A heat dissipation case for high-performance computers

Abstract

The application relates to the technical field of computer mainframes, in particular to a heat dissipation case for a high-performance computer, which comprises a main case body, the main case body is in a rectangular sealed structure, a cooling bin in a U-shaped structure is arranged in the main case body, a mounting groove is arranged at the top of the main case body, a top plate is inserted into the mounting groove, a mounting frame is fixedly arranged at the bottom of the top plate, and a plurality of heat dissipation copper pipes are fixedly arranged on the inner wall of the cooling bin. The main case body is designed, a sandwich layer can be formed outside the mounting frame through the cooling bin in the main case body, the main case body itself can be kept in a cooling state through cooperation with cooling liquid, the main case body in the cooling state can cool the air entering the inside of the main case body, meanwhile, part of the hot air in the main case body can be introduced into the cooling liquid through cooperation with an exhaust pipe and an air suction pipe, the hot air is discharged after being cooled by the cooling liquid, and the temperature of the air around the main case body is further reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to computer host technology field, especially to a kind of for high-performance computer's heat dissipation case. BACKGROUND

[0002] Computer host is the main component of computer, generally includes CPU, memory, video card, motherboard, hard disk, optical drive, power supply, case, heat dissipation system and other input-output controllers and interfaces.

[0003] Computer host is divided into many kinds according to the use, game computer host is one of the more common ones, the existing game computer host in order to can adapt to large 3A game, its configuration is generally higher, belongs to the high-performance computer commonly seen in daily life, the power consumption of CPU and video card is generally larger, therefore, a large amount of heat will be generated in the process of use, and the conventional computer host is generally cooled by fan, but the heat dissipation effect cannot meet the requirements due to the influence of case itself, this situation can make the case internal store a large amount of heat, and in the prior art, some cases will adopt water cooling type, the effect of this cooling method is better, but it can only cool CPU and video card itself, cannot cool mainboard, power supply and other parts, after long time running of game computer host, the phenomenon of host overheating is still caused, therefore, we propose a kind of high-performance game computer host. SUMMARY

[0004] The purpose of the present application is to solve the problems in the background art, and a kind of for high-performance computer's heat dissipation case is proposed.

[0005] In order to achieve the above purpose, the technical scheme adopted by the present application is as follows: a kind of for high-performance computer's heat dissipation case, including host case, the host case is rectangular sealed structure, the cooling bin of U-shaped structure is opened in the host case, the mounting groove is opened in the top of host case, the top plate is inserted in the mounting groove, and the mounting frame is fixedly installed at the bottom of top plate.

[0006] In the above-mentioned heat dissipation case for high-performance computer, the inner wall of cooling bin is fixedly installed with a plurality of heat dissipation copper pipes, the two ends of heat dissipation copper pipe are all through the host case, a plurality of heat dissipation copper pipes are divided into two groups and are distributed in straight line, two symmetrical air inlet grooves are opened in one side of host case, a plurality of fixed supports in straight line are fixedly installed on the inner wall of air inlet groove, the installation positions of a plurality of fixed supports are one-to-one corresponding to the installation positions of a plurality of heat dissipation copper pipes, and the heat dissipation fan is fixedly installed on the fixed support.

[0007] In the heat dissipation case for high-performance computer, the inner wall of the cooling bin is provided with a moving groove, the inner wall of the moving groove is provided with a fixed tooth groove, the cooling bin is provided with a C-shaped moving frame, the bottom of the moving frame is in sliding connection with the moving groove, the bottom of the moving frame is rotatably installed with a driving gear in the moving groove, the driving gear is in engagement with the fixed tooth groove, the outer wall of the heat dissipation copper pipe is provided with a pushing ring, the pushing rings on the outer walls of the plurality of linearly distributed heat dissipation copper pipes are fixedly connected through a connecting support, the plurality of fixedly connected pushing rings are fixedly connected with the moving frame, one side of the pushing ring is rotatably installed with a rotating ring, the outer wall of the rotating ring is fixedly installed with an agitating blade, and the outer wall of the heat dissipation copper pipe and the inner wall of the rotating ring are both provided with threads.

[0008] In the heat dissipation case for high-performance computer, the two sides of the main case body are provided with placing grooves, the two placing grooves are respectively arranged at the two ends of the top of the U-shaped cooling bin, the inner wall bottom of the placing groove is provided with a plurality of air holes, the air holes are in communication with the cooling bin, a fixed cover plate is inserted in the placing groove, and the fixed cover plate is provided with a water absorbing cotton near the side close to the corresponding placing groove.

