A method for detecting lamination performance and a lamination performance detection device

Abstract

This application belongs to the technical field of semiconductor manufacturing, and relates to a method for detecting press-fitting performance, which includes the following steps: setting preset parameters for the bonder head control mechanism, where the preset parameters include a detection threshold; the press-fitting mechanism performs a press-fitting process on the lead frame; the bonder head control mechanism controls the bonder head to apply a first pressure to the lead frame, and records the current encoder reading as the first detection value after the pressure is stabilized; the bonder head control mechanism controls the bonder head to apply a second pressure to the lead frame, and records the current encoder reading as the second detection value; calculating the detection difference between the first detection value and the second detection value; determining whether the detection threshold is greater than the detection difference; if so, the press-fitting performance of the lead frame is qualified. This application also relates to a device for detecting press-fitting performance. The technical solution provided by this application can improve the detection accuracy and detection efficiency of the press-fitting performance of the wire bonding machine.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor manufacturing, and more specifically, to a method for detecting pressing performance and a pressing performance detection device. Background Art

[0002] In the field of semiconductor package testing, a fully automatic wire bonder uses a bonding process of thermocompression ultrasonic ball bonding, and uses a metal wire to connect important positions in the semiconductor. Among them, the quality of the solder ball at one end of the wire is crucial, and the pressing performance of the wire bonder plays a key role in the product quality.

[0003] Currently, the detection of the pressing performance of wire bonding equipment is mainly carried out by an operator manually pressing the lead frame to be detected, and the operator judges by observing the shaking of the lead frame through a microscope. Since the force applied by the operator manually on the lead frame cannot ensure that the same force is used for each pressing, and there are differences in the operator's manual judgment, the detection standards for the pressing performance are inconsistent, the detection efficiency is slow. In addition, since the solder ball thickness of a semiconductor chip is usually in the micron range, it is difficult to observe micron-level disturbances of the lead frame even when using a microscope, resulting in poor detection accuracy of the pressing performance. Summary of the Invention

[0004] The technical problem to be solved by the embodiments of the present application is that the existing pressing performance detection method has slow detection efficiency, inconsistent detection standards, and poor detection accuracy, resulting in a low yield of products.

[0005] To solve the above technical problems, the embodiments of the present application provide a method for detecting pressing performance, and adopt the following technical solutions:

[0006] A method for detecting pressing performance includes the following steps:

[0007] Set preset parameters for the bonding head control mechanism, where the preset parameters include a detection threshold;

[0008] The pressing mechanism performs a pressing process on the lead frame;

[0009] The bonding head control mechanism controls the bonding head to apply a first pressure to the lead frame, and records the current encoder reading as the first detection value after the pressure is stabilized;

[0010] The bonding head control mechanism controls the bonding head to apply a second pressure to the lead frame, and records the current encoder reading as the second detection value;

[0011] Calculate the detection difference between the first detection value and the second detection value;

[0012] Judge whether the detection threshold is greater than the detection difference;

[0013] If so, the lamination performance of the lead frame is qualified.

[0014] Furthermore, the step of the lamination mechanism laminating the lead frame includes the following steps:

[0015] Set an initial lamination stroke within the lamination mechanism, where the initial lamination stroke is 5 mm to 10 mm;

[0016] The lamination mechanism controls the platen to move the initial lamination stroke to laminate the lead frame;

[0017] After maintaining for a first set time, the lamination mechanism controls the platen to reset, completing the lamination process of the lead frame.

[0018] Furthermore, when the detection threshold is less than the detection difference, the lamination performance of the lead frame is unqualified, and the lamination mechanism performs a secondary lamination process on the lead frame, where the secondary lamination process includes the following steps:

[0019] Correct the lamination stroke of the lamination mechanism, where the correction stroke is the sum of the initial lamination stroke and the compensation stroke, and the range of the compensation stroke is 2 μm to 1 mm;

[0020] The lamination mechanism controls the platen to move the correction stroke to perform a secondary lamination process on the lead frame;

[0021] After maintaining for a first set time, the lamination mechanism controls the platen to reset, completing the secondary lamination process of the lead frame.

[0022] Furthermore, the preset parameters further include a set deviation value, where the range of the set deviation value is 2 μm to 3 μm;

[0023] The pressure stabilization is detected through the following steps:

[0024] After the bonding head control mechanism controls the bonding head to apply a first pressure to the lead frame, the bonding head control mechanism records the current encoder reading as the third detection value;

[0025] After the first pressure is maintained for a second set time, the bonding head control mechanism records the current encoder reading as the fourth detection value, where the range of the second set time is 100 ms to 200 ms;

[0026] Calculate the difference between the third detection value and the fourth detection value, and determine whether the difference is less than the set deviation value. If so, proceed to the next step; otherwise, the bonding head control mechanism controls the bonding head to reset.

