Semiconductor wafer material processing device and method

Abstract

The invention relates to the technical field of semiconductor wafer processing, in particular to a semiconductor wafer material processing device and a method thereof.The semiconductor wafer material processing device comprises a machine frame, a cutting piece rotationally installed in the machine frame, a supporting cylinder, a material receiving assembly and a material conveying assembly, the conveying device is mounted right above the supporting cylinder in a sliding manner and is used for collecting and conveying the cut wafers; and the cleaning assembly is used for cleaning the multiple sets of cutting steel wires, the cleaning assembly comprises two sliding rods located on the two sides of the cutting steel wires correspondingly, and cleaning rollers used for cleaning the cutting steel wires are fixedly installed on the sliding rods. According to the wafer bar cutting device, the material collecting assembly is installed above the supporting barrel in a sliding mode, collecting work after wafer bar cutting is completed is rapidly and efficiently completed, and the overall efficiency of wafer bar cutting is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer processing, and in particular to a semiconductor wafer material processing device and method thereof. Background Art

[0002] In the processing of semiconductor wafer materials, a wire cutting machine is needed to cut silicon ingots. This steel wire is usually called diamond wire, also known as diamond cutting wire or diamond saw wire. The high-speed rotating roller drives the diamond wire to move to complete the cutting process. Although the existing wafer cutting device can efficiently complete the cutting process of the wafer bar, it needs to be stopped after the cutting is completed to remove the cut wafer from the cutting device. This processing method will affect the processing efficiency of the wafer bar cutting process. Summary of the invention

[0003] In view of the above-mentioned shortcomings of the prior art, the present invention provides a semiconductor wafer material processing device and method thereof, which can effectively solve the problem that although the prior art wafer cutting device can efficiently complete the cutting process of wafer rods, it needs to be shut down after cutting is completed to remove the cut wafers from the cutting device. This processing method will affect the processing efficiency of wafer rod cutting.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: The present invention provides a semiconductor wafer material processing device, comprising a frame and a cutting piece rotatably mounted inside the frame, driving components for driving the cutting piece to rotate are fixedly mounted on both sides of the frame, a feeding port for adding wafer bars is arranged on the side of the frame, and the cutting piece comprises three driving rollers distributed in an inverted triangle shape and a plurality of cutting steel ropes spaced apart and sleeved on the three driving rollers; A support cylinder is used to hold the wafer bar and drive the wafer bar to move upward to the cutting piece for cutting. A semicircular support groove is arranged above the support cylinder along the length direction. A plurality of cutting grooves are arranged at intervals on the support cylinder. A telescopic piece is arranged on the inner wall of the frame to drive the support cylinder to move up and down. The material receiving assembly is slidably mounted just above the supporting cylinder and is used to collect and transport the cut wafers; A cleaning assembly is used for cleaning multiple groups of cutting wires. The cleaning assembly comprises two sliding rods respectively located on both sides of the cutting wires, and cleaning rollers for cleaning the cutting wires are fixedly mounted on the sliding rods.

[0005] Furthermore, the material receiving device includes a semicircular arc suction cup, the lower end face contour of the arc suction cup is semicircular, the lower end face of the arc suction cup is spaced apart with a plurality of slots for wafers to slide into, and the lower ends of both sides of the arc suction cup are provided with elastic limiting protrusions.

[0006] Furthermore, a plurality of piston grooves are arranged above the arc suction cup, and the plurality of piston grooves are respectively arranged above the plurality of card slots, and a plurality of adsorption holes are arranged at the bottom of each of the piston grooves, and the adsorption holes connect the piston groove and the card slot. A lifting plate is installed above the arc suction cup for sliding up and down, and the lifting plate is respectively provided with a plurality of sliding pistons for sliding into the plurality of piston grooves. During the rising process of the lifting plate, the sliding piston slides inside the piston groove, so that negative pressure is generated at the adsorption hole, thereby adsorbing the wafer.

[0007] Furthermore, a plurality of limit plates are arranged on both sides above the arc suction cup, a slide groove is arranged on the end surface of the limit plate facing the middle of the arc suction cup, a plurality of clamping blocks are arranged on both sides of the lifting plate, the plurality of clamping blocks are respectively located in the plurality of slide grooves and slide up and down, an elastic protruding ball is arranged on the clamping block, the elastic protruding ball is interference fit with the inner wall of the slide groove, and guide plates for pushing the lifting plate to move upward are arranged on both sides of the support tube.

