A fiber laser online cleaning process method and device for plastic packaging molds

Abstract

The present application discloses a process method and device for online cleaning of plastic packaging molds by fiber laser, which relates to the technical field of plastic packaging mold cleaning. The device can realize automatic cleaning of plastic packaging molds by setting an AGV moving device, a robotic arm and a cleaning head; fiber laser is selected as a laser source, and the plastic packaging mold is cleaned thoroughly and without damage by utilizing the laser's high instantaneous energy, high action time, and non-contact characteristics; a semi-quantitative basis for selecting optical path hardware and a method for selecting laser parameters (i.e., pre-setting laser cleaning parameters) are provided, and the laser parameters are accurately matched with the characteristics of dirt and base material on the surface of the plastic packaging mold, thereby realizing efficient and thorough cleaning of the surface of the plastic packaging mold, and effectively realizing uniform energy distribution on the laser scanning path and the cleaning path, thereby ensuring that the pollutants can be thoroughly cleaned while avoiding damage to the plastic packaging mold itself.

Description

Technical Field

[0001] The present application relates to the technical field of plastic packaging mold cleaning, and in particular to a process method and device for online cleaning of plastic packaging molds using a fiber laser. Background Art

[0002] Packaging is a critical step in semiconductor component manufacturing. It uses resin materials to seal components, securing, sealing, and protecting them while also improving thermal conductivity and extending their lifespan. During this process, the contacts on the chip are connected to the pins of the package via wires. These pins are then connected to other electronic components via wires on the circuit board, ensuring the integrity and functionality of the circuit. Therefore, packaging technology is crucial to the development of the entire semiconductor industry.

[0003] Traditional semiconductor packaging processes primarily utilize a two-part mold technology, where the mold design incorporates a deep recess for the chip. During the mold closing process, liquid resin is injected and held under high temperature and pressure for a period of time, allowing the molten resin to evenly fill the gap between the molds through a flow channel system. Once the resin cools and solidifies, the chip is encapsulated. This technology, popular for its rapid and efficient mass production, is currently one of the most widely used packaging methods in the semiconductor industry.

[0004] Due to the properties of resin materials, traditional semiconductor molding processes inevitably leave residue on the mold surface. This residue accumulates over time and with repeated use, potentially leading to underfill and other defects on the product surface, impacting product yield. These contaminants, including resin, grease, and wax, are formed under high temperature and pressure, resulting in strong adhesion and difficulty in complete removal.

[0005] Traditional methods for cleaning plastic molds involve placing a dedicated cleaning strip between the mold halves and subjecting them to high temperature and high pressure for a period of time after the molds are closed. During this process, the strip melts and fills the interior of the plastic mold, then solidifies. Finally, the solidified cleaning rubber cake is removed when the mold is opened. This method effectively absorbs residual contaminants from the plastic mold onto the rubber cake, while the used rubber cake is collected and disposed of. Although this method is currently the most mainstream cleaning method for plastic molds, it still has some serious problems. First, the mold cleaning strip is used in large quantities, and long-term use incurs significant consumable costs, increasing production costs. Second, both mold cleaning and rubber cake handling require manual labor, resulting in poor working conditions and low cleaning efficiency. Third, some plastic molds use small cavities with certain internal chamfers, which often prevent the strip from completely clearing the mold. Multiple cleanings or regular overhauls are required, reducing production efficiency.

[0006] Therefore, the semiconductor industry urgently needs to develop a more efficient and environmentally friendly mold cleaning technology to replace the traditional rubber strip mold cleaning method, reduce costs and improve production efficiency.

[0007] The emergence of laser cleaning technology offers a more environmentally friendly and efficient solution for cleaning plastic molds. Laser cleaning utilizes the high energy density of lasers to interact with contaminants attached to the workpiece substrate, separating them through instantaneous thermal expansion, melting, and volatilization. Laser cleaning technology, due to its non-contact cleaning, lack of physical grinding requirements, and compatibility with a wide range of materials, has found widespread industrial application, particularly in surface treatments such as rust removal, degreasing, and paint stripping.

