Component of electronic component and production process thereof

Abstract

The invention discloses an assembly of an electronic component and a production process of the assembly. The assembly comprises a base, a substrate, a circuit structure and the electronic component, the circuit structure comprises an insulating layer and a circuit line formed on the insulating layer, the circuit structure is fixedly connected to the substrate, and the insulating layer is spaced between the substrate and the circuit line; the electronic component is conductively connected to the circuit line and is fixed on the substrate at the same time; the base, the substrate, the circuit structure and the electronic component are integrally formed through one-time injection molding. Therefore, one-time injection molding is adopted for the assembly, the injection molding frequency is small, the production cost is low, the production efficiency is high, the substrate, the circuit structure and the electronic components can be combined into a whole, the thickness and the size of the assembly are greatly reduced, and the requirement for product miniaturization is met. Meanwhile, the electronic component can be conveniently attached and welded to a circuit on the surface of the substrate through the SMT technology, the welding effect is good, and the product yield is high.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, in particular to an assembly of electronic components and a production process thereof. Background Art

[0002] The base of the closed-loop voice coil motor in the camera module of a mobile terminal device usually needs to be equipped with electronic components such as Hall elements, coils and driver chips to achieve the corresponding closed-loop function. Due to the continuous miniaturization of mobile terminal devices, the size of the base of the corresponding voice coil motor is also smaller, and the current production process is relatively complicated for the production process of the base with various electronic components, and the production process efficiency is low.

[0003] Existing related technologies, such as Chinese patent CN 109287074 A, disclose a production process for a base with electronic components, in which a metal circuit is formed and the entire base is integrally formed by two injection molding processes and one SMT process, thereby avoiding the additional assembly process between the electronic components and the plastic parts. However, this process has the defect of requiring multiple injection molding processes.

[0004] Moreover, in this solution, since the metal circuit needs to be injected once and wrapped, a concave hole needs to be formed at the welding point of the metal circuit after injection molding to facilitate the subsequent welding with electronic components. However, the existence of the concave hole causes uneven solder filling when printing solder paste, affecting the subsequent SMT process welding and easily causing cold soldering and leaking. Therefore, it is necessary to change to or add a tinning process to solve the above problems, but in this way, the SMT process cannot be used alone, resulting in low efficiency and high cost. At the same time, when tinning, tin may be sprayed or splashed to other places, causing short circuits and other problems. Summary of the invention

[0005] The object of the present invention is to provide an assembly of electronic components and a production process thereof, which has the advantages of ensuring product yield, improving production efficiency and reducing production costs.

[0006] In order to achieve the above object, the solution of the present invention is: An assembly of electronic components, comprising a base, a substrate, a circuit structure and electronic components; The circuit structure includes an insulating layer and a circuit line formed on the insulating layer, and the circuit structure is fixedly connected to the substrate, and the insulating layer is spaced between the substrate and the circuit line; the electronic components are conductively connected to the circuit line and fixed to the substrate; The base is integrally formed with the substrate, the circuit structure and the electronic components by one-step injection molding.

[0007] Furthermore, the substrate is a metal substrate, and the insulating layer is an insulating film.

[0008] Furthermore, the insulating layer is a polyester film or a polyimide film; the circuit line is a circuit line made of liquid metal, a circuit line made of conductive silver paste, or a circuit line made of copper foil.

[0009] Furthermore, the electronic components are Hall elements, coils and / or drive chips.

[0010] Furthermore, the electronic components include a coil and a Hall element and / or a driving chip; the Hall element and / or the driving chip are soldered to a side of the circuit line away from the substrate; the coil is fixed to a side of the substrate away from the circuit structure, and a via is provided on the substrate, and a guide hole is provided on the insulating layer, and the coil is conductively connected to the circuit line through the via and the guide hole.

[0011] Furthermore, there are two circuit structures, which are respectively arranged on both sides of the substrate, and electronic components are connected to the circuit structures respectively; vias are provided on the substrate, guide holes are provided on the insulating layers of the two circuit structures, and the two circuit structures are conductively connected through the guide holes and the vias.

[0012] Furthermore, the insulating layer of the circuit structure is adhered and fixed or printed on the substrate.

[0013] Furthermore, the substrate includes a substrate body and a pin plug plate bent from the edge of the substrate body; the circuit structure has a circuit structure body and an insulating layer pin portion and a circuit pin bent and abutted against the pin plug plate; the base wraps the substrate body and the circuit structure body, while the pin plug plate, the insulating layer pin portion and the circuit pin extend out of one side of the base.

