Surface de-icing structure, surface de-icing device and surface de-icing method

Abstract

The present invention discloses a surface de-icing structure, a surface de-icing device and a surface de-icing method, which relate to the field of object surface de-icing. The surface de-icing structure includes: a substrate and interdigital electrodes. The surface of the substrate has a hydrophobic region and a hydrophilic region, and the hydrophilic regions are arranged on both sides of the hydrophobic region. Among them, channels are arranged on the surface of the substrate, and the channels form the hydrophilic regions. The interdigital electrodes are arranged on the substrate, and the interdigital electrodes are used to conduct electricity with two adjacent channels and are used to jointly form a discharge electrode with the brine in the channels. When the hydrophobic region and the channels are connected by brine to form a loop, the brine located in the hydrophobic region is used as a resistance heater. The surface de-icing device provided by the embodiments of the present application has high and stable de-icing efficiency, solves the problem that liquid water is difficult to penetrate and freeze in the holes between the upper and lower electrodes in the prior art, and thus there is a defect of low de-icing efficiency.

Description

Technical Field

[0001] The present invention relates to the field of deicing on the surface of an object, and particularly to a surface deicing structure, a surface deicing device, and a surface deicing method. Background Art

[0002] Under the influence of low-temperature climates such as polar regions and cold regions, the hulls, superstructures, and various equipment of sailing ships and offshore engineering equipment will be covered with a large amount of ice and snow, which will change the draft depth and center of gravity of the ship, thereby reducing the ship's stability and the reliability of the superstructure structure; a large amount of accumulated ice on the equipment will also affect the operation of the equipment, bringing serious safety risks.

[0003] In the prior art, there are already devices capable of surface deicing, and these devices all have a common pain point, that is, the deicing efficiency is not high. For example, the surface deicing structure disclosed in CN117395819A uses steam pressure to impact the ice layer to achieve the purpose of reducing the adhesion force at the bottom of the ice layer and promoting the cracking and peeling of the ice layer. However, this solution has problems such as the hierarchical layout of the inner and outer electrodes and the difficulty of liquid water penetrating and freezing in the through holes between the upper and lower electrodes, and thus has the defect of low deicing efficiency.

[0004] Therefore, providing a structure that can efficiently and stably perform surface deicing is a technical problem that needs to be urgently solved by those skilled in the art. Summary of the Invention

[0005] The present invention discloses a surface deicing structure, a surface deicing device, and a surface deicing method to at least partially improve the above technical problems.

[0006] To solve the above problems, the present invention adopts the following technical solutions:

[0007] On the one hand, an embodiment of the present application provides a surface deicing structure, including: a substrate and interdigital electrodes. The surface of the substrate has a hydrophobic region and a hydrophilic region, and the hydrophilic regions are arranged on both sides of the hydrophobic region. Among them, a channel is provided on the surface of the substrate, and the channel forms the hydrophilic region. The interdigital electrodes are arranged on the substrate, and the interdigital electrodes are used to conduct with two adjacent channels and are used to jointly form a discharge electrode with the brine in the channels. When a circuit is formed after the hydrophobic region and the channels are connected by brine, the brine located in the hydrophobic region is used as resistance heating.

[0008] In one embodiment, the surface deicing structure further includes: a porous electrode material, and the porous electrode material is arranged in the hydrophilic region and contacts the interdigital electrodes.

[0009] In one embodiment, the distance between adjacent porous electrode materials is 10 times to 50 times the width of the channel;

[0010] And / or, the depth of the channel is less than or equal to the thickness of the hydrophobic film layer;

[0011] And / or, the width of the channel is less than or equal to 1 mm;

[0012] And / or, the spacing between adjacent channels is less than or equal to 6 times the width of the channel.

[0013] In one embodiment, the surface de-icing structure further includes: a zero electrode, the zero electrode is electrically connected to the interdigital electrode, and the zero electrode is used to form a circuit with the porous electrode material and the interdigital electrode. At this time, the porous electrode material is used as a resistance heater.