[0008] Furthermore, guide rails are fixedly installed on the inner walls of both sides of the frame, and linear motors are arranged at both ends of the arc suction cup to drive the arc suction cup to move to one side of the frame; and receiving parts are arranged on the side of the frame to receive the wafer rods that have been cut.

[0009] Furthermore, a partition is fixedly installed inside the frame, the partition is located between the support cylinder and the lowest driving roller, the partition is provided with a plurality of through holes for the cutting steel rope to pass through, and the cleaning assembly is arranged below the partition.

[0010] Furthermore, two sliding rods respectively located on both sides of the cutting steel rope are horizontally slidably installed inside the frame, and a partition plate passes through the bottom of the guide plate. Two guide holes are provided on the guide plate for the middle parts of the two sliding rods to pass through. The two guide holes are distributed in a curved shape, and the two guide holes are symmetrical to each other. The two guide holes are used to drive the two sliding rods to move closer or farther away from each other during the up and down movement of the guide plate.

[0011] Furthermore, a circular cleaning groove is provided in the middle of the cleaning roller, a plurality of cleaning brushes are provided on the outer surface of the cleaning roller, a filter is fixedly installed inside the frame, the filter is located below the partition, and the filter is used to filter the gas inside the frame and discharge it out of the frame.

[0012] A semiconductor wafer material processing method, the processing method specifically comprises the following steps: Step 1: First, put the wafer bar with both ends cut into the support tube from the feed port on the side of the rack, and push the wafer bar to the designated position; Step 2: After that, the driving component is turned on to drive the cutting component to operate, and the telescopic component is driven to move upward, so as to drive the wafer bar material to move upward to the position of the cutting wire rope as a whole to complete the cutting process; Step 3: Then, continue to drive the cut wafer bar to move upward so that the upper part of the cut wafer bar is completely wrapped by the arc suction cup, and then drive the telescopic part back to the initial position. Step 4. Finally, the arc suction cup and the cut wafer bar below it are driven by the linear motor to move to the side exit of the rack. Beneficial Effects

[0013] Compared with the known public technology, the technical solution provided by the present invention has the following beneficial effects: 1. The present invention installs a material receiving assembly on the top of the support cylinder by sliding. After the support cylinder drives the wafer bar to complete cutting, the support cylinder can drive the cut wafer to move to the inside of the material receiving assembly to collect the cut wafer. After the collection is completed, the material receiving assembly transports the wafer to the side of the rack. At this time, the support cylinder returns to the initial position to start the cutting process of the next wafer bar, and the collection work after the wafer bar cutting is completed is completed quickly and efficiently.

[0014] 2. In the present invention, a slot is provided below the arc suction cup so that the cut wafer can be aligned and slid into the slot. Limiting protrusions with limiting elasticity are provided on both sides below the arc suction cup, so that both sides of the wafer can be conveniently supported from both sides of the bottom, so that the wafer can be more stably supported below the arc suction cup.

[0015] 3. In the present invention, a piston groove is provided above the arc suction cup and a sliding piston is provided below the lifting plate. When the cut wafer moves into the slot, the lifting plate is driven to rise, so that the sliding piston can be moved upward to generate negative pressure inside the piston groove, thereby causing the adsorption hole to produce an adsorption effect on the top of the wafer, so that the wafer is stably located below the arc suction cup.

[0016] 4. In the present invention, two groups of guide through holes are symmetrically arranged on the guide plate. When the guide plate moves up and down following the support tube, the two groups of guide through holes respectively drive the two sliding rods to move closer or farther away, so that the cleaning rollers on the sliding rods move closer to or farther away from the cutting steel rope. By repeatedly changing the distance between the cleaning roller and the cutting steel rope, different cleaning surfaces on the cleaning roller can be brought into contact with the cutting steel rope, so that the cutting debris remaining on the cutting steel rope can be cleaned off more efficiently, which can not only reduce the wear of the cutting steel rope, but also enable the cutting steel rope to cut the wafer rod more efficiently. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 is a cross-sectional side view of the present invention; Figure 3 It is a schematic diagram of the internal overall structure of the present invention; Figure 4 It is a schematic diagram of the overall installation structure of the support cylinder and the material receiving assembly of the present invention; Figure 5 It is a schematic diagram of the installation structure of the material receiving assembly and the support cylinder of the present invention; Figure 6 It is an exploded view of the installation structure of the material receiving assembly of the present invention; Figure 7 For the present invention Figure 6 A local enlarged structural schematic diagram; Figure 8 It is a schematic diagram of the overall structure of the cleaning component of the present invention.

