Power amplification module base used at low temperature and optimization design method thereof

Abstract

The invention discloses a power amplification module base used at low temperature and an optimization design method thereof, and relates to the technical field of laser components, the power amplification module base comprises a base plate, a fixing assembly is arranged at the position, close to one side, of the top of the base plate, a floating assembly is arranged at the position, close to the other side, of the top of the base plate, and a first heat sink is fixedly installed at the top of the fixing assembly; the second heat sink is fixedly installed on the top of the floating assembly, a gain medium is installed between the first heat sink and the second heat sink, the first heat sink and the second heat sink are both fixedly connected with the gain medium in an indium welding mode, and the first heat sink is fixed to the base plate through the fixing assembly. The floating assembly enables the second heat sink to move slightly in the X direction, the Y direction and the Z direction relative to the base plate. The base solves the problem that an existing base is affected by tensile stress in a low-temperature environment, so that the power amplification module is subjected to open welding, the base is suitable for fixing and supporting the power amplification module in the low-temperature environment, stress is uniform, and local stress concentration is prevented.

Description

Technical Field

[0001] The invention relates to the technical field of laser components, and in particular to a power amplification module base for low temperature and an optimization design method thereof. Background Art

[0002] The power amplifier module is the core component of the laser, which is used to absorb the energy brought by the excitation source and achieve the function of power amplification. The power amplifier module includes a gain medium, a heat sink and a base. Among them, the base mainly plays a supporting role and is usually fixed on the heat sink to ensure that the power amplifier module has good stability and reliability. After the gain medium in the power amplifier module is stimulated to radiate, the power is amplified and heat is generated. Heat accumulation will reduce the quality and service life of the laser spot, so a cooling medium is required to cool it down so that it can be used normally. For low-power, low-energy power amplifier modules, water is often used as a cooling medium; for high-power, high-energy power amplifier modules, liquid nitrogen is often used as a cooling medium.

[0003] At present, the base of high-power, high-energy power amplifier modules generally adopts an integrated structure of stainless steel material, which is connected to the left and right heat sinks by bolts. This structure is evenly stressed and has good rigidity at room temperature, providing good support for the power amplifier module. However, in low-temperature environments, the left and right heat sinks will expand and contract, and the integrated base will stretch the heat sink under stress. Since the heat sink and the gain medium are connected by indium welding, the tensile stress will cause the power amplifier module to have a weld break, and it cannot be used normally. To address this problem, relevant practitioners generally use one side of the heat sink to connect to the base with bolts, and the other side of the heat sink to connect to the base with indium welding. Although this solves the effect of tensile stress on the heat sinks on both sides in low-temperature environments, under repeated high and low temperature conditions, the indium material is prone to tensile fatigue, resulting in weld break between the heat sink and the base, causing the power amplifier module and the base to become a cantilever structure. Figure 1 As shown in the figure, it is a force cloud diagram of the power amplifier module after the indium material is opened for welding. It can be seen that in a low temperature environment, the overall force of the power amplifier module is uneven and the local stress is too large, which will lead to a decrease in bending resistance, resulting in an optical path deviation, a decrease in power and spot quality, and the stability and reliability of the power amplifier module cannot be guaranteed. Therefore, it is necessary to provide a technical solution for a power amplifier module base in a low temperature environment. Summary of the invention

[0004] The purpose of the present invention is to provide a power amplifier module base for low temperature and an optimization design method thereof in order to solve the above problems.

[0005] The present invention achieves the above-mentioned purpose through the following technical solutions:

[0006] A power amplifier module base for low temperature, comprising a base plate, a fixing component is arranged near one side of the top of the base plate, a floating component is arranged near the other side of the top of the base plate, a first heat sink is fixedly installed on the top of the fixing component, a second heat sink is fixedly installed on the top of the floating component, a gain medium is installed between the first heat sink and the second heat sink, and the first heat sink and the second heat sink are fixedly connected to the gain medium by indium welding; the fixing component fixes the first heat sink on the base plate, and the floating component enables the second heat sink to move slightly in the X direction, the Y direction and the Z direction relative to the base plate; the fixing component comprises a connecting plate and a first insulating block, the first insulating block is placed at a position near one side of the top of the base plate, the connecting plate is placed on the top of the first insulating block, the base plate, the first insulating block and the connecting plate are all provided with first through holes at corresponding positions, and the base plate, the first insulating block, the connecting plate and the first heat sink are fixedly connected by first bolts.

