Substrate processing apparatus, substrate processing system, and substrate processing method

Abstract

The purpose of the present invention is to reduce the amount of data used in an apparatus, system, and method for processing a substrate. In order to achieve the above purpose, the substrate processing apparatus includes: one or more processing units that process each substrate; and one or more arithmetic processing units. The one or more arithmetic processing units create a flow procedure for specifying a flow of a series of processes relating to the substrate by using a combination of two or more processing procedures among a plurality of processing procedures for each specifying a condition of a process relating to a process performed on the substrate in the one or more processing units. The plurality of processing procedures include a plurality of liquid processing procedures that respectively specify conditions for processing the substrate using the processing liquid.

Description

[0001] This application is a divisional application of an application with a filing date of September 6, 2019, application number 201980058138.8, and invention name “Substrate processing device, substrate processing system, and substrate processing method”. Technical Field

[0002] The present invention relates to a substrate processing device, a substrate processing system and a substrate processing method. The substrates to be processed include, for example, semiconductor substrates, substrates for liquid crystal display devices, substrates for flat panel displays such as organic EL (Electroluminescence) display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, substrates for solar cells, etc. Background Art

[0003] There is known a substrate processing apparatus having a plurality of processing units capable of performing various processes such as cleaning and etching of a substrate using a processing liquid such as a chemical solution.

[0004] In addition, there is a substrate processing system (for example, see Patent Document 1, etc.), which includes: a plurality of substrate processing devices; and a group controller as a management computer connected to the plurality of substrate processing devices via a communication line. In the group controller, for example, information related to substrate processing (also referred to as process-related information), such as recipes and parameters used in controlling each substrate processing device, is stored in a storage unit, and a plurality of process-related information are compared, manually edited, and the process-related information is sent to the substrate processing device.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2018-67626 Summary of the invention

[0008] Problem that the invention aims to solve

[0009] However, for example, in a management computer, as the conditions for processing a substrate in a substrate processing apparatus increase, more information including a flow recipe that specifies a series of processing to be performed on the substrate processing apparatus will need to be prepared in advance. Therefore, for example, the amount of data stored and managed by the management computer and the amount of data sent from the management computer to the substrate processing apparatus will increase. As a result, for example, it will be necessary to increase the storage capacity of the storage unit in the management computer and to increase the communication speed with the substrate processing apparatus.

[0010] Therefore, there is room for improvement in reducing the amount of data used in substrate processing apparatuses, substrate processing systems, and substrate processing methods.

[0011] The present invention has been proposed in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus, a substrate processing system, and a substrate processing method that can reduce the amount of data used.

[0012] Means used to solve problems

[0013] In order to solve the above-mentioned problem, a substrate processing apparatus according to a first embodiment includes: one or more processing units for processing substrates respectively; and one or more calculation processing units. The one or more calculation processing units create a flow chart for defining a flow chart of a series of processing on a substrate by combining two or more processing charts among a plurality of processing charts, wherein the plurality of processing charts are used to define conditions for processing related to processing performed on a substrate in the one or more processing units respectively. The plurality of processing charts include a plurality of liquid processing charts for defining conditions for processing performed on a substrate using a processing liquid respectively.

[0014] The substrate processing apparatus of the second embodiment, in the substrate processing apparatus of the first embodiment, further comprises one or more sensor units, each of which acquires a signal of an index of the status of substrate processing in the one or more processing units. The plurality of processing procedures include a plurality of measurement processing procedures, each of which specifies a condition of measurement processing of the one or more sensor units for acquiring the signal of the index. The one or more calculation processing units create the flow procedure by combining one or more liquid processing procedures among the plurality of liquid processing procedures and one or more measurement processing procedures among the plurality of measurement processing procedures.

[0015] In the substrate processing apparatus of the third embodiment, in the substrate processing apparatus of the second embodiment, one or more of the arithmetic processing units creates the process program by combining at least one of a plurality of correction forms into at least one of the two or more processing programs, wherein the plurality of correction forms are used to correct at least a part of the conditions in the plurality of processing programs based on the signal of the indicator obtained by the one or more sensor units. The one or more arithmetic processing units calculate one or more correction coefficients from at least one of the correction forms based on the signal of the indicator obtained by the one or more sensor units, and use the one or more correction coefficients to correct the conditions specified by at least one of the processing programs.

[0016] In a substrate processing apparatus according to a fourth embodiment, in the substrate processing apparatus according to the second embodiment or the third embodiment, one or more of the sensor units acquires signals of one or more indicators indicating the state of the substrate. The plurality of processing procedures include a first processing procedure and a second processing procedure. The plurality of measurement processing procedures include a first measurement processing procedure, and the first measurement processing procedure specifies conditions for measurement processing of the one or more sensor units for acquiring signals of the one or more indicators. One or more of the operation processing units create the process procedure by combining the first measurement processing procedure with a branch processing procedure for specifying the conditions for branch processing among a plurality of branch processing procedures for respectively branching the processing process, and combining the first processing procedure as a processing procedure for the first branch post-processing process to the one branch processing procedure, and combining the second processing procedure as a processing procedure for the second branch post-processing process to the one branch processing procedure. In the one branch processing, if one or more of the indicators meets the first condition, the first branch post-processing process is executed, and if one or more of the indicators meets the second condition, the second branch post-processing process is executed.

[0017] In the substrate processing device of the fifth embodiment, in the substrate processing device described in any one of the first to fourth embodiments, the plurality of liquid processing procedures include one or more structured liquid processing procedures that respectively specify the following processing processes and conditions: if the substrate is in the first state when being processed using the first processing liquid, then the substrate is processed using the second processing liquid after being processed using the first processing liquid, and in response to the substrate changing to the second state when being processed using the first processing liquid, the substrate is processed using the third processing liquid.

[0018] The substrate processing system of the sixth embodiment comprises: a plurality of substrate processing devices; and a management device connected to the plurality of substrate processing devices in a manner capable of transmitting and receiving data. The management device comprises a first communication unit, and the first communication unit transmits and receives information to and from the plurality of substrate processing devices. The plurality of substrate processing devices respectively comprise: one or more processing units, which respectively process substrates; a second communication unit, which transmits and receives information to and from the management device; and one or more calculation processing units, which create a flow chart for defining a series of processes on substrates. At least a part of the plurality of substrate processing devices and the management device comprises one or more storage units for storing a plurality of processing charts, and the plurality of processing charts respectively define conditions for processing related to processing performed on substrates in one or more processing units. The plurality of processing charts include a plurality of liquid processing charts, which respectively define conditions for processing performed on substrates using processing liquids. The first communication unit transmits two or more identification information for respectively identifying two or more processing charts to each of the plurality of substrate processing devices. The second communication unit receives the two or more identification information. The one or more arithmetic processing units create the flow protocol by combining two or more of the plurality of processing protocols based on two or more of the identification information.

[0019] In the substrate processing system of the seventh embodiment, in the substrate processing system described in the sixth embodiment, each of the plurality of substrate processing devices has one or more sensor units, and each of the one or more sensor units obtains a signal of an index of the status of substrate processing in the one or more processing units. The plurality of processing procedures include a plurality of measurement processing procedures, and the plurality of measurement processing procedures respectively stipulate the conditions of the measurement processing of the one or more sensor units for obtaining the signal of the index. The one or more storage units store a plurality of correction formulas for correcting at least a part of the conditions in the plurality of processing procedures based on the signal of the index obtained by the one or more sensor units. The one or more calculation processing units create the process procedure by combining two or more processing procedures including one or more liquid processing procedures of the plurality of liquid processing procedures and one or more measurement processing procedures of the plurality of measurement processing procedures, and combining at least one correction formula of the plurality of correction formulas with at least one processing procedure of the two or more processing procedures. The one or more processing units process the substrate according to the process procedure. The one or more sensor units obtain a signal of one or more indexes for indicating the status of the substrate. When one or more of the operation processing units processes the substrate according to the process procedure through one or more of the processing units, and when the signals of one or more of the indicators obtained by one or more of the sensor units meet the specified conditions, the information representing the combination of at least one of the processing procedures in the process procedure and at least one of the correction forms is sent to the management device through the second communication unit.

[0020] The substrate processing method of the eighth embodiment uses a substrate processing device having one or more processing units and one or more calculation processing units for processing substrates respectively, wherein the substrate processing method includes steps (a), (b), and (c). In step (a), one or more storage units store a plurality of processing procedures that respectively specify the conditions for processing related to the processing performed on the substrate in one or more of the processing units. In step (b), one or more of the calculation processing units create a flow procedure for specifying a series of processing procedures for the substrate by combining two or more of the plurality of processing procedures stored in one or more of the storage units in step (a). In step (c), one or more of the processing units perform processing according to the flow procedure created in step (b). The plurality of processing procedures include a plurality of liquid processing procedures that respectively specify the conditions for processing the substrate using a processing liquid.

[0021] Effects of the Invention

[0022] According to the substrate processing apparatus of the first embodiment, even if the conditions for a series of substrate processing increase, for example, two or more of the plurality of pre-prepared processing procedures can be combined to create a flow procedure, instead of increasing the number of pre-prepared flow procedures. Thus, for example, the amount of data pre-prepared in the substrate processing apparatus can be reduced. As a result, for example, the amount of data used in the substrate processing apparatus can be reduced.

[0023] According to the substrate processing apparatus of the second embodiment, for example, not only the processing using the processing liquid but also the processing for measuring can be combined with two or more processing procedures among the plurality of processing procedures to create a flow procedure. Thus, for example, even if the conditions for a series of processing of a substrate including the measuring processing increase, two or more processing procedures among the plurality of processing procedures prepared in advance can be combined to create a flow procedure, instead of increasing the number of flow procedures prepared in advance. As a result, for example, the amount of data used in the substrate processing apparatus can be reduced.

[0024] According to the substrate processing apparatus of the third embodiment, for example, a correction form can be combined with a processing procedure to create a flow procedure. Thus, for example, even if the conditions for a series of processing of a substrate including a correction of processing increase, two or more processing procedures among a plurality of processing procedures prepared in advance can be combined, and at least one correction form among a plurality of correction forms prepared in advance can be combined with at least one processing procedure to create a flow procedure, instead of increasing the number of flow procedures prepared in advance. As a result, for example, the amount of data used in the substrate processing apparatus can be reduced.

[0025] According to the substrate processing apparatus of the fourth embodiment, for example, by making the first measurement processing rule, the branch processing rule, the first processing rule of the first branch post-processing flow, and the second processing rule of the second branch post-processing flow, it is possible to create a flow rule that can implement a series of processes corresponding to the state of the substrate. Thus, for example, even if the conditions for a series of processes on the substrate are added in a manner that the process flow branches according to the state of the substrate, it is possible to combine the first measurement processing rule among the plurality of measurement processing rules prepared in advance, one of the plurality of branch processing rules prepared in advance, the first liquid processing rule among the plurality of liquid processing rules prepared in advance, and the second liquid processing rule to create a flow rule that specifies a series of processes on the substrate for bringing the state of the substrate close to the desired state, instead of increasing the number of flow rules prepared in advance. As a result, for example, the amount of data prepared in advance in the substrate processing apparatus can be reduced, and the amount of data used in the substrate processing apparatus can be reduced. Furthermore, compared with a case where the substrate is processed again in the substrate processing apparatus in order to bring the substrate into a desired state after being unloaded from the substrate processing apparatus, the efficiency of the processing performed on the substrate can be easily improved.

[0026] According to the substrate processing apparatus of the fifth embodiment, for example, when a substrate is sequentially processed using a first processing liquid and a substrate is sequentially processed using a second processing liquid, if a specific state is reached when the substrate is processed using the first processing liquid, the processing using the first processing liquid can be terminated and the substrate can be processed using a third processing liquid. Thus, for example, appropriate processing can be performed according to the state when the substrate is processed using the first processing liquid.

[0027] According to the substrate processing system of the sixth embodiment, even if the conditions for a series of substrate processing increase, for example, the substrate processing device can combine two or more processing procedures corresponding to two or more identification information from the management device among the plurality of processing procedures prepared in advance to create a flow procedure, instead of increasing the number of flow procedures prepared in advance. Thus, for example, the amount of data prepared in advance in the substrate processing system can be reduced. As a result, for example, the amount of data used in the substrate processing system can be reduced.

[0028] According to the substrate processing system of the seventh embodiment, when a good result is obtained by processing based on a processing procedure combined with a correction formula, information indicating the combination of the processing procedure and the correction formula is sent to a management device. Thus, for example, other substrate processing devices can also use the combination of the processing procedure and the correction formula that obtains the good result.

[0029] According to the substrate processing method of the eighth embodiment, even if the conditions for a series of substrate processing increase, for example, two or more of the plurality of processing procedures prepared in advance can be combined to create a flow procedure, instead of increasing the number of the flow procedures prepared in advance. Thus, for example, the amount of data prepared in advance can be reduced. As a result, for example, the amount of data used when performing substrate processing can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a diagram showing an example of a schematic configuration of a substrate processing system according to the first embodiment.

[0031] Figure 2 This is a block diagram showing an example of the electrical configuration and an example of the functional configuration of the management device.

[0032] Figure 3 It is a schematic plan view showing an example of a schematic structure of a substrate processing apparatus.

[0033] Figure 4 This is a diagram schematically showing a configuration example of a processing unit.

[0034] Figure 5 This is a block diagram showing the connection method of each structure in the substrate processing apparatus.

[0035] Figure 6 This is a block diagram showing an example of the electrical structure and an example of the functional structure of the main control unit.

[0036] Figure 7 This is a diagram showing an example of the content of a data group.

[0037] Figure 8 This is a diagram showing an example of a flow chart.

[0038] Fig. 9 This is a diagram showing another example of the flow chart.

[0039] Fig.10 This is a diagram showing another example of the flow chart.

[0040] Fig.11 This is a block diagram showing an example of the electrical configuration and an example of the functional configuration of the schedule management control unit.

[0041] Fig.12 This is a block diagram showing an example of an electrical structure and an example of a functional structure of a part of the control unit.

