Operating System, Method and Controller for Controlling an Etching and Tin-Removing Equipment to Process Materials

Abstract

The present disclosure relates to an operating system, method and controller for controlling an etching and tin stripping device to process materials, belonging to the technical field of etching and tin stripping device control. The system includes an etching and tin stripping device, a controller and an image acquisition device. The controller is communicatively connected to the etching and tin stripping device and the image acquisition device respectively. The image acquisition device is configured to acquire image information about the material before the material enters the etching and tin stripping device. The etching and tin stripping device is configured with an etching solution pipeline and a tin stripping solution pipeline. The etching solution pipeline is used to spray etching solution on a plurality of etching areas, and the tin stripping solution pipeline is used to spray tin stripping solution on a plurality of tin stripping areas.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to the technical field of controlling an etching and tin stripping device, and more specifically, to an operating system, method, and controller for controlling an etching and tin stripping device to process materials. Background Art

[0002] With the rapid development of technology, the application scenarios of circuit boards are increasing, and the production of circuit boards tends to be artificial intelligence-based. Currently, in order to improve the production efficiency of circuit boards, an etching and tin stripping device is usually configured to perform etching and tin stripping processes on circuit boards. For some customized circuit boards, the etching solution can be sprayed on the circuit board through an etching device to complete the etching process of the circuit board, and then the tin stripping solution can be sprayed on the etched circuit board through a tin stripping device to complete the tin stripping process of the circuit board. However, the shapes of some customized or irregular-shaped circuit boards are irregular, resulting in different areas on these circuit boards that need to be etched and tin stripped. Therefore, in order to perform corresponding processing on all areas of these circuit boards, the etching and tin stripping device needs to increase the spraying scale or intensity, which leads to a large demand for the etching solution and tin stripping solution sprayed by the etching and tin stripping device, and the etching and tin stripping efficiency of the etching and tin stripping device is low. Summary of the Invention

[0003] An object of embodiments of the present disclosure is to provide a new technical solution for controlling the operation of an etching and tin stripping device to process materials.

[0004] According to a first aspect of the present disclosure, there is provided an operating system for controlling an etching and tin stripping device to process materials, the system including an etching and tin stripping device, a controller, and an image acquisition device. The controller is communicatively connected to the etching and tin stripping device and the image acquisition device respectively. The image acquisition device is configured to acquire image information about the material before the material enters the etching and tin stripping device. The etching and tin stripping device is configured with an etching solution pipeline and a tin stripping solution pipeline. The etching solution pipeline is used to spray the etching solution on multiple etching areas, and the tin stripping solution pipeline is used to spray the tin stripping solution on multiple tin stripping areas;

[0005] The controller is configured to: receive the target image information about the target material output by the image acquisition device; determine a target material model that matches the target material in the target image information through a preset image library; determine the position information of the target material according to the correspondence between the material characteristics of the target material model and the target material in the target image information; and first control the etching solution pipeline to spray the etching solution on a first etching area, and then control the tin stripping solution pipeline to spray the tin stripping solution on the first etching area according to the position information and the material characteristics.

[0006] Optionally, the system further includes a pose adjustment device communicatively connected to the controller, and the pose adjustment device is configured to adjust the pose of the material so that the material is parallel to the advancing direction of the material;

[0007] The controller is further configured to: control the pose adjustment device to adjust the pose of the target material so that the target material is parallel to the advancing direction of the material; when receiving the reaction force signal fed back by the pose adjustment device, obtain the position parameter information of the pose adjustment device; according to the position parameter information, control the pose adjustment device to move the target material to a set position; wherein the set position is related to the edge of the etching and tin stripping equipment.

[0008] Optionally, the controller is further configured to: determine a second etching area and a second tin stripping area passed by the target material among a plurality of etching areas and a plurality of tin stripping areas according to the lateral interval and the longitudinal interval of the target material reflected by the position information; according to the processing area of the target material in the second etching area and the second tin stripping area reflected by the material characteristics, screen out a first etching area and a first tin stripping area from the second etching area and the second tin stripping area.

[0009] Optionally, the etching solution pipeline is provided with a plurality of etching solution valves for controlling the spraying of etching solution in the corresponding etching areas; the tin stripping solution pipeline is provided with a plurality of tin stripping solution valves for controlling the spraying of tin stripping solution in the corresponding tin stripping areas;

[0010] The controller is further configured to: first control the opening of the etching solution valve in the first etching area according to the position information and the material characteristics to control the spraying of etching solution in the first etching area, and then control the opening of the tin stripping solution valve in the first tin stripping area to control the spraying of tin stripping solution in the first tin stripping area.

