Copper-steel multi-layer composite board conductive part and preparation method thereof

Abstract

The invention provides a copper-steel multilayer composite board conductive part and a preparation method thereof, and the preparation method comprises the steps: providing a copper-steel layered composite strip with double-sided copper cladding, and the copper layer thickness of the first surface of the copper-steel layered composite strip is greater than the copper layer thickness of the second surface of the copper-steel layered composite strip; the copper-steel layered composite strip is punched and formed, and a copper-steel composite punched part is obtained; the second surfaces of the two copper-steel composite stamping parts are welded to form a copper-steel composite part of a multi-layer composite structure; carrying out finish machining on the copper-steel composite part; and electroplating the copper-steel composite part to obtain the copper-steel multi-layer composite board conductive part. The processing method is simple, the yield is high, the interface bonding strength of the ultra-thick copper-steel composite board can be effectively improved, and the prepared copper-steel multilayer composite board conductive part has the characteristics of high strength, low cost, excellent conductivity and the like.

Description

Technical Field

[0001] The invention relates to the field of low-voltage electrical components, and in particular to a copper-steel multilayer composite plate conductive part and a preparation method thereof. Background Art

[0002] In the fields of electricity, electronics, new energy, ships, etc., the performance of conductive parts directly affects the reliability and stability of equipment. Traditional conductive parts are mostly made of high-cost pure copper or copper alloy materials. Although they have good electrical conductivity and thermal conductivity, they have low strength and poor high-temperature creep resistance, making it difficult to meet the application requirements of high strength, high temperature resistance, low cost, or corrosion resistance (such as large machine tool slides, large-span conductive copper bars, etc.). Copper-steel composite plates combine the high conductivity of copper and the high strength of steel, making them an ideal conductive material.

[0003] The copper-steel composite plate coating required for some special use environments is relatively thick, and its thickness exceeds 6mm. It is difficult to achieve good interface bonding through conventional rolling composite processes, resulting in insufficient interface bonding strength of the composite plate, which is easy to crack, affecting the conductive performance and service life of the conductive parts. For example, patent CN114864305A compounds copper materials of asymmetric thickness on the upper and lower surfaces of iron or low-carbon steel strips to obtain heterogeneous copper-steel composite strips, which are widely used in the production of low-voltage electrical appliance supports with high current levels. However, when this method produces thicker copper-steel composite plates, the composite interface is prone to delamination, cracking, wrinkling and other problems, which seriously affects the yield and service life of the copper-steel composite plate conductive parts.

[0004] Existing thick copper-steel composite plates and conductive parts made of such composite plates are mostly prepared by explosive compounding. Patent CN106141413A discloses an explosive welding method for ultra-thick plates, which realizes compounding of 20mm thick plates on steel substrates by arranging a plane wave generator at the prefabricated detonation point. However, its preparation process is complicated, the raw materials and explosives required for the explosion are controlled, and the cost is high, which makes it difficult to meet the needs of large-scale and safe production.

[0005] Therefore, it is now necessary to develop a high-strength, low-cost copper-steel multilayer composite plate conductive member and a preparation method thereof to solve at least one of the above technical problems. Summary of the invention

[0006] In view of the defects in the prior art, an object of the present invention is to provide a copper-steel multilayer composite plate conductive member and a preparation method thereof.

[0007] According to one aspect of the present invention, there is provided a method for preparing a copper-steel multilayer composite plate conductive member, comprising:

[0008] A double-sided copper-clad copper-steel layered composite strip is provided, wherein the copper layer thickness on the first surface of the copper-steel layered composite strip is greater than the copper layer thickness on the second surface;

[0009] The copper-steel layered composite strip is punched and formed to obtain a copper-steel composite punching part;

[0010] Welding the second surfaces of the two copper-steel composite stampings to form a copper-steel composite part with a multi-layer composite structure;

[0011] Performing fine processing on the copper-steel composite parts;

[0012] The copper-steel composite part is electroplated to obtain a copper-steel multilayer composite plate conductive part.

[0013] Optionally, providing the copper-steel layered composite strip with double-sided copper cladding includes: first stacking copper material, iron material, and copper material in sequence, and then rolling and cladding them.

[0014] Optionally, the deformation reduction of the rolling composite is 30% to 75%.

