Ultrasonic high-pressure flushing equipment for inner wall of semiconductor pipeline

Abstract

The invention belongs to the technical field of semiconductor pipeline cleaning, and particularly relates to semiconductor pipeline inner wall ultrasonic high-pressure flushing equipment which comprises a workbench, a stepping conveying belt is installed on the workbench, the workbench is connected with a cleaning box through a connecting table, an air cylinder is installed on the cleaning box, the output end of the air cylinder is connected with a cleaning assembly, and a tray is placed on the stepping conveying belt. A fixing seat and a rotating assembly are installed on the tray, and a semiconductor pipeline is fixed to the fixing seat and the rotating assembly. The ultrasonic generation plate at the bottom of the T-shaped plate is driven by the T-shaped plate to be attached to the outer wall of the pipeline, the pipeline is driven by the ultrasonic generation plate to vibrate, and dirt on the inner wall of the pipeline is loosened. The second L-shaped rod drives the pipeline to incline, the high-pressure nozzle flushes from the inner wall of the pipeline away from one end of the high-pressure nozzle to the inner wall of the pipeline close to one end of the high-pressure nozzle, and meanwhile the belt drives the inclined pipeline to rotate, so that the high-pressure nozzle flushes all parts of the inner wall of the pipeline, and cleaning dead corners of the inner wall of the pipeline are avoided.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor pipeline cleaning, and in particular relates to an ultrasonic high-pressure washing device for the inner wall of a semiconductor pipeline. Background Art

[0002] Semiconductor pipelines are a type of pipeline system specifically used to transport high-purity fluids during semiconductor manufacturing. As pipelines are used for a long time, impurities and chemicals will accumulate on the inner wall of the pipeline, corroding the pipe wall, causing problems such as thinning of the pipe wall and holes. Existing technologies can reduce the residue of these harmful substances, reduce the corrosion rate of the pipeline, and extend the service life of the pipeline by flushing the pipeline.

[0003] Compared with other pipelines, semiconductor pipelines have extremely high requirements for manufacturing precision. The smoothness inside the pipeline must be ensured, and the inner surface roughness is usually required to reach the nanometer level. The diameter of semiconductor pipelines is smaller, such as photoresist delivery pipelines and chemical mechanical polishing liquid pipelines, whose pipeline diameter is 1-2 inches.

[0004] Therefore, during the process of high-pressure flushing of semiconductor pipelines, it is difficult for the high-pressure water nozzle to be inserted into the pipe for flushing. Even if the nozzle is inserted into the pipe, in order to avoid the nozzle scratching the inner wall of the pipe, the adjustment direction of the nozzle will be restricted, the difficulty of pipeline cleaning will be increased, and the pipeline is prone to cleaning dead corners. Summary of the invention

[0005] The purpose of the present invention is to provide an ultrasonic high-pressure flushing device for the inner wall of a semiconductor pipeline to solve the technical problems in the prior art in view of the shortcomings of the prior art.

[0006] The object of the present invention can be achieved by the following technical scheme: an ultrasonic high-pressure washing device for the inner wall of a semiconductor pipeline, which includes a workbench, a stepping conveyor belt is installed on the workbench, the workbench is connected to a cleaning box through a connecting table, a cylinder is installed on the cleaning box, and the output end of the cylinder is connected to a cleaning component, a tray is placed on the stepping conveyor belt, a fixed seat and a rotating component are installed on the tray, and the semiconductor pipeline is fixed on the fixed seat and the rotating component; the cleaning component includes a T-shaped plate, a motor is installed on the T-shaped plate, the motor drives the screw rod to rotate, the screw rod and the L-shaped rod are in transmission cooperation, the L-shaped rod is rotatably connected to one end of an ultrasonic generating plate, and the other end of the ultrasonic generating plate is connected to the T through a rotating shaft. The bottom of the T-shaped plate is connected; an inclined plate is slidably installed in the T-shaped plate, a high-pressure nozzle is installed on the inclined plate, and the cylinder drives the T-shaped plate to move downward, so that the ultrasonic generating plate at the bottom of the T-shaped plate fits the semiconductor pipeline; the rotating component includes a base and a press table, the base is installed on the tray, and a layout groove is provided on the press table, a driven roller group and an active roller are installed in the layout groove, a belt is installed on the driven roller group and the active roller, and a transmission gear is coaxially installed on the active roller; the press table is slidably matched with the base, the base is connected to the press table through a longitudinal spring, a rack is installed on the base, the rack is meshed with the transmission gear, one end of the semiconductor conduit is installed on the press table, so that the semiconductor conduit fits the belt.

