Large Warped Wafer Adsorption Device

Abstract

The present invention discloses a large warpage wafer adsorption device, which includes a base, a fixed seat and an adsorption platform. The fixed seat connects the base and the adsorption platform. The device further includes an adaptive sealing tube, a lifting assembly and a wafer traction mechanism. The adaptive sealing tube is arranged on the adsorption platform, the lifting assembly is arranged on the base, and the wafer traction mechanism is connected to the lifting assembly through a traction mechanism mounting bracket. The wafer traction mechanism can be controllably lifted under the action of the lifting assembly. After descending, the wafer fits with the adaptive sealing tube, and the adaptive sealing tube automatically adapts to the warpage of the wafer surface. Advantages: The simple-structured and small-sized lifting assembly drives the wafer traction mechanism to move up and down. The wafer traction mechanism pulls the wafer to move up and down. When the wafer moves down, the adaptive sealing tube automatically adapts to the warpage of the wafer and forms a negative pressure chamber with good sealing performance with the vacuum adsorption chamber on the adsorption platform. The position of the wafer is fixed by negative pressure. The overall structure of the device is simple, the use cost is low, and it is suitable for fixing large warpage wafers.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and particularly relates to a large warpage wafer adsorption device. Background Art

[0002] In semiconductor processing equipment, the device for wafer loading and adsorption is a key device. In the existing technology, general adsorption devices can only adsorb wafers without warpage on the plane.

[0003] With the update and replacement of the process, the wafer processing technology is becoming more and more complex, and the wafers are subjected to more and more processes, which will cause the wafers to have a certain warpage or deformation. This phenomenon is becoming more and more common in semiconductor processing, so the demand for a device that can adsorb warped wafers is becoming more and more urgent.

[0004] The existing adsorption devices can generally handle wafers with a warpage degree of several hundred micrometers. When the warpage is close to 1 mm, it is difficult for the existing adsorption devices to adsorb wafers with a warpage of about 1 mm, and the applicability is poor.

[0005] Some existing companies have made certain efforts in adsorbing warped wafers, but the wafer adsorption devices prepared by them have a large structure volume, are not concise enough, and have a complex structure, and the use cost is high.

[0006] Therefore, a wafer adsorption device is needed that can solve the problem of adsorbing warped wafers with a warpage of less than 3 mm, and also takes into account a simple structure, easy implementation and assembly, small space volume and low cost.

[0007] The publication number is CN116313980A, and the name is: Wafer Adsorption Device, which is a Chinese patent application. This application records that it includes a wafer chuck for adsorbing wafers. There are more than two adsorption areas on the adsorption surface of the wafer chuck, and the adsorption areas are separated by sealing rings; the adsorption areas can generate negative pressure to achieve zonal adsorption of the wafers.

[0008] The application of this wafer adsorption device mainly processes the adsorption surface of the wafer chuck into a form with multiple independent adsorption areas, and controls the adsorption process of the wafers by controlling different adsorption areas, so as to achieve the adsorption of warped wafers. This application can achieve the adsorption of warped wafers in terms of structure, but the overall structure of the technical solution of this application is relatively complex, the assembly difficulty is high, the volume is large, and the use cost is high. Summary of the Invention

[0009] The technical problem to be solved by the present invention is the problem that the existing wafer adsorption devices mentioned in the background art are difficult to apply to wafers with large warpage, and the existing wafer adsorption devices have a complex structure, are not easy to implement and assemble, have a large space volume and high cost.

[0010] To solve the above technical problems, a large warped wafer adsorption device is proposed, which is realized through the following technical solutions: A large warped wafer adsorption device includes a base, a fixed seat, and an adsorption platform. The fixed seat is arranged between the base and the adsorption platform to connect the base and the adsorption platform. It is characterized in that it further includes an adaptive sealing tube, a lifting assembly, and a wafer traction mechanism. The adaptive sealing tube is arranged on the adsorption platform, the lifting assembly is arranged on the base, and the wafer traction mechanism for pulling the wafer to move is connected to the lifting assembly through a traction mechanism mounting bracket. The wafer traction mechanism can be controllably lifted under the action of the lifting assembly. After descending, the surface of the wafer fits with the adaptive sealing tube to form a cavity for adsorbing the wafer with the adsorption platform. The adaptive sealing tube automatically adapts to fit the warped wafer and adsorbs it flat.