[0027] Further, the lead frame includes a border and at least two detection sub-units distributed in the border in a determinant array structure, and the preset parameters further include movement parameters;

[0028] After the step of the pressing mechanism pressing the leads, the following steps are included:

[0029] The bonding head control mechanism controls the bonding head to move to the target detection sub-unit based on the movement parameters;

[0030] The bonding head control mechanism controls the bonding head to apply a first pressure to the target detection sub-unit, and records the current encoder reading as the first detection value after the pressure is stabilized;

[0031] The bonding head control mechanism controls the bonding head to apply a second pressure to the target detection sub-unit, and records the current encoder reading as the second detection value;

[0032] Calculate the detection difference between the first detection value and the second detection value;

[0033] Judge whether the detection threshold is greater than the detection difference;

[0034] Yes, then the pressing performance of the target detection sub-unit is qualified, and proceed to the next step;

[0035] The bonding head control mechanism controls to move to the next detection sub-unit for detection based on the movement parameters.

[0036] Further, when the bonding head control mechanism controls the bonding head to complete the pressure performance detection of all the detection sub-units of the lead frame, the following steps are further included:

[0037] Normalize the detection differences of each detection sub-unit;

[0038] Draw the pressure performance cloud map of the lead frame.

[0039] Further, the pressure range of the first pressure is 25 g / mm 2 ~35 g / mm 2 ; and / or,

[0040] The pressure range of the second pressure is 80 g / mm 2 ~120 g / mm 2 ; and / or,

[0041] The range of the detection threshold is 18 μm to 20 μm.

[0042] To solve the above technical problems, an embodiment of the present application further provides a pressing performance detection device, which adopts the following technical solutions:

[0043] A press-fitting performance detection device is used to perform the detection method of the press-fitting performance as described above. Among them, the press-fitting performance detection device includes a bonding head control mechanism and a press-fitting mechanism. The press-fitting mechanism is used to carry a lead frame, and the bonding head control mechanism is used to detect the press-fitting performance of the lead frame;

[0044] The press-fitting mechanism includes a workbench, a lifting component and a pressing plate. The lifting component is installed on the workbench, and the pressing plate is installed on the lifting component. The workbench is used to carry the lead frame;

[0045] The bonding head control mechanism includes a bonding head mounting seat, a bonding head and an encoder. The bonding head is rotatably installed on the bonding head mounting seat, and the encoder is installed on the bonding head mounting seat. The encoder is used to detect the position data of the bonding head.

[0046] Furthermore, the bonding head control mechanism further includes a controller, and the controller is respectively connected to the bonding head mounting seat and the encoder;

[0047] The controller is built-in with preset parameters, and the preset parameters include a detection threshold and a set deviation value.

[0048] Furthermore, the bonding head control mechanism further includes a translation component. The bonding head mounting seat is installed on the translation component, and the translation component is connected to the controller. Among them, the preset parameters further include movement parameters;

[0049] The translation component is used to control the horizontal movement of the bonding head mounting seat relative to the press-fitting mechanism to adjust the position correspondence between the bonding head and each detection sub-unit of the lead frame.

[0050] Compared with the prior art, the embodiments of the present application mainly have the following beneficial effects:

[0051] The detection method of the press-fitting performance provided by the present application performs detection by applying a quantitative pressure to the lead frame through the bonding head, unifies the detection standard of the press-fitting performance, and based on the comparison between the detection difference value of the first detection value and the second detection value and the detection threshold, can quickly judge whether the press-fitting performance is qualified, improving the detection efficiency of the press-fitting performance; since the encoder reading is used to read the first detection value and the second detection value, it can monitor the disturbance at the micron level, improving the detection accuracy of the press-fitting performance and further improving the product qualification rate; in addition, by applying pressure to the lead frame twice through the bonding head and ensuring that the first pressure is stable before recording the first detection value, it can ensure the stable contact between the bonding head and the lead frame, avoiding the influence of the position deviation between the bonding head and the lead frame on the detection accuracy of the press-fitting performance and improving the detection accuracy of the press-fitting performance. Description of the Drawings

[0052] To more clearly illustrate the solution of this application, the accompanying drawings required for the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.

[0053] Figure 1 is a flowchart of the detection method for the lamination performance of the first embodiment of this application;

[0054] Figure 2 is a flowchart of the detection method for the lamination performance of the second embodiment of this application;

[0055] Figure 3 is a schematic structural diagram of the lead frame of the embodiment of this application;

[0056] Figure 4 is a schematic structural diagram of the lamination performance detection device of the embodiment of this application;

[0057] Figure 5 is the lamination performance cloud map drawn from the first lamination performance detection of the embodiment of this application.

[0058] Reference numerals:

[0059] 1. Bond head control mechanism; 11. Bond head mounting base; 12. Bond head; 13. Encoder; 14. Cantilever; 15. Translation assembly; 2. Lamination mechanism; 21. Workbench; 22. Lifting assembly; 23. Pressing plate; 3. Lead frame; 31. Frame; 32. Detection sub-unit. Detailed implementation manners

[0060] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above accompanying drawing descriptions are intended to cover non-exclusive inclusion. The terms "first", "second", etc. in the specification and claims of this application or the above accompanying drawings are used to distinguish different objects and not to describe a specific order.

