the ultraviolet radiation intensity and radiation range of the ultraviolet curing operation at the dispensing position based on the glue coverage area range at the dispensing position.

[0092] The beneficial effects of the above embodiments are as follows. The dispensing area includes multiple glue accommodation spaces (i.e., recesses) that need to be injected with glue, and the sizes and shapes of each glue accommodation space are different, so the volume of glue to be injected into each glue accommodation space is also different. Among them, if the injected glue volume is too small, the effective and stable electrical connection of the electronic components cannot be guaranteed; if the injected glue volume is too large, the glue is likely to overflow, resulting in a short circuit in the connection of the electronic components. The actual glue filling volume of each glue accommodation space directly affects the dispensing quality. To accurately control the glue filling volume of each glue accommodation space, determine the glue filling volume of the glue accommodation space based on the three-dimensional shape feature information of the glue accommodation space included in the spatial shape feature information of the matched dispensing area, and adjust the glue output flow rate at the dispensing position during the movement of the dispensing nozzle along the movement path based on the glue filling volume and the movement speed of the dispensing nozzle along the movement path, so as to ensure that the glue is uniformly output and injected into the glue accommodation space during the movement of the dispensing nozzle, and ensure that the glue accommodation space is effectively filled with glue. Also, when the dispensing is completed, the glue needs to be irradiated with ultraviolet light to cure and form. To improve the curing and forming speed of the glue, adjust the ultraviolet radiation intensity and radiation range of the ultraviolet curing operation at the dispensing position based on the glue coverage area range at the dispensing position, so as to improve the production efficiency and yield rate of the printed circuit board.

[0093] Generally speaking, the dispensing processing method and system of the printed circuit board visually identify the spatial shape feature information of all dispensing areas on the surface of the printed circuit board; also track and identify the relative position between the dispensing nozzle and the surface of the printed circuit board to determine the dispensing area matching the dispensing nozzle and control the spatial sequence of the dispensing operation of the dispensing nozzle on the printed circuit board; based on the spatial shape feature information of the dispensing area, determine the movement path of the dispensing nozzle, and visually identify the shape information of the corresponding dispensing position during the movement of the dispensing nozzle, so as to adjust the aiming posture of the dispensing nozzle relative to the dispensing position, ensure that the dispensing nozzle accurately outputs glue to the dispensing position, and avoid mis-dispensing; also adjust the glue output state of the dispensing nozzle based on the airborne shape feature information of the dispensing area, and adjust the curing operation state of the glue based on the glue form information of the dispensing position, avoid insufficient glue dispensing and glue overflow, and improve the production efficiency and yield rate of the printed circuit board.

[0094] The above is only a specific embodiment of the present invention, and any improvement made on the premise of the present invention's concept is regarded as the protection scope of the present invention.