[0011] Preferably, the adsorption platform includes a vacuum adsorption cavity and a sealing tube placement groove. The vacuum adsorption cavity is recessed on the surface of the adsorption platform and is used for placing the adaptive sealing tube. The sealing tube placement groove is recessed on the surface of the adsorption platform. There is a gap between the sealing tube placement groove and the vacuum adsorption cavity. The setting of the vacuum adsorption cavity facilitates the formation of a pressure cavity for negatively adsorbing the wafer under negative pressure, which is convenient for fixing the wafer.

[0012] Preferably, a microporous ceramic plate is arranged in the vacuum adsorption cavity. The microporous ceramic plate is placed in the vacuum adsorption cavity, and the surface of the microporous ceramic plate is flush with the surface of the adsorption platform. The setting of the microporous ceramic plate facilitates the fitting with the surface of the wafer to prevent the wafer from being damaged due to negative pressure attraction and warping problems.

[0013] Preferably, the adaptive sealing tube includes a tube body and a tube body fixed end. The tube body fixed end is connected to the tube body, and the tube body is connected to the adsorption platform through the tube body fixed end. The setting of the adaptive sealing tube enables the adaptive sealing tube itself to automatically adapt to the warped shape of the wafer, ensuring the sealing performance during negative pressure attraction, facilitating the adsorption and fixation of the wafer, with a simple structure and high practicality.

[0014] Preferably, the tube body is made of flexible rubber and the inside of the tube body is hollow. Such a setting facilitates the adaptive sealing tube to automatically adapt to the warping of the wafer, ensuring the sealing performance of the vacuum adsorption cavity during negative pressure attraction, facilitating the adsorption and fixation of the wafer, with a simple structure and high practicality.

[0015] For the optimization of the technical solution of the present invention, the lifting component includes a telescopic cylinder and a lifting push rod. One end of the lifting push rod is connected to the mounting frame of the traction mechanism. The telescopic cylinder is arranged on the base, and a wedge-shaped guide block is arranged on the telescopic cylinder. The wedge-shaped guide block is in sliding fit with the other end of the lifting push rod. The lifting push rod is lifted and lowered under the action of the wedge-shaped guide block. The setting of the lifting component facilitates driving the movement of the wafer traction mechanism, facilitating pulling the wafer to fit on the adsorption platform, and facilitating fixing the wafer. The structure is simple, the operation is convenient, and the use cost is low.

[0016] For the optimization of the technical solution of the present invention, the mounting frame of the traction mechanism includes a fixed frame and a movable frame. The fixed frame is arranged on the adsorption platform, and the movable frame is placed inside the fixed frame. The movable frame is connected to the lifting push rod in the lifting component. The movable frame can be controllably lifted and lowered inside the fixed frame under the action of the lifting push rod. The setting of the mounting frame of the traction mechanism facilitates fixing the wafer traction mechanism and facilitating controlling the lifting of the wafer, and is convenient to use.

[0017] For the optimization of the technical solution of the present invention, a sealing ring is arranged at the connection between the movable frame and the adsorption platform, and a plurality of guide shafts for guiding the lifting of the movable frame are arranged between the fixed frame and the movable frame. The setting of the guide shafts facilitates stably driving the movable frame up and down.

[0018] For the optimization of the technical solution of the present invention, a return spring is arranged between the fixed frame and the movable frame. The movable frame is reset under the action of the return spring. Such a setting facilitates driving the movable frame to reset through the return spring, and the structure is simple and convenient to use.

[0019] For the optimization of the technical solution of the present invention, the wafer traction mechanism includes a traction rod. One end of the traction rod is connected to the movable frame in the mounting frame of the traction mechanism, and a suction cup is fixed at the other end of the traction rod. The traction rod contacts the wafer through the suction cup. Such a setting facilitates moving the position of the wafer, and at the same time is convenient for pulling the wafer to fit on the adsorption platform and facilitating fixing the wafer. The structure is simple, the operation is convenient, and the use cost is low.

