Feeding platform and feeding method for large-size silicon wafer cutting machining

Abstract

The feeding platform is provided with a connecting piece arranged corresponding to a cutting assembly, a silicon rod is arranged on the connecting piece and matched with a connecting base, and the connecting base is pushed by a pushing piece to linearly move so as to be matched with the connecting piece to push the silicon rod to the cutting assembly moving in a reciprocating mode for cutting. The connecting piece is connected with the silicon rod through a swinging assembly so as to circularly swing when the silicon rod is cut by the cutting assembly, and low-contact-area cutting of the cutting line and the silicon rod is kept; the swing assembly comprises a bonding strip, the bottom of the bonding strip is rotationally arranged on the connecting piece, and the top of the bonding strip can be fixedly bonded with the silicon rod. The invention discloses a feeding platform for silicon rod cutting, which solves the problem of high abrasion speed caused by large contact area with a silicon rod when the silicon rod is cut by a cutting line due to the fact that a linear feeding mode is adopted by an existing feeding platform for silicon rod cutting.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer processing, and in particular to a feeding platform and a feeding method for cutting and processing large-size silicon wafers. Background Art

[0002] As an important basic material, the quality of silicon wafer processing and manufacturing technology directly affects the quality and performance of related products. The silicon wafer cutting process is one of the key links in the silicon wafer manufacturing process. At present, wire cutting technology has become the mainstream method of silicon wafer cutting due to its advantages such as high efficiency and high precision.

[0003] However, the existing silicon wafer wire cutting process has certain defects. In the actual wire cutting process, the cutting wire is mostly processed in conjunction with a feed disk platform that adopts a linear feed. This linear feeding method allows the cutting wire to gradually penetrate into the silicon rod when cutting the silicon rod. As the cutting wire goes deeper, the contact area between the cutting wire and the silicon rod continues to increase. The increase in contact area brings a series of problems. On the one hand, it aggravates the wear rate of the cutting wire, resulting in a shortened service life of the cutting wire, requiring frequent replacement of the cutting wire, and increasing production costs; on the other hand, it also greatly increases the possibility of the cutting wire breaking. Once the cutting wire breaks, it will not only interrupt the cutting process, but may also cause damage to the silicon rod and affect the quality of the silicon wafer. Summary of the invention

[0004] The purpose of the present invention is to solve the problem that the existing silicon rod cutting feed platform adopts a linear feeding method, so that the cutting wire wears quickly due to the large contact area with the silicon rod when cutting the silicon rod, and to provide a feeding platform and feeding method for large-size silicon wafer cutting processing.

[0005] The present invention solves the deficiencies of the above technical problems and adopts the following technical solutions: a feeding platform for large-size silicon wafer cutting processing, which has a connecting piece corresponding to the cutting assembly, a silicon rod is arranged on the connecting piece and cooperates with a connecting base, the connecting base is pushed by a pushing piece to move linearly to cooperate with the connecting piece to push the silicon rod to the reciprocating cutting assembly for cutting, the connecting piece is connected to the silicon rod through a swinging assembly to swing cyclically when the silicon rod is cut by the cutting assembly, and the cutting is kept at a low contact area between the cutting line and the silicon rod;

[0006] The swing assembly comprises an adhesive strip whose bottom is rotatably arranged on the connecting piece, and the top of the adhesive strip can be fixedly bonded with the silicon rod.

[0007] As a further optimization of the feeding platform for large-size silicon wafer cutting processing of the present invention: the cross-section of the adhesive strip is an isosceles triangle.

[0008] As a further optimization of the feeding platform for large-size silicon wafer cutting processing of the present invention: a central axis is provided at the bottom of the adhesive strip, and the central axis is rotatably connected to a fixed seat provided on the connecting piece.

[0009] As a further optimization of the feeding platform for large-size silicon wafer cutting processing of the present invention: a damping component for preventing the adhesive strip from swinging is provided on the adhesive strip.

[0010] As a further optimization of the feed platform for large-size silicon wafer cutting processing of the present invention: the damping assembly includes two bottom blocks respectively fixed on one side of the corresponding connecting parts on both sides of the adhesive strip, and a damping spring is provided between the bottom block and the connecting part to connect the two together.

[0011] As a further optimization of the feed platform for large-size silicon wafer cutting processing of the present invention: the damping assembly includes two counterweight blocks, the counterweight blocks are arranged on one side of the connecting parts corresponding to the two sides of the adhesive strip, and the two adhesive strips are symmetrically arranged.

[0012] As a further optimization of the feed platform for large-size silicon wafer cutting processing of the present invention: the cutting assembly includes a first power roller and a second power roller, the first power roller and the second power roller are connected by a plurality of cutting lines, and the first power roller and the second power roller can drive the cutting lines to reciprocate to cut the silicon rod.

