A PCB board soldering flux application device and operation method

Abstract

The present invention relates to the technical field of flux coating equipment, and specifically discloses a PCB board flux coating equipment and an operation method, including a bottom plate, on which two fixed plates are symmetrically installed. Guide rails are installed on the opposite surfaces of the two fixed plates, and electric sliders are slidably installed on the guide rails. Installation plates are installed on the sides of the two electric sliders, and a bearing plate is installed between the two installation plates. In the present invention, the area on the PCB board that needs to be coated with flux is surrounded by rubber limiting sleeves, so that the coating brush can only move within the area on the PCB board that needs to be coated with flux. Furthermore, the coating brush can only coat flux on the area on the PCB board that needs to be coated with flux, avoiding the problem that the flux is easily coated out of bounds during the traditional coating of the PCB board. With this device, the flux can be accurately coated on the area on the PCB board that needs to be coated with flux.

Description

Technical Field

[0001] The present invention relates to the technical field of flux coating equipment, and particularly relates to a PCB board flux coating equipment and an operation method. Background Art

[0002] Flux is usually a mixture with rosin as the main component, and it is an auxiliary material to ensure the smooth progress of the welding process; welding is the main process in electronic assembly, and flux is an auxiliary material used in welding. The main function of flux is to remove oxides on the surface of the solder and the base material to be welded, so that the metal surface reaches the necessary cleanliness. It prevents the surface from being oxidized again during welding, reduces the surface tension of the solder, and improves the welding performance. The quality of the flux directly affects the quality of electronic products.

[0003] After retrieval, it is found that the Chinese patent with the application number 201720810888.4 discloses "a flux coating device, which includes at least one set of coating mechanism and a motion mechanism. Each set of coating mechanism includes a first coating part and a second coating part arranged opposite to each other. Among them: for each set of coating mechanism, a coating component for providing flux is arranged on the surface of the first coating part of the coating mechanism opposite to the second coating part, and / or, a coating component for providing flux is arranged on the surface of the second coating part of the coating mechanism opposite to the first coating part; the motion mechanism is connected to the first coating part and drives the first coating part to move closer to or away from the second coating part."; however, when the above flux coating device applies flux to the PCB board, the flux applied to the PCB board is prone to flow on the PCB board, and it is easy to cause the applied flux to flow across the boundary to the area where flux does not need to be applied on the PCB board. Therefore, in order to solve such problems, a PCB board flux coating equipment and an operation method are proposed. Summary of the Invention

[0004] The purpose of the present invention is to solve the deficiencies existing in the prior art, and a PCB board flux coating equipment and an operation method are proposed.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A PCB board flux coating equipment includes a bottom plate, two fixing plates are symmetrically installed on the bottom plate, guide rails are installed on the opposite surfaces of the two fixing plates, electric sliders are slidably installed on the guide rails, mounting plates are installed on the sides of the two electric sliders, and a bearing plate is installed between the two mounting plates;

[0007] A mechanism with arbitrarily variable shape is arranged on the bearing plate;

[0008] The arbitrarily shaped change mechanism includes several first automatic guided vehicles installed on the bearing plate. A first electromagnet is installed at the bottom of the first automatic guided vehicle. Several first mounting plates corresponding to the positions of the first automatic guided vehicles are arranged at the bottom of the bearing plate. A third electromagnet that attracts and combines with the first electromagnet is installed on the side of the first mounting plate close to the bearing plate. Several lower adjusting rods are installed at the bottom of the first mounting plate. A rubber limit sleeve is jointly arranged at the bottom ends of the several lower adjusting rods.

[0009] A coating mechanism for coating flux on the PCB board is arranged on the bearing plate, and the coating mechanism is located within the rubber limit sleeve.

[0010] A protection mechanism is arranged at the bottom of the bearing plate, and the rubber limit sleeve is located within the protection mechanism.

[0011] Preferably, the coating mechanism includes a second automatic guided vehicle installed on the bearing plate. A second electromagnet is installed at the bottom of the second automatic guided vehicle. A second mounting plate corresponding to the position of the second automatic guided vehicle is arranged at the bottom of the bearing plate. A fourth electromagnet that attracts and combines with the second electromagnet is installed on the side of the second mounting plate close to the bearing plate. Universal balls are arranged on the sides of the first mounting plate and the second mounting plate close to the bearing plate. A connecting box is connected to the bottom of the second mounting plate through a telescopic component. Several coating brushes are arranged at the bottom of the connecting box. Several liquid outlet holes are opened at the bottom of the connecting box. A flux box is installed at the bottom of the second mounting plate. The flux box is filled with flux. The flux box is connected to the connecting box through a second corrugated pipe. A liquid pump is arranged within the second corrugated pipe. The connecting box is located within the rubber limit sleeve.

[0012] Preferably, the telescopic component includes an electric telescopic rod installed at the bottom of the second mounting plate, and the end of the piston rod of the electric telescopic rod is connected to the top of the connecting box.

