LED Substrate, LED Device, Method of Using and Manufacturing LED Device

Abstract

The present invention discloses an LED substrate, an LED device, a usage method and a manufacturing method of the LED device, relating to the technical field of LEDs. The LED substrate includes: a substrate unit, conductive lines, at least two side pads and at least two bottom pads. The conductive lines are disposed on the upper surface of the substrate unit, and at least two upper pads for soldering LED chips are provided on the conductive lines. At least two side pads are disposed on the side of the substrate unit, and the upper end of each side pad is connected to the conductive line to be electrically connected to one upper pad. At least two bottom pads are disposed on the lower surface of the substrate unit and correspond to each side pad one by one, and each bottom pad is connected to the lower end of the corresponding side pad. For the LED substrate of the present invention, when the bottom pads of the LED substrate are connected to the PCB board, the LED chips on the LED substrate can emit light towards the top surface, and when the side pads of the LED substrate are connected to the PCB board, the LED chips on the LED substrate can emit light towards the side surface, and the functional compatibility is better.

Description

Technical Field

[0001] The present invention relates to the technical field of LEDs, and particularly to an LED substrate, an LED device, a method for using an LED device, and a method for manufacturing an LED device. Background Art

[0002] At present, LED devices have the advantages of high brightness, high contrast, high color gamut, long lifespan, strong anti-collision ability, high reliability, etc., and are widely used in high-definition display fields such as high-end rental / vehicle-mounted display / cinema live broadcast / virtual shooting.

[0003] In the prior art, LED devices are generally soldered on a PCB board and emit light from the top surface of the LED device. However, in some application scenarios, there is also a need for the LED device to emit light from the side, and the existing LED devices are difficult to meet such requirements. Summary of the Invention

[0004] Embodiments of the present invention provide an LED substrate, an LED device, a method for using an LED device, and a method for manufacturing an LED device to solve the technical problem in the related art that existing LED devices are difficult to be compatible with emitting light from the top surface and the side.

[0005] In a first aspect, an LED substrate is provided, including:

[0006] A substrate unit;

[0007] A conductive circuit provided on the upper surface of the substrate unit, and at least two upper pads for soldering LED chips are provided on the conductive circuit;

[0008] At least two side pads provided on the side of the substrate unit, and the upper end of each side pad is connected to the conductive circuit to be electrically connected to one of the upper pads;

[0009] Bottom pads provided on the lower surface of the substrate unit and corresponding to each side pad one by one, and each bottom pad is connected to the lower end of the corresponding side pad.

[0010] In some embodiments, at least two through holes are formed on the side of the substrate unit, and each through hole is filled with conductive metal to form the side pad.

[0011] In a second aspect, an LED device is provided, including the aforementioned LED substrate, and further including: a packaging layer and at least one LED chip;

[0012] The packaging layer is provided on the upper surface of the substrate unit, and each LED chip is provided between the substrate unit and the packaging layer and is connected to the corresponding two upper pads.

[0013] In some embodiments, there are three LED chips, and the light-emitting colors of the three LED chips are red, green, and blue respectively. There are six upper pads, and both the side pads and the bottom pads are four.

[0014] One LED chip is welded to every two of the upper pads. One of the side pads serves as the first electrode and is connected to the three upper pads of the three LED chips through the conductive lines. The other three side pads serve as the second electrodes and are respectively connected to the other three upper pads of the three LED chips through the conductive lines. Among them, the first electrode is the common electrode.

[0015] In some embodiments, the encapsulation layer is a transparent encapsulation colloid.

[0016] In a third aspect, a method for using an LED device is provided, including the following steps:

[0017] Connect the four side pads or the four bottom pads of the LED device to an external LED driver chip.

[0018] Use the external LED driver chip to provide different currents to the three LED chips and respectively adjust the brightness of the three LED chips.

[0019] In a fourth aspect, a method for manufacturing an LED device is provided, including the following steps:

[0020] Divide the substrate body into a plurality of substrate units arranged in an array along a preset cutting line.

[0021] Set at least two bottom pads on the lower surface of each substrate unit.

[0022] Set conductive lines on the upper surface of each substrate unit, and set at least two upper pads on the conductive lines of each substrate unit. One LED chip is welded to every two upper pads.

[0023] Press an encapsulation layer on the upper surface of the substrate body.

[0024] Set side pads corresponding to each bottom pad between every two substrate units in the same column of substrate units.

[0025] Cut the substrate body along the preset cutting line to obtain a plurality of LED devices.

