Acceleration sensor packaging assembly

Abstract

The invention discloses an acceleration sensor packaging assembly, and belongs to the related technical field of sensor packaging, the acceleration sensor packaging assembly comprises a workbench, a mounting rack is fixedly mounted on the top wall of the workbench, a top plate is fixedly mounted on the mounting rack, and an electric telescopic rod is vertically mounted on the top plate; a mounting disc is fixedly mounted at the output end of the electric telescopic rod, a glue injection rod is fixedly mounted on the bottom wall of the mounting disc, and an absorption assembly is arranged on the glue injection rod; the absorption assembly comprises a glue storage cavity formed in the glue injection rod. According to the scheme, by arranging the buffering air bag, shaking of the glue injection pump is reduced, air can be sucked through the air inlet valve and the first air pipe, then the first air pipe sucks air from the communicating hole through the linkage assembly and the communicating assembly, and at the moment, air flow can drive substances on the top wall of the chip to flow into the linkage assembly together; therefore, it is avoided that the use effect of the chip is affected due to the fact that impurities are attached to the top wall of the chip, and rework processing needs to be carried out, and the effect of improving production efficiency is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field related to sensor packaging, and more specifically, to an acceleration sensor packaging component. Background Art

[0002] A velocity sensor is a sensor that can detect the acceleration of an object and is widely used in various fields such as consumer electronics, automobiles, aerospace, industrial automation, etc.

[0003] In order to prevent the acceleration sensor from getting damp during use and avoid the chip getting damp and affecting its performance and reliability, as well as to prevent dust from adhering to the chip surface or entering the sensitive elements, affecting the accuracy and stability of the sensor, and protecting the sensor chip from external mechanical shock and vibration damage, it is often necessary to package the acceleration sensor. At the same time, after the sensor is packaged, it can improve performance, facilitate installation and integration, improve reliability and consistency, and meet specific application requirements. When packaging, it is generally necessary to cut the wafer first, and then mount the sensor element. After mounting, lead welding is required to connect the electrodes of the sensor chip to the external circuit, and finally package and solidify, that is, fix the sensor chip and leads in the package to form a complete packaging structure. For economic considerations, more and more plastics are used as packaging materials. The most common packaging materials are epoxy resins and additives such as curing agents. They are usually black blocks and stored at low temperatures. They need to be warmed up before use. Epoxy resins are first in a molten state at high temperatures, and then gradually harden to form a package. However, the existing chip packaging grease injection equipment uses an overall heating method. The increase in the entire ambient temperature will damage the chip, resulting in a low yield rate for the final chip. In addition, since the chip shell injected with grease is not completely solidified after overall heating, the surface of the produced chip is not smooth enough, affecting the appearance. In addition, in the subsequent chip processing process, the chip temperature after packaging is high, which is not conducive to the subsequent cutting and other processing processes, affecting the improvement of production efficiency.

[0004] In view of the above problems, some solutions have been provided in the prior art. For example, the Chinese invention patent with announcement number CN112827752B discloses a chip packaging grease injection device and a chip packaging process. The device precisely controls the entire production process by setting a controller, so that the various systems of the entire device are linked, so that the operation procedures of the entire device are carried out in an orderly and rapid manner, and the entire chip packaging grease injection process is carried out quickly, saving a lot of transfer and device idle time, and effectively improving the production efficiency of the entire process; however, a small amount of dust will inevitably adhere to the surface of the chip during transportation. If the dust cannot be cleaned in time, the chip will be packaged together with the dust, which will easily affect the use effect of the chip, and may require rework, seriously affecting the production efficiency. Summary of the invention

[0005] In view of the problems existing in the prior art, an object of the present invention is to provide an acceleration sensor packaging assembly, which can achieve the purpose of improving production efficiency.

[0006] To solve the above problems, the present invention adopts the following technical solutions.