[0042] Fig.13 This is a block diagram showing an example of the electrical structure and an example of the functional structure of the liquid management control unit.

[0043] Fig.14 This is a diagram showing an example of the content of a data group stored in a data storage.

[0044] Fig.15 This is a flowchart showing an example of the flow of operations for creating a flow program.

[0045] Fig.16 This is a flowchart showing an example of the operation flow of modifying the processing procedure.

[0046] Fig.17 This is a diagram showing an example of a branch processing procedure group included in a data group according to the second embodiment.

[0047] Fig.18 This is a diagram showing an example of a flow chart according to the second embodiment.

[0048] Fig.19 This is a diagram showing an example of a structured liquid handling program according to the third embodiment.

[0049] Fig. 20 This is a diagram showing an example of another flow chart. DETAILED DESCRIPTION

[0050] Hereinafter, various embodiments and various variations of the present invention will be described based on the accompanying drawings. In the accompanying drawings, the same reference numerals are given to parts having the same structure and function, and repeated descriptions are omitted in the following description. In addition, the accompanying drawings are schematically shown.

[0051] (1. First Implementation Method)

[0052] (1-1. Schematic Structure of Substrate Processing System)

[0053] Figure 1 1 is a diagram showing an example of a schematic structure of a substrate processing system 1 according to the first embodiment. Figure 1 As shown, the substrate processing system 1 includes, for example, a management device 10, a plurality of substrate processing devices 20, and a transport device 30. The plurality of substrate processing devices 20 include, for example, a first substrate processing device 20a, a second substrate processing device 20b, and a third substrate processing device 20c. Here, the management device 10, the plurality of substrate processing devices 20, and the transport device 30 are connected in a manner that data can be sent and received via a communication line 5. The communication line 5 may be, for example, any of a wired line and a wireless line.

[0054] (1-2. Management Device)

[0055] The management device 10 can collectively manage, for example, a plurality of substrate processing apparatuses 20 . Figure 2 (a) is a block diagram showing an example of the electrical structure of the management device 10. Figure 2 As shown in (a) in FIG. 1 , the management device 10 is realized by, for example, a computer and includes a communication unit 11 , an input unit 12 , an output unit 13 , a storage unit 14 , a control unit 15 , and a drive 16 connected via a bus Bu10 .

[0056] The communication unit 11 has, for example, a function as a transmitting unit that can transmit signals to each substrate processing apparatus 20 and the conveying apparatus 30 via the communication line 5 and a function as a receiving unit that can receive signals from each substrate processing apparatus 20 and the conveying apparatus 30 via the communication line 5. In other words, the communication unit 11 has, for example, a function as a part that transmits and receives information between the plurality of substrate processing apparatuses 20 (also referred to as a first communication unit).

[0057] The input unit 12 can input signals corresponding to actions of a user using the management device 10, for example. The input unit 12 can include, for example, an operation unit, a microphone, and various sensors. The operation unit can input signals corresponding to user operations, for example. The operation unit can include, for example, a mouse and a keyboard. The microphone can input signals corresponding to the user's voice. Various sensors can input signals corresponding to user actions.

[0058] The output unit 13 can output various information, for example. The output unit 13 can include, for example, a display unit and a speaker. The display unit can output various information visually in a manner recognizable to the user. The display unit can also be in the form of a touch panel integrated with at least a portion of the input unit 12, for example. The speaker can output various information audibly in a manner recognizable to the user.

[0059] The storage unit 14 can store information, for example. The storage unit 14 can be composed of a non-volatile storage medium such as a hard disk or a flash memory. The storage unit 14 can be configured to have one storage medium, two or more storage media integrally, or two or more storage media divided into two or more parts. The storage unit 14 can store, for example, a program 14pg, processing plan information 14pc, and various information 14dt. The storage unit 14 can also include, for example, a memory 15b described later.

[0060] The processing plan information 14pc indicates the execution of N processing units 21 (N is a natural number) described later in each substrate processing apparatus 20 (see Figure 3 The timing of processing a plurality of consecutive substrates in a plurality of substrate groups (such as the timing of processing a plurality of consecutive substrates in a plurality of substrate groups). For example, a substrate group is composed of a plurality of substrates W (see Figure 3 In other words, one substrate group includes a group of substrates W.

[0061] The various information 14dt includes, for example, information of each substrate W, tasks, and multiple identification information of multiple processes in the substrate processing device 20 for each substrate W of a group of substrates W. The information of each substrate W can include, for example, the number of the slot in the carrier C that holds the substrate W, the shape of the substrate W, and information of the process that has been performed on the substrate W (also referred to as processed information). The information representing the shape of the substrate W can include, for example, the thickness of the film in the substrate W (also referred to as film thickness) and the distribution of the film thickness. The film thickness can be obtained by measuring, for example, various film thickness meters, and can be any of the average value, minimum value, and maximum value of the film thickness. The multiple processes in the substrate processing device 20 include, for example, a process of performing a process on the substrate W using a processing liquid (also referred to as liquid processing), a process of measuring various states related to the process performed on the substrate W (also referred to as measurement processing), and a process of correcting the conditions of the liquid process or the measurement process (also referred to as correction processing).

[0062] The plurality of identification information is, for example, information for respectively identifying the plurality of processes in the substrate processing device 20. Here, the plurality of identification information includes, for example: identification information of a plurality of processing procedures (also referred to as procedure identification information) for determining the conditions of various processes related to the processes performed on the substrate W for each processing procedure, and identification information (also referred to as correction form identification information) for determining the calculation formula (also referred to as correction form) for various correction processes for each correction form. The plurality of processing procedures include a plurality of procedures (also referred to as liquid processing procedures) for respectively defining the conditions of the processes performed on the substrate W using the processing liquid, and a plurality of procedures (also referred to as measurement processing procedures) for respectively defining the conditions of the measurement processes. The procedure identification information and the correction form identification information are respectively applied with, for example, numbers, number sequences, character sequences, or a combination of numbers and characters, etc., which are assigned to each processing procedure and each correction form.

[0063] The control unit 15 includes, for example, a calculation processing unit 15a that functions as a processor and a memory 15b for temporarily storing information. The calculation processing unit 15a can be, for example, an electrical circuit such as a central processing unit (CPU (Central Processing Unit: Central Processing Unit)). The memory 15b can be, for example, a random access memory (RAM: Random Access Memory). The calculation processing unit 15a can realize the functions of the management device 10 by, for example, reading and executing a program 14pg stored in the storage unit 14. Various information temporarily obtained by various information processing in the control unit 15 can be appropriately stored in the memory 15b.

[0064] The drive 16 is, for example, a part that can load and unload the portable storage medium RM10. The drive 16, for example, can transfer data between the storage medium RM10 and the control unit 15 when the storage medium RM10 is installed. Here, for example, the storage medium RM10 storing the program 14pg can be installed in the drive 16, and the program 14pg can be read from the storage medium RM10 and stored in the storage unit 14.

[0065] Figure 2 (b) is a block diagram showing an example of a functional structure implemented by the calculation processing unit 15a. Figure 2 As shown in (b) of FIG. 1 , the operation processing unit 15a has, for example, a transmission control unit F151 and a storage control unit F152 as the functional structure to be implemented. As a workspace during processing in each unit, for example, a memory 15b is used. Here, for example, at least a part of the functions implemented by the operation processing unit 15a can also be implemented by a dedicated electrical circuit.

[0066] The sending control unit F151 can, for example, send information, tasks, and multiple identification information for each substrate W of each group of substrates W to multiple substrate processing devices 20 through the communication unit 11. Here, the multiple identification information sent includes two or more procedure identification information for respectively specifying two or more processing procedures. The two or more procedure identification information can also specify the order of processing, for example, by describing the order. In addition, the multiple identification information sent here can also, for example, include at least one correction form identification information. At least one correction form identification information can, for example, be associated with at least one procedure identification information of the two or more procedure identification information. Here, at least one correction form identification information associated with at least one procedure identification information can, for example, be determined based on information on the prior state of a group of substrates W that are objects to be processed (processed information, material, film thickness, etc.).

[0067] The storage control unit F152 can store, for example, information received from each of the plurality of substrate processing apparatuses 20 via the communication unit 11 in the storage unit 14 .

[0068] (1-3. Substrate processing apparatus)

[0069] Figure 3 1 is a schematic top view showing an example of a schematic structure of a substrate processing device 20. The substrate processing device 20 is, for example, a single-sheet device that can perform various processes by supplying a processing liquid to the surface of a substrate W. Here, a semiconductor substrate (wafer) can be used as an example of a substrate W. The various processes include, for example, a liquid treatment for etching with a liquid, a cleaning treatment for removing foreign matter or an object with a liquid, a rinsing treatment for rinsing with water, and a coating treatment for coating a resist, etc.

[0070] The substrate processing apparatus 20 includes a plurality of load ports LP, a transfer unit 24, a liquid storage unit 23, and a plurality of processing units 21. In addition, the substrate processing apparatus 20 includes, for example, a main control unit PC0, a predetermined management control unit PC1, a plurality of part control units PC2, a liquid management control unit PC3, and a data storage NA1.

[0071] (1-3-1. Loading port)

[0072] Each of the plurality of loading ports LP is a mechanism (also referred to as a container holding mechanism) capable of holding a carrier (also referred to as a FOUP (Front Opening Unified Pod: front-opening wafer transfer box)) C as a container. Figure 3In the example of , there are a first loading port LP1, a second loading port LP2, a third loading port LP3, and a fourth loading port LP4 as a plurality of loading ports LP. The first loading port LP1 to the fourth loading port LP4 have a function as a portion (also referred to as a loading and unloading portion) for carrying in and out a plurality of substrate groups between the substrate processing apparatus 20 and the outside of the substrate processing apparatus 20. Figure 3 In the example of FIG. 1 , the first load port LP1 to the fourth load port LP4 are arranged horizontally spaced apart from each processing unit 21. In addition, the first load port LP1 to the fourth load port LP4 are arranged along the horizontal first direction DR1 when viewed from above.

[0073] Here, for example, the carrier C is transported from the carrier placement area 40 by the transport device 30 and placed on the first loading port LP1 to the fourth loading port LP4. The carrier C can accommodate, for example, a plurality of substrates W (twenty-five in the first embodiment) as a set of substrates W. The movement of the transport device 30 can be controlled by, for example, the management device 10. Here, for example, the transport device 30 can also transport the carrier C between a plurality of substrate processing devices 20. Figure 3 In the example of FIG. 1 , the transport device 30 can move along the first direction DR1 and the second horizontal direction DR2 perpendicular to the first direction DR1. Therefore, for example, a carrier C for accommodating a plurality of substrates W constituting a substrate group can be transported from the carrier placement area 40 and placed in any one of the first load port LP1 to the fourth load port LP4. In addition, in the first load port LP1 to the fourth load port LP4, a plurality of carriers C can be arranged along the first direction DR1.

[0074] (1-3-2. Transport unit)

[0075] The transport unit 24 can, for example, sequentially transport a plurality of substrates W in a group of substrates W contained in a carrier C held by a loading port LP toward a plurality of processing units 21. In the first embodiment, the transport unit 24 includes an indexer robot IR and a center robot CR. The indexer robot IR can, for example, transport the substrates W between the first loading port LP1 to the fourth loading port LP4 and the center robot CR. The center robot CR can, for example, transport the substrates W between the indexer robot IR and each processing unit 21.

[0076] Specifically, the indexer robot IR can, for example, transport a plurality of substrates W one by one from the carrier C to the central robot CR, and can transport a plurality of substrates W one by one from the central robot CR to the carrier C. Similarly, the central robot CR can, for example, transport a plurality of substrates W one by one from the indexer robot IR to each processing unit 21, and can transport a plurality of substrates W one by one from each processing unit 21 to the indexer robot IR. In addition, for example, the central robot CR can transport substrates W between a plurality of processing units 21 as needed.

[0077] exist Figure 3 In the example of FIG. 1 , the indexer robot IR has two hands H that are U-shaped when viewed from above. The two hands H are arranged at different heights. Each hand H can support the substrate W in a horizontal posture. The indexer robot IR can move the hand H in the horizontal direction and the vertical direction. Furthermore, the indexer robot IR can change the direction of the hand H by rotating (rotating) around an axis in the vertical direction. The indexer robot IR passes through the handover position (at Figure 3 The indexer robot IR moves along the first direction DR1 in a path 201 (in which the position of the indexer robot IR is depicted). The handover position is a position where the indexer robot IR and the central robot CR are relative to each other in a direction orthogonal to the first direction DR1 when viewed from above. The indexer robot IR can make the hand H relative to any carrier C and the central robot CR, respectively. Here, for example, the indexer robot IR can perform a loading action for loading the substrate W into the carrier C and a unloading action for unloading the substrate W from the carrier C by moving the hand H. In addition, for example, the indexer robot IR can cooperate with the central robot CR and perform a handover action at the handover position, and the handover action is an action of moving the substrate W from one of the indexer robot IR and the central robot CR to the other.

[0078] Similar to the indexer robot IR, Figure 3In the example, the central robot CR has two hands H that are U-shaped when viewed from above. The two hands H are arranged at different heights. Each hand H can support a substrate W in a horizontal posture. The central robot CR can move each hand H in the horizontal direction and the vertical direction. Furthermore, the central robot CR can change the direction of the hand H by rotating (rotating) around an axis along the vertical direction. The central robot CR is surrounded by a plurality of processing units 21 when viewed from above. The central robot CR can make the hand H face any processing unit 21 and any indexer robot IR. Here, for example, the central robot CR can perform a loading action for loading the substrate W into each processing unit 21 and a unloading action for unloading the substrate W from each processing unit 21 by moving the hand H. Here, each processing unit 21 has an openable and closable shutter for shielding the processing unit 21 and the central robot CR. The shutter is opened when the central robot CR moves the substrate W into or out of the processing unit 21. In addition, for example, the central robot CR can cooperate with the indexer robot IR and perform a handover operation, which is an operation of moving the substrate W from one of the indexer robot IR and the central robot CR to the other.