[0013] Preferably, a fixed rod is installed on the top of the second automatic guided vehicle. A mounting sleeve is fixedly sleeved on the fixed rod. Several baffles are installed on the outer wall of the mounting sleeve. Several upper adjusting rods are installed on the tops of the several first automatic guided vehicles. A rubber limit ring is jointly arranged at the top ends of the several upper adjusting rods. The baffles are located within the rubber limit ring.

[0014] Preferably, through holes are opened on the rubber limit ring, and the upper adjusting rods are located within the through holes. Limit holes are opened at the top of the rubber limit sleeve, and the lower adjusting rods are located within the limit holes. A rectangular mounting groove is opened at the bottom of the rubber limit sleeve, and a wiping sponge is installed within the mounting groove. The bottom end of the wiping sponge is located below the rubber limit sleeve.

[0015] Preferably, the protection mechanism includes a rubber sealing sleeve installed at the bottom of the bearing plate. The bottom end of the rubber sealing sleeve is fixed to the outer wall of the rubber limiting sleeve, and the ductility of the rubber sealing sleeve is greater than that of the rubber limiting sleeve. An air purifier is installed on the mounting plate. The air inlet end of the air purifier is communicated with a first corrugated pipe. The end of the first corrugated pipe penetrates through the bearing plate and extends into the rubber sealing sleeve. An air extraction pump is arranged in the first corrugated pipe.

[0016] Preferably, limiting blocks are installed at both the upper and lower ends of the guide rail. The limiting blocks are fixed to the side surface of the fixed plate, and a reinforcing block is fixed between the electric slider and the mounting plate.

[0017] Preferably, a raw material box and a collection box are installed on the bottom plate. The raw material box and the collection box are symmetrically arranged. A limiting groove for limiting the PCB board is formed on the bottom plate. The limiting groove is located between the raw material box and the collection box. A limiting border is installed on the bearing plate, and the first automatic guided vehicle is located within the limiting border.

[0018] An operation method of a PCB board soldering flux coating device in the present invention includes the following steps:

[0019] S1: Adsorb the PCB board in the raw material box by using the arbitrarily deformable shape mechanism, and move and place the PCB board in the limiting groove for feeding the PCB board;

[0020] S2: Adjust the shape of the rubber limiting sleeve by using the arbitrarily deformable shape mechanism to make the shape of the rubber limiting sleeve consistent with the shape of the area on the PCB board where the soldering flux needs to be coated;

[0021] S3: Coat the soldering flux on the area of the PCB board where the soldering flux needs to be coated by using the coating mechanism;

[0022] S4: Adsorb the PCB board after coating the soldering flux again by using the arbitrarily deformable shape mechanism, and move and place the PCB board after coating the soldering flux in the collection box for discharging the PCB board.

[0023] Compared with the prior art, the beneficial effects of the present invention are:

[0024] 1: In the present invention, several first automated guided vehicles move on a carrier plate. According to the shape of the area on the PCB board where the soldering flux needs to be applied, the several first automated guided vehicles move on the carrier plate, thereby driving several lower adjusting rods to drive the rubber limit sleeves to form a shape consistent with the shape of the area on the PCB board where the soldering flux needs to be applied. And by placing the second automated guided vehicle between the several first automated guided vehicles, the shape of the rubber limit sleeve can be adjusted to be consistent with the shape of the area on the PCB board where the soldering flux needs to be applied. The area on the PCB board where the soldering flux needs to be applied is surrounded by the rubber limit sleeve, so that the coating brush can only move within the area on the PCB board where the soldering flux needs to be applied. Thus, the coating brush can only apply the soldering flux to the area on the PCB board where the soldering flux needs to be applied, avoiding the problem that the soldering flux is easily smeared beyond the boundary during the traditional soldering flux application on the PCB board. With this device, the soldering flux can be accurately applied to the area on the PCB board where the soldering flux needs to be applied.

[0025] 2: In the present invention, the rubber limit sleeve is used to limit the area on the PCB board where the soldering flux needs to be applied, so that the coating brush can only move within the area on the PCB board where the soldering flux needs to be applied to apply the soldering flux. The rubber limit sleeve is used to limit the applied soldering flux, avoiding the phenomenon that the soldering flux applied on the PCB board flows on the PCB board. The soldering flux applied on the PCB board can be limited within the rubber limit sleeve, preventing the soldering flux from flowing beyond the boundary and flowing into the area on the PCB board where the soldering flux does not need to be applied. This can keep the soldering flux applied on the PCB board always within the area on the PCB board where the soldering flux needs to be applied.