[0019] The numbers in the figure represent: 1. Frame; 101. Feeding port; 11. Partition plate; 12. Guide rail; 13. Material receiving part; 2. Driving part; 3. Cutting part; 4. Support cylinder; 401. Cutting groove; 402. Support groove; 41. Guide plate; 4101. Guide through hole; 42. Telescopic member; 5. Wafer bar; 6. Material receiving assembly; 61. Arc suction cup; 6101. Piston groove; 6102. Card slot; 6103. Adsorption hole; 611. Linear motor; 612. Limiting protrusion; 62. Lifting plate; 621. Linkage plate; 622. Sliding piston; 623. Card block; 63. Limiting plate; 7. Cleaning assembly; 71. Sliding rod; 72. Cleaning roller; 73. Cleaning groove; 8. Filter element. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] The present invention will be further described below in conjunction with the embodiments.

[0022] Embodiment: A semiconductor wafer material processing device, such as Figure 1 - Figure 4 As shown, it includes a frame 1 and a cutting piece 3 rotatably mounted inside the frame 1, driving components 2 for driving the cutting piece 3 to rotate are fixedly mounted on both sides of the frame 1, and a feeding port 101 for adding wafer bars 5 is arranged on the side of the frame 1, and the cutting piece 3 includes three driving rollers distributed in an inverted triangle and a plurality of cutting steel ropes spaced apart and sleeved on the three driving rollers; The support cylinder 4 is used to hold the wafer bar 5 and drive the wafer bar 5 to move upward to the cutting piece 3 for cutting. A semicircular support groove 402 is provided on the upper side of the support cylinder 4 along the length direction. A plurality of cutting grooves 401 are provided at intervals on the support cylinder 4. A telescopic member 42 for driving the support cylinder 4 to move up and down is provided on the inner wall of the frame 1. The receiving assembly 6 is slidably mounted just above the supporting cylinder 4 and is used to collect and transport the cut wafers; The cleaning assembly 7 is used for cleaning multiple groups of cutting wires. The cleaning assembly 7 includes two sliding rods 71 ​​respectively located on both sides of the cutting wires. Cleaning rollers 72 for cleaning the cutting wires are fixedly mounted on the sliding rods 71.

[0023] In the present invention, the material receiving assembly 6 is slidably installed above the support cylinder 4. After the support cylinder 4 drives the wafer bar 5 to be cut, the support cylinder 4 can drive the cut wafer to move to the inside of the material receiving assembly 6 to collect the cut wafer. After the collection is completed, the material receiving assembly 6 transports the wafer to the side of the frame 1. At this time, the support cylinder 4 returns to the initial position to start the cutting process of the next wafer bar 5.

[0024] Furthermore, if Figure 5 and Figure 6As shown, the material receiving device 6 includes a semicircular arc suction cup 61, the lower end face contour of the arc suction cup 61 is semicircular, and the lower end face of the arc suction cup 61 is spaced apart with a plurality of slots 6102 for wafers to slide into, and the lower ends of both sides of the arc suction cup 61 are provided with elastic limiting protrusions 612.

[0025] Among them, by providing a clamping groove 6102 under the arc suction cup 61, the cut wafer can be aligned and slid into the clamping groove 6102, and by providing limiting elastic limiting protrusions 612 on both sides of the bottom of the arc suction cup 61, the two sides of the wafer can be conveniently supported from both sides of the bottom, so that the wafer is more stably supported under the arc suction cup 61; Furthermore, if Figure 6 and Figure 7 As shown, a plurality of piston grooves 6101 are arranged above the arc suction cup 61, and the plurality of piston grooves 6101 are respectively arranged above the plurality of card slots 6102, and a plurality of adsorption holes 6103 are arranged at the bottom of each of the piston grooves 6101, and the adsorption holes 6103 connect the piston groove 6101 and the card slot 6102, and a lifting plate 62 is installed to slide up and down above the arc suction cup 61, and the lifting plate 62 is respectively provided with a plurality of sliding pistons 622 for sliding into the plurality of piston grooves 6101, and during the rising process of the lifting plate 62, the sliding piston 622 slides inside the piston groove 6101, so that negative pressure is generated at the adsorption hole 6103, so as to adsorb the wafer.

