Manufacturing method of single-side double-contact flexible circuit board

Abstract

The invention discloses a manufacturing method of a single-sided double-contact flexible circuit board, and relates to the technical field of printed circuit boards, in particular to the technical scheme, comprising the following steps of: step 1, combining a copper foil and a bearing film, and pressing the copper foil and the bearing film together through a film pressing process to obtain a base material I; 2, the base material I is sequentially subjected to pattern exposure treatment, developing treatment, dry film pasting treatment, etching treatment, film stripping treatment and drying treatment, and a base material II is obtained; 3, the base material II and the PI black film subjected to punching treatment are combined, and an initial material is obtained; fourthly, the bearing film on the initial material is torn off, the initial material is combined with a double-faced adhesive tape, the single-face double-contact flexible circuit board is obtained, and one side of the double-faced adhesive tape is provided with a release film. According to the mode, the bearing film is pressed on the copper foil, the bearing film can support the copper foil, and when the copper foil is treated, wrinkles generated by the layer attached to the bearing film can be reduced to a great extent.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a single-sided double-contact flexible circuit board. Background Art

[0002] With the development of miniaturization and lightweight of various electronic devices, it is required to use thin, light, flexible circuit boards with excellent bending performance and multifunctionality as important accessories of electronic devices. Single-sided flexible circuit boards can only be connected to electronic components on the pad side. Although double-sided flexible circuit boards can be connected to electronic components on both sides, the thickness of the plug-in end is relatively thick. Therefore, single-sided double-contact flexible circuit boards are produced.

[0003] At present, in the production process of existing single-sided double-contact flexible circuit boards, wrinkles are easily formed on the circuit board after it is formed, resulting in a high defective rate. Summary of the invention

[0004] The object of the present invention is to provide a method for manufacturing a single-sided double-contact flexible circuit board to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A method for manufacturing a single-sided double-contact flexible circuit board comprises the following steps:

[0007] Step 1: Combine the copper foil and the carrier film, and press the two together through a lamination process to obtain substrate I;

[0008] Step 2: subjecting substrate I to pattern exposure treatment, development treatment, dry film application treatment, etching treatment, film removal treatment and drying treatment in sequence to obtain substrate II;

[0009] Step 3: Combine the substrate II and the punched PI black film to obtain a primary material;

[0010] Step 4: tear off the carrier film on the initial material and combine it with the double-sided adhesive to obtain a single-sided double-contact flexible circuit board, wherein one side of the double-sided adhesive has a release film.

[0011] Preferably, the carrier film in step one comprises a sticky photosensitive adhesive film.

[0012] Preferably, the carrier film is attached to the rough surface of the copper foil.

[0013] Preferably, in the lamination process in step 1, single-sided lamination is performed on one side where the copper foil is provided, wherein the carrier film is rolled and laminated relative to the copper foil, and then cut after lamination.

[0014] Preferably, in the dry film pasting process in step 2, the release film provided on the copper foil needs to be torn off before pasting.

[0015] Preferably, the dry film is attached to the bright surface of the copper foil, and during the attaching process, the dry film is rolled and attached to the copper foil before being cut.

[0016] Preferably, in step 4, the carrier film is first irradiated by an exposure machine to reduce its viscosity before being peeled off.

[0017] Preferably, the method for manufacturing the single-sided contact flexible circuit board further comprises the following step: pressing and shaping the formed single-sided double-contact flexible circuit board.

[0018] Preferably, the copper foil has a thickness of 2 oz to 5 oz.

[0019] The beneficial effect of the present invention is that a layer of carrier film is pressed onto the copper foil, and the carrier film can play a supporting role for the copper foil. When the copper foil is processed, the wrinkles generated by the layer bonded thereto can be greatly reduced, thereby effectively improving the yield rate of the single-sided double-contact flexible circuit board. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] The present invention will be further described below in conjunction with the embodiments.