[0026] 3: In the present invention, several first automated guided vehicles move on the carrier plate to drive several lower adjusting rods to change the shape of the rubber limit sleeve. The shape of the rubber limit sleeve can be changed according to the shape of the area on the PCB board where the soldering flux needs to be applied. This enables the device to be used for PCB boards with different coating areas. Through the coordinated use of several first automated guided vehicles, lower adjusting rods, and rubber limit sleeves, the rubber limit sleeve can be adjusted at any time according to the different shapes of the areas on the PCB board where the soldering flux needs to be applied. This makes the device applicable to PCB boards with different coating areas.

[0027] 4: In the present invention, after using the rubber limit sleeve to seal the area of the PCB board within the rubber limit sleeve, the air pump extracts the air within the rubber seal sleeve and the rubber limit sleeve. After the rubber seal sleeve seals the rubber limit sleeve, an adsorption force can be generated on the PCB board at the opening at the bottom of the rubber limit sleeve. Furthermore, the opening at the bottom of the rubber limit sleeve is used to adsorb and fix the PCB board. When the first automatic guided vehicle moves on the carrier plate, it can drive the PCB board adsorbed and fixed by the opening at the bottom of the rubber limit sleeve to move, enabling automatic feeding of the PCB board without manual feeding of the PCB board.

[0028] 5: After using the rubber limit sleeve to adsorb and fix the PCB board in the present invention, the electric slider is used to move upward on the guide rail to remove the PCB board from the limit groove. Moreover, by using several first automatic guided vehicles to move the rubber limit sleeve, the PCB board adsorbed and fixed by the opening at the bottom of the rubber limit sleeve can be moved until it stops above the collection box. Then, the electric slider is used to move downward on the guide rail to place the PCB board in the collection box. By turning off the air pump, the PCB board can be placed in the collection box to complete the discharging process of the PCB board, enabling automatic discharging of the PCB board after the solder flux has been applied. Description of the Drawings

[0029] Figure 1 is a schematic structural diagram of a PCB board solder flux coating device proposed by the present invention from the first perspective;

[0030] Figure 2 is a schematic structural diagram of a PCB board solder flux coating device proposed by the present invention from the second perspective;

[0031] Figure 3 is Figure 2 a partial enlarged view of part A in

[0032] Figure 4 is a schematic structural diagram of a PCB board solder flux coating device proposed by the present invention from the third perspective;

[0033] Figure 5 is a connection schematic diagram of the fixing plate and the guide rail of a PCB board solder flux coating device proposed by the present invention;

[0034] Figure 6 is a connection schematic diagram of the guide rail and the electric slider of a PCB board solder flux coating device proposed by the present invention;

[0035] Figure 7 is a connection schematic diagram of the mounting plate and the carrier plate of a PCB board solder flux coating device proposed by the present invention;

[0036] Figure 8Schematic diagram of the rubber seal of a solder flux application device for a PCB board proposed by the present invention;

[0037] Figure 9 Schematic diagram of the connection between the lower adjustment rod and the rubber limit sleeve of a solder flux application device for a PCB board proposed by the present invention;

[0038] Figure 10 Schematic diagram of the connection between the first mounting piece and the third electromagnet of a solder flux application device for a PCB board proposed by the present invention;

[0039] Figure 11 For Figure 10 Partial enlarged view of part B in

[0040] Figure 12 、 13 Schematic diagram of the structure of the rubber limit sleeve of a solder flux application device for a PCB board proposed by the present invention;

[0041] Figure 14 Schematic diagram of the connection between the second mounting piece and the electric telescopic rod of a solder flux application device for a PCB board proposed by the present invention.

[0042] In the figure: 1, bottom plate; 2, fixing plate; 3, guide rail; 4, electric slider; 5, limit block; 6, strengthening block; 7, mounting plate; 8, air purifier; 9, bearing plate; 10, limit frame; 11, first corrugated pipe; 12, air extraction pump; 13, raw material box; 14, collection box; 15, limit groove; 16, rubber seal; 17, rubber limit sleeve; 18, rubber limit ring; 19, first automatic guided vehicle; 20, first electromagnet; 21, upper adjustment rod; 22, second automatic guided vehicle; 23, second electromagnet; 24, fixed rod; 25, mounting sleeve; 26, baffle; 27, first mounting piece; 28, lower adjustment rod; 29, connection box; 30, wiping sponge; 31, third electromagnet; 32, second mounting piece; 33, fourth electromagnet; 34, solder flux box; 35, electric telescopic rod; 36, second corrugated pipe; 37, liquid pump; 38, mounting groove; 39, coating brush; 40, liquid outlet hole. Detailed implementation manners

[0043] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0044] Refer to Figure 1-14, A PCB board soldering flux application device, including a bottom plate 1, on which two fixing plates 2 are symmetrically installed. On the opposite surfaces of the two fixing plates 2, guide rails 3 are installed. Electric sliders 4 are slidably installed on the guide rails 3. Installation plates 7 are installed on the sides of the two electric sliders 4. The fixing plates 2 can provide an installation plane for the guide rails 3. A carrier plate 9 is installed between the two installation plates 7;

[0045] A mechanism for arbitrarily changing the shape is provided on the carrier plate 9;