[0007] As a further optimization or improvement of this solution, the screw rod is installed in a transmission manner with the L-shaped rod, a triangular frame is installed on the L-shaped rod, and the triangular frame fits the inclined surface of the inclined plate; when the L-shaped rod moves downward, the L-shaped rod pushes the inclined plate toward the semiconductor pipeline through the triangular frame.

[0008] As a further optimization or improvement of the present solution, a transverse groove is provided in the T-shaped plate, the inclined plate is slidably matched with the transverse groove, and the inclined plate is connected to the inner wall of the T-shaped plate via a transverse spring.

[0009] As a further optimization or improvement of this solution, the motor is connected to the lead screw via a reduction box, and the lead screw is respectively connected to the L-shaped rod 1 and the L-shaped rod 2 through transmission.

[0010] As a further optimization or improvement of the present solution, a slide groove is provided on the T-shaped plate, the L-shaped rod 2 and the L-shaped rod 1 are located in the slide groove and slide, and a screw rod is installed in the slide groove.

[0011] As a further optimization or improvement of this solution, a heat sink is installed on the cleaning box, an upper sliding pad is installed on the bottom of the ultrasonic generating plate, and a lower sliding pad is installed on the fixed seat.

[0012] As a further optimization or improvement of the present solution, a clearance groove and a guide groove are provided on the press platform, a guide rod is installed on the base, the guide rod is slidably matched with the guide groove, and the rack is matched with the clearance groove.

[0013] Beneficial effects of the present invention: (1) The present invention drives the T-shaped plate downward through a cylinder, and the T-shaped plate drives the ultrasonic generating plate at the bottom thereof to fit the outer wall of the pipe. At the same time, the high-pressure nozzle on the T-shaped plate is aimed at the pipe, and the ultrasonic generating plate drives the pipe to vibrate, so that the dirt on the inner wall of the pipe is loosened. The L-shaped rod 2 pushes one end of the semiconductor pipe to move through the ultrasonic generating plate, so that the pipe gradually tilts. During the process of the pipe tilting, high-pressure water flushes the pipe through the high-pressure nozzle. The high-pressure nozzle flushes from the inner wall of the pipe far from one end of the high-pressure nozzle to the inner wall of the pipe close to the one end of the high-pressure nozzle, and cooperates with the ultrasonic generating plate to drive the pipe body to vibrate, thereby improving the cleaning ability of the pipe.

[0014] Specifically, when the second L-shaped rod pushes the semiconductor pipeline to tilt, one end of the pipeline presses the pressing platform. At this time, the longitudinal spring is compressed, and the pressing platform moves relative to the base, so that the rack on the base drives the transmission gear to rotate, and the transmission gear drives the belt to run through the active roller, so that the belt drives the inclined pipeline to rotate, so that the high-pressure nozzle flushes various parts of the inner wall of the pipeline to avoid cleaning dead corners on the inner wall of the pipeline.

[0015] (2) The present invention drives the pipeline to tilt by L-shaped rod 2, so that the high-pressure nozzle flushes from the inner wall of the pipe body toward the inner wall of the pipe mouth. At the same time, the inclined plate and the high-pressure nozzle on it are pushed by the triangular frame to move toward the pipe mouth, so that the water pressure of the high-pressure nozzle toward the pipe mouth gradually increases, thereby improving the cleaning strength of the inner wall of the pipe mouth. The problem that more impurities are accumulated at the pipe mouth of the semiconductor pipeline than at the pipe body is solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below in conjunction with the accompanying drawings.

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0018] Figure 2 Schematic diagram of the internal structure of the cleaning box.

[0019] Figure 3 This is a schematic diagram of the working status of the cleaning component.

[0020] Figure 4 This is a schematic diagram of the overall structure of the cleaning component.

[0021] Figure 5 It is a cross-sectional view of the overall structure of the cleaning component.

[0022] Figure 6 It is a schematic diagram of the structure of the ultrasonic generating plate.

[0023] Figure 7 Schematic diagram of the pallet structure.

[0024] Figure 8 It is a schematic diagram of the overall structure of the rotating component.

[0025] Fig. 9 Schematic diagram of the internal structure of the press table.

[0026] Fig.10 This is the connection diagram between the belt and the active roller.