[0020] The beneficial effects of the present invention compared with the prior art are:

[0021] The technical solution of the present invention uses a lifting component with a simple structure and small size to drive the wafer traction mechanism to move up and down. The wafer is pulled up and down by the wafer traction mechanism. When the wafer moves down, the adaptive sealing tube arranged on the adsorption platform automatically adapts to the warping of the wafer. A chamber with good sealing performance is formed by the adaptive sealing tube and the vacuum adsorption chamber on the adsorption platform, and then the position of the wafer is fixed by negative pressure suction. While the overall structure of the device is simple and the use cost is low, the adsorption and fixation of large-warpage wafers are realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic three-dimensional view of the present inventionFigure 1 (Wafer descending and adsorbing state);

[0023] Figure 2 This is a three - dimensional schematic of the present invention Figure 2 (Wafer ascending and returning state);

[0024] Figure 3 It is a three - dimensional schematic diagram of the adsorption platform;

[0025] Figure 4 It is a three - dimensional schematic diagram of the lifting component;

[0026] Figure 5 It is a three - dimensional schematic diagram of the traction mechanism mounting bracket;

[0027] Figure 6 It is an exploded view of the traction mechanism mounting bracket;

[0028] Figure 7 It is a three - dimensional schematic diagram of the wafer traction mechanism;

[0029] Figure 8 This is a partial cross - sectional view of the present invention;

[0030] Figure 9 It is Figure 8 The enlarged view at position A in

[0031] Figure 10 It is Figure 8 The enlarged view at position B in

[0032] Figure 11 This is an exploded view of the present invention;

[0033] Description of reference numerals: 1 - base, 2 - fixed seat, 3 - adsorption platform, 31 - vacuum adsorption cavity, 32 - sealing tube placement groove, 33 - sealing tube fixing groove, 4 - adaptive sealing tube, 41 - tube body, 42 - tube body fixed end, 5 - microporous ceramic plate, 6 - lifting component, 61 - telescopic cylinder, 62 - lifting push rod, 63 - guide wheel, 64 - wedge - shaped guide block, 7 - traction mechanism mounting bracket, 71 - fixed bracket, 72 - moving bracket, 73 - guide shaft mounting hole, 74 - traction rod mounting groove, 75 - guide shaft, 76 - guide shaft sleeve, 77 - return spring, 8 - wafer traction mechanism, 81 - traction rod, 82 - suction cup, 9 - negative pressure suction head. Specific embodiments

[0034] Next, the technical solutions in the embodiments of the present invention will be described in detail in conjunction with the attached Figure 1-11 drawings of the embodiments of the present invention.

[0035] Embodiment

[0036] As Figure 1 、 2As shown in Figure 11, a large warpage wafer adsorption device includes a base 1, a fixed base 2, an adsorption platform 3, an adaptive sealing tube 4, a lifting assembly 6, a traction mechanism mounting frame 7 and a wafer traction mechanism 8, wherein the adsorption platform 3 is connected to the base 1 through the fixed base 2, the adaptive sealing tube 4 is installed on the adsorption platform 3, the adaptive sealing tube 4 and the vacuum adsorption chamber 31 on the adsorption platform 3 together constitute a chamber for adsorbing the wafer, the wafer traction mechanism 8 is installed on the adsorption platform 3 through the traction mechanism mounting frame 7, the lifting assembly 6 is connected to the wafer traction mechanism 8, the wafer can be adsorbed through the wafer traction mechanism 8, and then the wafer is pulled up and down, so that the wafer can be stably adsorbed on the adsorption platform 3 through negative pressure.

[0037] The main function of the base 1 is to serve as a carrier for installing the entire wafer adsorption device. The entire device is installed on the working position through the base 1.

[0038] The main function of the fixing base 2 is to connect the adsorption platform 3 and the base 1 . At the same time, the fixing base 2 also separates a space for installing the lifting component 6 between the adsorption platform 3 and the base 1 .