[0014] The present invention also provides a production process for an assembly of electronic components, comprising the following steps: S1, providing an insulating layer on a whole substrate, and batch forming a plurality of independent circuit lines on the insulating layer to form a first semi-finished product; S2, welding and fixing each electronic component to each circuit line of the first semi-finished product through SMT process to form a second semi-finished product; S3, dividing the second semi-finished product into a plurality of independent third semi-finished products having substrates, circuit structures and electronic components; S4, performing injection molding of bases on each of the third semi-finished products to obtain a finished product of the assembly.

[0015] Furthermore, in the step S1, the insulating layer is fixed on the entire substrate by printing or pasting; the insulating layer is first fixed to the substrate and then the circuit line is printed, or the circuit line is first printed and then fixed to the substrate; In step S2, the first semi-finished product is sent to a screen printer to print solder paste on each circuit line of the first semi-finished product, and then sent to a placement machine to place each electronic component on the placement machine and finally fixed by reflow soldering to obtain a second semi-finished product.

[0016] Furthermore, in the step S1, after the circuit line is formed, a coil is also formed on the circuit line to form a first semi-finished product with a coil and a circuit line.

[0017] Furthermore, the electronic components in step S2 do not include coils; in step S4, after the third semi-finished product is injection molded into a base, the coil is welded to the third semi-finished product to obtain the finished product of the assembly.

[0018] Furthermore, in the step S4, first, a long strip of material with a plurality of reinforcing plates arranged at intervals is provided, and each third semi-finished product obtained in step S3 is fixed one by one to the reinforcing plate of the material strip to obtain an intermediate product with the third semi-finished product, and then, the intermediate product is sent to an injection molding machine to injection mold a base for each third semi-finished product respectively, and finally, the third semi-finished product, the reinforcing plate and the base after injection molding are disconnected from the material strip to obtain the finished product of the component.

[0019] After adopting the above technical solution, the component adopts one-time injection molding, with fewer injection molding times, low production cost, high production efficiency, and the substrate, circuit structure and electronic components can be combined into one, greatly reducing the thickness and volume of the component, without multiple injection molding or multi-layer stacking like the prior art, which can meet the needs of product miniaturization. At the same time, the electronic components can be conveniently welded with the circuit lines on the surface of the substrate using the SMT process, and there will be no concave holes affecting the tin coating and welding, with good welding effect and high product yield; the electronic components can be Hall elements, coils and / or driver chips, and the component can be used as a base on the closed-loop voice coil motor in the camera module, which can realize the function of closed-loop detection.

[0020] The process of the present invention can be used to mass-produce the component, and a substrate is provided as a support and reinforcement structure, which can be conveniently fed into an SMT placement machine for placement of electronic components, thereby improving production efficiency, and a one-time injection molding base can reduce the number of injections and save production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a three-dimensional diagram of the assembly of Example 1 of the present invention; Figure 2 It is an exploded view of the components of Example 1 of the present invention; Figure 3 It is a partial structural schematic diagram of the components of Example 1 of the present invention (I); Figure 4It is a partial structural schematic diagram of the components of Example 1 of the present invention (II); Figure 5 is a cross-sectional view of a component of Example 1 of the present invention; Figure 6 for Figure 5 A magnified image of point A; Figure 7 This is a flow chart of the production process of Example 1 of the present invention; Figure 8 This is a flow chart of the production process of Example 2 of the present invention; Fig. 9 Schematic diagram of the process of step S4 of embodiment 2 of the present invention.

[0022] Explanation of reference numerals: component 10, base 1, substrate 2, via 21, conductive column 22, substrate body 23, pin plug board 24, circuit structure 3, insulating layer 31, guide hole 311, conductive material 312, circuit line 32, circuit structure body 33, insulating layer pin portion 34, circuit pin 35, electronic component 4, coil 41, driving chip 42, material strip 6, reinforcement plate 61, intermediate product 7. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0024] Example 1 like Figures 1 to 6 As shown, an electronic component assembly 10 of the present embodiment includes a base 1, a substrate 2, a circuit structure 3 and an electronic component 4.