[0011] According to a second aspect of the present disclosure, there is also provided a method for controlling the operation of an etching and tin stripping device to process a material. The execution subject of the method is the controller according to the first aspect. The controller is communicatively connected to the etching and tin stripping device and an image acquisition device respectively. The image acquisition device is configured to acquire image information about the material before the material enters the etching and tin stripping device. The etching and tin stripping device is configured with an etching solution pipeline and a tin stripping solution pipeline. The etching solution pipeline is used for spraying etching solution on a plurality of etching areas, and the tin stripping solution pipeline is used for spraying tin stripping solution on a plurality of tin stripping areas. The method includes:

[0012] Receiving the target image information about the target material output by the image acquisition device;

[0013] Determine a target material model that matches the target material in the target image information through a preset image library;

[0014] Determine the position information of the target material according to the correspondence between the material characteristics of the target material model and the target material in the target image information;

[0015] According to the position information and the material characteristics, first control the etching solution pipeline to spray etching solution on the first etching area, and then control the tin stripping solution pipeline to spray tin stripping solution on the first etching area.

[0016] Optionally, the system further includes a pose adjustment device, which is communicatively connected to the controller. The pose adjustment device is used to adjust the material pose to make the material parallel to the advancing direction of the material; before receiving the target image information about the target material output by the image acquisition device, the method further includes:

[0017] Control the pose adjustment device to adjust the target material pose to make the target material parallel to the advancing direction of the material;

[0018] When receiving the reaction force signal fed back by the pose adjustment device, obtain the position parameter information of the pose adjustment device;

[0019] According to the position parameter information, control the pose adjustment device to move the target material to a set position; wherein, the set position is related to the edge of the etching and tin stripping equipment.

[0020] Optionally, the step of, according to the position information and the material characteristics, first controlling the etching solution pipeline to spray etching solution on the first etching area, and then controlling the tin stripping solution pipeline to spray tin stripping solution on the first etching area includes:

[0021] Determine the second etching area and the second tin stripping area passed by the target material among a plurality of etching areas and a plurality of tin stripping areas according to the horizontal interval and the vertical interval of the target material reflected by the position information;

[0022] According to the processing area of the target material in the second etching area and the second tin stripping area reflected by the material characteristics, screen out the first etching area and the first tin stripping area from the second etching area and the second tin stripping area.

[0023] Optionally, the etching solution pipeline is configured with a plurality of etching solution valves for controlling the spraying of etching solution in corresponding etching areas; the tin stripping solution pipeline is configured with a plurality of tin stripping solution valves for controlling the spraying of tin stripping solution in corresponding tin stripping areas; the step of first controlling the etching solution pipeline to spray etching solution on the first etching area and then controlling the tin stripping solution pipeline to spray tin stripping solution on the first etching area according to the position information and the material characteristics includes:

[0024] According to the position information and the material characteristics, first control the etching solution valve in the first etching area to open to control the spraying of etching solution in the first etching area, and then control the tin stripping solution valve in the first tin stripping area to open to control the spraying of tin stripping solution in the first tin stripping area.

[0025] Optionally, the step of determining a target material model matching the target material in the target image information through a pre-set image library includes:

[0026] Determine a first area conforming to a first set shape and a first position of the first area in the target image information;

[0027] According to the quantity of the first areas and the first positions, screen out a matching target material model from the pre-set image library;

[0028] When the target material model is associated with a front and back difference identifier, determine a second area conforming to a second set shape and a second position of the second area in the target image information;

[0029] According to the quantity of the second areas and the second positions, determine that the first side of the target material shown in the target image information corresponds to the second side of the target material model.

[0030] According to a third aspect of the present disclosure, there is also provided an operating device for controlling an etching and tin stripping device to process materials, and the device includes:

[0031] An information receiving module for receiving target image information about a target material output by the image acquisition device;

[0032] A model determination module for determining a target material model matching the target material in the target image information through a pre-set image library;

[0033] An information determination module for determining the position information of the target material according to the correspondence between the material characteristics of the target material model and the target material in the target image information;

[0034] A pipeline control module, configured to control the etching solution pipeline to spray the etching solution on the first etching area according to the position information and the material characteristics, and then control the tin stripping solution pipeline to spray the tin stripping solution on the first etching area.

[0035] According to a fourth aspect of the present disclosure, there is also provided a controller, including a memory and a processor, where the memory is used to store a computer program; the processor is used to execute the computer program to implement the method according to the second aspect of the present disclosure.

[0036] According to a fifth aspect of the present disclosure, there is also provided a computer-readable storage medium, on which a computer program is stored, and the computer program, when executed by a processor, implements the method according to the second aspect of the present disclosure.

[0037] According to a sixth aspect of the present disclosure, there is also provided a computer program product, including a computer program, and the computer program, when executed by a processor, implements the method according to the second aspect of the present disclosure.