[0039] The main function of the adsorption platform 3 is to support the wafer. At the same time, a vacuum adsorption chamber 31 is opened on the adsorption platform 3. The vacuum adsorption chamber 31 generates negative pressure on the adsorption platform 3 by using negative pressure to stably adsorb the wafer on the adsorption platform 3.

[0040] The main function of the adaptive sealing tube 4 is to automatically adapt to the deformed shape of the wafer, ensure the tightness of the fit between the wafer surface and the adsorption platform 3, improve the adsorption effect of the negative pressure on the wafer, so that the wafer can be stably adsorbed on the adsorption platform 3, and improve the stability of the wafer fixed on the adsorption platform 3.

[0041] The main function of the wafer pulling mechanism 8 is to contact the wafer, pull the wafer up or down, and then stably place the wafer on the adsorption platform 3, or lift the wafer to contact the front-end module of the external equipment for subsequent processes.

[0042] The main function of the traction mechanism mounting frame 7 is to install and fix the wafer traction mechanism 8 , so as to facilitate the installation of the wafer traction mechanism 8 on the back side of the adsorption platform 3 .

[0043] The main function of the lifting assembly 6 is to provide power for the wafer pulling mechanism 8 to rise. The lifting assembly 6 can drive the wafer pulling mechanism 8 to move upward.

[0044] like Figure 1 , 3 As shown in FIGS. 8 and 11 , the base 1 is a circular metal plate made of metal, and the lifting assembly 6 is fixed to the middle of the base 1 by screws.

[0045] The fixed base 2 is a metal base made of metal with a rectangular cross-section. The fixed base 2 is fixed on the surface of the base 1 by screws. And to improve stability, multiple fixed bases 2 are fixed on the base 1. In this embodiment, it is preferably to fix 3 fixed bases 2 on the base 1, and the 3 fixed bases 2 are evenly distributed on the base 1.

[0046] The adsorption platform 3 is a circular plate with a certain thickness. In this embodiment, it is preferably that the adsorption platform 3 is made of ceramic, and the adsorption platform 3 is connected to the fixed base 2 by screws.

[0047] Definition: In this embodiment, based on the base 1, the direction from the base 1 to the adsorption platform 3 is defined as upward, and vice versa as downward.

[0048] As Figure 3 、 8 As shown in 9, in order to facilitate the formation of an adsorption cavity and facilitate the adsorption of the wafer by negative pressure, on the upper surface of the adsorption platform 3, a circular groove is recessed perpendicularly to the surface of the adsorption platform 3, and this groove is named the vacuum adsorption cavity 31. At the same time, a circular through-hole connected to the outside is opened in the vacuum adsorption cavity 31, and this through-hole is named the negative pressure connection port. The negative pressure suction head 9 is screwed and fixed in the negative pressure connection port, and the negative pressure suction head 9 is located on the lower surface of the adsorption platform 3.

[0049] In order to facilitate the installation of the adaptive sealing tube 4, a circular groove is opened on the surface of the adsorption platform 3, and this groove is named the sealing tube placement groove 32. The diameter of the sealing tube placement groove 32 is larger than the diameter of the vacuum adsorption cavity 31. At the same time, in order to facilitate the fixation of the adaptive sealing tube 4, a circular groove is further recessed perpendicularly to the sealing tube placement groove 32 on the bottom surface of the sealing tube placement groove 32, and this groove is named the sealing tube fixing groove 33. The fixed end on the adaptive sealing tube 4 is fixed in the sealing tube fixing groove 33, and the tube body 41 of the adaptive sealing tube 4 is placed in the sealing tube placement groove 32.

[0050] The adaptive sealing tube 4 is a circular tube made of flexible rubber. The adaptive sealing tube 4 includes a tube body 41 and a tube body fixed end 42. The tube body 41 is a hollow tube with a circular cross-section. Such a setting enables the soft and hollow tube body 41 to automatically adapt to the warped shape of the wafer surface when the warped wafer surface contacts the adaptive sealing tube 4, facilitating the formation of a closed cavity among the wafer, the adaptive sealing tube 4, and the vacuum adsorption cavity 31, and further adsorbing the wafer.