[0022] Example 1

[0023] A method for manufacturing a single-sided double-contact flexible circuit board comprises the following steps:

[0024] Step 1: Combine the copper foil and the carrier film, and press the two together through a lamination process to obtain substrate I. The thickness of the selected copper foil is 2OZ;

[0025] Step 2: subjecting substrate I to pattern exposure treatment, development treatment, dry film application treatment, etching treatment, film removal treatment and drying treatment in sequence to obtain substrate II;

[0026] Step 3: Combine the substrate II and the punched PI black film to obtain a primary material;

[0027] Step 4: tear off the carrier film on the raw material and combine it with the double-sided adhesive to obtain a single-sided double-contact flexible circuit board, wherein one side of the double-sided adhesive has a release film;

[0028] Step 5: Press and shape the formed single-sided double-contact flexible circuit board.

[0029] As a preferred solution, the carrier film used in step one is a sticky photosensitive adhesive film, and is adhered to the rough surface of the copper foil. After lamination, one side of the copper foil is single-sidedly pressed using a lamination process; in the dry film pasting process in step two, it is necessary to first tear off the release film on the copper foil and then adhere the dry film, and the dry film is pasted on the bright surface of the copper foil.

[0030] Furthermore, during the lamination process, the dry film and the carrier film are generally stored in rolls. When laminating, the dry film and the carrier film are respectively rolled and laminated to the copper foil and then cut, which can further effectively reduce the generation of wrinkles on the dry film and the carrier film.

[0031] Preferably, in step four, the carrier film is first irradiated by an exposure machine to reduce its viscosity before being peeled off, which can avoid the carrier film being difficult to peel off due to excessive viscosity during the peeling process and reduce the possibility of damage to the flexible circuit board due to pulling of the carrier film.

[0032] The invention laminates a carrier film on the copper foil, and the carrier film can support the copper foil. When the copper foil is processed, the wrinkles of the layer bonded to it can be greatly reduced, and the yield rate of the single-sided double-contact flexible circuit board can be effectively improved.

[0033] Example 2

[0034] A method for manufacturing a single-sided double-contact flexible circuit board comprises the following steps:

[0035] Step 1: Combine the copper foil and the carrier film, and press the two together through a lamination process to obtain substrate I. The thickness of the selected copper foil is 2.5OZ;

[0036] Step 2: subjecting substrate I to pattern exposure treatment, development treatment, dry film application treatment, etching treatment, film removal treatment and drying treatment in sequence to obtain substrate II;

[0037] Step 3: Combine the substrate II and the punched PI black film to obtain a primary material;

[0038] Step 4: tear off the carrier film on the raw material and combine it with the double-sided adhesive to obtain a single-sided double-contact flexible circuit board, wherein one side of the double-sided adhesive has a release film;

[0039] Step 5: Press and shape the formed single-sided double-contact flexible circuit board.

[0040] As a preferred solution, the carrier film used in step one is a sticky photosensitive adhesive film, and is adhered to the rough surface of the copper foil. After lamination, one side of the copper foil is single-sidedly pressed using a lamination process; in the dry film pasting process in step two, it is necessary to first tear off the release film on the copper foil and then adhere the dry film, and the dry film is pasted on the bright surface of the copper foil.

[0041] Furthermore, during the lamination process, the dry film and the carrier film are generally stored in rolls. When laminating, the dry film and the carrier film are respectively rolled and laminated to the copper foil and then cut, which can further effectively reduce the generation of wrinkles on the dry film and the carrier film.

[0042] Preferably, in step four, the carrier film is first irradiated by an exposure machine to reduce its viscosity before being peeled off, which can avoid the carrier film being difficult to peel off due to excessive viscosity during the peeling process and reduce the possibility of damage to the flexible circuit board due to pulling of the carrier film.

[0043] The invention laminates a carrier film on the copper foil, and the carrier film can support the copper foil. When the copper foil is processed, the wrinkles of the layer bonded to it can be greatly reduced, and the yield rate of the single-sided double-contact flexible circuit board can be effectively improved.