[0026] Among them, by arranging a piston groove 6101 above the arc suction cup 61 and arranging a sliding piston 622 below the lifting plate 62, when the cut wafer moves into the slot 6102, the lifting plate 62 is driven to rise, so that the sliding piston 622 can move upward, so that negative pressure is generated inside the piston groove 6101, and then the adsorption hole 6103 produces an adsorption effect on the upper part of the wafer, so that the wafer is stably located below the arc suction cup 61; It should be noted that the inner wall of the slot 6102 on the lower end face of the arc suction cup 61 is paved with sealing gaskets. When the outer edge of the wafer contacts the side wall of the slot 6102, the entire interior of the slot 6102 is in a relatively closed space. At this time, the adsorption force generated by the upward movement of the sliding piston 622 can directly act on the outer peripheral surface of the wafer.

[0027] Furthermore, a plurality of limit plates 63 are provided on both sides above the arc suction cup 61, and a slide groove is provided on the end surface of the limit plate 63 facing the middle of the arc suction cup 61, and a plurality of clamping blocks 623 are provided on both sides of the lifting plate 62. The plurality of clamping blocks 623 are respectively located in the plurality of slide grooves and slide up and down, and an elastic protruding ball is provided on the clamping block 623, and the elastic protruding ball is interference fit with the inner wall of the slide groove, and guide plates 41 for pushing the lifting plate 62 to move upward are provided on both sides of the support tube 4.

[0028] Among them, by setting a limit plate 63 on the side of the arc suction cup 61, and setting a clamping block 623 on the side of the lifting plate 62, when the lifting plate 62 moves up and down, the clamping block 623 is located in the sliding groove of the limit plate 63 and slides up and down. Since an elastic raised ball is set on the clamping block 623, the lifting plate 62 can slide to any height under the action of external force and can be directly self-locked in position without moving up and down at will.

[0029] It should be noted that the upper end of the guide plate 41 arranged on the side of the support cylinder 4 extends upward. When the support cylinder 4 drives the wafer to move up to contact the side wall of the card slot 6102, the upper end of the guide plate 41 abuts against the bottom of the linkage plate 621 on the side of the lifting plate 62. At this time, as the support cylinder 4 continues to drive the wafer to move up, the upper end of the guide plate 41 will abut against the bottom of the linkage plate 621 to drive the lifting plate 62 to rise to a certain height. At this time, the sliding piston 622 on the lifting plate 62 generates negative pressure inside the piston groove 6101.

[0030] Furthermore, guide rails 12 are fixedly installed on the inner walls of both sides of the frame 1, and linear motors 611 are provided at both ends of the arc suction cup 61 to drive the arc suction cup 61 to move to one side of the frame 1; the side of the frame 1 is provided with a receiving piece 13 for receiving the wafer rod material 5 that has been cut.

[0031] Among them, by arranging linear motors 611 on both sides of the arc suction cup 61, after the arc suction cup 61 completes the collection of the wafers, the linear motor 611 can directly drive multiple wafers to move to the side of the frame 1. When the arc suction cup 61 moves to the top of the material receiving piece 13, the wafer can be conveniently dropped into the inside of the material receiving piece 13 by pressing the lifting plate 62 downward, thereby completing the collection of the wafers quickly and efficiently.

[0032] Furthermore, a partition 11 is fixedly installed inside the frame 1, and the partition 11 is located between the support cylinder 4 and the lowest driving roller. The partition 11 is provided with a plurality of through holes for the cutting steel rope to pass through, and the cleaning assembly 7 is arranged below the partition 11.

[0033] Among them, by arranging a partition 11 inside the frame 1 and locating the cleaning component 7 below the partition 11, it can be avoided that during the cleaning process, the cleaned cutting debris is not scattered with the air to the surface of the wafer rod 5, thereby avoiding affecting the cleanliness of the surface of the wafer rod 5.