[0051] In order to be applicable to wafers with different warping degrees, in this embodiment, it is preferably that the diameter of the tube body 41 is 10 mm.

[0052] To facilitate the fixation of the adaptive sealing tube 4, a circular tube body fixing end 42 is also fixed on the tube body 41 in the adaptive sealing tube 4. The tube body fixing end 42 is integrally annular, and the cross-sectional size of the tube body fixing end 42 is the same as that of the sealing tube fixing groove 33. The tube body fixing end 42 can be inserted into the sealing tube fixing groove 33 and fixed with glue.

[0053] The tube body fixing end 42 in the adaptive sealing tube 4 is fixed in the sealing tube fixing groove 33. About one-third of the tube body 41 is located in the sealing tube placement groove 32, and two-thirds of the tube body 41 protrudes from the upper surface of the adsorption platform 3. When the wafer is placed on the adsorption platform 3, it contacts the tube body 41 first.

[0054] When the wafer is adsorbed on the adsorption platform 3 and adsorbed flat under the action of negative pressure, to prevent the wafer from being broken due to the action of negative pressure, a circular microporous ceramic plate 5 is also placed in the vacuum adsorption cavity 31. The microporous ceramic plate 5 is a circular plate made of ceramic, and a plurality of micropores are evenly opened on the surface of the microporous ceramic plate 5. The microporous ceramic plate 5 is placed in the vacuum adsorption cavity 31, and the upper surface of the microporous ceramic plate 5 is flush with the upper surface of the adsorption platform 3. In this way, when using the negative pressure suction head 9 for negative pressure suction, the micropores on the microporous ceramic plate 5 can circulate air, facilitating the suction of the air in the vacuum adsorption cavity 31 to form a negative pressure space.

[0055] Regarding the adsorption process of the wafer: When the wafer is placed on the adsorption platform 3, since the upper end of the tube body 41 of the adaptive sealing tube 4 is higher than the upper surface of the adsorption platform 3, the upper end of the tube body 41 contacts the wafer surface first. When sucking the wafer with negative pressure, the wafer surface squeezes the tube body 41, and the tube body 41 deforms to adapt to the shape of the wafer, and then cooperates with the vacuum adsorption cavity 31 to form a sealed cavity. At this time, continuous negative pressure suction is carried out, and the surface of the wafer contacts the surface of the microporous ceramic plate 5, ensuring the adsorption effect and preventing the wafer from being deformed and damaged by negative pressure.

[0056] As Figure 1 、 4 shown in 8 and 11, the main function of the lifting component 6 is to drive the wafer traction mechanism 8 to lift, contact the wafer, and pull the wafer to the adsorption platform 3 to facilitate the fixation of the wafer.

[0057] The lifting component 6 includes a telescopic cylinder 61 and a lifting push rod 62. To reduce the occupancy of the installation space by the telescopic cylinder 61 and promote the miniaturization of the device, the telescopic cylinder 61 is placed flat on the upper surface of the base 1 and fixed with screws. One end of the lifting push rod 62 is connected to the telescopic cylinder 61, and the other end is connected to the wafer traction mechanism 8. The telescopic cylinder 61 can drive the lifting push rod 62 to move up and down to realize the up and down movement of the wafer traction mechanism 8.

[0058] In order to enable the telescopic cylinder 61 to drive the lifting push rod 62 to move up and down, a connecting mechanism is provided between the telescopic cylinder 61 and the lifting push rod 62. This connecting mechanism can be a crank and connecting rod mechanism. In this embodiment, a wedge-shaped block with a triangular cross-section is preferably provided, and this wedge-shaped block is named the wedge-shaped guiding block 64. The wedge-shaped guiding block 64 is connected to the telescopic cylinder 61 by screws. When the telescopic cylinder 61 extends, the wedge-shaped guiding block 64 moves, driving the cooperating lifting push rod 62 to move upward.