[0027] The following are marked in the figure: 1, workbench; 2, stepping conveyor belt; 3, connecting table; 4, cleaning box; 5, cylinder; 6, tray; 7, fixed seat; 8, rotating assembly; 801, base; 802, press table; 803, belt; 804, driven roller group; 805, arrangement groove; 806, driving roller; 807, transmission gear; 808, yield groove; 809, guide rod; 810, rack; 811, longitudinal spring; 812 , guide groove; 9, cleaning component; 901, T-shaped plate; 902, motor; 903, slide groove; 904, reduction box; 905, screw rod; 906, L-shaped rod one; 907, L-shaped rod two; 908, inner groove; 909, rotating shaft; 910, ultrasonic generating plate; 911, triangular frame; 912, inclined plate; 913, high-pressure nozzle; 914, transverse spring; 915, upper sliding pad; 10, lower sliding pad; 11, heat sink. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] See also Figure 1-Figure 10, an ultrasonic high-pressure washing device for the inner wall of a semiconductor pipeline, comprising a workbench 1, a stepping conveyor belt 2 is installed on the workbench 1, the workbench 1 is connected to a cleaning box 4 through a connecting platform 3, a cylinder 5 is installed on the cleaning box 4, the output end of the cylinder 5 is connected to a cleaning component 9, a tray 6 is placed on the stepping conveyor belt 2, a fixing seat 7 and a rotating component 8 are installed on the tray 6, and the semiconductor pipeline is fixed on the fixing seat 7 and the rotating component 8; the cleaning component 9 comprises a T-shaped plate 901, a motor 902 is installed on the T-shaped plate 901, the motor 902 drives a screw rod 905 to rotate, the screw rod 905 is in transmission cooperation with an L-shaped rod 907, the L-shaped rod 907 is rotatably connected to one end of an ultrasonic generating plate 910, and the other end of the ultrasonic generating plate 910 is connected to the bottom of the T-shaped plate 901 through a rotating shaft 909; an inclined plate 912 is slidably installed in the T-shaped plate 901, and the inclined plate 91 2, a high-pressure nozzle 913 is installed on the T-shaped plate 901, and the cylinder 5 drives the T-shaped plate 901 to move downward, so that the ultrasonic generating plate 910 at the bottom of the T-shaped plate 901 fits the semiconductor pipeline; the rotating component 8 includes a base 801 and a press table 802, the base 801 is installed on the tray 6, and the press table 802 is provided with a layout groove 805, and a driven roller group 804 and an active roller 806 are installed in the layout groove 805. The driven roller group 804 and the active roller 806 are installed with a belt 803, and the active roller 806 is coaxially installed with a transmission gear 807; the press table 802 is slidably matched with the base 801, and the base 801 is connected to the press table 802 through a longitudinal spring 811. A rack 810 is installed on the base 801, and the rack 810 is meshed with the transmission gear 807. One end of the semiconductor conduit is installed on the press table 802, so that the semiconductor conduit fits the belt 803.

[0030] Specifically, the motor 902 is connected to the screw rod 905 via the reduction box 904, and the screw rod 905 is respectively connected to the L-shaped rod 1 906 and the L-shaped rod 2 907 in transmission.

[0031] Specifically, a slide groove 903 is provided on the T-shaped plate 901 , and the second L-shaped rod 907 and the first L-shaped rod 906 are located in the slide groove 903 for sliding, and a screw rod 905 is installed in the slide groove 903 .

[0032] Specifically, the press platform 802 is provided with a clearance groove 808 and a guide groove 812 , the base 801 is provided with a guide rod 809 , the guide rod 809 is slidably matched with the guide groove 812 , and the rack 810 is matched with the clearance groove 808 .

[0033] It should be noted that a water pipe and a water pump connected to the high-pressure nozzle 913 are installed in the cleaning box 4. The connection method between the high-pressure nozzle 913 and the water pump is a prior art, which will not be reviewed in the present invention and does not affect the integrity of this solution. An inner groove 908 is provided at the bottom of the T-shaped plate 901, and the ultrasonic generating plate 910 is located inside the inner groove 908. The wiring harness of the ultrasonic generating plate 910 can be arranged inside the inner groove 908 to avoid water erosion.

[0034] It should be noted that see Figure 3 , place the semiconductor pipeline on the fixed seat 7 and the rotating assembly 8, convey the tray 6 to the bottom of the cleaning box 4 through the stepping conveyor belt 2, drive the T-shaped plate 901 to move downward through the cylinder 5, and the T-shaped plate 901 drives the ultrasonic generating plate 910 at the bottom thereof to fit the outer wall of the pipeline. At the same time, the high-pressure nozzle 913 on the T-shaped plate 901 is aimed at the pipeline, and the ultrasonic generating plate 910 is started. The ultrasonic generating plate 910 drives the pipeline to vibrate, so that the dirt on the inner wall of the pipeline is loosened.