[0007] Preferably, the floating assembly includes a connecting plate, a second insulating block and a top plate, the top plate is placed on the top of the seat plate near the other side, the second insulating block is placed on the top of the top plate, the connecting plate is placed on the top of the second insulating block, the top plate, the second insulating block and the connecting plate are provided with first through holes at corresponding positions, the top plate, the second insulating block, the connecting plate and the second heat sink are fixedly connected by first bolts, a mounting groove is provided at the bottom of the seat plate corresponding to the top plate, a bottom plate is matched in the mounting groove, a first placement groove is provided on one side of the top plate near the bottom position, the first placement groove is communicated with the bottom of the top plate, and the first placement groove is arranged along the width direction of the top plate. A straight-line distribution is provided in the first placement groove, and a plurality of ball bearings are arranged in the first placement groove, and the ball bearings are in a clearance fit state with the first placement groove. There are a plurality of first placement grooves and they are evenly distributed on the top plate, and a baffle is fixedly arranged on the side of the top plate close to the first placement groove, and a through groove is provided on the seat plate corresponding to the position of the first placement groove, and a second placement groove is provided on the top of the bottom plate corresponding to the position of the through groove, and a slide is provided in the second placement groove, and the slide crosses the through groove and its top surface contacts with the ball bearings, and second through holes are provided at corresponding positions of the seat plate and the bottom plate, and a disc spring is provided in the second through hole of the bottom plate, and the bottom plate is mounted on the seat plate by passing a second bolt through the disc spring.

[0008] Preferably, the cross section of the first placement groove is in the shape of a three-quarter circle with a notch.

[0009] Preferably, the length of the first placement groove is greater than the sum of diameters of a plurality of the balls.

[0010] Preferably, the width of the slide is greater than the diameter of the ball.

[0011] Preferably, the top of the connecting plate of the fixed assembly and the top of the connecting plate of the floating assembly are on the same horizontal plane.

[0012] Preferably, a protrusion is fixedly provided on the top of the connecting plate of the fixed component, and there are multiple protrusions distributed in parallel with each other, and the top of the protrusion fits with the bottom of the first heat sink; and a protrusion is fixedly provided on the top of the connecting plate of the floating component, and there are multiple protrusions distributed in parallel with each other, and the top of the protrusion fits with the bottom of the second heat sink.

[0013] Preferably, the seat plate is made of an iron-nickel alloy material; the connecting plate, the first insulating block and the second insulating block are all made of a quartz material.

[0014] Preferably, a material reduction groove is provided at a bottom position of the seat plate corresponding to the fixing assembly, and there are a plurality of the material reduction grooves which are evenly distributed on the seat plate.

[0015] A method for optimizing the design of a power amplifier module base at low temperatures comprises the following steps:

[0016] (1) constructing a geometric model of the gain medium, the first heat sink, the second heat sink, the fixed component, and the floating component using a three-dimensional modeling software;

[0017] (2) Import all geometric models constructed in step (1) into ANSYS software, select Static Structural and Steady State Thermal modules, and perform static structural analysis and steady-state temperature field analysis on them;

[0018] (3) defining the physical properties of the gain medium, the first heat sink, the second heat sink, the fixed component, and the floating component;

[0019] (4) All the constructed geometric models are then imported into the HyperMesh software. According to the structure of the geometric model, the idea of ​​meshing from two-dimensional to three-dimensional is adopted, and the geometric model is meshed by the ALL Quad method. The three-dimensional mesh refinement method is set according to the size of the geometric model, and the common nodes of the three-dimensional mesh are checked at the same time. By setting the mesh size, it is ensured that the number of mesh layers of each part of the geometric model meets the calculation requirements.