[0007] An acceleration sensor packaging assembly comprises a workbench, a mounting frame is fixedly mounted on the top wall of the workbench, a top plate is fixedly mounted on the mounting frame, an electric telescopic rod is vertically mounted on the top plate, a mounting plate is fixedly mounted on the output end of the electric telescopic rod, a glue injection rod is fixedly mounted on the bottom wall of the mounting plate, and an absorption assembly is provided on the glue injection rod; The absorption component includes a glue storage cavity opened on the glue injection rod, a glue injection pump is installed on the glue injection rod, a glue injection tube is fixedly installed on the output end of the glue injection pump, a buffer airbag is installed between the mounting plate and the top plate, an air intake valve is inserted on the buffer airbag, a first air pipe is installed on the input end of the air intake valve, a transmission plate is rotatably installed on the top wall of the workbench, a placement groove is opened on the top wall of the transmission plate, a limit frame is detachably installed in the placement groove, a positioning groove is opened on the limit frame, a conveying component for conveying the chip into the limit frame is provided on the mounting plate, and a linkage component cooperating with the first air pipe is provided on the glue injection rod.

[0008] Furthermore, the linkage assembly includes a slide groove opened on the glue injection rod, a horizontal plate is slidably installed in the slide groove, a return spring is jointly installed between the top wall of the horizontal plate and the slide groove, a push rod is fixedly installed on the bottom wall of the horizontal plate, a collection box is detachably installed on the side wall of the glue injection rod, and the collection box is connected to one end of the first air pipe away from the intake valve of the buffer airbag, a control assembly is provided on the horizontal plate, and a connecting assembly connected to the control assembly is inserted on the collection box.

[0009] Furthermore, the connecting component includes a second air pipe inserted on the collection box, a collection rod is fixedly installed on the horizontal plate, a connecting hole connected to the second air pipe is opened on the collection rod, and a vertical groove slidingly matched with the collection rod is opened on the glue injection rod.

[0010] Furthermore, a filter screen cooperating with the first air pipe is fixedly mounted on the collection box, a linkage groove communicating with the vertical groove is provided on the glue injection rod, and a scraper is slidably mounted in the linkage groove.

[0011] Furthermore, the conveying assembly includes a conveying block opened on the bottom wall of the mounting plate, the conveying block is provided with a storage groove, a hydraulic rod is fixedly installed on the side wall of the conveying block, a pushing groove is opened on the conveying block, a discharge groove is opened on the bottom wall of the pushing groove, and a push plate fixedly connected to the output end of the hydraulic rod is horizontally slidably installed in the pushing groove.

[0012] Furthermore, a limiting groove is provided on the conveying block, a U-shaped limiting plate is vertically slidably installed in the limiting groove, a first spring is installed between the limiting plate and the limiting groove, and an inclined groove is provided on the limiting plate.

[0013] Furthermore, a vertical block is fixedly mounted on the bottom wall of the mounting plate, and a heat solidification rod slidably matched with the positioning groove is evenly fixedly mounted on the bottom wall of the vertical block.

[0014] Furthermore, a groove is provided on the bottom wall of the heat coagulation rod, a stopper is slidably installed in the groove, a second spring is installed between the stopper and the groove, a third air pipe is fixedly installed on the top wall of the groove, and an exhaust valve whose output end is connected to the third air pipe is inserted on the buffer airbag, a first magnet is embedded in the stopper, a second magnet is embedded in the limit frame, and the first magnet and the second magnet repel each other.