[0026] In some embodiments, the step of setting side pads corresponding to each bottom pad between every two substrate units in the same column of substrate units includes:

[0027] A via hole corresponding to each bottom pad of any one of the substrate units is provided between every two substrate units in the same column of substrate units, and a conductive body is filled in each via hole to form a side pad.

[0028] In some embodiments, the step of providing a via hole corresponding to each bottom pad of any one of the substrate units between every two substrate units in the same column of substrate units and filling a conductive body in each via hole to form a side pad includes:

[0029] Put the substrate body into the electrolyte solution, and perform electroplating using the conductive wires reserved on the substrate body and electrically connected to the conductive lines of each substrate unit to fill each via hole with a conductive body.

[0030] In some embodiments, the manufacturing method of the LED device further includes:

[0031] When there are three LED chips soldered on each substrate unit and the emission colors of the three LED chips are red, green, and blue respectively, the conductive lines of every two substrate units in the same column of substrate units and the centers of the three LED chips are centrosymmetric.

[0032] The beneficial effects brought by the technical solution provided by the present invention include:

[0033] The embodiments of the present invention provide an LED substrate, an LED device, a usage method and a manufacturing method of the LED device. The LED substrate is provided with at least two side pads and at least two bottom pads. When the bottom pads of the LED substrate are connected to the PCB board, the LED chips on the LED substrate can emit light towards the top surface. When the side pads of the LED substrate are connected to the PCB board, the LED chips on the LED substrate can emit light towards the side surface, and the functional compatibility is better. Description of the Drawings

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0035] Figure 1 It is a top view of an LED substrate provided by an embodiment of the present invention;

[0036] Figure 2 It is a front view of an LED device (including the Figure 1 LED substrate) provided by an embodiment of the present invention;

[0037] Figure 3Another top view of an LED substrate provided by an embodiment of the present invention;

[0038] Figure 4 Front view and top view of the bottom pads of multiple LED devices provided by an embodiment of the present invention connected to a PCB board;

[0039] Figure 5 Front view and top view of the side pads of multiple LED devices provided by an embodiment of the present invention connected to a PCB board;

[0040] Figure 6 Top view of an LED device provided by an embodiment of the present invention;

[0041] Figure 7 Schematic flow chart of a manufacturing method of an LED device provided by an embodiment of the present invention;

[0042] Figure 8 Provided by an embodiment of the present invention Figure 7 Schematic diagram of implementing step S10 in;

[0043] Figure 9 Provided by an embodiment of the present invention Figure 7 Schematic diagram of implementing step S20 in;

[0044] Figure 10 Provided by an embodiment of the present invention Figure 7 Schematic diagram of implementing step S30 in;

[0045] Figure 11 Provided by an embodiment of the present invention Figure 7 Schematic diagram of implementing step S40 in;

[0046] Figure 12 Provided by an embodiment of the present invention Figure 7 The first schematic diagram of implementing step S50 in;

[0047] Figure 13 Provided by an embodiment of the present invention Figure 7 The second schematic diagram of implementing step S50 in;

[0048] Reference numerals:

[0049] 1. Substrate unit;

[0050] 2. Conductive circuit;

[0051] 3. Side pad;

[0052] 4. Bottom pad;

[0053] 5. Top pad;

[0054] 6. LED chip;

[0055] 7. Encapsulation layer;

[0056] 9. Substrate body;

[0057] 10. PCB board;

[0058] 11. Preset cutting line. Detailed implementation manner

[0059] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0060] The embodiments of the present invention provide an LED substrate, which can solve the technical problem that existing LED devices are difficult to be compatible with top and side light emission.

[0061] See Figure 1 As shown, the embodiments of the present invention provide an LED substrate, including: substrate unit 1, conductive circuit 2, at least two side pads 3, and at least two bottom pads 4.

[0062] The conductive circuit 2 is disposed on the upper surface of the substrate unit 1, and at least two upper pads 5 for soldering LED chips 6 are provided on the conductive circuit 2. Figure 1 And Figure 6 Six upper pads 5 are provided in [description in Chinese], and one LED chip 6 is soldered to every two upper pads 5. Assuming that they are the first upper pad 5, the second upper pad 5, the third upper pad 5, the fourth upper pad 5, the fifth upper pad 5, and the sixth upper pad 5 from right to left in sequence, then the first upper pad 5 and the second upper pad 5 solder the first LED chip 6 (emitting red light), the third upper pad 5 and the fourth upper pad 5 solder the second LED chip 6 (emitting green light), and the fifth upper pad 5 and the sixth upper pad 5 solder the third LED chip 6 (emitting blue light).