[0009] In the heat dissipation case for high-performance computer, the two sides of the main case body are provided with placing grooves, the two placing grooves are respectively arranged at the two ends of the top of the U-shaped cooling bin, the inner wall bottom of the placing groove is provided with a plurality of air holes, the air holes are in communication with the cooling bin, a fixed cover plate is inserted in the placing groove, and the fixed cover plate is provided with a water absorbing cotton near the side close to the corresponding placing groove.

[0010] In the heat dissipation case for high-performance computer, the two sides of the main case body are provided with placing grooves, the two placing grooves are respectively arranged at the two ends of the top of the U-shaped cooling bin, the inner wall bottom of the placing groove is provided with a plurality of air holes, the air holes are in communication with the cooling bin, a fixed cover plate is inserted in the placing groove, and the fixed cover plate is provided with a water absorbing cotton near the side close to the corresponding placing groove.

[0011] In the heat dissipation case for high-performance computer, the two sides of the main case body are provided with placing grooves, the two placing grooves are respectively arranged at the two ends of the top of the U-shaped cooling bin, the inner wall bottom of the placing groove is provided with a plurality of air holes, the air holes are in communication with the cooling bin, a fixed cover plate is inserted in the placing groove, and the fixed cover plate is provided with a water absorbing cotton near the side close to the corresponding placing groove.

[0012] In the heat dissipation case for high-performance computer, the two sides of the main case body are provided with placing grooves, the two placing grooves are respectively arranged at the two ends of the top of the U-shaped cooling bin, the inner wall bottom of the placing groove is provided with a plurality of air holes, the air holes are in communication with the cooling bin, a fixed cover plate is inserted in the placing groove, and the fixed cover plate is provided with a water absorbing cotton near the side close to the corresponding placing groove.

[0013] Compared with the prior art, the heat dissipation case for high-performance computers has the advantages that the main case body is designed, a sandwich is formed outside the mounting frame through the cooling bin in the main case body, the main case body is always kept in a cooling state through the cooling liquid, the main case body in the cooling state can cool the air entering the inside of the main case body, and part of the hot air in the main case body can be introduced into the cooling liquid through the exhaust pipe and the air suction pipe, the hot air is discharged after being cooled by the cooling liquid, the temperature of the air around the main case body is further reduced, the air sucked into the main case body is kept at a low temperature, and the cooling effect of the main case body is improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is a schematic view of the three-dimensional structure of the main case body in the application.

[0015] Figure 2 is a schematic view of the three-dimensional structure of the main case body in the application.

[0016] Figure 3 is a schematic view of the three-dimensional structure of the main case body in the application. Figure 2

[0017] Figure 4 is a schematic view of the three-dimensional structure of the main case body in the application.

[0018] Figure 5 is a schematic view of the three-dimensional structure of the main case body in the application. Figure 4

[0019] Figure 6 is a schematic view of the three-dimensional structure of the main case body in the application.

[0020] Figure 7 is a schematic view of the three-dimensional structure of the main case body in the application. Figure 6

[0021] Figure 8 is a schematic view of the three-dimensional structure of the main case body in the application. Figure 6

[0022] Figure 9 is a schematic view of the three-dimensional structure of the main case body in the application. Figure 6

[0023] Figure 10 is a schematic view of the three-dimensional structure of the main case body in the application.

[0024] Figure 11 is a schematic view of the three-dimensional structure of the main case body in the application. Figure 10

[0025] ​​​​​​In the figure: 1, main box body; 2, cooling bin; 101, mounting groove; 3, top plate; 301, mounting frame; 201, heat dissipation copper pipe; 102, air inlet groove; 103, fixed support; 104, heat dissipation fan; 202, moving groove; 203, fixed gear slot; 204, moving frame; 205, drive gear; 206, push ring; 207, rotating ring; 4, placing groove; 401, air hole; 402, fixed cover plate; 403, water absorbing cotton; 404, water receiving groove; 405, water inlet hole; 406, sealing plug; 105, exhaust pipe; 302, heat dissipation bin; 303, exhaust pipe; 304, exhaust fan; 208, lifting chute; 209, lifting block; 210, bellows; 211, extension pipe; 106, air inlet; 107, push plate; 108, electric cylinder. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.

