An integrated cutting and grinding device and processing method for a copper-embedded HDI circuit board

Abstract

The present application provides a cutting and grinding integrated device for a copper-embedded HDI circuit board and a processing method, belonging to the technical field of circuit board processing equipment. The device includes a feeding component, which includes a set of brackets, a rotating shaft, and a suction cup; a laser cutting component, which includes a gantry, a gantry, and a vacuum suction plate, and there is a laser cutting machine above the vacuum suction plate; a grinding component, which is arranged on one side of the vertical part of the gantry and is used for grinding the copper-embedded area of the circuit board. The processing method for the copper-embedded HDI circuit board includes the following steps: S1, copper base processing; S2, inner layer core board processing; S3, lamination; S4, laser drilling and hole filling electroplating; S5, laser grooving: using the cutting and grinding integrated device to remove the PP and copper foil in the copper-embedded area on one side of the circuit board to expose the copper-embedded block; S6, grinding: to grind the cutting position. Using the solution provided by the present application can avoid multiple transfers of the circuit board, improve the processing efficiency of the circuit board, and make the copper base bonding effect good, improving the reliability of the circuit board.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board processing equipment, and in particular relates to a copper block embedded HDI circuit board cutting and grinding integrated device and a processing method. Background Art

[0002] As the assembly density and integration of PCB components increase and the signal transmission speed increases, the power consumption increases accordingly, and the requirements for heat dissipation and high-frequency transmission of PCB boards become increasingly higher.

[0003] The copper base has excellent heat dissipation performance, good electromagnetic shielding performance, high mechanical strength and toughness, so the embedded copper base has a good application in printed circuit boards.

[0004] The common copper-embedded base is a standard rectangular block, and the embedded position corresponds to the groove in the middle area of ​​the circuit board, which is the same size as the copper base. In the process of embedding the copper base, the hot-melted glue of the semi-cured sheet used for pressing flows into the gap between the copper base and the circuit board, and forms adhesion after solidification. This method requires grooves in the circuit board area, but the structure of the copper-embedded HDI board is PP and copper foil on the outside. Because PP cannot be fixed, the groove position and the embedded copper block cannot be aligned, resulting in the surface of the embedded copper block being covered with resin, affecting the connection between the embedded copper block and the chip; and when removing the resin on the surface of the embedded copper block, it is necessary to manually turn it over to remove the resin-covered areas on both sides of the circuit board separately, which is inefficient; in addition, the surface flatness of the area covered with resin is affected, and it needs to be moved to the next station for grinding before grinding can be performed, which is time-consuming and labor-intensive. Summary of the invention

[0005] In order to solve the above-mentioned deficiencies in the prior art, the present invention provides a copper-embedded HDI circuit board cutting and grinding integrated device and processing method, which avoids multiple transfers of circuit boards, improves the circuit board processing efficiency, and makes the copper base bonding effect good, thereby improving the reliability of the circuit board.

[0006] In order to achieve the purpose of the present invention, the following scheme is proposed:

[0007] A copper-embedded HDI circuit board cutting and grinding integrated device, comprising:

[0008] The feeding assembly comprises a group of brackets arranged at intervals, a conveyor belt is provided on the top of each group of brackets for conveying circuit boards, a rotating shaft is provided at one end of each group of brackets, a U-shaped suction cup frame is provided on the rotating shaft, a plurality of vertically retractable suction cups are evenly distributed on one side of the suction cup frame, and support plates are vertically provided on the vertical parts of both sides of the suction cup frame, and one end of the support plate is connected to the rotating shaft;

[0009] The laser cutting assembly is spacedly arranged at one end of a group of brackets and includes a portal frame. A vacuum suction plate is rotatably arranged between the two vertical parts of the portal frame. The two ends of the vacuum suction plate are respectively rotatably connected to the vertical parts on both sides of the portal frame. A limiting member is arranged on one side of the vacuum suction plate for limiting one side of the circuit board. One end of the limiting plate passes through the vacuum suction plate. When the suction cup frame rotates to the top surface of the vacuum suction plate and the suction cup adsorbs the circuit board, one side of the support plate abuts against one end of the limiting member. When the suction cup frame flips the circuit board onto the conveyor belt, the support plate disengages from one end of the limiting member. Above the vacuum suction plate, a laser cutting machine is spacedly arranged. The upper end of the laser cutting machine is connected to the cross part of the portal frame for laser cutting the copper-embedded area of the circuit board on the vacuum suction plate.

[0010] The grinding assembly is arranged on one side of the vertical part of the portal frame and includes a pushing member that moves along the direction of the cross part of the portal frame. A group of vertically moving grinding wheels are symmetrically arranged in the moving direction of the pushing member. When the vacuum suction plate drives the laser-cut circuit board to rotate to a vertical state, the pushing member is used to push the circuit board between the group of grinding wheels for grinding to grind the cutting position.