[0015] Optionally, the thickness of the copper layer on the first surface accounts for 10% to 45% of the total thickness of the copper-steel layered composite strip; the thickness of the copper layer on the second surface accounts for 2% to 5% of the total thickness of the copper-steel layered composite strip.

[0016] Optionally, the second surfaces of the two copper-steel composite stampings are welded to form a copper-steel composite part with a multi-layer composite structure, wherein any one of diffusion welding, induction welding, resistance welding and laser welding is adopted.

[0017] Optionally, when the diffusion welding is used for welding, the temperature is 600° C. to 850° C., the time is 5 seconds to 60 seconds, and the atmosphere is any one of air, N2 and Ar atmospheres.

[0018] Optionally, when the diffusion welding is used for welding, the welding solder is a copper-based or silver-based solder, which is added in the form of welding sheets or welding paste.

[0019] Optionally, the copper-steel composite part is subjected to finish machining, including: using at least one machining method of drilling, tapping and milling to machine positioning holes or threaded holes in the copper-steel composite part.

[0020] Optionally, the copper-steel composite part is electroplated, wherein: the electroplating adopts at least one of silver plating, nickel plating, tin plating and copper plating, and the thickness of the formed coating is 0.1um to 15um.

[0021] According to another aspect of the present invention, there is provided a copper-steel multilayer composite plate conductive part, which is prepared by the above-mentioned method for preparing a copper-steel multilayer composite plate conductive part, and the copper-steel multilayer composite plate conductive part comprises a first material layer to a fifth material layer in sequence, wherein the first material layer, the third material layer and the fifth material layer are copper layers, and the second material layer and the fourth material layer are iron layers; the first material layer and the fifth material layer are main conductive layers, and the thickness of the two is the same; the third material layer is a non-main conductive layer.

[0022] Compared with the prior art, the present invention has at least one of the following beneficial effects:

[0023] 1. The present invention can simultaneously stack and weld two copper-steel layered composite conductive parts through the welding connection method of the copper-steel composite punching parts to form a thicker copper-steel multi-layer composite plate conductive part, which effectively solves the problems of 6-12 mm thick copper-steel composite plates being difficult to roll and composite, insufficient interface bonding strength of thick copper-steel composite plates, and easy delamination and cracking. It can improve the interface bonding strength of ultra-thick copper-steel composite plates, thereby improving the yield rate and service life of conductive parts products.

[0024] 2. The present invention replaces the original copper conductive parts by alternately compounding or welding copper and steel, which not only greatly reduces the consumption of precious metal copper resources, but also makes the conductive parts have the advantages of good conductivity and plasticity of copper and high strength and low cost of steel, thereby improving the conductivity, strength, high temperature resistance and breaking performance of the copper-steel multilayer composite plate conductive parts, and can meet the use requirements of thicker conductive copper bars of intelligent frame circuit breakers and ultra-thick conductive copper bars of knife switches.

[0025] 3. Compared with the existing process of preparing ultra-thick copper-steel composite materials by explosive compounding, the process of the present invention is simple, the raw materials are not limited, and it is easy to mass produce. At the same time, there is no need to strictly control the safety of raw materials and equipment to achieve safe production, which greatly reduces the production cost of conductive parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0027] Figure 1 It is a schematic diagram of a process for preparing a copper-steel multilayer composite plate conductive member according to an embodiment of the present invention;

[0028] Figure 2 This is a schematic structural diagram of a copper-steel layered composite strip with double-sided copper cladding in one embodiment of the present invention;

[0029] Figure 3 Schematic diagram of the cross-sectional structure of a double-sided copper-clad copper-steel layered composite strip in one embodiment of the present invention;

[0030] Figure 4 A schematic structural diagram of a copper-steel composite part of a multi-layer composite structure in one embodiment of the present invention;

[0031] Figure 5 A schematic diagram of the cross-sectional structure of a copper-steel composite part with a multi-layer composite structure in one embodiment of the present invention;

[0032] In the figure, the reference numerals correspond to: 1 - copper-steel layered composite strip, 2 - copper-steel composite part, 3 - copper layer on the first surface, 3' - copper layer on the second surface, 4 - iron layer. DETAILED DESCRIPTION