[0015] Compared with the prior art, the present invention has the following beneficial effects: (1) This solution sets a buffer airbag to reduce the vibration of the injection pump while allowing air to be sucked in through the air inlet valve and the first air pipe. The first air pipe then sucks air from the connecting hole through the linkage component and the connecting component. At this time, the airflow can drive the material on the top wall of the chip to flow into the linkage component, thereby preventing impurities from adhering to the top wall of the chip and affecting the chip's use effect, resulting in the need for time-consuming rework, thereby improving production efficiency. (2) This scheme sets a collecting rod, which drives the push rod to move downward during the downward movement of the injection rod. During the downward movement of the push rod, the push rod gradually contacts the top wall of the limit frame, and then the top wall of the limit frame drives the push rod to move upward. During the upward movement of the push rod, the collecting rod is driven upward through the horizontal plate, and during the upward movement of the collecting rod, the connecting hole is driven upward. After the connecting hole is connected with the second air pipe, the buffer airbag can inhale air through the air inlet valve, the first air pipe, the collecting box, the second air pipe, and the connecting hole. That is, as the buffer airbag is gradually stretched, the pressure in the buffer airbag gradually decreases, thereby improving the suction force of the connecting hole, thereby improving the cleaning effect of the chip and further improving the production efficiency. This solution sets a scraper. When the collecting box rod moves upward along the vertical slot, the pressure in the vertical slot gradually increases. Then, under the action of the pressure, the airflow in the vertical slot flows into the linkage slot, and the pressure in the linkage slot increases. Then, under the action of the pressure, the scraper is driven to move along the linkage slot. During the movement of the scraper, the filter can be cleaned to avoid dust accumulation on the bottom wall of the filter, which affects the normal passage of the airflow through the filter and requires the user to stop production and frequently clean the filter, thereby further improving production efficiency. (4) This scheme sets a limit plate. During the movement of the push plate, the limit plate is driven to move downward through the inclined groove. Then, during the movement of the limit plate downward, the limit plate gradually loses contact with the push groove. At this time, the push plate can push the chip into the discharge slot along the push groove. After the chip passes through the discharge slot and enters the positioning groove, the output end of the hydraulic rod contracts and drives the push plate to reset. During the reset of the push plate, the push plate gradually loses contact with the storage slot. Then, under the action of gravity, the chip enters the push groove. As the push plate moves, the push plate gradually loses contact with the inclined groove. At this time, the first spring stretches and drives the limit plate to move upward. Then, under the action of the limit plate, the chip can be prevented from falling into the outside through the discharge slot when not pushed by the push plate, thereby affecting the normal development of production work and further improving production efficiency. (5) In this scheme, a stopper is set, and when the mounting plate moves upward, the first magnet and the second magnet move away from each other, and then the second spring stretches and drives the stopper to gradually move out of the groove. At the same time, the buffer airbag is compressed when the mounting plate moves upward. At this time, the air flow in the buffer airbag flows into the groove through the exhaust valve and the third air pipe, and then flows to the outside through the groove, thereby accelerating the air flow rate around the positioning groove, thereby accelerating the cooling of the packaging liquid and further improving the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 For the present invention Figure 1 Enlarged view of point A in the middle; Figure 3 It is a combined diagram of the glue injection rod and the glue injection rod of the collection box of the present invention; Figure 4 For the present invention Figure 3 Enlarged view of point B in the middle; Figure 5 It is a cross-sectional view of the conveying block, the push plate and the limit plate of the present invention; Figure 6 It is a combined diagram of the heat solidification rod, the stopper, and the second spring of the present invention; Figure 7 is a cross-sectional view of the cushioning airbag of the present invention; Figure 8 is a cross-sectional view of a collecting rod of the present invention; Fig. 9 It is a combination diagram of the limit block and the second magnet of the present invention.

[0017] Description of the numbers in the figure: 1. Workbench; 2. Mounting frame; 3. Top plate; 4. Electric telescopic rod; 5. Mounting plate; 6. Glue injection rod; 7. Absorption component; 701. Glue storage chamber; 702. Glue injection pump; 703. Glue injection tube; 704. Buffer airbag; 705. Air inlet valve; 706. First air pipe; 707. Transmission plate; 708. Placement slot; 709. Limiting frame; 710. Positioning slot; 8. Linkage assembly; 801. Horizontal plate; 802. Return spring; 803. Push rod; 804. Collecting box; 805. Connecting assembly; 8051. Second air pipe; 8052. Collecting rod; 8053. Connecting hole; 8054. Vertical slot; 806. Filter screen; 807. Scraper; 9. Conveying assembly; 901. Conveying block; 902. Storage slot; 903. Hydraulic rod; 904. Discharging slot; 905. Push plate; 906. Limiting slot; 907. Limiting plate; 908. First spring; 909. Inclined slot; 101, vertical block; 102, heat solidification rod; 103, stopper; 104, second spring; 105, third air pipe; 106, exhaust valve; 107, first magnet; 108, second magnet. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention.