[0027] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0028] Reference Figures 1-11 A heat dissipation case for high-performance computers, comprising a main case body 1, the main case body 1 is in a rectangular sealed structure, a U-shaped cooling bin 2 is formed in the main case body 1, a mounting groove 101 is formed at the top of the main case body 1, a top plate 3 is inserted into the mounting groove 101, a mounting frame 301 is fixedly installed at the bottom of the top plate 3, the mounting frame 301 is used to install the main board and graphics card and other parts, when mounting, the installed mounting frame 301 together with the top plate 3 is inserted into the main case body 1 through the mounting groove 101, and the cooling bin 2 is used to cool the inside of the main case body 1.

[0029] The inner wall of the cooling bin 2 is fixedly provided with a plurality of heat dissipation copper pipes 201, both ends of the heat dissipation copper pipes 201 penetrate the main case body 1, the plurality of heat dissipation copper pipes 201 are divided into two groups and are distributed in a straight line, two symmetrically arranged air inlet grooves 102 are formed in one side of the main case body 1, a plurality of fixed supports 103 distributed in a straight line are fixedly arranged on the inner wall of the air inlet grooves 102, the installation positions of the plurality of fixed supports 103 correspond to the installation positions of the plurality of heat dissipation copper pipes 201 one by one, the fixed supports 103 are fixedly provided with heat dissipation fans 104, when heat is generated in the main case body 1, the filled cooling liquid in the cooling bin 2 can cool the main case body 1 itself, so that the temperature of the main case body 1 is prevented from being too high, and when the temperature of the cooling liquid in the cooling bin 2 is increased, the heat dissipation copper pipes 201 can cool the cooling liquid, so that the cooling effect of the cooling liquid is ensured, the fixed supports 103 are used for installing the heat dissipation fans 104, and the heat dissipation fans 104 can further improve the heat dissipation effect of the heat dissipation copper pipes 201.

[0030] A moving groove 202 is formed in the bottom of the inner wall of the cooling bin 2, a fixed tooth groove 203 is formed in the inner wall of the moving groove 202, a C-shaped moving frame 204 is arranged in the cooling bin 2, the bottom of the moving frame 204 is in sliding connection with the moving groove 202, a driving gear 205 is rotatably arranged on the bottom of the moving frame 204 and located in the moving groove 202, the driving gear 205 is in engagement with the fixed tooth groove 203, a pushing ring 206 is arranged on the outer wall of the heat dissipation copper pipe 201, the pushing rings 206 arranged in a straight line on the outer walls of the plurality of heat dissipation copper pipes 201 are fixedly connected through a connecting support, the plurality of fixedly connected pushing rings 206 are fixedly connected with the moving frame 204, a rotating ring 207 is rotatably arranged on one side of the pushing ring 206, the rotating ring 207 is fixedly provided with stirring blades on the outer wall, threads are formed in the outer wall of the heat dissipation copper pipe 201 and the inner wall of the rotating ring 207, a driving motor with a forward and reverse rotation function is fixedly arranged in the moving frame 204, the driving motor drives the driving gear 205 to reciprocating rotate, the driving gear 205 and the fixed tooth groove 203 are matched to drive the moving frame 204 to reciprocating move in the moving groove 202, the moving frame 204 drives the pushing ring 206 and the rotating ring 207 to reciprocating move along the corresponding heat dissipation copper pipe 201, in the moving process of the rotating ring 207, the threads in the inner wall of the rotating ring 207 and the outer wall of the heat dissipation copper pipe 201 are matched to drive the rotating ring 207 to rotate and drive the stirring blades to rotate, the rotation of the stirring blades can stir the cooling liquid, so that the cooling liquid flows, and the heat dissipation effect is further improved.

[0031] Two placing grooves 4 are formed on the two sides of the mainframe box 1, and the two placing grooves 4 are respectively formed at the top of the two ends of the cooling bin 2 in the U-shaped structure. A plurality of air holes 401 are formed in the inner wall bottom of the placing groove 4, the air holes 401 are communicated with the cooling bin 2, a fixed cover plate 402 is inserted in the placing groove 4, a water absorbing cotton 403 is inserted on the side of the fixed cover plate 402 close to the corresponding placing groove 4, the placing groove 4 is used for placing the water absorbing cotton 403, when the cooling liquid in the cooling bin 2 is heated, a certain degree of evaporation will be generated, the steam generated by the evaporation will rise and enter the placing groove 4 through the air holes 401, the steam entering the placing groove 4 will be absorbed by the water absorbing cotton 403, when the water absorbing cotton 403 absorbs a specified amount of cooling liquid, the fixed cover plate 402 is removed and replaced with another dry water absorbing cotton 403, and the replaced water absorbing cotton 403 can be used after drying treatment.