[0008] Although laser cleaning technology has achieved remarkable cleaning results, it is often difficult to avoid some damage to the substrate surface in actual application. For plastic encapsulation molds, due to their extremely high precision requirements, any damage caused during the cleaning process is unacceptable.

[0009] Currently, there is no scientific and systematic process method and device that can achieve rapid and thorough cleaning without damaging the mold. Summary of the Invention

[0010] The purpose of this application is to provide a process method and device for online cleaning of plastic packaging molds using fiber laser, which can quickly and thoroughly clean contaminants on the plastic packaging mold without damaging the mold.

[0011] To achieve the above objectives, this application provides the following solutions:

[0012] In a first aspect, the present application provides a process device for online cleaning of a plastic packaging mold using a fiber laser, comprising:

[0013] AGV mobile device, used to navigate to the predetermined position according to the position of the plastic packaging mold;

[0014] A robotic arm, fixed to the AGV moving device, for moving the cleaning head to a target position of the plastic packaging mold;

[0015] The cleaning head is connected to the robotic arm through a retractable clamp and to the laser through an optical fiber. It is used to clean the plastic packaging mold using laser light emitted by the laser according to preset laser cleaning parameters, wherein the preset laser cleaning parameters include laser wavelength, beam quality factor range, laser focusing module specifications, laser single pulse energy, laser scanning speed and laser cleaning speed.

[0016] In a second aspect, the present application provides a fiber laser online cleaning process for a plastic encapsulation mold. The fiber laser online cleaning process for a plastic encapsulation mold is implemented using the fiber laser online cleaning process device for a plastic encapsulation mold described in the first aspect. The fiber laser online cleaning process for a plastic encapsulation mold includes:

[0017] Navigate the AGV mobile device to the predetermined position according to the position of the plastic packaging mold;

[0018] Move the cleaning head to the target position of the plastic molding die;

[0019] The cleaning head is controlled to use laser to clean the plastic mold according to preset laser cleaning parameters, wherein the preset laser cleaning parameters include laser wavelength, beam quality factor range, laser focusing module specifications, laser single pulse energy, laser scanning speed and laser cleaning speed.

[0020] According to the specific embodiments provided in this application, this application has the following technical effects:

[0021] The present application provides a process method and device for online cleaning of plastic packaging molds by fiber laser. The device can realize automatic cleaning of plastic packaging molds by setting an AGV moving device, a robotic arm and a cleaning head; fiber laser is selected as the laser source, and the characteristics of the laser such as high instantaneous energy, end action time and non-contact are utilized to clean the plastic packaging mold thoroughly and without damage; a semi-quantitative basis for selecting optical path hardware and a method for selecting laser parameters (i.e., preset laser cleaning parameters) are provided, and the laser parameters are accurately matched with the characteristics of the dirt and base material on the surface of the plastic packaging mold, thereby realizing efficient and thorough cleaning of the surface of the plastic packaging mold, and effectively realizing uniform energy distribution on the laser scanning path and the cleaning path, thereby ensuring that the pollutants can be thoroughly cleaned while avoiding damage to the plastic packaging mold itself. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 This is a schematic diagram of the structure of a process device for online cleaning of plastic packaging molds using a fiber laser, as provided in Example 1 of the present application;

[0024] Figure 2 Schematic diagram of the process of determining the preset laser cleaning parameters in Example 1 of the present application;

[0025] Figure 3A schematic flow chart of a fiber laser online cleaning process for a plastic packaging mold provided in Example 2 of the present application;

[0026] Reference numerals:

[0027] 1. Plastic encapsulation mold; 2. AGV mobile device; 3. Robotic arm; 4. Retractable clamp; 5. Cleaning head. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0029] The research found that a method for removing dirt from the surface of a plastic mold of a semiconductor packaging device in the related art (using a 248nm wavelength excimer laser with a laser energy density of 149~301mJ / cm 2 , the laser pulse width is 23ns, which can realize laser cleaning of the surface of plastic packaging mold) Although laser cleaning technology is also used to solve the problems of low efficiency, high cost and poor environment of traditional cleaning methods, there are still some shortcomings:

[0030] First, the pulsed laser spot area used in this method is set to approximately 1 square centimeter, which is relatively large, making it difficult for a single pulse to completely remove the dirt. To completely remove the dirt layer, at least two pulses are usually required to cover the same area, which undoubtedly reduces the overall efficiency of laser cleaning.

[0031] Second, while the 248nm excimer laser used in this method effectively addresses the low efficiency, high cost, and environmental concerns of traditional cleaning methods, its short wavelength, high spot overlap, and high energy can damage the plastic mold material. Especially at high energy densities, this laser can cause thermal or physical damage, impacting the mold's precision and lifespan. Furthermore, the 248nm excimer laser's poor beam quality can affect cleaning uniformity and efficiency.

[0032] Third, with the advancement of mold technology, mold surfaces are trending towards larger surfaces, narrower mold openings, and more complex structures, placing higher demands on cleaning technology. Current methods may not be able to meet the cleaning requirements of these modern molds, limiting their application in mold cleaning.

[0033] To promote the application of laser cleaning technology in the cleaning of complex plastic molds, this embodiment provides a process method and device for online cleaning of plastic molds using fiber laser. This technology achieves efficient and precise cleaning of plastic molds through process innovation and the integration of cleaning equipment and robotic technology, while ensuring that the surface of the plastic mold is not damaged, providing an environmentally friendly and efficient solution for cleaning semiconductor packaging plastic molds.

[0034] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0035] Example 1

[0036] like Figure 1 As shown, this embodiment provides a process device for online cleaning of a plastic packaging mold 1 using a fiber laser, comprising:

[0037] The AGV mobile device 2 is used to navigate to a predetermined position according to the position of the plastic packaging mold 1;

[0038] The robot arm 3 is fixed on the AGV moving device and is used to move the cleaning head 5 to the target position of the plastic packaging mold 1 according to the cleaning path;

[0039] A cleaning head 5 is connected to the robotic arm via a retractable clamp 4 and to the laser via an optical fiber. The cleaning head 5 is used to clean the plastic encapsulation mold 1 using laser light emitted by the laser according to preset laser cleaning parameters, and to remove smoke and debris during the cleaning process. The cleaning head 5 is flat. The preset laser cleaning parameters include laser wavelength, beam quality factor range, laser focusing module specifications, laser single pulse energy, laser scanning speed, and laser cleaning speed. The preset laser cleaning parameters are variables determined according to different plastic encapsulation mold parameters and contaminant parameters. The laser is a near-infrared wavelength laser.

[0040] The dust blowing device is located on the cleaning head 5 and is used to remove smoke, dust and debris during the cleaning process.

[0041] This embodiment provides a more specific example of a process device. The core of the device is an AGV (Automated Guided Vehicle) carriage, which carries the robotic arm, fixture, and cleaning head 5 and houses an electrical control box. The AGV has built-in trajectory planning software, enabling automatic navigation to a predetermined location. For safety, the device is equipped with a laser radar on the edge to prevent collisions with equipment or personnel. In the event of an unexpected collision, anti-collision devices on the side of the carriage immediately activate the brakes upon sensing pressure. A multi-axis robotic arm is mounted on the AGV carriage, precisely moving the cleaning head 5 to the target position. The robotic arm and cleaning head 5 are connected by a retractable clamp, which not only ensures the stability of the cleaning head 5 but also allows the robotic arm to penetrate deep into the mold 1 for cleaning. The cleaning head 5, located at the front of the device, transmits a laser beam to the front of the cleaning head 5 via optical fiber, where it is directed onto the surface of the mold 1 to clean the mold. A dust blower on the cleaning head 5 removes smoke and debris generated during the cleaning process.