[0044] Example 3

[0045] A method for manufacturing a single-sided double-contact flexible circuit board comprises the following steps:

[0046] Step 1: Combine the copper foil and the carrier film, and press them together through a lamination process to obtain substrate I. The thickness of the selected copper foil is 3OZ;

[0047] Step 2: subjecting substrate I to pattern exposure treatment, development treatment, dry film application treatment, etching treatment, film removal treatment and drying treatment in sequence to obtain substrate II;

[0048] Step 3: Combine the substrate II and the punched PI black film to obtain a primary material;

[0049] Step 4: tear off the carrier film on the raw material and combine it with the double-sided adhesive to obtain a single-sided double-contact flexible circuit board, wherein one side of the double-sided adhesive has a release film;

[0050] Step 5: Press and shape the formed single-sided double-contact flexible circuit board.

[0051] As a preferred solution, the carrier film used in step one is a sticky photosensitive adhesive film, and is adhered to the rough surface of the copper foil. After lamination, one side of the copper foil is single-sidedly pressed using a lamination process; in the dry film pasting process in step two, it is necessary to first tear off the release film on the copper foil and then adhere the dry film, and the dry film is pasted on the bright surface of the copper foil.

[0052] Furthermore, during the lamination process, the dry film and the carrier film are generally stored in rolls. When laminating, the dry film and the carrier film are respectively rolled and laminated to the copper foil and then cut, which can further effectively reduce the generation of wrinkles on the dry film and the carrier film.

[0053] Preferably, in step four, the carrier film is first irradiated by an exposure machine to reduce its viscosity before being peeled off, which can avoid the carrier film being difficult to peel off due to excessive viscosity during the peeling process and reduce the possibility of damage to the flexible circuit board due to pulling of the carrier film.

[0054] The invention laminates a carrier film on the copper foil, and the carrier film can support the copper foil. When the copper foil is processed, the wrinkles of the layer bonded to it can be greatly reduced, and the yield rate of the single-sided double-contact flexible circuit board can be effectively improved.

[0055] Example 4

[0056] A method for manufacturing a single-sided double-contact flexible circuit board comprises the following steps:

[0057] Step 1: Combine the copper foil and the carrier film, and press the two together through a lamination process to obtain substrate I. The thickness of the selected copper foil is 4OZ;

[0058] Step 2: subjecting substrate I to pattern exposure treatment, development treatment, dry film application treatment, etching treatment, film removal treatment and drying treatment in sequence to obtain substrate II;

[0059] Step 3: Combine the substrate II and the punched PI black film to obtain a primary material;

[0060] Step 4: tear off the carrier film on the raw material and combine it with the double-sided adhesive to obtain a single-sided double-contact flexible circuit board, wherein one side of the double-sided adhesive has a release film;

[0061] Step 5: Press and shape the formed single-sided double-contact flexible circuit board.

[0062] As a preferred solution, the carrier film used in step one is a sticky photosensitive adhesive film, and is adhered to the rough surface of the copper foil. After lamination, one side of the copper foil is single-sidedly pressed using a lamination process; in the dry film pasting process in step two, it is necessary to first tear off the release film on the copper foil and then adhere the dry film, and the dry film is pasted on the bright surface of the copper foil.

[0063] Furthermore, during the lamination process, the dry film and the carrier film are generally stored in rolls. When laminating, the dry film and the carrier film are respectively rolled and laminated to the copper foil and then cut, which can further effectively reduce the generation of wrinkles on the dry film and the carrier film.

[0064] Preferably, in step four, the carrier film is first irradiated by an exposure machine to reduce its viscosity before being peeled off, which can avoid the carrier film being difficult to peel off due to excessive viscosity during the peeling process and reduce the possibility of damage to the flexible circuit board due to pulling of the carrier film.

[0065] The invention laminates a carrier film on the copper foil, and the carrier film can support the copper foil. When the copper foil is processed, the wrinkles of the layer bonded to it can be greatly reduced, and the yield rate of the single-sided double-contact flexible circuit board can be effectively improved.