[0014] In one embodiment, the surface de-icing structure further includes: a hydrophobic film layer, and the hydrophobic film layer is disposed on the surface of the substrate to form the hydrophobic region.

[0015] In one embodiment, the thickness of the hydrophobic film layer is less than or equal to 100 μm.

[0016] In one embodiment, the extending direction of the hydrophilic region is consistent with the flowing direction of the brine.

[0017] On the other hand, an embodiment of the present application further provides a surface de-icing device, including a power supply and the surface de-icing structure as described above, and the power supply is electrically connected to the interdigital electrode.

[0018] In one embodiment, the surface de-icing device further includes a temperature sensor, the temperature sensor is electrically connected to the power supply, and the temperature sensor is configured to: when the temperature of the circuit formed after the hydrophobic region and the channel are connected by brine rises to a specified temperature, control the power supply to turn off.

[0019] On yet another aspect, an embodiment of the present application further provides a surface de-icing method, including the following steps:

[0020] Set the foregoing surface de-icing structure at a part of the target object where there is a de-icing requirement;

[0021] When an ice layer is formed on the surface of the surface de-icing structure and de-icing is required, apply a voltage or pulse to the interdigital electrode.

[0022] The technical solution adopted by the present invention can achieve the following beneficial effects:

[0023] The surface de-icing structure provided by the embodiments of the present application forms a hydrophilic region by arranging channels for draining from the hydrophobic region on the substrate, and arranges interdigital electrodes. The interdigital electrodes and the brine in the guiding channels jointly form a discharge electrode. When the hydrophobic region is connected by brine between two adjacent discharge electrodes to form a loop, the brine in the hydrophobic region will be heated as a resistor, and thus the surface de-icing effect of the hydrophobic region can be achieved. The surface de-icing device provided by the embodiments of the present application has high and stable de-icing efficiency. Only when the brine connects the channels and the hydrophobic region can a loop be formed and de-icing operations be carried out, solving the defect or problem of low de-icing efficiency in the prior art that liquid water is difficult to penetrate and freeze in the holes between the upper and lower electrodes. Applying the above surface de-icing structure to the surface de-icing device and the surface de-icing method can also solve the above problems. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0025] Figure 1 FIG. shows a schematic structural diagram of a surface de-icing structure according to an embodiment of the present application attached to an object to be protected;

[0026] Figure 2 is Figure 1 an enlarged view of part A in;

[0027] Figure 3 FIG. shows a schematic structural diagram of another perspective of a surface de-icing structure according to an embodiment of the present application attached to an object to be protected;

[0028] Figure 4 is Figure 3 an enlarged view of part B in;

[0029] Figure 5 FIG. shows a schematic structural diagram of a part of a surface de-icing structure according to an embodiment of the present application attached to an object to be protected;

[0030] Figure 6 is Figure 5 an enlarged view of part C in;

[0031] Figure 7 FIG. shows a working principle diagram of a surface de-icing structure according to an embodiment of the present application;

[0032] Figure 8 FIG. shows a schematic structural diagram of a surface de-icing structure according to an embodiment of the present application;

[0033] Figure 9 The flowchart of a surface de-icing method in an embodiment of the present application is shown.

[0034] In the figure: 1, surface de-icing device; 10, surface de-icing structure; 110, substrate; 111, hydrophobic region; 112, hydrophilic region; 113, channel; 120, interdigital electrode; 130, porous electrode material; 140, hydrophobic film layer; 20, temperature sensor; 30, brine; 40, ice layer; 50, power supply; 2, object to be protected. Specific embodiments

[0035] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. Apparently, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present invention.

[0036] Terms such as "first" and "second" in the description and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same category, and the number of objects is not limited. For example, the first object can be one or multiple. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.

[0037] The inventive concept of the present application is described herein:

[0038] Under the influence of low-temperature climates such as polar regions and cold regions, the hulls, superstructures and various equipment of sailing ships and offshore engineering equipment will be covered with a large amount of ice and snow, which will change the draft depth and center of gravity of the ships, thereby reducing the ship stability and the structural reliability of the superstructure; a large amount of accumulated ice on the equipment will also affect the equipment operation, bringing serious safety risks.