[0042] The process of using the fiber laser online cleaning process device for the plastic packaging mold in this embodiment includes:

[0043] The machine requiring cleaning sends cleaning instructions to the AGV controller via the MES system. The AGV then navigates to the vicinity of the plastic molding table. Next, the robotic arm, based on a pre-set trajectory and combined with calibration by the AGV's vision module, determines key positioning points and plans an efficient cleaning path.

[0044] According to the preset laser cleaning parameters and cleaning path, the cleaning head 5 is activated to operate. While the laser is being emitted, the dust blowing device operates synchronously, which not only protects the lens of the cleaning head 5 but also effectively removes smoke and pollutants from the surface of the plastic encapsulation mold 1. The front section of the cleaning head 5 is also equipped with a dust collecting device, which is responsible for collecting these pollutants. When facing a plastic encapsulation mold 1 with a large bevel or chamfer, the cleaning head 5 needs to be fine-tuned so that it emits the laser at a non-perpendicular angle, that is, it is deflected by about 15° toward the area to be cleaned to ensure that the laser can cover the edge of the product cavity of the plastic encapsulation mold 1.

[0045] After the cleaning operation is completed and the mold is confirmed to be clean, the robot arm 3 will smoothly withdraw the cleaning head 5 from the mold cavity and fold it for storage. The AGV will then automatically navigate back to the charging position to prepare for the next task.

[0046] The process of determining the preset laser cleaning parameters is as follows Figure 2 Shown, including:

[0047] Step 1: Determine the laser wavelength. When cleaning plastic molds, it is crucial to identify contaminants on the surface of the plastic mold. These contaminants typically include epoxy resin residues and various substances composed of oxidized waxes. In addition to epoxy resin, epoxy molding compounds also contain a variety of additives such as curing agents, adhesives, and colorants, which are often the main source of contaminants. Different contaminants and plastic mold materials have different absorption rates for laser wavelengths. Selecting a fiber laser with the right wavelength is crucial for the cleaning process to ensure that the contaminant's absorption rate for the laser is higher than the absorption rate of the plastic mold base material. To avoid excessive heating and potential damage to the plastic mold base material caused by the laser, infrared light is usually used for laser cleaning wavelengths, typically 1064nm, 1080nm, etc.

[0048] Step 2: Determine the beam quality factor M 2 To ensure that the laser can act on the dirt without damaging the substrate, the laser beam mode needs to be determined according to the dirt binding force. By utilizing the laser thermal ablation mechanism, when the laser photon energy is greater than the binding energy of the dirt molecules, the molecular bonds are broken from the attachments, and the material is transformed into a loose state, which promotes the evaporation of the dirt layer and ensures that the energy does not damage the substrate. Usually, the residual dirt in the plastic encapsulation mold is the organic matter left by the epoxy resin. The adhesion force is less than 10N, and the beam quality factor M is selected. 2 Range 2~9.

[0049] Step 3: Determine the specifications of the laser focusing module. As the surface design of today's plastic molds tends to have narrower mold openings, the equipment uses a flat laser head that can easily reach into the plastic mold for cleaning. Therefore, it is necessary to set a reasonable optical path for laser focusing.

[0050] Laser optical path > mold opening distance + laser head cleaning head front end size (laser focusing module to the front end of cleaning head 5).

[0051] Laser optical path length = k × optical focal length of the laser focusing module.

[0052] According to experience, the coefficient k is 1.1 when a two-piece focusing module is used; when a three-piece focusing module is used, it is 1.3. Therefore, the specifications of the focusing module can be determined.