[0038] One beneficial effect of the embodiments of the present disclosure is that the controller of the operation system for controlling the etching and tin stripping equipment to process materials provided by the present invention can obtain target image information about the target material and screen out a matching target material model from the image library. According to the position information and material characteristics of the target material, control the etching solution pipeline to spray the etching solution on the first etching area and control the tin stripping solution pipeline to spray the tin stripping solution on the first tin stripping area. By identifying the material model corresponding to the target material from the image library and combining the position information and material characteristics of the target material, it is possible to effectively control the etching solution pipeline and the tin stripping solution pipeline to process the target material specifically, without the need for the etching and tin stripping equipment to increase the spraying scale or intensity, effectively reducing the consumption of the etching solution and the tin stripping solution, improving the working efficiency of the etching and tin stripping equipment, and thus reducing the processing cost of the circuit board.

[0039] Through the following detailed description of the exemplary embodiments of the present disclosure with reference to the accompanying drawings, other features and advantages of the embodiments of the present disclosure will become clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The drawings incorporated in the specification and constituting a part of the specification illustrate embodiments of the present disclosure and, together with the description, are used to explain the principles of the embodiments of the present disclosure.

[0041] Figure 1 is a schematic structural diagram of a composition of an operation system for controlling an etching and tin stripping equipment to process materials according to an embodiment;

[0042] Figure 2 is a schematic structural diagram of an etching and tin stripping equipment according to an embodiment;

[0043] Figure 3 Schematic diagram of multiple etching areas and multiple tin stripping areas according to an embodiment;

[0044] Figure 4 Schematic flow chart of an operation method for controlling an etching and tin stripping device to process materials according to an embodiment;

[0045] Figure 5 Schematic block diagram of an operation device for controlling an etching and tin stripping device to process materials according to an embodiment;

[0046] Figure 6 Schematic diagram of the hardware structure of an electronic device according to an embodiment.

[0047] Description of reference signs in the drawings:

[0048] Etching and tin stripping device 10; etching section 11; etching solution spray head 111; third conveying wheel 112; tin stripping section 12; tin stripping solution spray head 121; fourth conveying wheel 122; controller 20; image acquisition device 30; circuit board 5; first conveying wheel 6; second conveying wheel 7; Detailed implementation manners

[0049] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that: Unless otherwise specifically stated, the relative arrangements of the parts and steps set forth in these embodiments, numerical expressions and values do not limit the scope of the present invention.

[0050] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way serves as a limitation on the present invention or its application or use.

[0051] Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the specification.

[0052] In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values.

[0053] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0054] <System embodiment>

[0055] Figure 1 Schematic diagram of the composition structure of an operation system capable of applying an etching and tin stripping device to process materials according to an embodiment. As Figure 1As shown, the operating system of the control etching and tin stripping equipment for processing materials may include an etching and tin stripping equipment 10, a controller 20, and an image acquisition device 30. The controller 20 is communicatively connected to the etching and tin stripping equipment 10 and the image acquisition device 30 respectively. The image acquisition device 30 is used to acquire image information about the materials before the materials enter the etching and tin stripping equipment 10. The etching and tin stripping equipment 10 is configured with an etching solution pipeline and a tin stripping solution pipeline. The etching solution pipeline is used to spray etching solution on multiple etching areas, and the tin stripping solution pipeline is used to spray tin stripping solution on multiple tin stripping areas.

[0056] In this application, as Figure 1 shown, the operating system of the control etching and tin stripping equipment 10 for processing materials may include a plurality of first conveying wheels 6 and second conveying wheels 7. The first conveying wheels 6 can drive the circuit board 5 to move inside the etching and tin stripping equipment 10, and the second conveying wheels 7 can drive the circuit board 5 after tin stripping to move out of the etching and tin stripping equipment 10.

[0057] In this application, as Figure 2 shown, a plurality of first conveying wheels 6 can be arranged in two rows, so that the circuit board 5 can be sent into the etching and tin stripping equipment 10 between the two rows of first conveying wheels 6. A plurality of second conveying wheels 7 can be arranged in two rows, so that the circuit board 5 after tin stripping can be sent out of the etching and tin stripping equipment 10 between the two rows of second conveying wheels 7.

[0058] In this application, the etching and tin stripping equipment 10 can be divided into an etching section 11 and a tin stripping section 12. The etching section 11 is provided with two rows of third conveying wheels 112, so that the circuit board 5 can be driven by the third conveying wheels 112 to move to the tin stripping section 12. An etching solution pipeline is also arranged inside the etching section 11. The etching solution pipeline is provided with a plurality of etching solution spray heads 111, and these etching solution spray heads 111 can spray etching solution towards the circuit board 5. The tin stripping section 12 is provided with two rows of fourth conveying wheels 122, so that the circuit board 5 can be driven by the fourth conveying wheels 122 to move out of the etching and tin stripping equipment 10. A tin stripping solution pipeline is also arranged inside the tin stripping section 12. The tin stripping solution pipeline is provided with a plurality of tin stripping solution spray heads 121, and these tin stripping solution spray heads 121 can spray tin stripping solution towards the circuit board 5.