[0013] As a further optimization of the feed platform for large-size silicon wafer cutting processing of the present invention: the connecting piece is arranged in an inverted U shape, and a sliding block is provided on the inner wall of the horizontal section of the connecting piece, and the sliding block cooperates with the sliding groove on the connecting base.

[0014] As a further optimization of the feed platform for large-size silicon wafer cutting processing of the present invention: the vertical sections on both sides of the connecting member are fixedly connected to the connecting base by bolts.

[0015] A feeding method for cutting large-size silicon wafers, in which a cutting wire included in a cutting assembly cuts a silicon rod, the reciprocating cutting wire drives the silicon rod to swing, so that the cutting wire cuts the silicon rod with a low contact area.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention securely connects the silicon rod by setting an adhesive strip in the swing assembly, and the adhesive strip and the connecting member are connected in a rotating manner, so as to ensure that the silicon rod can be swung under the strong support of the adhesive strip during the process of being cut by the cutting line. In this process, the weight of the silicon rod itself and the weight of the adhesive strip are cleverly used to effectively prevent the silicon rod and the adhesive strip from completely following the displacement of the cutting line. That is, it is effectively avoided that the silicon rod cannot obtain a good cutting effect due to the complete displacement of the silicon rod with the cutting line. In addition, in the process of the cutting line cutting the silicon rod into silicon wafers, the silicon rod can be accurately cut at multiple angles. This cutting method successfully avoids the situation where the cutting line passes through the diameter position of the silicon rod, while always maintaining a low contact area between the cutting line and the silicon rod. In this way, the possibility of the cutting line wearing faster or breaking easily due to the large contact area with the silicon rod is greatly reduced, and the cutting stability and the service life of the cutting line are significantly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a front view structural schematic diagram of embodiment 1 of the present invention;

[0019] Figure 2 It is a front view structural schematic diagram of embodiment 2 of the present invention;

[0020] Figure 3 It is a schematic cross-sectional structure diagram of the first cutting state of the present invention;

[0021] Figure 4 is a schematic cross-sectional structural diagram of the second cutting state of the present invention;

[0022] Figure 5 is a schematic cross-sectional structure diagram of the third cutting state of the present invention;

[0023] Markings in the figure: 1. Cutting assembly; 101. First power roller; 102. Cutting line; 103. Second power roller; 2. Silicon rod; 3. Swinging assembly; 301. Adhesive strip; 302. Center axis; 303. Fixed seat; 4. Connector; 5. Connecting base; 6. Damping assembly; 601. Bottom block; 602. Damping spring; 603. Counterweight block; 7. Propeller; 8. Bolt. DETAILED DESCRIPTION

[0024] In order to better understand the present invention, the content of the present invention is further explained below in conjunction with embodiments, but the content of the present invention is not limited to the following embodiments.

[0025] <Example 1>

[0026] like Figure 1As shown, a feeding platform for large-size silicon wafer cutting processing has a precisely designed swing component 3, whose main function is to firmly adhere the silicon rod 2 and provide a stable basic support for subsequent cutting operations. The swing component 3 adopts a rotatable installation method and is cleverly installed on the connecting member 4. This design allows the swing component 3 to flexibly swing during operation to meet various needs in the cutting process.

[0027] The connector 4 is closely connected to the connecting base 5. The power source of the connecting base 5 is the propeller 7. The propeller 7 can accurately drive the connecting base 5, thereby realizing the power transmission and motion control of the entire feeding platform. The structural design of the connector 4 is unique, and it is an inverted U-shaped structure. A slider is carefully arranged on its horizontal inner wall. The slider is precisely adapted to the size of the slide groove pre-opened on the connecting base 5. This ingenious design greatly facilitates the staff to quickly and accurately connect the connector 4 and the connecting base 5 together, effectively improving the installation efficiency of the equipment. In addition, the outer side surfaces of the two vertical sections of the connector 4 are tightly fixed to the side surfaces of the connecting base 5 by high-strength bolts 8. This strong connection method significantly improves the connection stability between the connector 4 and the connecting base 5, and can withstand various complex forces generated during the cutting process, thereby ensuring that the connecting base 5 is more stable and reliable when pushing the connector 4 and the swing assembly 3 to move vertically, thereby providing a solid guarantee for the processing quality of the silicon rod 2 during the upward cutting process.

