Liquid cooling cabinet structure with cooling flow channel

Abstract

The invention relates to the technical field of liquid cooling structure design of electronic equipment, and discloses a liquid cooling case structure with a cooling runner, which comprises a case body formed by encircling a bottom plate, a top plate and four side plates, the first side plate and the second side plate in the four side plates are oppositely arranged, a cooling liquid inlet and a cooling liquid outlet are formed in the bottom plate, and a liquid cooling flow channel communicated with the cooling liquid inlet and the cooling liquid outlet is formed among the first side plate, the bottom plate and the top plate. According to the computer case, the liquid cooling flow channels which are communicated with one another are arranged in the bottom plate, the top plate and the first side plate of the case body, cooling liquid is introduced from the cooling liquid inlet of the bottom plate, flows through the bottom plate, the top plate and the first side plate and then flows out from the cooling liquid outlet in the bottom plate, the cooling liquid can circularly flow in the liquid cooling flow channels, heat generated by components is taken away, and the heat dissipation efficiency is improved. The heat dissipation efficiency in the case body is effectively improved, the heat dissipation problem of the high-power and low-flow-resistance case body is solved, and the stability of electronic equipment under long-time operation is guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of liquid cooling structure design of electronic equipment, and discloses a liquid cooling chassis structure with a cooling flow channel. Background Art

[0002] In the existing chassis body design, heat dissipation efficiency and flow resistance control are two major technical challenges. Traditional chassis bodies often face the problem of insufficient heat dissipation when operating at high power. At the same time, unreasonable flow channel design will lead to excessive flow resistance, affecting the circulation efficiency of the coolant. These problems are particularly prominent in high-power, high-density electronic devices, because they generate a lot of heat during operation and require an effective heat dissipation system to maintain the normal operating temperature of the equipment. In addition, excessive flow resistance will not only reduce the cooling efficiency, but may also increase the power consumption of the pump, thereby affecting the energy efficiency ratio of the entire system. Therefore, how to optimize the flow channel design to reduce flow resistance while ensuring sufficient heat dissipation capacity is an urgent problem to be solved in the current chassis body design field. Summary of the invention

[0003] The purpose of the present invention is to provide a liquid-cooled chassis structure with a cooling channel, which can effectively improve the heat dissipation efficiency inside the chassis body, solve the heat dissipation problem of a high-power, low-flow resistance chassis body, and ensure the stability of electronic equipment under long-term operation.

[0004] In order to achieve the above technical effects, the technical solution adopted by the present invention is:

[0005] A liquid-cooled chassis structure with a cooling channel comprises a chassis body, wherein the chassis body is mainly formed by a bottom plate, a top plate and four side plates; the four side plates are respectively a first side plate, a second side plate, a third side plate and a third side plate; wherein the first side plate and the second side plate are arranged opposite to each other, a coolant inlet and a coolant outlet are arranged on the bottom plate, and a liquid cooling channel connecting the coolant inlet and the coolant outlet is arranged between the first side plate, the bottom plate and the top plate.

[0006] Furthermore, weight-reducing grooves are respectively provided on the top plate and the bottom plate.

[0007] Furthermore, the weight-reducing groove of the bottom plate is arranged in a position close to the inner wall surface of the bottom plate, and the liquid-cooling channel of the bottom plate is arranged in a position close to the outer wall surface of the bottom plate.

[0008] Furthermore, rectangular protrusion structures are provided in the liquid cooling channels in the first side plate, the bottom plate and the top plate.

[0009] Furthermore, the flow channel inside the bottom plate (1) is formed by stacking and splicing three layers of cold plates, and the three layers of cold plates are welded into shape by a diffusion welding process.

[0010] Furthermore, the chassis body is welded into an integrated structure by a vacuum brazing process, with the top plate, the bottom plate, the first side plate, the second side plate, the third side plate and the fourth side plate.

[0011] Furthermore, the chassis body is provided with card slots for installing 14 electronic modules.

[0012] Furthermore, the cooling liquid supply flow rate of the chassis body is 6.25L / min, and the flow resistance of the liquid cooling channel in the chassis body is less than 55kPa.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention arranges interconnected liquid cooling channels in the bottom plate, top plate and first side plate of the chassis body, and allows the coolant to enter from the coolant inlet position of the bottom plate, flow through the bottom plate, top plate and first side plate, and then flow out from the coolant outlet on the bottom plate. The coolant can circulate in the liquid cooling channel to take away the heat generated by the components, effectively improving the heat dissipation efficiency inside the chassis body, solving the heat dissipation problem of a high-power, low-flow resistance chassis body, and ensuring the stability of the electronic equipment under long-term operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of a liquid cooling chassis with cooling channels in Embodiment 1 or 2;

[0015] Figure 2 A schematic diagram of a liquid cooling channel between the bottom plate, the top plate and the first side plate in Embodiment 1 or 2;

[0016] Figure 3 A three-dimensional diagram of the structure of a liquid-cooled chassis with cooling channels in Embodiment 1 or 2;

[0017] Among them, 1. bottom plate; 2. top plate; 3. first side plate; 4. second side plate; 5. coolant inlet; 6. coolant outlet; 7. liquid cooling channel; 8. weight reduction groove; 9. card slot. DETAILED DESCRIPTION

[0018] The present invention is further described in detail below in conjunction with the embodiments and drawings. However, it should not be understood that the scope of the above subject matter of the present invention is limited to the following embodiments, and all technologies realized based on the content of the present invention belong to the scope of the present invention.

