Semiconductor chip lead frame detection station roller conveying mechanism

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor chip lead frame detection station roller conveying mechanism which comprises a bottom plate and two conveying mechanisms arranged on the two sides of the bottom plate respectively. Each conveying mechanism comprises two supporting columns, a mounting plate, a plurality of conveying shafts, a side plate, two center shafts, a conveying belt and a driving mechanism, the two supporting columns are fixedly connected with the bottom plate, the mounting plate is fixedly connected with the supporting columns, the cross section of the mounting plate is concave, the conveying shafts are rotationally connected with the mounting plate, the side plate is fixedly connected with the mounting plate, and the conveying belt is fixedly connected with the side plate. The two center shafts are rotationally connected with the side plates, the conveying belt wraps the outer sides of the two center shafts, the driving assembly is arranged on the outer side of the mounting plate, and through the arrangement of the structure, the problem that in the prior art, in the lead frame rotor conveying process, the edge makes contact with the conveying supporting table, and abrasion is likely to be caused is solved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor manufacturing, and in particular to a roller conveying mechanism for a semiconductor chip lead frame detection station. Background Art

[0002] During the packaging process, the lead frame provides mechanical support for the chip and protects internal components from damage. The lead frame not only transmits electrical signals, but also effectively disperses and discharges the heat generated by the semiconductor device during operation through the good thermal conductivity of its metal material, thereby extending its service life.

[0003] In the prior art, the patent document with the announcement number (CN218464717U) mentions a roller conveying mechanism for a semiconductor chip lead frame inspection station, including a bottom plate, on which a plurality of conveyors arranged in series are installed, the conveyor including two side plates, and each side plate is provided with a plurality of driving wheel shafts, and a load-bearing wheel is provided between the inner ends of each driving wheel shaft, and each load-bearing wheel is provided with two wheel grooves, and a rubber ring is sleeved between the wheel grooves of adjacent load-bearing wheels, and the load-bearing wheels between the two side plates constitute a conveying platform for conveying the lead frame, and a driving mechanism for driving the plurality of driving wheel shafts to rotate synchronously is provided on the side plate. The prior art has the characteristics of smooth conveying, which is more stable than the traditional chain conveyor line, and is not prone to lead frame jumping phenomenon, ensuring the high accuracy of the detection result.

[0004] However, in the above-mentioned prior art, during the conveying process of the lead frame rotor, the edge contacts with the conveying platform, which is easy to cause wear. Summary of the invention

[0005] The purpose of the present invention is to provide a roller conveying mechanism for a semiconductor chip lead frame inspection station, which solves the problem in the prior art that during the conveying process of the lead frame rotor, the edge contacts with the conveying tray, which easily causes wear.

[0006] To achieve the above-mentioned purpose, the present invention provides a roller conveying mechanism for a semiconductor chip lead frame detection station, comprising a base plate and two transport mechanisms, the two transport mechanisms are respectively arranged on both sides of the base plate, each of the transport mechanisms comprises two support columns, a mounting plate, a plurality of transport shafts, a side plate, two center shafts, a transport belt and a driving mechanism, the two support columns are fixedly connected to the base plate and are located on one side of the base plate, the mounting plate is fixedly connected to the support columns and is located above the two support columns, the cross-section of the mounting plate is concave-shaped, the plurality of transport shafts are rotatably connected to the mounting plate and are evenly arranged on the surface of the mounting plate, the side plate is fixedly connected to the mounting plate and is located on one side of the mounting plate, the two center shafts are rotatably connected to the side plate and are located on one side of the side plate, the transport belt is coated on the outside of the two center shafts, and the driving assembly is arranged on the outside of the mounting plate.

[0007] Wherein, the transport mechanism further comprises a limiting plate, which is fixedly connected to the side plate and is located above the mounting plate.

[0008] In which, the driving assembly includes a plurality of first transmission shafts, a plurality of second transmission shafts, a plurality of first transmission belts, a plurality of second transmission belts and two transmission structures, a plurality of the first transmission shafts are fixedly connected to the corresponding transport shafts and are located on one side of the mounting plate, a plurality of the second transmission shafts are fixedly connected to the corresponding first transmission shafts and are located on one side of the first transmission shaft, a plurality of the first transmission belts are respectively wrapped around the outer sides of the corresponding two first transmission shafts, a plurality of the second transmission belts are respectively wrapped around the outer sides of the corresponding two second transmission shafts, and the two transmission structures are respectively arranged on both sides of the mounting plate.