[0066] Example 5

[0067] A method for manufacturing a single-sided double-contact flexible circuit board comprises the following steps:

[0068] Step 1: Combine the copper foil and the carrier film, and press the two together through a lamination process to obtain substrate I. The thickness of the selected copper foil is 5OZ;

[0069] Step 2: subjecting substrate I to pattern exposure treatment, development treatment, dry film application treatment, etching treatment, film removal treatment and drying treatment in sequence to obtain substrate II;

[0070] Step 3: Combine the substrate II and the punched PI black film to obtain a primary material;

[0071] Step 4: tear off the carrier film on the raw material and combine it with the double-sided adhesive to obtain a single-sided double-contact flexible circuit board, wherein one side of the double-sided adhesive has a release film;

[0072] Step 5: Press and shape the formed single-sided double-contact flexible circuit board.

[0073] As a preferred solution, the carrier film used in step one is a sticky photosensitive adhesive film, and is adhered to the rough surface of the copper foil. After lamination, one side of the copper foil is single-sidedly pressed using a lamination process; in the dry film pasting process in step two, it is necessary to first tear off the release film on the copper foil and then adhere the dry film, and the dry film is pasted on the bright surface of the copper foil.

[0074] Furthermore, during the lamination process, the dry film and the carrier film are generally stored in rolls. When laminating, the dry film and the carrier film are respectively rolled and laminated to the copper foil and then cut, which can further effectively reduce the generation of wrinkles on the dry film and the carrier film.

[0075] Preferably, in step four, the carrier film is first irradiated by an exposure machine to reduce its viscosity before being peeled off, which can avoid the carrier film being difficult to peel off due to excessive viscosity during the peeling process and reduce the possibility of damage to the flexible circuit board due to pulling of the carrier film.

[0076] The invention laminates a carrier film on the copper foil, and the carrier film can support the copper foil. When the copper foil is processed, the wrinkles of the layer bonded to it can be greatly reduced, and the yield rate of the single-sided double-contact flexible circuit board can be effectively improved.

[0077] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0078] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A method for manufacturing a single-sided double-contact flexible circuit board, characterized in that: The steps include: Step 1: Combine the copper foil and the carrier film, and press the two together through a lamination process to obtain substrate I; Step 2: subjecting substrate I to pattern exposure treatment, development treatment, dry film application treatment, etching treatment, film removal treatment and drying treatment in sequence to obtain substrate II; Step 3: Combine the substrate II and the punched PI black film to obtain a primary material; Step 4: tear off the carrier film on the initial material and combine it with the double-sided adhesive to obtain a single-sided double-contact flexible circuit board, wherein one side of the double-sided adhesive has a release film.

2. The method for manufacturing a single-sided double-contact flexible circuit board according to claim 1, characterized in that: The carrier film described in step 1 includes a sticky photosensitive adhesive film.

3. The method for manufacturing a single-sided double-contact flexible circuit board according to claim 2, characterized in that: The carrier film is attached to the rough surface of the copper foil.

4. The method for manufacturing a single-sided double-contact flexible circuit board according to claim 3, characterized in that: In the lamination process in step 1, single-sided lamination is performed on one side where the copper foil is provided, wherein the carrier film is rolled and laminated relative to the copper foil, and then cut after lamination.

5. The method for manufacturing a single-sided double-contact flexible circuit board according to claim 4, characterized in that: In the dry film pasting process in step 2, it is necessary to first tear off the release film provided on the copper foil and then adhere it.

6. The method for manufacturing a single-sided double-contact flexible circuit board according to claim 5, characterized in that: The dry film is attached to the bright surface of the copper foil, and during the attaching process, the dry film is rolled and attached to the copper foil before being cut.

7. The method for manufacturing a single-sided double-contact flexible circuit board according to claim 1, characterized in that: In the step 4, the carrier film is first irradiated by an exposure machine to reduce its viscosity before being peeled off.

8. The method for manufacturing a single-sided double-contact flexible circuit board according to claim 1, characterized in that: The method for manufacturing the single-sided contact flexible circuit board also includes the following step: pressing and shaping the formed single-sided double-contact flexible circuit board.

9. The method for manufacturing a single-sided double-contact flexible circuit board according to claim 1, characterized in that: The thickness of the copper foil is 2 oz to 5 oz.