[0061] Referring to "embodiment" herein means that the specific features, structures or characteristics described in connection with the embodiment can be included in at least one embodiment of this application. The appearance of this phrase in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0062] Example 1 of the detection method for the lamination performance of the present application

[0063] Please refer to Figure 1 As shown, the embodiment of the present application provides a detection method for lamination performance. In this embodiment, the lamination performance detection device detects the lamination performance of the entire lead frame.

[0064] In some embodiments, the detection method for the lamination performance includes the following steps:

[0065] Step S101, set preset parameters for the bonding head control mechanism.

[0066] In some embodiments, the bonding head control mechanism includes a controller, and the preset parameters are built in the controller. Among them, the preset parameters include a detection threshold, and the detection threshold is used to judge whether the lamination performance of the lead frame is qualified. In some embodiments, the range of the detection threshold is 18μm - 20μm. Specifically, the detection threshold can be set to any value among 18μm, 19μm, 20μm or the range formed between any two values.

[0067] Step S102, the lamination mechanism performs a lamination process on the lead frame.

[0068] In some embodiments, the lamination mechanism includes a workbench, a lifting assembly and a pressing plate. The lifting assembly is installed on the workbench, and the pressing plate is installed on the lifting assembly. The workbench is used to carry the lead frame; the lifting assembly controls the pressing plate to perform a lamination process on the lead frame. Subsequently, the lifting assembly controls the pressing plate to rise to facilitate the subsequent detection of the lamination performance of the lead frame.

[0069] Step S103, the bonding head control mechanism controls the bonding head to apply a first pressure to the lead frame, and records the current encoder reading as the first detection value after the pressure is stabilized.

[0070] In some embodiments, the bonding head control mechanism further includes a bonding head mounting seat, a bonding head and an encoder. The bonding head is rotatably installed on the bonding head mounting seat, and the encoder is installed on the bonding head mounting seat. The encoder is used to detect the position data of the bonding head; in the initial state, the bonding head abuts against the surface of the lead frame. During operation, the bonding head mounting seat controls the bonding head to rotate a certain angle to apply a first pressure to the lead frame, and the encoder records the moving distance of the bonding head and inputs the encoder reading into the controller.

[0071] In some embodiments, the pressure range of the first pressure is 25g / mm 2 ~35g / mm 2, specifically, the magnitude of the first pressure can be set to 25 g / mm 2 , 30 g / mm 2 , 35 g / mm 2 or any range formed between any two of these values.

[0072] Step S104, the bonding head control mechanism controls the bonding head to apply a second pressure to the lead frame, and records the current encoder reading as the second detection value.

[0073] In some embodiments, the second pressure is greater than the first pressure, where the pressure range of the second pressure is 80 g / mm 2 to 120 g / mm 2 , specifically, the magnitude of the first pressure can be set to 80 g / mm 2 , 90 g / mm 2 , 100 g / mm 2 , 110 g / mm 2 , 120 g / mm 2 or any range formed between any two of these values.

[0074] Step S105, calculate the detection difference between the first detection value and the second detection value.

[0075] Step S106, determine whether the detection threshold is greater than the detection difference.

[0076] Step S1061, when the detection threshold is greater than the detection difference, the pressing performance of the lead frame is qualified, and the detection of the pressing performance of the lead frame ends.

[0077] Step S1062, when the detection threshold is less than the detection difference, the pressing performance of the lead frame is unqualified, return to step S102, and the pressing mechanism performs secondary pressing on the lead frame.

[0078] In this embodiment, after the pressing mechanism completes the pressing of the lead frame, the bonding head control mechanism controls the bonding head to apply pressure to the lead frame twice. Through the first pressure application, the positioning of the bonding head and the lead frame is achieved, and through the second pressure application, the detection of the pressing performance of the lead frame is realized.

[0079] The detection method for lamination performance provided by this application detects by applying a quantitative pressure to the lead frame through the bonding head, unifies the detection standard for lamination performance, and can quickly judge whether the lamination performance is qualified based on the comparison between the detection difference of the first detection value and the second detection value and the detection threshold, improving the detection efficiency of lamination performance; since the encoder reading is used to read the first detection value and the second detection value, the monitoring of perturbations at the micron level can be achieved, improving the detection accuracy of lamination performance and further increasing the yield rate of products; in addition, by applying pressure to the lead frame twice through the bonding head and ensuring that the first detection value is recorded after the first pressure is applied stably, the stable contact between the bonding head and the lead frame can be ensured, avoiding the influence of the positional deviation between the bonding head and the lead frame on the detection accuracy of lamination performance and improving the detection accuracy of lamination performance.

[0080] In some embodiments, in step S102, the step of the lamination mechanism performing lamination processing on the lead frame specifically includes the following steps:

[0081] Set an initial lamination stroke in the lamination mechanism.