[0020] (5) Boundary conditions are set according to the connection relationship between the gain medium, the first heat sink, the second heat sink, the fixed component and the floating component. The contact mode between the first heat sink, the second heat sink and the gain medium is set to Bonded contact. The contact mode between the ball of the floating component and the first placement groove and the ball and the slide is set to Frictional contact. The connection mode between the second bolt and the base plate is set to Non-separation. The remaining parts are set to the default contact mode. The temperature values ​​of the first heat sink and the second heat sink are set to the temperature of the coolant used. The surface of the power amplifier module in contact with the surrounding environment is set to the thermal convection surface, and different convection heat transfer coefficients are set according to the experimental results.

[0021] (6) Displacement probes are respectively arranged on the gain medium, the surface of the base plate, and the upper edge of the second heat sink;

[0022] (7) Use Program Controlled to solve the calculation, and import the temperature field results into the static structure as the initial condition. Set the support of the seat plate as a fixed constraint, add a vertical upward bolt force to the first through hole of the seat plate, and add a vertical downward standard gravity to the overall geometric model; set the weak spring option in the calculation condition to Program Controlled, use the linear method to calculate, and after the calculation is completed, check the deformation result of the geometric model under low temperature conditions through the deformation of the geometric model;

[0023] (8) Repeat steps (1) to (7) to calculate the deformation results at different temperatures. According to the deformation amount of the power amplifier module, optimize the structure, repeatedly iterate the calculation, optimize the calculation results, and adjust the adjustment range of the floating assembly according to the final deformation result. In combination with the thickness of a single disc spring, the number of disc springs and the preload force of the second bolt are adaptively selected.

[0024] The beneficial effects of the present invention are as follows: (1) The present invention solves the problem that the existing base is affected by tensile stress in a low-temperature environment, causing the power amplifier module to have open welding. The present base is suitable for fixing and supporting the power amplifier module in a low-temperature environment, and its force is uniform, preventing local stress concentration; (2) The floating component allows the second heat sink to move slightly relative to the base plate in three directions: X, Y and Z, so that the tensile stress generated by the thermal expansion and contraction of the two heat sinks in a low-temperature environment can be balanced, and the adjustment amount in each direction is controllable; (3) The power amplifier module base is simple to install, easy to use, and has high stability and reliability; (4) The optimization design method of the power amplifier module base can effectively calculate the deformation of the power amplifier module, and repeatedly optimize the base structure through numerical simulation calculation results, saving design costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a force cloud diagram of the power amplifier module in the prior art;

[0026] Figure 2 It is a first stereoscopic diagram of the overall structure of the present invention;

[0027] Figure 3 It is a second stereoscopic diagram of the overall structure of the present invention;

[0028] Figure 4 It is a third stereoscopic diagram of the overall structure of the present invention;

[0029] Figure 5 It is a three-dimensional diagram of the fixed component and the floating component of the present invention;

[0030] Figure 6 is a cross-sectional view of a floating assembly of the present invention;

[0031] Figure 7 A three-dimensional diagram of the top plate of the present invention;

[0032] Figure 8 A three-dimensional diagram of the seat plate of the present invention;

[0033] Fig. 9 A three-dimensional diagram of the bottom plate of the present invention;

[0034] Fig.10 This is a force cloud diagram of the power amplifier module of the present invention.

[0035] Description of reference numerals:

[0036] 1. Power amplifier module; 11. Gain medium; 12. First heat sink; 13. Second heat sink; 14. Base plate; 141. First through hole; 142. Mounting slot; 143. Through slot; 144. Second through hole; 145. Reduction slot;

[0037] 21. fixing assembly; 211. connecting plate; 2111. protrusion; 212. first insulating block;

[0038] 22, floating assembly; 221, second insulating block; 222, top plate; 2221, first placement groove; 223, bottom plate; 2231, second placement groove; 224, baffle; 225, slide; 226, ball bearing;

[0039] 31. first bolt; 32. second bolt;

[0040] 4. Disc spring. DETAILED DESCRIPTION

[0041] The present invention will be further described below in conjunction with the accompanying drawings:

[0042] like Figure 2 , Figure 4 and Figure 5 As shown, the present invention provides a power amplifier module base for low temperature, including a base plate 14, a fixing component 21 is arranged near one side of the top of the base plate 14, and a floating component 22 is arranged near the other side of the top of the base plate 14. The first heat sink 12 is fixedly mounted on the top of the fixing component 21, and the second heat sink 13 is fixedly mounted on the top of the floating component 22. A gain medium 11 is installed between the first heat sink 12 and the second heat sink 13, and the first heat sink 12 and the second heat sink 13 are fixedly connected to the gain medium 11 by indium welding. The fixing component 21 fixes the first heat sink 12 on the base plate 14, and the floating component 22 allows the second heat sink 13 to move slightly in the X direction, the Y direction and the Z direction relative to the base plate 14. The fixing component 21 includes a connecting plate 211 and a first insulating block 212. The first insulating block 212 is placed near one side of the top of the base plate 14, and the connecting plate 211 is placed on the top of the first insulating block 212. First through holes 141 are provided at corresponding positions on the seat plate 14, the first insulating block 212 and the connecting plate 211. The seat plate 14, the first insulating block 212, the connecting plate 211 and the first heat sink 12 are fixedly connected by the first bolt 31. Specifically, a flat washer is sleeved on the first bolt 31, which then passes through the first through holes 141 of the seat plate 14, the first insulating block 212 and the connecting plate 211 in sequence, and finally engages with the threaded mounting hole at the bottom of the first heat sink 12 to achieve fixed connection of the seat plate 14, the first insulating block 212, the connecting plate 211 and the first heat sink 12.

[0043] like Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, in this embodiment, the floating assembly 22 includes a connecting plate 211, a second insulating block 221 and a top plate 222. The top plate 222 is placed on the top of the seat plate 14 near the other side, the second insulating block 221 is placed on the top of the top plate 222, and the connecting plate 211 is placed on the top of the second insulating block 221. The top plate 222, the second insulating block 221 and the connecting plate 211 are provided with first through holes 141 at corresponding positions. The top plate 222, the second insulating block 221, the connecting plate 211 and the second heat sink 13 are fixedly connected by a first bolt 31. Specifically, a flat washer is sleeved on the first bolt 31, and then passes through the first through holes 141 of the top plate 222, the second insulating block 221 and the connecting plate 211 in turn, and finally is threadedly matched with the mounting hole at the bottom of the second heat sink 13 to achieve a fixed connection between the top plate 222, the second insulating block 221, the connecting plate 211 and the second heat sink 13. The first bolt 31 not only has the function of positioning and tightening, but also can improve the shear resistance of the fixed component 21 and the floating component 22. The bottom of the seat plate 14 is provided with a mounting groove 142 at a position corresponding to the top plate 222, and the bottom plate 223 is provided in the mounting groove 142. Figure 6 and Figure 7As shown, a first placement groove 2221 is provided near the bottom position on one side of the top plate 222. The first placement groove 2221 is connected to the bottom of the top plate 222, and the first placement groove 2221 is distributed in a straight line along the width direction of the top plate 222. Among them, the cross-section of the first placement groove 2221 is a three-quarter circle shape with a notch, and the notch is located at the bottom position of the top plate 222. The bottom of the ball 226 extends through the notch to the outside of the first placement groove 2221 and contacts the top surface of the slide 225. A plurality of balls 226 are provided in the first placement groove 2221, and the balls 226 and the first placement groove 2221 are in a clearance fit state. The length of the first placement groove 2221 is greater than the sum of the diameters of the plurality of balls 226, that is, the number of balls 226 can be adjusted according to the length of the first placement groove 2221, but it is necessary to ensure that there is a mutual movement amount between any two adjacent balls 226. There are multiple first placement grooves 2221 and they are evenly distributed on the top plate 222. For example, in this embodiment, the number of first placement grooves 2221 is 4. Figure 5 As shown, a baffle 224 is fixedly provided on the side of the top plate 222 near the first placement groove 2221. The baffle 224 is fixedly installed on the side of the top plate 222 by screws. The baffle 224 can prevent the ball 226 in the first placement groove 2221 of the top plate 222 from falling out. Figure 6 , Figure 8 and Fig. 9 As shown, the seat plate 14 is provided with a through slot 143 at a position corresponding to the first placement slot 2221, and the top of the bottom plate 223 is provided with a second placement slot 2231 at a position corresponding to the through slot 143. A slide 225 is provided in the second placement slot 2231, and the slide 225 crosses the through slot 143 and its top surface is in contact with the ball 226. The width of the slide 225 is greater than the diameter of the ball 226. When the first heat sink 12 and the second heat sink 13 are subjected to thermal expansion and contraction in a low temperature environment to generate tensile stress, the ball 226 can be slightly moved and adjusted along the X direction and the Y direction on the slide 225. Second through holes 144 are provided at corresponding positions on the seat plate 14 and the bottom plate 223. A disc spring 4 is provided in the second through hole 144 of the bottom plate 223. The bottom plate 223 is installed on the seat plate 14 by passing the second bolt 32 through the disc spring 4. When the first heat sink 12 and the second heat sink 13 are subjected to thermal expansion and contraction and generate tensile stress in a low temperature environment, the ball 226 can squeeze the slide 225 to move slightly along the Z direction for adjustment.