[0032] An arc-shaped water receiving groove 404 is fixedly installed below the two sides of the mainframe box 1 and below the placing groove 4, a water inlet hole 405 is formed in the inner wall of the water receiving groove 404, the water inlet hole 405 is communicated with the cooling bin 2, a sealing plug 406 is inserted in the water inlet hole 405, the water receiving groove 404 is used for receiving the overflow of the cooling liquid absorbed by the water absorbing cotton 403, when the water receiving groove 404 receives the cooling liquid, the cooling liquid can flow back into the cooling bin 2 through the water inlet hole 405 by pulling out the sealing plug 406, and the water receiving groove 404 cooperates with the water inlet hole 405 to facilitate the supplement of the cooling liquid in the cooling bin 2.

[0033] Two symmetrical U-shaped exhaust pipes 105 are fixedly installed on the inner wall of the mainframe box 1, the exhaust pipe 105 penetrates through the mainframe box 1 and extends into the cooling bin 2, a heat dissipation bin 302 is formed in the top plate 3, a U-shaped exhaust pipe 303 is fixedly installed in the heat dissipation bin 302, an exhaust fan 304 is fixedly installed in the exhaust pipe 303, the two ends of the exhaust pipe 303 penetrate through the top plate 3, one end of the exhaust pipe 105 away from the cooling bin 2 is inserted into one end of the exhaust pipe 303, when the top plate 3 is inserted into the installation groove 101, the exhaust pipe 105 is inserted with the corresponding exhaust pipe 303, when the high-performance computer is running, the exhaust fan 304 is rotated to exhaust the hot air in the mainframe box 1 and discharge it into the exhaust pipe 105, the hot air in the exhaust pipe 105 will enter the cooling bin 2 under the continuous action of the exhaust fan 304, and the accumulation of the hot air in the mainframe box 1 can be avoided.

[0034] The inner wall of the cooling bin 2 is provided with a lifting chute 208, and a lifting block 209 is slidingly installed in the lifting chute 208. One side of the lifting block 209 extends out of the lifting chute 208 and is fixedly installed with a bellows 210. One end of the bellows 210 is fixedly connected with one end of the air exhaust pipe 105 extending into the cooling bin 2. The other end of the bellows 210 is fixedly installed with an extension pipe 211 of U-shaped structure. The hot air entering the air exhaust pipe 105 is finally discharged into the cooling liquid in the cooling bin 2 through the bellows 210 and the extension pipe 211. The hot air is cooled after passing through the cooling liquid. The lifting block 209 is an electric sliding block. The bellows 210 can be folded or stretched by the lifting block 209, and the extension pipe 211 is lifted in the cooling bin 2 synchronously. The outer wall of the extension pipe 211 is installed with an induction module, which can automatically adjust according to the height of the cooling liquid in the cooling bin 2, so that the end of the extension pipe 211 away from the bellows 210 is always inserted into the cooling liquid.

[0035] The outer wall of the host box body 1 is provided with a plurality of inclined air inlets 106 at both ends. The air inlets 106 penetrate the host box body 1. One end of the outer wall of the host box body 1 is provided with a push plate 107. The installation position of the push plate 107 is consistent with the opening position of the air inlet 106. Two symmetrical electric cylinders 108 are fixedly installed in the host box body 1. The extension end of the electric cylinder 108 penetrates the host box body 1 and is fixedly connected with the push plate 107. The air inlet 106 is used for air intake and exhaust in the host box body 1. The electric cylinder 108 can drive the push plate 107 to reciprocate by extension and contraction. The hot air in the host box body 1 can be pushed by the reciprocating movement of the push plate 107 cooperating with the air inlet 106, which can further improve the exhaust efficiency of the hot air.

[0036] Further, the above-mentioned fixed connection should be understood in a broad sense unless otherwise specified and limited, for example, it can be welding, gluing, or integrally formed with other conventional means familiar to those skilled in the art.