[0025] The circuit structure 3 includes an insulating layer 31 and a circuit line 32 formed on the insulating layer 31, and the circuit structure 3 is fixedly connected to the substrate 2, and the insulating layer 31 is spaced between the substrate 2 and the circuit line 32; the electronic component 4 is conductively connected to the circuit line 32 and fixed to the substrate 2; The base 1 is integrally formed with the substrate 2 , the circuit structure 3 and the electronic components 4 by one-step injection molding.

[0026] Thus, the component 10 of this embodiment adopts one-time injection molding, with fewer injection molding times, low production cost, high production efficiency, and can combine the substrate 2, circuit structure 3 and electronic components 4 into one, greatly reducing the thickness and volume of the component 10, meeting the needs of product miniaturization. At the same time, the electronic component 4 can be conveniently welded to the circuit line 32 on the surface of the substrate 2 using a patch production process, with good welding effect and high product yield; the electronic component 4 can be a Hall element, a coil 41 and / or a driver chip 42, and the component 10 can be used as a base on a closed-loop voice coil motor in a camera module, which can realize a closed-loop detection function.

[0027] Furthermore, the above-mentioned component 10 can be manufactured by adopting the following production process.

[0028] like Figure 7 , a production process of an assembly of electronic components of this embodiment includes the following steps: S1. An insulating layer 31 is provided on a whole substrate 2, and a plurality of independent circuit lines 32 are formed in batches on the insulating layer 31 to form a first semi-finished product.

[0029] Specifically, the insulating layer 31 can be formed on the entire substrate 2 by printing or other methods. The insulating layer 31 can be made of materials such as polyimide or polyester, and then the circuit line 32 is formed on the insulating layer 31 of the substrate 2 by printing or other methods. The circuit line 32 can be a circuit line 32 made of liquid metal, a circuit line 32 made of conductive silver paste, or a circuit line 32 made of copper foil.

[0030] Of course, the insulating layer 31 can also be formed by pasting an insulating film on the surface of a whole substrate 2, and the insulating film can be a polyester film or a polyimide film, etc., and then printing the circuit line 32. Alternatively, the circuit line 32 can be first printed on the insulating film, and then the insulating film can be pasted and fixed on the substrate 2.

[0031] S2. Solder and fix each electronic component 4 to each circuit line 32 of the first semi-finished product through SMT process to form a second semi-finished product.

[0032] Specifically, since the circuit structures 3 on the first semi-finished product are fixed on a whole substrate 2, the second semi-finished product can be obtained by using the substrate 2 as a support and adopting the SMT process. The first semi-finished product can be sent to the screen printer to print the solder paste on the pads of each circuit line 32 of the first semi-finished product, and then sent to the placement machine to place the electronic components on the surface and finally fixed them by reflow soldering, so as to quickly and batch-weld the electronic components 4 to the corresponding pad positions of the circuit lines 32 to realize the corresponding circuit functions, thereby obtaining the second semi-finished product.

[0033] S3, dividing the second semi-finished product into several independent third semi-finished products having substrates 2, circuit structures 3 and electronic components 4; dividing a whole substrate 2 into independent third semi-finished products, while facilitating mass production, also meets the demand for product miniaturization.

[0034] S4, respectively perform injection molding of the base 1 on each of the third semi-finished products to obtain a finished product of the assembly 10. The finished product can be assembled with other structures of the camera module to form a complete camera module with a closed-loop function.

[0035] In summary, the process of the present invention can be used to mass-produce the component 10, and the substrate 2 is set as a support and reinforcement structure for the circuit structure, which can facilitate the use of the SMT process for mounting and fixing the electronic components 4 during production, thereby improving production efficiency, and one-time injection molding can reduce the number of injections and save production costs.

[0036] In this embodiment, the substrate 2 can be a metal substrate 2 so as to have good supporting performance and facilitate entering the SMT equipment for mounting and fixing during the production process. The substrate 2 included in the final product can reinforce the base 1, improve the supporting performance of the base 1, and increase the service life of the product.

[0037] In this embodiment, Figure 2 The Hall element and / or the driving chip 42 can be welded to the lower side of the circuit line 32 away from the substrate 2; and the coil 41 can be fixed to the side of the substrate 2 away from the circuit structure 3, see Figure 6 The figure is only a schematic drawing. The substrate 2 may be provided with a via hole 21, and the insulating layer 31 may be provided with a guide hole 311. The coil 41 is conductively connected to the circuit line 32 through the via hole 21 and the guide hole 311. In this way, different electronic components 4 can be arranged in corresponding positions as needed.

