Integrated design method for 5G communication module of new energy automobile core power supply

Abstract

The invention discloses an integrated design method for a 5G communication module of a new energy automobile core power supply, relates to the technical field of new energy automobiles, and aims to solve the technical problem that the current method is difficult to effectively deal with the problems of signal interference, power supply fluctuation and electrostatic discharge. And planning the spatial position layout of the PCB, and dividing the PCB into functional areas. Various functional modules are creatively integrated on the PCB, the problems of signal interference, power supply fluctuation and electrostatic discharge when the new energy automobile core power supply and the 5G communication module are integrated are solved, and the stability, reliability and electromagnetic compatibility of the system are effectively improved through fine design and synergistic effect of all the steps. According to the invention, the capability of facing the problems of signal interference, power supply fluctuation and electrostatic discharge after integration is greatly improved, so that the stability, reliability and electromagnetic compatibility of the system are enhanced.

Description

Technical Field

[0001] The present invention relates to the field of new energy vehicle technology, and more specifically, to a 5G communication module integrated design method for a core power supply of a new energy vehicle. Background Art

[0002] In recent years, under the background of global advocacy of green travel and rapid technological progress, the new energy vehicle industry has shown a booming development trend, its market share has continued to rise, and technological innovation has also changed with each passing day. At the same time, 5G communication technology has rapidly become popular with its significant advantages such as ultra-high speed, low latency and large capacity. Under this situation, the ingenious integration of 5G communication modules into the core power system of new energy vehicles has become the core element and key to further improving the level of vehicle intelligence. This can not only achieve more efficient and accurate information interaction between vehicles and the outside world, such as real-time road condition perception, remote vehicle control, etc., but also provide solid technical support for cutting-edge functions such as autonomous driving and smart cockpits, thereby greatly enhancing the market competitiveness of new energy vehicles and leading a new revolution in future travel.

[0003] However, the integration of core power supply and 5G communication module of new energy vehicles in the existing technology has obvious defects. In terms of signal interference, due to the lack of reasonable layout and shielding measures, the signals of each module affect each other, resulting in poor communication signal quality and error-prone data transmission, which affects the realization of vehicle intelligent functions. In terms of power fluctuation, the power supply is not effectively filtered and stabilized, making the voltage unstable, which may cause component damage and unstable system operation. There is no perfect protection mechanism for electrostatic discharge. After static electricity accumulates, it is easy to cause damage to electronic components, reduce system reliability, increase maintenance costs and failure risks, and it is difficult to meet the high requirements of new energy vehicles for electronic system stability, reliability and electromagnetic compatibility, which hinders its further development. In view of this, we propose a 5G communication module integrated design method for the core power supply of new energy vehicles. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art, adapt to actual needs, and provide a 5G communication module integrated design method for the core power supply of new energy vehicles to solve the technical problems that the current method is difficult to effectively deal with when facing signal interference, power supply fluctuations and electrostatic discharge problems.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: a 5G communication module integrated design method for a core power supply of a new energy vehicle, comprising the following steps:

[0006] S1: Layout planning: According to the internal components of the BMS module and the structure of the PCB board, plan the spatial layout of the PCB board and divide the PCB board into functional areas;

[0007] S2: Component placement: Classify the components of the PCB board and place different components in corresponding functional areas;

[0008] S3: Area wiring: wiring between each functional area;

[0009] S4: Module construction: Add corresponding PCB board auxiliary devices, and design electromagnetic interference suppression module, anti-static discharge module, electromagnetic interference module, radio frequency signal transmission module and abnormal protection module on the PCB board of the core power supply;

[0010] S5: Three-proof reinforcement: perform three-proof treatment on PCB board;

[0011] S6: Program packaging: burn the program into the PCB board and package the patch for testing.

[0012] Preferably, the structure of the PCB board in the step S1 includes a heat dissipation layer, a bottom circuit layer, a dielectric layer and a surface circuit layer from bottom to top, the heat dissipation layer is a copper clad layer, and the bottom circuit layer and the surface circuit layer are solder mask pattern layers, silk screen layers, character layers or device layers; the structure of the PCB board is arranged to be a first PCB board, a second PCB board, a third PCB board, a fourth PCB board, a fifth PCB board and a sixth PCB board from bottom to top, the bottom circuit layer and the surface circuit layer are located between the first PCB board, the second PCB board, the third PCB board, the fourth PCB board, the fifth PCB board and the sixth PCB board, the dielectric layer is located between two adjacent PCB boards, and the dielectric layer is made of epoxy resin.