[0019] See also Figures 1 to 9 , an acceleration sensor packaging assembly, comprising a workbench 1, a mounting frame 2 is fixedly mounted on the top wall of the workbench 1, a top plate 3 is fixedly mounted on the mounting frame 2, an electric telescopic rod 4 is vertically mounted on the top plate 3, a mounting plate 5 is fixedly mounted on the output end of the electric telescopic rod 4, a glue injection rod 6 is fixedly mounted on the bottom wall of the mounting plate 5, and an absorption component 7 is provided on the glue injection rod 6; The absorption component 7 includes a glue storage cavity 701 opened on the glue injection rod 6, a glue injection pump 702 is installed on the glue injection rod 6, a glue injection tube 703 is fixedly installed on the output end of the glue injection pump 702, a buffer air bag 704 is installed between the mounting plate 5 and the top plate 3, an air intake valve 705 is inserted on the buffer air bag 704, a first air pipe 706 is installed on the input end of the air intake valve 705, a transmission plate 707 is rotatably installed on the top wall of the workbench 1, a placement groove 708 is opened on the top wall of the transmission plate 707, a limit frame 709 is detachably installed in the placement groove 708, a positioning groove 710 is opened on the limit frame 709, a conveying component 9 for conveying the chip into the limit frame 709 is provided on the mounting plate 5, and a linkage component 8 cooperating with the first air pipe 706 is provided on the glue injection rod 6.

[0020] The linkage assembly 8 includes a slide groove opened on the glue injection rod 6, a horizontal plate 801 is slidably installed in the slide groove, a return spring 802 is installed between the top wall of the horizontal plate 801 and the slide groove, a push rod 803 is fixedly installed on the bottom wall of the horizontal plate 801, a collection box 804 is detachably installed on the side wall of the glue injection rod 6, and the collection box 804 is connected to one end of the first air pipe 706 away from the air inlet valve 705 of the buffer airbag 704, a control assembly is provided on the horizontal plate 801, and a connecting assembly 805 connected to the control assembly is inserted on the collection box 804.

[0021] The connecting component 805 includes a second air pipe 8051 inserted on the collecting box 804, a collecting rod 8052 is fixedly installed on the horizontal plate 801, a connecting hole 8053 connected to the second air pipe 8051 is opened on the collecting rod 8052, and a vertical groove 8054 slidingly matched with the collecting rod 8052 is opened on the injection rod 6.

[0022] A filter screen 806 cooperating with the first air pipe 706 is fixedly mounted on the collecting box 804 , and a linkage groove communicating with the vertical groove 8054 is provided on the glue injection rod 6 , and a scraper 807 is slidably mounted in the linkage groove.

[0023] When in use, the user can put the limit frame 709 into the placement groove 708, and then the conveying component 9 can convey the chip to the positioning groove 710. At this time, the transmission disk 707 on the workbench 1 can drive the limit frame 709 to the bottom of the glue injection rod 6 through the placement groove 708, and then the output end of the electric telescopic rod 4 extends and drives the installation disk 5 to move downward. In the process of the installation disk 5 moving downward, it drives the glue injection rod 6 to move downward. After the glue injection rod 6 is in contact with the top wall of the limit frame 709, the glue injection pump 702 drives the packaging liquid in the glue storage cavity 701 to flow to the chip through the glue injection tube 703, thereby achieving the purpose of packaging. At the same time, During the operation of the glue injection pump 702, the buffer airbag 704 can absorb the vibration of the glue injection pump 702, thereby achieving the packaging effect and stretching the buffer airbag 704 during the downward movement of the mounting plate 5. At this time, the buffer airbag 704 draws air through the air inlet valve 705 and the first air pipe 706, and then the first air pipe 706 draws air from the connecting hole 8053 through the linkage component 8 and the connecting component 805. At this time, the airflow can drive the material on the top wall of the chip to flow into the linkage component 8, thereby preventing impurities from adhering to the top wall of the chip and affecting the use effect of the chip, resulting in the need for time-consuming rework, thereby improving production efficiency.