[0011] Further, the middle part below a group of brackets is connected to the same cross bar. A convex block is arranged on the cross bar, and a rubber pad is arranged on the convex block.

[0012] Further, pushing members are respectively arranged on the opposite surfaces of one end of a group of brackets. The pushing member includes a first telescopic rod that telescopically moves vertically. A connecting seat is arranged at the top of the first telescopic rod. A second telescopic rod that telescopically moves horizontally is arranged on one surface of the connecting seat, and a push plate is arranged at the output end of the second telescopic rod.

[0013] Further, horizontal baffle plates are arranged at one end of a group of brackets. When the vacuum suction plate is in a horizontal state, the other side below the vacuum suction plate is attached to the horizontal baffle plate. Buffer plates are respectively arranged on the other side of the vertical part of the portal frame. When the vacuum suction plate is in a vertical state, the bottom surface of the vacuum suction plate is attached to the buffer plate.

[0014] Further, the limiting member includes an L-shaped limiting plate that is vertically arranged on one side of the vacuum suction plate. A group of guide rods are arranged in parallel and spacedly on one surface of the vertical part of the limiting plate. The horizontal part of the limiting plate is located on the top surface of the vacuum suction plate. The group of guide rods pass through the vacuum suction plate, and a round plate is arranged at one end of the group of guide rods passing through the vacuum suction plate. When the suction cup frame rotates above the vacuum suction plate, one surface of the round plate abuts against one side of the support plate. When the suction cup frame rotates below the other end of a group of brackets, the round plate extends towards the other end of the group of brackets. A spring is sleeved on the group of guide rods. One end of the spring abuts against the other side of the vacuum suction plate, and the other end abuts against the other surface of the round plate.

[0015] Further, a third telescopic rod is movably arranged on the horizontal part of the gantry. The third telescopic rod is vertically arranged, and a guide rod perpendicular to the horizontal part of the gantry is provided at the output end of the third telescopic rod. The laser cutting machine is movably arranged along the length direction of the guide rod.

[0016] Further, a strip-shaped seat is provided at the lower end of the gantry. A strip-shaped groove is provided on the strip-shaped seat. The pushing member is movably arranged along the strip-shaped groove. One end of the strip-shaped seat is vertically provided with a guide rail. A column is movably arranged on the guide rail. A group of grinding wheels are respectively arranged on one side vertical part of the gantry and the opposite side of the column.

[0017] A processing method for an embedded copper HDI circuit board includes the following steps:

[0018] S1. Copper base processing: sequentially perform cutting and milling to obtain the copper base to be embedded;

[0019] S2. Inner layer core board processing: sequentially perform processes of blanking, drilling, copper deposition / plating on board, circuit, etching, and routing;

[0020] S3. Lamination: embed the copper-embedded block into the inner layer core board, stack PP and copper foil outside the core board, and laminate to form a multilayer board;

[0021] S4. Laser drilling and filling hole electroplating: perform laser drilling and filling hole electroplating to obtain an HDI board;

[0022] S5. Laser grooving: the integrated cutting and grinding device for the copper-embedded block HDI circuit board places the circuit board on the conveyor belt, moves the circuit board to the top surface of the vacuum suction plate, uses the laser cutting machine to remove the PP and copper foil in the copper-embedded block area on one side of the circuit board to expose the copper-embedded block. After cutting is completed, rotate the suction cup frame. The horizontal part of the suction cup frame pushes the limiting member out of the top surface of the vacuum suction plate. The suction cup adsorbs one side of the circuit board. Rotate the suction cup frame to turn the circuit board over to the conveyor belt, and then convey the turned-over circuit board to the top surface of the vacuum suction plate again to remove the PP and copper foil in the copper-embedded block area on the other side of the circuit board to expose the copper-embedded block;

[0023] S6. Grinding: turn the vacuum suction plate outwards to the vertical state, use the pushing member to push the circuit board after double-sided cutting into the space between a group of grinding wheels for grinding to grind the cutting position.

[0024] Further, the height of the copper-embedded block milled in step S1 is consistent with the finished board thickness of the circuit board.

[0025] Further, the PP and copper foil used in the lamination process in step S3 do not need to be grooved, and the copper-embedded position of the laminated structure protrudes from the surface of the circuit board.