[0079] In addition, a portion (also referred to as a gas supply portion) 22a for supplying gas (e.g., air) to the internal space Sc0 and a portion (also referred to as a sensor portion) 22s for detecting an index (e.g., temperature, etc.) representing the state of the environment of the internal space Sc0 are provided in the internal space Sc0 of the box in which the plurality of processing units 21 and the central robot CR are located. The sensor portion 22s can also detect the amount of gas supplied by the gas supply portion 22a to the internal space Sc0 as an index representing the state of the environment of the internal space Sc0. Here, the state of the environment of the internal space Sc0 affects the substrate processing in the plurality of processing units 21. Therefore, the sensor portion 22s can obtain signals related to one or more indexes regarding the status of the substrate processing in the plurality of processing units 21.

[0080] (1-3-3. Liquid storage unit)

[0081] The liquid storage unit 23 can store, for example, the processing liquid L1 used in the plurality of processing units 21 (see Figure 4 The liquid storage unit 23 includes, for example, one or more storage tanks 23t that can store the treatment liquid L1. Figure 3In the example, the liquid storage unit 23 has three storage tanks 23t including a first storage tank 23ta, a second storage tank 23tb and a third storage tank 23tc. In each storage tank 23t, for example, a sensor unit 23s and a heating unit 23h are provided. The sensor unit 23s is a part for measuring physical quantities representing the state (for example, concentration, hydrogen ion index (pH (power of hydrogen; acid-base value)) and temperature, etc.) of the processing liquid L1 in the storage tank 23t. The processing liquid L1 is used for processing the substrate W in the processing unit 21. Moreover, the processing liquid L1 may deteriorate, for example, depending on the passage of time and the degree of use. Therefore, the state of the processing liquid L1 affects the substrate processing in the processing unit 21. That is, the sensor unit 23s can obtain a signal related to an indicator of the status of the substrate processing in multiple processing units 21. The heating unit 23h is a part including a heating element, which is used to adjust the temperature of the processing liquid L1 in the storage tank 23t. The heating method of the heating element is, for example, a radiant heating method using a halogen lamp, an indirect heating method without direct contact with the liquid, or a radiant heating method using near-infrared rays. Figure 3 In the example, the first sensor portion 23sa and the first heating portion 23ha are located in the first storage tank 23ta, the second sensor portion 23sb and the second heating portion 23hb are located in the second storage tank 23tb, and the third sensor portion 23sc and the third heating portion 23hc are located in the third storage tank 23tc. Here, for example, a mechanism for stirring the treatment liquid L1 may also exist in each storage tank 23t. In addition, for example, more than one storage tank 23t is connected to each processing unit 21 in a state where the treatment liquid L1 can be supplied. Here, each storage tank 23t may be connected to all of the multiple processing units 21, or may be connected to a part of the multiple processing units 21. In addition, here, the three storage tanks 23t may store the same type of treatment liquid L1, or may store different types of treatment liquids L1. In other words, the same type of processing liquid L1 may be stored among the first storage tank 23ta, the second storage tank 23tb, and the third storage tank 23tc, or different types of processing liquid L1 may be stored.

[0082] (1-3-4. Processing unit)

[0083] The plurality of processing units 21 can process the substrate W respectively. Figure 3 In the example of FIG. 1 , three groups of processing units 21 each consisting of four processing units 21 arranged in a planar manner are arranged in a stacked manner in the vertical direction. Thus, there are a total of twelve processing units 21. The plurality of processing units 21 include, for example, two or more processing units 21 that can perform the same type of substrate processing on the substrate W. Thus, the same type of substrate processing can be performed on the substrate W in parallel in the plurality of processing units 21.

[0084] Figure 4 : is a diagram schematically showing a structural example of a processing unit 21. The processing unit 21 can process the substrate W using a processing liquid L1. In the processing unit 21, for example, by supplying the processing liquid L1 to a main surface (also called the upper surface) Us1 of the substrate W that is rotating in a plane, various processes can be performed on the upper surface Us1 of the substrate W. The processing liquid L1 is generally a liquid with low viscosity, such as water or a liquid having fluidity and used for processing the substrate. The liquid system is an etching liquid or a cleaning liquid. More specifically, the liquid system can be a liquid containing sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, hydrofluoric nitric acid, ammonia water, hydrogen peroxide water, organic acid (such as citric acid, oxalic acid, etc.), organic base (such as TMAH (tetramethylammonium hydroxide), isopropyl alcohol (IPA: isopropyl alcohol)), surfactant, and anti-corrosion agent.

[0085] like Figure 4 As shown, the processing unit 21 includes, for example, a holding portion 211 , a rotating mechanism 212 , a processing liquid supply system 213 , and a sensor portion 214 .

[0086] The holding part 211 can hold the substrate W in a substantially horizontal posture and rotate the substrate W. The holding part 211 can be, for example, a vacuum chuck or a clamping chuck. The vacuum chuck has an upper surface 211u that can vacuum-absorb the other main surface (also referred to as the lower surface) Bs1 opposite to the upper surface Us1 of the substrate W, and the clamping chuck has a plurality of chuck pins that can clamp the peripheral edge of the substrate W.

[0087] The rotating mechanism 212 can rotate the holding part 211, for example. The structure of the rotating mechanism 212, for example, is applied with a structure having a rotating support shaft 212s and a rotating driving part 212m. The rotating support shaft 212s, for example, is connected to the holding part 211 at the upper end thereof and extends in the vertical direction. The rotating driving part 212m, for example, has a motor, etc., which can rotate the rotating support shaft 212s around an imaginary rotating axis Ax1 along the vertical direction as the center. Here, for example, the rotating driving part 212m rotates the rotating support shaft 212s around the rotating axis Ax1 as the center, thereby rotating the holding part 211 while maintaining a posture along the horizontal plane. Therefore, for example, the substrate W held on the holding part 211 rotates around the rotating axis Ax1 as the center. Here, for example, when the upper surface Us1 and the lower surface Bs1 of the substrate W are substantially circular, the rotating axis Ax1 passes through the center of the upper surface Us1 and the lower surface Bs1 of the substrate W.

[0088] The processing liquid supply system 213 can, for example, eject one or more processing liquids L1 toward the substrate W. Figure 4 In the example of , the processing liquid supply system 213 includes a first processing liquid supply part 213a, a second processing liquid supply part 213b, and a third processing liquid supply part 213c.

[0089] The first processing liquid supply part 213a, for example, has a nozzle Nz1, a piping part Pp1, a movable piping part At1, a spray valve Vv1, and a liquid delivery supply part Su1. The nozzle Nz1, for example, can spray the first processing liquid L11, which is a type of processing liquid L1, toward the substrate W held by the holding part 211. The piping part Pp1 connects the liquid delivery supply part Su1 and the nozzle Nz1, and forms a flow path for the first processing liquid L11. In addition, the movable piping part At1 is located in the middle of the piping part Pp1, and supports a portion of the piping part Pp1 on the nozzle Nz1 side in a manner that allows it to rotate around an axis in the vertical direction. Moreover, for example, the state in which the nozzle Nz1 is located on the substrate W (also referred to as a liquid sprayable state) and the state in which the nozzle Nz1 is not located on the substrate W (also referred to as a retracted state) can be switched by the driving force of a driving part such as a motor. Figure 4 In the example, the first processing liquid supply part 213a is in a state capable of discharging liquid, and the nozzle Nz1 can discharge the first processing liquid L11 from directly above the substrate W toward the upper surface Us1 of the substrate W. The discharge valve Vv1 is, for example, disposed in the middle of the piping part Pp1, and can be opened and closed according to a signal from the partial control unit PC2. Here, for example, the discharge valve Vv1 is opened, thereby bringing the liquid delivery supply part Su1 into a state of being connected to the nozzle Nz1. In addition, for example, the discharge valve Vv1 is closed, thereby bringing the liquid delivery supply part Su1 into a state of being disconnected from the nozzle Nz1. The liquid delivery supply part Su1 can, for example, deliver and supply the first processing liquid L11 from, for example, the liquid storage unit 23 (here, the first storage tank 23ta) toward the piping part Pp1 according to a signal from the main control unit PC0 or the partial control unit PC2. The liquid delivery supply part Su1 uses, for example, a pump.

[0090] The second processing liquid supply part 213b has a structure similar to the first processing liquid supply part 213a. Specifically, the second processing liquid supply part 213b has, for example, a nozzle Nz2, a piping part Pp2, a movable piping part At2, a spray valve Vv2, and a liquid delivery supply part Su2. The nozzle Nz2 can, for example, spray the second processing liquid L12, which is a type of processing liquid L1, toward the substrate W held by the holding part 211. The piping part Pp2 connects the liquid delivery supply part Su2 and the nozzle Nz2, and forms a path for the second processing liquid L12 to flow. In addition, the movable piping part At2 is located in the middle of the piping part Pp2, and supports the part of the nozzle Nz2 side in the piping part Pp2 in a manner that can rotate around an axis in the vertical direction as the center. Moreover, for example, the driving force of a driving part such as a motor can switch the state in which the nozzle Nz2 is located on the substrate W (a state in which liquid can be sprayed) and the state in which the nozzle Nz2 is not located on the substrate W (a retreat state). In Figure 4 In the example, the second processing liquid supply part 213b is in a state where liquid can be ejected, and the nozzle Nz2 can eject the second processing liquid L12 from directly above the substrate W toward the upper surface Us1 of the substrate W. The ejection valve Vv2 is, for example, arranged in the middle of the piping part Pp2, and can be opened and closed according to a signal from the partial control unit PC2. Here, for example, the ejection valve Vv2 is opened, thereby the liquid delivery supply part Su2 and the nozzle Nz2 are connected. In addition, for example, the ejection valve Vv2 is closed, thereby the liquid delivery supply part Su2 and the nozzle Nz2 are not connected. The liquid delivery supply part Su2 can, for example, transport and supply the second processing liquid L12 from the liquid storage unit 23 (here, the second storage tank 23tb) toward the piping part Pp2 according to a signal from the main control unit PC0 or the partial control unit PC2. The liquid delivery supply part Su2 uses, for example, a pump.

[0091] Although in Figure 4 The first processing liquid supply unit 213a and the second processing liquid supply unit 213b are both in a state where they can spray liquid, but in reality, the first processing liquid supply unit 213a and the second processing liquid supply unit 213b are both in a retreated state, and one of the first processing liquid supply unit 213a and the second processing liquid supply unit 213b is selectively switched to a state where one of the first processing liquid supply unit 213a and the second processing liquid supply unit 213b can spray liquid. Figure 4 Although the first processing liquid supply part 213a and the second processing liquid supply part 213b are staggered up and down so as not to interfere with each other, as long as the switching action between the retreat state and the liquid spraying state of the first processing liquid supply part 213a and the second processing liquid supply part 213b is properly synchronized, the first processing liquid supply part 213a and the second processing liquid supply part 213b will not interfere with each other even if they do not have a staggered relationship up and down.

[0092] The third processing liquid supply unit 213c includes, for example, a nozzle Nz3, a pipe unit Pp3, a discharge valve Vv3, and a liquid delivery supply unit Su3. The nozzle Nz3 can discharge, for example, a third processing liquid L13 which is a type of the processing liquid L1 toward the substrate W held by the holding unit 211. Figure 4 In the example of , the nozzle Nz3 can eject the third processing liquid L13 from the oblique upper side of the substrate W toward the upper surface Us1 of the substrate W. The piping section Pp3 connects the liquid delivery supply section Su3 and the nozzle Nz3, and forms a path for the flow of the third processing liquid L13. The ejection valve Vv3 is, for example, arranged in the middle of the piping section Pp3, and can be opened and closed according to a signal from the partial control unit PC2. Here, for example, the ejection valve Vv3 is opened, thereby the liquid delivery supply section Su3 and the nozzle Nz3 are connected. In addition, for example, the ejection valve Vv3 is closed, thereby the liquid delivery supply section Su3 and the nozzle Nz3 are not connected. The liquid delivery supply section Su3 can, for example, deliver and supply the third processing liquid L13 from, for example, the liquid storage unit 23 (here, the third storage tank 23tc) toward the piping section Pp3 according to a signal from the main control unit PC0 or the partial control unit PC2. The liquid delivery supply section Su3 is, for example, an application pump.

[0093] The processing unit 21 having the above-mentioned structure can, for example, sequentially spray the first processing liquid L11 from the nozzle Nz1 of the first processing liquid supply part 213a toward the substrate W, spray the second processing liquid L12 from the nozzle Nz2 of the second processing liquid supply part 213b toward the substrate W, and spray the third processing liquid L13 from the nozzle Nz3 of the third processing liquid supply part 213c toward the substrate W.

[0094] Here, the processing liquid L1 sprayed from each nozzle Nz1 to Nz3 toward the substrate W is recovered by, for example, a cup set downward from the side of the substrate W and returned to the storage tank 23t corresponding to the liquid storage unit 23. In other words, the processing liquid L1 stored in the liquid storage unit 23 is repeatedly used for substrate processing in a cyclic manner. At this time, for example, the processing liquid L1 shows a tendency to slowly deteriorate according to the number of times it is used. Here, when the processing liquid L1 returns from the processing unit 21 to the liquid storage unit 23, the processing liquid L1 can also be purified by a filter or the like.

[0095] In addition, here, for example, one, two, or four or more processing liquid supply parts may be present in the processing unit 21 .

[0096] The sensor unit 214 can acquire, for example, a signal related to an index of the status of substrate processing in the processing unit 21. Figure 4In the example, the sensor unit 214 has a film thickness meter Fm0 and a shooting unit 21sb for obtaining a signal related to one or more indicators indicating the state of the substrate W. The film thickness meter Fm0 can be applied, for example, a reflection spectroscopic film thickness meter that utilizes the interference of light. The reflection spectroscopic film thickness meter can, for example, perform spectroscopy using a prism, etc., and use a conversion formula to calculate the film thickness from the light of a wavelength with a high intensity of the interference of light. Here, in the reflection spectroscopic film thickness meter, for example, as long as the conversion formula for calculating the film thickness is corrected for each material according to the refractive index that depends on the temperature, the measurement accuracy of the film thickness can be improved. The shooting unit 21sb, for example, uses a component that utilizes a shooting element, such as an area sensor in which light receiving elements are arranged in a planar manner.