[0033] The present invention is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those of ordinary skill in the art, several variations and improvements may be made without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0034] Figure 1 The schematic diagram of the process of preparing the copper-steel multilayer composite plate conductive member provided by one embodiment of the present invention is shown. Figure 1 As shown, a method for preparing a copper-steel multilayer composite plate conductive member provided by an embodiment of the present invention comprises the following steps:

[0035] S1, such as Figure 2 and Figure 3 As shown, a copper-steel layered composite strip 1 with double-sided copper cladding is provided. The composite strip has a special-shaped structure. The thickness of the copper layer 3 on the first surface of the copper-steel layered composite strip 1 is greater than the thickness of the copper layer 3' on the second surface, and there is an iron layer 4 in the middle;

[0036] S2, punching and forming the copper-steel layered composite strip 1 to obtain a copper-steel composite punching part with a special-shaped structure; in this step, according to the structure of the required conductive part, the outer contour is punched out in advance to facilitate subsequent welding, and the process parameters of the punching process are determined according to the hardness and thickness of the conductive part product;

[0037] S3, the second surfaces of the two copper-steel composite stampings are welded to form a copper-steel composite part 2 with a multi-layer composite structure, such as Figure 4 and Figure 5 As shown;

[0038] S4, finishing the copper-steel composite part 2, that is, processing a connection hole on the copper-steel composite part 2 so that the conductive part can be fixed in position or installed in an electrical appliance such as a switch;

[0039] S5. Electroplating the copper-steel composite part 2 to obtain a copper-steel multilayer composite plate conductive part.

[0040] The embodiment of the present invention can solve the problems of the existing copper-steel composite plates with a thickness exceeding 6 mm being difficult to roll and composite, the composite interface being prone to delamination and cracking, and the interface bonding strength being insufficient, and the existing explosive composite method for preparing ultra-thick copper-steel composite plates being difficult to find raw materials, having a complex process, high production costs, and difficult safety control through welding connection of copper-steel composite stampings. The processing method provided by the embodiment of the present invention is simple, and can improve the interface bonding strength of ultra-thick copper-steel composite plates, thereby improving the yield rate and service life of conductive products.

[0041] The embodiment of the present invention replaces the original copper conductive parts by alternately compounding or welding copper and steel, which not only greatly reduces the consumption of precious metal copper resources, but also makes the conductive parts have the advantages of good conductivity and plasticity of copper and high strength and low cost of steel, thereby improving the conductivity, strength, high temperature resistance and breaking performance of the copper-steel multilayer composite plate conductive parts, and can meet the use requirements of thicker conductive copper bars of intelligent frame circuit breakers and ultra-thick conductive copper bars of knife switches.

[0042] The above-mentioned double-sided copper-clad copper-steel composite strip with a special structure refers to the copper layer thickness of the upper and lower surfaces of the double-sided copper-clad copper-steel layered composite strip 1 being different. In some embodiments, the thickness of the copper layer 3 on the first surface accounts for 10% to 45% of the total thickness of the copper-steel layered composite strip 1, which is the main conductive layer of the copper-steel composite strip; the thickness of the copper layer 3' on the second surface accounts for 2% to 5% of the total thickness of the copper-steel layered composite strip 1, which is the non-main conductive layer of the copper-steel composite strip. The above-mentioned copper layer thickness parameter is mainly set according to factors such as the current level and weldability of the conductive part, so that in the subsequent steps, the non-main conductive layer of the copper-steel composite stamping can be firmly welded together.

[0043] In order to provide a copper-steel layered composite strip 1 with double-sided copper cladding of a special-shaped structure, in some embodiments, in step S1, copper material, iron material, and copper material are first stacked in sequence, and then rolled and composited. Exemplarily, the material of the copper material is any one of pure copper, red copper, oxygen-free copper, and copper alloy; the material of the iron material is any one of iron, iron alloy, stainless steel, low-carbon steel, silicon steel, structural steel, and alloy steel.

[0044] In some preferred embodiments, the iron material is made of stainless steel such as SUS430, which can not only guide the direction of the arc, but also improve the corrosion resistance of the copper-steel multi-layer composite plate conductive product.

[0045] The above rolling compound refers to any one of cold rolling compound, hot rolling compound and warm rolling compound. Among them, hot rolling compound and warm rolling compound are compounded in a reducing atmosphere or vacuum environment, and the compounding temperature is 500℃~950℃. Cold rolling compound is compounded at room temperature and air environment. In this way, a copper-steel composite strip with good composite interface and no defects such as delamination can be obtained.