[0059] The lifting push rod 62 is a circular guide rod. In order to facilitate driving the lifting push rod 62 to rise by the wedge-shaped guiding block 64, a circular guiding wheel 63 is fixed at the end of the lifting push rod 62 by a pin. The guiding wheel 63 can rotate freely along the pin joint. The guiding wheel 63 is in contact with the inclined surface of the wedge-shaped guiding block 64. When the wedge-shaped guiding block 64 moves, the inclined surface of the wedge-shaped guiding block 64 applies pressure to the guiding wheel 63, thereby driving the lifting push rod 62 to move upward.

[0060] As Figure 5 、 6 shown in Figures 8 and 11, in order to facilitate the fixation of the wafer traction mechanism 8, a traction mechanism mounting bracket 7 is fixed on the lower surface of the adsorption platform 3. The wafer traction mechanism 8 is connected to the adsorption platform 3 through the traction mechanism mounting bracket 7.

[0061] The traction mechanism mounting bracket 7 includes a fixed bracket 71 and a movable bracket 72. The movable bracket 72 is placed inside the fixed bracket 71, and the fixed bracket 71 is fixed on the back of the adsorption platform 3.

[0062] The fixed bracket 71 is a circular plastic disk. Three rectangular brackets are integrally fixed to the arc-shaped side surface of the circular plastic disk. The three rectangular brackets are evenly spaced on the plastic disk.

[0063] Circular mounting holes are provided at the ends of the rectangular brackets. The entire fixed bracket 71 is fixed to the back of the adsorption platform 3 by screws. In order to improve the sealing performance of the contact surface between the fixed bracket 71 and the surface of the adsorption platform 3, a sealing washer is placed on the end surface of the fixed bracket 71, and the sealing performance of the connection can be improved through the sealing washer.

[0064] In order to facilitate the placement of the movable bracket 72 inside the fixed bracket 71, a movable bracket placement groove is recessed on the upper surface of the fixed bracket 71, and the movable bracket 72 is movably placed in the movable bracket placement groove.

[0065] The movable bracket 72 is made of plastic. The shape of the movable bracket 72 is the same as that of the fixed bracket 71, both being disks with three brackets fixed on the side. The size of the movable bracket 72 is smaller than that of the fixed bracket 71, and the movable bracket 72 can be stored inside the fixed bracket 71.

[0066] A circular through-hole is provided in the middle of the fixing frame 71. The other end of the lifting push rod 62 away from the guide wheel 63 passes through the circular through-hole and is fixedly connected to the moving frame 72. When the lifting push rod 62 moves up and down, it can drive the moving frame 72 to move up and down.

[0067] To increase the movement stroke of the moving frame 72, a groove for the moving frame 72 to move is also provided at the corresponding position on the back of the adsorption platform 3. This groove is named the stroke groove. When the moving frame 72 rises, the upper end of the moving frame 72 exceeds the upper end of the fixing frame 71 and enters the stroke groove.

[0068] To improve the stability of the moving frame 72 when rising or falling within the fixing frame 71, three circular guide shafts 75 are rotatably connected to the fixing frame 71. The three guide shafts 75 are evenly distributed within the fixing frame 71. At the corresponding positions on the moving frame 72, three circular through-holes are provided. This through-hole is named the guide shaft mounting hole 73. A guide shaft sleeve 76 is fixed in each guide shaft mounting hole 73. The guide shaft 75 with one end fixed to the fixing frame 71 is inserted into the guide shaft sleeve 76. When the moving frame 72 moves up and down, it slides along the cooperating guide shaft 75 and guide shaft sleeve 76, ensuring the stability of the movement.

[0069] To facilitate the installation of the traction rod 81 in the wafer traction mechanism 8, on the upper surface of the moving frame 72 and perpendicular to the moving frame 72, three circular grooves are also provided. This groove is named the traction rod mounting groove 74. One end of the traction rod 81 is rotatably connected in the traction rod mounting groove 74.

[0070] To facilitate the control of the moving frame 72 to lower and reset, a reset spring 77 is also placed in each traction rod mounting groove 74. The reset spring 77 is sleeved outside the traction rod 81. One end of the reset spring 77 abuts against the bottom surface of the traction rod mounting groove 74, and the other end abuts against the back of the adsorption platform 3. When the moving frame 72 moves upward, the reset spring 77 is compressed by the force.