[0035] The motor 902 drives the screw rod 905 to rotate. Figure 5 The screw rod 905 drives the L-shaped rod 1 906 and the L-shaped rod 2 907 to move synchronously. When the L-shaped rod 2 907 moves downward, the L-shaped rod 2 907 pushes one end of the semiconductor pipeline to move through the ultrasonic generating plate 910, so that the pipeline gradually tilts. In the process of the pipeline tilting, high-pressure water flushes the pipeline through the high-pressure nozzle 913. The high-pressure nozzle 913 flushes from the inner wall of the pipeline far away from the end of the high-pressure nozzle 913 to the inner wall of the pipeline close to the end of the high-pressure nozzle 913, and cooperates with the ultrasonic generating plate 910 to drive the pipeline body to vibrate, thereby improving the cleaning ability of the pipeline.

[0036] Specifically, when the L-shaped rod 907 pushes the semiconductor pipeline to tilt, see Figure 8-Figure 9 , one end of the pipeline presses the pressing platform 802, at this time the longitudinal spring 811 is compressed, the pressing platform 802 moves relative to the base 801, so that the rack 810 on the base 801 drives the transmission gear 807 to rotate, and the transmission gear 807 drives the belt 803 to run through the active roller 806, so that the belt 803 drives the inclined pipeline to rotate, so that the high-pressure nozzle 913 flushes various parts of the inner wall of the pipeline to avoid cleaning dead corners on the inner wall of the pipeline.

[0037] See also Figure 3-Figure 5 The screw rod 905 is installed in a transmission manner with an L-shaped rod 906, a triangular frame 911 is installed on the L-shaped rod 906, and the triangular frame 911 fits the inclined surface of the inclined plate 912; when the L-shaped rod 906 moves downward, the L-shaped rod 906 pushes the inclined plate 912 to move toward the semiconductor pipeline through the triangular frame 911.

[0038] Specifically, a transverse groove is provided in the T-shaped plate 901 , and the inclined plate 912 is slidably matched with the transverse groove. The inclined plate 912 is connected to the inner wall of the T-shaped plate 901 via a transverse spring 914 .

[0039] It should be noted that, due to the turbulence effect, more impurities are accumulated at the nozzle of the semiconductor pipeline than at the tube body. For example, when the liquid in the pipeline flows at a high speed, the tiny particles entrained in the liquid will frequently collide with the inner wall of the nozzle and adhere to it due to the turbulence at the nozzle.

[0040] Based on the above problems, when the screw rod 905 of the present invention is in operation, the screw rod 905 drives the L-shaped rod 1 906 to move downward, and the L-shaped rod 1 906 pushes the inclined plate 912 and the high-pressure nozzle 913 thereon to move closer to the pipe mouth through the triangular frame 911, and the transverse spring 914 is compressed. At the same time, as the L-shaped rod 2 907 drives the pipeline to gradually tilt through the ultrasonic generating plate 910, the high-pressure nozzle 913 gradually flushes toward the pipe mouth position. As the high-pressure nozzle 913 gradually approaches the pipe mouth, the water pressure of the high-pressure nozzle 913 on the inner wall of the pipe gradually increases, and the flushing force of the high-pressure nozzle 913 gradually increases. When the high-pressure nozzle 913 flushes toward the inner wall of the pipe mouth, the flushing force of the high-pressure nozzle 913 on the inner wall of the pipe mouth is the greatest.

[0041] The present invention drives the pipeline to tilt through the L-shaped rod 907, so that the high-pressure nozzle 913 flushes from the inner wall of the pipe body toward the inner wall of the pipe mouth. At the same time, the triangular frame 911 pushes the inclined plate 912 and the high-pressure nozzle 913 thereon to move closer to the pipe mouth, so that the water pressure of the high-pressure nozzle 913 toward the pipe mouth gradually increases, thereby improving the cleaning effect of the inner wall of the pipe mouth.

[0042] Specifically, the present invention can perform secondary cleaning on the pipeline, that is, after the cleaning of the pipe mouth at one end of the pipeline is completed, the tray 6 is sent back by the stepping conveyor belt 2, the pipeline is placed in reverse on the fixed seat 7 and the rotating assembly 8, and then the pipeline is transported to the bottom of the cleaning assembly 9 by the stepping conveyor belt 2 for secondary cleaning.