[0026] The beneficial effects of the present invention are as follows:

[0027] Insert the side of the copper-embedded block into the circuit board, so that the copper base and the circuit board have an adhesive effect in the horizontal direction, with good bonding force, enhancing the reliability of the copper-embedded printed circuit board. And use the flipped suction cup holder to automatically turn over the circuit board. When the resin removal and cutting of both sides of the circuit board are completed, automatically grind both sides of the circuit board simultaneously, shortening the processing time of the circuit board and improving work efficiency. Description of the Drawings

[0028] The drawings described in this document are only for illustrating the selected embodiments, not all possible implementation schemes, and are not intended to limit the scope of the present invention.

[0029] Figure 1 The schematic diagram of the application scenario of Embodiment 1 of the present application is shown.

[0030] Figure 2 The schematic cross-sectional view along the width direction of the vacuum suction plate of Embodiment 1 of the present application is shown.

[0031] Figure 3 The... of Embodiment 1 of the present application is shown Figure 2 The partial enlarged schematic view at A in... is shown.

[0032] Figure 4 The schematic diagram of the state when the circuit board of Embodiment 1 of the present application turns over and leaves the vacuum suction plate is shown.

[0033] Figure 5 The schematic diagram of the state when the lower side of the circuit board of Embodiment 1 of the present application contacts the conveyor belt during flipping is shown.

[0034] Figure 6 The schematic diagram of the state of the circuit board of Embodiment 1 of the present application on the conveyor belt during flipping is shown.

[0035] Figure 7 The schematic diagram of the state when the ejector of Embodiment 1 of the present application pushes the circuit board for grinding is shown.

[0036] Figure 8 The schematic front projection diagram of the side where the ejector of Embodiment 1 of the present application is located is shown.

[0037] Figure 9 The schematic front projection diagram of the side where the grinding wheel of Embodiment 1 of the present application is located is shown.

[0038] Figure 10 The cross-sectional view of the copper base of Embodiment 2 of the present application is shown.

[0039] Figure 11 The schematic diagram of the copper base of Embodiment 2 of the present application embedded in the inner core board is shown.

[0040] Figure 12 The schematic diagram of the copper-embedded HDI board after lamination of Embodiment 2 of the present application is shown.

[0041] Figure 13 Shows a schematic diagram of the copper - inlaid HDI board after laser drilling and filling - hole electroplating in the second embodiment of the present application.

[0042] Figure 14 Shows a schematic diagram of the copper - inlaid HDI board in the second embodiment of the present application.

[0043] Markings in the figure: circuit board - 1, feeding assembly - 10, bracket - 11, conveyor belt - 12, rotating shaft - 13, suction cup holder - 14, suction cup - 141, support plate - 142, cross bar - 15, bump - 151, pushing member - 16, first telescopic rod - 161, connecting seat - 162, second telescopic rod - 163, push plate - 164, horizontal baffle - 17, laser cutting assembly - 20, gantry - shaped frame - 21, buffer plate - 211, vacuum suction plate - 22, limiting member - 23, limiting plate - 231, guide rod - 232, circular plate - 233, spring - 234, laser cutting machine - 24, third telescopic rod - 241, guide rod - 242, strip - shaped seat - 25, strip - shaped groove - 251, guide rail - 26, grinding assembly - 30, pushing - out member - 31, grinding wheel - 32, column - 33. Detailed implementation manners

[0044] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will describe the embodiments of the present invention in detail with reference to the accompanying drawings. However, the embodiments described herein are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0045] Embodiment 1

[0046] As Figures 1 - 9 shown, this embodiment provides an integrated device for cutting and grinding a copper - inlaid HDI circuit board, including a feeding assembly 10, a laser cutting assembly 20 arranged in sequence, and a grinding assembly 30 arranged at one end of the laser cutting assembly 20.

[0047] As Figures 1 - 4 shown, the feeding assembly 10 includes a group of brackets 11, a conveyor belt 12, a rotating shaft 13, a suction cup holder 14, a cross bar 15, a pushing member 16, and a horizontal baffle 17.

[0048] A group of brackets 11 are arranged in parallel and at intervals. A conveyor belt 12 is distributed on the top surface along the length direction of the group of brackets 11 for conveying the circuit board 1 towards the laser cutting assembly 20. Strip - shaped plates are respectively arranged on the outer sides of the tops of the group of brackets 11, and the top surface height of the strip - shaped plates is higher than the top surface height of the conveyor belt 12 for guiding the circuit board 1. During use, both ends of the circuit board 1 are conveyed to the laser cutting assembly 20 along the conveyor belt 12 on the top surface of the group of brackets 11, and the laser cutting assembly 20 is used to perform laser cutting on the copper - inlaid area in the center of the top surface of the circuit board 1 to expose the copper - inlaid block.