Claims

1. A dispensing method for a printed circuit board, characterized in that, Including: Performing visual recognition on the surface of a printed circuit board to determine the spatial shape feature information of each dispensing area on the surface of the printed circuit board; Tracking and recognizing a dispensing nozzle to obtain the relative position information between the dispensing nozzle and the surface of the printed circuit board, and based on the relative position information, determining the dispensing area matching the dispensing nozzle; Based on the spatial shape feature information of the matching dispensing area, determining the movement path of the dispensing nozzle above the matching dispensing area; performing visual recognition on the movement of the dispensing nozzle along the movement path to obtain the shape information of the current dispensing position corresponding to the dispensing nozzle; Based on the shape information of the dispensing position, adjusting the aiming posture of the dispensing nozzle relative to the dispensing position; Based on the spatial shape feature information, adjusting the glue output state of the dispensing nozzle at the dispensing position during the movement of the dispensing nozzle along the movement path; Then, based on the glue form information of the dispensing position, adjusting the curing operation state of the dispensing position; Wherein, based on the spatial shape feature information, adjusting the glue output state of the dispensing nozzle at the dispensing position during the movement of the dispensing nozzle along the movement path includes: Step S1, using the following formula (1), controlling the enabling of the dispensing nozzle according to whether there is glue wire drawing, the length of the glue wire drawing, and the thickness state of the glue wire drawing in the glue output state of the dispensing nozzle at the dispensing position during the movement of the dispensing nozzle along the movement path; E(t)=[S(t)=1]&&[D(t)≥D min ]&&[L(t)≥L min ] (1) In the above formula (1), E(t) represents the enabling control value of the dispensing nozzle at time t; S(t) represents the presence recognition value of the glue wire drawing at time t. If S(t) = 1, it means that there is glue wire drawing at time t. If S(t) = 0, it means that there is no glue wire drawing at time t; D(t) represents the cross-sectional diameter of the glue wire drawing at time t; L(t) represents the length value of the glue wire drawing at time t; && represents logical AND. If all the arithmetic expressions between the logical ANDs are established, the overall output value is 1. If there is one or more arithmetic expressions that do not hold among all the arithmetic expressions between the logical ANDs, the overall output value is 0; D min represents the minimum cross-sectional diameter of the glue wire drawing; L min represents the minimum length of the glue wire drawing; Step S2, when the enabling of the dispensing nozzle is turned on, using the following formula (2), controlling the rotation speed of the dispensing nozzle according to the length of the glue wire drawing and the thickness state of the glue wire drawing; In the above formula (2), V(t) represents the rotational speed of the dispensing nozzle at time t when the dispensing nozzle is enabled to open; V max represents the maximum controllable rotational speed of the dispensing nozzle; e represents the natural constant; Step S3, using the following formula (3), controlling the glue stagnation time when dispensing at the next dispensing position according to the glue stagnation time, the longest length of the wire drawing, and the thickness state of the wire drawing at the previous dispensing position; In the above formula (3), T next represents the dwell time of the glue during dispensing at the next dispensing position. If it is the first dispensing position, the dwell time of the glue during dispensing is the initially set time; T previous represents the dwell time of the glue during dispensing at the previous dispensing position; L M represents the maximum length of the glue string at the previous dispensing position; D M represents the maximum cross-sectional diameter of the glue string at the previous dispensing position; represents obtaining and the maximum value of 0.

2. The dispensing processing method for a printed circuit board according to claim 1, wherein: Performing visual recognition on the surface of a printed circuit board to determine the spatial shape feature information of each dispensing area on the surface of the printed circuit board; tracking and recognizing a dispensing nozzle to obtain the relative position information between the dispensing nozzle and the surface of the printed circuit board, and based on the relative position information, determining the dispensing area matching the dispensing nozzle, including: Performing three-dimensional visual recognition on the surface of the printed circuit board to obtain the three-dimensional contour feature information of all dispensing areas on the surface of the printed circuit board; based on the three-dimensional contour feature information, determining the spatial shape feature information of each dispensing area on the surface of the printed circuit board; wherein, the spatial shape feature information includes the three-dimensional shape feature information of the glue accommodating space of the dispensing area; Based on the characteristic structure of the dispensing nozzle, tracking and recognizing the dispensing nozzle to obtain the relative distance information and relative azimuth information between the dispensing nozzle and the surface of the printed circuit board; based on the relative distance information and relative azimuth information, determining the dispensing area closest to the dispensing nozzle as the dispensing area matching the dispensing nozzle.

3. The dispensing method for a printed circuit board according to claim 1, wherein: Based on the spatial shape feature information of the matched dispensing area, determine the movement path of the dispensing nozzle above the matched dispensing area; perform visual recognition on the movement of the dispensing nozzle along the movement path to obtain the shape information of the current dispensing position corresponding to the dispensing nozzle; Based on the shape information of the dispensing position, adjust the aiming posture of the dispensing nozzle relative to the dispensing position, including: Based on the three-dimensional shape feature information of the glue accommodating space included in the spatial shape feature information of the matched dispensing area, obtain the extension path of the matched dispensing area on the surface of the printed circuit board, and thereby determine the movement path of the dispensing nozzle above the matched dispensing area; perform visual recognition on the movement of the dispensing nozzle along the movement path to obtain the surface contour shape information of the current dispensing position corresponding to the dispensing nozzle; Based on the surface contour shape information, determine the angular offset between the glue output end of the dispensing nozzle and the dispensing position, so as to adjust the aiming posture angle of the dispensing nozzle relative to the dispensing position.