[0043] See also Figure 6-Figure 7 A heat sink 11 is installed on the cleaning box 4 , an upper slide pad 915 is installed on the bottom of the ultrasonic generating plate 910 , and a lower slide pad 10 is installed on the fixing seat 7 .

[0044] It should be noted that an upper sliding pad 915 is installed between the ultrasonic generating plate 910 and the pipeline. The lower sliding pad 10 and the upper sliding pad 915 are made of graphite material and have the functions of low friction and shock absorption. During the rotation of the pipeline, the upper sliding pad 915 can reduce the friction of the pipeline and enable the pipeline to rotate smoothly.

[0045] Working principle of the present invention: When the present invention is used, refer to Figure 3 , place the semiconductor pipeline on the fixed seat 7 and the rotating assembly 8, convey the tray 6 to the bottom of the cleaning box 4 through the stepping conveyor belt 2, drive the T-shaped plate 901 to move downward through the cylinder 5, and the T-shaped plate 901 drives the ultrasonic generating plate 910 at the bottom thereof to fit the outer wall of the pipeline. At the same time, the high-pressure nozzle 913 on the T-shaped plate 901 is aimed at the pipeline, and the ultrasonic generating plate 910 is started. The ultrasonic generating plate 910 drives the pipeline to vibrate, so that the dirt on the inner wall of the pipeline is loosened.

[0046] The motor 902 drives the screw rod 905 to rotate. Figure 5The screw rod 905 drives the L-shaped rod 1 906 and the L-shaped rod 2 907 to move synchronously. When the L-shaped rod 2 907 moves downward, the L-shaped rod 2 907 pushes one end of the semiconductor pipeline to move through the ultrasonic generating plate 910, so that the pipeline gradually tilts. In the process of the pipeline tilting, high-pressure water flushes the pipeline through the high-pressure nozzle 913. The high-pressure nozzle 913 flushes from the inner wall of the pipeline far away from the end of the high-pressure nozzle 913 to the inner wall of the pipeline close to the end of the high-pressure nozzle 913, and cooperates with the ultrasonic generating plate 910 to drive the pipeline body to vibrate, thereby improving the cleaning ability of the pipeline.

[0047] Specifically, when the L-shaped rod 907 pushes the semiconductor pipeline to tilt, see Figure 8-Figure 9 , one end of the pipeline presses the pressing platform 802, at this time the longitudinal spring 811 is compressed, the pressing platform 802 moves relative to the base 801, so that the rack 810 on the base 801 drives the transmission gear 807 to rotate, and the transmission gear 807 drives the belt 803 to run through the active roller 806, so that the belt 803 drives the inclined pipeline to rotate, so that the high-pressure nozzle 913 flushes various parts of the inner wall of the pipeline to avoid cleaning dead corners on the inner wall of the pipeline.

[0048] Specifically, due to the turbulence effect, more impurities are accumulated at the nozzle of the semiconductor pipeline than at the tube body. For example, when the liquid in the pipeline flows at a high speed, the tiny particles entrained in the liquid will frequently collide with the inner wall of the nozzle and adhere to it due to the turbulence at the nozzle.

[0049] Based on the above problems, when the screw rod 905 of the present invention is in operation, the screw rod 905 drives the L-shaped rod 1 906 to move downward, and the L-shaped rod 1 906 pushes the inclined plate 912 and the high-pressure nozzle 913 thereon to move closer to the pipe mouth through the triangular frame 911, and the transverse spring 914 is compressed. At the same time, as the L-shaped rod 2 907 drives the pipeline to gradually tilt through the ultrasonic generating plate 910, the high-pressure nozzle 913 gradually flushes toward the pipe mouth position. As the high-pressure nozzle 913 gradually approaches the pipe mouth, the water pressure of the high-pressure nozzle 913 on the inner wall of the pipe gradually increases, and the flushing force of the high-pressure nozzle 913 gradually increases. When the high-pressure nozzle 913 flushes toward the inner wall of the pipe mouth, the flushing force of the high-pressure nozzle 913 on the inner wall of the pipe mouth is the greatest.

[0050] The present invention drives the pipeline to tilt through the L-shaped rod 907, so that the high-pressure nozzle 913 flushes from the inner wall of the pipe body toward the inner wall of the pipe mouth. At the same time, the triangular frame 911 pushes the inclined plate 912 and the high-pressure nozzle 913 thereon to move closer to the pipe mouth, so that the water pressure of the high-pressure nozzle 913 toward the pipe mouth gradually increases, thereby improving the cleaning effect of the inner wall of the pipe mouth.