[0049] The rotating shaft 13 is arranged at one end of a set of brackets 11 facing the laser cutting assembly 20 and is located below the conveying direction of the conveyor belt 12. The rotation of the rotating shaft 13 can be driven by a motor in cooperation with a speed reducer, or a gear can be arranged at one end of the rotating shaft 13, and a rack is pushed by a cylinder, and the rack pushes the gear to rotate to rotate the rotating shaft 13 forward or backward.

[0050] As Figures 5 - 6 shown, the suction cup holder 14 is of a U-shaped structure. A plurality of vertically telescopic suction cups 141 are evenly distributed on one side of the suction cup holder 14 to meet the use of circuit boards 1 with different thicknesses. One end of the vertical part of the suction cup holder 14 is vertically provided with a support plate 142, and the lower end of the support plate 142 is fixedly connected to the rotating shaft 13, so that the suction cup holder 14 can move synchronously with the forward or backward rotation of the rotating shaft 13. When the suction cup holder 14 rotates to the laser cutting assembly 20, the adsorption end of its suction cup 141 is vertically downward for adsorbing the circuit board 1 after one side has been laser cut.

[0051] Among them, setting the suction cup holder 14 into a U-shaped structure can reduce the weight of the suction cup holder 14, make the rotating shaft 13 more labor-saving, and make the suction cup holder 14 more stable during rotation, so that the adsorption force of each suction cup 141 on the circuit board 1 is uniform, and avoid the circuit board 1 falling off due to uneven force during the turning process, resulting in the failure of turning over.

[0052] The cross bar 15 is arranged below the middle of a set of brackets 11 for connecting a set of brackets 11, and convex blocks 151 are arranged at intervals on the top surface of the cross bar 15. The top surface of the convex block 151 has an inclined surface and is inclined downward toward the direction where the laser cutting assembly 20 is located. A rubber pad is arranged on the top surface of the convex block 151. When the circuit board 1 after one side is cut is turned over onto the conveyor belt 12 and the downward side of the circuit board 1 contacts the conveyor belt 12, the suction cup 141 is closed, so that the circuit board 1 is separated from the suction cup 141, and the suction cup holder 14 continues to move downward to below the conveyor belt 12. At this time, the inclined surface of the convex block 151 limits the suction cup holder 14 to prevent the suction cup holder 14 from rotating downward too much, and ensures that the suction cup holder 14 does not affect the conveyor belt 12 from conveying the turned-over circuit board 1. At the same time, when the suction cup 141 turns over the next circuit board 1 after one side is cut again, the starting torque of the rotating shaft 13 can be reduced, the service life of the rotating shaft 13 can be improved, and energy can be saved; and the setting of the rubber pad can play a role in buffering and shock absorption for the suction cup holder 14 and reduce noise.

[0053] The pushing member 16 is arranged at one end of the lower side of the rotating shaft 13 facing the laser cutting assembly 20, and the horizontal baffle 17 is arranged at one end of a set of brackets 11 facing the laser cutting assembly 20.

[0054] Specifically, as Figures 1 - 2 、 Figure 4As shown in the figure, the laser cutting assembly 20 includes a gantry 21, a vacuum suction plate 22, a limiting member 23, and a laser cutting machine 24. The gantry 21 is spaced at one end of a set of brackets 11. The vacuum suction plate 22 is arranged inside the gantry 21, and both ends of the vacuum suction plate 22 are rotatably connected to the vertical parts on both sides of the gantry 21. When the vacuum suction plate 22 is in a horizontal state, it is used to receive the circuit board 1 conveyed by the conveyor belt 12 to the laser cutting assembly 20. At this time, the lower end of the side of the vacuum suction plate 22 facing the set of brackets 11 contacts the top surface of the horizontal baffle 17, which is used to ensure the levelness of the vacuum suction plate 22, so that the suction cup 141 is more stable when adsorbing.

[0055] As Figure 3 shown in the figure, a set of through holes arranged at intervals are arranged in the width direction of the vacuum suction plate 22. The limiting member 23 includes a limiting plate 231 with an inverted L-shaped structure, a set of guide rods 232, a circular plate 233, and a spring 234. The limiting plate 231 is arranged on the side of the vacuum suction plate 22 away from the set of brackets 11. The horizontal part of the limiting plate 231 faces the top surface of the vacuum suction plate 22, so that the vertical part of the limiting plate 231 is used to limit one side of the moving direction of the circuit board 1 to prevent the circuit board 1 from moving out of the vacuum suction plate 22. A set of guide rods 232 are arranged in parallel and at intervals on the inner side surface of the vertical part of the limiting plate 231, and the set of guide rods 232 are slidably connected to the through holes. The circular plates 233 are respectively arranged at one ends of the set of guide rods 232 passing through the through holes. The springs 234 are respectively sleeved on the set of guide rods 232, and one end of the spring 234 abuts against the surface of the circular plate 233 facing the vacuum suction plate 22, and the other end abuts against the other side of the vacuum suction plate 22.