[0028] The propeller 7 plays a key power role in the whole system. It can drive the connector 4 to move upward through the connecting base 5. Specifically, the propeller 7 can use a hydraulic rod or a telescopic cylinder according to the actual production needs and equipment performance. Both propellers 7 have the characteristics of high precision, high stability and high reliability, and can accurately control the moving distance and speed of the connector 4. When the propeller 7 is started, the swing component 3 will then drive the silicon rod 2 firmly attached to it to move upward or downward, so that it can accurately contact the cutting line 102 in the cutting component 1, thereby smoothly realizing the cutting operation of the silicon rod 2.

[0029] During the cutting process of the silicon rod 2, the movement of the cutting wire 102 has also been carefully designed. The cutting wire 102 achieves a cyclical displacement through the relative cyclic rotation of the first power roller 101 and the second power roller 103. This continuous movement can ensure that the cutting wire 102 cuts the silicon rod 2 continuously and evenly. When the cutting wire 102 cuts the silicon rod 2, the force generated by its reciprocating movement will push the silicon rod 2 to swing under the action of the swing component 3. This swinging movement enables the cutting wire 102 to gradually contact the various cut surfaces of the silicon rod 2, thereby completing the all-round cutting of the silicon rod 2. Figure 3-5As shown, through this innovative cutting method, the silicon rod 2 can be cut into silicon wafers in a polygonal state. This cutting method effectively avoids the cutting line 102 directly passing through the diameter of the silicon rod 2, significantly reducing the contact area between the cutting line 102 and the silicon rod 2, thereby fundamentally reducing the rapid wear of the cutting line 102 caused by the excessive contact area, greatly extending the service life of the cutting line 102, and reducing the production cost.

[0030] As one of the core components of the entire feeding platform, the internal structure of the swing assembly 3 is also very delicate. The swing assembly 3 includes an adhesive strip 301, which is rotatably arranged on the connecting member 4. The cross section of the adhesive strip 301 is an isosceles triangle. This special shape design can optimize the mechanical properties during the cutting process while ensuring the bonding strength. Its bottom edge is firmly bonded to the silicon rod 2 through a high-performance adhesive material to ensure that the silicon rod 2 will not loosen or move during the cutting process. When the silicon rod 2 is cut by the cutting line 102, the adhesive strip 301 will swing on the connecting member 4. In the process of the adhesive strip 301 driving the silicon rod 2 to swing and cut with the cutting line 102, the weight at the two vertex corners of the adhesive strip 301 cooperates with the weight of the silicon rod 2, which can effectively prevent the cutting line 102 from driving the two to swing, thereby assisting the cutting line 102 to efficiently cut the silicon rod 2. This unique design not only improves the cutting efficiency, but also maintains the effect of multi-faceted cutting of the silicon rod 2, ensuring that the contact area between the cutting line 102 and the inner wall of the silicon rod 2 is always at a low level, thereby achieving high-quality cutting processing. Specifically, the top corner of the adhesive strip 301 is rotatably connected to a fixing seat 303 provided on the connecting member 4 via a central axis 302. This connection method has undergone rigorous mechanical calculations and optimized design, and can ensure the stability of the adhesive strip 301 when driving the silicon rod 2 to swing, thereby avoiding shaking or instability during the cutting process.

[0031] A damping assembly 6 is provided between the two oblique side surfaces of the adhesive strip 301 and the connector 4, and the design of the damping assembly 6 further improves the performance of the entire system. The damping assembly 6 includes a plurality of bottom blocks 601 fixed on the adhesive strip 301, and the bottom blocks 601 are connected to the upper side surface of the connector 4 via a damping spring 602. In the process of the adhesive strip 301 driving the silicon rod 2 to swing and cut along the cutting line 102, the damping spring 602 can assist the weight of the two top corners of the adhesive strip 301 and the silicon rod 2, further hindering the cutting line 102 from driving the two to swing, thereby more effectively assisting the cutting line 102 in cutting the silicon rod 2. At the same time, the setting of the damping assembly 6 also maintains the effect of multi-faceted cutting of the silicon rod 2, ensuring that the contact area between the cutting line 102 and the inner wall of the silicon rod 2 is always at a low level, thereby achieving an efficient and stable cutting process.

[0032] A feeding method for cutting large-size silicon wafers, wherein a silicon rod 2 is supported and swung by a swinging assembly 3, and the reciprocating motion of a cutting wire 102 is used as a power source. Under the weight of the silicon rod 2 and the swinging member, the cutting wire 102 can accurately cut the silicon rod 2 at multiple angles and with a low contact area. This innovative feeding method greatly improves the cutting efficiency and quality, and provides more advanced and reliable technical support for the production of large-size silicon wafers.