[0046] The mechanism for arbitrarily changing the shape includes several first automated guided vehicles 19 installed on the carrier plate 9. A first electromagnet 20 is installed at the bottom of the first automated guided vehicle 19. Several first mounting pieces 27 corresponding to the positions of the first automated guided vehicles 19 are provided at the bottom of the carrier plate 9. A third electromagnet 31 that mutually attracts with the first electromagnet 20 is installed on the side of the first mounting piece 27 close to the carrier plate 9. Several lower adjustment rods 28 are installed at the bottom of the first mounting piece 27. A rubber limit sleeve 17 is provided at the common bottom ends of the several lower adjustment rods 28;

[0047] A coating mechanism for applying soldering flux to the PCB board is provided on the carrier plate 9. The coating mechanism is located within the rubber limit sleeve 17;

[0048] A protection mechanism is provided at the bottom of the carrier plate 9. The rubber limit sleeve 17 is located within the protection mechanism.

[0049] As a technical optimization scheme of the present invention, the coating mechanism includes a second automated guided vehicle 22 installed on the carrier plate 9. A second electromagnet 23 is installed at the bottom of the second automated guided vehicle 22. A second mounting piece 32 corresponding to the position of the second automated guided vehicle 22 is provided at the bottom of the carrier plate 9. A fourth electromagnet 33 that mutually attracts with the second electromagnet 23 is installed on the side of the second mounting piece 32 close to the carrier plate9. Universal balls are provided on the sides of the first mounting piece 27 and the second mounting piece 32 close to the carrier plate 9. The bottom of the second mounting piece 32 is connected to a connection box 29 through a telescopic component. Several coating brushes 39 are provided at the bottom of the connection box 29. Several liquid outlet holes 40 are opened at the bottom of the connection box 29. A soldering flux box 34 is installed at the bottom of the second mounting piece 32. The soldering flux box 34 contains soldering flux. The soldering flux box 34 is connected to the connection box 29 through a second corrugated pipe 36. A liquid pump 37 is provided within the second corrugated pipe 36. The connection box 29 is located within the rubber limit sleeve 17. The liquid pump 37 can extract the soldering flux in the soldering flux box 34 into the connection box 29, and the coating brushes 39 can apply the soldering flux to the PCB board.

[0050] As a technical optimization solution of the present invention, the telescopic assembly includes an electric telescopic rod 35 installed at the bottom of the second mounting piece 32. The end of the piston rod of the electric telescopic rod 35 is connected to the top of the connection box 29, and the electric telescopic rod 35 can drive the connection box 29 to move up and down.

[0051] As a technical optimization solution of the present invention, a fixed rod 24 is installed on the top of the second automatic guided vehicle 22. An installation sleeve 25 is fixedly sleeved on the fixed rod 24. A plurality of baffles 26 are installed on the outer wall of the installation sleeve 25. A plurality of upper adjustment rods 21 are installed on the tops of the plurality of first automatic guided vehicles 19. A rubber limit ring 18 is jointly arranged at the top ends of the plurality of upper adjustment rods 21. The baffle 26 is located within the rubber limit ring 18.

[0052] As a technical optimization solution of the present invention, through holes are formed in the rubber limit ring 18, and the upper adjustment rods 21 are located within the through holes. Limit holes are formed at the top of the rubber limit sleeve 17, and the lower adjustment rods 28 are located within the limit holes. A rectangular installation groove 38 is formed at the bottom of the rubber limit sleeve 17. A wiping sponge 30 is installed within the installation groove 38. The bottom end of the wiping sponge 30 is located below the rubber limit sleeve 17. The installation groove 38 can provide an installation plane for the wiping sponge 30, facilitating the installation of the wiping sponge 30 and also facilitating the connection between the wiping sponge 30 and the rubber limit sleeve 17.

[0053] As a technical optimization solution of the present invention, the protection mechanism includes a rubber sealing sleeve 16 installed at the bottom of the bearing plate 9. The bottom end of the rubber sealing sleeve 16 is fixed to the outer wall of the rubber limit sleeve 17, and the ductility of the rubber sealing sleeve 16 is greater than that of the rubber limit sleeve 17. An air purifier 8 is installed on the installation plate 7. The air inlet end of the air purifier 8 is communicated with a first corrugated pipe 11. The end of the first corrugated pipe 11 penetrates through the bearing plate 9 and extends into the rubber sealing sleeve 16. An air extraction pump 12 is arranged within the first corrugated pipe 11. The greater ductility of the rubber sealing sleeve 16 than that of the rubber limit sleeve 17 enables the rubber sealing sleeve 16 to deform first while the rubber limit sleeve 17 remains unchanged when the air extraction pump 12 extracts the air within the rubber sealing sleeve 16, allowing the rubber sealing sleeve 16 to deform first to avoid the deformation of the rubber limit sleeve 17.