[0053] Step 4: Determine the laser single pulse energy. During the laser cleaning process, the surface cleanliness of the plastic mold needs to be measured to determine the number and distribution of contaminants on the surface to be cleaned. This is accomplished using a tape test: by applying tape to the surface of the plastic mold to be tested and then quickly tearing it off, observing the number of contaminants adhered to the tape to estimate the number of contaminants per square centimeter. Based on this data, the laser single pulse energy E is adjusted to meet the cleaning needs of different areas. For example, if the number of contaminants on the surface of the plastic mold is large, the single pulse energy E needs to be increased to improve cleaning efficiency; conversely, if the contaminants are small, the single pulse energy E can be reduced to avoid unnecessary damage to the substrate. A general single pulse energy E<1.4mJ is selected.

[0054] Step 5: Determine the laser scanning speed V1. Select an appropriate laser scanning speed based on the measured focused spot size D and laser single pulse energy E. Since the energy of the laser beam is Gaussian, with the highest energy in the center and gradually decreasing toward the periphery, it is necessary to set an appropriate spot overlap (i.e., the overlap rate of the laser spot) during the laser scanning process to ensure a more uniform energy distribution across the laser scanning width, ensure the consistency of the laser cleaning effect, and avoid incomplete cleaning or damage to the plastic packaging mold 1 due to uneven energy distribution. Therefore, the laser scanning speed V1 should be set as:

[0055] Laser scanning speed V1 Focus spot size D × laser power P ÷ single pulse energy E

[0056] Step 6: Determine the laser cleaning speed V2. Several key factors need to be considered comprehensively to ensure the efficiency and safety of the cleaning process. First, the spot size D directly affects the cleaning speed. The energy Gaussian distribution characteristics of the laser beam require spot overlap to ensure uniform energy distribution. Second, the single pulse energy E determines the cleaning ability. High single pulse energy may allow for faster cleaning speeds. Third, the type and thickness of the contaminant are also important factors in determining the cleaning speed. Thicker or more difficult to remove contaminants may require a slower scanning speed to ensure thorough removal. Fourth, the scanning strategy, including the scanning path and mode, will also affect the setting of the cleaning speed. The maximum scanning speed and repetition frequency of the equipment limit the possible cleaning speed. Finally, safety considerations are factors that cannot be ignored when setting the cleaning speed. It is crucial to ensure the safety of operators and equipment. Combining the above points, the laser cleaning speed V2 should be set as:

[0057] Laser cleaning speed V2 ≥ Focus spot size D × laser power P ÷ single pulse energy E;

[0058] Laser cleaning speed V2 ≤ V1÷laser scanning width×focus spot size D.

[0059] 1. This embodiment proposes a fiber laser online cleaning device for semiconductor packaging mold surface contaminants. Using a near-infrared wavelength fiber laser as the laser source, the device leverages the laser's high instantaneous energy, long-lasting action time, and non-contact properties to thoroughly and non-damage the mold. It provides a semi-quantitative basis for selecting optical path hardware and laser parameter selection, precisely matching the laser parameters with the properties of the mold surface contaminants and the substrate material, achieving efficient and thorough cleaning of the mold surface. The laser scanning speed and cleaning speed are set by combining the laser single pulse energy and the focused spot size, effectively achieving uniform energy distribution along the laser scanning and cleaning paths. This ensures thorough cleaning of contaminants while avoiding damage to the mold itself.

[0060] 2. This embodiment proposes a fiber laser device for cleaning contaminants from the surface of semiconductor packaging molds. Process parameters such as laser pulse width, pulse frequency, and power are not directly specified in the process steps. Instead, the laser energy per single pulse is used to quantify whether the laser energy causes damage to the substrate. This method achieves adjustability in the laser's energy and spatial distribution characteristics. By utilizing different laser pulse widths, pulse frequencies, powers, wavelengths, beam modes, and optical path designs, it is compatible with most commercially available plastic mold cleaning methods, demonstrating its versatility.