[0019] Example 1

[0020] See also Figure 1-Figure 3A liquid-cooled chassis structure with a cooling channel comprises a chassis body, wherein the chassis body is mainly composed of a bottom plate 1, a top plate 2 and four side plates; the four side plates are respectively a first side plate 3, a second side plate 4, a third side plate and a third side plate; wherein the first side plate 3 and the second side plate 4 are arranged opposite to each other, a coolant inlet 5 and a coolant outlet 6 are arranged on the bottom plate 1, and a liquid cooling channel 7 connecting the coolant inlet 5 and the coolant outlet 6 is arranged between the first side plate 3, the bottom plate 1 and the top plate 2.

[0021] In this embodiment, by setting interconnected liquid cooling channels 7 in the bottom plate 1, top plate 2 and first side plate 3 of the chassis body, the coolant is introduced from the coolant inlet 5 of the bottom plate 1, flows through the bottom plate 1, the top plate 2 and the first side plate 3, and then flows out from the coolant outlet 6 on the bottom plate 1. The coolant can circulate in the liquid cooling channel 7 to take away the heat generated by the components, effectively improving the heat dissipation efficiency inside the chassis body, solving the heat dissipation problem of the high-power, low-flow resistance chassis body, and ensuring the stability of the electronic equipment under long-term operation.

[0022] Under the condition that the overall dimensions of the chassis body meet the requirements, in this embodiment, weight-reducing grooves 8 are respectively provided on the top plate 2 and the bottom plate 1 to achieve the purpose of reducing the weight of the chassis body. The design of the weight-reducing grooves 8 not only helps to reduce the weight of the overall structure, but also improves the convenience of carrying and installing the chassis body without sacrificing the structural strength, so that the chassis body meets the requirements of efficient heat dissipation and lightweight at the same time.

[0023] In this embodiment, a rectangular protrusion structure is provided in the liquid cooling channel 7 in the first side plate 3, the bottom plate 1 and the top plate 2, which can increase the area of ​​contact between the coolant and the heat, so that the coolant can exchange with more heat when flowing through the liquid cooling channel 7, accelerate the heat transfer process, and enable the chassis body to more effectively control the operating temperature of the electronic equipment, extend the service life of the equipment, and thus reduce the risk of failure caused by overheating. In addition, the shape and layout of the rectangular protrusion structure in this embodiment are designed to ensure the uniformity and stability of the coolant flow and avoid excessive fluid resistance or local overheating.

[0024] Example 2

[0025] See also Figure 1-Figure 3, this embodiment combines the use requirements of a certain type of host and proposes a liquid-cooled chassis structure design with a cooling channel. Among them, the overall height of the chassis body is limited to 310mm, the height of the module installed inside the chassis body is 248mm, and the thickness of the top plate 2 and the bottom plate 1 of the chassis body reaches 38.5mm under the condition that a 0.5mm gap is left at the upper and lower ends of the module; at the same time, since the liquid cooling coolant inlet 5 of the chassis body is close to the lower end surface of the chassis body, the coolant has a smaller heat dissipation effect when it is close to the module, so there is a large height difference between the coolant inlet 5 and the heat dissipation surface, and it is necessary to repeatedly iterate the layout path of the flow channel in combination with the structural characteristics of the chassis body. The coolant needs to experience multiple drops, rises and drops inside the chassis body flow channel to complete heat dissipation and circulation. Secondly, the number of modules installed inside the electronic device is large (14 modules), and the maximum heat consumption of a single module is 150W, which puts forward high requirements on the heat dissipation capacity of the module-cooled chassis body, and it is necessary to increase the heat dissipation area of ​​the flow channel. Finally, the chassis body is connected in parallel with other devices in the system to centrally supply liquid, requiring that the flow resistance of the chassis body cannot be greater than 55kpa.

[0026] According to the above-mentioned design requirements, the liquid-cooled chassis structure with a cooling channel in this embodiment includes a chassis body, which is mainly composed of a bottom plate 1, a top plate 2 and four side plates; the four side plates are respectively a first side plate 3, a second side plate 4, a third side plate and a third side plate; wherein, the first side plate 3 and the second side plate 4 are arranged opposite to each other, a coolant inlet 5 and a coolant outlet 6 are arranged on the bottom plate 1, and a liquid cooling channel 7 connecting the coolant inlet 5 and the coolant outlet 6 is arranged between the first side plate 3, the bottom plate 1 and the top plate 2.