[0024] After the cushion airbag 704 inhales air through the air inlet valve 705 and the first air pipe 706, the first air pipe 706 inhales air from the connecting component 805 through the collection box 804 and the second air pipe 8051, thereby driving the dust to flow into the collection box 804, facilitating the collection of dust and preventing the dust from adhering to the surface of other chips, further improving the chip cleaning effect, and driving the push rod 803 to move downward during the downward movement of the injection rod 6. During the downward movement of the push rod 803, it gradually contacts the top wall of the limit frame 709, and then the top wall of the limit frame 709 drives the push rod 803 to move upward. During the upward movement, the collecting rod 8052 is driven to move upward through the horizontal plate 801, and the connecting hole 8053 is driven to move upward during the upward movement of the collecting rod 8052. After the connecting hole 8053 is connected with the second air pipe 8051, the buffer airbag 704 can inhale air through the air intake valve 705, the first air pipe 706, the collecting box 804, the second air pipe 8051, and the connecting hole 8053. That is, as the buffer airbag 704 gradually stretches, the pressure inside the buffer airbag 704 gradually decreases, which increases the suction force of the connecting hole 8053, thereby improving the cleaning effect of the chip and further improving the production efficiency.

[0025] After the dust flows to the collection box 804, the filter 806 is set to prevent the dust from flowing into the buffer airbag 704 and affecting the normal operation of the buffer airbag 704. At the same time, in the process of the collection box 804 rod moving upward along the vertical groove 8054, the pressure in the vertical groove 8054 gradually increases. Then, under the action of the pressure, the airflow in the vertical groove 8054 flows into the linkage groove, and the pressure in the linkage groove increases. Then, under the action of the pressure, the scraper 807 is driven to move along the linkage groove. In the process of the scraper 807 moving, the filter 806 can be cleaned to prevent dust from accumulating on the bottom wall of the filter 806, affecting the normal airflow through the filter 806, and requiring users to stop production and frequently clean the filter 806, thereby further improving production efficiency.

[0026] After the chip packaging is completed, the user can first turn off the glue injection pump 702, and then control the output end of the electric telescopic rod 4 to extend. At this time, the first reset spring 802 extends and drives the push rod 803 to reset through the horizontal plate 801. During the reset of the horizontal plate 801, it drives the collecting rod 8052 to reset. During the reset of the collecting rod 8052, the pressure in the vertical groove 8054 decreases, and then the scraper 807 is reset under the action of pressure, which prepares for packaging again.

[0027] like Figure 5 As shown, the conveying assembly 9 includes a conveying block 901 opened on the bottom wall of the mounting plate 5, the conveying block 901 is provided with a storage groove 902, a hydraulic rod 903 is fixedly installed on the side wall of the conveying block 901, a pushing groove is opened on the conveying block 901, a discharge groove 904 is opened on the bottom wall of the pushing groove, and a push plate 905 fixedly connected to the output end of the hydraulic rod 903 is horizontally slidably installed in the pushing groove.

[0028] The conveying block 901 is provided with a limiting groove 906 , in which a U-shaped limiting plate 907 is vertically slidably installed, a first spring 908 is installed between the limiting plate 907 and the limiting groove 906 , and an inclined groove 909 is provided on the limiting plate 907 .

[0029] By adopting the above technical solution, after the user places the limit frame 709 in the placement slot 708, the output end of the electric telescopic rod 4 drives the conveying block 901 to move downward through the mounting plate 5, and aligns the discharge slot 904 with the positioning slot 710, and then the user can control the output end of the hydraulic rod 903 to extend, and drive the push plate 905 to move during the extension of the output end of the hydraulic rod 903, and then drive the chip to move toward the discharge slot 904 during the movement of the push plate 905, and enter the positioning slot 710 through the discharge slot 904, so that the user does not need to spend time loading materials, thereby improving production efficiency.

[0030] The first spring 908 extends and drives the limiting plate 907 to move upward, and then, under the action of the limiting plate 907, the chip can be prevented from falling into the outside through the discharging chute 904 when not pushed by the push plate 905, thereby affecting the normal development of production work and further improving production efficiency.