[0009] Among them, each of the transmission structures includes a first motor, a driving shaft and a driving belt. The first motor is fixedly connected to the base plate and is located below the mounting plate. The driving shaft is fixedly connected to the first motor and is located on one side of the first motor. The driving belt is wrapped around the surface of the driving shaft.

[0010] Among them, the roller conveying mechanism of the semiconductor chip lead frame detection station also includes two connecting columns and a receiving mechanism, the two connecting columns are fixedly connected to the base plate and are located on one side of the two mounting plates, and the receiving assembly is rotatably connected to the two connecting columns and is located between the two receiving mechanisms.

[0011] Wherein, the receiving mechanism comprises a rotating frame and a plurality of rotating shafts, wherein the rotating frame is rotatably connected to the two receiving columns and is located between the two connecting columns, and the plurality of rotating shafts are rotatably connected to the rotating frame and are evenly arranged between the rotating frames.

[0012] Wherein, the receiving assembly further comprises a baffle, which is rotatably connected to the rotating frame and is located outside the rotating frame.

[0013] The present invention provides a roller conveying mechanism for a semiconductor chip lead frame detection station, wherein the two support columns are fixedly connected to the base plate and are located on one side of the base plate, the mounting plate is fixedly connected to the support columns and is located above the two support columns, the cross-section of the mounting plate is arranged in a concave shape, a plurality of transport shafts are rotatably connected to the mounting plate and are evenly arranged on the surface of the mounting plate, the side plate is fixedly connected to the mounting plate and is located on one side of the mounting plate, the two central shafts are rotatably connected to the side plates and are located on one side of the side plate, the transport belt is covered on the outside of the two central shafts, the drive assembly is arranged on the outside of the mounting plate, the transport shaft is supported at the bottom of the lead frame, when transporting the lead frame, the transport belt blocks both sides of the lead frame, and when the lead frame contacts the transport belt, the transport belt rotates accordingly to prevent the lead frame from colliding during transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 It is a schematic structural diagram of the first embodiment of the present invention.

[0016] Figure 2 The present invention Figure 1 Schematic diagram of the structure at point A.

[0017] Figure 3 is a side view of the first embodiment of the present invention.

[0018] Figure 4 The present invention Figure 3 BB line cross-sectional view.

[0019] Figure 5 It is a schematic structural diagram of the second embodiment of the present invention.

[0020] Figure 6 It is a schematic structural diagram of the third embodiment of the present invention.

[0021] Figure 7 2 is a front view of a third embodiment of the present invention.

[0022] 101-bottom plate, 102-support column, 103-mounting plate, 104-transport shaft, 105-side plate, 106-center axis, 107-transport belt, 108-limiting plate, 109-first transmission shaft, 110-second transmission shaft, 111-first transmission belt, 112-second transmission belt, 113-first motor, 114-driving shaft, 115-driving belt, 201-connecting column, 202-rotating frame, 203-baffle, 204-rotating shaft, 301-second motor, 302-screw, 303-moving block, 304-connecting rod, 305-rotating plate, 306-third motor. DETAILED DESCRIPTION

[0023] Embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be construed as limiting the present invention.

[0024] First embodiment:

[0025] See also Figure 1 to Figure 4 ,in, Figure 1 is a schematic structural diagram of the first embodiment of the present invention, Figure 2 The present invention Figure 1 Schematic diagram of the structure at A, Figure 3 is a side view of a first embodiment of the present invention, Figure 4 The present invention Figure 3 BB line cross-sectional view.

[0026] The present invention provides a roller conveying mechanism for a semiconductor chip lead frame inspection station, comprising a base plate 101 and two conveying mechanisms, each of the conveying mechanisms comprising two support columns 102, a mounting plate 103, a plurality of conveying shafts 104, a side plate 105, two central shafts 106, a conveying belt 107, a limiting plate 108 and a driving mechanism, the driving assembly comprising a plurality of first transmission shafts 109, a plurality of second transmission shafts 110, a plurality of first transmission belts 111, a plurality of second transmission belts 112 and two transmission structures, each of the transmission structures comprising a first motor 113, a driving shaft 114 and a driving belt 115, and the above-mentioned scheme solves the problem in the prior art that during the conveying process of the lead frame rotor, the edge contacts with the conveying support platform, which easily causes wear.