[0037] The above is only a preferred embodiment of the present application, but the protection scope of the present application is not limited thereto. Any skilled person in the art can make equivalent replacement or change according to the technical solution and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A heat dissipating case for high performance computer, comprising a main case body (1), characterized in that: The main box body (1) is in rectangular sealed structure, the cooling bin (2) of U-shaped structure is arranged in the main box body (1), the mounting groove (101) is formed in the top of the main box body (1), the top plate (3) is inserted in the mounting groove (101), the mounting rack (301) is fixedly installed on the bottom of the top plate (3); The inner wall of the cooling bin (2) is fixedly installed with a plurality of heat dissipation copper pipes (201), both ends of the heat dissipation copper pipe (201) penetrate the main box body (1), the plurality of heat dissipation copper pipes (201) are divided into two groups and are distributed in a straight line, the side of the main box body (1) is provided with two symmetrically arranged air inlet grooves (102), a plurality of fixed supports (103) are fixedly installed on the inner wall of the air inlet groove (102) and are distributed in a straight line, the installation positions of the plurality of fixed supports (103) correspond to the installation positions of the plurality of heat dissipation copper pipes (201) one by one, and the fixed support (103) is fixedly installed with a heat dissipation fan (104); The inner wall bottom of the cooling bin (2) is provided with a moving groove (202), the inner wall of the moving groove (202) is provided with a fixed tooth groove (203), the cooling bin (2) is provided with a C-shaped moving frame (204), the bottom of the moving frame (204) is slidably connected with the moving groove (202), the bottom of the moving frame (204) is rotatably installed with a driving gear (205) in the moving groove (202), the driving gear (205) is engaged with the fixed tooth groove (203), the outer wall of the heat dissipation copper pipe (201) is provided with a pushing ring (206), the pushing rings (206) on the outer walls of the plurality of heat dissipation copper pipes (201) are fixedly connected through the connecting supports, the plurality of fixedly connected pushing rings (206) are fixedly connected with the moving frame (204), a rotating ring (207) is rotatably installed on one side of the pushing ring (206), the outer wall of the rotating ring (207) is fixedly installed with stirring blades, and threads are formed on the outer wall of the heat dissipation copper pipe (201) and the inner wall of the rotating ring (207); The inner wall of the main box body (1) is fixedly installed with two symmetrically arranged U-shaped exhaust pipes (105), the exhaust pipe (105) penetrates the main box body (1) and extends into the cooling bin (2), the top plate (3) is provided with a heat dissipation bin (302), the heat dissipation bin (302) is fixedly installed with a U-shaped exhaust pipe (303), the exhaust pipe (303) is fixedly installed with an exhaust fan (304), both ends of the exhaust pipe (303) penetrate the top plate (3), and one end of the exhaust pipe (105) away from the cooling bin (2) is inserted into one end of the exhaust pipe (303); The inner wall of the cooling bin (2) is provided with a lifting sliding groove (208), a lifting sliding block (209) is slidably installed in the lifting sliding groove (208), one side of the lifting sliding block (209) extends out of the lifting sliding groove (208) and is fixedly installed with a bellows (210), one end of the bellows (210) is fixedly connected with one end of the exhaust pipe (105) extending into the cooling bin (2), and the other end of the bellows (210) away from the exhaust pipe (105) is fixedly installed with a U-shaped extension pipe (211).

2. The heat dissipation case for high performance computer according to claim 1, wherein: The two sides of the mainframe box (1) are provided with placing grooves (4), and the two placing grooves (4) are respectively arranged at the top of the two ends of the cooling bin (2) with a U-shaped structure; a plurality of air holes (401) are arranged on the inner wall bottom of the placing groove (4) and are communicated with the cooling bin (2); and a fixed cover plate (402) is arranged in the placing groove (4), and a water absorbing cotton bar (403) is arranged on the side of the fixed cover plate (402) close to the corresponding placing groove (4).

3. The heat dissipation case for high performance computer according to claim 2, wherein: The two sides of the mainframe box (1) are provided with placing grooves (4), and the two placing grooves (4) are respectively arranged at the top of the two ends of the cooling bin (2) with a U-shaped structure; a plurality of air holes (401) are arranged on the inner wall bottom of the placing groove (4) and are communicated with the cooling bin (2); and a fixed cover plate (402) is arranged in the placing groove (4), and a water absorbing cotton bar (403) is arranged on the side of the fixed cover plate (402) close to the corresponding placing groove (4).

4. The heat dissipation case for high performance computer according to claim 1, wherein: The two ends of the outer wall of the mainframe box (1) are provided with a plurality of inclined air inlets (106), the air inlets (106) penetrate through the mainframe box (1), one end of the outer wall of the mainframe box (1) is provided with a push plate (107), the installation position of the push plate (107) is consistent with the opening position of the air inlet (106), two symmetrical electric cylinders (108) are fixedly installed in the mainframe box (1), and the telescopic ends of the electric cylinders (108) penetrate through the mainframe box (1) and are fixedly connected with the push plate (107).

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