[0056] The laser cutting machine 24 is vertically arranged below the horizontal part of the gantry 21, and is used to perform laser cutting on the copper-embedded area of the circuit board 1 on the vacuum suction plate 22. When performing laser cutting, the vacuum suction plate 22 adsorbs the circuit board 1.

[0057] As Figures 5 - 6 shown in the figure, when one side of the circuit board 1 is completed with laser cutting, when the suction cup holder 14 rotates upward to the upper part of the vacuum suction plate 22, the support plate 142 pushes the circular plate 233 to move towards the vacuum suction plate 22, so that the circular plate 233 pushes a set of guide rods 232 to move, so that the horizontal part of the limiting plate 231 moves out of the top surface of the vacuum suction plate 22, so as to prevent the horizontal part of the limiting plate 231 from interfering with the rotation of the circuit board 1 along with the suction cup holder 14, so that the circuit board 1 can be smoothly turned over onto the conveyor belt 12. When the circuit board 1 completely falls onto the top surface of the conveyor belt 12, the support plate 142 rotates to the lower part of the circular plate 233, so that the limiting plate 231 is reset under the action of the restoring force of the spring 234. Then the circuit board 1 moves again and moves to the top surface of the vacuum suction plate 22 along with the conveyance of the conveyor belt 12 for cutting the copper-embedded area on the other side.

[0058] As Figure 1 、 Figures 7 - 9As shown in the figure, the grinding assembly 30 includes a pushing member 31, a set of grinding wheels 32, and a column 33. The lower ends of the vertical portions on both sides of the gantry 21 are connected to the two ends of the same strip-shaped seat 25, and the outer side of the strip-shaped seat 25 protrudes from the gantry 21. On one side of the top surface of the strip-shaped seat 25, there is a strip-shaped groove 251, and the strip-shaped groove 251 is located outside the projection of the horizontal portion of the gantry 21 on the horizontal plane. As Figure 8 shown, the pushing member 31 has a "7"-shaped structure. After the circuit board 1 is cut on both sides, the vacuum suction plate 22 rotates to a vertical state on the side away from the set of brackets 11. The outer end of the horizontal portion of the pushing member 31 fits against the side of the vacuum suction plate 22 carrying the circuit board 1. The lower end of the vertical portion of the pushing member 31 is movably arranged in the strip-shaped groove 251. The movement of the pushing member 31 can be driven by a motor cooperating with a lead screw, so that the lower end of the vertical portion of the pushing member 31 is threadedly connected to the lead screw, or it can also be directly pushed by a linear cylinder.

[0059] One end of the strip-shaped seat 25 facing the pushing direction of the pushing member 31 is vertically provided with a guide rail 26. The column 33 is movably arranged along the guide rail 26. The column 33 corresponds to one side vertical portion of the gantry 21, and a set of grinding wheels 32 are respectively arranged on the vertical portion of the column 33 facing the gantry 21 and on the side of the vertical portion of the gantry 21 facing the column 33. The outer side of the grinding wheel 32 arranged on the vertical portion of one side of the gantry 21 is parallel to the side of the vacuum suction plate 22 carrying the circuit board 1 when the vacuum suction plate 22 rotates to a vertical state.

[0060] During use, when the pushing member 31 pushes out the circuit board 1 along the inner side surface of the vertical portion of the limiting plate 231, the column 33 moves towards the vertical portion of one side of the gantry 21, so that both sides of the circuit board 1 are simultaneously ground by the grinding wheels 32, so that the two sides of the circuit board 1 are uniformly stressed during the grinding process, and the grinding time can be saved and the work efficiency can be improved.

[0061] Preferably, in order to adapt to the grinding of laser cutting areas at different heights, vertical sliding grooves are respectively provided on the surface of the vertical portion of the gantry 21 facing the column 33 and on the surface of the column 33 facing the vertical portion of one side of the gantry 21. Sliding seats are arranged in the sliding grooves. The top surface of the sliding seat is connected to an electric telescopic rod that can be telescopically adjusted vertically, and the grinding wheel 32 is installed in the sliding seat.

[0062] Specifically, in order to ensure the perpendicularity of the vacuum suction plate 22 when it rotates to a vertical state, buffer plates 211 are respectively provided on the side of the vertical portion of the gantry 21 facing the set of brackets 11. When the vacuum suction plate 22 is in a vertical state, the bottom surface of the vacuum suction plate 22 fits against the buffer plates 211.