4. The dispensing method for a printed circuit board according to claim 1, wherein: Based on the spatial shape feature information, adjust the glue output state of the dispensing nozzle at the dispensing position during the movement along the movement path; Then, based on the glue state information of the dispensing position, adjust the curing operation state of the dispensing position, including: Based on the three-dimensional shape feature information of the glue accommodating space included in the spatial shape feature information of the matched dispensing area, determine the glue filling volume of the glue accommodating space; based on the glue filling volume and the movement speed of the dispensing nozzle along the movement path, adjust the glue output flow rate of the dispensing nozzle at the dispensing position during the movement along the movement path; Based on the glue coverage area range of the dispensing position, adjust the ultraviolet radiation intensity and radiation range of the ultraviolet curing operation for the dispensing position.

5. A dispensing processing system for a printed circuit board, characterized in that Including: A dispensing area shape recognition module, configured to perform visual recognition on the surface of the printed circuit board to determine the spatial shape feature information of each dispensing area on the surface of the printed circuit board; A dispensing area matching determination module, configured to perform tracking recognition on the dispensing nozzle to obtain the relative position information between the dispensing nozzle and the surface of the printed circuit board, and based on the relative position information, determine the dispensing area matched with the dispensing nozzle; A nozzle movement path determination module, configured to determine the movement path of the dispensing nozzle above the matched dispensing area based on the spatial shape feature information of the matched dispensing area; A nozzle aiming posture adjustment module, configured to perform visual recognition on the movement of the dispensing nozzle along the movement path to obtain the shape information of the current dispensing position corresponding to the dispensing nozzle; Based on the shape information of the dispensing position, adjust the aiming posture of the dispensing nozzle relative to the dispensing position; The glue output adjustment module is used to adjust the glue output state of the dispensing nozzle at the dispensing position during the movement along the movement path based on the spatial shape feature information; The dispensing and curing operation adjustment module is used to adjust the curing operation state of the dispensing position based on the glue state information of the dispensing position; Among them, adjusting the glue output state of the dispensing nozzle at the dispensing position during the movement along the movement path based on the spatial shape feature information includes: Step S1: Using the following formula (1), according to whether there is glue drawing, the length of the glue drawing, and the thickness state of the glue drawing in the glue output state of the dispensing nozzle at the dispensing position during the movement along the movement path, control the enabling of the dispensing nozzle; E(t) = [S(t) = 1] && [D(t) ≥ D min && [L(t) ≥ L min (1) In the above formula (1), E(t) represents the enabling control value of the dispensing nozzle at time t; S(t) represents the presence recognition value of the glue wire drawing at time t. If S(t) = 1, it means that there is glue wire drawing at time t. If S(t) = 0, it means that there is no glue wire drawing at time t; D(t) represents the cross-sectional diameter of the glue wire drawing at time t; L(t) represents the length value of the glue wire drawing at time t; && represents logical AND. If all the arithmetic expressions between the logical ANDs are established, the overall output value is 1. If there is one or more arithmetic expressions among all the arithmetic expressions between the logical ANDs that are not established, the overall output value is 0; D min represents the minimum cross-sectional diameter of the glue wire drawing; L min represents the minimum length of the glue wire drawing; Step S2: When the enabling of the dispensing nozzle is turned on, use the following formula (2) to control the rotation speed of the dispensing nozzle according to the length of the glue drawing and the thickness state of the glue drawing; In the above formula (2), V(t) represents the rotational speed of the dispensing nozzle at time t when the dispensing nozzle is enabled to open; V max represents the maximum controllable rotational speed of the dispensing nozzle; e represents the natural constant; Step S3: Using the following formula (3), according to the glue stagnation duration, the longest length of the glue drawing, and the thickness state of the glue drawing at the previous dispensing position, control the glue stagnation duration when dispensing at the next dispensing position; In the above formula (3), T next represents the dwell time of the adhesive when dispensing at the next dispensing position. If it is the first dispensing position, the dwell time of the adhesive when dispensing is the initially set time; T previous represents the dwell time of the adhesive when dispensing at the previous dispensing position; L M represents the maximum length of the adhesive string at the previous dispensing position; D M represents the maximum cross-sectional diameter of the adhesive string at the previous dispensing position; represents obtaining and the maximum value of 0.