[0027] According to the present specific embodiment, the two transport mechanisms are respectively arranged on both sides of the bottom plate 101, the two support columns 102 are fixedly connected to the bottom plate 101 and are located on one side of the bottom plate 101, the mounting plate 103 is fixedly connected to the support columns 102 and is located above the two support columns 102, the cross section of the mounting plate 103 is arranged in a concave shape, a plurality of transport shafts 104 are rotatably connected to the mounting plate 103 and are evenly arranged on the surface of the mounting plate 103, and the side plate 105 is fixedly connected to the mounting plate 103. The two center shafts 106 are rotatably connected to the side plate 105 and are located on one side of the side plate 105. The conveyor belt 107 is wrapped around the outside of the two center shafts 106. The driving assembly is arranged on the outside of the mounting plate 103. The conveyor shaft 104 is supported at the bottom of the lead frame. When the lead frame is transported, the conveyor belt 107 blocks both sides of the lead frame. When the lead frame contacts the conveyor belt 107, the conveyor belt 107 rotates accordingly to prevent the lead frame from colliding during transportation.

[0028] The limiting plate 108 is fixedly connected to the side plate 105 and is located above the mounting plate 103. During transportation, the limiting plate 108 is clamped on the top of the lead frame, thereby improving stability during transportation.

[0029] Secondly, a number of the first transmission shafts 109 are fixedly connected to the corresponding transport shafts 104 and are located on one side of the mounting plate 103; a number of the second transmission shafts 110 are fixedly connected to the corresponding first transmission shafts 109 and are located on one side of the first transmission shaft 109; a number of the first transmission belts 111 are respectively wrapped around the outer sides of the corresponding two first transmission shafts 109; a number of the second transmission belts are respectively wrapped around the outer sides of the corresponding two second transmission shafts 110; the two transmission structures are respectively arranged on both sides of the mounting plate 103; the transmission structures respectively drive the first transmission shafts 109 and the second transmission shafts 110 on both sides to rotate; under the transmission action of the first transmission belts 111 and the second transmission belts 112, the number of transport shafts 104 rotate accordingly.

[0030] In addition, the first motor 113 is fixedly connected to the base plate 101 and is located below the mounting plate 103. The driving shaft 114 is fixedly connected to the first motor 113 and is located on one side of the first motor 113. The driving belt 115 is wrapped around the surface of the driving shaft 114. The first transmission belt 111 and the second transmission belt 112 are wrapped around the surfaces of the first transmission shaft 109 and the second transmission shaft 110. One of the first transmission shaft 109 and the second transmission shaft 110 is reserved on both sides, and the two driving belts 115 are connected to one of them respectively. The first motor 113 drives the driving shaft 114 to rotate, so that the first transmission shaft 109 and the second transmission shaft 110 rotate accordingly.

[0031] When the present invention is used, the first motor 113 drives the driving shaft 114 to rotate, so that the first transmission shaft 109 and the second transmission shaft 110 rotate accordingly. Under the transmission action of the first transmission belt 111 and the second transmission belt 112, the plurality of transport shafts 104 rotate accordingly. The transport shafts 104 are supported at the bottom of the lead frame. When the lead frame is transported, the transport belt 107 blocks both sides of the lead frame. When the lead frame contacts the transport belt 107, the transport belt 107 rotates accordingly to prevent the lead frame from colliding during transportation. During transportation, the limit plate 108 is stuck on the top of the lead frame, thereby improving stability during transportation.

[0032] Second embodiment:

[0033] See also Figure 5 , Figure 5 It is a schematic structural diagram of the second embodiment of the present invention.

[0034] On the basis of the first embodiment, the present invention provides a roller conveyor mechanism for a semiconductor chip lead frame inspection station, further comprising two connecting columns 201 and a receiving mechanism, wherein the receiving mechanism comprises a rotating frame 202, a baffle 203 and a plurality of rotating shafts 204. The aforementioned solution solves the problem of inconvenient storage of the lead frame after transportation.

[0035] According to this specific embodiment, the two connecting columns 201 are fixedly connected to the base plate 101 and are located on one side of the two mounting plates 103. The receiving assembly is rotatably connected to the two connecting columns 201 and is located between the two receiving mechanisms. The lead frame falls onto the surface of the receiving assembly through the transport shaft 4, and the receiving assembly can rotate around the connecting columns 201.

