Electricity removal device, power supply connecting device and semiconductor processing chamber

Abstract

The invention provides a static electricity removing device, a power supply connecting device and a semiconductor processing chamber, and the static electricity removing device comprises a space part which is arranged on an upper cover of the semiconductor processing chamber and is provided with a first space and a second space which is communicated with the first space and is located above or on the side of the first space, the first space is used for accommodating at least one part of a power supply connecting block; the contact part is movably arranged in the second space and is grounded; the stopping part is arranged on a main body of the semiconductor processing chamber, when the upper cover is opened, the contact part is located on the side, close to the first space, of the second space, and when the upper cover is closed, the contact part is located on the side, close to the first space, of the second space by taking the space part as a reference. And the contact part is pushed by the stop part from one side, close to the first space, of the second space to the other side, far away from the first space, of the second space.

Description

Technical Field

[0001] The present invention relates to a charge removal device, a power connection device, and a semiconductor processing chamber, and more particularly to a charge removal device, a power connection device, and a semiconductor processing chamber that can automatically remove charge from a target at an appropriate time. Background Art

[0002] With the development of technology, various electrical appliances have been applied to all aspects of production and life, providing great convenience. However, at the same time, there are also potential safety hazards. For example, when there is a leakage of electricity or an excessive accumulation of charges in a certain place, there is a risk of fire or electric shock to personnel. To avoid these accidents, grounding is usually adopted to guide the leaked current or excess charges to the ground.

[0003] The semiconductor processing field is no exception. Taking a physical vapor deposition chamber that uses sputtering to deposit a thin film on a substrate as an example, when there is a leakage of electricity, it is not only dangerous, but also the excess charges accumulated in various parts of the chamber will form a pressure difference, which will have an adverse effect on the deposition of the thin film. Therefore, the outer shell must be grounded, and it is preferably fixed firmly to the outer shell with screws to ensure that the outer shell is always in a grounded state.

[0004] In addition to the outer shell, some devices inside the chamber also need to be grounded, such as the target. However, the reasons, purposes, and methods of grounding the target have their own particularities, which are as follows.

[0005] The target is usually installed on the upper cover of the chamber. When the upper cover of the chamber is closed, the target faces the process space inside the main body of the chamber. When argon gas is introduced into the evacuated process space and the target is connected to the cathode of the power supply, the electrons ionized from the argon atoms will bombard the target, causing the material on the target to be sputtered onto the substrate loaded in the process space, thereby forming a thin film. During this process, charges will accumulate on the target, and even after the power supply is cut off after sputtering is completed, there will still be charges remaining on the target.

[0006] Therefore, when workers need to inspect or replace the target, the target should be discharged in advance to avoid electric shock to personnel caused by the charges remaining on the target. Usually, the worker will first open the upper cover to expose the target, and then manually temporarily connect a grounding wire to the target or the power connection block used to connect the target to the power supply to drain the excess charges to the ground, thereby achieving the discharge of the target.

[0007] Although this method is direct and effective, it is relatively cumbersome and dangerous to operate, and there is a risk of discharge failure due to human error. On the other hand, as a consumable, the target needs to be replaced frequently. If this method is used for discharging every time, the replacement efficiency and safety will be greatly reduced.

[0008] Therefore, for the current target, a more efficient and safe static elimination solution is needed. Summary of the Invention

[0009] Technical Problem

[0010] An object of the present invention is to provide a static elimination device that can selectively eliminate static electricity from a target provided in a semiconductor processing chamber according to the opening or closing of the upper cover of the semiconductor processing chamber.

[0011] Another object of the present invention is to provide a power connection device including the above-mentioned static elimination device.

[0012] Another object of the present invention is to provide a semiconductor processing chamber including the above-mentioned power connection device.