[0059] In this application, as Figure 3 shown, each etching solution spray head 111 can spray an etching area. For example, the etching solution spray heads 111 located above the etching section 11 can spray etching areas A1 - etching area C3, and the etching solution spray heads 111 located below the etching section 11 can spray etching areas E4 - etching area G6. Also, for example, etching area A1 can correspond to etching area E4.

[0060] In this application, as Figure 3As shown, each tin stripping liquid spray head 121 can spray a tin stripping area. For example, the tin stripping liquid spray head 121 located above the tin stripping part 12 can spray the tin stripping areas H1 - J3, and the tin stripping liquid spray head 121 located below the tin stripping part 12 can spray the tin stripping areas K4 - P6. For another example, the tin stripping area I2 can correspond to the tin stripping area Q5.

[0061] In this application, the image acquisition device 30 is, for example, a camera, which can be arranged above the first conveying wheel 6 so that the camera can obtain the image of area K1, that is, collect the image information of the material.

[0062] The controller 20 is configured to: receive the target image information of the target material output by the image acquisition device 30; determine the target material model matching the target material in the target image information through a preset image library; determine the position information of the target material according to the corresponding relationship between the material characteristics of the target material model and the target material in the target image information; and first control the etching liquid pipeline to spray etching liquid on the first etching area, and then control the tin stripping liquid pipeline to spray tin stripping liquid on the first etching area according to the position information and material characteristics.

[0063] Among them, the material can be a circuit board, and the target material is a certain circuit board.

[0064] In this application, the controller 20 can preset an image library, and the user can import the circuit layout diagrams of each circuit board 5 into the controller 20, so that multiple circuit layout diagrams of the circuit boards 5, that is, multiple material models, can be stored in the image library.

[0065] In this application, the target image information can display the material characteristics such as the component mounting holes and connection lines of the target material. That is to say, the target material model matching the target material is the same as the number, size and position of the component mounting holes and connection lines of the target material.

[0066] In this application, since the shooting position of the image acquisition device 30 is fixed, the controller 20 presets the orientation of the image output by the image acquisition device 30 relative to the etching and tin stripping device 10. For example, as Figure 1 shown, the area K1 can reflect the image output by the image acquisition device 30. The circuit board 5 can be matched with a material model, and it can be determined that the long side of the circuit board 5 deviates from the advancing direction of the circuit board 5 by a certain angle, and the circuit board 5 can pass through the etching areas A1 to B3, the etching areas E4 to F6, and the tin stripping areas K4 to O6.

[0067] In this embodiment, by identifying the material model corresponding to the target material from the image library and combining the position information and material characteristics of the target material, it is possible to effectively control the etching solution pipeline and the tin stripping solution pipeline to process the target material specifically, without the need for the etching and tin stripping equipment to increase the spraying scale or intensity, effectively reducing the consumption of the etching solution and the tin stripping solution, improving the working efficiency of the etching and tin stripping equipment, and thus reducing the processing cost of the circuit board.

[0068] In some embodiments, in order to further improve the utilization efficiency of the etching solution and the tin stripping solution, the controller 20 is further configured to: determine the second etching area and the second tin stripping area passed by the target material among a plurality of etching areas and a plurality of tin stripping areas according to the horizontal interval and the vertical interval of the target material reflected by the position information; and screen out the first etching area and the first tin stripping area from the second etching area and the second tin stripping area according to the processing area of the target material in the second etching area and the second tin stripping area reflected by the material characteristics.

[0069] In this application, the horizontal interval is the horizontal length of the target material model, and the vertical interval is the length in the advancing direction of the target material model.

[0070] In some examples, taking the upward-facing side of the target material as an example, the controller 20 can determine the processing areas of the target circuit board 5 passing through the etching areas A1 to A3 and the etching areas B1 to B3, that is, the processing area of the second etching area. Among them, the etching areas A1 to B3 are the second etching areas, and the tin stripping areas H1 to J3 are the second tin stripping areas. When the processing area is within the first area range, the controller 20 can control the etching solution pipeline to spray the etching areas A1 to A3, that is, the first etching area is the etching areas A1 to A3. When within the second area range, the controller 20 can control the etching solution pipeline to spray the etching areas A2 and A3, that is, the first etching area is the etching areas A2 and A3. When within the third area range, the controller 20 can control the etching solution pipeline to spray the etching area A3, that is, the first etching area is the etching area A3. Among them, the first area range, the second area range, and the third area range can be set artificially and are not limited herein.

[0071] In some examples, taking the calculation of the processing area as an example, the calculation is performed through the preset dividing line G1 and dividing line G2. When the area to be etched of the target material model is known, according to the dividing line G1, the processing area of the target material in the etching areas A1 to A3 can be determined. According to the dividing line G1 and the dividing line G2, the processing area of the target material in the etching areas B1 to B3 can be determined. Among them, calculating the area to be etched and the areas divided by the dividing lines are prior arts and will not be limited herein.