[0063] Specifically, as Figure 3As shown, the pushing members 16 are respectively arranged at one end of a set of brackets 11 facing the laser cutting assembly 20 and are located on the opposite sides of the set of brackets 11. The pushing member 16 includes a first telescopic rod 161, a connecting seat 162, a second telescopic rod 163, and a pushing plate 164. At the front of the connection between the two ends of the rotating shaft 13 and the lower ends of the set of brackets 11, there are supports. The first telescopic rod 161 is vertically arranged above one end of the support facing the laser cutting assembly 20. The connecting seat 162 is arranged at the output end of the first telescopic rod 161. The second telescopic rod 163 is horizontally arranged on the side of the connecting seat 162 facing the laser cutting assembly 20. The pushing plate 164 is arranged at the output end of the second telescopic rod 163. When the width of the circuit board 1 is small and the cutting position on its top surface cannot be moved to the output end of the laser cutting assembly 20, the first telescopic rod 161 can be used to move vertically, so that the bottom surface of the pushing plate 164 is flush with the top surface of the vacuum suction plate 22, thereby pushing the circuit board 1 to the output end of the laser cutting assembly 20 for laser cutting.

[0064] Specifically, as Figure 2 shown, to increase the moving range of the laser cutting machine 24, a third telescopic rod 241 is movably arranged on the horizontal part of the gantry 21. The third telescopic rod 241 is vertically arranged. The output end of the third telescopic rod 241 is provided with a guide rod 242 arranged perpendicular to the horizontal part of the gantry 21. The laser cutting machine 24 is movably arranged along the length direction of the guide rod 242.

[0065] Specific usage process:

[0066] The circuit board 1 is intermittently conveyed onto the conveyor belt 12. When the circuit board 1 is conveyed along the conveyor belt 12 onto the vacuum suction plate 22, the first telescopic rod 161 is started to push vertically upward by the first telescopic rod 161, so that the bottom surface of the pushing plate 164 is flush with the top surface of the vacuum suction plate 22. Then the second telescopic rod 163 is started, so that the pushing plate 164 moves along the top surface of the vacuum suction plate 22, thereby pushing the circuit board 1, so that one side of the circuit board 1 is flush with the vertical part of the limiting plate 231. After that, the pushing plate 164 is reset.

[0067] The laser cutting machine 24 performs laser cutting on the copper-embedded area at the center of the top surface of the circuit board 1 to remove the PP and copper foil in the copper-embedded block area, so as to expose the copper-embedded block. After the cutting is completed, the rotating shaft 13 is started, so that the rotating shaft 13 drives the suction cup holder 14 to rotate upward in the direction of the vacuum suction plate 22 until it is parallel to the top surface of the vacuum suction plate 22. The suction cup 141 is started, so that the suction cup 141 vertically adsorbs the two ends of the upper side of the circuit board 1 and the side facing the limit plate 231. After the adsorption is completed, the rotating shaft 13 is rotated in the reverse direction, so that the suction cup holder 14 drives the circuit board 1 to rotate above a set of conveyor belts 12. When the circuit board 1 continues to move upward above the conveyor belt 12 as the suction cup holder 14 rotates, when the other side of the adsorbed side of the circuit board 1 contacts the top surface of the conveyor belt 12, the included angle between the circuit board 1 and the conveying direction of the conveyor belt 12 is greater than 120°. At this time, the suction cup 141 is closed, and the circuit board 1 slides down along the suction cup 141 onto the conveyor belt 12, and enters the top surface of the vacuum suction plate 22 again with the conveyance of the conveyor belt 12, and repeats the cutting operation before turning over. At the same time, the rotating shaft 13 continuously rotates downward, so that the suction cup 141 rotates below the conveyor belt 12 to avoid affecting the entry of the next circuit board 1 into the conveyor belt 12.

[0068] After the laser cutting of the copper-embedded area of the circuit board 1 after turning over is completed, the vacuum suction plate 22 is rotated to the vertical state on the side away from a set of brackets 11, and the pushing member 31 is started, so that the pushing member 31 pushes the circuit board 1 along one end of the circuit board 1 between a set of grinding wheels 32. During the pushing process, the column 33 is moved inward along the guide rail 26, so that the grinding wheels 32 provided on the column 33 approach the copper-embedded area to be cut for double-sided grinding.