[0013] Preferably, in step S4, an electromagnetic interference suppression module is designed, specifically as follows: the EMI module designs a DC-DC suppression module and a 5G radio frequency signal suppression module; the DC-DC suppression module is provided with a series inductor filter and a capacitor filter, and the 5G radio frequency signal suppression module is designed with a low-pass filter;

[0014] The filtering effect of the DC-DC suppression module is approximately calculated by the following formula to calculate the attenuation degree of the noise of a specific frequency f:

[0015]

[0016] Among them, Z in (f) is the complex representation of the impedance of the input signal source at frequency f, Z filter (f) is composed of series inductor L, input filter capacitor C A and C B , output filter capacitor C C And the grounding filter capacitor C D The equivalent impedance of the filter circuit composed of .

[0017] Preferably, an input filter circuit is connected in series to the input end of the voltage stabilizer in the DC-DC suppression module, and the input filter circuit is capacitor A and capacitor B; an output filter circuit is connected in series to the output end of the voltage stabilizer, and the output filter circuit is a capacitor; a grounding filter circuit is connected in series to the ground end of the voltage stabilizer, and the grounding filter circuit is capacitor D; the positive electrode of the voltage stabilizer is grounded through capacitor B and capacitor, and one end of the capacitor is grounded; the negative electrode of the voltage stabilizer and one end of capacitor B are grounded through capacitor D.

[0018] Preferably, a 5G module is provided on the PCB board, and an energy storage filter circuit is connected in series to the output end of the voltage stabilizing device, and the energy storage filter circuit is located between the output end of the voltage stabilizing device and the power supply module of the 5G module. The power supply module of the 5G module is a power conversion module, and an output filter circuit is connected in series to the output end of the power conversion module, and the output filter circuit is a capacitor E. The grounding end of the power conversion module is connected in series to a grounding filter circuit, and the grounding filter circuit is capacitors F and G. The output end of the power conversion module is grounded through capacitors E and F, and the capacitors F and G are connected in series.

[0019] Preferably, the design of the anti-static discharge module in step S4 is specifically as follows: the vias of the PCB board are wired, the peripheral vias of the PCB board are connected to the outermost vias on the PCB board through routing, a capacitor H and a capacitor I are connected in parallel between the peripheral vias and the outermost vias, both ends of the capacitor H are respectively connected to the power conversion module through the outermost vias, both ends of the capacitor I are respectively connected to the ground plane of the PCB board through the outermost vias, the outermost vias are connected to the capacitor H and the capacitor I through the vias, a resistor A and a resistor B are connected in parallel between the capacitor H and the capacitor I, one end of the resistor B is connected to the ground plane of the PCB board, and the other end is connected to the power conversion module of the PCB board, and one end of the resistor A and the capacitor I are connected to the ground plane of the PCB board.

[0020] Preferably, the electromagnetic interference module is designed in step S4 as follows: a metal layer is designed on the ground plane of the PCB board, a power supply DC / DC module is arranged in the electromagnetic interference module, the ground plane of the power supply DC / DC module adopts a copper clad layer, and the copper clad layer is connected to the ground plane of the PCB board; the copper clad layer adopts four layers of copper clad layers, and metal layers are arranged between the four layers of copper clad layers; the widths of adjacent copper layers in the four layers of copper clad layers are consistent, and the metal layer is a hydrocarbon resin insulating material.

[0021] Preferably, a radio frequency signal transmission module is designed in step S4, specifically as follows: a radio frequency processing circuit is provided on the PCB board, the radio frequency processing circuit is placed on the transmission path of the circuit signal, the radio frequency processing circuit includes a first radio frequency processing module and a second radio frequency processing module, the radio frequency processing module includes a switch tube, an inductor and a capacitor connected in series, a filter circuit and an amplifier circuit are connected in series at the input end of the first radio frequency processing module, the input end of the filter circuit is connected to a 5G module through a capacitor J, and the output end of the radio frequency processing module is connected to a second attenuation circuit.