[0051] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements all fall within the scope of the present invention to be protected.

Claims

1. An ultrasonic high-pressure washing device for the inner wall of a semiconductor pipeline, characterized in that: The invention comprises a workbench (1), a stepping conveyor belt (2) is installed on the workbench (1), the workbench (1) is connected to a cleaning box (4) via a connecting platform (3), a cylinder (5) is installed on the cleaning box (4), an output end of the cylinder (5) is connected to a cleaning component (9), a tray (6) is placed on the stepping conveyor belt (2), a fixing seat (7) and a rotating component (8) are installed on the tray (6), and a semiconductor pipeline is fixed on the fixing seat (7) and the rotating component (8); The cleaning assembly (9) comprises a T-shaped plate (901), a motor (902) is mounted on the T-shaped plate (901), the motor (902) drives a screw rod (905) to rotate, the screw rod (905) and a second L-shaped rod (907) are in transmission cooperation, the second L-shaped rod (907) is rotatably connected to one end of an ultrasonic generating plate (910), and the other end of the ultrasonic generating plate (910) is connected to the bottom of the T-shaped plate (901) via a rotating shaft (909); an inclined plate (912) is slidably mounted in the T-shaped plate (901), a high-pressure nozzle (913) is mounted on the inclined plate (912), and the cylinder (5) drives the T-shaped plate (901) to move downward, so that the ultrasonic generating plate (910) at the bottom of the T-shaped plate (901) fits the semiconductor pipeline; The rotating assembly (8) comprises a base (801) and a press table (802); the base (801) is mounted on the tray (6); a layout groove (805) is provided on the press table (802); a driven roller group (804) and a driving roller (806) are mounted in the layout groove (805); a belt (803) is mounted on the driven roller group (804) and the driving roller (806); a transmission gear (807) is coaxially mounted on the driving roller (806); the press table (802) and the base (801) are slidably matched; the base (801) is connected to the press table (802) via a longitudinal spring (811); a rack (810) is mounted on the base (801); the rack (810) is meshed with the transmission gear (807); one end of the semiconductor conduit is mounted on the press table (802) so that the semiconductor conduit fits the belt (803).

2. The semiconductor pipeline inner wall ultrasonic high-pressure washing equipment according to claim 1, characterized in that: The lead screw (905) is installed in a transmission manner with the L-shaped rod (906); a triangular frame (911) is installed on the L-shaped rod (906); the triangular frame (911) fits the inclined surface of the inclined plate (912); when the L-shaped rod (906) moves downward, the L-shaped rod (906) pushes the inclined plate (912) to move toward the semiconductor pipeline through the triangular frame (911).

3. The semiconductor pipeline inner wall ultrasonic high-pressure washing equipment according to claim 1, characterized in that: A transverse groove is provided in the T-shaped plate (901), and the inclined plate (912) is slidably matched with the transverse groove. The inclined plate (912) is connected to the inner wall of the T-shaped plate (901) via a transverse spring (914).

4. The semiconductor pipeline inner wall ultrasonic high-pressure washing equipment according to claim 1, characterized in that: The motor (902) is connected to a screw rod (905) via a reduction box (904), and the screw rod (905) is respectively connected to an L-shaped rod 1 (906) and an L-shaped rod 2 (907) in a transmission manner.

5. The semiconductor pipeline inner wall ultrasonic high-pressure washing equipment according to claim 1, characterized in that: The T-shaped plate (901) is provided with a slide groove (903), the L-shaped rod 2 (907) and the L-shaped rod 1 (906) are located in the slide groove (903) for sliding, and the screw rod (905) is installed in the slide groove (903).

6. The semiconductor pipeline inner wall ultrasonic high-pressure washing equipment according to claim 1, characterized in that: A heat sink (11) is installed on the cleaning box (4), an upper sliding pad (915) is installed on the bottom of the ultrasonic generating plate (910), and a lower sliding pad (10) is installed on the fixing seat (7).

7. The semiconductor pipeline inner wall ultrasonic high-pressure washing equipment according to claim 2, characterized in that: The press platform (802) is provided with a clearance groove (808) and a guide groove (812), the base (801) is provided with a guide rod (809), the guide rod (809) is slidably matched with the guide groove (812), and the rack (810) is matched with the clearance groove (808).

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