[0031] like Figure 6 , Figure 7 , Fig. 9 As shown, a vertical block 101 is fixedly mounted on the bottom wall of the mounting plate 5 , and a heat coagulation rod 102 slidably matched with the positioning groove 710 is evenly fixedly mounted on the bottom wall of the vertical block 101 .

[0032] A groove is provided on the bottom wall of the heat coagulation rod 102, a stopper 103 is slidably installed in the groove, a second spring 104 is installed between the stopper 103 and the groove, a third air pipe 105 is fixedly installed on the top wall of the groove, and an exhaust valve 106 whose output end is connected to the third air pipe 105 is inserted on the buffer airbag 704, a first magnet 107 is embedded in the stopper 103, a second magnet 108 is embedded in the limit frame 709, and the first magnet 107 and the second magnet 108 repel each other.

[0033] By adopting the above technical solution, after the output end of the electric telescopic rod 4 contracts and drives the mounting plate 5 to reset, the transmission plate 707 can rotate 90 degrees again and drive the packaged chip to move below the heat coagulation rod 102. Then, during the downward movement of the mounting plate 5, the heat coagulation rod 102 is driven to move into the positioning groove 710 through the vertical block 101. When the heat coagulation rod 102 moves into the positioning groove 710, the second magnet 108 drives the stopper 103 into the groove through the repulsive force. At this time, the second spring 104 is compressed and has a tendency to recover. Then, the heat coagulation rod 102 can be In order to perform a thermal solidification operation on the packaged chip, the first magnet 107 and the second magnet 108 move away from each other during the upward movement of the mounting plate 5, and then the second spring 104 extends and drives the block 103 to gradually move out of the groove. At the same time, the buffer airbag 704 is compressed during the upward movement of the mounting plate 5. At this time, the airflow in the buffer airbag 704 flows into the groove through the exhaust valve 106 and the third air pipe 105, and flows to the outside through the groove, thereby accelerating the air flow rate around the positioning groove 710, thereby accelerating the cooling of the packaging liquid and further improving production efficiency.