[0072] In some embodiments, in order to further improve the utilization efficiency of the etching solution and the tin stripping solution, the system further includes a pose adjustment device 40. The pose adjustment device 40 is communicatively connected to the controller 20, and the pose adjustment device 40 is configured to adjust the material pose to make the material parallel to the advancing direction of the material.

[0073] In this application, as Figure 1 shown, the pose adjustment device 40 may include a first telescopic part 41 and a second telescopic part 42. The thicknesses of the first telescopic part 41 and the second telescopic part 42 are less than the gap between the upper conveying wheel and the lower conveying wheel. The first telescopic part 41 and the second telescopic part 42 can clamp the circuit board 5 so that the circuit board 5 can be parallel to the advancing direction of the circuit board 5, that is, the pose of the circuit board 5 is adjusted. Moreover, the first telescopic part 41 and the second telescopic part 42 can clamp the circuit board 5 and move to adjust the position of the circuit board 5.

[0074] The controller 20 is further configured to: control the pose adjustment device 40 to adjust the target material pose to make the target material parallel to the advancing direction of the material; when receiving the reaction force signal fed back by the pose adjustment device 40, obtain the position parameter information of the pose adjustment device 40; according to the position parameter information, control the pose adjustment device 40 to move the target material to the set position; wherein, the set position is related to the edge of the etching and tin stripping device 10.

[0075] In this application, the controller 20 can detect the driving voltage of the pose adjustment device 40. When the driving voltage of the pose adjustment device 40 abnormally increases, it can be determined that the pose adjustment device 40 has received a reaction force, that is, the pose adjustment device 40 has fed back a reaction force signal. The controller 20 can determine the two lateral edge lines of the target material according to the positions of the first telescopic part 41 and the second telescopic part 42, and use the pose adjustment device 40 to move the target material to the set position. For example, the controller 20 can control the positions of the first telescopic part 41 and the second telescopic part 42 to make the edge line B3 of the target material collinear with the edge line B1, or control the edge line B4 of the target material to be collinear with the edge line B2; wherein, the lateral direction is perpendicular to the advancing direction of the target material.

[0076] In some embodiments, in order to control the spraying of different etching areas, the etching solution pipeline is configured with a plurality of etching solution valves, and the etching solution valves are used to control the spraying of the etching solution in the corresponding etching areas; the solder stripping solution pipeline is configured with a plurality of solder stripping solution valves, and the solder stripping solution valves are used to control the spraying of the solder stripping solution in the corresponding solder stripping areas.

[0077] The controller 20 is further configured to: according to the position information and the material characteristics, first control the opening of the etching solution valve in the first etching area to control the spraying of the etching solution in the first etching area, and then control the opening of the solder stripping solution valve in the first solder stripping area to control the spraying of the solder stripping solution in the first solder stripping area.

[0078] In some examples, taking the part of the target material passing through the etching areas A1 to A3 as an example, the area of this part is the above-mentioned processing area. When the processing area is within the first area range, the controller 20 can control the opening of the etching solution valves in the etching areas A1 to A3, that is, the first etching area is the etching areas A1 to A3. When within the second area range, the controller 20 can control the opening of the etching solution valves in the etching areas A2 and A3, that is, the first etching area is the etching areas A2 and A3. When within the third area range, the controller 20 can control the opening of the etching solution valve in the etching area A3, that is, the first etching area is the etching area A3.

[0079] Applied to the embodiments of the present disclosure, the memory of the controller 20 is used to store a computer program, and this computer program is used to control the processor of the controller 20 to operate according to the operation method of controlling the etching and solder stripping equipment to process materials in any embodiment. Those skilled in the art can design a computer program according to the solution of the embodiments of the present disclosure. How this computer program controls the processor to operate is well known in the art, so it will not be described in detail here.

[0080] <Method Embodiment>

[0081] Figure 4 It is a schematic flowchart of the operation method of controlling the etching and solder stripping equipment to process materials according to an embodiment. The implementation subject is the controller.

[0082] As Figure 4 shown, the operation method of controlling the etching and solder stripping equipment to process materials in this embodiment may include the following steps S410 to step S440:

[0083] Step S410, receiving the target image information of the target material output by the image acquisition device.

[0084] In some embodiments, before step S410, there are also steps S310 to S330:

[0085] Step S310: Control the pose adjustment device to adjust the pose of the target material so that the target material is parallel to the advancing direction of the material.

[0086] Step S320: When receiving the reaction force signal fed back by the pose adjustment device, obtain the position parameter information of the pose adjustment device.

[0087] Step S330: According to the position parameter information, control the pose adjustment device to move the target material to the set position; wherein, the set position is related to the edge of the etching and tin stripping equipment.

[0088] Step S420: Determine the target material model that matches the target material in the target image information through a pre-set image library.

[0089] In some embodiments, this step S420 may include the following steps S4201 to S4204:

[0090] Step S4201: Determine the first area that conforms to the first set shape in the target image information and the first position of the first area.