[0033] <Example 2>

[0034] like Figure 2 As shown, in actual production applications, in order to meet different production needs and optimize equipment performance, the structure and principle of this embodiment are basically the same as those of Example 1, but further improvements and optimizations have been made in details. The main difference is that the damping assembly 6 is a counterweight 603 fixedly arranged on the two oblique sides of the adhesive strip 301, and the two counterweights 603 are symmetrically distributed. This design is an optimized choice based on in-depth research and analysis of mechanical properties under different working scenarios. The setting of the counterweight 603 can assist the weight of the two top corners of the adhesive strip 301 and the silicon rod 2 in the process of swinging and cutting the silicon rod 2 driven by the cutting line 102, effectively hindering the cutting line 102 from driving the two to swing, thereby further enhancing the auxiliary effect of the cutting line 102 on cutting the silicon rod 2. Compared with the damping spring 602 in Example 1, the setting of the counterweight 603 can provide a more stable and lasting damping effect under certain specific working conditions. At the same time, this design also maintains the effect of multi-sided cutting of the silicon rod 2, ensuring that the contact area between the cutting line 102 and the inner wall of the silicon rod 2 is always at a low level, achieving high efficiency and stability in silicon wafer cutting processing, and providing more options and more flexible solutions for cutting processing of large-size silicon wafers.

[0035] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art may make various modifications or variations within the scope of the claims, which do not affect the essence of the present invention.

Claims

1. A feeding platform for large-size silicon wafer cutting, comprising a connecting member (4) arranged corresponding to a cutting assembly (1), a silicon rod (2) being arranged on the connecting member (4) and cooperating with a connecting base (5), the connecting base (5) being pushed by a pushing member (7) to move linearly, so as to cooperate with the connecting member (4) to push the silicon rod (2) toward the reciprocating cutting assembly (1) for cutting, characterized in that: The connecting member (4) is connected to the silicon rod (2) via a swinging assembly (3) so as to swing cyclically when the silicon rod (2) is cut by the cutting assembly (1), thereby maintaining a low contact area between the cutting assembly (1) and the silicon rod (2); The swing assembly (3) comprises an adhesive strip (301) whose bottom is rotatably arranged on the connecting member (4), and the top of the adhesive strip (301) can be fixedly bonded to the silicon rod (2).

2. A feeding platform for large-size silicon wafer cutting as claimed in claim 1, characterized in that: The cross section of the adhesive strip (301) is an isosceles triangle.

3. A feeding platform for large-size silicon wafer cutting as claimed in claim 1, characterized in that: The bottom of the adhesive strip (301) is provided with a central axis (302), and the central axis (302) is rotatably connected to a fixing seat (303) provided on the connecting member (4).

4. A feeding platform for large-size silicon wafer cutting as claimed in claim 1, characterized in that: The adhesive strip (301) is provided with a damping component (6) for preventing the adhesive strip (301) from swinging.

5. A feeding platform for large-size silicon wafer cutting as claimed in claim 4, characterized in that: The damping assembly (6) comprises two bottom blocks (601) respectively fixed on the two sides of the adhesive strip (301) corresponding to the side surface of the connecting member (4), and a damping spring (602) is provided between the bottom block (601) and the connecting member (4) to connect the two together.

6. A feeding platform for cutting large-size silicon wafers as claimed in claim 4, characterized in that: The damping assembly (6) comprises two counterweight blocks (603), the counterweight blocks (603) being arranged on one side of the connecting member (4) corresponding to the two sides of the adhesive strip (301), and the two adhesive strips (301) are symmetrically arranged.

7. A feeding platform for large-size silicon wafer cutting as claimed in claim 1, characterized in that: The cutting assembly (1) comprises a first powered roller (101) and a second powered roller (103), wherein the first powered roller (101) and the second powered roller (103) are connected via a plurality of cutting lines (102), and the first powered roller and the second powered roller (103) can drive the cutting lines (102) to reciprocate and cut the silicon rod (2).

8. A feeding platform for large-size silicon wafer cutting as claimed in claim 1, characterized in that: The connecting member (4) is arranged in an inverted U shape, and a sliding block is provided on the inner wall of the horizontal section of the connecting member (4), and the sliding block cooperates with a sliding groove on the connecting base (5).

9. A feeding platform for large-size silicon wafer cutting as claimed in claim 8, characterized in that: The vertical sections on both sides of the connecting member (4) are fixedly connected to the connecting base (5) via bolts (8).

10. A feeding method for cutting large-size silicon wafers, characterized in that: During the process of the cutting wire (102) included in the cutting assembly (1) cutting the silicon rod (2), a feeding platform for cutting large-size silicon wafers according to any one of claims 1 to 9 is used to make the reciprocating cutting wire (102) drive the silicon rod (2) to swing, so that the cutting wire (102) can cut the silicon rod (2) with a low contact area.

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