[0061] 3. The fiber laser cleaning device proposed in this embodiment for cleaning contaminants on the surface of semiconductor packaging plastic molds has a cleaning process with a smaller focused light spot, which makes the energy of each light spot more concentrated and produces a stronger impact force on the contaminants, thereby effectively causing the contaminants to vibrate with the substrate and be removed, rather than through thermal influence, effectively avoiding thermal influence of the laser on the substrate and causing damage to the substrate.

[0062] 4. This embodiment proposes a fiber laser device for cleaning contaminants from the surface of semiconductor packaging molds. It integrates an automated guided vehicle (AGV), a multi-axis robotic arm, a retractable fixture, and a specially designed cleaning head. The flat design of the cleaning head allows it to flexibly enter the narrow mold openings of the mold, reaching depths exceeding 300 mm, making it suitable for cleaning most narrow and deep molds. Furthermore, utilizing path planning and visual recognition capabilities, the device automatically completes subsequent cleaning operations after initial calibration, eliminating the need for human intervention. This significantly reduces operating costs and improves production efficiency.

[0063] Example 2

[0064] like Figure 3As shown, this embodiment provides a fiber laser online cleaning process method for plastic sealing molds. The fiber laser online cleaning process method for plastic sealing molds is implemented using the fiber laser online cleaning process device for plastic sealing molds described in Example 1. The fiber laser online cleaning process method for plastic sealing molds includes:

[0065] S1: Navigate the AGV mobile device 2 to a predetermined position according to the position of the plastic packaging mold 1;

[0066] S2: moving the cleaning head 5 to the target position of the plastic packaging mold 1 according to the cleaning path;

[0067] S3: Control the cleaning head 5 to use laser to clean the plastic packaging mold according to preset laser cleaning parameters, wherein the preset laser cleaning parameters include laser wavelength, beam quality factor range, laser focusing module specifications, laser single pulse energy, laser scanning speed and laser cleaning speed, and the preset laser cleaning parameters are variables determined according to different plastic packaging mold parameters and contaminant parameters.

[0068] It should be noted that the process of determining the preset laser cleaning parameters refers to the definition in Example 1 and will not be repeated here.

[0069] This embodiment proposes a method for using a fiber laser to clean contaminants on the surface of a semiconductor package plastic mold. This method is particularly suitable for the current plastic mold structure design. Based on this process method, a flat laser head can be designed that can be inserted into a plastic mold with a narrow mold opening spacing for cleaning. By utilizing the advantages of the fiber laser, such as high beam quality, compact size, high efficiency, high flexibility, long life, and low maintenance cost, and by precisely setting the relevant laser process parameters, one-time cleaning of the plastic mold is achieved while ensuring that the plastic mold is not damaged. This method not only improves the cleaning efficiency, but also avoids the damage to the plastic mold that may be caused by improper selection of the laser process, effectively extending the service life of the plastic mold and reducing the frequency of cleaning.

[0070] Compared with existing technologies:

[0071] 1) This embodiment utilizes laser cleaning technology with a small spot size and low single-pulse energy to ensure concentrated energy density within each spot, effectively enhancing the impact force on contaminants and thus separating them from the substrate. By precisely controlling the laser's single-pulse energy and spot size, this embodiment can set an appropriate laser spot overlap ratio, achieving uniform energy distribution along the laser scanning and cleaning paths. This allows the mold surface to be cleaned in a single pass, eliminating the need for multiple scans of the same location. This reduces cleaning time and potential material damage, significantly improving cleaning efficiency and effectiveness.

[0072] 2) This embodiment uses near-infrared wavelength optical fiber as the laser transmission medium. This choice takes advantage of the laser's high energy, short action time, and non-contact cleaning properties, effectively avoiding potential damage to the plastic mold material caused by the short wavelength.