[0038] Specifically, the guide hole 311 may be filled with a conductive material 312, a conductive column 22 may be disposed inside the via hole 21, and the conductive column 22 may be spaced apart from the via hole 21 wall to form insulation, and the conductive material 312 and the conductive column 22 are connected as a whole, so as to realize the conductive connection between the coil 41 and the circuit line 32 by utilizing the conductive column 22 and the conductive material 312. Of course, the coil 41 may also realize the conductive connection with the circuit line 32 by other conventional means in the art, and is not limited thereto.

[0039] In another embodiment (not shown), the circuit structures 3 may be two and disposed on the upper and lower sides of the substrate 2, respectively, and the circuit structures 3 may be connected with electronic components 4 respectively; the substrate 2 may also be provided with vias 21, and the insulating layers 31 of the two circuit structures 3 may be provided with guide holes 311, and the two circuit structures 3 are conductively connected through the guide holes 311 and the conductive pillars 22 in the via holes 21. In this way, the design requirements of multiple circuit lines 32 can be met.

[0040] For example Figure 3 and Figure 4 The substrate 2 may include a substrate body 23 and a pin plug board 24 bent from the edges of both sides of the substrate body 23; the circuit structure 3 has a circuit structure body 33 and an insulating layer pin portion 34 and a circuit pin 35 bent and abutted against the pin plug board 24; the base 1 wraps the substrate body 23 and the circuit structure body 33, while the pin plug board 24, the insulating layer pin portion 34 and the circuit pin 35 extend out from the lower side of the base 1.

[0041] By providing the pin plug plate 24, the base 1 can be provided with an outwardly extending pin structure after injection molding, so as to facilitate assembly with other accessories of the camera module.

[0042] This embodiment adopts the SMT process to mount and fix the electronic components 4, and of course, laser welding can also be used.

[0043] Example 2 The structure of this embodiment is basically the same as that of the above-mentioned embodiment, except that the production process is different.

[0044] like Figure 8 and Fig. 9 As shown, a production process of an assembly of electronic components of this embodiment includes the following steps: S1. An insulating layer is provided on a whole substrate 2, and a plurality of independent circuit lines 32 are formed in batches on the insulating layer. At the same time, after each circuit line 32 is formed, one or more corresponding coils 41 are formed to form a first semi-finished product with coils 41 and circuit lines.

[0045] Specifically, the coil can be formed on the insulating layer by using an ion implantation plating semi-additive method and is conductively connected to the circuit line 32 .

[0046] S2. Solder and fix each electronic component 4 to each circuit line 32 of the first semi-finished product through SMT process to form a second semi-finished product.

[0047] Specifically, the electronic components 4 in this step may include a Hall and a driving chip, and the coil 41 may be formed by step S1, which can make production more convenient and improve production efficiency.

[0048] S3, dividing the second semi-finished product into several independent third semi-finished products 5 having substrates 2, circuit structures 3 and electronic components 4; dividing a whole substrate 2 into independent third semi-finished products 5, while facilitating mass production, also meets the demand for product miniaturization.

[0049] S4. First, a long strip of material strip 6 with a plurality of reinforcing plates 61 arranged at intervals can be provided, and each third semi-finished product 5 obtained in step S3 can be fixed one by one to the reinforcing plates 61 of the material strip 6 to obtain an intermediate product 7 with the third semi-finished product. Then, the intermediate product 7 is sent to an injection molding machine to injection mold the base of each third semi-finished product respectively. Finally, the third semi-finished product, the reinforcing plate and the base after injection molding are disconnected from the material strip to obtain the finished product of the component.

[0050] In this embodiment, compared with the embodiment 1, the third semi-finished product 5 is further combined with the material strip 6 to form the intermediate product 7, so that each third semi-finished product 5 can be more conveniently and quickly put into the injection molding machine for injection molding with the assistance of the long strip material strip 6. At the same time, the intermediate product 7 can also be rolled up separately and then sent to the downstream manufacturer for injection molding, which can reduce the production cost. In addition, the base after injection molding can also include the reinforcing plate, and the product structure strength is better.

[0051] Among them, in step S4, the material strip 6 can be formed by stamping or etching a metal strip, and the material strip 6 also forms two connecting strips 62, and each reinforcement plate 61 is connected to the two connecting strips 62 on both sides by a plurality of connecting pieces 63; subsequently, each connecting piece 63 and the connecting strip 62 can be conveniently interrupted to achieve the separation of the third semi-finished product 5, the reinforcement plate 61 and the base from the material strip 6 after injection molding.