[0034] Furthermore, if Figure 4 and Figure 5 As shown, two sliding rods 71 ​​respectively located on both sides of the cutting steel rope are horizontally slidably installed inside the frame 1, and the partition 11 passes through the bottom of the guide plate 41. The guide plate 41 is provided with two guide holes 4101 for the middle parts of the two sliding rods 71 ​​to pass through. The two guide holes 4101 are distributed in a curved shape, and the two guide holes 4101 are symmetrical to each other. The two guide holes 4101 are used to drive the two sliding rods 71 ​​to move closer or farther away from each other during the up and down movement of the guide plate 41.

[0035] Among them, by symmetrically arranging two groups of guide through holes 4101 on the guide plate 41, when the guide plate 41 moves up and down following the support tube 4, the two groups of guide through holes 4101 respectively drive the two sliding rods 71 ​​to approach or move away, so that the cleaning roller 72 on the sliding rod 71 approaches or moves away from the cutting steel rope, and by repeatedly changing the distance between the cleaning roller 72 and the cutting steel rope, different cleaning surfaces on the cleaning roller 72 can be brought into contact with the cutting steel rope, so that the cutting debris remaining on the cutting steel rope can be cleaned off more efficiently, which can not only reduce the wear of the cutting steel rope, but also enable the cutting steel rope to cut the wafer rod 5 more efficiently.

[0036] Furthermore, if Figure 8 As shown, a circular cleaning groove 73 is provided in the middle of the cleaning roller 72, and a plurality of cleaning brushes are provided on the outer surface of the cleaning roller 72. A filter element 8 is fixedly installed inside the frame 1, and the filter element 8 is located below the partition 11. The filter element 8 is used to filter the gas inside the frame 1 and discharge it from the frame 1, wherein the filter element 8 is an exhaust filter device in traditional equipment, which is a prior art and will not be described in detail in this application.

[0037] Among them, by arranging a cleaning groove 73 in the middle of the cleaning roller 72, the cleaning surface of the cleaning roller 72 can have a wrapping effect to clean various positions of the cutting steel rope, which can reduce the cleaning dead corners on the cutting steel rope.

[0038] A semiconductor wafer material processing method, the processing method specifically comprises the following steps: Step 1: First, put the wafer bar 5 with both ends cut into the support tube 4 from the feed port 101 on the side of the frame 1, and push the wafer bar 5 to the designated position; Step 2: After that, the driving component 2 is turned on to drive the cutting component 3 to operate, and the telescopic component 42 is driven to move upward, so as to drive the wafer bar 5 to move upward as a whole to the position of the cutting wire rope to complete the cutting process; Step 3: Then, continue to drive the cut wafer bar 5 to move upward, so that the upper section of the cut wafer bar 5 is completely wrapped by the arc suction cup 61, and then drive the telescopic member 42 to retract to the initial position. Step 4: Finally, the arc suction cup 61 and the wafer bar 5 cut thereunder are driven by the linear motor 611 to move to the side exit of the rack 1 .

[0039] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor wafer material processing device, characterized in that: include: A frame (1) and a cutting piece (3) rotatably mounted inside the frame (1), driving components (2) for driving the cutting piece (3) to rotate are fixedly mounted on both sides of the frame (1), a feeding port (101) for adding wafer bars (5) is arranged on the side of the frame (1), and the cutting piece (3) comprises three driving rollers distributed in an inverted triangle shape and a plurality of cutting steel ropes spaced apart and sleeved on the three driving rollers; A support cylinder (4) for holding a wafer bar (5) and driving the wafer bar (5) to move upward to a cutting piece (3) for cutting, wherein a semicircular support groove (402) is provided above the support cylinder (4) along the length direction, a plurality of cutting grooves (401) are provided at intervals on the support cylinder (4), and a telescopic piece (42) for driving the support cylinder (4) to move up and down is provided on the inner wall of the frame (1); A material receiving assembly (6) is slidably mounted just above the support cylinder (4) and is used to collect and transport the cut wafers; A cleaning assembly (7) is used for cleaning a plurality of groups of cutting wires, the cleaning assembly (7) comprising two sliding rods (71) respectively located on both sides of the cutting wires, and a cleaning roller (72) for cleaning the cutting wires is fixedly mounted on the sliding rods (71).

2. A semiconductor wafer material processing device according to claim 1, characterized in that: The material receiving device (6) comprises a semicircular arc suction cup (61), the lower end surface profile of the arc suction cup (61) is semicircular, the lower end surface of the arc suction cup (61) is provided with a plurality of slots (6102) for wafers to slide into, and the lower ends of both sides of the arc suction cup (61) are provided with elastic limiting protrusions (612).