[0097] The film thickness gauge Fm0 is fixed to, for example, an arm Am1, which is supported by a movable portion At0 so as to be rotatable around an axis in a vertical direction. Moreover, the arm Am1 is rotated, for example, by a driving force of a driving portion such as a motor, thereby switching between a state in which the film thickness gauge Fm0 is on the substrate W (a measurable state) and a state in which the film thickness gauge Fm0 is not on the substrate W (a retreat state). The film thickness gauge Fm0 may also be protected by a shielding member (shield) in the retreat state to prevent the processing liquid L1 from adhering. Here, the arm Am1 is rotated while the substrate W is appropriately rotated by the rotating mechanism 212, thereby enabling the film thickness gauge Fm0 to measure the thickness (film thickness) of various films in a wide range located on the substrate W. Here, the film thickness may also be, for example, any one of an average value, a minimum value, and a maximum value of the film thickness at a plurality of locations. Here, as the film located on the substrate W, various films such as oxide films, single crystal silicon (siliconsingle crystal) layers, polycrystalline silicon (polycrystal silicon) layers, amorphous silicon (amorphous silicon) layers, and resist films can be used. The film thickness meter Fm0 can measure the film thickness of the film on the substrate W before and after the substrate W is processed by the processing liquid L1 in the processing unit 21. Therefore, a signal related to the film thickness can be obtained as an indicator of the status of the substrate processing in the processing unit 21. The film thickness meter Fm0 sends the obtained signal to the partial control unit PC2, for example. Figure 4 In FIG. 1 , although the distance between the upper surface Us1 of the substrate W and the film thickness gauge Fm0 is simply depicted as being relatively far in the measurable state, the film thickness gauge Fm0 actually measures the film thickness in a state close to the upper surface Us1 of the substrate W.

[0098] The imaging unit 21sb, for example, images the conditions on the substrate W before and after the substrate W is processed by the processing liquid L1 in the processing unit 21, thereby acquiring an image signal related to the state of the upper surface Us1 of the substrate W as an indicator of the conditions of the substrate processing in the processing unit 21. The imaging unit 21sb, for example, transmits the acquired image signal to the partial control unit PC2.

[0099] The sensor unit 214 may also include the following components, for example: a flow meter for detecting the amount of the processing liquid L1 ejected from each nozzle Nz1 to Nz3; and a sensor (such as an angle sensor, etc.) for detecting the position (also called the ejection position) at which each nozzle Nz1, Nz2 ejects the processing liquid L1.

[0100] (1-3-5. Main unit control unit)

[0101] The main body control unit PC0 can perform, for example, data transmission and reception between the main body control unit PC0 and the management device 10 and control of the operation of each unit in the substrate processing apparatus 20 .

[0102] Figure 5 1 is a block diagram showing the connection method of the control system and the data transmission and reception system in the substrate processing device 20. Here, the main control unit PC0, the scheduled management control unit PC1, the plurality of part control units PC2, and the liquid management control unit PC3 are connected in a manner that various control signals can be mutually transmitted and received via the control communication line L0c. In addition, the main control unit PC0, the scheduled management control unit PC1, the plurality of part control units PC2, the liquid management control unit PC3, and the data storage NA1 are connected in a manner that various data can be mutually transmitted and received via the data communication line L0d. The control communication line L0c and the data communication line L0d may be either a wired line or a wireless line, respectively.

[0103] Figure 6 (a) is a block diagram showing an example of the electrical structure of the main control unit PC0. Figure 6 As shown in (a) in FIG. 1 , the main control unit PC0 is realized by, for example, a computer, and includes a communication unit P01, an input unit P02, an output unit P03, a storage unit P04, a control unit P05, and a driver P06 connected via a bus Bu0.

[0104] The communication unit P01 has, for example, a function as a transmitting unit and a receiving unit, and can perform signal transmission and reception between the predetermined management control unit PC1, the plurality of part control units PC2, and the liquid management control unit PC3 via the control communication line L0c, and can perform data transmission and reception between the predetermined management control unit PC1, the plurality of part control units PC2, and the liquid management control unit PC3 via the data communication line L0d. In addition, the communication unit P01 has, for example, a function of transmitting and receiving information with respect to the management device 10 via the communication line 5. In other words, the communication unit P01 has, for example, a function as a part (also referred to as a second communication unit) for transmitting and receiving information between the communication unit P01 and the management device 10. In this case, the communication unit P01 can, for example, receive information of each substrate W of each group of substrates W, a task, and two or more identification information sent from the management device 10.

[0105] The input unit P02 can input, for example, a signal corresponding to the action of the user using the substrate processing apparatus 20. Here, similarly to the input unit 12, the input unit P02 can include, for example, an operation unit, a microphone, and various sensors. The input unit P02 can also input, for example, a signal for instructing manual correction of information on the protocol.

[0106] The output unit P03 can output various information, for example. Like the output unit 13, the output unit P03 can include, for example, a display unit and a speaker. The display unit may be in the form of a touch panel integrated with at least a part of the input unit P02.

[0107] The storage unit P04 can store information, for example. The storage unit P04 can be composed of a non-volatile storage medium such as a hard disk or a flash memory. In the storage unit P04, any one of a structure having one storage medium, a structure having two or more storage media integrally, and a structure in which two or more storage media are divided into two or more parts can also be adopted. The storage unit P04 can store, for example, a program pg0, various information Dt0, and a data group Db0. The storage unit P04 can also include, for example, a memory P05b described later.

[0108] The various information Dt0 includes, for example, information on each substrate W in each group of substrates W transmitted from the management device 10 , a task, a plurality of identification information, and the like.

[0109] Figure 7 is a diagram showing an example of the contents of data group Db0. Figure 7 As shown, the data group Db0 includes, for example, a liquid processing rule group Gp1, a measurement processing rule group Gp2, and a correction rule group Gp3.

[0110] The liquid processing procedure group Gp1 includes, for example, a plurality of liquid processing procedures R1. Figure 7 In the example of , the plurality of liquid processing rules R1 include a first liquid processing rule R1a, a second liquid processing rule R1b, a third liquid processing rule R1c, a fourth liquid processing rule R1d, a fifth liquid processing rule R1e, and a sixth liquid processing rule R1f. Specifically, the plurality of liquid processing rules R1 may include, for example, a rule for prescribing conditions for liquid processing for etching by a liquid, a rule for prescribing conditions for a cleaning process for removing foreign matter or an object by a liquid, a rule for prescribing conditions for a rinsing process by rinsing with water, and a rule for prescribing conditions for a coating process for applying a resist, etc. In addition, for example, when the liquid treatment is composed of a treatment using the first treatment liquid L11, a treatment using the second treatment liquid L12, a treatment using the third treatment liquid L13, and a drying treatment, the plurality of liquid treatment procedures R1 may also individually apply a procedure for specifying the conditions for the treatment using the first treatment liquid L11, a procedure for specifying the conditions for the treatment using the second treatment liquid L2, a procedure for specifying the conditions for the treatment using the third treatment liquid L13, and a procedure for specifying the conditions for the drying treatment. Here, for example, the first treatment liquid L11 may be a hydrofluoric nitric acid mixed with hydrofluoric acid and nitric acid as an etching liquid. The second treatment liquid L12 may be a mixed liquid (SC1 liquid) mixed with ammonia water and hydrogen peroxide water as a cleaning liquid. The third treatment liquid L13 may be pure water as a rinse liquid. In addition, the conditions of liquid treatment consisting of, for example, treatment using the first treatment liquid L11, treatment using the second treatment liquid L12, treatment using the third treatment liquid L13, and drying treatment may be specified by one liquid treatment procedure R1 or by any number of more than two liquid treatment procedures R1.

[0111] The measurement processing procedure group Gp2 includes, for example, a plurality of measurement processing procedures R2. Figure 7In the example, the plurality of measurement processing procedures R2 include a first measurement processing procedure R2a, a second measurement processing procedure R2b, a third measurement processing procedure R2c, a fourth measurement processing procedure R2d, a fifth measurement processing procedure R2e, and a sixth measurement processing procedure R2f. The measurement processing procedure R2, for example, specifies the conditions for the measurement processing of the sensor unit 214, which is used to obtain a signal related to an indicator of the status of the substrate processing in the processing unit 21. For example, consider a method in which the measurement processing procedure R2 specifies the conditions for measuring the thickness of a film on the substrate W using the film thickness meter Fm0. Furthermore, the plurality of measurement processing procedures R2, for example, may include procedures for respectively specifying the conditions for measurements of different positions and measurement times for measuring the film thickness by the film thickness meter Fm0. In addition, the measurement processing procedure group Gp2 may, for example, include more than one measurement processing procedure R2, or may include any number of more than two measurement processing procedures R2.

[0112] Thus, the data group Db0 includes a plurality of processing procedures including a plurality of liquid processing procedures R1 and one or more measurement processing procedures R2.

[0113] The correction formula group Gp3 includes, for example, a first correction formula group Gp31 and a second correction formula group Gp32. The first correction formula group Gp31 includes, for example, one or more first correction formulas C31 for correcting at least a part of the conditions of the liquid processing procedure R1. Figure 7 In the example of the embodiment, the one or more first correction formulas C31 include a 1A correction formula C31a, a 1B correction formula C31b, a 1C correction formula C31c, a 1D correction formula C31d, a 1E correction formula C31e, and a 1F correction formula C31f. Each of the first correction formulas C31 is a correction formula for correcting at least a part of the conditions of the liquid processing procedure R1 based on the signal of the index obtained by the sensor unit 22s, 23s, 214, for example.

[0114] For example, the following method is considered: when the liquid processing rule R1 specifies conditions such as the time for etching the film of the substrate W using the processing liquid (also referred to as the etching time), the first correction formula C31 is used to change the numerical value of a part of the condition specified by the liquid processing rule R1, that is, the etching time, etc., according to indicators such as the concentration, temperature, and etching rate of the processing liquid. The etching time is applied, for example, to the supply time of the etching liquid to the substrate W. In this case, the following correction formula is considered: for example, the index is applied to the variable, thereby calculating the coefficient (also referred to as the correction coefficient) used to multiply the numerical value of the part of the condition, that is, the correction object (for example, the etching time) to correct the numerical value. For example, the correction formula may be a correction formula that adds a coefficient to a part including one variable, or a correction formula that adds coefficients to parts including two or more variables. For example, the following correction formula is considered: the correction coefficient is calculated by multiplying the second value by the first value, the first value being the value obtained by multiplying the first coefficient by the part including the first variable, and the second value being the value obtained by multiplying the second coefficient by the part including the second variable. Furthermore, for example, the correction formula may be a correction formula in which a correction coefficient (also called a first correction coefficient) is multiplied by the numerical value of the correction object and then a third value (also called a second correction coefficient) is added, where the third value is a value obtained by multiplying the third coefficient by the part including the third variable.

[0115] Here, for example, the initial value of the correction coefficient is set to 1. In addition, for example, the portion including the first variable may be changed in stages relative to the change of the first indicator, and the portion including the second variable may be changed in stages relative to the change of the second indicator. Here, for example, the following situation is assumed: the first indicator is the etching rate (also referred to as the first etching rate) in the etching process recently performed on the substrate W by one processing unit 21, the second indicator is the etching rate (also referred to as the second etching rate) in the etching process recently performed on the substrate W by another processing unit 21, and the third indicator is a numerical value indicating the number of times the processing liquid L1 in the storage tank 23t has been used since the most recent liquid exchange. In this case, for example, the first coefficient to the third coefficient act as coefficients that add weights to the first indicator to the third indicator. Here, for example, the first coefficient is set to an arbitrary number from 0 to 1 (for example, 0.8, etc.), the second coefficient is set to (1-(first coefficient), etc.), and the third coefficient is set to an arbitrary number (for example, 0.1, etc.). Furthermore, for example, the following method is considered: when the value obtained by dividing the first etching rate as the first indicator by the reference value of the first etching rate is 0.95 to 1.05, the portion including the first variable is set to 1; when the value obtained by dividing the first etching rate as the first indicator by the reference etching rate is 1.05 to 1.15, the portion including the first variable is set to 1.1. Furthermore, for example, the following method is considered: when the value obtained by dividing the second etching rate as the second indicator by the reference value of the second etching rate is 0.95 to 1.05, the portion including the second variable is set to 1; when the value obtained by dividing the second etching rate as the second indicator by the reference value of the second etching rate is 1.05 to 1.15, the portion including the second variable is set to 1.1. The portion including the second variable may also be set to the same value as the portion including the first variable, for example. In addition, regarding the portion including the third variable, for example, in the case of a new processing liquid L1, the numerical value indicating the number of times used is 0, and according to the use of the processing liquid L1, the numerical value indicating the number of times used becomes a natural number greater than 1. Here, the following method is considered: for example, the processing capacity of the processing liquid L1 decreases according to the number of times used, and when the number of times used is once, the etching time is extended by 0.1 hours, and when the number of times used is twice, the etching time is extended by 0.2 hours.

[0116] The second correction formula group Gp32 includes, for example, one or more second correction formulas C32 for correcting at least a part of the conditions of the measurement processing procedure R2. Figure 7In the example, one or more second correction formulas C32 include a 2A correction formula C32a, a 2B correction formula C32b, a 2C correction formula C32c, a 2D correction formula C32d, a 2E correction formula C32e, and a 2F correction formula C32f. Each second correction formula C32 applies, for example, the following correction formula: based on the signal of the index obtained by the sensor unit 22s, 23s, 214, etc., at least a part of the conditions of the measurement processing procedure R2 is corrected. Here, for example, the following method is considered: when the measurement processing procedure R2 stipulates the conditions for measuring the thickness (film thickness) of the film of the substrate W using the film thickness meter Fm0, the second correction formula C32 is used to change the correction processing of the transformation formula for calculating a part of the conditions stipulated by the measurement processing procedure R2, that is, the film thickness, according to the index such as the temperature of the processing unit 21. In this method, the second correction formula C32 can be set for each film material, for example.