[0071] As Figure 1 、 7 As shown in 8, 10, and 11, the wafer traction mechanism 8 includes a traction rod 81. The traction rod 81 is a rod with a circular cross-section. A thread is provided at one end of the traction rod 81. The traction rod 81 is rotatably connected in the traction rod mounting groove 74 through the thread.

[0072] To facilitate the traction rod 81 to pull the wafer up and down, a circular suction cup 82 is fixed at the other end of the traction rod 81. When the traction rod 81 contacts the wafer, the suction cup 82 preferentially contacts the wafer and adsorbs the wafer.

[0073] To facilitate the upward movement of the traction rod 81, relief holes are correspondingly provided on the adsorption platform 3 and the microporous ceramic plate 5. One end of the traction rod 81 with the suction cup 82 passes through the relief hole and is exposed outside.

[0074] Usage process of this embodiment:

[0075] Falling process, i.e., the wafer adsorption process:

[0076] After the wafer is positioned and calibrated in the equipment front-end module, it enters the process chamber (or detection chamber) from the equipment front-end module. Before falling onto the adsorption device, at this time, the traction rod 81 and the moving frame 72 are in the raised state, and the reset spring 77 is in the compressed state. Then, the fingers on the equipment front-end module place the wafer on the suction cup 82 on the traction rod 81. Then, the fingers of the equipment front-end module leave the wafer and return to the inside of the equipment front-end module. At this time, the suction cup 82 on the traction rod 81 adsorbs the wafer. Then, the telescopic cylinder 61 retracts, and the wedge-shaped guide block 64 disengages from the lifting push rod 62. At this time, the moving frame 72 descends under the action of the reset spring 77. At this time, the traction rod 81 descends with the wafer. The wafer will first contact the self-adaptive sealing tube 4. The traction rod 81 continues to descend. Due to the characteristics of the self-adaptive sealing tube 4, it will conform to the warping of the wafer and fit with the wafer, automatically adapting to the warping of the wafer and forming a vacuum boundary. At this time, the vacuum is activated at the negative pressure suction head 9, and a vacuum area is formed on the lower side of the wafer. Under the action of the atmosphere, the wafer moves downward until it contacts the surface of the adsorption platform 3 and is then firmly adsorbed by the vacuum for the next process detection.

[0077] Wafer rising, i.e., the wafer return process:

[0078] The negative pressure suction at the negative pressure suction head 9 is disconnected, and the atmospheric pressure is restored in the vacuum adsorption cavity 31 of the adsorption platform 3 below the wafer (the restoration process is a prior art and can be completed by injecting air into the vacuum adsorption cavity 31 through the negative pressure suction head 9). At this time, the wafer is no longer adsorbed. The telescopic cylinder 61 moves to drive the wedge-shaped guide block 64 to move, and then drives the lifting push rod 62 to move upward. At this time, the traction rod 81 rises to contact the wafer and then pushes the wafer to the highest point (this height can be designed as needed, generally about 10 mm). At this time, the fingers of the equipment front-end module extend under the wafer, and then the fingers move upward, generally moving about 6 mm upward, to lift the wafer. Then, the fingers carry the wafer back to the equipment front-end module, completing a cycle of the wafer in the detection chamber.

[0079] Advantages of the present invention:

[0080] The structure is simple. The technical solution of the present invention uses the self-adaptive sealing tube 4 that can automatically adapt to the warping of the wafer and the vacuum adsorption cavity 31 on the adsorption platform 3 to form an adsorption cavity, completing the adsorption of the warped wafer. The structure is simple, the operability is strong, and at the same time, the lifting component 6 that occupies a small space is used to control the wafer traction mechanism 8 to drive the wafer to rise and fall. The overall structure is simple, the use cost is low, the occupied space is small, and the assembly is convenient.

[0081] The above embodiments are only used to illustrate the technical idea of the present invention, and the protection scope of the present invention cannot be limited thereby. Any modification made on the basis of the technical solution according to the technical idea proposed by the present invention falls within the protection scope of the present invention.