[0034] Instructions for use: During use, the user can place the limit frame 709 into the placement slot 708, and then the conveying component 9 can convey the chip into the positioning slot 710. At this time, the transmission disk 707 on the workbench 1 can drive the limit frame 709 to the bottom of the glue injection rod 6 through the placement slot 708, and then the output end of the electric telescopic rod 4 extends and drives the installation disk 5 to move downward. In the process of the installation disk 5 moving downward, it drives the glue injection rod 6 to move downward. After the glue injection rod 6 is in contact with the top wall of the limit frame 709, the glue injection pump 702 drives the packaging liquid in the glue storage cavity 701 to flow to the chip through the glue injection tube 703, thereby achieving the purpose of packaging. At the same time, during the operation of the glue injection pump 702, the buffer airbag 704 can absorb the glue injection. The vibration of the pump 702 can stretch the buffer airbag 704 through the packaging effect and the process of the mounting plate 5 moving downward. At this time, the buffer airbag 704 draws air through the air inlet valve 705 and the first air pipe 706, and then the first air pipe 706 draws air from the connecting hole 8053 through the linkage component 8 and the connecting component 805. At this time, the airflow can drive the material on the top wall of the chip to flow into the linkage component 8; after the buffer airbag 704 draws air through the air inlet valve 705 and the first air pipe 706, the first air pipe 706 draws air from the connecting component 805 through the collection box 804 and the second air pipe 8051, thereby driving the dust to flow into the collection box 804, which is convenient for collecting dust and preventing dust from adhering to other chip surfaces. The chip cleaning effect is further improved, and the push rod 803 is driven to move downward in the process of the glue injection rod 6 moving downward, and gradually contacts with the top wall of the limit frame 709 in the process of the push rod 803 moving downward, and then the top wall of the limit frame 709 drives the push rod 803 to move upward, and drives the collecting rod 8052 to move upward through the horizontal plate 801 in the process of the push rod 803 moving upward, and drives the connecting hole 8053 to move upward in the process of the collecting rod 8052 moving upward, and after the connecting hole 8053 is connected with the second air pipe 8051, the buffer airbag 704 can inhale air through the air inlet valve 705, the first air pipe 706, the collecting box 804, the second air pipe 8051, and the connecting hole 8053, that is, with the buffer air As the bag 704 is gradually stretched, the pressure in the buffer air bag 704 gradually decreases, thereby increasing the suction force of the connecting hole 8053. After the dust flows into the collection box 804, the filter screen 806 is provided to prevent the dust from flowing into the buffer air bag 704 and affecting the normal operation of the buffer air bag 704. Meanwhile, during the upward movement of the rod of the collection box 804 along the vertical groove 8054, the pressure in the vertical groove 8054 gradually increases. Then, under the action of the pressure, the airflow in the vertical groove 8054 flows into the linkage groove, and the pressure in the linkage groove increases. Then, under the action of the pressure, the scraper 807 is driven to move along the linkage groove. During the movement of the scraper 807, the filter screen 806 can be cleaned to prevent dust from accumulating on the bottom wall of the filter screen 806.After the user places the limit frame 709 in the placement slot 708, the output end of the electric telescopic rod 4 drives the conveying block 901 to move downward through the mounting plate 5, and aligns the discharge slot 904 with the positioning slot 710. Then the user can control the output end of the hydraulic rod 903 to extend, and drive the push plate 905 to move during the extension of the output end of the hydraulic rod 903. Then, during the movement of the push plate 905, the chip is driven to move toward the discharge slot 904 and enter the positioning slot 710 through the discharge slot 904; during the movement of the push plate 905, the limit plate 907 is driven downward through the inclined slot 909, and then During the downward movement of the limit plate 907, it gradually loses contact with the push groove. At this time, the push plate 905 can push the chip into the discharge groove 904 along the push groove. Then, after the chip passes through the discharge groove 904 and enters the positioning groove 710, the output end of the hydraulic rod 903 contracts and drives the push plate 905 to reset. During the reset of the push plate 905, it gradually loses contact with the storage groove 902. Then, under the action of gravity, the chip enters the push groove, and as the push plate 905 moves, the push plate 905 gradually loses contact with the inclined groove 909. At this time, the first spring 908 stretches and drives the limit plate 907 to move upward, and then The positioning plate 907 can prevent the chip from falling into the outside through the discharge slot 904 when it is not pushed by the push plate 905; after the output end of the electric telescopic rod 4 contracts and drives the mounting plate 5 to reset, the transmission plate 707 can rotate 90 degrees again and drive the packaged chip to move below the heat coagulation rod 102, and then drive the heat coagulation rod 102 to move into the positioning groove 710 through the vertical block 101 during the downward movement of the mounting plate 5. When the heat coagulation rod 102 moves into the positioning groove 710, the second magnet 108 drives the stopper 103 into the groove through the repulsive force, and the second spring 104 is compressed at this time. And has a tendency to recover, then the heat coagulation rod 102 can perform heat coagulation operation on the packaged chip, and the first magnet 107 and the second magnet 108 are separated during the upward movement of the mounting plate 5, and then the second spring 104 stretches and drives the stopper 103 to gradually move out of the groove. At the same time, the buffer airbag 704 is compressed during the upward movement of the mounting plate 5. At this time, the airflow in the buffer airbag 704 flows into the groove through the exhaust valve 106 and the third air pipe 105, and flows to the outside through the groove, so that the air flow rate around the positioning groove 710 can be accelerated, thereby accelerating the cooling of the packaging liquid. ;