[0117] The control unit P05 includes, for example, a calculation processing unit P05a that functions as a processor and a memory P05b for temporarily storing information. The calculation processing unit P05a can be, for example, an electrical circuit such as a CPU. The memory P05b can be, for example, a RAM. The calculation processing unit P05a can, for example, read and execute the program Pg0 stored in the storage unit P04 to realize the function of the main control unit PC0 of the present invention. Various information temporarily obtained by various information processing in the control unit P05 can be appropriately stored in the memory P05b.

[0118] The driver P06 is, for example, a part that can load and unload the portable storage medium RM0. The driver P06 can, for example, transfer data between the storage medium RM0 and the control unit P05 when the storage medium RM0 is installed. In addition, when the storage medium RM0 storing the program Pg0 is installed in the driver P06, the driver P06 can also read the program Pg0 from the storage medium RM0 and store it in the storage unit P04.

[0119] Figure 6 (b) is a block diagram showing an example of a functional structure implemented by the operation processing unit P05a. Figure 6 As shown in (b) in FIG. 1 , the operation processing unit P05a includes, for example, an information acquisition unit F01, a production unit F02, a storage control unit F03, an instruction unit F04, an output control unit F05, and a transmission control unit F06 as the functional structure to be implemented. As a workspace during processing in each unit, for example, a memory P05b is used. Here, for example, at least a part of the functions implemented by the operation processing unit P05a can also be implemented by a dedicated electrical circuit.

[0120] The information acquisition unit F01 can acquire, for example, information of each substrate W of each group of substrates W, a task, and two or more identification information sent from the management device 10. The information of each substrate W can include, for example, the number of the slot in which the substrate W is held in the carrier C, the form of the substrate W (film thickness and film thickness distribution, etc.), and processed information. The two or more identification information includes, for example, two or more protocol identification information and at least one revision identification information associated with at least one of the two or more protocol identification information.

[0121] The production unit F02 can, for example, produce a procedure (also referred to as a flow procedure) FL1 for defining a series of processes for a substrate W. For example, the production unit F02 can produce a flow procedure FL1 for defining a series of processes for a substrate W by combining two or more of the multiple processing procedures for defining the conditions for processing respectively stored in the storage unit P04. In the first embodiment, the production unit F02 can produce the flow procedure FL1 by combining two or more of the multiple processing procedures stored in the storage unit P04 based on two or more identification information acquired by the information acquisition unit F01. Here, for example, the combination order of the two or more processing procedures can be set according to the description order of the two or more identification information. In this way, for example, a flow procedure FL1 can be produced for a group of substrates W such as twenty-five substrates W accommodated in one carrier C.

[0122] Furthermore, as long as such a structure is adopted, for example, even if the conditions for a series of processes on the substrate W increase, it is possible to create a flow program FL1 by combining two or more of the plurality of process programs prepared in advance, instead of increasing the number of the flow programs FL1 prepared in advance. Therefore, for example, the amount of data prepared in advance in the substrate processing system 1, the management device 10, and the substrate processing device 20 can be reduced. As a result, for example, the amount of data used in the substrate processing system 1, the management device 10, and the substrate processing device 20 can be reduced.

[0123] Here, a mode is considered in which the two or more processing protocols constituting the flow protocol FL1 include, for example, two or more liquid processing protocols R1. Figure 8 This is a diagram showing an example of the flow chart FL1. Figure 8The flow protocol FL1 shown can be produced by, for example, sequentially combining the fourth liquid processing protocol R1d, the first liquid processing protocol R1a, and the fifth liquid processing protocol R1e among the plurality of liquid processing protocols R1 stored in the storage unit P04. Here, for example, the fourth liquid processing protocol R1d specifies the conditions for processing (etching processing, etc.) using the first processing liquid L11 such as hydrofluoric nitric acid, the first liquid processing protocol R1a specifies the conditions for processing (cleaning processing, etc.) using the second processing liquid L12 such as SC1 liquid, and the fifth liquid processing protocol R1e specifies the conditions for processing (rinsing processing, etc.) using the third processing liquid L13 such as pure water. In this case, the production unit F02 produces the flow protocol FL1 by, for example, combining two or more liquid processing protocols R1 among the plurality of liquid processing protocols R1 stored in the storage unit P04. With this configuration, for example, even if the conditions for a series of processes on the substrate W increase, two or more liquid processing procedures among the plurality of processing procedures prepared in advance can be combined to create the flow procedure FL1, instead of increasing the number of the flow procedures FL1 prepared in advance. As a result, for example, the amount of data used in the substrate processing system 1, the management device 10, and the substrate processing apparatus 20 can be reduced.

[0124] Here, a mode is considered in which the two or more processing rules constituting the flow rule FL1 include, for example, one or more liquid processing rules R1 and one or more measurement processing rules R2. Fig. 9 This is a diagram showing another example of the flow chart FL1. Fig. 9The flow protocol FL1 shown can be produced by, for example, sequentially combining the second measurement protocol R2d, the fourth liquid processing protocol R1d, the first liquid processing protocol R1a, the fifth liquid processing protocol R1e, and the second measurement protocol R2d among the plurality of liquid processing protocols R1 stored in the storage unit P04 and the plurality of measurement protocol R2. Here, for example, the following method is considered: the second measurement protocol R2b specifies the conditions for measuring the film thickness of the thin film on the substrate W. In this case, the production unit F02 produces the flow protocol FL1 by, for example, combining one or more liquid processing protocols R1 among the plurality of liquid processing protocols R1 stored in the storage unit P04 and one or more measurement protocol R2 among the plurality of measurement protocol R2 stored in the storage unit P04. With such a configuration, for example, the flow protocol FL1 can be produced by including not only liquid processing but also measurement processing, and combining two or more processing protocols among the plurality of processing protocols. Thus, for example, even if the conditions for a series of processes including the measurement of the substrate W increase, two or more of the plurality of process procedures prepared in advance can be combined to create the flow procedure FL1, instead of increasing the number of the flow procedures FL1 prepared in advance. As a result, for example, the amount of data used in the substrate processing system 1, the management device 10, and the substrate processing apparatus 20 can be reduced.

[0125] In addition, here, at least one processing procedure among the two or more processing procedures constituting the flow procedure FL1 may be combined with at least one correction form. Fig.10 This is a diagram showing another example of the flow chart FL1. Fig.10The flow protocol FL1 shown can be prepared, for example, by sequentially combining the second measurement protocol R2b, the fourth liquid processing protocol R1d, the first liquid processing protocol R1a, the fifth liquid processing protocol R1e, and the second measurement protocol R2b among the plurality of processing protocols stored in the storage unit P04, and each processing protocol is combined with the first revision C31 or the second revision C32. Specifically, for example, the second measurement protocol R2b is combined with the second revision C32a, the fourth liquid processing protocol R1d is combined with the first revision C31e, the first liquid processing protocol R1a is combined with the first revision C31c, the fifth liquid processing protocol R1e is combined with the first revision C31f, and the second measurement protocol R2b is combined with the second revision C32a. In this case, the preparation unit F02 prepares the flow program FL1 by, for example, combining at least one correction form in at least one of the two or more processing programs. Thus, for example, even if the conditions of the processing including the correction of the processing increase, the flow program FL1 can be prepared by combining two or more processing programs among the plurality of processing programs prepared in advance and combining at least one correction form among the plurality of correction forms prepared in advance to at least one processing program, instead of increasing the number of flow programs FL1 prepared in advance. As a result, for example, the amount of data used in the substrate processing system 1, the management device 10, and the substrate processing device 20 can be reduced.

[0126] The storage control unit F03 can store, for example, information acquired by the information acquisition unit F01 and the flow specification FL1 created by the creation unit F02 in the storage unit P04. The storage control unit F03 can also store information of the data group Db0 input from the management device 10 or the storage medium RM0 in the storage unit P04.

[0127] The instruction unit F04 can, for example, give various instructions to the scheduled management control unit PC1, the plurality of partial control units PC2, and the liquid management control unit PC3. The instruction unit F04 can, for example, give instructions to the scheduled management control unit PC1 to set a time schedule for transporting and processing a group of substrates W in the substrate processing apparatus 20, can give instructions to the plurality of partial control units PC2 to perform actions according to the flow chart FL1 and the time schedule, and can give instructions to the liquid management control unit PC3 to perform temperature adjustment, exchange, and monitoring of the processing liquid L1. The time schedule specifies, for example, the transport timing of the substrate W by the transport unit 24 and the processing timing of the substrate W by the plurality of processing units 21. Thus, for example, the plurality of processing units 21 can process the substrate W according to the flow chart FL1 for specifying the conditions for processing the substrate W. In the first embodiment, for example, the same processing can be performed on the substrate W in parallel in two or more of the plurality of processing units 21 according to the same chart. Here, the same processing refers to processing performed in the same order in the processing unit 21 using the same one or more processing liquids L1 and the sensor unit 214. Moreover, for example, even if the time of liquid processing using the processing liquid L1 is increased or decreased by modifying the liquid processing procedure R1, or even if the time of measurement processing using the sensor unit 214 is increased or decreased by modifying the measurement processing procedure R2, as long as the same one or more processing liquids L1 and sensor units 214 are used to perform processing in the same order within the processing unit 21, it can be regarded as the same processing.

[0128] The output control unit F05 can cause the output unit P03 to output information on the state of the substrate processing apparatus 20 visually or audibly, for example.

[0129] The transmission control unit F06 can, for example, cause the communication unit P01 to execute transmission of various information to the management device 10. Here, the various information can, for example, include information on the results of processing a group of substrates W on each carrier C in the substrate processing apparatus 20. In addition, the transmission control unit F06 can, for example, cause the communication unit P01 to execute transmission of information on the flow protocol FL1 to a predetermined management control unit PC1 and a plurality of part control units PC2.

[0130] (1-3-6. Schedule management control unit)

[0131] The order management control unit PC1 can set a time schedule corresponding to the flow chart FL1 for a group of substrates W accommodated in the carrier C, for example, based on an instruction from the main body control unit PC0. The time schedule specifies, for example, the timing of sequentially transporting the plurality of substrates W constituting the group of substrates W accommodated in the carrier C to the plurality of processing units 21 by the transport unit 24 and the timing of performing processing on the plurality of substrates W.

[0132] Fig.11 (a) is a block diagram showing an example of the electrical structure of the scheduled management control unit PC1. Fig.11 As shown in (a) of FIG. 1 , the schedule management control unit PC1 is realized by, for example, a computer, and includes a communication unit P11 , a storage unit P14 , and a control unit P15 connected via a bus Bu1 .

[0133] The communication unit P11, for example, has the functions of a sending unit and a receiving unit, and can send and receive signals between the communication unit P11 and the main control unit PC0, etc. via the communication line L0c for control, and can send and receive data between the communication unit P11 and the main control unit PC0, etc. via the communication line L0d for data.

[0134] The storage unit P14 can store information, for example. The storage unit P14 can be composed of a non-volatile storage medium such as a hard disk or a flash memory. In the storage unit P14, any one of a structure having one storage medium, a structure having two or more storage media integrally, and a structure in which two or more storage media are divided into two or more parts can also be adopted. The storage unit P14 can store, for example, a program Pg1 and various information Dt1. The storage unit P14 can also include, for example, a memory P15b described later.

[0135] The control unit P15 includes, for example, a calculation processing unit P15a that functions as a processor and a memory P15b for temporarily storing information. The calculation processing unit P15a can be, for example, an electrical circuit such as a CPU, and the memory P15b can be, for example, a RAM. The calculation processing unit P15a can realize the functions of the predetermined management control unit PC1 by, for example, reading and executing the program Pg1 stored in the storage unit P14. Various information temporarily obtained by various information processing in the control unit P15 can also be appropriately stored in the memory P15b.

[0136] Fig.11 (b) is a block diagram showing an example of a functional structure implemented by the operation processing unit P15a. Fig.11 As shown in (b) of FIG. 1 , the operation processing unit P15a includes, for example, an acquisition unit F11, a setting unit F12, and a transmission control unit F13 as the functional structure to be implemented. As a workspace in the processing of each unit, for example, a memory P15b is used. Here, for example, at least a part of the functions implemented by the operation processing unit P15a can also be implemented by a dedicated electrical circuit.

[0137] The acquisition unit F11 can acquire information of the flow specification FL1 created by the main body control unit PC0.

[0138] The setting unit F12 can set the time schedule based on the flow specification FL1 acquired by the acquisition unit F11, for example.

[0139] The transmission control unit F13 can, for example, cause the communication unit P11 to transmit various information to the main control unit PC0. Here, the various information can include, for example, information on the time schedule set by the setting unit F12.

[0140] (1-3-7. Part of the control unit)

[0141] For example, the plurality of partial control units PC2 can control the actions of the plurality of processing units 21 and the conveying unit 24 according to instructions from the main control unit PC0. In the first embodiment, a dedicated partial control unit PC2 is provided in each processing unit 21, and a dedicated partial control unit PC2 is also provided in the conveying unit 24. The partial control unit PC2 of the processing unit 21 can, for example, control the actions of the various parts of the processing unit 21 while appropriately monitoring the actions and states of the various parts of the processing unit 21. The partial control unit PC2 of the conveying unit 24 can, for example, control the actions of the various parts of the conveying unit 24 while appropriately monitoring the actions and states of the various parts of the conveying unit 24. In addition, here, for example, one partial control unit PC2 may be provided in two or more processing units 21, and the actions of the conveying unit 24 may also be controlled by the main control unit PC0.

[0142] Fig.12 (a) is a block diagram showing an example of the electrical structure of the partial control unit PC2. Fig.12 As shown in (a) in FIG. 1 , the partial control unit PC2 is realized by, for example, a computer, and includes a communication unit P21 , a storage unit P24 , and a control unit P25 connected via a bus Bu2 .