[0073] 3) The flat laser cleaning head designed in this embodiment significantly improves cleaning flexibility. This flat design can easily reach into plastic molds with a pitch greater than or equal to 60mm and a depth exceeding 300mm, making it compatible with various common plastic molds on the market.

[0074] 4) The cleaning device designed in this embodiment uses an AGV to drive a robotic arm to operate. After the initial calibration is completed, subsequent cleaning actions can be completed fully automatically without the need for human operation, which greatly reduces operating costs and improves production efficiency.

[0075] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] This document uses specific examples to illustrate the principles and implementation methods of this application. The description of the above examples is only intended to help understand the method and core concept of this application. At the same time, for those skilled in the art, based on the concept of this application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting this application.

Claims

1. A fiber laser online cleaning process device for plastic packaging molds, characterized in that: The fiber laser online cleaning process device for plastic packaging molds includes: AGV mobile device, used to navigate to the predetermined position according to the position of the plastic packaging mold; A robotic arm, fixed to the AGV moving device, is used to move the cleaning head to a target position of the plastic packaging mold according to a cleaning path; a cleaning head connected to the robotic arm via a retractable clamp and to the laser via an optical fiber, and configured to clean the plastic encapsulation mold using laser light emitted by the laser according to preset laser cleaning parameters, wherein the preset laser cleaning parameters include laser wavelength, beam quality factor range, laser focusing module specifications, laser single pulse energy, laser scanning speed, and laser cleaning speed, and the preset laser cleaning parameters are variables determined based on different plastic encapsulation mold parameters and contaminant parameters; The molding mold parameters include the material type of the molding mold and the bonding force between the contaminant and the molding mold. The contaminant parameters include the contaminant type, contaminant quantity, contaminant size, and contaminant thickness. The laser wavelength calculation process specifically includes: Determine the laser wavelength based on the material type and contaminant type of the plastic packaging mold; The calculation process of the beam quality factor range includes: Determine the range of the beam quality factor based on the bonding force between the contaminant and the plastic mold; The calculation process of the laser focusing module specifications includes: Determine the specifications of the laser focusing module based on the depth from the plastic encapsulation mold to the outer edge of the workbench and the focus spot size; The calculation process of laser single pulse energy specifically includes: Determine the laser single pulse energy based on the number and size of pollutants; The calculation process of laser scanning speed specifically includes: Determine the overlap rate of the laser spot based on the focused spot size and the laser single pulse energy; determining a laser scanning speed according to the overlap rate; The calculation process of laser cleaning speed specifically includes: The laser cleaning speed is determined based on the focus spot size, laser single pulse energy, contaminant type, contaminant thickness, scanning mode, and equipment safety, wherein the equipment safety includes the maximum scanning speed and repetition frequency.

2. The fiber laser online cleaning process device for plastic packaging molds according to claim 1 is characterized in that: The fiber laser online cleaning process device for the plastic packaging mold further includes a dust blowing device, which is located on the cleaning head and is used to remove smoke and debris during the cleaning process.

3. The fiber laser online cleaning process device for plastic packaging molds according to claim 1 is characterized in that: The cleaning head is flat.

4. A fiber laser online cleaning process for plastic packaging molds, characterized in that: The fiber laser online cleaning process for the plastic encapsulation mold is implemented using the fiber laser online cleaning process device for the plastic encapsulation mold according to any one of claims 1 to 3. The fiber laser online cleaning process for the plastic encapsulation mold comprises: Navigate the AGV mobile device to the predetermined position according to the position of the plastic packaging mold; Move the cleaning head to the target position of the plastic packaging mold according to the cleaning path; The cleaning head is controlled to use laser to clean the plastic packaging mold according to preset laser cleaning parameters, wherein the preset laser cleaning parameters include laser wavelength, beam quality factor range, laser focusing module specifications, laser single pulse energy, laser scanning speed and laser cleaning speed. The preset laser cleaning parameters are variables determined according to different plastic packaging mold parameters and contaminant parameters.

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