[0054] As a technical optimization solution of the present invention, limit blocks 5 are installed at both the upper and lower ends of the guide rail 3. The limit blocks 5 are fixed to the side of the fixed plate 2. A strengthening block 6 is fixed between the electric slider 4 and the installation plate 7, and the strengthening block 6 can increase the connection strength between the electric slider 4 and the installation plate 7.

[0055] As a technical optimization solution of the present invention, a raw material box 13 and a collection box 14 are installed on the bottom plate 1. The raw material box 13 and the collection box 14 are symmetrically arranged. A limiting groove 15 for limiting the PCB board is formed on the bottom plate 1. The limiting groove 15 is located between the raw material box 13 and the collection box 14. A limiting frame 10 is installed on the bearing plate 9. The first automatic guided vehicle 19 is located within the limiting frame 10. The limiting frame 10 can limit the first automatic guided vehicle 19 to prevent the first automatic guided vehicle 19 from disengaging from the bearing plate 9.

[0056] An operation method of a PCB board flux coating device in the present invention, the operation method comprising the following steps:

[0057] S1: Adsorb the PCB board in the raw material box 13 by using the arbitrarily deformable mechanism, and move and place the PCB board in the limiting groove 15 for feeding the PCB board;

[0058] S2: Adjust the shape of the rubber limiting sleeve 17 by using the arbitrarily deformable mechanism, and adjust the shape of the rubber limiting sleeve 17 to be consistent with the shape of the area on the PCB board where the flux needs to be coated;

[0059] S3: Coat the flux on the area of the PCB board where the flux needs to be coated by using the coating mechanism;

[0060] S4: Adsorb the PCB board after coating the flux again by using the arbitrarily deformable mechanism, and move and place the PCB board after coating the flux in the collection box 14 for discharging the PCB board.

[0061] When the present invention is in use, when it is necessary to coat the flux on the PCB board, first, start a plurality of first automatic guided vehicles 19. When the plurality of first automatic guided vehicles 19 move on the bearing plate 9, due to the adsorption between the first electromagnet 20 and the third electromagnet 31, when the first automatic guided vehicle 19 moves on the bearing plate 9, the lower adjusting rod 28 can be driven to move along with the first automatic guided vehicle 19. By using the plurality of lower adjusting rods 28 to drive the rubber limiting sleeve 17 to move, the rubber limiting sleeve 17 can make a corresponding shape according to the position distribution of the plurality of lower adjusting rods 28, the area of the rubber limiting sleeve 17 can be made smaller than the area of the PCB board, and the rubber limiting sleeve 17 is moved above the raw material box 13.

[0062] At this time, start the electric slider 4. The electric slider 4 moves downward on the guide rail 3, thereby driving the bearing plate 9 to move upward. When the bearing plate 9 moves downward, it can drive a number of lower adjusting rods 28 to move downward, and then make the rubber limit sleeve 17 move downward until the wiping sponge 30 at the bottom of the rubber limit sleeve 17 contacts the upper surface of the PCB board. And the electric slider 4 continues to move downward on the guide rail 3, so that the rubber limit sleeve 17 continues to move downward until the rubber limit sleeve 17 moves downward to squeeze the wiping sponge 30 into the installation groove 38 at the bottom of the rubber limit sleeve 17. And as the rubber limit sleeve 17 continues to move downward, the bottom end of the rubber limit sleeve 17 can contact the upper surface of the PCB board until a downward extrusion force is generated on the PCB board by the bottom end of the rubber limit sleeve 17 to seal the area of the PCB board within the rubber limit sleeve 17.

[0063] After using the rubber limit sleeve 17 to seal the area of the PCB board within the rubber limit sleeve 17, the air extraction pump 12 in the first bellows 11 can be started. The air extraction pump 12 extracts the air in the rubber sealing sleeve 16 and the rubber limit sleeve 17. After the rubber sealing sleeve 16 seals the rubber limit sleeve 17, an adsorption force can be generated on the PCB board by the opening at the bottom end of the rubber limit sleeve 17. Then, the PCB board is adsorbed and fixed by the opening at the bottom end of the rubber limit sleeve 17. At this time, start the electric slider 4 again. When the electric slider 4 moves upward on the guide rail 3, it can drive the rubber limit sleeve 17 and the PCB board adsorbed and fixed by the rubber limit sleeve 17 to move upward, and the PCB board can be taken out from the raw material box 13. At this time, start a number of first automatic guided vehicles 19. The first automatic guided vehicles 19 move on the bearing plate 9 and can drive the PCB board adsorbed and fixed by the opening at the bottom end of the rubber limit sleeve 17 to move until it stops above the limit groove 15. At this time, start the electric slider 4 to move downward on the guide rail 3, which can drive the rubber limit sleeve 17 and the PCB board adsorbed and fixed by the opening at the bottom end of the rubber limit sleeve 17 to move downward until the PCB board is placed in the limit groove 15 and then stops. And by turning off the air extraction pump 12, the PCB board can be placed in the limit groove 15, and automatic feeding of the PCB board can be performed without manual feeding of the PCB board.