[0046] During the rolling and compounding process, the deformation reduction is mainly set according to factors such as the type of composite rolling method, the different ductility of copper and steel, and work hardening characteristics, so as to obtain a copper-steel composite strip with good composite interface bonding, no wrinkles, no delamination, and electrical conductivity, high temperature resistance and other properties that meet the requirements of circuit breaker products. In some embodiments, the deformation reduction of rolling and compounding is 30% to 75%.

[0047] In some embodiments, the second surfaces of two copper-steel composite stampings are welded to form a copper-steel composite part 2 of a multi-layer composite structure, wherein: the two copper-steel composite stampings are connected by any one of diffusion welding, induction welding, resistance welding and laser welding, so that the non-main conductive copper layers of the two copper-steel composite stampings are welded together to form a copper-steel composite part 2 of a five-layer composite structure. The first material layer, the third material layer and the fifth material layer of the five-layer composite structure are all copper materials; the second material layer and the fourth material layer are both iron materials.

[0048] In some embodiments, when diffusion welding is used for welding, the temperature is 600°C to 850°C, the time is 5 seconds to 60 seconds, and the atmosphere is any one of air, N2 and Ar atmosphere. The welding solder is a copper-based or silver-based solder, and the material of the copper-based solder is any one of pure copper, red copper, oxygen-free copper, or copper alloy, and is added in the form of solder sheet or solder paste.

[0049] In the above embodiments, diffusion welding is achieved by diffusion between atoms under high temperature and high pressure. Compared with other methods, the heat affected zone of diffusion welding is smaller, and the heating is uniform and the cooling is slow, so that the residual stress of diffusion welding is small, the deformation is small, and large-area joints can be welded.

[0050] Through the above-mentioned embodiments, a copper-steel composite part 2 having a diffusion layer of a certain thickness at the welding interface and good bonding at the welding interface can be obtained.

[0051] In some embodiments, the copper-steel composite part 2 is finely processed, including: using at least one processing method of drilling, tapping and milling to process positioning holes or threaded holes in the welded copper-steel composite part 2, so that the conductive part can be installed in products or equipment such as low-voltage electrical appliances.

[0052] In some embodiments, the copper-steel composite part 2 is electroplated, wherein: the electroplating adopts at least one of silver plating, nickel plating, tin plating and copper plating, and the thickness of the formed plating layer is 0.1um to 15um. In this way, the conductive part can be firmly welded with the electrical contact or other parts without affecting the rust-proof effect.

[0053] In the above embodiment of the present invention, the finished product is obtained by rolling the semi-finished copper-steel composite plate and stacking and welding the semi-finished copper-steel composite plate. Compared with the existing preparation method, the process is simple in processing method, easy to batch, and can form a copper-steel composite plate conductive part with a thickness of more than 6 mm and good composite interface bonding under conventional production conditions.

[0054] The copper-steel multilayer composite plate conductor prepared in the above embodiment of the present invention includes the first material layer to the fifth material layer in sequence, wherein the first material layer, the third material layer and the fifth material layer are copper layers, and the second material layer and the fourth material layer are iron layers; the first material layer and the fifth material layer are main conductive layers, and the thickness of the two is the same; the third material layer is a non-main conductive layer. The conductor prepared in the above embodiment of the present invention combines the advantages of both copper and steel. When the current is loaded on the copper-steel multilayer composite plate conductor in the embodiment of the present invention, it mainly passes through the main conductive copper layer of the conductor; the iron material layer in the conductor provides high-strength support for the conductor and guides the direction of the switch arc, and under high temperature conditions, it will not soften and deform like a pure copper conductor. Therefore, the copper-steel multilayer composite plate conductor prepared by this process has significantly improved strength, high temperature creep resistance and breaking performance without losing conductive performance. The conductor has the characteristics of high strength, low cost, excellent conductive performance, etc., and can effectively replace copper conductors in the fields of electricity, electronics, new energy, etc.

[0055] The scheme of the present application will be explained below in conjunction with specific embodiments and comparative examples. It will be appreciated by those skilled in the art that the following examples are only used to illustrate the present application and should not be considered as limiting the scope of the present application. If no specific technology or conditions are indicated in the embodiments, the technology or conditions described in the literature in this area or the product specification are carried out. The reagents used or the instruments that do not indicate the manufacturer are all conventional products that can be obtained through commercial channels.