[0052] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, equivalent changes and modifications without departing from the principle of the present invention should still belong to the protection scope of the present invention.

[0053] In the description of the embodiments of the present application, it should be understood that the indicated orientation or position relationship is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the product of the application is usually placed when in use, or is the orientation or position relationship commonly understood by technical personnel in this field. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0054] In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" and "several" is two or more, unless otherwise clearly and specifically defined.

Claims

1. An assembly of electronic components, characterized in that: Including base, substrate, circuit structure and electronic components; The circuit structure includes an insulating layer and a circuit line formed on the insulating layer, and the circuit structure is fixedly connected to the substrate, and the insulating layer is spaced between the substrate and the circuit line; the electronic components are conductively connected to the circuit line and fixed to the substrate; The base is integrally formed with the substrate, the circuit structure and the electronic components by one-step injection molding.

2. An electronic component assembly according to claim 1, characterized in that: The substrate is a metal substrate, the insulating layer is adhered or printed on the substrate; the insulating layer is a polyester film or a polyimide film; the circuit line is a circuit line made of liquid metal, a circuit line made of conductive silver paste or a circuit line made of copper foil.

3. An electronic component assembly according to claim 1, characterized in that: The electronic components include a coil and a Hall element and / or a driving chip; the Hall element and / or the driving chip are welded to a side of the circuit line away from the substrate; the coil is fixed to a side of the substrate away from the circuit structure, and a via is provided on the substrate, and a guide hole is provided on the insulating layer, and the coil is conductively connected to the circuit line through the via and the guide hole.

4. The electronic component assembly according to claim 1, characterized in that: There are two circuit structures, which are respectively arranged on both sides of the substrate, and electronic components are connected to the circuit structures respectively; vias are provided on the substrate, guide holes are provided on the insulating layers of the two circuit structures, and the two circuit structures are conductively connected through the guide holes and the vias.

5. The electronic component assembly according to claim 1, characterized in that: The substrate includes a substrate body and a pin plug plate bent from the edge of the substrate body; the circuit structure has a circuit structure body and an insulating layer pin portion and a circuit pin bent and abutted against the pin plug plate; the base wraps the substrate body and the circuit structure body, while the pin plug plate, the insulating layer pin portion and the circuit pin extend out of one side of the base.

6. A production process for an assembly of electronic components, characterized in that: The steps include: S1. An insulating layer is provided on a whole substrate, and a plurality of independent circuit lines are formed in batches on the insulating layer to form a first semi-finished product; S2, welding and fixing each electronic component to each circuit line of the first semi-finished product through SMT process to form a second semi-finished product; S3, dividing the second semi-finished product into a plurality of independent third semi-finished products having substrates, circuit structures and electronic components; S4, performing injection molding of bases on each of the third semi-finished products to obtain a finished product of the assembly.

7. The production process of an assembly of electronic components according to claim 6, characterized in that: In the step S1, the insulating layer is fixed on the whole substrate by printing or pasting; the insulating layer is first fixed to the substrate and then the circuit line is printed, or the circuit line is first printed and then fixed to the substrate; In step S2, the first semi-finished product is sent to a screen printer to print solder paste on the pads of each circuit line of the first semi-finished product, and then sent to a placement machine to place each electronic component on the surface and finally fixed by reflow soldering to obtain a second semi-finished product.

8. The production process of an assembly of electronic components according to claim 6, characterized in that: In the step S1, after the circuit line is formed, a coil is also formed on the circuit line to form a first semi-finished product with a coil and a circuit line.

9. The production process of an assembly of electronic components according to claim 6, characterized in that: The electronic components in step S2 do not include coils; in step S4, after the third semi-finished product is injection molded into a base, the coil is welded to the third semi-finished product to obtain the finished product of the assembly.

10. The production process of an assembly of electronic components according to claim 6, characterized in that: In the step S4, first, a long strip of material with a plurality of reinforcing plates arranged at intervals is provided, and the third semi-finished products obtained in step S3 are fixed one by one to the reinforcing plates of the material strip to obtain an intermediate product with the third semi-finished products. Then, the intermediate product is sent to an injection molding machine to injection mold the bases of the third semi-finished products respectively. Finally, the third semi-finished products, the reinforcing plates and the base after injection molding are disconnected from the material strip to obtain the finished product of the component.

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