[0064] After placing the PCB board in the limit slot 15, start several first automatic guided vehicles 19. The several first automatic guided vehicles 19 are arranged in a row on the carrier plate 9. Use the electric slider 4 to move downward on the guide rail 3, so that the wiping sponge 30 at the bottom of the rubber limit sleeve 17 contacts the upper surface of the PCB board. At this time, start several first automatic guided vehicles 19 and the second automatic guided vehicle 22 to move horizontally on the carrier plate 9. The several first automatic guided vehicles 19 can drive the wiping sponge 30 at the bottom of the rubber limit sleeve 17 to move horizontally. By using the contact between the wiping sponge 30 and the upper surface of the PCB board, the upper surface of the PCB board can be wiped, and then the dust and impurities on the upper surface of the PCB board can be wiped off, ensuring the cleanliness of the upper surface of the PCB board and avoiding the influence of dust and impurities on the upper surface of the PCB board on the effect of applying the soldering flux on the PCB board later.

[0065] After wiping off the dust and impurities on the upper surface of the PCB board, start several first automatic guided vehicles 19 again. The several first automatic guided vehicles 19 move on the carrier plate 9. According to the shape of the area on the PCB board where the soldering flux needs to be applied, make the several first automatic guided vehicles 19 move on the carrier plate 9, and then drive several lower adjustment rods 28 to move to drive the rubber limit sleeve 17 to make a shape consistent with the shape of the area on the PCB board where the soldering flux needs to be applied. And make the second automatic guided vehicle 22 be between the several first automatic guided vehicles 19, so that the shape of the rubber limit sleeve 17 can be adjusted to be consistent with the shape of the area on the PCB board where the soldering flux needs to be applied. Use the electric slider 4 to move downward on the guide rail 3 again until the bottom end of the rubber limit sleeve 17 contacts the upper surface of the PCB board again and use the rubber limit sleeve 17 and the air extraction pump 12 to seal the area of the PCB board within the rubber limit sleeve 17.

[0066] After sealing the area of the PCB board inside the rubber limit sleeve 17, at this time, start the second automatic guided vehicle 22. The second automatic guided vehicle 22 moves on the carrier plate 9 according to the shape of the rubber limit sleeve 17. And at the same time, start the electric telescopic rod 35. The piston rod of the electric telescopic rod 35 pushes the connection box 29 downward. The coating brush 39 at the bottom end of the device connection box 29 contacts the upper surface of the PCB board. And at the same time, start the liquid pump 37. The liquid pump 37 extracts the soldering flux in the connection box 29 into the connection box 29, and the soldering flux extracted into the connection box 29 flows out through the liquid outlet hole 40 at the bottom of the connection box 29. Then, use the coating brush 39 to apply the soldering flux flowing out of the liquid outlet hole 40 on the PCB board. And the second automatic guided vehicle 22 moves on the carrier plate 9, and the second automatic guided vehicle 22 moves according to the shape formed by the rubber limit sleeve 17 to drive the coating brush 39 to apply the soldering flux on the PCB board. The rubber limit sleeve 17 surrounds the area of the PCB board where the soldering flux needs to be applied, so that the coating brush 39 can only move within the area of the PCB board where the soldering flux needs to be applied. Then, the coating brush 39 can only apply the soldering flux to the area of the PCB board where the soldering flux needs to be applied, avoiding the problem that the soldering flux is easily smeared out of bounds when applying the soldering flux to the PCB board traditionally. Using this device, the soldering flux can be accurately applied to the area of the PCB board where the soldering flux needs to be applied.

[0067] And use several first automatic guided vehicles 19 to move on the carrier plate 9 to drive several lower adjustment rods 28 to move to change the shape of the rubber limit sleeve 17, so that the shape of the rubber limit sleeve 17 can be changed according to the shape of the area of the PCB board where the soldering flux needs to be applied, and this device can be used for PCB boards with different coating areas. Through the coordinated use of several first automatic guided vehicles 19, lower adjustment rods 28 and rubber limit sleeves 17, the rubber limit sleeve 17 can be adjusted at any time according to the different shapes of the areas of the PCB board where the soldering flux needs to be applied, so that this device is applicable to PCB boards with different coating areas.

[0068] And when using the coating brush 39 to apply the soldering flux to the PCB board, the rubber limit sleeve 17 is used to limit the area of the PCB board where the soldering flux needs to be applied, so that the coating brush 39 can only move within the area of the PCB board where the soldering flux needs to be applied to apply the soldering flux. The rubber limit sleeve 17 is used to limit the applied soldering flux, avoiding the phenomenon that the soldering flux applied on the PCB board flows on the PCB board. The soldering flux applied on the PCB board can be limited within the rubber limit sleeve 17, avoiding the soldering flux flowing out of bounds on the PCB board and flowing into the area of the PCB board where the soldering flux does not need to be applied, so that the soldering flux applied on the PCB board can always remain in the area of the PCB board where the soldering flux needs to be applied.