3. A semiconductor wafer material processing device according to claim 2, characterized in that: A plurality of piston grooves (6101) are arranged above the arc suction cup (61), and the plurality of piston grooves (6101) are respectively arranged above the plurality of card slots (6102), and a plurality of adsorption holes (6103) are arranged at the bottom of each of the piston grooves (6101), and the adsorption holes (6103) connect the piston groove (6101) and the card slot (6102). A lifting plate (62) is installed above the arc suction cup (61) to slide up and down, and the lifting plate (62) is respectively provided with a plurality of sliding pistons (622) for sliding into the plurality of piston grooves (6101). When the lifting plate (62) rises, the sliding piston (622) slides inside the piston groove (6101), so that negative pressure is generated at the adsorption hole (6103), thereby adsorbing the wafer.

4. A semiconductor wafer material processing device according to claim 3, characterized in that: A plurality of limit plates (63) are arranged on both sides above the arc suction cup (61); a slide groove is arranged on the end surface of the limit plate (63) facing the middle of the arc suction cup (61); a plurality of clamping blocks (623) are arranged on both sides of the lifting plate (62); the plurality of clamping blocks (623) are respectively located in the plurality of slide grooves and slide up and down; an elastic protruding ball is arranged on the clamping block (623); the elastic protruding ball is interference-fitted with the inner wall of the slide groove; and guide plates (41) for pushing the lifting plate (62) to move upward are arranged on both sides of the support tube (4).

5. A semiconductor wafer material processing device according to claim 4, characterized in that: Guide rails (12) are fixedly mounted on the inner walls on both sides of the frame (1); linear motors (611) for driving the circular arc suction cup (61) to move to one side of the frame (1) are arranged at both ends of the circular arc suction cup (61); and receiving parts (13) for receiving wafer bars (5) that have been cut are arranged on the side of the frame (1).

6. The semiconductor wafer material processing device according to claim 5, characterized in that: A partition (11) is fixedly installed inside the frame (1), and the partition (11) is located between the support cylinder (4) and the lowest driving roller. The partition (11) is provided with a plurality of through holes for the cutting steel rope to pass through, and the cleaning assembly (7) is arranged below the partition (11).

7. A semiconductor wafer material processing device according to claim 6, characterized in that: Two sliding rods (71) respectively located on both sides of the cutting steel rope are horizontally slidably installed inside the frame (1), and the lower part of the guide plate (41) passes through the partition plate (11). The guide plate (41) is provided with two guide through holes (4101) for the middle parts of the two sliding rods (71) to pass through. The two guide through holes (4101) are both distributed in a curved shape. The two guide through holes (4101) are symmetrical to each other. The two guide through holes (4101) are used to drive the two sliding rods (71) to move closer to or away from each other during the upward and downward movement of the guide plate (41).

8. The semiconductor wafer material processing device according to claim 7, characterized in that: A circular cleaning groove (73) is provided in the middle of the cleaning roller (72), a plurality of cleaning brushes are provided on the outer surface of the cleaning roller (72), a filter element (8) is fixedly installed inside the frame (1), the filter element (8) is located below the partition (11), and the filter element (8) is used to filter the gas inside the frame (1) and discharge it out of the frame (1).

9. A semiconductor wafer material processing method, characterized in that: A semiconductor wafer material processing device applicable to claim 8, wherein the processing method specifically comprises the following steps: Step 1: First, place the wafer bar (5) with both ends cut into the interior of the support tube (4) from the feed port (101) on the side of the frame (1), and push the wafer bar (5) to a designated position; Step 2: After that, the driving component (2) is turned on to drive the cutting component (3) to operate, and the telescopic component (42) is driven to move upward, thereby driving the wafer bar (5) to move upward as a whole to the position of the cutting wire rope to complete the cutting process; Step 3: Then, continue to drive the cut wafer bar (5) to move upward, so that the upper section of the cut wafer bar (5) is completely wrapped by the arc suction cup (61), and then drive the telescopic member (42) to retract to the initial position. Step 4: Finally, the arc suction cup (61) and the cut wafer bar (5) thereunder are driven by the linear motor (611) to move to the side exit of the rack (1).

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