[0036] The rotating frame 202 is rotatably connected to the two receiving columns and is located between the two connecting columns 201. A plurality of rotating shafts 204 are rotatably connected to the rotating frame 202 and are evenly arranged between the rotating frames 202. The lead frame falls on the surface of the rotating shaft 204. When the rotating frame 202 is tilted, the lead frame falls and the rotating shaft 204 rotates accordingly.

[0037] Secondly, the baffle 203 is rotatably connected to the rotating frame 202 and is located outside the rotating frame 202. The baffle 203 blocks the outside of the lead frame to prevent the lead frame from falling.

[0038] When the present invention is used, the first motor 113 drives the driving shaft 114 to rotate, so that the first transmission shaft 109 and the second transmission shaft 110 rotate accordingly. Under the transmission action of the first transmission belt 111 and the second transmission belt 112, the plurality of transport shafts 104 rotate accordingly. The transport shaft 104 is supported at the bottom of the lead frame. When transporting the lead frame, the transport belt 107 blocks both sides of the lead frame. When the lead frame contacts the transport belt 107, the transport belt 107 rotates accordingly to prevent the lead frame from colliding during transportation. During transportation, the limiting plate 108 is stuck on the top of the lead frame, and the lead frame falls on the surface of the rotating shaft 204. When the rotating frame 202 is tilted, the lead frame falls, and the rotating shaft 204 rotates accordingly.

[0039] Third embodiment:

[0040] The roller conveying mechanism of the semiconductor chip lead frame inspection station further includes an adjusting mechanism, and the adjusting mechanism is arranged outside the rotating frame 202 .

[0041] The adjustment mechanism includes a second motor 301, a screw rod 302, a moving block 303 and a connecting rod 304. The second motor 301 is fixedly connected to the base plate 101. The screw rod 302 is fixedly connected to the output end of the second motor 301 and is located on one side of the second motor 301. The moving block 303 is threadedly connected to the screw rod 302 and covered on the surface of the screw rod 302. One end of the connecting rod 304 is rotatably connected to the moving block 303, and the other end of the connecting rod 304 is rotatably connected to the rotating frame 202.

[0042] The adjustment mechanism also includes a rotating plate 305 and a third motor 306 . The rotating plate 305 is fixedly connected to the baffle 203 and is located on one side of the baffle 203 . The third motor 306 is fixedly connected to the baffle 203 , and an output end of the third motor 306 is fixedly connected to the rotating plate 305 .

[0043] See also Figure 6-7 ,in, Figure 6 is a schematic structural diagram of a second embodiment of the present invention, Figure 7 It is a front view of the second embodiment of the present invention.

[0044] On the basis of the second embodiment, the present invention provides a roller conveying mechanism for a semiconductor chip lead frame inspection station, which also includes an adjustment mechanism. The adjustment mechanism includes a second motor 301, a screw 302, a moving block 303, a connecting rod 304, a rotating plate 305 and a third motor 306. The above-mentioned solution solves the problem that the rotating frame 202 is inconvenient to adjust and the lead frame wire is inconvenient to operate.

[0045] According to this specific embodiment, the adjustment mechanism is disposed on the outside of the rotating frame 202 , and the adjustment component adjusts the tilt angle of the rotating frame 202 to facilitate the removal of the lead frame.

[0046] Among them, the second motor 301 is fixedly connected to the base plate 101, the screw rod 302 is fixedly connected to the output end of the second motor 301 and is located on one side of the second motor 301, the moving block 303 is threadedly connected to the screw rod 302 and covered on the surface of the screw rod 302, one end of the connecting rod 304 is rotatably connected to the moving block 303, and the other end of the connecting rod 304 is rotatably connected to the rotating frame 202, the second motor 301 drives the screw rod 302 to rotate, and the moving block 303 moves accordingly, so that the connecting rod 304 moves accordingly, and the rotating frame 202 tilts accordingly.

[0047] Secondly, the rotating plate 305 is fixedly connected to the baffle 203 and is located on one side of the baffle 203. The third motor 306 is fixedly connected to the baffle 203. The output end of the third motor 306 is fixedly connected to the rotating plate 305. The rotating plate 305 is blocked on one side of the baffle 203. The third motor 306 drives the rotating plate 305 to rotate to open the baffle 203.