[0069] And the rubber limit sleeve 17 is used to limit the flux applied on the PCB board. At the same time, in cooperation with the rubber seal sleeve 16, the area on the PCB board that needs to be applied with flux is sealed within the rubber limit sleeve 17. The combined use of the rubber seal sleeve 16 and the rubber limit sleeve 17 can provide protection for the flux applied on the PCB board, preventing external dust and impurities from falling into the flux on the PCB board and causing contamination of the flux. At the same time, it can also prevent external objects from colliding with the flux applied on the PCB board and causing the flux to flow out of bounds on the PCB board.

[0070] And the flux applied on the PCB board is sealed within the rubber seal sleeve 16 through the rubber seal sleeve 16 and the rubber limit sleeve 17. The rubber seal sleeve 16 can be used to seal the peculiar smell generated during and after the application of the flux. The peculiar smell generated by the flux can be sealed within the rubber seal sleeve 16, thus preventing the peculiar smell and harmful gases contained therein from floating out and affecting the surrounding air environment and the respiratory health of the surrounding staff. The peculiar smell and harmful gases generated by the flux can be sealed within the rubber seal sleeve 16.

[0071] Moreover, the position of the lower adjustment rod 28 corresponds one by one to the position of the upper adjustment rod 21. The shape of the rubber limit ring 18 driven by the upper adjustment rod 21 is the same as the shape of the rubber limit sleeve 17. The staff can judge the shape of the rubber limit sleeve 17 through the shape of the rubber limit ring 18, which is convenient for the staff to view the shape of the rubber limit sleeve 17 in real time. And the rubber limit ring 18 can be used to limit the second automatic guided vehicle 22. The rubber limit ring 18 can be used to limit the baffle 26. Thus, the second automatic guided vehicle 22 is limited within the rubber limit ring 18, preventing the second automatic guided vehicle 22 from moving out of bounds on the bearing plate 9. The second automatic guided vehicle 22 can be limited within the area formed by several first automatic guided vehicles 19 by using the rubber limit ring 18, ensuring that the coating brush 39 will not overcoat the flux when applying the flux.

[0072] After the flux is applied to the PCB board, the air pump 12 is started again. The opening at the bottom of the rubber limit sleeve 17 is used to adsorb and fix the PCB board. The air pump 12 extracts the air within the rubber seal sleeve 16, and the peculiar smell and harmful gases generated by the flux within the rubber seal sleeve 16 are extracted into the first corrugated pipe 11 and then into the air purifier 8. Thus, the air purifier 8 is used to treat the peculiar smell and harmful gases, preventing the air containing the peculiar smell and harmful gases from being directly discharged to the outside and polluting the external air environment.

[0073] After the PCB board is adsorbed and fixed by the rubber limit sleeve 17, the electric slider 4 can be used to move upward on the guide rail 3 to take out the PCB board from the limit slot 15. Then, several first automatic guided vehicles 19 are started to move the rubber limit sleeve 17, so as to move the PCB board adsorbed and fixed at the bottom opening of the rubber limit sleeve 17 until it stops above the collection box 14. By starting the electric slider 4 to move downward on the guide rail 3, the PCB board can be placed in the collection box 14. After closing the air extraction pump 12, the PCB board can be placed in the collection box 14 to complete the blanking process of the PCB board, and the automatic blanking process of the PCB board after applying the solder paste can be carried out.

[0074] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, equivalent substitution or change should be covered within the protection scope of the present invention.

Claims

1. A PCB board soldering flux coating device, comprising a bottom plate (1), characterized in that, Two fixing plates (2) are symmetrically installed on the bottom plate (1). Guide rails (3) are installed on the opposite surfaces of the two fixing plates (2). Electric sliders (4) are slidably installed on the guide rails (3). Mounting plates (7) are installed on the sides of the two electric sliders (4). A bearing plate (9) is installed between the two mounting plates (7). A mechanism for arbitrarily changing the shape is provided on the bearing plate (9). The mechanism for arbitrarily changing the shape includes a plurality of first automatic guided vehicles (19) installed on the bearing plate (9). A first electromagnet (20) is installed at the bottom of the first automatic guided vehicle (19). A plurality of first mounting pieces (27) corresponding to the positions of the first automatic guided vehicles (19) are provided at the bottom of the bearing plate (9). A third electromagnet (31) that mutually attracts with the first electromagnet (20) is installed on the side of the first mounting piece (27) close to the bearing plate (9). A plurality of lower adjusting rods (28) are installed at the bottom of the first mounting piece (27). A rubber limit sleeve (17) is provided at the common bottom ends of the plurality of lower adjusting rods (28). A coating mechanism for coating flux on the PCB board is provided on the bearing plate (9). The coating mechanism is located within the rubber limit sleeve (17). A protection mechanism is provided at the bottom of the bearing plate (9). The rubber limit sleeve (17) is located within the protection mechanism. The coating mechanism includes a second automatic guided vehicle (22) installed on the bearing plate (9). A second electromagnet (23) is installed at the bottom of the second automatic guided vehicle (22). A second mounting piece (32) corresponding to the position of the second automatic guided vehicle (22) is provided at the bottom of the bearing plate (9). A fourth electromagnet (33) that mutually attracts with the second electromagnet (23) is installed on the side of the second mounting piece (32) close to the bearing plate (9). Universal balls are provided on the sides of the first mounting piece (27) and the second mounting piece (32) close to the bearing plate (9). The bottom of the second mounting piece (32) is connected to a connection box (29) through a telescopic assembly. A plurality of coating brushes (39) are provided at the bottom of the connection box (29). A plurality of liquid outlet holes (40) are provided at the bottom of the connection box (29). A flux box (34) is installed at the bottom of the second mounting piece (32). The flux box (34) contains flux. The flux box (34) is connected to the connection box (29) through a second corrugated pipe (36). A liquid pump (37) is provided within the second corrugated pipe (36). The connection box (29) is located within the rubber limit sleeve (17).