[0082] In some embodiments, the initial lamination stroke is set to 5 mm to 10 mm. Specifically, the initial lamination stroke is set to any value among 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm or the range formed between any two values. In this embodiment, the initial lamination stroke is preferably 5 mm.

[0083] The lamination mechanism controls the pressing plate to move the initial lamination stroke to perform lamination processing on the lead frame.

[0084] After maintaining for the first set time, the lamination mechanism controls the pressing plate to reset to complete the lamination processing on the lead frame.

[0085] In this embodiment, the first set time is set to 2 s to 3 s. Specifically, the lamination time of the lamination mechanism for the lead frame is set to any value among 2 s and 3 s or the range formed between any two values.

[0086] Based on the initial lamination stroke already set in the lamination mechanism in step S102, after the judgment in step S106, when entering step S1062 and the detection threshold is less than the detection difference, and the lamination performance of the lead frame is unqualified, the lamination mechanism performs secondary lamination processing on the lead frame. Among them, the secondary lamination processing includes the following steps:

[0087] Correct the lamination stroke of the lamination mechanism.

[0088] In some embodiments, the correction stroke is the sum of the initial pressing stroke and the compensation stroke, and the range of the compensation stroke is 2 μm to 1 mm. Specifically, the range of the compensation stroke can be any value among 2 μm, 5 μm, 10 μm, 20 μm, 50 μm, 100 μm, 200 μm, 500 μm, 1 mm or the range formed between any two values. In order to improve the pressing efficiency of the lead frame and avoid damage to the lead frame by the pressing plate, in this embodiment, the compensation stroke is set to 2 μm.

[0089] The pressing mechanism controls the pressing plate to move the correction stroke to perform a secondary pressing process on the lead frame.

[0090] After maintaining for the first set time, the pressing mechanism controls the pressing plate to reset, completing the secondary pressing process on the lead frame.

[0091] In this embodiment, after the steps of the secondary pressing process described above, steps S103 to S106 are used to further detect the pressing performance of the lead frame after the secondary pressing process. If the requirements of step S1061 are met, the pressing performance of the lead frame after the secondary pressing process is qualified, the detection of the pressing performance is stopped, and the corrected correction stroke in the steps of the secondary pressing process described above is used as the initial pressing stroke for subsequent pressing processes; if it enters step S1062, it is further corrected on the basis of the corrected correction stroke in the steps of the secondary pressing process described above, and further pressing processes are performed with the corrected pressing stroke until the pressing performance of the lead frame after the pressing process meets the requirements of step S1061.

[0092] By presetting the compensation stroke in the embodiments of the present application, when the current pressing performance detection is unqualified, the initial pressing stroke is increased by the set stroke at least once, so that after the lead frame is subjected to secondary pressing or multiple pressings, the pressing detection standard is met, so as to obtain the optimal pressing stroke distance that meets the pressing detection standard and improve the detection efficiency and processing efficiency of the subsequent pressing of the lead frame.

[0093] In some embodiments, the preset parameter further includes a set deviation value, and the set deviation value is used to determine whether the relative position of the bonding head and the lead frame in step S103 is stable. Among them, the range of the set deviation value is 2 μm to 3 μm. Specifically, the range of the set deviation value can be set to any value among 2 μm, 2.5 μm, 3 μm or the range formed between any two values.

[0094] In some embodiments, the pressure stability in step S103 is detected by the following steps:

[0095] After the bonding head control mechanism controls the bonding head to apply a first pressure to the lead frame, the bonding head control mechanism records the current encoder reading as the third detection value.

[0096] After the first pressure is maintained for a second set time, the bonding head control mechanism records the current encoder reading as the fourth detection value.

[0097] In some embodiments, the range of the second set time is 100 ms to 200 ms. Specifically, the range of the second set time can be set to any value between 100 ms, 150 ms, and 200 ms or the range formed between any two values.

[0098] Calculate the difference between the third detection value and the fourth detection value, and determine whether the difference is less than the set deviation value. If yes, go to step S104; if no, the bonding head control mechanism controls the bonding head to reset. The relative position between the bonding head and the lead frame is unstable and needs to be repositioned and pressured.

[0099] In the embodiment of the present application, the relative displacement between the bonding head and the lead frame after applying the first pressure is judged by the difference of the encoder readings to ensure that the relative position between the bonding head and the lead frame tends to be stable. Thus, the detection accuracy of the pressing performance is not affected by the position deviation, and the detection accuracy of the pressing performance is improved. In addition, the difference of the encoder readings can be used to detect the micron-level disturbance between the bonding head and the lead frame, improving the detection accuracy.

[0100] Embodiment 2 of the detection method for the pressing performance of the present application

[0101] During the process of the pressing plate pressing the lead frame, the pressing plate usually contacts the border of the lead frame and applies pressure to the border. Therefore, the pressing performance of the outer periphery of the lead frame is better than that of the center of the lead frame. Therefore, a single detection of the pressing performance of the lead frame is not sufficient to fully reflect the detection of the pressing performance of each area of the lead frame.