[0048] When the present invention is used, the first motor 113 drives the driving shaft 114 to rotate, so that the first transmission shaft 109 and the second transmission shaft 110 rotate accordingly. Under the transmission action of the first transmission belt 111 and the second transmission belt 112, the plurality of transport shafts 104 rotate accordingly. The transport shafts 104 are supported at the bottom of the lead frame. When the lead frame is transported, the transport belt 107 blocks both sides of the lead frame. When the lead frame contacts the transport belt 107, the transport belt 107 rotates accordingly to prevent the lead frame from being transported. A collision occurs on the way. During transportation, the limit plate 108 is stuck on the top of the lead frame, and the lead frame falls on the surface of the rotating shaft 204. The second motor 301 drives the lead screw 302 to rotate, and the moving block 303 moves accordingly, so that the connecting rod 304 moves accordingly, so that the rotating frame 202 tilts accordingly, the lead frame falls, and the rotating shaft 204 rotates accordingly. The rotating plate 305 blocks one side of the baffle 203, and the third motor 306 drives the rotating plate 305 to rotate to open the baffle 203.

[0049] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A roller conveying mechanism for a semiconductor chip lead frame inspection station, comprising a bottom plate, characterized in that: It also includes two transport mechanisms, which are respectively arranged on both sides of the bottom plate; Each of the transport mechanisms includes two support columns, a mounting plate, a plurality of transport shafts, a side plate, two center shafts, a transport belt and a driving mechanism. The two support columns are fixedly connected to the base plate and are located on one side of the base plate. The mounting plate is fixedly connected to the support columns and is located above the two support columns. The cross-section of the mounting plate is concave-shaped. A plurality of transport shafts are rotatably connected to the mounting plate and are evenly arranged on the surface of the mounting plate. The side plate is fixedly connected to the mounting plate and is located on one side of the mounting plate. The two center shafts are rotatably connected to the side plate and are located on one side of the side plate. The transport belt is wrapped around the outside of the two center shafts, and the driving assembly is arranged on the outside of the mounting plate.

2. The semiconductor chip lead frame inspection station roller conveying mechanism according to claim 1, characterized in that: The transport mechanism further comprises a limiting plate, which is fixedly connected to the side plate and is located above the mounting plate.

3. The semiconductor chip lead frame inspection station roller conveying mechanism according to claim 2, characterized in that: The driving assembly includes a plurality of first transmission shafts, a plurality of second transmission shafts, a plurality of first transmission belts, a plurality of second transmission belts and two transmission structures. The plurality of first transmission shafts are fixedly connected to the corresponding transport shafts and are located on one side of the mounting plate. The plurality of second transmission shafts are fixedly connected to the corresponding first transmission shafts and are located on one side of the first transmission shaft. The plurality of first transmission belts are respectively wrapped around the outer sides of the corresponding two first transmission shafts. The plurality of second transmission belts are respectively wrapped around the outer sides of the corresponding two second transmission shafts. The two transmission structures are respectively arranged on both sides of the mounting plate.

4. The roller conveying mechanism for the semiconductor chip lead frame inspection station according to claim 3, characterized in that: Each of the transmission structures includes a first motor, a driving shaft and a driving belt. The first motor is fixedly connected to the base plate and is located below the mounting plate. The driving shaft is fixedly connected to the first motor and is located on one side of the first motor. The driving belt is wrapped around the surface of the driving shaft.

5. The roller conveying mechanism for semiconductor chip lead frame inspection station according to claim 4, characterized in that: The roller conveying mechanism of the semiconductor chip lead frame detection station also includes two connecting columns and a receiving mechanism. The two connecting columns are fixedly connected to the base plate and are located on one side of the two mounting plates. The receiving assembly is rotatably connected to the two connecting columns and is located between the two receiving mechanisms.

6. The roller conveying mechanism for semiconductor chip lead frame inspection station according to claim 5, characterized in that: The receiving mechanism comprises a rotating frame and a plurality of rotating shafts. The rotating frame is rotatably connected to the two receiving columns and is located between the two connecting columns. The plurality of rotating shafts are rotatably connected to the rotating frame and are evenly arranged between the rotating frames.

7. The roller conveying mechanism for the semiconductor chip lead frame inspection station according to claim 6, characterized in that: The receiving assembly further comprises a baffle, which is rotatably connected to the rotating frame and is located outside the rotating frame.

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