2. The solder flux coating device for a PCB board according to claim 1, wherein, The telescopic assembly includes an electric telescopic rod (35) installed at the bottom of the second mounting piece (32). The end of the piston rod of the electric telescopic rod (35) is connected to the top of the connection box (29).

3. A PCB board soldering flux coating device according to claim 1, characterized in that, A fixing rod (24) is installed at the top of the second automatic guided vehicle (22). A mounting sleeve (25) is fixedly sleeved on the fixing rod (24). A plurality of baffles (26) are installed on the outer wall of the mounting sleeve (25). A plurality of upper adjusting rods (21) are installed at the tops of the plurality of first automatic guided vehicles (19). A rubber limit ring (18) is provided at the common top ends of the plurality of upper adjusting rods (21). The baffles (26) are located within the rubber limit ring (18).

4. The solder flux applying device for a PCB board according to claim 3, wherein, The rubber limit ring (18) is provided with through holes, the upper adjusting rod (21) is located in the through holes, the top of the rubber limit sleeve (17) is provided with limit holes, the lower adjusting rod (28) is located in the limit holes, the bottom of the rubber limit sleeve (17) is provided with a rectangular installation groove (38), a wiping sponge (30) is installed in the installation groove (38), and the bottom end of the wiping sponge (30) is located below the rubber limit sleeve (17).

5. A PCB board soldering flux application device according to claim 1, characterized in that, The protection mechanism includes a rubber sealing sleeve (16) installed at the bottom of the bearing plate (9), the bottom end of the rubber sealing sleeve (16) is fixed to the outer wall of the rubber limit sleeve (17), and the ductility of the rubber sealing sleeve (16) is greater than that of the rubber limit sleeve (17). An air purifier (8) is installed on the mounting plate (7), the air inlet end of the air purifier (8) is communicated with a first corrugated pipe (11), the end of the first corrugated pipe (11) penetrates through the bearing plate (9) and extends into the rubber sealing sleeve (16), and an air extraction pump (12) is arranged in the first corrugated pipe (11).

6. The solder flux coating device for a PCB board according to claim 1, characterized in that, Limit blocks (5) are installed at both the upper and lower ends of the guide rail (3), the limit blocks (5) are fixed to the side surface of the fixed plate (2), and a reinforcing block (6) is fixed between the electric slider (4) and the mounting plate (7).

7. A soldering flux coating device for a PCB board according to claim 1, characterized in that, A raw material box (13) and a collection box (14) are installed on the bottom plate (1), the raw material box (13) and the collection box (14) are symmetrically arranged, a limit groove (15) for limiting the PCB board is opened on the bottom plate (1), the limit groove (15) is located between the raw material box (13) and the collection box (14), a limit frame (10) is installed on the bearing plate (9), and the first automatic guided vehicle (19) is located within the limit frame (10).

8. The operating method of a PCB board soldering flux coating device according to any one of the above claims 1-7, characterized in that, This operation method includes the following steps: S1: Adsorb the PCB board in the raw material box (13) by using the arbitrarily deformable shape mechanism, and move and place the PCB board in the limit groove (15) for feeding the PCB board; S2: Adjust the shape of the rubber limit sleeve (17) by using the arbitrarily deformable shape mechanism to make the shape of the rubber limit sleeve (17) consistent with the shape of the area on the PCB board where the soldering flux needs to be applied; S3: Apply the soldering flux to the area on the PCB board where the soldering flux needs to be applied by using the coating mechanism; S4: Adsorb the PCB board after applying the soldering flux again by using the arbitrarily deformable shape mechanism, and move and place the PCB board after applying the soldering flux in the collection box (14) for discharging the PCB board.

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