[0013] Technical Solution

[0014] The present invention provides a static elimination device for eliminating static electricity from a target provided in a semiconductor processing chamber, which includes: a space part provided on the upper cover of the semiconductor processing chamber, having a first space and a second space communicating with the first space and located above or on the side of the first space, the first space being used to accommodate at least a part of a power connection block that connects the target to a power source; a contact part movably disposed in the second space and grounded; and a stop part provided on the main body of the semiconductor processing chamber. When the upper cover is opened, the contact part is located on the side of the second space close to the first space, so as to contact the power connection block provided in the first space. When the upper cover is closed, based on the space part, the contact part is pushed by the stop part from the side of the second space close to the first space to the other side of the second space far from the first space, so as to be separated from the power connection block provided in the first space.

[0015] According to an embodiment, a spring is disposed on the other side of the second space far from the first space to apply a thrust force towards the first space to the contact part.

[0016] According to an embodiment, the space part forms a guide hole on the side of the second space far from the first space, and a protruding guide rod is formed on the surface of the contact part far from the first space, and the guide rod is inserted into the guide hole to guide the movement of the contact part.

[0017] According to an embodiment, a step part is provided at the outer end of the guide hole, and a radially protruding boss part is provided at the top end of the guide rod, and the boss part is stuck to the step part to limit the contact part in the second space.

[0018] According to one embodiment, a spring gasket is provided between the first space and the second space.

[0019] According to one embodiment, it further includes an insulating portion disposed on at least a part of the outer surface of the stopper portion.

[0020] According to one embodiment, when the second space is located laterally of the first space, the lower surface of the contact portion includes an inclined surface that is inclined so as to gradually move away from the first space from top to bottom and is configured to contact the stopper portion when the upper cover is closed.

[0021] The present invention provides a power connection device, which includes: the above-described static elimination device for static elimination of a target provided in a semiconductor processing chamber; and a power connection block disposed on an upper cover of the semiconductor processing chamber and at least a part of which is disposed in a first space of a space portion of the static elimination device for connecting the target to a power source.

[0022] According to one embodiment, when the second space of the space portion is located above the first space, a through hole that penetrates up and down is formed in a portion of the power connection block located in the first space, and the through hole is aligned with a stopper portion of the static elimination device and can accommodate the stopper portion.

[0023] The present invention provides a semiconductor processing chamber configured with the above-described power connection device.

[0024] Advantageous Effects

[0025] The static elimination device of the present invention can selectively perform static elimination on a target provided in a semiconductor processing chamber according to the opening or closing of an upper cover of the semiconductor processing chamber.

[0026] The power connection device of the present invention includes the static elimination device of the present invention. Therefore, it can selectively perform static elimination on a target provided in a semiconductor processing chamber according to the opening or closing of an upper cover of the semiconductor processing chamber.

[0027] The semiconductor processing chamber of the present invention includes the power connection device of the present invention. Therefore, it can selectively perform static elimination on a target provided in a semiconductor processing chamber according to the opening or closing of an upper cover of the semiconductor processing chamber. Description of the Drawings

[0028] Figure 1 It is a schematic diagram showing a static elimination device according to one embodiment of the present invention in combination with an upper cover, a main body, and a power connection block of a semiconductor processing chamber.

[0029] Figure 2 It is according to one embodiment of the present inventionFigure 1 Left view showing details in area A in

[0030] Figure 3 In (a) and (b) are schematic diagrams showing the states of the charge removal device according to an embodiment of the present invention when the upper cover of the semiconductor processing chamber is open and closed, respectively.

[0031] Figure 4 is according to another embodiment of the present invention Figure 1 Left view showing details in area A in

[0032] Figure 5 In (a) and (b) are schematic diagrams showing the states of the charge removal device according to another embodiment of the present invention when the upper cover of the semiconductor processing chamber is open and closed, respectively.

[0033] Figure 6 is a schematic diagram showing the power connection device according to an embodiment of the present invention in combination with the upper cover and the main body of the semiconductor processing chamber.

[0034] Figure 7 In (a) and (b) are schematic diagrams showing the states of the power connection device according to an embodiment of the present invention when the upper cover of the semiconductor processing chamber is open and closed, respectively.