[0039] In the prior art, there have been devices capable of surface de-icing. However, all of these devices have a common pain point, that is, the de-icing efficiency is not high. For example, the surface de-icing structure disclosed in CN117395819A uses steam pressure to impact the ice layer to reduce the adhesion force at the bottom of the ice layer and promote the cracking and peeling of the ice layer. However, this solution has problems such as the layered layout of the inner and outer electrodes and the difficulty of liquid water permeating and freezing in the through holes between the upper and lower electrodes, resulting in the defect of low de-icing efficiency.

[0040] Based on this, the inventor provides a surface de-icing structure, a surface de-icing device and a surface de-icing method. The surface de-icing structure uses the brine in the channel and the interdigital electrodes to jointly form a discharge electrode. When the adjacent discharge electrodes are connected by brine to form a circuit, this part of the brine will be heated as a resistor, thereby achieving surface de-icing.

[0041] The following Figures 1-9 , through specific embodiments and their application scenarios, the surface de-icing structure 10, the surface de-icing device 1 and the surface de-icing method provided by the present application are described in detail.

[0042] Please also refer to Figures 1-6 , the surface de-icing structure 10 provided by the embodiment of the present application may include: a substrate 110 and interdigital electrodes 120.

[0043] The substrate 110 can be made of an insulating material. For example, EVA (ethylene-vinyl acetate copolymer) or POE film (Polyolefin Elastomer) or PET film (Polyethylene terephthalate) can be selected to ensure good insulation performance and weather resistance between the subsequent electric heating structure and the surface to be protected. The substrate 110 can be attached to the surface of the object 2 to be protected to avoid or reduce the possibility of icing on the surface of the object 2 to be protected.

[0044] Please refer to Figure 1 and Figure 2 , the surface of the substrate 110 may have a hydrophobic region 111 and a hydrophilic region 112. The hydrophilic region 112 can be arranged on both sides of the hydrophobic region 111. In a specific embodiment, the hydrophilic region 112 and the hydrophobic region 111 can be arranged at intervals.

[0045] The embodiments of the present application do not limit the specific formation methods of the hydrophobic region 111 and the hydrophilic region 112. For example, in one embodiment, channels 113 may be provided on the surface of the substrate 110, and the channels 113 may form the hydrophilic region 112. When water accumulates on the surface of the substrate 110, the accumulated water will preferentially enter the channels 113. Further, in one embodiment, the extending direction of the hydrophilic region 112 may be consistent with the flowing direction of the accumulated water. Specifically, the extending direction of the channels 113 may be consistent with the flowing direction of the accumulated water, which is conducive to the downward transportation of the liquid film formed by the accumulated water on the surface of the substrate 110 by air flow shear, thereby avoiding excessive accumulation of water on the surface of the substrate and playing a role in preventing the formation of ice layer 40 on the surface of the substrate 110.

[0046] Please refer to Figure 3 and Figure 4 , the hydrophobic region 111 may be a hydrophobic film layer 140 provided on the surface of the substrate 110. That is, in one embodiment, the surface de-icing structure 10 may further include a hydrophobic film layer 140, and the hydrophobic film layer 140 may be provided on the surface of the substrate 110 to form the hydrophobic region 111. The embodiments of the present application do not limit the specific form and structure of the hydrophobic film layer 140. For example, in one embodiment, the hydrophobic film layer 140 may be made of materials such as PFA (modified polytetrafluoroethylene), PTFE (polytetrafluoroethylene), fluorinated polyethylene, fluorocarbon wax, or other synthetic fluorine-containing polymers. The hydrophobic film layer 140 made of these materials may be provided on the surface of the substrate 110 as an external insulation layer, weather resistance layer, and protective layer of the substrate 110, and at the same time, it needs to have strong long-term hydrophobic characteristics. In addition, in this embodiment, the thickness of the hydrophobic film layer 140 is less than or equal to 100 μm, which can make the specific surface have the hydrophobic region 111 while reducing the thickness of the hydrophobic region 111, thereby reducing the weight of the entire surface de-icing structure 10 for facilitating the carrying and installation of the surface de-icing structure 10, etc.