[0022] Preferably, an abnormal protection module is designed in step S4, specifically as follows: the abnormal protection module is set as an abnormal self-recovery module and an abnormal active discharge module, the abnormal self-recovery module includes a control chip, a MOSFET, the power supply terminal of the control chip is connected to the drain of the MOSFET, and a resistor is connected in parallel between the power supply terminal of the control chip and the drain of the MOSFET, a resistor C is connected between the ground terminal of the control chip and the gate of the MOSFET, and the ground terminal of the control chip is connected to the ground, the enable terminal of the control chip is connected to the source of the MOSFET, and a resistor is connected in parallel between the enable terminal of the control chip and the source of the MOSFET, and two solder resist layers are arranged between two adjacent PCBs.

[0023] Preferably, the PCB board is affixed with a layer of high temperature and corrosion resistant film before production, and the PCB board is surface treated after the film is affixed, and the surface treatment includes etching and cleaning the component area of ​​the PCB board by physical methods; the PCB board adopts a semi-cured sheet in production; the PCB board is heat treated, electroplated and packaged in sequence after production; the heat treatment temperature is 170-180°C, the heating time is 2-3min, and the electroplating temperature is 45-50°C.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] 1. The present invention innovatively integrates multiple functional modules into the PCB board, solving the signal interference, power supply fluctuation and electrostatic discharge problems faced when integrating the core power supply of new energy vehicles with the 5G communication module. Through the fine design and synergy of each step, the stability, reliability and electromagnetic compatibility of the system are effectively improved. The present invention greatly increases the ability to deal with signal interference, power supply fluctuation and electrostatic discharge problems after integration, and enhances the stability, reliability and electromagnetic compatibility of the system.

[0026] 2. The present invention rationally plans the spatial position layout of the PCB board according to the internal components of the BMS module and the structure of the PCB board, deeply analyzes the characteristics of the BMS module components and the structure of each layer of the PCB board, fully considers factors such as heat dissipation, signal transmission, and power distribution, and divides functional areas such as power management, 5G communication, and signal processing. The optimized layout optimizes signal integrity and reduces interference. The present invention improves the overall performance of the system, lays a solid foundation for subsequent component layout and wiring, and ensures the stable operation of the PCB board under complex working conditions.

[0027] 3. The present invention classifies components based on their functions and electrical characteristics, such as separating passive components such as capacitors and inductors from active components such as chips, and placing 5G communication chips in specific communication areas. In this way, during maintenance, technicians can quickly locate faulty components and reduce troubleshooting time. At the same time, the standardized layout facilitates upgrading and replacing components, reduces maintenance costs, improves the maintainability and service life of new energy vehicles, and makes the operation and maintenance of the entire electronic system more efficient and convenient. The present invention improves the efficiency of later maintenance by classifying PCB board components and placing them in corresponding functional areas. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the steps of the present invention. DETAILED DESCRIPTION

[0029] Embodiment 1, as Figure 1 As shown, the present invention relates to a 5G communication module integrated design method for a new energy vehicle core power supply, comprising the following steps:

[0030] S1: Layout planning: According to the internal components of the BMS module and the structure of the PCB board, the spatial position layout of the PCB board is planned, and the PCB board is divided into functional areas; the structure of the PCB board in step S1 includes a heat dissipation layer, a bottom circuit layer, a dielectric layer and a surface circuit layer from bottom to top, the heat dissipation layer is a copper cladding layer, and the bottom circuit layer and the surface circuit layer are solder mask pattern layers, silk screen layers, character layers or device layers; the structure of the PCB board is arranged from bottom to top as a first PCB board, a second PCB board, a third PCB board, a fourth PCB board, a fifth PCB board, and a sixth PCB board, the bottom circuit layer and the surface circuit layer are located between the first PCB board, the second PCB board, the third PCB board, the fourth PCB board, the fifth PCB board, and the sixth PCB board, the dielectric layer is located between two adjacent PCB boards, and the dielectric layer is made of epoxy resin.

[0031] In step S1, the multilayer structure design of the PCB board described is of great significance. As a copper-clad layer, the heat dissipation layer can not only effectively conduct the heat generated by the core power supply and the 5G communication module when working, but also provide stable mechanical support for the entire PCB board to a certain extent. The thickness and distribution of the copper layer can be optimized according to the actual heat dissipation requirements. For example, by simulating the heat conduction process, it is determined to increase the area and thickness of the copper cladding under the high-power components or in the heat-concentrated area to improve the heat dissipation efficiency and ensure that each component on the PCB board works in a suitable temperature environment, thereby improving the reliability and stability of the entire system.