[0069] Embodiment 2

[0070] A processing method for a copper-embedded HDI circuit board includes the following steps:

[0071] S1. Copper base processing: sequentially perform cutting and milling to obtain the copper base as shown in Figure 10 ;

[0072] S2. Inner layer core board processing: sequentially perform the processes of blanking, drilling, electroless copper plating / plating on the board, circuit, etching, and routing;

[0073] S3. Laminating: As shown in Figure 11 , embed the copper-embedded block into the inner layer core board, stack PP and copper foil outside the core board, and laminate to form a multi-layer board as shown in Figure 12 ;

[0074] S4. Laser drilling and filling hole electroplating: perform laser drilling and filling hole electroplating to realize the HDI board, as shown in Figure 13 ;

[0075] S5. Laser Grooving: Place the circuit board 1 on the conveyor belt 12 using the integrated cutting and grinding device for copper-embedded HDI circuit boards in Embodiment 1, move the circuit board 1 to the top surface of the vacuum suction plate 22, and use the laser cutter 24 to remove the PP and copper foil in the copper-embedded block area on one side of the circuit board 1. As Figure 14 shown, the copper-embedded block is exposed. After the cutting is completed, rotate the suction cup holder 14 towards the direction of the set of brackets 11. The support plate 142 pushes the limiting member 23 out of the top surface of the vacuum suction plate 22, the suction cup 141 adsorbs one side of the circuit board 1, rotate the suction cup holder 14 to turn the circuit board 1 over onto the conveyor belt 12, and the conveyor belt 12 conveys the turned-over circuit board 1 back to the top surface of the vacuum suction plate 22 again, and repeat the above laser cutting process;

[0076] S6. Grinding: Flip the vacuum suction plate 22 away from the set of brackets 11 to a vertical state, and use the pushing member 31 to push the circuit board 1 after double-sided cutting into the space between a set of grinding wheels 32 for grinding to grind the cutting position.

[0077] Specifically, the height of the milled copper-embedded block is the same as the finished board thickness of the circuit board 1.

[0078] Specifically, the PP and copper foil used in the lamination process in step S3 do not need to be grooved, and the copper-embedded position of the laminated structure protrudes from the surface of the circuit board 1.

[0079] The above are only the preferred embodiments of the present invention, and do not represent the only or limit the present invention. Those skilled in the art should understand that without departing from the scope of the present invention, various changes or equivalent substitutions made to the present invention all fall within the scope of protection of the present invention.

Claims

1. A copper-embedded HDI circuit board cutting and grinding integrated device, characterized in that: include: A feeding assembly (10) comprises a group of brackets (11) arranged at intervals and a U-shaped suction cup frame (14); a conveyor belt (12) is provided on the top of the bracket (11) for conveying the circuit board (1); a plurality of telescopic suction cups (141) are evenly distributed vertically on one side of the suction cup frame (14); support plates (142) are vertically provided on both sides of the vertical portion of the suction cup frame (14), one end of which is rotatably connected between the group of brackets (11) via a rotating shaft (13); A laser cutting assembly (20) is arranged at one end of a group of brackets (11) at intervals, and comprises a vacuum suction plate (22) rotatably arranged between a door frame (21) and its vertical portion; a limiting member (23) is arranged on one side of the vacuum suction plate (22) for limiting one side of the circuit board (1); one end of the limiting member (23) passes through the vacuum suction plate (22); when the suction cup frame (14) rotates to the top surface of the vacuum suction plate (22) and the suction cup (141) absorbs the circuit board (1), one side of the support plate (142) abuts against one end of the limiting member (23); when the suction cup frame (14) turns over the absorbed circuit board (1) and receives it on the conveyor belt (12), the support plate (142) is separated from one end of the limiting member (23); a laser cutting machine (24) connected to the door frame (21) is arranged at intervals above the vacuum suction plate (22) for laser cutting the copper embedded area of ​​the circuit board (1) on the vacuum suction plate (22); The grinding assembly (30) is arranged on one side of the vertical portion of the portal frame (21), and comprises a push-out member (31) arranged to move along the length direction of the horizontal portion of the portal frame (21), and a group of grinding wheels (32) symmetrically arranged on both sides of the moving track of the push-out member (31) and moving vertically. When the vacuum suction plate (22) drives the circuit board (1) after laser cutting to rotate to a vertical state, the push-out member (31) is used to push the circuit board (1) between the group of grinding wheels (32) to grind the cutting position.

2. The copper embedded HDI circuit board cutting and grinding integrated device according to claim 1, characterized in that: The middle parts below a group of brackets (11) are connected to the same crossbar (15), a convex block (151) is provided on the crossbar (15), and a rubber pad is provided on the convex block (151).

3. The copper embedded HDI circuit board cutting and grinding integrated device according to claim 1, characterized in that: A group of brackets (11) are provided with pushers (16) on opposite sides of one end, the pushers (16) comprising a first telescopic rod (161) which is telescopically arranged vertically, a connecting seat (162) being provided on the top of the first telescopic rod (161), a second telescopic rod (163) which is telescopically arranged horizontally being provided on one side of the connecting seat (162), and a push plate (164) being provided at the output end of the second telescopic rod (163).