[0047] Continuing from the foregoing, the channels 113 arranged at intervals on the hydrophobic region 111 of the substrate 110 can utilize the surface tension gradient force between the hydrophobic region 111 and the channels 113 to promote the spontaneous aggregation of supercooled droplets during the icing process towards the channels 113, and form a liquid film layer with a greater thickness and slower flow rate inside the channels 113 compared to the hydrophobic region 111 or a conventional flat surface.

[0048] The embodiments of the present application do not limit the specific depth of the channel 113 either. For example, in this embodiment, according to engineering experience, the liquid film thickness is about 10 μm when the aircraft encounters supercooled water icing. According to the thickness of the hydrophobic film layer 140, the depth of the channel 113 can be less than or equal to the thickness of the hydrophobic film layer 140. Specifically, it can be comprehensively designed according to factors such as the surface tension of the hydrophilic region 112 and the hydrophobic region 111, the gradient force, the liquid film thickness in the anti-icing environment, and the liquid film freezing time, so as to ensure that 70% of the accumulated water between adjacent channels 113 enters the interior of the channel 113. This can ensure that the brine 30 can smoothly enter the hydrophilic region 112, and at the same time ensure that the water film thickness in the channel 113 is on the order of 100 μm, which is convenient for continuous conduction and heat storage. For the situation of a typical aircraft encountering supercooled water icing, the depth of the channel 113 is about 30 μm, the width of the channel 113 should be 500 microns, and the spacing is 1500 μm.

[0049] Please refer to Figure 5 and Figure 6 , the interdigital electrode 120 can be arranged on the substrate 110. Specifically, the interdigital electrode 120 can be arranged inside the substrate 110 and under the hydrophobic region 111. When the hydrophobic film layer 140 is used as the hydrophobic region 111, the interdigital electrode 120 can be located between the substrate 110 and the hydrophobic film layer 140. The interdigital electrode 120 refers to the manufacturing process of a mature flexible PCB (printed circuit board), or a flexible circuit board (Flexible Printed Circuit Board, abbreviated as "flexible board", commonly known as FPC in the industry) to make an electrothermal circuit layer, so that the interdigital electrode 120 can be adapted to substrates 110 of different shapes, which is beneficial to improving the applicability of the entire surface de-icing structure 10.

[0050] In this embodiment, the interdigital electrode 120 can be used to communicate with two adjacent channels 113 and jointly form a discharge electrode with the brine 30 in the channel 113. The interdigital electrode 120 and the brine 30 in one of the guide grooves also form a positive electrode, and the interdigital electrode 120 and the brine 30 in another channel 113 jointly form a negative electrode. When the hydrophobic region 111 and the channel 113 are connected by the brine 30 to form a loop, the brine 30 in the hydrophobic region 111 is used as a resistance for heating, and at this time, the surface de-icing effect on the hydrophobic region 111 can be achieved. It should be noted that the embodiments of the present application do not limit the specific form of the aforementioned brine 30. For example, it can be solid or liquid.

[0051] Furthermore, please refer to Figure 1 and Figure 2, in one embodiment, the surface de-icing structure 10 may further include: a porous electrode material 130, which may be disposed in the hydrophilic region 112, specifically in the guide groove. The porous electrode material 130 may be in contact with the interdigital electrode 120 and may be used as a conductive material between the interdigital electrode 120 and the external brine 30. The specific materials and forms of the porous electrode are not limited in the embodiments of the present application. In this embodiment, the porous conductive electrode should have good electrical conductivity and should have corrosion resistance, erosion resistance, etc., and have a porous structure inside so that the porous electrode material 130 can adsorb a large number of salt ions. For example, in some embodiments, an ORR (oxygen reduction reaction) electrode material made of MOFs (metal-organic frameworks) material, a glassy carbon electrode, etc. can be used as the porous electrode material 130.