[0032] The bottom circuit layer and the surface circuit layer contain multiple functional layers. For example, the solder mask pattern layer defines the welding area through precise graphic design, prevents the solder from flowing in unnecessary places, avoids the occurrence of short circuits and other problems, and improves the accuracy and reliability of welding; the silk screen layer and the character layer provide key identification information for the assembly, debugging and maintenance of the PCB board. The technicians can quickly and accurately complete the installation of components and the debugging of circuits according to the component outline on the silk screen layer and the component parameters and numbers on the character layer, which greatly improves the production efficiency and maintainability; the device layer is the key layer for placing electronic components, and its layout design needs to comprehensively consider factors such as signal transmission path, power distribution and heat dissipation. For example, for temperature-sensitive components, they should be kept as far away from areas with high heat generation as possible. At the same time, the signal transmission path should be as short as possible and avoid crossing to reduce signal interference and transmission delay.

[0033] The structural design of the six-layer PCB board (from bottom to top, the first PCB board to the sixth PCB board) uses epoxy resin as the dielectric layer in the middle. This material has good insulation performance and dielectric constant stability, and can effectively isolate each circuit layer to prevent electrical breakdown and signal crosstalk. At the same time, the mechanical properties of epoxy resin can also provide a certain strength and toughness for the PCB board, so that it can maintain the integrity of the structure under the vibration and impact environment during vehicle driving. In actual production, the performance of the dielectric layer can be optimized by controlling the curing process parameters of epoxy resin, such as temperature, pressure and time, to ensure that it meets the electrical and mechanical performance requirements of the PCB board under different working conditions.

[0034] S2: Component placement: Classify the components of the PCB board and place different components in corresponding functional areas;

[0035] S3: Area wiring: wiring between each functional area;

[0036] S4: Module construction: add corresponding PCB board auxiliary devices, and design electromagnetic interference suppression module, anti-static discharge module, electromagnetic interference module, radio frequency signal transmission module and abnormal protection module on the PCB board of the core power supply; the electromagnetic interference suppression module is designed in step S4, as follows: the EMI module designs a DC-DC suppression module and a 5G radio frequency signal suppression module; the DC-DC suppression module is provided with series inductor filtering and capacitor filtering, and the 5G radio frequency signal suppression module is designed with a low-pass filter.

[0037] An input filter circuit is connected in series at the input end of the voltage stabilizer in the DC-DC suppression module. The voltage stabilizer is H1223.6 / 04H. The input filter circuit is capacitor A and capacitor B. An output filter circuit is connected in series at the output end of the voltage stabilizer. The output filter circuit is a capacitor. A grounding filter circuit is connected in series at the ground end of the voltage stabilizer. The grounding filter circuit is capacitor D. The positive electrode of the voltage stabilizer is connected to ground through capacitor B and capacitor, and one end of the capacitor is grounded; the negative electrode of the voltage stabilizer and one end of capacitor B are grounded through capacitor D; capacitor A, capacitor B, capacitor and capacitor D are Y capacitor 120, respectively, and series capacitor 96, Y capacitor 116 and Y capacitor 112.

[0038] In the DC-DC suppression module, the voltage stabilizer H1223.6 / 04H is one of the key components. The input filter circuit (composed of a Y capacitor 120 and a series capacitor 96) at its input end can effectively filter out high-frequency noise and clutter signals in the input power supply. According to the filtering principle of capacitors, the Y capacitor 120 is mainly used to filter out common-mode noise. It is connected between the power line and the ground to provide a low-impedance path for high-frequency noise to flow to the ground, thereby reducing the common-mode interference entering the voltage stabilizer. The series capacitor 96 works in conjunction with the Y capacitor 120 to further optimize the filtering effect. By adjusting its capacitance value, the attenuation characteristics of noises of different frequencies can be changed, making the power input to the voltage stabilizer purer.

[0039] The output filter circuit (Y capacitor 116) connected in series with the output end of the voltage stabilizer is mainly used to filter out the ripple component in the output voltage to ensure that a stable DC power supply is provided to the subsequent circuit. The grounding filter circuit (Y capacitor 112) connected in series with the ground end helps to stabilize the ground potential of the voltage stabilizer, reduce noise interference in the ground loop, and improve the stability of the entire circuit.