[0063] At least two side pads 3 are disposed on the side of the substrate unit 1. The first end of each side pad 3 is connected to the conductive circuit 2 to be electrically connected to an upper pad 5, and the second end of each side pad 3 is connected to the bottom pad. Specifically, at least two through holes are formed on the side of the substrate unit 1, and each through hole is filled with conductive metal to form the side pad 3.

[0064] At least two bottom pads 4 are provided on the lower surface of the substrate unit 1 and correspond to each side pad 3 one by one, and each bottom pad 4 is connected to the lower end of a corresponding side pad 3.

[0065] For example, referring to Figure 3 As shown, when the number of LED chips 6 to be soldered is one, there are two side pads 3, upper pads 5, and bottom pads 4. Referring to Figure 1 and Figure 2 As shown, when the number of LED chips 6 to be soldered is three, among them, the light emitting colors of the three LED chips 6 are red, green, and blue (from right to left), there are six upper pads 5, and both the side pads 3 and the bottom pads 4 are four. Every two upper pads 5 are used to solder one LED chip 6. One side pad 3 serves as the first electrode and is connected to the three upper pads 5 of the three LED chips 6 through the conductive line 2. The other three side pads 3 serve as the second electrodes and are respectively connected to the other three upper pads 5 of the three LED chips 6 through the conductive line 2, where the first electrode is the common electrode. Referring to Figure 1 and Figure 6 As shown, the leftmost side pad 3 (H) serves as the first electrode (common electrode) and is connected to the sixth upper pad 5, the fourth upper pad 5, and the second upper pad 5 through the conductive line 2. The other three side pads 3 (B, G, R) are respectively connected to the fifth upper pad 5, the third upper pad 5, and the first upper pad 5 through the conductive line 2.

[0066] Taking the example of soldering three LED chips 6 on the LED substrate, when the bottom pads 4 of multiple LED substrates are connected to the PCB board 10, the LED chips 6 on the LED substrate emit light towards the top surface. Referring to Figure 4 As shown; when the side pads 3 of multiple LED substrates are connected to the PCB board 10, the LED chips 6 on the LED substrate emit light towards the side. Referring to Figure 5 As shown.

[0067] In the LED substrate in the embodiment of the present invention, it is provided with at least two side pads and at least two bottom pads. When the bottom pads of the LED substrate are connected to the PCB board, the LED chips on the LED substrate can emit light towards the top surface. When the side pads of the LED substrate are connected to the PCB board, the LED chips on the LED substrate can emit light towards the side, and the functional compatibility is better.

[0068] Referring to Figure 2 and Figure 6 As shown, the embodiment of the present invention provides an LED device, including the aforementioned LED substrate, and further including: a packaging layer 7 and at least one LED chip 6.

[0069] The LED substrate includes: a substrate unit 1, conductive lines 2, at least two side pads 3, and at least two bottom pads 4.

[0070] The conductive lines 2 are disposed on the upper surface of the substrate unit 1, and at least two upper pads 5 for soldering LED chips 6 are provided on the conductive lines 2. Figure 1 and Figure 6 Six upper pads 5 are provided, and one LED chip 6 is soldered to every two upper pads 5. Assuming that the upper pads 5 are the first upper pad 5, the second upper pad 5, the third upper pad 5, the fourth upper pad 5, the fifth upper pad 5, and the sixth upper pad 5 from right to left in sequence, then the first upper pad 5 and the second upper pad 5 solder the first LED chip 6 (emitting red light), the third upper pad 5 and the fourth upper pad 5 solder the second LED chip 6 (emitting green light), and the fifth upper pad 5 and the sixth upper pad 5 solder the third LED chip 6 (emitting blue light).

[0071] At least two side pads 3 are disposed on the side of the substrate unit 1, and the upper end of each side pad 3 is connected to the conductive lines 2 to be electrically connected to one upper pad 5. Specifically, at least two through holes are formed on the side of the substrate unit 1, and each through hole is filled with conductive metal to form the side pad 3.

[0072] At least two bottom pads 4 are disposed on the lower surface of the substrate unit 1 and correspond to each side pad 3 one by one, and each bottom pad 4 is connected to the lower end of the corresponding side pad 3.

[0073] The encapsulation layer 7 is disposed on the upper surface of the substrate unit 1, and each LED chip 6 is disposed between the substrate unit 1 and the encapsulation layer 7 and is connected to the corresponding two upper pads 5.