[0102] To improve the detection accuracy of the pressing performance of each area of the lead frame, the difference between this embodiment and Embodiment 1 is that the lead frame provided in this embodiment includes a border and at least two detection sub-units distributed in the border in a determinant array structure. The pressing performance of each detection sub-unit is detected by a pressing performance detection device to obtain the detection of the pressing performance of each area of the lead frame. Compared with Embodiment 1, the detection accuracy of the detection method in this embodiment is better.

[0103] In some embodiments, the lead frame includes a border and several detection sub-units distributed in the border in a determinant array structure, where the several detection sub-units are arranged in an 8×5 arrangement, such asFigure 3 as shown

[0104] Please refer to Figure 2 As shown above, based on the lead frame described above, the detection method for the lamination performance provided by the embodiments of the present application specifically includes the following steps:

[0105] Step S201, set preset parameters for the bonding head control mechanism.

[0106] In some embodiments, the preset parameters include a detection threshold and a movement parameter. Among them, the detection threshold is used to determine whether the lamination performance of the lead frame is qualified, and the movement parameter is used to control the bonding head to move from the target detection subunit to the next detection subunit; the range of the detection threshold is 18μm to 20μm. Specifically, the detection threshold can be set to any value among 18μm, 19μm, and 20μm or the range formed between any two values.

[0107] Step S202, the lamination mechanism performs a lamination process on the lead frame.

[0108] Step S203, the bonding head control mechanism controls the bonding head to move to the target detection subunit based on the movement parameter.

[0109] Step S204, the bonding head control mechanism controls the bonding head to apply a first pressure to the target detection subunit, and records the current encoder reading as the first detection value after the pressure is stabilized.

[0110] In some embodiments, the pressure range of the first pressure is 25g / mm 2 to 35g / mm 2 , specifically, the magnitude of the first pressure can be set to any value among 25 g / mm 2 , 30 g / mm 2 , 35 g / mm 2 or the range formed between any two values.

[0111] Step S205, the bonding head control mechanism controls the bonding head to apply a second pressure to the target detection subunit, and records the current encoder reading as the second detection value.

[0112] In some embodiments, the second pressure is greater than the first pressure. Among them, the pressure range of the second pressure is 80g / mm 2 to 120g / mm 2 , specifically, the magnitude of the first pressure can be set to any value among 80 g / mm 2 , 90 g / mm 2 , 100g / mm 2 , 110g / mm 2, 120 g / mm 2 or a range formed between any one value or any two values thereof.

[0113] Step S206, calculate the detection difference between the first detection value and the second detection value.

[0114] Step S207, determine whether the detection threshold is greater than the detection difference.

[0115] Step S2071, when the detection threshold is greater than the detection difference, the pressing performance of the target detection subunit is qualified, end the pressing performance detection of the current target detection subunit, and enter Step S208.

[0116] Step S2072, when the detection threshold is less than the detection difference, the pressing performance of the lead frame is unqualified, and enter Step S208.

[0117] Step S208, the bonding head control mechanism controls to move to the next detection subunit for detection based on the movement parameter, and return to Step S204.

[0118] In the embodiment of the present application, by dividing the lead frame into several detection subunits and performing pressure detection on each detection subunit respectively, it is convenient for the operator to understand the pressing performance information of the specific area of the lead frame, and based on the pressing performance of each area, it is convenient to timely adjust the pressing stroke of the pressing plate and the relative position between the pressing plate and the lead frame, thereby improving the pressing accuracy of the pressing plate on the lead frame and improving the yield of the product.

[0119] In some embodiments, before the Step S208, the following steps are further included:

[0120] The bonding head control mechanism determines whether there is a next detection subunit;

[0121] If yes, execute the Step S208; if no, stop the pressing performance detection.

[0122] In some embodiments, after the bonding head control mechanism controls the bonding head to complete the pressure performance detection of all detection subunits of the lead frame, the judgment results of the Step S207 of each detection subunit and the detection differences of each detection subunit are summarized.

[0123] In this embodiment, when each detection subunit meets the requirements of Step S2071, the overall pressing performance of the lead frame is qualified, and the performance detection of the lead frame is completed;

[0124] When there is at least one detection subunit whose judgment result meets Step S2072, the following steps are further included:

[0125] Normalize the detection differences of each of the said detection subunits.

[0126] In this embodiment, the formula for the normalization process is as follows:

[0127] ;

[0128] where x is the detection difference of the target detection subunit, x max is the maximum detection difference of the detection subunits in the lead frame, x min is the minimum detection difference of the detection subunits in the lead frame, x norm is the detection difference of the target detection subunit after normalization.

[0129] Draw the press-fitting performance nephogram of the said lead frame.