[0040] The positive electrode of the voltage stabilizing device is grounded through capacitors 96 and 116, and the negative electrode and one end of capacitor 96 are grounded through capacitor 112. This capacitor connection method forms a complex filtering network, which can more effectively suppress various frequency noises in the power supply. By reasonably selecting the parameters of the capacitor (such as capacitance value, withstand voltage value, equivalent series resistance, etc.), the performance of this filtering network can be optimized so that it can achieve a good filtering effect at different operating frequencies. For example, according to the actual power supply noise spectrum analysis, a capacitor with a suitable capacitance value is selected to ensure effective attenuation of the main noise frequency components. At the same time, considering the influence of the equivalent series resistance of the capacitor on the filtering effect, a capacitor with a low equivalent series resistance is selected to reduce energy loss and signal distortion.

[0041] A 5G module is provided on the PCB board. An energy storage filter circuit is connected in series at the output end of the voltage stabilizer. The energy storage filter circuit is located between the output end of the voltage stabilizer and the power supply module of the 5G module. The power supply module of the 5G module is a power conversion module. The power conversion module is SW1223C6G6. An output filter circuit is connected in series at the output end of the power conversion module. The output filter circuit is a capacitor E. A grounding filter circuit is connected in series at the ground end of the power conversion module. The grounding filter circuit is capacitors F and G. The output end of the power conversion module is grounded through capacitors E and F. Capacitors F and G are connected in series. Capacitors E, F and G are capacitors 143, 144 and 145 respectively.

[0042] The design of the anti-static discharge module in step S4 is specifically as follows: the vias of the PCB board are wired, the peripheral vias of the PCB board are connected to the outermost vias on the PCB board through routing, capacitors H and I are connected in parallel between the peripheral vias and the outermost vias, both ends of capacitor H are connected to the power conversion module through the outermost vias, both ends of capacitor I are connected to the ground plane of the PCB board through the outermost vias, the outermost vias are connected to capacitor H and capacitor I through vias, resistors A and B are connected in parallel between capacitor H and capacitor I, one end of resistor B is connected to the ground plane of the PCB board, and the other end is connected to the power conversion module of the PCB board, and one end of resistor A and capacitor I are connected to the ground plane of the PCB board; capacitor H, capacitor I, resistor A and resistor B are capacitor 117, capacitor 121, resistor R118 and resistor R119 respectively.

[0043] In step S4, an electromagnetic interference suppression module is designed, specifically as follows: the EMI module designs a DC-DC suppression module and a 5G radio frequency signal suppression module; the DC-DC suppression module is provided with a series inductor filter and a capacitor filter, and the 5G radio frequency signal suppression module is designed with a low-pass filter;

[0044] The filtering effect of the DC-DC suppression module is approximately calculated by the following formula to calculate the degree of attenuation of noise of a specific frequency f:

[0045]

[0046] Among them, Z in (f) is the complex representation of the impedance of the input signal source at frequency f, Z filter (f) is composed of series inductor L, input filter capacitor C A and C B , output filter capacitor C C And the grounding filter capacitor C D The equivalent impedance of the filter circuit composed of .

[0047] In step S4, a radio frequency signal transmission module is designed, specifically as follows: a radio frequency processing circuit is provided on the PCB board, the radio frequency processing circuit is placed on the transmission path of the circuit signal, the radio frequency processing circuit includes a first radio frequency processing module and a second radio frequency processing module, the radio frequency processing module includes a switch tube, an inductor and a capacitor connected in series, the input end of the first radio frequency processing module is connected in series with a filter circuit and an amplifier circuit, the input end of the filter circuit is connected to a 5G module through a capacitor J, and the output end of the radio frequency processing module is connected to a second attenuation circuit; capacitor J is capacitor 123.

[0048] An abnormal protection module is designed in step S4, specifically as follows: the abnormal protection module is set as an abnormal self-recovery module and an abnormal active discharge module, the abnormal self-recovery module includes a control chip, a MOSFET, the power supply end of the control chip is connected to the drain of the MOSFET, and a resistor is connected in parallel between the power supply end of the control chip and the drain of the MOSFET, a resistor C is connected between the ground end of the control chip and the gate of the MOSFET, and the ground end of the control chip is connected to the ground, the enable end of the control chip is connected to the source of the MOSFET, and a resistor is connected in parallel between the enable end of the control chip and the source of the MOSFET, and two solder resist layers are arranged between two adjacent PCBs; the size width of the solder resist layer is 1.4mm, and the size thickness of the solder resist layer is 0.03mm; the solder resist of the solder resist layer is formed by screen printing; the solder resist layer and the solder resist ink are thermosetting or UV curing; the solder resist ink is composed of silicon aluminum oxide, sodium oxide, potassium oxide, magnesium oxide, zinc oxide, phosphoric acid, manganese oxide, boron, sodium silicate, potassium silicate, magnesium silicate, titanium dioxide, polyvinyl alcohol, starch, sodium gelatin, and water.