4. The copper embedded HDI circuit board cutting and grinding integrated device according to claim 1, characterized in that: A horizontal baffle (17) is provided at one end of a group of brackets (11); when the vacuum suction plate (22) is in a horizontal state, the lower side of the other side of the vacuum suction plate (22) is in contact with the horizontal baffle (17); and a buffer plate (211) is provided at the other side of the vertical portion of the door-shaped frame (21); when the vacuum suction plate (22) is in a vertical state, the bottom surface of the vacuum suction plate (22) is in contact with the buffer plate (211).

5. The copper embedded HDI circuit board cutting and grinding integrated device according to claim 1, characterized in that: The limiting member (23) comprises an inverted L-shaped limiting plate (231) vertically arranged on one side of the vacuum suction plate (22); a group of guide rods (232) are arranged on one side of the vertical portion of the limiting plate (231) in parallel and at intervals; a horizontal portion of the limiting plate (231) is located on the top surface of the vacuum suction plate (22); a group of guide rods (232) are penetrated through the vacuum suction plate (22); and a circular plate (233) is arranged on one end of the group of guide rods (232) passing through the vacuum suction plate (22); when the suction cup frame (1 4) When the circular plate (233) is rotated to the top of the vacuum suction plate (22), one side of the circular plate (233) abuts against one side of the support plate (142); when the suction cup frame (14) is rotated to the bottom of the other end of the one set of brackets (11), the circular plate (233) extends toward the other end of the one set of brackets (11); a spring (234) is provided on the one set of guide rods (232); one end of the spring (234) abuts against the other side of the vacuum suction plate (22), and the other end abuts against the other side of the circular plate (233).

6. The copper embedded HDI circuit board cutting and grinding integrated device according to claim 1, characterized in that: A third telescopic rod (241) is movably provided on the transverse portion of the portal frame (21); the third telescopic rod (241) is arranged vertically; an output end of the third telescopic rod (241) is provided with a guide rod (242) arranged perpendicularly to the transverse portion of the portal frame (21); and the laser cutting machine (24) is movably provided along the length direction of the guide rod (242).

7. The copper embedded HDI circuit board cutting and grinding integrated device according to claim 1, characterized in that: A strip seat (25) is provided at the lower end of the portal frame (21), a strip groove (251) is provided on the strip seat (25), a push-out member (31) is movably arranged along the strip groove (251), a guide rail (26) is vertically provided at one end of the strip seat (25), a column (33) is movably provided on the guide rail (26), and a group of grinding wheels (32) are respectively movably arranged on a side of a vertical portion of one side of the portal frame (21) and a side opposite to the column (33).

8. A method for processing a copper-embedded HDI circuit board, characterized in that: The steps include: S1. Copper base processing: cutting and milling are performed in sequence to obtain the copper base to be embedded; S2, inner core board processing: cutting, drilling, copper plating / board electricity, circuit, etching, gong board process in sequence; S3, Lamination: embed the copper block into the inner core board, laminate PP and copper foil on the outside of the core board, and press to form a multilayer board; S4, laser drilling and hole filling electroplating: laser drilling and hole filling electroplating are performed to realize HDI board; S5. Laser grooving: using the copper-embedded HDI circuit board cutting and grinding device as described in any one of claims 1 to 7, placing the circuit board (1) on the conveyor belt (12), moving the circuit board (1) to the top surface of the vacuum suction plate (22), using the laser cutting machine (24) to remove the PP and copper foil in the copper-embedded area on one side of the circuit board (1) to expose the copper-embedded area, after the cutting is completed, rotating the suction cup frame (14), the horizontal part of the suction cup frame (14) pushes the limiter (23) out of the top surface of the vacuum suction plate (22), the suction cup (141) adsorbs one side of the circuit board (1), rotating the suction cup frame (14) to flip the circuit board (1) onto the conveyor belt (12), conveying the flipped circuit board (1) to the top surface of the vacuum suction plate (22) again, removing the PP and copper foil in the copper-embedded area on the other side of the circuit board (1) to expose the copper-embedded area; S6, grinding: turning the vacuum suction plate (22) outward to a vertical state, and using a pusher (31) to push the double-sided cut circuit board (1) between a set of grinding wheels (32) for grinding, so as to grind the cutting position.

9. The method for processing a copper-embedded HDI circuit board according to claim 8, characterized in that: The height of the copper embedded block milled out in step S1 is consistent with the thickness of the finished printed circuit board.

10. The method for processing a copper-embedded HDI circuit board according to claim 8, characterized in that: The PP and copper foil used in the lamination process in step S3 do not need to be grooved, and the copper embedding position of the laminated structure is raised on the surface of the printed circuit board.

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