[0056] Example 1

[0057] This example was prepared as Figure 2-Figure 5 The Cu / Fe / Cu / Fe / Cu copper-steel multilayer composite plate conductive member comprises the following steps:

[0058] S1: First, pure Cu sheet, Fe sheet and Cu sheet are stacked in sequence, and then cold-rolled and laminated at room temperature and atmospheric atmosphere with a deformation reduction of 55%, to obtain a 3mm thick Cu / Fe / Cu three-layer composite strip with a special-shaped structure. Among them, one copper layer is the main conductive layer of the Cu / Fe / Cu composite strip, and its thickness accounts for 20% of the total thickness of the Cu / Fe / Cu composite strip; the other copper layer is the non-main conductive layer of the Cu / Fe / Cu composite strip, and its thickness accounts for 3% of the total thickness of the Cu / Fe / Cu composite strip.

[0059] S2: According to the outer contour shape of the required conductive product, the Cu / Fe / Cu composite strip obtained in S1 is punched and formed to obtain a Cu / Fe / Cu copper-steel three-layer composite punching part;

[0060] S3: stacking two Cu / Fe / Cu three-layer composite stampings and placing them in a diffusion welding device so that the non-main conductive copper layers of the two Cu / Fe / Cu three-layer composite parts are in surface contact, adding a copper-based welding sheet at the contact interface, and performing diffusion welding in a N2 atmosphere at a diffusion welding temperature of 800°C for 40 seconds, using a copper-based welding sheet as the solder, to obtain a copper-steel composite part with a Cu / Fe / Cu / Fe / Cu five-layer composite structure;

[0061] S4: The welded Cu / Fe / Cu / Fe / Cu copper-steel composite parts are processed into threads by drilling and tapping.

[0062] S5: The Cu / Fe / Cu / Fe / Cu copper-steel composite part obtained in S4 is first cleaned, and then a layer of 8um thick pure silver is electroplated on the surface to obtain a 6mm thick Cu / Fe / Cu / Fe / Cu copper-steel multilayer composite plate conductive part.

[0063] Example 2

[0064] In this embodiment, a T2 / SUS430 / T2 / SUS430 / T2 copper-steel multilayer composite plate conductive member is prepared, including the following steps:

[0065] S1: First, T2 plate, SUS430 stainless steel plate and T2 plate are stacked in sequence, and then hot-rolled and laminated with a deformation reduction of 65% in a nitrogen-hydrogen mixed atmosphere at a temperature of 870°C to obtain a T2 / SUS430 / T2 three-layer composite strip with a special structure. Among them, one copper layer is the main conductive layer of the T2 / SUS430 / T2 composite strip, and its thickness accounts for 40% of the total thickness of the T2 / SUS430 / T2 composite strip; the other copper layer is the non-main conductive layer of the T2 / SUS430 / T2 composite strip, and its thickness accounts for 5% of the total thickness of the T2 / SUS430 / T2 composite strip.

[0066] S2: The T2 / SUS430 / T2 composite strip obtained in S1 is punched and formed to obtain a T2 / SUS430 / T2 copper-steel three-layer composite punching part;

[0067] S3: Stack two T2 / SUS430 / T2 three-layer composite stampings, add a copper-based welding sheet at the contact interface, and perform induction welding to weld the non-main conductive copper layers of the two T2 / SUS430 / T2 three-layer composite parts together to obtain a copper-steel composite part with a T2 / SUS430 / T2 / SUS430 / T2 five-layer composite structure;

[0068] S4: Finishing treatment of copper-steel composite parts after diffusion welding; drilling and milling are used to process positioning holes in T2 / SUS430 / T2 / SUS430 / T2 copper-steel composite parts after welding.

[0069] S5: electroplating a 6um thick layer of tin on the surface of the T2 / SUS430 / T2 / SUS430 / T2 copper-steel composite part obtained in S4 to obtain the desired copper-steel multilayer composite plate conductive part.

[0070] Comparative Example

[0071] The comparative example provides a Cu / Fe / Cu three-layer composite material prepared by a conventional plate rolling method.