[0143] The communication unit P21, for example, has the functions of a sending unit and a receiving unit, and can send and receive signals between the communication unit P21 and the main control unit PC0, etc. via the control communication line L0c, and can send and receive data between the communication unit P21 and the main control unit PC0 and the data storage NA1, etc. via the data communication line L0d.

[0144] The storage unit P24 can store information, for example. The storage unit P24 can be composed of a non-volatile storage medium such as a hard disk or a flash memory. In the storage unit P24, any one of a structure having one storage medium, a structure having two or more storage media integrally, and a structure in which two or more storage media are divided into two or more parts can also be adopted. The storage unit P24 can store, for example, a program Pg2 and various information Dt2. The storage unit P24 can also include, for example, a memory P25b described later.

[0145] The control unit P25 includes, for example, a calculation processing unit P25a that functions as a processor and a memory P25b for temporarily storing information. The calculation processing unit P25a can be, for example, an electrical circuit such as a CPU, and the memory P25b can be, for example, a RAM. The calculation processing unit P25a can realize the functions of a part of the control unit PC2 by, for example, reading and executing the program Pg2 stored in the storage unit P24. Various information temporarily obtained by various information processing in the control unit P25 can also be appropriately stored in the memory P25b.

[0146] Fig.12 (b) is a block diagram showing an example of a functional structure implemented by the operation processing unit P25a. Fig.12 As shown in (b) of FIG. 1 , the operation processing unit P25a includes, for example, a program acquisition unit F21, an information acquisition unit F22, a program correction unit F23, a storage control unit F24, a unit control unit F25, and a transmission control unit F26 as the functional structures implemented. As a workspace in the processing of each unit, for example, a memory P25b is used. Here, for example, at least a part of the functions implemented by the operation processing unit P25a can also be implemented by a dedicated electrical circuit.

[0147] The protocol acquisition unit F21 can acquire the flow protocol FL1 from the main body control unit PC0, for example.

[0148] The information acquisition unit 22 can obtain data of one or more indicators regarding the status of substrate processing in the plurality of processing units 21 stored in the data group DG1 of the data memory NA1, for example. The information acquisition unit F22 can also selectively obtain data of one or more indicators used in the procedure modification unit F23 from the data group DG1 of the data memory NA1, for example. The data of one or more indicators used in the procedure modification unit F23 can be identified by referring to at least one modification form associated with the processing procedure in the flow procedure FL1, for example.

[0149] The procedure correction unit F23 can correct the processing procedure in the flow procedure FL1 using at least one correction form associated with the processing procedure, for example. Here, for example, the procedure correction unit F23 calculates one or more correction coefficients from at least one correction form in the flow procedure FL1 based on the signal of the index acquired by the sensor unit 22s, 23s, 214, and corrects a part of the conditions specified by at least one processing procedure associated with at least one correction form in the flow procedure FL1 using the calculated one or more correction coefficients. Here, as described above, the one or more correction coefficients may be one or more than two. Moreover, for example, the following mode is considered: at a predetermined timing before processing one substrate W in a group of substrates W by one processing unit 21, the procedure correction unit F23 corrects the processing procedure for processing the one substrate W. As the predetermined timing, the timing of finishing processing another substrate W before using one processing unit 21 to process one substrate W is considered. In this case, in response to finishing processing the one substrate W using one processing unit 21, the procedure correction unit F23 corrects the processing procedure for the next substrate W.

[0150] The storage control unit F24 can store, for example, the flow protocol FL1 acquired by the protocol acquisition unit F21, the processing protocol modified by the protocol modification unit F23 (also referred to as modified processing protocol), and one or more correction coefficients calculated by the protocol modification unit F23 in the storage unit P24. Thus, the various information Dt2 in the storage unit P24 can include, for example, the flow protocol FL1, the modified processing protocol, and one or more correction coefficients.

[0151] The unit control unit F25 can, for example, perform processing on the substrate W through the processing unit 21 based on the flow protocol FL1. Here, for example, if the processing protocol is modified by the protocol modification unit F23, the unit control unit F25 can perform processing on the substrate W through the processing unit 21 based on the flow protocol FL1 including the modified processing protocol. In addition, the unit control unit F25 of the processing unit 21 can, for example, control the operation of the sensor unit 214. In addition, the unit control unit F25 of the conveying unit 24 can, for example, control the operation of the sensor unit 22s. The conditions for the operation of the sensor unit 214 and the sensor unit 22s are, for example, specified by the measurement processing protocol. Thus, the sensor unit 214 and the sensor unit 22s can obtain signals of one or more indicators regarding the status of the substrate processing in the processing unit 21. In this case, the unit control unit F25 can, for example, obtain signals of one or more indicators from the sensor unit 214 and the sensor unit 22s. Here, the unit control unit F25 can also calculate the etching rate from the film thickness before and after the processing and the processing time as a numerical value based on the signal of one or more indicators. The film thickness before processing may be, for example, the film thickness of the substrate W obtained by the sensor unit 214, or the film thickness of the substrate W obtained by the main control unit PC0 from the management device 10. In addition, for example, the partial control unit PC2 may perform image processing on the image signal obtained from the sensor unit 214, thereby calculating a numerical value indicating the degree of unevenness of the surface of the substrate W as a numerical value of a signal based on one or more indicators.

[0152] The transmission control unit F26 can, for example, cause the communication unit P21 to execute transmission of various information to the main control unit PC0 and the data memory NA1. Here, the various information transmitted to the main control unit PC0 can include, for example, information on the completion of substrate processing, the history of processing actually performed on the substrate W (process log), information on the revised protocol revised by the protocol revision unit F23, and data of one or more indicators acquired using the sensor units 22s and 214. In addition, the various information transmitted to the data memory NA1 can include, for example, data of one or more indicators acquired using the sensor units 22s and 214.

[0153] (1-3-8. Liquid management control unit)

[0154] The liquid management control unit PC3 can manage the state of the processing liquid L1 in the liquid storage unit 23 by, for example, controlling the operation of each unit included in the liquid storage unit 23 .

[0155] Fig.13 (a) is a block diagram showing an example of the electrical structure of the liquid management control unit PC3. Fig.13As shown in (a) of FIG. 1 , the liquid management control unit PC3 is realized by, for example, a computer, and includes a communication unit P31 , a storage unit P34 , and a control unit P35 connected via a bus Bu3 .

[0156] The communication unit P31, for example, has the functions of a sending unit and a receiving unit, and can send and receive signals between the communication unit P31 and the main control unit PC0, etc. via the control communication line L0c, and can send and receive data between the communication unit P31 and the main control unit PC0 and the data storage NA1 via the data communication line L0d.

[0157] The storage unit P34 can store information, for example. The storage unit P34 can be composed of a non-volatile storage medium such as a hard disk or a flash memory. In the storage unit P34, any one of a structure having one storage medium, a structure having two or more storage media integrally, and a structure in which two or more storage media are divided into two or more parts can also be adopted. The storage unit P34 can store, for example, a program Pg3 and various information Dt3. The storage unit P34 can also include, for example, a memory P35b described later.

[0158] The control unit P35 includes, for example, a calculation processing unit P35a that functions as a processor and a memory P35b for temporarily storing information. The calculation processing unit P35a can be, for example, an electrical circuit such as a CPU, and the memory P35b can be, for example, a RAM. The calculation processing unit P35a can realize the functions of the liquid management control unit PC3 by, for example, reading and executing the program Pg3 stored in the storage unit P34. Various information temporarily obtained by various information processing in the control unit P35 can also be appropriately stored in the memory P35b.

[0159] Fig.13 (b) is a block diagram showing an example of a functional structure implemented by the operation processing unit P35a. Fig.13 As shown in (b) of FIG. 1 , the operation processing unit P35a includes, for example, an information acquisition unit F31, a unit control unit F32, a liquid management unit F33, and a transmission control unit F34 as the functional structures implemented. As a workspace in the processing of each unit, for example, a memory P35b is used. Here, for example, at least a part of the functions implemented by the operation processing unit P35a can also be implemented by a dedicated electrical circuit.

[0160] The information acquisition unit F31 can acquire various instructions from the main body control unit PC0, for example, including instructions for temperature adjustment, replacement, and monitoring of the processing liquid L1.

[0161] The unit control unit F32 can, for example, control the actions in the liquid storage unit 23. The unit control unit F32 can, for example, cause the sensor unit 23s of each storage tank 23t to obtain a signal of a physical quantity indicating the state of the processing liquid L1. Thus, the sensor unit 23s can obtain a signal of one or more indicators regarding the status of the substrate processing in the processing unit 21. In addition, the unit control unit F32 can, for example, cause the heating unit HR to heat the processing liquid L1 in each storage tank 23t. In addition, for example, in the case where each storage tank 23t has a liquid exchange unit for automatically exchanging the processing liquid L1, the unit control unit F32 can exchange the processing liquid L1 in each storage tank 23t through the liquid exchange unit.

[0162] The liquid management unit F33 can manage, for example, the elapsed time since the liquid exchange of the processing liquid L1 in each storage tank 23t and the number of times the processing liquid L1 is used. The elapsed time can be identified and managed by, for example, using the time when the processing liquid L1 was most recently exchanged as a reference through a clock function. The number of times the processing liquid L1 is used can be identified and managed based on, for example, the amount of the processing liquid L1 stored in each storage tank 23t and the amount of the processing liquid L1 supplied from each storage tank 23t to the plurality of processing units 21.

[0163] The transmission control unit F34 can, for example, cause the communication unit P31 to execute transmission of various information to the main body control unit PC0 and the data storage NA1. Here, the various information transmitted to the main body control unit PC0 can include, for example, information on the time elapsed since the liquid exchange of the processing liquid L1 in each storage tank 23t and the number of times the processing liquid L1 is used. In addition, the various information transmitted to the data storage NA1 can include, for example, information on one or more indicators obtained by the use sensor unit 23s and information on the time elapsed since the liquid exchange of the processing liquid L1 in each storage tank 23t and the number of times the processing liquid L1 is used.

[0164] (1-3-9. Data storage)

[0165] The data storage NA1 can store, for example, a data group DG1 of one or more indicators of the substrate processing conditions in the plurality of processing units 21 based on the signals obtained by the respective sensor units 22s, 23s, 214, etc. The data group DG1 can also include, for example, information on the elapsed time since the liquid exchange of the processing liquid L1 in each storage tank 23t and the number of times the processing liquid L1 is used, as data of one or more indicators of the substrate processing conditions in the plurality of processing units 21. The data storage NA1 can be, for example, a non-volatile storage medium such as a hard disk or a flash memory, or a volatile storage medium such as a RAM.

[0166] Fig.141 is a diagram showing an example of the contents of the data group DG1 stored in the data memory NA1. Fig.14 As shown, the data group DG1 can include, for example, numerical values ​​of indicators for indicating the state of the environment in the internal space Sc0 (e.g., the temperature of the environment, the amount of gas supplied, etc.), numerical values ​​of indicators for indicating the state of the processing liquid L1 (e.g., concentration, pH, temperature, the time elapsed since the liquid exchange, the number of times the processing liquid L1 is used, etc.), numerical values ​​of indicators for indicating the state of the substrate W (e.g., the film thickness before and after the process, the etching speed, the degree of unevenness of the substrate surface), etc. In addition, the data group DG1 can also include, for example, numerical values ​​of indicators for indicating the ejection state of the processing liquid L1 (ejection amount, ejection position, etc.). Here, in the data memory NA1, for example, various data contained in the data group DG1 are overwritten, thereby setting the latest indicator data. In addition, the various data contained in the data group DG1 can also include, for example, data for indicating which sensor unit 22s, 23s, 214 of which part (processing unit 21 or storage tank 23t, etc.) has acquired the data.

[0167] (1-4. Process specification creation action)

[0168] Fig.15 1 is a flowchart showing an example of the operation flow of creating the flow chart FL1. Here, for example, the main control unit PC0 executes the program Pg0 by the operation processing unit P05a, and the scheduled management control unit PC1 executes the program Pg1 by the operation processing unit P15a. Thus, the main control unit PC0 and the scheduled management control unit PC1 cooperate to realize Fig.15 The flow chart shows the operation flow of creating the flow chart FL1.

[0169] First, in Fig.15 In step Sp1, the storage control unit F03 of the main control unit PC0 stores a plurality of processing procedures and correction formulas respectively defining conditions for processing related to the processing performed by the plurality of processing units 21 on the substrate W in the storage unit P04. Thus, the data group Db0 is stored in the storage unit P04. Here, the plurality of processing procedures include, for example, a plurality of liquid processing procedures R1 respectively defining conditions for processing performed on the substrate W using the processing liquid L1.

[0170] In step Sp2, the information acquisition unit F01 of the main control unit PC0 determines whether a task has been acquired from the management device 10. Here, for example, in response to the carrier C containing a group of substrates W being placed on the load port LP, the information acquisition unit F01 repeatedly performs the determination of step Sp2 until a task for the group of substrates W contained in the carrier C is acquired from the management device 10. Then, as long as the information acquisition unit F01 acquires a task, the process proceeds to step Sp3.

[0171] In step Sp3, the information acquisition unit F01 of the main control unit PC0 acquires two or more identification information corresponding to the task acquired in step Sp2 and information on a group of substrates W including information on each substrate W from the management device 10. The two or more identification information may include: procedure identification information for respectively identifying a liquid processing procedure for liquid processing and a measurement processing procedure for measurement processing; and correction form identification information for identifying a correction form for correction processing.

[0172] In step Sp4, the production unit F02 of the main control unit PC0 produces the flow program FL1. Here, for example, the flow program FL1 is produced by combining two or more processing programs among the plurality of processing programs stored in the storage unit P04 in step Sp1. The two or more processing programs correspond to, for example, the two or more identification information acquired in step Sp3 in the data group Db0 stored in the storage unit P04. Here, if the two or more identification information acquired in step Sp3 includes correction form identification information, the flow program FL1 can also be produced by combining the correction form corresponding to the correction form identification information in the data group Db0 stored in the storage unit P04 with the processing program.