[0052] Specifically, in this embodiment, the bottom of the porous electrode material 130 may be in contact with the interdigital electrode 120, and the top may be flush with the depth direction of the channel 113. There may be multiple porous electrode materials 130, which may be evenly distributed in the channel 113. Adjacent porous electrode materials 130 may be spaced apart, and the space between adjacent porous electrode materials 130 may be filled with an insulating and hydrophilic material, such as polyvinyl alcohol (PVA), polyacrylic acid (PAA), polyacrylamide (PAM), etc.

[0053] In a specific embodiment, the width of the channel 113 is less than or equal to 1 mm. Considering the processing technology, setting the width of the channel 113 to be less than or equal to 1 mm can ensure that the aerodynamic surface is limitedly rough, thereby reducing the influence of the airflow on the de-icing effect of the surface de-icing structure 10.

[0054] In addition, in this embodiment, the spacing between adjacent channels 113 is less than or equal to 6 times the width of the channel 113. If the spacing between the channels 113 is too large, it will be difficult to conduct between adjacent channels 113, resulting in low de-icing efficiency and easy surface ice residue. If the spacing between the channels 113 is too small, the space slot density on the surface of the substrate 110 will be too large, which is not conducive to the processing of the substrate 110, and the conduction frequency between adjacent channels 113 is too high. At this time, the entire surface de-icing structure 10 will be approximately the same as the surface heating of the entire substrate 110, resulting in too high energy consumption of the entire surface de-icing structure 10.

[0055] Furthermore, the distance between adjacent porous electrode materials 130 can be 10 to 50 times the width of the channel 113. It can be understood that the distance between adjacent porous electrode materials 130 is similar to the distance between each electric heating wire in a series circuit. Due to the limited width of the channel 113, setting the distance between adjacent porous electrode materials 130 to 10 to 50 times the width of the channel 113 can make the distance between adjacent porous electrode materials 130 also in the order of millimeters, which is the effective range of the thermal effect / vaporization destruction effect generated by the partial discharge of the discharge electrode.

[0056] In another embodiment, the surface de-icing structure 10 may further include: a zero electrode, which can be electrically connected to the interdigital electrode 120 and can be used to form a circuit with the porous electrode material 130 and the interdigital electrode 120. At this time, the porous electrode material 130 can be added as a resistor.

[0057] It should be noted that the circuit formed by the zero electrode, the interdigital electrode 120, and the porous electrode material 130 and the circuit formed by the discharge electrode and the brine 30 connecting the hydrophobic region 111 and the channel 113 are two independent and mutually exclusive circuits. For ease of explanation, the first circuit mentioned above will be referred to as the first loop hereinafter, and the second circuit mentioned above will be referred to as the second loop. That is to say, in this embodiment, when the first loop is turned on, the second loop cannot be turned on, and when the second loop is turned on, the first loop cannot be turned on.

[0058] Please refer to Figure 1 、 Figure 2 and Figure 7 , the working principle of the surface de-icing structure 10 provided by the embodiment of the present application is as follows:

[0059] When it is necessary to prevent icing of the object attached with the surface de-icing structure 10, the first loop can be turned on and the second loop can be blocked. At this time, the porous electrode material 130 can generate heat to prevent icing on the surface of the substrate 110.

[0060] When it is necessary to de-ice the object attached with the surface de-icing structure 10, the second loop can be turned on and the first loop can be blocked. At this time, the brine 30 connecting the hydrophobic region 111 and the channel 113 can be heated to de-ice the surface of the substrate 110.

[0061] Among them, in the case of a relatively low de-icing power requirement, a medium-low supply voltage is used for the interdigital electrode 120, and the thin brine 30 liquid film on the hydrophobic region 111 between adjacent channels 113 is heated by using the power supply basis that the channel 113 is filled with brine 30 or saline ice and is completely conductive, so as to achieve the de-icing effect.