Claims

1. A large warpage wafer adsorption device, comprising a base (1), a fixed seat (2) and an adsorption platform (3), the fixed seat (2) is arranged between the base (1) and the adsorption platform (3) and connects the base (1) and the adsorption platform (3), and is characterized in that: It further includes an adaptive sealing tube (4), a lifting assembly (6) and a wafer traction mechanism (8). The adaptive sealing tube (4) is arranged on the adsorption platform (3), the lifting assembly (6) is arranged on the base (1), and the wafer traction mechanism (8) for pulling the wafer to move is connected to the lifting assembly (6) through a traction mechanism mounting bracket (7). The wafer traction mechanism (8) can be controllably lifted under the action of the lifting assembly (6). After descending, the surface of the wafer fits with the adaptive sealing tube (4) to form a cavity for adsorbing the wafer with the adsorption platform (3). The adaptive sealing tube (4) automatically adapts to fit the warped wafer and adsorbs it flat; The adsorption platform (3) includes a vacuum adsorption cavity (31), and a microporous ceramic plate (5) is arranged in the vacuum adsorption cavity (31). The microporous ceramic plate (5) is placed in the vacuum adsorption cavity (31), and the surface of the microporous ceramic plate (5) is flush with the surface of the adsorption platform (3); The lifting assembly (6) includes a telescopic cylinder (61) and a lifting push rod (62). One end of the lifting push rod (62) is connected to the traction mechanism mounting bracket (7), and a guide wheel (63) is arranged at the other end. The telescopic cylinder (61) is arranged on the base (1), and a wedge-shaped guide block (64) is arranged on the telescopic cylinder (61). The wedge-shaped guide block (64) is movably matched with the guide wheel (63) at the other end of the lifting push rod (62). The lifting push rod (62) is lifted under the action of the wedge-shaped guide block (64); The wafer traction mechanism (8) includes a traction rod (81). One end of the traction rod (81) is connected to a moving frame (72) in the traction mechanism mounting bracket (7), and a suction cup (82) is fixed at the other end of the traction rod (81). The traction rod (81) contacts the wafer through the suction cup (82).

2. The large warped wafer adsorption device according to claim 1, wherein: The adsorption platform (3) includes a sealing tube placement groove (32). The vacuum adsorption cavity (31) is recessed on the surface of the adsorption platform (3), and the sealing tube placement groove (32) for installing the adaptive sealing tube (4) is recessed on the surface of the adsorption platform (3). There is a gap between the sealing tube placement groove (32) and the vacuum adsorption cavity (31).

3. The large warped wafer adsorption device according to claim 1, characterized in that: The adaptive sealing tube (4) includes a tube body (41) and a tube body fixed end (42). The tube body fixed end (42) is connected to the tube body (41), and the tube body (41) is connected to the adsorption platform (3) through the tube body fixed end (42).

4. The large warped wafer adsorption device according to claim 3, wherein: The tube body (41) is made of flexible rubber, and the inside of the tube body (41) is hollow.

5. The large warped wafer adsorption device according to claim 1, characterized in that: The traction mechanism mounting bracket (7) includes a fixed bracket (71) and a moving bracket (72). The fixed bracket (71) is arranged on the adsorption platform (3), and the moving bracket (72) is placed in the fixed bracket (71). The moving bracket (72) is connected to the lifting push rod (62) in the lifting assembly (6), and the moving bracket (72) can be controllably lifted in the fixed bracket (71) under the action of the lifting push rod (62).

6. The large warped wafer adsorption device according to claim 5, wherein: A sealing ring is arranged at the connection between the moving bracket (72) and the adsorption platform (3), and a plurality of guide shafts (75) for guiding the lifting of the moving bracket (72) are arranged between the fixed bracket (71) and the moving bracket (72).

7. The large warped wafer adsorption device according to claim 5, wherein: A return spring (77) is provided between the fixed frame (71) and the movable frame (72), and the movable frame (72) is reset under the action of the return spring (77).

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