[0044] like Figure 2 , Figure 3 and Figure 5 As shown, in this embodiment, when the power amplification module 1 is not subjected to stress, the top of the connecting plate 211 of the fixed component 21 and the top of the connecting plate 211 of the floating component 22 are on the same horizontal plane.

[0045] like Figure 2 and Figure 5As shown, in this embodiment, a protrusion 2111 is fixedly provided on the top of the connecting plate 211 of the fixed component 21, and there are multiple protrusions 2111 that are distributed in parallel with each other, and the top of the protrusion 2111 fits with the bottom of the first heat sink 12. A protrusion 2111 is fixedly provided on the top of the connecting plate 211 of the floating component 22, and there are multiple protrusions 2111 that are distributed in parallel with each other, and the top of the protrusion 2111 fits with the bottom of the second heat sink 13. The protrusion 2111 reduces heat transfer when the fixed component 21 is in direct contact with the first heat sink 12, and the floating component 22 is in direct contact with the second heat sink 13, and makes them evenly stressed.

[0046] like Figure 5 As shown, in this embodiment, the seat plate 14 is made of an iron-nickel alloy material, and specifically, the seat plate 14 can be made of 4J36 low expansion iron-nickel alloy. The connecting plate 211, the first insulating block 212 and the second insulating block 221 are all made of quartz material, and specifically, the connecting plate 211, the first insulating block 212 and the second insulating block 221 can be made of JGS1 quartz.

[0047] like Figure 4 As shown, in this embodiment, the bottom position of the seat plate 14 corresponding to the fixing assembly 21 is provided with a material reduction groove 145, and there are a plurality of material reduction grooves 145 evenly distributed on the seat plate 14. The material reduction grooves 145 can save the use of raw materials for production and reduce the weight of the seat plate 14.

[0048] like Fig.10 As shown, it is a force cloud diagram of the power amplifier module 1 of the present invention. It can be seen that in a low temperature environment, the power amplifier module 1 is subjected to uniform force as a whole, and the power amplifier module 1 has high stability and reliability.