[0091] In this application, the first set shape may be a circle, that is, the controller can determine the first area representing the component mounting holes in the target material in the target image information and the first position of the first area.

[0092] Step S4202: According to the number and the first position of the first area, screen out the matching target material model from the pre-set image library.

[0093] In this application, the controller can screen out the target material model with the same position of the component mounting holes and the number of component mounting holes in the image library.

[0094] Step S4203: When the target material model is associated with the front and back difference identifier, determine the second area that conforms to the second set shape in the target image information and the second position of the second area.

[0095] Step S4204: According to the number and the second position of the second area, determine that the first side of the target material shown in the target image information corresponds to the second side of the target material model.

[0096] In some examples, the target material model is associated with a front and back difference identifier, which may include the specific position and specific shape of a specific area on the front or back of the target material model. For example, the target material model has a square at the center position on the front. When there is one and only one second area that conforms to the square in the target image information and is at the center position, it can be determined that the first side of the target material shown in the target image information corresponds to the front side of the target material model, that is, the second side. When the second area that conforms to the square in the target image information is not equal to one and / or is not at the center position, it can be determined that the first side of the target material shown in the target image information corresponds to the back side of the target material model.

[0097] In other words, through the front and back difference identifier, circuit boards with different etching and tin stripping standards can be adapted, further improving the utilization efficiency of the etching solution and the tin stripping solution.

[0098] Step S430: Determine the position information of the target material according to the correspondence between the material characteristics of the target material model and the target material in the target image information.

[0099] Step S440: According to the position information and the material characteristics, first control the etching solution pipeline to spray the etching solution on the first etching area, and then control the tin stripping solution pipeline to spray the tin stripping solution on the first etching area.

[0100] In some embodiments, step S440 may include the following step S4401:

[0101] Step S4401: According to the position information and the material characteristics, first control the etching solution valve in the first etching area to open to control the spraying of the etching solution on the first etching area, and then control the tin stripping solution valve in the first tin stripping area to open to control the spraying of the tin stripping solution on the first tin stripping area.

[0102] <Device Embodiment 1>

[0103] Figure 5 is a schematic block diagram of an operating device for controlling an etching and tin stripping device to process materials according to an embodiment. As Figure 5 shown, the operating device 500 for controlling the etching and tin stripping device to process materials may include:

[0104] An information receiving module 510, configured to receive the target image information about the target material output by the image acquisition device;

[0105] A model determination module 520, configured to determine a target material model that matches the target material in the target image information through a preset image library;

[0106] An information determination module 530, configured to determine the position information of the target material according to the correspondence between the material characteristics of the target material model and the target material in the target image information;

[0107] A pipeline control module 540, configured to first control an etching solution pipeline to spray an etching solution on a first etching area according to the position information and the material characteristics, and then control a tin stripping solution pipeline to spray a tin stripping solution on the first etching area.

[0108] Optionally, the operating device 500 of the control etching and tin stripping equipment for processing materials further includes a pose adjustment module, configured to control a pose adjustment device to adjust the pose of the target material to make the target material parallel to the advancing direction of the material; when receiving a reaction force signal fed back by the pose adjustment device, obtain the position parameter information of the pose adjustment device; according to the position parameter information, control the pose adjustment device to move the target material to a set position; wherein, the set position is related to the edge of the etching and tin stripping equipment

[0109] Optionally, the pipeline control module 540 is further configured to determine a second etching area and a second tin stripping area passed by the target material among a plurality of etching areas and a plurality of tin stripping areas according to the lateral interval and the longitudinal interval of the target material reflected by the position information; according to the processing area of the target material in the second etching area and the second tin stripping area reflected by the material characteristics, screen out a first etching area and a first tin stripping area from the second etching area and the second tin stripping area.

[0110] Optionally, the pipeline control module 540 is further configured to first control the opening of the etching solution valve in the first etching area according to the position information and the material characteristics to control the spraying of the etching solution in the first etching area, and then control the opening of the tin stripping solution valve in the first tin stripping area to control the spraying of the tin stripping solution in the first tin stripping area.

[0111] Optionally, the model determination module 520 is further configured to determine a first area that conforms to a first set shape in the target image information and a first position of the first area; according to the number of the first areas and the first position, screen out a matching target material model from a preset image library; when the target material model is associated with a front and back difference identifier, determine a second area that conforms to a second set shape in the target image information and a second position of the second area; according to the number of the second areas and the second position, determine that the first side of the target material shown in the target image information corresponds to the second side of the target material model.

[0112] <Second Embodiment of the Device>

[0113] Figure 6 It is a schematic hardware structure diagram of an electronic device according to another embodiment.

[0114] Such as Figure 6As shown, the electronic device 600 includes a processor 610 and a memory 620. The memory 620 is used to store executable computer programs, and the processor 610 is used to execute the methods of any of the above method embodiments under the control of the computer programs.