[0130] The embodiments of the present application adopt the normalization method to process the detection differences, which can eliminate the data scale differences and map the data to a unified range, ensure the balanced contribution of each dimensional feature to the nephogram, facilitate the operator to visually compare and analyze the press-fitting performance of each area of the lead frame, and adjust the press-fitting stroke of the press plate according to the nephogram, thereby improving the press-fitting quality of the press-fitting mechanism for the lead frame.

[0131] Based on the above-mentioned detection method of press-fitting performance, the embodiments of the present application provide a press-fitting performance detection device, and the press-fitting performance detection device is used to execute the above-mentioned detection method of press-fitting performance.

[0132] Please refer to Figure 4 As shown, in some embodiments, the press-fitting performance detection device provided by the present application includes a bonder head control mechanism 1 and a press-fitting mechanism 2. The press-fitting mechanism 2 is used to carry the lead frame 3, and the bonder head control mechanism 1 is used to detect the press-fitting performance of the lead frame 3.

[0133] In some embodiments, the press-fitting mechanism 2 includes a workbench 21, a lifting assembly 22 and a press plate 23. The lifting assembly 22 is installed on the workbench 21, the press plate 23 is installed on the lifting assembly 22, and the workbench 21 is used to carry the lead frame 3.

[0134] In this embodiment, the lead frame 3 is rigidly connected to the workbench 21 through solder balls. In other embodiments, a number of vacuum adsorption holes are further provided on the workbench 21, and the lead frame 3 is fixed on the workbench 21 through the combined action of rigid connection by solder balls and vacuum adsorption of the vacuum adsorption holes.

[0135] The bonding head control mechanism 1 includes a bonding head mounting base 11, a bonding head 12, and an encoder 13. The bonding head 12 is rotatably mounted on the bonding head mounting base 11, and the encoder 13 is mounted on the bonding head mounting base 11. The encoder 13 is used to detect the position data of the bonding head 12.

[0136] In this embodiment, the bonding head control mechanism 1 further includes a cantilever 14. The cantilever 14 is rotatably mounted at the output end of the bonding head mounting base 11. The bonding head 12 is mounted at one end of the cantilever 14 away from the bonding head mounting base 11. The bonding head mounting base 11 drives the bonding head 12 to move by controlling the rotation of the cantilever 14. Please refer to Figure 4 As shown, in this embodiment, the rotation angle α of the cantilever 14 ranges from -1° to 6°. Among them, the counterclockwise rotation direction of the cantilever 14 is the positive direction. Specifically, the rotation angle α of the cantilever 14 can be set to any value among -1°, 0°, 1°, 2°, 3°, 4°, 5°, 6° or the range formed between any two values.

[0137] In the embodiment of the present application, by controlling the rotation angle of the cantilever 14, the bonding head 12 is driven to move, and thus different pressures are applied to the lead frame 3 through the bonding head 12, so as to facilitate the pressure performance test of the lead frame 3.

[0138] The press-fitting performance detection device provided by the embodiment of the present application detects by applying a quantitative pressure to the lead frame 3 by controlling the moving distance of the bonding head 12, unifies the detection standard of the press-fitting performance, and can quickly judge whether the press-fitting performance is qualified, improving the detection efficiency of the press-fitting performance; by using the reading of the encoder 13 to read the detection degree of the press-fitting performance, the monitoring of disturbances at the micron level can be realized, improving the detection accuracy of the press-fitting performance and further improving the yield rate of the product.

[0139] In some embodiments, the bonding head control mechanism 1 further includes a controller (not shown in the figure). The controller is respectively connected to the bonding head mounting base 11 and the encoder 13;

[0140] The controller has preset parameters built in, and the preset parameters include a detection threshold and a set deviation value.

[0141] In some embodiments, the lead frame 3 includes a frame 31 and a plurality of detection sub-units 32 distributed in the frame 31 in a row-column array structure. Among them, the plurality of detection sub-units 32 are arranged in an 8×5 arrangement, such as Figure 3 shown.

[0142] The bonding head control mechanism 1 further includes a translation component 15. The bonding head mounting seat 11 is installed on the translation component 15, and the translation component 15 is connected to the controller. Among them, the preset parameters further include movement parameters;

[0143] The translation component 15 is used to control the horizontal movement of the bonding head mounting seat 11 relative to the pressing mechanism 2 to adjust the position correspondence between the bonding head 12 and each detection subunit 32 of the lead frame 3.

[0144] In the embodiment of the present application, by dividing the lead frame 3 into several detection subunits 32 and respectively performing pressure detection on each detection subunit 32, it is convenient for the operator to understand the pressing performance information of the specific area of the lead frame 3, and based on the pressing performance of each area, it is convenient to timely adjust the pressing stroke of the pressing plate 23 and the relative position between the pressing plate 23 and the lead frame 3, thereby improving the pressing accuracy of the pressing plate 23 on the lead frame 3 and improving the yield rate of the product.

[0145] The following specifically describes the present application through specific embodiments. The following embodiments are only partial embodiments of the present application and do not limit the present application. Embodiment

[0146] Step (1), set preset parameters for the bonding head control mechanism. Among them, the preset parameters include a detection threshold, a set deviation value, and a movement parameter. The detection threshold is 18 μm, and the set deviation value is 2 μm.