[0049] The present invention also provides an optimization design method for a power amplifier module base at low temperature, comprising the following steps: (1) constructing a geometric model of a gain medium 11, a first heat sink 12, a second heat sink 13, a fixed component 21 and a floating component 22 by using a three-dimensional modeling software. (2) Importing all the geometric models constructed in step (1) into ANSYS software, selecting StaticStructural and Steady State Thermal modules, and performing static structural analysis and steady-state temperature field analysis on them. (3) Defining the physical properties of the gain medium 11, the first heat sink 12, the second heat sink 13, the fixed component 21 and the floating component 22. (4) Importing all the constructed geometric models into HyperMesh software, adopting the idea of ​​meshing from two-dimensional to three-dimensional according to the structure of the geometric model, and meshing the geometric model by the ALL Quad method; setting the three-dimensional mesh refinement method according to the size of the geometric model, and checking the common node situation of the three-dimensional mesh at the same time, and ensuring that the number of mesh layers of each part of the geometric model meets the calculation requirements by setting the mesh size. (5) According to the connection relationship between the gain medium 11, the first heat sink 12, the second heat sink 13, the fixed component 21 and the floating component 22, the boundary conditions are set, the contact mode between the first heat sink 12, the second heat sink 13 and the gain medium 11 is set to Bonded contact, the contact mode between the ball 226 of the floating component 22 and the first placement groove 2221, the ball 226 and the slide 225 is set to Frictional contact, the connection mode between the second bolt 32 and the bottom plate 223 is set to Non-separation, and the rest of the parts are in default contact mode; the temperature values ​​of the first heat sink 12 and the second heat sink 13 are set to the temperature of the coolant used, the surface of the power amplifier module 1 in contact with the surrounding environment is set to the thermal convection surface, and different convection heat transfer coefficients are set according to the experimental results. (6) Displacement probes are set on the gain medium 11, the surface of the seat plate 14 and the upper edge of the second heat sink 13. (7) Use Program Controlled to solve the calculation, and import the temperature field results into the static structure as the initial condition. Set the support of the seat plate 14 as a fixed constraint, add a vertically upward bolt force to the first through hole 141 of the seat plate 14, and add a vertically downward standard gravity to the overall geometric model; set the weak spring option in the calculation condition to Program Controlled, use the linear method for calculation, and after the calculation is completed, check the deformation result of the geometric model under low temperature conditions through the deformation of the geometric model.(8) Repeat steps (1) to (7) to calculate the deformation results at different temperatures. According to the deformation amount of the power amplifier module 1, optimize the structure, repeatedly iterate the calculation, optimize the calculation results, and adjust the adjustment range of the floating assembly 22 according to the final deformation result. In combination with the thickness of a single disc spring 4, adaptively select the number of disc springs 4 and customize the preload force of the second bolt 32.

[0050] The above are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereby. It should be understood by those skilled in the art that various changes, modifications, substitutions and deformations may be made to these embodiments without departing from the principles and purposes of the present invention, and all of them should be included in the protection scope of the present invention. The protection scope of the present invention is defined by the claims and their equivalents.

Claims

1. A power amplifier module base for low temperature, characterized in that: It includes a seat plate, a fixing component is arranged at a position near one side of the top of the seat plate, a floating component is arranged at a position near the other side of the top of the seat plate, a first heat sink is fixedly installed on the top of the fixing component, a second heat sink is fixedly installed on the top of the floating component, a gain medium is installed between the first heat sink and the second heat sink, and the first heat sink and the second heat sink are fixedly connected to the gain medium by indium welding; the fixing component fixes the first heat sink on the seat plate, and the floating component allows the second heat sink to move slightly in the X direction, the Y direction and the Z direction relative to the seat plate; the fixing component includes a connecting plate and a first insulating block, the first insulating block is placed at a position near one side of the top of the seat plate, the connecting plate is placed on the top of the first insulating block, first through holes are arranged at corresponding positions of the seat plate, and the seat plate, the first insulating block, the connecting plate and the first heat sink are fixedly connected by first bolts.

2. The power amplifier module base for low temperature according to claim 1, characterized in that: The floating assembly includes a connecting plate, a second insulating block and a top plate, wherein the top plate is placed on the top of the seat plate near the other side, a second insulating block is placed on the top of the top plate, and the connecting plate is placed on the top of the second insulating block. First through holes are provided at corresponding positions of the top plate, the second insulating block and the connecting plate, and the top plate, the second insulating block, the connecting plate and the second heat sink are fixedly connected by first bolts. A mounting groove is provided at the bottom of the seat plate corresponding to the position of the top plate, and a bottom plate is provided in the mounting groove. A first placement groove is provided on one side of the top plate near the bottom, the first placement groove is connected to the bottom of the top plate, and the first placement groove is in a straight line along the width direction of the top plate. The first placement groove is provided with a plurality of ball bearings, and the ball bearings are in a clearance fit state with the first placement groove. There are a plurality of first placement grooves and they are evenly distributed on the top plate. A baffle is fixedly provided on the side of the top plate close to the first placement groove. A through groove is provided on the seat plate corresponding to the position of the first placement groove. A second placement groove is provided on the top of the bottom plate corresponding to the position of the through groove. A slide is provided in the second placement groove. The slide crosses the through groove and its top surface contacts with the ball bearings. Second through holes are provided at corresponding positions of the seat plate and the bottom plate. A disc spring is provided in the second through hole of the bottom plate. The bottom plate is mounted on the seat plate by passing the disc spring through a second bolt.