[0049] S5: Three-proof reinforcement: The PCB board is subjected to three-proof treatment; a layer of high-temperature and corrosion-resistant film is affixed to the PCB board before production, and the PCB board is subjected to surface treatment after the film is affixed. The surface treatment includes etching and cleaning the component area of ​​the PCB board by physical methods; semi-cured sheets are used in the production of PCB boards; the PCB boards are subjected to heat treatment, electroplating and packaging in sequence after production; the heat treatment temperature is 170°C, the heating time is 2 minutes, and the electroplating temperature is 45°C; the semi-cured sheet uses one of the glass fiber cloths of FR-4, CEM-3, CEM-4 and PPS.

[0050] S6: Program packaging: burn the program into the PCB board and package the patch for testing.

[0051] The embodiments of the present invention disclose preferred embodiments, but are not limited thereto. A person skilled in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. However, as long as they do not deviate from the spirit of the present invention, they are all within the protection scope of the present invention.

Claims

1. A 5G communication module integrated design method for a core power supply of a new energy vehicle, characterized in that: The steps include: S1: Layout planning: According to the internal components of the BMS module and the structure of the PCB board, plan the spatial layout of the PCB board and divide the PCB board into functional areas; S2: Component placement: Classify the components of the PCB board and place different components in corresponding functional areas; S3: Area wiring: wiring between each functional area; S4: Module construction: Add corresponding PCB board auxiliary devices, and design electromagnetic interference suppression module, anti-static discharge module, electromagnetic interference module, radio frequency signal transmission module and abnormal protection module on the PCB board of the core power supply; S5: Three-proof reinforcement: perform three-proof treatment on PCB board; S6: Program packaging: burn the program into the PCB board and package the patch for testing.

2. According to claim 1, a 5G communication module integrated design method for a new energy vehicle core power supply is characterized in that: The structure of the PCB board in step S1 includes a heat dissipation layer, a bottom circuit layer, a dielectric layer and a surface circuit layer from bottom to top, the heat dissipation layer is a copper clad layer, the bottom circuit layer and the surface circuit layer are solder mask pattern layers, silk screen layers, character layers or device layers; the structure of the PCB board is arranged to be a first PCB board, a second PCB board, a third PCB board, a fourth PCB board, a fifth PCB board and a sixth PCB board from bottom to top, the bottom circuit layer and the surface circuit layer are located between the first PCB board, the second PCB board, the third PCB board, the fourth PCB board, the fifth PCB board and the sixth PCB board, the dielectric layer is located between two adjacent PCB boards, and the dielectric layer is made of epoxy resin.

3. According to claim 2, a 5G communication module integrated design method for a new energy vehicle core power supply is characterized in that: In step S4, an electromagnetic interference suppression module is designed, specifically as follows: the EMI module is designed with a DC-DC suppression module and a 5G radio frequency signal suppression module; the DC-DC suppression module is provided with a series inductor filter and a capacitor filter, and the 5G radio frequency signal suppression module is designed with a low-pass filter; The filtering effect of the DC-DC suppression module is approximately calculated by the following formula to calculate the attenuation degree of the noise of a specific frequency f: Among them, Z in (f) is the complex representation of the impedance of the input signal source at frequency f, Z filter (f) is composed of series inductor L, input filter capacitor C A and C B , output filter capacitor C C And the grounding filter capacitor C D The equivalent impedance of the filter circuit composed of .

4. According to claim 3, a 5G communication module integrated design method for a new energy vehicle core power supply is characterized in that: An input filter circuit is connected in series to the input end of the voltage stabilizer in the DC-DC suppression module, and the input filter circuit is capacitor A and capacitor B. An output filter circuit is connected in series to the output end of the voltage stabilizer, and the output filter circuit is a capacitor. A grounding filter circuit is connected in series to the ground end of the voltage stabilizer, and the grounding filter circuit is capacitor D. The positive electrode of the voltage stabilizer is grounded through capacitor B and capacitor, and one end of the capacitor is grounded; the negative electrode of the voltage stabilizer and one end of capacitor B are grounded through capacitor D.