[0074] For example, referring to Figure 3 as shown, when the number of LED chips 6 to be soldered is one, both the side pads 3, the upper pads 5, and the bottom pads 4 are two. Referring to Figure 1 and Figure 2 as shown, when the number of LED chips 6 to be soldered is three, among which, the emission colors of the three LED chips 6 are red light, green light, and blue light (from right to left), the upper pads 5 are six, both the side pads 3 and the bottom pads 4 are four, one LED chip 6 is soldered to every two upper pads 5, one side pad 3 serves as the first electrode and is connected to the three upper pads 5 of the three LED chips 6 through the conductive lines 2, and the other three side pads 3 serve as the second electrodes and are respectively connected to the other three upper pads 5 of the three LED chips 6 through the conductive lines 2, wherein, the first electrode is the common electrode. Referring to Figure 1 and Figure 6As shown, the leftmost side pad 3 (H) serves as the first electrode (common electrode) and is connected to the sixth upper pad 5, the fourth upper pad 5, and the second upper pad 5 through the conductive line 2. The other three side pads 3 (B, G, R) are respectively connected to the fifth upper pad 5, the third upper pad 5, and the first upper pad 5 through the conductive line 2.

[0075] Taking the LED device including three LED chips 6 as an example, when the bottom pads 4 of multiple LED substrates are connected to the PCB board 10, the three LED chips 6 emit light towards the top surface. Refer to Figure 4 as shown; when the side pads of multiple LED substrates are connected to the PCB board 10, the three LED chips 6 emit light towards the side surface. Refer to Figure 5 as shown.

[0076] In the LED device of the embodiment of the present invention, the LED substrate is provided with at least two side pads and at least two bottom pads. When the bottom pads of the LED substrate are connected to the PCB board, the LED device can emit light towards the top surface. When the side pads of the LED substrate are connected to the PCB board, the LED device can emit light towards the side surface, and the functional compatibility is better.

[0077] As an optional implementation manner, in an embodiment of the invention, the encapsulation layer 7 is a transparent encapsulation colloid. The transparent encapsulation colloid cooperates with three LED chips 6 emitting red, green, and blue lights, and can enable the LED device to emit white light with different color temperatures, and the use cost of the transparent encapsulation colloid is relatively low.

[0078] The embodiment of the present invention provides a method for using an LED device, including the following steps:

[0079] Connect the four side pads 3 or the four bottom pads 4 of the LED device to an external LED driving chip;

[0080] Use the external LED driving chip to provide different currents to the three LED chips to respectively adjust the brightness of the three LED chips 6.

[0081] In the method for using the LED device in the embodiment of the present invention, by adjusting the brightness of the three LED chips, the LED device can emit white light with different color temperatures, and the color temperature adjustment is convenient, solving the problem that the white light color temperature of some existing LED devices is fixed and cannot be adjusted.

[0082] Refer to Figure 7 As shown, the embodiment of the present invention provides a manufacturing method of an LED device, including the following steps:

[0083] Step S10, divide the substrate body 9 into a plurality of substrate units 1 arranged in an array along the preset cutting line 11. Refer to Figure 8 as shown.

[0084] Step S20, at least two bottom pads 4 are arranged on the lower surface of each substrate unit 1, as shown in Figure 9 the figure.

[0085] Step S30, a conductive circuit 2 is arranged on the upper surface of each substrate unit 1, and at least two upper pads 5 are arranged on the conductive circuit 2 of each substrate unit 1. One LED chip 6 is welded on every two upper pads 5, as shown in Figure 8 and Figure 10 the figure.

[0086] Step S40, an encapsulation layer 7 is pressed on the upper surface of the substrate body 9, as shown in Figure 11 the figure.

[0087] Step S50, side pads 3 corresponding to each bottom pad one by one are arranged between every two substrate units 1 in the same column of substrate units 1, as shown in Figure 12 and Figure 13 the figure.

[0088] Step S60, the substrate body 9 is cut along a preset cutting line to obtain a plurality of LED devices.

[0089] The manufacturing method of the LED device according to the embodiment of the present invention can realize the low-cost production of the LED device.

[0090] As an optional implementation manner, in an embodiment of the invention, as shown in Figure 12 the figure, the step of arranging side pads 3 corresponding to each bottom pad 4 one by one between every two substrate units 1 in the same column of substrate units 1 includes:

[0091] Through holes corresponding to each bottom pad 4 of any one of the substrate units 1 are arranged between every two substrate units 1 in the same column of substrate units 1, and a conductive body is filled in each through hole to form side pads 3.