[0035] The above is only a preferred specific implementation of the present invention; however, the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and its improved conception within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An acceleration sensor packaging assembly, comprising a workbench (1), a mounting frame (2) fixedly mounted on the top wall of the workbench (1), a top plate (3) fixedly mounted on the mounting frame (2), an electric telescopic rod (4) vertically mounted on the top plate (3), a mounting plate (5) fixedly mounted on the output end of the electric telescopic rod (4), a glue injection rod (6) fixedly mounted on the bottom wall of the mounting plate (5), and an absorption assembly (7) provided on the glue injection rod (6); Features: The absorption component (7) comprises a glue storage chamber (701) provided on a glue injection rod (6); a glue injection pump (702) is installed on the glue injection rod (6); a glue injection tube (703) is fixedly installed on the output end of the glue injection pump (702); a buffer air bag (704) is installed between the mounting plate (5) and the top plate (3); an air intake valve (705) is inserted into the buffer air bag (704); a first air pipe (706) is installed on the input end of the air intake valve (705); and the working A transmission disk (707) is rotatably mounted on the top wall of the workbench (1); a placement groove (708) is provided on the top wall of the transmission disk (707); a limit frame (709) is detachably mounted in the placement groove (708); a positioning groove (710) is provided on the limit frame (709); a conveying assembly (9) for conveying the chip into the limit frame (709) is provided on the mounting disk (5); and a linkage assembly (8) cooperating with the first air pipe (706) is provided on the glue injection rod (6).

2. The acceleration sensor package assembly according to claim 1, characterized in that: The linkage assembly (8) comprises a slide groove provided on the injection rod (6), a horizontal plate (801) being slidably mounted in the slide groove, a return spring (802) being mounted between the top wall of the horizontal plate (801) and the slide groove, a push rod (803) being fixedly mounted on the bottom wall of the horizontal plate (801), a collection box (804) being detachably mounted on the side wall of the injection rod (6), and the collection box (804) being connected to an end of the first air pipe (706) away from the air inlet valve (705) of the buffer airbag (704), a control assembly being arranged on the horizontal plate (801), and a connecting assembly (805) being connected to the control assembly being inserted into the collection box (804).

3. The acceleration sensor package assembly according to claim 2, characterized in that: The connecting component (805) comprises a second air pipe (8051) inserted into the collecting box (804); a collecting rod (8052) is fixedly mounted on the horizontal plate (801); a connecting hole (8053) connected to the second air pipe (8051) is formed on the collecting rod (8052); and a vertical groove (8054) slidably matched with the collecting rod (8052) is formed on the glue injection rod (6).

4. The acceleration sensor packaging assembly according to claim 3, characterized in that: A filter screen (806) cooperating with the first air pipe (706) is fixedly mounted on the collection box (804), and a linkage groove communicating with the vertical groove (8054) is provided on the glue injection rod (6), and a scraper (807) is slidably mounted in the linkage groove.

5. The acceleration sensor packaging assembly according to claim 4, characterized in that: The conveying assembly (9) comprises a conveying block (901) disposed on the bottom wall of the mounting plate (5), the conveying block (901) being provided with a storage groove (902), a hydraulic rod (903) being fixedly mounted on the side wall of the conveying block (901), a pushing groove being disposed on the conveying block (901), a discharging groove (904) being disposed on the bottom wall of the pushing groove, and a push plate (905) being fixedly mounted in the pushing groove and being connected to the output end of the hydraulic rod (903) in a horizontally slidable manner.

6. The acceleration sensor packaging assembly according to claim 5, characterized in that: The conveying block (901) is provided with a limiting groove (906), a U-shaped limiting plate (907) is vertically slidably installed in the limiting groove (906), a first spring (908) is installed between the limiting plate (907) and the limiting groove (906), and an inclined groove (909) is provided on the limiting plate (907).

7. The acceleration sensor package assembly according to claim 6, characterized in that: A vertical block (101) is fixedly mounted on the bottom wall of the mounting plate (5), and a heat coagulation rod (102) that slidably cooperates with the positioning groove (710) is evenly fixedly mounted on the bottom wall of the vertical block (101).

8. The acceleration sensor packaging assembly according to claim 7, characterized in that: The bottom wall of the heat coagulation rod (102) is provided with a groove, a stopper (103) is slidably installed in the groove, a second spring (104) is installed between the stopper (103) and the groove, a third air pipe (105) is fixedly installed on the top wall of the groove, and an exhaust valve (106) whose output end is connected to the third air pipe (105) is inserted into the buffer airbag (704), a first magnet (107) is embedded in the stopper (103), and a second magnet (108) is embedded in the limit frame (709), and the first magnet (107) and the second magnet (108) repel each other.

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