[0115] Each module of the above operation device 500 for controlling the etching and tin stripping device to process materials can be implemented by the processor 610 in this embodiment executing the computer program stored in the memory 620, or can be implemented by other structures, which is not limited herein.

[0116] The present invention can be a system, a method, and / or a computer program product. The computer program product can include a computer-readable storage medium having thereon computer-readable program instructions for causing a processor to implement various aspects of the present invention.

[0117] A computer-readable storage medium can be a tangible device that can retain and store instructions for use by an instruction execution device. A computer-readable storage medium can be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of the computer-readable storage medium include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disc read-only memory (CD-ROM), a digital versatile disc (DVD), a memory stick, a floppy disk, a mechanically encoded device such as a punched card or raised structures in grooves having instructions stored thereon, and any suitable combination of the foregoing. The computer-readable storage medium used herein is not construed as an instantaneous signal itself, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagated through a waveguide or other transmission medium (e.g., an optical pulse through an optical fiber cable), or an electrical signal transmitted through a wire.

[0118] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to various computing / processing devices, or downloaded to an external computer or external storage device through a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include a copper transmission cable, an optical fiber transmission, a wireless transmission, a router, a firewall, a switch, a gateway computer, and / or an edge server. A network adapter or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in the computer-readable storage medium in each computing / processing device.

[0119] The computer program instructions for performing the operations of the present invention may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-related instructions, microcode, firmware instructions, state-setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages such as Smalltalk, C++, etc., and conventional procedural programming languages such as the "C" language or similar programming languages. The computer-readable program instructions may be executed entirely on the user's computer, partially on the user's computer, executed as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., through the Internet using an Internet service provider). In some embodiments, by using the state information of the computer-readable program instructions to customize an electronic circuit, such as a programmable logic circuit, a field-programmable gate array (FPGA), or a programmable logic array (PLA), the electronic circuit can execute the computer-readable program instructions to implement various aspects of the present invention.

[0120] Aspects of the present invention are described herein with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer-readable program instructions.

[0121] These computer-readable program instructions may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that the instructions, when executed by the processor of the computer or other programmable data processing apparatus, create a means for implementing the functions / acts specified in one or more blocks of the flowchart illustrations and / or block diagrams. These computer-readable program instructions may also be stored in a computer-readable storage medium that causes a computer, a programmable data processing apparatus, and / or other devices to function in a particular manner, such that the computer-readable medium storing the instructions comprises a manufacture including instructions for implementing various aspects of the functions / acts specified in one or more blocks of the flowchart illustrations and / or block diagrams.

[0122] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other devices, causing a series of operational steps to be performed on the computer, other programmable data processing apparatus, or other devices to produce a computer-implemented process such that the instructions executed on the computer, other programmable data processing apparatus, or other devices implement the functions / actions specified in one or more boxes of the flowchart and / or block diagram.

[0123] The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagram may represent a module, a segment of code, or a portion of an instruction, which contains one or more executable instructions for implementing the specified logical function. In some alternative implementations, the functions noted in the blocks may occur out of the order noted in the figures. For example, two consecutive blocks may in fact be executed substantially in parallel, or they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented by a dedicated hardware-based system that performs the specified functions or actions, or by a combination of dedicated hardware and computer instructions. As is well known to those skilled in the art, implementation by hardware, implementation by software, and implementation by a combination of software and hardware are equivalent.

[0124] The embodiments of the present invention have been described above. The above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the market, or to enable other ordinary skilled persons in the art to understand the embodiments disclosed herein. The scope of the present invention is defined by the appended claims.

Claims

1. A system for controlling the operation of materials processed by etching and tin stripping equipment, characterized in that: The system includes an etching and tin stripping device, a controller and an image acquisition device, wherein the controller is respectively connected to the etching and tin stripping device and the image acquisition device for communication, and the image acquisition device is used to collect image information about the material before the material enters the etching and tin stripping device. The etching and tin stripping device is equipped with an etching liquid pipeline and a tin stripping liquid pipeline, wherein the etching liquid pipeline is used to spray etching liquid on multiple etching areas, and the tin stripping liquid pipeline is used to spray tin stripping liquid on multiple tin stripping areas; The controller is configured to: receive target image information about a target material output by the image acquisition device; determine a target material model matching the target material in the target image information through a preset image library; determine position information of the target material according to a corresponding relationship between a material feature of the target material model and the target material in the target image information; and control the etching liquid pipeline to spray etching liquid on the first etching area, and then control the tin stripping liquid pipeline to spray tin stripping liquid on the first etching area according to the position information and the material feature; The system further comprises a posture adjustment device, the posture adjustment device is in communication with the controller, and the posture adjustment device is used to adjust the posture of the material so as to achieve that the material is parallel to the advancing direction of the material; The controller is further configured to: control the posture adjustment device to adjust the posture of the target material so that the target material is parallel to the forward direction of the material; upon receiving the reaction force signal fed back by the posture adjustment device, obtain the position parameter information of the posture adjustment device; and according to the position parameter information, control the posture adjustment device to move the target material to a set position; wherein the set position is related to the edge of the etching and tin stripping equipment; The controller is also configured to: determine a second etching area and a second tin stripping area through which the target material passes among multiple etching areas and multiple tin stripping areas according to the lateral and longitudinal intervals of the target material reflected by the position information; and screen out a first etching area and a first tin stripping area from the second etching area and the second tin stripping area according to the processing area of ​​the target material in the second etching area and the second tin stripping area reflected by the material characteristics.