[0147] Step (2), the pressing mechanism performs a pressing process on the lead frame. Among them, the initial pressing stroke of the pressing process is 5 μm.

[0148] Step (3), the bonding head control mechanism controls the bonding head to move to the target detection subunit based on the movement parameter.

[0149] Step (4), the bonding head control mechanism controls the bonding head to apply a first pressure of 30 g / mm 2 to the target detection subunit, and record the current encoder reading as the first detection value after the pressure is stabilized.

[0150] Step (5), the bonding head control mechanism controls the bonding head to apply a second pressure of 100 g / mm 2 to the target detection subunit, and record the current encoder reading as the second detection value.

[0151] Step (6), calculate the detection difference between the first detection value and the second detection value.

[0152] Step (7), determine whether the detection threshold is greater than the detection difference, and record the detection difference.

[0153] Step (8), the bungee control mechanism controls the movement to the next detection subunit for detection based on the movement parameters.

[0154] Step (9), after the bungee control mechanism controls the bungee to complete the pressure performance test of all the detection subunits of the lead frame, the detection difference of each detection subunit is summarized and made into a table, as shown in Table 1:

[0155] .

[0156] As shown in Table 1, after the pressing performance test of step (4) to step (8), it can be known that the detection differences of the detection sub-units of four columns and three rows, four columns and four rows, four columns and five rows, four columns and six rows, five columns and two rows, five columns and three rows, five columns and four rows, five columns and five rows, five columns and six rows, five columns and seven rows, six columns and three rows, six columns and four rows, six columns and five rows, and six columns and six rows located in the middle of the lead frame are all greater than the detection threshold. Therefore, the pressing performance of the above detection sub-units is unqualified, and the pressing performance of the lead frame is unqualified, and a secondary pressing process is required.

[0157] Step (⑽), normalizing the detection differences of each detection sub-unit, and drawing a compression performance cloud diagram of the lead frame.

[0158] like Figure 5 As shown, according to the pressing performance cloud map produced after the normalization processing of the detection differences of each detection sub-unit recorded in Table 1, it can be intuitively seen that the pressing performance in the middle area of ​​the lead frame is unqualified.

[0159] Step (⑾), correcting the pressing stroke of the pressing mechanism. Specifically, the compensation stroke is 2 μm, and the correction stroke of the pressing mechanism is 5+2=7 μm.

[0160] Step (⑿), the pressing mechanism presses the lead frame based on the correction stroke.

[0161] Step ⒀, the bundling head control mechanism controls the bundling head to perform secondary pressing performance detection on each detection sub-unit in the lead frame, wherein the steps of the secondary pressing performance detection are the same as steps ⑷ to ⑻. After the bundling head control mechanism controls the bundling head to complete the secondary pressure performance detection of all the detection sub-units of the lead frame, the detection difference of each detection sub-unit is summarized and made into a table, as shown in Table 2:

[0162] .

[0163] As shown in Table 2, the detection differences of the detection sub-units of the lead frame after the secondary pressing process are all smaller than the detection threshold value. Therefore, the pressing performance of the lead frame is qualified, and the pressing performance test of the lead frame is completed.

[0164] In summary, the method for detecting the pressing performance provided by the embodiments of the present application detects by applying a quantitative pressure to the lead frame through the bonding head, unifies the detection standard of the pressing performance, and can quickly judge whether the pressing performance is qualified based on the comparison between the detection difference of the first detection value and the second detection value and the detection threshold, improving the detection efficiency of the pressing performance; since the encoder reading is used to read the first detection value and the second detection value, the monitoring of disturbances at the micron level can be realized, improving the detection accuracy of the pressing performance and further increasing the yield rate of the product; in addition, by applying pressure to the lead frame twice through the bonding head and ensuring that the first detection value is recorded after the first pressure is applied stably, the stable contact between the bonding head and the lead frame can be ensured, avoiding the influence of the position deviation between the bonding head and the lead frame on the detection accuracy of the pressing performance and improving the detection accuracy of the pressing performance.

[0165] Obviously, the embodiments described above are only a part of the embodiments of the present application, rather than all the embodiments. The drawings show the preferred embodiments of the present application, but do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements on some of the technical features. Any equivalent structure directly or indirectly using the content of the specification and drawings of the present application in other related technical fields shall be within the scope of the patent protection of the present application by the same token.