5. According to claim 4, a 5G communication module integrated design method for a new energy vehicle core power supply is characterized in that: A 5G module is provided on the PCB board, and an energy storage filter circuit is connected in series to the output end of the voltage stabilizing device, and the energy storage filter circuit is located between the output end of the voltage stabilizing device and the power supply module of the 5G module. The power supply module of the 5G module is a power conversion module, and an output filter circuit is connected in series to the output end of the power conversion module, and the output filter circuit is a capacitor E. A grounding filter circuit is connected in series to the ground end of the power conversion module, and the grounding filter circuit is capacitors F and G. The output end of the power conversion module is grounded through capacitors E and F, and the capacitors F and G are connected in series.

6. According to the 5G communication module integrated design method of the core power supply of a new energy vehicle according to claim 5, it is characterized in that: The design of the anti-static discharge module in step S4 is specifically as follows: the vias of the PCB board are wired, the peripheral vias of the PCB board are connected to the outermost vias on the PCB board through routing, a capacitor H and a capacitor I are connected in parallel between the peripheral vias and the outermost vias, both ends of the capacitor H are connected to the power conversion module through the outermost vias, both ends of the capacitor I are connected to the ground plane of the PCB board through the outermost vias, the outermost vias are connected to the capacitor H and the capacitor I through the vias, a resistor A and a resistor B are connected in parallel between the capacitor H and the capacitor I, one end of the resistor B is connected to the ground plane of the PCB board, and the other end is connected to the power conversion module of the PCB board, and one end of the resistor A and the capacitor I are connected to the ground plane of the PCB board.

7. The 5G communication module integrated design method of a new energy vehicle core power supply according to claim 6 is characterized in that: The electromagnetic interference module is designed in step S4 as follows: a metal layer is designed on the ground plane of the PCB board, a power supply DC / DC module is arranged in the electromagnetic interference module, the ground plane of the power supply DC / DC module adopts a copper clad layer, and the copper clad layer is connected to the ground plane of the PCB board; the copper clad layer adopts four layers of copper clad layers, and metal layers are arranged between the four layers of copper clad layers; the widths of adjacent copper layers in the four layers of copper clad layers are consistent, and the metal layer is a hydrocarbon resin insulating material.

8. The 5G communication module integrated design method of a new energy vehicle core power supply according to claim 7 is characterized in that: In the step S4, a radio frequency signal transmission module is designed, specifically as follows: a radio frequency processing circuit is provided on the PCB board, the radio frequency processing circuit is placed on the transmission path of the circuit signal, the radio frequency processing circuit includes a first radio frequency processing module and a second radio frequency processing module, the radio frequency processing module includes a switch tube, an inductor and a capacitor connected in series, a filter circuit and an amplifier circuit are connected in series at the input end of the first radio frequency processing module, the input end of the filter circuit is connected to a 5G module via a capacitor J, and the output end of the radio frequency processing module is connected to a second attenuation circuit.

9. The 5G communication module integrated design method of a new energy vehicle core power supply according to claim 8 is characterized in that: An abnormal protection module is designed in the step S4, specifically as follows: the abnormal protection module is set as an abnormal self-recovery module and an abnormal active discharge module, the abnormal self-recovery module includes a control chip, a MOSFET, the power supply terminal of the control chip is connected to the drain of the MOSFET, and a resistor is connected in parallel between the power supply terminal of the control chip and the drain of the MOSFET, a resistor C is connected between the ground terminal of the control chip and the gate of the MOSFET, and the ground terminal of the control chip is connected to the ground, the enable terminal of the control chip is connected to the source of the MOSFET, and a resistor is connected in parallel between the enable terminal of the control chip and the source of the MOSFET, and two solder resist layers are arranged between two adjacent PCBs.

10. The 5G communication module integrated design method of a new energy vehicle core power supply according to claim 9 is characterized in that: The PCB board is affixed with a layer of high temperature and corrosion resistant film before production, and the PCB board is surface treated after the film is affixed, and the surface treatment includes etching and cleaning the component area of ​​the PCB board by physical methods; the PCB board adopts a semi-cured sheet in production; the PCB board is heat treated, electroplated and packaged in sequence after production; the heat treatment temperature is 170-180°C, the heating time is 2-3min, and the electroplating temperature is 45-50°C.

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