2. The system according to claim 1, characterized in that The etching liquid pipeline is equipped with a plurality of etching liquid valves, and the etching liquid valves are used to control the corresponding etching area to spray the etching liquid; the tin stripping liquid pipeline is equipped with a plurality of tin stripping liquid valves, and the tin stripping liquid valves are used to control the corresponding tin stripping area to spray the tin stripping liquid; The controller is also configured to: first control the etching liquid valve of the first etching area to open according to the position information and the material characteristics, so as to control the first etching area to spray the etching liquid, and then control the tin stripping liquid valve of the first tin stripping area to open, so as to control the first tin stripping area to spray the tin stripping liquid.

3. A method for controlling the operation of etching and tin stripping equipment to process materials, characterized in that: The method is performed by the controller according to claim 1 or 2, the controller is respectively connected to the etching and tin stripping equipment and the image acquisition device, the image acquisition device is used to collect image information about the material before the material enters the etching and tin stripping equipment, the etching and tin stripping equipment is equipped with an etching liquid pipeline and a tin stripping liquid pipeline, the etching liquid pipeline is used to spray etching liquid on multiple etching areas, and the tin stripping liquid pipeline is used to spray tin stripping liquid on multiple tin stripping areas, and the method comprises: Receiving target image information about the target material output by the image acquisition device; Determining a target material model matching the target material in the target image information through a preset image library; Determining the location information of the target material according to the corresponding relationship between the material characteristics of the target material model and the target material in the target image information; According to the position information and the material characteristics, firstly control the etching liquid pipeline to spray the etching liquid on the first etching area, and then control the tin stripping liquid pipeline to spray the tin stripping liquid on the first etching area; The system further includes a posture adjustment device, which is in communication with the controller and is used to adjust the posture of the material so that the material is parallel to the forward direction of the material; before receiving the target image information about the target material output by the image acquisition device, the method further includes: Controlling the posture adjustment device to adjust the posture of the target material so that the target material is parallel to the advancing direction of the material; Upon receiving the reaction force signal fed back by the posture adjustment device, obtaining position parameter information of the posture adjustment device; According to the position parameter information, the position adjustment device is controlled to move the target material to a set position; wherein the set position is related to the edge of the etching and tin stripping equipment; According to the position information and the material characteristics, firstly controlling the etching liquid pipeline to spray the etching liquid on the first etching area, and then controlling the tin stripping liquid pipeline to spray the tin stripping liquid on the first etching area, comprises: Determine, according to the lateral interval and the longitudinal interval of the target material reflected by the position information, a second etching area and a second tin stripping area through which the target material passes among the plurality of etching areas and the plurality of tin stripping areas; According to the processing areas of the target material in the second etching area and the second tin stripping area reflected by the material characteristics, the first etching area and the first tin stripping area are screened out from the second etching area and the second tin stripping area.

4. The method according to claim 3, characterized in that: The etching liquid pipeline is equipped with a plurality of etching liquid valves, and the etching liquid valves are used to control the corresponding etching area to spray the etching liquid; the tin stripping liquid pipeline is equipped with a plurality of tin stripping liquid valves, and the tin stripping liquid valves are used to control the corresponding tin stripping area to spray the tin stripping liquid; according to the position information and the material characteristics, the etching liquid pipeline is first controlled to spray the etching liquid on the first etching area, and then the tin stripping liquid pipeline is controlled to spray the tin stripping liquid on the first etching area, including: According to the position information and the material characteristics, the etching liquid valve of the first etching area is first controlled to open to control the first etching area to spray the etching liquid, and then the tin stripping liquid valve of the first tin stripping area is controlled to open to control the first tin stripping area to spray the tin stripping liquid.

5. The method according to claim 3, characterized in that: The step of determining the target material model matching the target material in the target image information through a preset image library includes: Determine a first area in the target image information that conforms to a first set shape and a first position of the first area; According to the number of the first areas and the first positions, selecting a matching target material model from the preset image library; In a case where the target material model is associated with a front and back distinguishing mark, determining a second area in the target image information that conforms to a second set shape and a second position of the second area; According to the number of the second areas and the second positions, it is determined that the first side of the target material displayed in the target image information corresponds to the second side of the target material model.

6. A controller, characterized in that: The method comprises a memory and a processor, wherein the memory is used to store a computer program; and the processor is used to execute the computer program to implement the method according to any one of claims 3 to 5.

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