[0092] By adopting the above steps, after the through holes filled with the conductive body are finally cut along the cutting line of the substrate body 9, every two substrate units 1 in the same column of substrate units 1 both contain side pads 3, making full use of the substrate body 9 and improving the manufacturing production efficiency.

[0093] As an optional implementation manner, in an embodiment of the invention, as shown in Figure 13 the figure, the step of arranging through holes corresponding to each bottom pad 4 of any one of the substrate units 1 between every two substrate units 1 in the same column of substrate units 1, and filling a conductive body in each through hole to form side pads 3 includes:

[0094] Place the substrate body 9 into the electrolyte solution, and perform electroplating using the conductive wires reserved on the substrate body 9 and electrically connected to the conductive lines 2 of each substrate unit 1 to fill each through hole with a conductor.

[0095] The above method can be understood as an electroless copper plating process. The activation of palladium nuclei induces an autocatalytic electroless copper plating reaction. The newly formed electroless copper and the reaction by-product hydrogen can both act as reaction catalysts to catalyze the reaction, enabling the continuous progress of the copper plating reaction. After this step, electroless copper can be deposited on the inner wall of the through hole. If the copper plating in the through hole is not full enough, electroless copper plating can be performed again to fill the through hole with copper, ensuring the electrical conductivity of the side pads 3.

[0096] As an alternative embodiment, in an inventive embodiment, refer to Figure 8 and Figure 10 As shown, the manufacturing method of the LED device further includes;

[0097] When there are three LED chips 6 soldered on each substrate unit 1 and the emission colors of the three LED chips 6 are red, green, and blue respectively, the conductive lines 2 of every two substrate units 1 in the same column of substrate units 1 and the centers of the three LED chips 6 are centrosymmetric.

[0098] After such a setting, the multiple LED devices obtained by finally cutting the substrate body 9 along the preset cutting lines can be kept consistent, improving the production efficiency.

[0099] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by terms such as "upper", "lower", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. Unless otherwise clearly specified and defined, the terms "mounted", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0100] It should be noted that in the present invention, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0101] The above are only specific embodiments of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the broadest scope consistent with the principles and novel features of the present invention.

Claims

1. A manufacturing method of an LED device, characterized in that, Including the following steps: Dividing the substrate body (9) into a plurality of substrate units (1) arranged in an array along a preset cutting line (11); Providing at least two bottom pads (4) on the lower surface of each substrate unit (1); Providing a conductive circuit (2) on the upper surface of each substrate unit (1), and providing at least two upper pads (5) on the conductive circuit (2) of each substrate unit (1), and soldering an LED chip (6) on every two upper pads (5); Pressing and encapsulating a layer (7) on the upper surface of the substrate body (9); Providing through holes corresponding to each of the bottom pads one by one between every two substrate units (1) in the same column of substrate units (1), and filling a conductive body in each through hole; Cutting the substrate body (9) along the preset cutting line (11) to obtain a plurality of LED devices, and the preset cutting line (11) divides each through hole filled with a conductive body into two halves to form side pads (3), the upper end of each side pad (3) is connected to the conductive circuit (2) of the corresponding substrate unit (1) to be connected to an upper pad (5), and the lower end of each side pad (3) is connected to a bottom pad (4) of the corresponding substrate unit (1).

2. The manufacturing method of the LED device according to claim 1, wherein, The step of providing through holes corresponding to each of the bottom pads of any one of the substrate units one by one between every two substrate units (1) in the same column of substrate units (1) and filling a conductive body in each through hole includes: Putting the substrate body (9) into an electrolyte solution, and performing electroplating by using a conductive wire reserved on the substrate body (9) and electrically connected to the conductive circuit (2) of each substrate unit (1) to fill each through hole with a conductive body.

3. The manufacturing method of the LED device according to claim 1, characterized in that, It further includes: When there are three LED chips (6) soldered on each substrate unit (1) and the emission colors of the three LED chips (6) are red light, green light, and blue light respectively, the conductive circuits (2) of every two substrate units (1) in the same column of substrate units (1) and the centers of the three LED chips (6) are centrosymmetric.

4. The manufacturing method of the LED device according to claim 1, characterized in that, The encapsulating layer (7) is a transparent encapsulating colloid.

5. An LED device, characterized in that, It is manufactured by using the manufacturing method of the LED device according to claim 1.

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