Claims

1. A method for detecting lamination performance, characterized in that, Including the following steps: Set preset parameters for the bonding head control mechanism, where the preset parameters include a detection threshold and a set deviation value; The pressing mechanism performs a pressing process on the lead frame; The bonding head control mechanism controls the bonding head to apply a first pressure to the lead frame, and records the current encoder reading as a first detection value after the pressure application is stable; The bonding head control mechanism controls the bonding head to apply a second pressure to the lead frame, and records the current encoder reading as a second detection value; Calculate the detection difference between the first detection value and the second detection value; Determine whether the detection threshold is greater than the detection difference; If yes, the pressing performance of the lead frame is qualified; Among them, the detection of the stable pressure application is performed through the following steps: After the bonding head control mechanism controls the bonding head to complete the application of the first pressure to the lead frame, the bonding head control mechanism records the current encoder reading as a third detection value; After the first pressure is maintained for a second set time, the bonding head control mechanism records the current encoder reading as a fourth detection value; Calculate the difference between the third detection value and the fourth detection value, and determine whether the difference is less than the set deviation value. If yes, proceed to the next step; otherwise, the bonding head control mechanism controls the bonding head to reset.

2. The detection method for lamination performance according to claim 1, characterized in that, The step of the pressing mechanism performing a pressing process on the lead frame includes the following steps: Set an initial pressing stroke in the pressing mechanism, where the initial pressing stroke is 5 mm to 10 mm; The pressing mechanism controls the pressing plate to move the initial pressing stroke to perform a pressing process on the lead frame; After maintaining for a first set time, the pressing mechanism controls the pressing plate to reset, completing the pressing process on the lead frame.

3. The detection method for pressing performance according to claim 2, wherein, When the detection threshold is less than the detection difference, the pressing performance of the lead frame is unqualified, and the pressing mechanism performs a secondary pressing process on the lead frame. Among them, the secondary pressing process includes the following steps: Correct the pressing stroke of the pressing mechanism, where the corrected stroke is the sum of the initial pressing stroke and the compensation stroke, and the range of the compensation stroke is 2 μm to 1 mm; The pressing mechanism controls the pressing plate to move the corrected stroke to perform a secondary pressing process on the lead frame; After maintaining for a first set time, the pressing mechanism controls the pressing plate to reset, completing the secondary pressing process on the lead frame.

4. The detection method for pressing performance according to claim 1, wherein The range of the set deviation value is 2 μm to 3 μm; The range of the second set time is 100 ms to 200 ms.

5. The detection method for pressing performance according to claim 1, characterized in that, The lead frame includes a frame and at least two detection sub-units distributed in the frame in a determinant array structure, and the preset parameters further include movement parameters; After the step of the pressing mechanism performing a pressing process on the lead, the following steps are included: The bonding head control mechanism controls the bonding head to move to the target detection sub-unit based on the movement parameters; The bonding head control mechanism controls the bonding head to apply a first pressure to the target detection sub-unit, and records the current encoder reading as a first detection value after the pressure application is stable; The bonding head control mechanism controls the bonding head to apply a second pressure to the target detection subunit, and records the current encoder reading as the second detection value; Calculate the detection difference between the first detection value and the second detection value; Determine whether the detection threshold is greater than the detection difference; If yes, the pressing performance of the target detection subunit is qualified, and proceed to the next step; The bonding head control mechanism controls the movement to the next detection subunit for detection based on the movement parameter.

6. The detection method of the lamination performance according to claim 5, wherein After the bonding head control mechanism controls the bonding head to complete the pressure performance detection of all the detection subunits of the lead frame, the following steps are further included: Perform normalization processing on the detection differences of each detection subunit; Draw the pressing performance cloud map of the lead frame.

7. The detection method for lamination performance according to any one of claims 1 to 6, characterized in that, The pressure range of the first pressure is 25 g / mm 2 ~35 g / mm 2 ; and / or, The pressure range of the second pressure is 80 g / mm 2 to 120 g / mm 2 ; and / or, The range of the detection threshold is 18μm to 20μm.

8. A lamination performance detection device, characterized in that, For performing the detection method of the pressing performance according to any one of claims 1 to 7, wherein the pressing performance detection device includes a bonding head control mechanism and a pressing mechanism, the pressing mechanism is used to carry the lead frame, and the bonding head control mechanism is used to detect the pressing performance of the lead frame; The pressing mechanism includes a workbench, a lifting assembly and a pressing plate, the lifting assembly is installed on the workbench, the pressing plate is installed on the lifting assembly, and the workbench is used to carry the lead frame; The bonding head control mechanism includes a bonding head mounting seat, a bonding head and an encoder, the bonding head is rotatably installed on the bonding head mounting seat, the encoder is installed on the bonding head mounting seat, and the encoder is used to detect the position data of the bonding head.

9. The laminating performance detection device according to claim 8, wherein, The bonding head control mechanism further includes a controller, and the controller is respectively connected to the bonding head mounting seat and the encoder; The controller has preset parameters built therein, and the preset parameters include a detection threshold and a set deviation value.

10. The press-fitting performance detection device according to claim 9, wherein, The bonding head control mechanism further includes a translation assembly, the bonding head mounting seat is installed on the translation assembly, and the translation assembly is connected to the controller, wherein the preset parameters further include a movement parameter; The translation assembly is used to control the horizontal movement of the bonding head mounting seat relative to the pressing mechanism to adjust the position correspondence between the bonding head and each detection subunit of the lead frame.

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