3. The power amplifier module base for low temperature according to claim 2, characterized in that: The cross section of the first placement groove is in a three-quarter circle shape with a notch.

4. The power amplifier module base for low temperature according to claim 2, characterized in that: The length of the first placement groove is greater than the sum of the diameters of a plurality of the balls.

5. The power amplifier module base for low temperature according to claim 2, characterized in that: The width of the slide is greater than the diameter of the ball.

6. The power amplifier module base for low temperature according to claim 2, characterized in that: The top of the connecting plate of the fixed component and the top of the connecting plate of the floating component are on the same horizontal plane.

7. The power amplifier module base for low temperature according to claim 2, characterized in that: A protrusion is fixedly provided on the top of the connecting plate of the fixed component, and there are multiple protrusions distributed in parallel with each other, and the top of the protrusion fits with the bottom of the first heat sink; a protrusion is fixedly provided on the top of the connecting plate of the floating component, and there are multiple protrusions distributed in parallel with each other, and the top of the protrusion fits with the bottom of the second heat sink.

8. The power amplifier module base for low temperature according to claim 2, characterized in that: The seat plate is made of an iron-nickel alloy material; the connecting plate, the first insulating block and the second insulating block are all made of a quartz material.

9. The power amplifier module base for low temperature according to claim 1, characterized in that: The seat plate is provided with a material reduction groove at a bottom position corresponding to the fixing assembly, and there are a plurality of material reduction grooves which are evenly distributed on the seat plate.

10. An optimization design method for a power amplifier module base for low temperature as claimed in any one of claims 1 to 9, characterized in that: The following steps are involved: (1) constructing a geometric model of the gain medium, the first heat sink, the second heat sink, the fixed component, and the floating component using a three-dimensional modeling software; (2) Import all geometric models constructed in step (1) into ANSYS software, select Static Structural and Steady State Thermal modules, and perform static structural analysis and steady-state temperature field analysis on them; (3) defining the physical properties of the gain medium, the first heat sink, the second heat sink, the fixed component, and the floating component; (4) All the constructed geometric models are then imported into the HyperMesh software. According to the structure of the geometric model, the idea of ​​meshing from two-dimensional to three-dimensional is adopted, and the geometric model is meshed by the ALL Quad method. The three-dimensional mesh refinement method is set according to the size of the geometric model, and the common nodes of the three-dimensional mesh are checked at the same time. By setting the mesh size, it is ensured that the number of mesh layers of each part of the geometric model meets the calculation requirements. (5) Boundary conditions are set according to the connection relationship between the gain medium, the first heat sink, the second heat sink, the fixed component and the floating component. The contact mode between the first heat sink, the second heat sink and the gain medium is set to Bonded contact. The contact mode between the ball of the floating component and the first placement groove and the ball and the slide is set to Frictional contact. The connection mode between the second bolt and the base plate is set to Non-separation. The remaining parts are set to the default contact mode. The temperature values ​​of the first heat sink and the second heat sink are set to the temperature of the coolant used. The surface of the power amplifier module in contact with the surrounding environment is set to the thermal convection surface, and different convection heat transfer coefficients are set according to the experimental results. (6) Displacement probes are respectively arranged on the gain medium, the surface of the base plate, and the upper edge of the second heat sink; (7) Use Program Controlled to solve the calculation, and import the temperature field results into the static structure as the initial condition. Set the support of the seat plate as a fixed constraint, add a vertical upward bolt force to the first through hole of the seat plate, and add a vertical downward standard gravity to the overall geometric model; set the weak spring option in the calculation condition to Program Controlled, use the linear method to calculate, and after the calculation is completed, check the deformation result of the geometric model under low temperature conditions through the deformation of the geometric model; (8) Repeat steps (1) to (7) to calculate the deformation results at different temperatures. According to the deformation amount of the power amplifier module, optimize the structure, repeatedly iterate the calculation, optimize the calculation results, and adjust the adjustment range of the floating assembly according to the final deformation result. In combination with the thickness of a single disc spring, the number of disc springs and the preload force of the second bolt are adaptively selected.

Images