[0173] In step Sp5, the storage control unit F03 of the main control unit PC0 stores the flow program FL1 created in step Sp4 in the storage unit P04, and the sending control unit F06 of the main control unit PC0 sends the flow program FL1 created in step Sp4 to the scheduled management control unit PC1 through the communication unit P01.

[0174] In step Sp6, the setting unit F12 of the schedule management control unit PC1 sets the time schedule based on the flow plan FL1 created in step Sp4.

[0175] In step Sp7, the transmission control unit F13 of the schedule management control unit PC1 transmits the information of the time schedule set in step Sp6 to the main body control unit PC0 via the communication unit P11.

[0176] In step Sp8, the instruction unit F04 of the main control unit PC0 instructs the plurality of partial control units PC2 to perform operations according to the flow chart FL1 and the time schedule. At this time, the plurality of processing units 21 process the substrates W according to the flow chart FL1 created in step Sp4. Thus, a group of substrates W are processed according to the time schedule and the flow chart FL1.

[0177] Through this action flow, for example, even if the conditions for a series of processing on the substrate W increase, two or more processing procedures among the plurality of processing procedures prepared in advance can be combined to create the flow procedure FL1, instead of increasing the number of the flow procedures prepared in advance. Thus, for example, the amount of data prepared in advance in the substrate processing system 1 and the substrate processing apparatus 20 can be reduced. As a result, for example, the amount of data used in the substrate processing system 1, the management device 10, and the substrate processing apparatus 20 can be reduced.

[0178] (1-5. Correction actions for handling procedures)

[0179] Fig.16 2 is a flowchart showing an example of the operation flow of modifying the processing procedure. Here, for example, the operation processing unit P25a in the partial control unit PC2 of the processing unit 21 executes the program Pg2 to realize the operation flow of modifying the processing procedure.

[0180] First, in Fig.16 In step Sp11, the unit control unit F25 of the partial control unit PC2 determines whether the processing of one substrate W in the processing unit 21 has been completed. Here, the unit control unit F25 repeatedly performs the determination of step Sp11 until the processing of one substrate W in accordance with the flow chart FL1 in the processing unit 21 is completed. Then, if the unit control unit F25 completes the processing of one substrate W in accordance with the flow chart FL1 in the processing unit 21, the process proceeds to step Sp12.

[0181] In step Sp12, the information acquisition unit F22 of the partial control unit PC2 obtains from the data memory NA1 data of one or more indicators regarding the status of substrate processing in the plurality of processing units 21. Here, for example, based on the correction formula associated with the processing procedure of the flow procedure FL1, data of one or more indicators required for correction of the processing procedure can be obtained from the data memory NA1.

[0182] In step Sp13, the protocol correction unit F23 of the partial control unit PC2 corrects one or more processing protocols included in the flow protocol FL1 for a substrate W to be processed in the processing unit 21 next to the substrate W that has been processed in the processing unit 21 in step Sp11. Here, the protocol correction unit F23 corrects the one or more processing protocols included in the flow protocol FL1 based on, for example, a correction formula associated with the one or more processing protocols and data of one or more indicators obtained in step Sp12. Thus, for example, when a group of substrates W are processed in sequence by a plurality of processing units 21, the processing protocol can be corrected for each substrate W in a state close to real time.

[0183] In step Sp14, the unit control unit F25 of the partial control unit PC2 in the processing unit 21 executes an action corresponding to the flow chart FL1 in the processing unit 21. Fig.10 In the flow protocol FL1 shown, when the processing protocol is modified in step Sp13, the unit control unit F25 causes the processing unit 21 to execute an operation corresponding to the flow protocol FL1 including one or more processing protocols modified in step Sp13.

[0184] Here, when the substrate W is processed according to the flow protocol FL1 by the processing unit 21, when, for example, the signal of one or more indicators indicating the state of the substrate W acquired by the sensor unit 214 satisfies a predetermined condition, the transmission control unit F26 of the operation processing unit P25a in the partial control unit PC2 may also transmit information indicating the combination of the processing protocol and the correction form in the flow protocol FL1 (also referred to as combination information) to the main control unit PC0 through the communication unit P21. Then, for example, the transmission control unit F06 of the operation processing unit P05a in the main control unit PC0 may transmit the combination information to the management device 10 through the communication unit P01 as the second communication unit.

[0185] Here, the prescribed condition is, for example, the following condition: it is desired to process the substrate W according to the process flow FL1 by the processing unit 21, thereby achieving one or more indicators for indicating the state of the substrate W. Specifically, for example, when the substrate W is processed according to the process flow FL1 and the film thickness of the substrate W is set to be less than a prescribed target value by etching, the condition that the film thickness is less than the prescribed target value, which is one indicator for indicating the state of the substrate W, is used as the prescribed condition. And, for example, in the processing unit 21, Fig.10 When the substrate W is processed by the process procedure FL1 shown, if the film thickness of the substrate W obtained by the measurement processing according to the final second measurement processing procedure R2b is less than the specified target value, the signal of one or more indicators representing the state of the substrate W obtained by the sensor unit 214 satisfies the specified conditions.

[0186] When this configuration is adopted, for example, in the case where a good result is produced by a process based on a process procedure combined with a modified form, combination information indicating the combination of the process procedure and the modified form is sent to the management device 10, whereby even other substrate processing devices 20 can utilize the good combination of the process procedure and the modified form.

[0187] (1-6. Summary of the First Implementation Method)

[0188] As described above, the substrate processing system 1 and the substrate processing apparatus 20 of the first embodiment, for example, combine two or more processing procedures among a plurality of processing procedures including a plurality of liquid processing, thereby producing a flow procedure FL1. Therefore, for example, even if the conditions for a series of processing of the substrate W increase, two or more processing procedures among a plurality of processing procedures prepared in advance can be combined to produce the flow procedure FL1, instead of increasing the number of flow procedures prepared in advance. At this time, for example, the production unit F02 can combine two or more processing procedures corresponding to two or more identification information from the management device 10 to produce the flow procedure FL1. Thus, for example, the amount of data prepared in advance in the substrate processing system 1, the management device 10, and the substrate processing apparatus 20 can be reduced. As a result, for example, the amount of data used in the substrate processing system 1, the management device 10, and the substrate processing apparatus 20 can be reduced.

[0189] (1-7. Other embodiments)

[0190] The present invention is not limited to the above-mentioned first embodiment, and various changes and improvements can be made without departing from the scope of the present invention.

[0191] (1-7-1. Second Implementation Method)

[0192] In the first embodiment, for example, in the process of processing one substrate W according to the flow plan FL1 in the processing unit 21 , the flow plan FL1 in which the process flow branches according to the state of the one substrate W may be created.

[0193] In this case, for example, the sensor unit 214 can obtain signals of one or more indicators indicating the state of the substrate W. The one or more indicators can include, for example, the film thickness of the substrate W. In addition, the plurality of measurement processing procedures R2 of the measurement processing procedure group Gp2 include, for example, a first measurement processing procedure R2a that specifies the conditions for the measurement processing of the sensor unit 214, and the sensor unit 214 is used to obtain signals of one or more indicators indicating the state of the substrate W. The data group Db0 includes, for example, a branch processing procedure group Gp4.

[0194] Fig.17 FIG. 2 is a diagram showing an example of a branch processing rule group Gp4 included in a data group Db0 according to the second embodiment. The branch processing rule group Gp4 includes, for example, a plurality of branch processing rules C4 for branching a processing flow. Fig.17In the example, the plurality of branch processing procedures C4 include a first branch processing procedure C4a, a second branch processing procedure C4b, a third branch processing procedure C4c, a fourth branch processing procedure C4d, a fifth branch processing procedure C4e, and a sixth branch processing procedure C4f. Specifically, the plurality of branch processing procedures C4, for example, apply a procedure for defining the conditions for the following processing (also referred to as branch processing): if one or more indicators used to represent the state of the substrate W satisfy the first condition, the process of the first processing (also referred to as the first branch post-processing process) is executed; if one or more indicators used to represent the state of the substrate W satisfy the second condition, the process of the second processing (also referred to as the second branch post-processing process) is executed. Here, for example, it is assumed that one or more indicators used to represent the state of the substrate W is the film thickness of the substrate W. In this case, consider a method in which the first condition is a condition that the film thickness is less than T1μm (micrometer) and the second condition is a condition that the film thickness is above T1μm. Furthermore, the branch processing rule C4 may also execute a third processing flow (also referred to as a third branch post-processing flow) when one or more indicators indicating the state of the substrate W satisfy a third condition. Here, the first condition is that the film thickness is less than T1 μm, the second condition is that the film thickness is greater than T1 μm and less than T2 μm, and the third condition is that the film thickness is greater than T2 μm and less than T3 μm.

[0195] Moreover, the production unit F02 combines, for example, the first measurement processing procedure R2a among multiple measurement processing procedures R2 and the branch processing procedure C4 among multiple branch processing procedures C4, which stipulates that if one or more indicators meet the first condition, the first branch post-processing flow is executed, and if one or more indicators meet the second condition, the second branch post-processing flow is executed. The first processing procedure is combined with the branch processing procedure C4 as a processing procedure of the first branch post-processing flow, and the second processing procedure different from the first processing procedure is combined with the branch processing procedure C4 as a processing procedure of the second branch post-processing flow, thereby producing the process procedure FL1.

[0196] Fig.18 This is a diagram showing an example of the flow plan FL1 according to the second embodiment. Fig.18 The flow chart FL1 shown, for example, Fig.10Based on the process procedure FL1 shown, the first measurement processing procedure R2a and the second branch processing procedure C4b combined with the second C correction form C32c are inserted in sequence between the fourth liquid processing procedure R1d and the first liquid processing procedure R1a. The second branch processing procedure C4b is the following procedure: if one or more indicators used to represent the state of the substrate W as a result of the measurement processing of the sensor unit 214 according to the first measurement processing procedure R2a satisfy condition a as the first condition, the first branch post-processing flow is executed; if one or more indicators used to represent the state of the substrate W as a result of the measurement processing of the sensor unit 214 according to the first measurement processing procedure R2a satisfy condition b as the second condition, the second branch post-processing flow is executed.

[0197] exist Fig.18 In the example, the first branch post-processing flow is sequentially combined with: the first liquid processing procedure R1a, combined with the first C revision form C31c; the fifth liquid processing procedure R1e, combined with the first F revision form C31f; and the second measurement processing procedure R2b, combined with the second A revision form C32a. In other words, the first liquid processing procedure R1a, which is the first processing procedure, is combined with the second branch processing procedure C4b as the processing procedure of the first branch post-processing flow. In addition, the second branch post-processing flow is combined in the following manner: after executing the liquid processing according to the second liquid processing procedure R1b combined with the first A revision form C31a, the measurement processing according to the first measurement processing procedure R2a is executed again. In other words, the second liquid processing procedure R1b, which is the second processing procedure, is combined with the second branch processing procedure C4b as the processing procedure of the second branch post-processing flow. According to the processing of the process procedure FL1 including such a branch processing procedure C4, for example, the second branch post-processing process is repeatedly executed until one or more indicators used to represent the state of the substrate W satisfy condition a as the first condition. If one or more indicators used to represent the state of the substrate W satisfy condition a as the first condition, the first branch post-processing process is executed.

[0198] Here, for example, one or more indicators for indicating the state of the substrate W is the film thickness of the film on the substrate W to be etched. If the condition a as the first condition satisfies the condition that the film thickness is less than T1 μm, the second branch post-processing flow is repeatedly executed to perform etching on the substrate W until the one or more indicators for indicating the state of the substrate W satisfies the condition a. Here, for example, the following method is considered: the second liquid processing procedure R1b stipulates a processing condition in which the etching amount of the film of the substrate W is relatively reduced compared to the fourth liquid processing procedure R1d. Specifically, for example, the following method is considered: the second liquid processing procedure R1b stipulates a processing condition in which the concentration of the etching liquid as at least the processing liquid L1 is relatively thin compared to the fourth liquid processing procedure R1d or the etching processing time is relatively short compared to the fourth liquid processing procedure R1d. As long as this structure is adopted, for example, insufficient processing of the substrate W in the substrate processing device 20 is unlikely to occur, and the processing efficiency of the substrate W can be improved compared with a method of processing the substrate W again by the substrate processing device 20 after the underprocessed substrate W is temporarily moved to the outside of the substrate processing device 20 by the carrier C in order to solve the insufficient processing of the substrate W.

[0199] Thus, in the substrate processing system 1 and the substrate processing apparatus 20 of the second embodiment, for example, the preparation section F02 can prepare a flow procedure FL1 that can perform a process corresponding to the state of the substrate W on the substrate W by combining the first measurement processing procedure R2a, the second branch processing procedure C4b, the first processing procedure of the first branch post-processing flow, and the second processing procedure of the second branch post-processing flow. Thus, for example, even if conditions for a series of processes on the substrate W are added in a manner that the process flow branches according to the state of the substrate W, the flow procedure FL1 that specifies a series of processes on the substrate W for bringing the state of the substrate W close to the desired state can be prepared by combining the first measurement processing procedure R2a among the plurality of measurement processing procedures R2 prepared in advance, one of the plurality of branch processing procedures C4 prepared in advance, the first liquid processing procedure R1a and the second liquid processing procedure R1b among the plurality of liquid processing procedures R1 prepared in advance, instead of increasing the number of flow procedures FL1 prepared in advance. As a result, for example, the amount of data prepared in advance in the substrate processing system 1 and the substrate processing apparatus 20 can be reduced, and the amount of data used in the substrate processing system 1, the management device 10, and the substrate processing apparatus 20 can be reduced. In addition, compared with the case where the substrate W is processed again in the substrate processing apparatus 20 in order to bring the substrate W close to a desired state after the substrate W is unloaded from the substrate processing apparatus 20, the efficiency of the processing performed on the substrate W can be easily improved.