[0027] In this embodiment, while ensuring that the overall dimensions of the chassis meet customer requirements, the top plate 2 and the bottom plate 1 of the chassis are treated to reduce weight, and weight reducing grooves 8 are designed at the module installation corresponding positions of the top plate 2 and the bottom plate 1, and the liquid cooling channel 7 should be as close to the module installation wall as possible; at the same time, cables need to be laid and components need to be installed on the inner side of the bottom plate 1, so the weight reduction design there is on the inner side, and therefore the liquid cooling channel 7 is close to the outer side of the cold plate.

[0028] In this embodiment, in order to increase the heat dissipation area of ​​the cold plate, a rectangular protrusion structure is designed inside the flow channel. The flow channel structure is relatively complex, so a diffusion welding process is used; the traditional bottom plate 1 is formed by welding an upper and lower structure. However, in this embodiment, the flow channel inlet is at a high height from the liquid cooling heat dissipation surface, and the coolant needs to rise to reach the heat dissipation area. Therefore, the bottom plate 1 adopts an upper, middle and lower three-layer cold plate structure. The coolant needs to first go down, then go up, and then go down again on the bottom cold plate to meet the heat dissipation requirements. The three-layer cold plate (plate structure with a liquid cooling flow channel) of this embodiment is processed into a bottom plate 1 assembly using a diffusion welding process.

[0029] In this embodiment, the second side plate 4, the top plate 2, the right cold plate, and the bottom plate 1 of the chassis frame are welded into a whole by a vacuum brazing process. The one-piece welded structure can better meet the electromagnetic compatibility requirements and structural strength requirements of the chassis.

[0030] In this embodiment, the chassis body is provided with card slots 9 for installing 14 electronic modules. The chassis body can accommodate 14 modules, the maximum thermal power consumption of the module is 150W, and the total power consumption is 1890W. By designing the chassis flow channel with high heat dissipation efficiency, the chassis body can meet the maximum temperature of the contact position with the module not exceeding 50°C; in addition, 35°C coolant is introduced into the chassis body at the coolant inlet 5, and the liquid supply flow rate is 6.25L / min. By designing the flow channel with low flow resistance, the liquid cooling flow channel 7 is connected in parallel → in series → in parallel inside the chassis body, which increases the heat dissipation area while reducing the flow resistance of the flow channel to ensure that the flow resistance of the chassis is less than 55kpa.

[0031] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A liquid cooling chassis structure with a cooling channel, characterized in that: The invention comprises a chassis body, wherein the chassis body is mainly formed by a bottom plate (1), a top plate (2) and four side plates; the four side plates are respectively a first side plate (3), a second side plate (4), a third side plate and a third side plate; wherein the first side plate (3) and the second side plate (4) are arranged opposite to each other, a cooling liquid inlet (5) and a cooling liquid outlet (6) are arranged on the bottom plate (1), and a liquid cooling channel (7) connecting the cooling liquid inlet (5) and the cooling liquid outlet (6) is arranged between the first side plate (3), the bottom plate (1) and the top plate (2).

2. The liquid cooling chassis structure with cooling channels according to claim 1, characterized in that: The top plate (2) and the bottom plate (1) are respectively provided with weight-reducing grooves (8).

3. The liquid cooling chassis structure with cooling channels according to claim 2, characterized in that: The weight-reducing groove (8) of the base plate (1) is arranged in a position inside the base plate (1) close to the inner wall surface of the base plate (1), and the liquid cooling channel (7) of the base plate (1) is arranged in a position close to the outer wall surface of the base plate (1).

4. The liquid cooling chassis structure with cooling channels according to claim 1, characterized in that: Rectangular protruding structures are provided in the liquid cooling channels (7) in the first side plate (3), the bottom plate (1) and the top plate (2).

5. The liquid cooling chassis structure with cooling channels according to claim 1, characterized in that: The flow channel inside the bottom plate (1) is formed by stacking and splicing three layers of cold plates, and the three layers of cold plates are welded into shape by a diffusion welding process.

6. The liquid cooling chassis structure with cooling channels according to claim 1, characterized in that: The chassis body is welded into an integrated structure by a vacuum brazing process, with the top plate (2), the bottom plate (1), the first side plate (3), the second side plate (4), the third side plate and the fourth side plate.

7. The liquid cooling chassis structure with cooling channels according to claim 1, characterized in that: The chassis body is provided with card slots (9) capable of installing 14 electronic modules.

8. The liquid cooling chassis structure with cooling channels according to claim 7, characterized in that: The cooling liquid supply flow rate of the chassis body is 6.25L / min, and the flow resistance of the liquid cooling channel (7) in the chassis body is less than 55kPa.

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