[0062] In the case of a high de-icing power requirement and a fast freezing speed of the liquid film, a medium-high supply voltage is used for the interdigital electrode 120. Based on the supply foundation where each channel 113 is filled with brine 30 or saline ice and is completely conductive, the brine 30 liquid film or saline ice on the hydrophobic region 111 between adjacent channels 113 is heated.

[0063] When there are both a brine 30 liquid film and saline ice on the hydrophobic region 111 between adjacent channels 113, the current will preferentially heat the brine 30 film part with low resistance to quickly vaporize it to achieve the de-icing effect; when there is only saline ice on the hydrophobic region 111 between adjacent channels 113, due to the skin effect of the current, brine 30 will be generated first at the bottom interface of the position where the ice layer 40 is thickest, and then vaporization and ice breaking will occur first at this position.

[0064] The surface de-icing structure 10 provided by the embodiment of the present application sets channels 113 for draining from the hydrophobic region 111 as hydrophilic regions 112 on the substrate 110, and sets interdigital electrodes 120. By using the interdigital electrodes 120 and the brine 30 in the guide channels to jointly form a discharge electrode, when the hydrophobic region 111 is connected by brine 30 between two adjacent discharge electrodes to form a loop, the brine 30 located in the hydrophobic region 111 will be heated as a resistor, and thus the surface de-icing effect of the hydrophobic region 111 can be achieved. The surface de-icing device 1 provided by the embodiment of the present application has high and stable de-icing efficiency. Only when the brine 30 connects the channel 113 and the hydrophobic region 111 can a loop be formed and de-icing operation be carried out. Moreover, the depth of the channel 113 is small. Therefore, even if there is only a small amount of brine 30 on the surface of the surface de-icing structure 10, de-icing operation can still be carried out, preventing the accumulation of the ice layer 40 and solving the defect or problem of low de-icing efficiency that occurs when liquid water is difficult to penetrate and freeze in the through holes between the upper and lower electrodes in the prior art. In addition, the surface de-icing structure 10 provided by the embodiment of the present application has the advantages of simple structure and high control of anti-icing energy utilization rate, and can achieve the purpose of reducing the adhesion force at the bottom of the ice layer 40 and promoting the cracking and peeling of the ice layer 40.

[0065] Please refer to Figure 8 The embodiment of the present application further provides a surface de-icing device 1. The surface de-icing device 1 may include a power supply 50 and the surface de-icing structure 10 as described above. The power supply 50 can be electrically connected to the interdigital electrode 120 and is used to supply power to the interdigital electrode 120. The present application does not limit the specific form and parameters of the power supply 50. For example, in one embodiment, the power supply can be set as a power supply with low voltage (<100V), large current (within 10A), and low-frequency pulse (<100Hz).

[0066] In one embodiment, the surface de-icing device 1 may further include a temperature sensor 20. The temperature sensor 20 may be electrically connected to the power supply 50 and may be configured to control the power supply 50 to turn off when the temperature of the loop formed after the hydrophobic region 111 is connected by the brine 30 to the channel 113 rises to a specified temperature. This can further play a role in energy conservation. It should be noted that the embodiments of the present application do not limit the specific structure and form of the temperature sensor 20. Considering the compactness of the circuit structure, a snap-action thermostat such as a bimetal sheet or a polymer PTC thermistor is preferably used to automatically disconnect the single-circuit temperature within the range of 40~150°C; or following a similar idea of electric vehicle power management, an SMD (Surface Mounted Devices) flat chip temperature sensor is selected to detect the temperature of the interdigital electrode 120 circuit in each channel 113, and the on / off control of this circuit is combined with a digital circuit.

[0067] Please refer to Figure 9 , embodiments of the present application also provide a surface de-icing method, which can be applied to airplanes, ships, coastal buildings, etc. The method may include steps S100-S200:

[0068] Step S100: Set the above-mentioned surface de-icing structure at the part of the target object where de-icing is required.