6. The dispensing processing system for a printed circuit board according to claim 5, wherein: The dispensing area shape recognition module is used to perform visual recognition on the surface of the printed circuit board to determine the spatial shape feature information of each dispensing area on the surface of the printed circuit board, including: Performing three-dimensional visual recognition on the surface of the printed circuit board to obtain the three-dimensional contour feature information of all dispensing areas on the surface of the printed circuit board; based on the three-dimensional contour feature information, determining the spatial shape feature information of each dispensing area on the surface of the printed circuit board; wherein, the spatial shape feature information includes the three-dimensional shape feature information of the glue accommodation space of the dispensing area; The dispensing area matching and determination module is used to perform tracking recognition on the dispensing nozzle to obtain the relative position information between the dispensing nozzle and the surface of the printed circuit board, and based on the relative position information, determine the dispensing area matching the dispensing nozzle, including: Based on the characteristic structure of the dispensing nozzle, performing tracking recognition on the dispensing nozzle to obtain the relative distance information and relative orientation information between the dispensing nozzle and the surface of the printed circuit board; based on the relative distance information and relative orientation information, determining the dispensing area closest to the dispensing nozzle as the dispensing area matching the dispensing nozzle.

7. The dispensing processing system for a printed circuit board according to claim 5, wherein: The nozzle movement path determination module is used to determine the movement path of the dispensing nozzle above the matching dispensing area based on the spatial shape feature information of the matching dispensing area, including: Based on the three-dimensional shape feature information of the glue accommodating space included in the spatial shape feature information of the matched dispensing area, obtain the extension path of the matched dispensing area on the surface of the printed circuit board, so as to determine the movement path of the dispensing nozzle above the matched dispensing area; the nozzle aiming attitude adjustment module is used to perform visual recognition on the movement of the dispensing nozzle along the movement path to obtain the shape information of the current dispensing position corresponding to the dispensing nozzle; based on the shape information of the dispensing position, adjust the aiming attitude of the dispensing nozzle relative to the dispensing position, including: Perform visual recognition on the movement of the dispensing nozzle along the movement path to obtain the surface contour shape information of the current dispensing position corresponding to the dispensing nozzle; based on the surface contour shape information, determine the angle offset between the glue output end of the dispensing nozzle and the dispensing position, so as to adjust the aiming attitude angle of the dispensing nozzle relative to the dispensing position.

8. The dispensing processing system for a printed circuit board according to claim 5, wherein: The glue output adjustment module is used to adjust the glue output state of the dispensing nozzle at the dispensing position during the movement along the movement path based on the spatial shape feature information, including: Based on the three-dimensional shape feature information of the glue accommodating space included in the spatial shape feature information of the matched dispensing area, determine the glue filling volume of the glue accommodating space; based on the glue filling volume and the movement speed of the dispensing nozzle along the movement path, adjust the glue output flow rate of the dispensing nozzle at the dispensing position during the movement along the movement path. The dispensing curing operation adjustment module is used to adjust the curing operation state of the dispensing position based on the glue form information of the dispensing position, including: Based on the glue coverage area range of the dispensing position, adjust the ultraviolet radiation intensity and radiation range of the ultraviolet curing operation for the dispensing position.

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