[0200] Furthermore, in the second embodiment, when the substrate W is processed by the processing unit 21 according to the flow protocol FL1, for example, in the branch processing according to the second branch processing protocol C4b less than a preset number of times (for example, once), if one or more indicators indicating the state of the substrate W as a result of the measurement processing by the sensor unit 214 according to the first measurement processing protocol R2a satisfy the condition a as the first condition, then the signal indicating one or more indicators of the state of the substrate W acquired by the sensor unit 214 satisfies the prescribed condition. In this case, the transmission control unit F26 of the calculation processing unit P25a in the partial control unit PC2 may transmit combination information indicating the combination of the fourth liquid processing protocol R1d as the processing protocol in the flow protocol FL1 and the 1E modified form C31e combined with the fourth liquid processing protocol R1d to the main control unit PC0 through the communication unit P21. Furthermore, the transmission control unit F06 of the calculation processing unit P05a in the main control unit PC0 can also transmit the combination information to the management device 10 through the communication unit P01 as the second communication unit. If such a structure is adopted, for example, when a good result is produced by processing based on a processing procedure combined with a correction formula, the combination information indicating the combination of the processing procedure and the correction formula is transmitted to the management device 10, and thereby other substrate processing apparatuses 20 can also use the good combination of the processing procedure and the correction formula.

[0201] (1-7-2. Third Implementation Method)

[0202] In each of the above-mentioned embodiments, for example, a liquid processing procedure R1 may specify conditions for liquid processing using two or more processing liquids L1, and may specify the following conditions: the procedure flow may branch in a manner such that the contents of one or more liquid processings to be performed thereafter are different depending on the processing-related state of the substrate W in the processing unit 21.

[0203] Specifically, for example, the plurality of liquid processing rules R1 included in the data group Db0 may include one or more liquid processing rules (also referred to as structured liquid processing rules), and the one or more liquid processing rules respectively define the flow and conditions of the following processing: when the substrate W is in the first state when the processing using the first processing liquid L11 (also referred to as the first liquid processing) is performed on the substrate W, the processing using the second processing liquid L12 (also referred to as the second liquid processing) is performed after the first liquid processing is performed on the substrate W, and in response to the situation that the substrate W becomes in the second state when the first liquid processing is performed on the substrate W, the processing using the third processing liquid L13 (also referred to as the third liquid processing) is performed on the substrate W. If such a structure is adopted, for example, when the first liquid processing using the first processing liquid L11 and the second liquid processing using the second processing liquid L12 are sequentially performed on the substrate W, if the substrate W becomes in the specific second state when the first liquid processing is performed on the substrate W, the first liquid processing on the substrate W can be terminated and the third liquid processing on the substrate W can be performed. Thus, for example, appropriate processing can be performed according to the situation when the first liquid processing is performed on the substrate W.

[0204] Fig.19 This is a diagram showing an example of a liquid processing rule R1 as a structured liquid processing rule defined so that a plurality of liquid processing according to the third embodiment are structured. Fig.19 The liquid processing procedure R1 shown defines the following processing conditions: if the first liquid processing of the substrate W is started and a predetermined processing time has passed while maintaining the first state, then after the first liquid processing is finished, the second liquid processing and the third liquid processing are sequentially performed on the substrate W. On the other hand, if the substrate W is in the middle of the first liquid processing from the first state to the second state, the third liquid processing is performed on the substrate W. Here, for example, the first state is applied to a state in which the storage tank 23t stores the first processing liquid L11, and the second state is applied to a state in which the first processing liquid L11 cannot be supplied from the storage tank 23t to the processing unit 21 (also referred to as a state in which the supply cannot be supplied). The state in which the supply cannot be supplied includes, for example, a state in which the first processing liquid L11 stored in the storage tank 23t has been used up (a state in which it is exhausted). In this case, for example, a structure in which the sensor unit 23s detects the amount of the first processing liquid L11 in the storage tank 23t is considered.

[0205] Here, specifically, for example, the following case is assumed: the first processing liquid L11 is an etching liquid such as hydrofluoric acid and nitric acid mixed with hydrofluoric acid, the second processing liquid L12 is a chemical liquid such as SC1 liquid, and the third processing liquid L13 is a liquid for rinsing treatment such as pure water. In this case, for example, in response to the second state in which the first processing liquid L11, i.e., hydrofluoric acid, is exhausted during the first liquid processing, when only the first liquid processing is stopped and the substrate W is unloaded from the processing unit 21, the substrate W may be excessively etched by the hydrofluoric acid remaining on the substrate W. In contrast, for example, in response to the second state in which the first processing liquid L11, i.e., hydrofluoric acid, is exhausted during the first liquid processing, if the hydrofluoric acid remaining on the substrate W is rinsed with the third processing liquid L13, i.e., a liquid for rinsing treatment such as pure water, the substrate W is less likely to be excessively etched by the hydrofluoric acid remaining on the substrate W.

[0206] (1-7-3. Other implementations)

[0207] In the above embodiments, for example Fig. 20 As shown, the preparation unit F02 may also prepare the flow program FL1 by combining one or more liquid processing procedures R1 and two or more measurement processing procedures R2 among the plurality of processing procedures included in the data set Db0. Furthermore, for example, the preparation unit F02 may also prepare the flow program FL1 by combining one or more liquid processing procedures R1 and one or more measurement processing procedures R2 among the plurality of processing procedures included in the data set Db0.

[0208] In each of the above-mentioned embodiments, all or part of the data constituting the data group Db0 stored in the storage unit P04 of the main control unit PC0 may be stored in, for example, at least one of the storage units P04, P14, P24, and P34 of the substrate processing apparatus 20, or may be stored in two or more of the storage units P04, P14, P24, and P34 of the substrate processing apparatus 20 in a distributed manner. In addition, for example, all or part of the data constituting the data group Db0 stored in the storage unit P04 of the main control unit PC0 may be stored in the storage unit 14 of the management device 10. In other words, for example, a plurality of substrate processing apparatuses 20 and at least a portion of the management apparatuses 10 may also have one or more storage units for storing a plurality of processing procedures, wherein the plurality of processing procedures respectively define processing conditions related to processing performed on substrates W in one or more processing units 21.

[0209] In the above-mentioned embodiments, for example, the sensor unit 214 may also detect the angle of the arm Am1 of the film thickness gauge Fm0 to identify the position in the film on the substrate W where the film thickness is measured by the film thickness gauge Fm0. In this case, for example, if the measurement processing rule R2 stipulates the conditions for measuring the thickness (film thickness) of the film on the substrate W using the film thickness gauge Fm0, the second correction formula C32 incorporated in the measurement processing rule R2 may also be used for the correction processing for appropriately changing the position in the film on the substrate W where the film thickness is measured by the film thickness gauge Fm0.

[0210] In the above-mentioned embodiments, the correction of the liquid processing procedure R1 based on the first correction form C31 is not limited to the correction of the etching time such as the supply time of the etching liquid, and may also include, for example, the appropriate change of the spraying position of the nozzles Nz1 and Nz2 for spraying the processing liquid L1 onto the substrate W and the correction of other conditions such as the changing conditions.

[0211] In the above-mentioned embodiments, for example, when two or more processing units 21 are used in sequence to execute multiple processes under conditions specified by the flow chart FL1, information on a portion of the processing procedures in the flow chart FL1 may be sent to the partial control units PC2 of the two or more processing units 21.

[0212] In the above-described respective embodiments, the measurement process according to the last measurement process routine following all the liquid processing routines in the flow routine FL1 may be a measurement process executed by, for example, a sensor unit located outside the processing unit 21 .

[0213] In the above-mentioned embodiments, although the substrate processing device 20 obtains two or more pieces of identification information for determining the processing procedure from the management device 10, the present invention is not limited thereto. For example, the substrate processing device 20 may obtain two or more pieces of identification information from one or more parts such as other devices connected via the communication line 5, the storage medium RM0 held by the drive 16, and the input unit P02.

[0214] In the above-mentioned embodiments, for example, the data group DG1 stored in the data memory NA1 may be stored in at least one of the storage unit P04 of the main control unit PC0, the storage unit P14 of the predetermined tube control unit, and the storage unit P24 of the partial control unit PC2, or may be stored in the storage unit 14 of the management device 10. In this case, for example, a server that is independent of the management device 10 and stores at least one of the data group Db0 and the data group DG1 may be connected to each substrate processing device 20 via the communication line 5 in a manner that can send and receive data.

[0215] In each of the above-mentioned embodiments, the creation of the flow chart FL1 may be performed, for example, by at least one of the operation processing unit P05a of the main control unit PC0 and the operation processing unit P15a of the scheduled management control unit PC1, or may be performed by the coordinated action of the operation processing unit P05a of the main control unit PC0 and the operation processing unit P15a of the scheduled management control unit PC1. In addition, for example, the functions of the main control unit PC0 and the scheduled management control unit PC1 may also be realized by one control unit. In other words, the functions of the operation processing unit P05a of the main control unit PC0 and the functions of the operation processing unit P15a of the scheduled management control unit PC1 may also be appropriately allocated to one or more operation processing units in one or more control units.

[0216] In each of the above-mentioned embodiments, the substrate processing apparatus 20 may also include, for example, two or more operation processing units, including an operation processing unit (also referred to as the first operation processing unit) that creates a flow protocol FL1 for a group of substrates W, and an operation processing unit P25a that is a second operation processing unit of a partial control unit PC2 that is a second control unit and performs modification of the process protocol. When such a configuration is adopted, for example, when there are a large number of processing units 21 and there are a first control unit for controlling the operation in a wide range of the structure of the substrate processing apparatus 20 and a second control unit for controlling the operation in a narrow range of the structure of individual processing units 21 or a part of the processing units 21 in the substrate processing apparatus 20, the first operation processing unit of the first control unit creates the flow protocol FL1 for a group of substrates W, and the second operation processing unit of the second control unit modifies the process protocol in the flow protocol FL1, thereby making it easy to realize hierarchical operation control in the substrate processing apparatus 20. As a result, for example, it is possible to efficiently create a unified process schedule FL1 for a group of substrates W and to modify the process schedule for a portion of the group of substrates W in near real time. This allows efficient and accurate substrate processing that suits the situation.

[0217] In each of the above-mentioned embodiments, for example, the flow chart FL1 may be created and the processing chart may be modified by one operation processing unit in one control unit. That is, the flow chart FL1 may be created and the processing chart may be modified by one or more operation processing units in more than one control unit. In this case, for example, the function of creating the flow chart FL1 in the operation processing unit P05a of the main control unit PC0 and the function of modifying the processing chart in the operation processing units P25a of the plurality of partial control units PC2 may be appropriately allocated to one or more operation processing units in more than one control unit.

[0218] In each of the above-mentioned embodiments, the substrate processing apparatus 20 may include more than one processing unit 21 instead of including a plurality of processing units 21 .

[0219] Furthermore, all or part of the above-described embodiments and various modifications may be appropriately combined within a range that does not conflict with each other.

[0220] Description of reference numerals:

[0221] 1 Substrate processing system

[0222] 10 Management Devices

[0223] 11. P01, P11, P21, P31 Communications Department

[0224] 14, P04, P14, P24, P34 Storage

[0225] 15a, P05a, P15a, P25a, P35a Calculation processing unit

[0226] 20. Substrate processing device

[0227] 21 Processing Units

[0228] 22s, 23s, 214 Sensor unit

[0229] 23 Liquid storage unit

[0230] 23t storage tank

[0231] 24 handling units

[0232] C31 1st revision

[0233] C31a~C31f 1A~1F revision

[0234] C32 2nd revision

[0235] C32a~C32f 2A~2F revision form

[0236] C4 Branch Handling Procedure

[0237] C4a~C4f 1st to 6th Branch Processing Procedure

[0238] DG1, Db0 data group

[0239] F01, F22, F31 Information Acquisition Department

[0240] F02 Production Department

[0241] F03, F24, F152 Storage control unit

[0242] F04 Indicator

[0243] F06, F13, F26, F34, F151 Sending control unit

[0244] F11 Acquisition Department

[0245] F12 Setting section

[0246] F21 Procedure Acquisition Department

[0247] F23 Regulation Amendment

[0248] F25, F32 unit control unit

[0249] F33 Liquid Management Department

[0250] FL1 Process Procedures

[0251] Fm0 Film Thickness Meter

[0252] Gp1 Liquid Handling Protocol Group

[0253] Gp2 Measurement Processing Procedure Group

[0254] Gp3 modified group

[0255] Gp31, Gp32 1st revision official group, 2nd revision official group

[0256] Gp4 Branch Handling Procedure Group

[0257] L1 treatment fluid

[0258] L11~L13 1st treatment liquid~3rd treatment liquid

[0259] NA1 Data Memory

[0260] PC0 Main control unit

[0261] PC1 Reservation Management Control Unit

[0262] PC2 Partial Control Unit

[0263] PC3 Fluid Management Control Unit

[0264] R1 Liquid Handling Protocol

[0265] R1a~R1f 1st~6th Liquid Handling Procedures

[0266] R2 Measurement Processing Procedure

[0267] R2a~R2f 1st to 6th measurement processing procedures

[0268] W substrate

Claims

1. A substrate processing device, wherein: have: One or more processing units to process the substrates respectively; and One or more arithmetic processing units create a flow chart for defining a series of processes on a substrate by combining two or more of a plurality of processing charts, wherein the plurality of processing charts respectively define conditions for processes related to the processes performed on the substrate in the one or more processing units; The plurality of processing procedures include a plurality of liquid processing procedures that respectively define conditions for processing the substrate using the processing liquid; One or more of the arithmetic processing units include: an information acquisition unit that acquires two or more pieces of identification information; and a creation unit that creates the flow program by combining two or more processing programs corresponding to the two or more pieces of identification information among the plurality of processing programs.

2. A substrate processing system, wherein: have: The substrate processing apparatus according to claim 1; and a management device connected to the substrate processing device in a manner capable of transmitting and receiving data; The creating unit creates the flow protocol based on the two or more pieces of identification information transmitted from the management device, received by the substrate processing apparatus, and acquired by the information acquiring unit.

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