[0069] Embodiments of the present application do not limit the specific form of the above setting. For example, it can be bonded or snapped, etc., and can be specifically set according to the actual situation. Since the thickness of the surface de-icing structure provided by the embodiments of the present application is relatively thin, it will not cause too much burden on the target object.

[0070] Step S200: When an ice layer is formed on the surface of the surface de-icing structure and de-icing is required, apply a voltage or pulse to the interdigital electrode.

[0071] In this embodiment, specifically according to different scenarios, different voltages or pulses can be applied to the interdigital electrode in different modes such as the de-icing mode or the anti-icing mode described above to achieve the de-icing or anti-icing effect.

[0072] It should be noted that in this article, the term "comprising", "including" or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device including a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the presence of additional identical elements in the process, method, article or device including that element.

[0073] In addition, it should be noted that the scope of the methods and apparatuses in the embodiments of the present application is not limited to performing functions in the order shown or discussed. It may also include performing functions in a substantially simultaneous manner or in a reverse order according to the functions involved. For example, the described methods may be performed in an order different from that described, and various steps may also be added, omitted, or combined. Additionally, the features described with reference to certain examples may be combined in other examples.

[0074] As described above, the above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, and all should be covered within the protection scope of the present invention.

Claims

1. A surface deicing structure, characterized in that: include: A substrate, wherein the surface of the substrate has a hydrophobic region and a hydrophilic region, and the hydrophilic region is arranged on both sides of the hydrophobic region; wherein the surface of the substrate is provided with a groove, and the groove forms the hydrophilic region; as well as An interdigital electrode, the interdigital electrode being disposed on the substrate, the interdigital electrode being used to be connected to two adjacent channels and to form a discharge electrode together with the salt water in the channels; When the hydrophobic area and the channel are connected by salt water to form a loop, the salt water in the hydrophobic area is heated as a resistor.

2. The surface deicing structure according to claim 1, characterized in that: The surface deicing structure further includes a porous electrode material, which is disposed in the hydrophilic region and in contact with the interdigital electrodes.

3. The surface deicing structure according to claim 2, characterized in that: The spacing between adjacent porous electrode materials is 10 to 50 times the width of the channel; and / or, the width of the groove is less than or equal to 1 mm; And / or, the spacing between adjacent grooves is less than or equal to 6 times the width of the groove.

4. The surface deicing structure according to claim 2, characterized in that: The surface deicing structure also includes: a zero pole, which is electrically connected to the interdigital electrodes. The zero pole is used to form a loop with the porous electrode material and the interdigital electrodes. At this time, the porous electrode material is used as a resistor for heating.

5. The surface deicing structure according to claim 1, characterized in that: The surface deicing structure further includes: a hydrophobic film layer, and the hydrophobic film layer is arranged on the surface of the substrate to form the hydrophobic area.

6. The surface deicing structure according to claim 5, characterized in that: The thickness of the hydrophobic film layer is less than or equal to 100 μm; and / or the depth of the groove is less than or equal to the thickness of the hydrophobic film layer.

7. The surface deicing structure according to any one of claims 1 to 6, characterized in that: The extending direction of the hydrophilic region is consistent with the flow direction of the salt water.

8. A surface deicing device, characterized in that: The invention comprises a power source and the surface deicing structure according to any one of claims 1 to 7, wherein the power source is electrically connected to the interdigital electrodes.

9. The surface deicing device according to claim 8, characterized in that: The surface deicing device also includes a temperature sensor, which is electrically connected to the power supply. The temperature sensor is configured to control the power supply to be turned off when the temperature of the loop formed by the connection of the hydrophobic area and the channel with brine rises to a specified temperature.

10. A method for deicing a surface, characterized in that: The following steps are involved: A surface deicing structure as claimed in any one of claims 1 to 7 is arranged at a location of the target object where deicing is required; When an ice layer is formed on the surface of the surface deicing structure and deicing is required, a voltage or a pulse is applied to the interdigital electrodes.

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