[0072] The copper-steel multilayer composite plate conductive part sample prepared in Example 1 was compared with the Cu / Fe / Cu three-layer composite conductive part with the same thickness prepared by the conventional plate rolling method in the comparative example, and the interface bonding strength (peel strength), mechanical life, temperature rise, and yield rate were evaluated. The detailed results are shown in Table 1 below. The characterization results of the samples in Example 2 are close to those in Example 1.

[0073] Table 1 Test results of interface bonding strength, mechanical life, temperature rise and yield rate

[0074]

[0075] It can be seen from Table 1 that copper-steel composite conductive parts for use in low-voltage electrical appliances and the like are prepared by the method in the embodiment of the present invention, which have higher strength, longer mechanical life, lower temperature rise, and higher yield.

[0076] The above-mentioned embodiments of the present invention can effectively improve the processable thickness and strength of the product and extend the service life of electrical appliances such as circuit breakers by only using rolling and welding. The processing method is simple, suitable for large-scale production, and has a high yield rate, thereby reducing costs.

[0077] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various modifications or variations within the scope of the claims, which does not affect the essence of the present invention. The above preferred features can be used in any combination without conflicting with each other.

Claims

1. A method for preparing a copper-steel multilayer composite plate conductive member, characterized in that: include: A double-sided copper-clad copper-steel layered composite strip is provided, wherein the copper layer thickness on the first surface of the copper-steel layered composite strip is greater than the copper layer thickness on the second surface; The copper-steel layered composite strip is punched and formed to obtain a copper-steel composite punching part; Welding the second surfaces of the two copper-steel composite stampings to form a copper-steel composite part with a multi-layer composite structure; Performing fine processing on the copper-steel composite parts; The copper-steel composite part is electroplated to obtain a copper-steel multilayer composite plate conductive part.

2. The method for preparing the copper-steel multilayer composite plate conductive member according to claim 1, characterized in that: The method of providing a copper-steel layered composite strip with double-sided copper cladding comprises: firstly stacking a copper material, an iron material, and a copper material in sequence, and then rolling and cladding them.

3. The method for preparing the copper-steel multilayer composite plate conductive member according to claim 2, characterized in that: The deformation reduction amount of the rolling composite is 30% to 75%.

4. The method for preparing the copper-steel multilayer composite plate conductive member according to claim 1, characterized in that: The thickness of the copper layer on the first surface accounts for 10% to 45% of the total thickness of the copper-steel layered composite strip; the thickness of the copper layer on the second surface accounts for 2% to 5% of the total thickness of the copper-steel layered composite strip.

5. The method for preparing the copper-steel multilayer composite plate conductive member according to claim 1, characterized in that: The second surfaces of the two copper-steel composite stampings are welded to form a copper-steel composite part with a multi-layer composite structure, wherein any one of diffusion welding, induction welding, resistance welding and laser welding is used.

6. The method for preparing the copper-steel multilayer composite plate conductive member according to claim 5, characterized in that: When the diffusion welding is used for welding, the temperature is 600° C. to 850° C., the time is 5 seconds to 60 seconds, and the atmosphere is any one of air, N2 and Ar atmospheres.

7. The method for preparing the copper-steel multilayer composite plate conductive member according to claim 5, characterized in that: When the diffusion welding is used for welding, the welding solder is a copper-based or silver-based solder, which is added in the form of welding sheets or welding paste.

8. The method for preparing the copper-steel multilayer composite plate conductive member according to claim 1, characterized in that: The copper-steel composite part is finely processed, including: using at least one processing method of drilling, tapping and milling to process positioning holes or threaded holes in the copper-steel composite part.

9. The method for preparing the copper-steel multilayer composite plate conductive member according to claim 1, characterized in that: The copper-steel composite parts are electroplated, wherein: the electroplating adopts at least one of silver plating, nickel plating, tin plating and copper plating, and the thickness of the formed plating layer is 0.1um-15um.

10. A copper-steel multilayer composite plate conductive member, characterized in that: The copper-steel multilayer composite plate conductive part is prepared by the preparation method of any one of claims 1 to 9, wherein the copper-steel multilayer composite plate conductive part comprises a first material layer to a fifth material layer in sequence, wherein the first material layer, the third material layer and the fifth material layer are copper layers, and the second material layer and the fourth material layer are iron layers; the first material layer and the fifth material layer are main conductive layers, and the thickness of the two layers is the same; the third material layer is a non-main conductive layer.

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