[0035] Reference numerals

[0036] 1: Charge removal device

[0037] 1a: Upper half

[0038] 1b: Lower half

[0039] 11: Space part

[0040] 11a: First space

[0041] 11b: Second space

[0042] 12: Contact part

[0043] 12a: Inclined surface

[0044] 13: Stopper part

[0045] 13a: Insulating part

[0046] 14: Spring

[0047] 15: Guide hole

[0048] 15a: Step part

[0049] 16: Guide rod

[0050] 16a: convex platform part

[0051] 2: power connection device

[0052] 21: power connection block

[0053] 21a: through hole

[0054] 3: semiconductor processing chamber

[0055] 31: upper cover

[0056] 32: main body

[0057] 4: target Detailed implementation manners

[0058] Next, with reference to the drawings of one or more embodiments of the present invention, a detailed description will be given of one or more embodiments of the present invention. Obviously, these one or more embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are also within the scope of protection of the present invention.

[0059] The terms used in the following embodiments are only for the purpose of explaining or illustrating specific embodiments, and are not intended to limit the scope of protection of the present invention. In addition, the singular forms used in the present invention, such as "a", "an", "the", "above-mentioned", "this" and "this one", are intended to include plural forms such as "one or more", unless there is a clear indication to the contrary in the context. It should also be understood that in the embodiments of the present invention, when using terms such as "one or more", "at least one", "more than one", etc., it is intended to include the cases of one, two and at least three.

[0060] In addition, when using terms such as "in one embodiment", "in some embodiments", "in one or more embodiments" in the description of the present invention, it is intended that one or more embodiments of the present invention may include specific technical features described in connection with this embodiment. Therefore, the "in one embodiment", "in some embodiments", "in one or more embodiments" that appear in different parts of this specification do not necessarily refer to the same embodiment, but may refer to the same embodiment or different embodiments, unless the specific technical features described in these embodiments cannot be used alone or combined.

[0061] In addition, in the present invention, when an element is described as "including", "comprising", or "having" another element, it is intended to be an open-ended limitation, that is, in addition to including the other element, the one element may further include other elements. When an element is described as "only including", "only comprising", "only having" another element or "consisting of" another element, it is intended to be a closed-ended limitation, that is, the one element does not include other elements except the other element. However, it should be noted that when the term "formed by another element" is used to illustrate the formation relationship between multiple elements, this term is not intended to be a closed-ended limitation, and it should be considered that the other element forms a part of the one element, and the one element may include other elements except the other element.

[0062] It should be understood that when sequential terms such as "first", "second", etc. are used in this article to illustrate each element, these sequential terms are only used to distinguish one element from another element, and the terms such as "first", "second", etc. should not imply meanings such as primary-secondary relationship, sequence relationship, etc. Without departing from the scope of the present invention, the first element may be labeled as the second element, and the second element may also be labeled as the first element.

[0063] In the present invention, when terms such as "on", "under", "between" etc. are used to illustrate the positional relationship between two or more elements, it means that one or more other elements may be further provided between the two or more elements, unless terms such as "exactly", "adjacent to" etc. are used.

[0064] Hereinafter, one or more embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can clearly and completely understand the present invention. When the description of well-known structures or features will unnecessarily obscure the gist of the present invention, the description of these well-known structures or features will be omitted.

[0065] The present invention provides a charge removal device, a power connection device, and a semiconductor processing chamber. Among them, the charge removal device of the present invention can selectively remove the charge of a target provided in the semiconductor processing chamber according to the opening or closing of the upper cover of the semiconductor processing chamber. Specifically, the charge removal device can ground the target to remove the charge of the target when the upper cover is opened, and release the grounding of the target to stop removing the charge of the target when the upper cover is closed.

[0066] Hereinafter, the charge removal device of the present invention will be described in detail.

[0067] Figure 1 is a schematic diagram showing a charge removal device according to an embodiment of the present invention in combination with the upper cover, the main body, and the power connection block of a semiconductor processing chamber.

[0068] AsFigure 1 As shown, a target 4 and a power supply connection block 21 connecting the target 4 to a power supply (not shown) are provided on the upper cover 31 of a semiconductor processing chamber 3. The charge removal device 1 of the present invention can be provided adjacent to the power supply connection block 21 in the semiconductor processing chamber 3. Specifically, the charge removal device 1 may include an upper half portion 1a provided on the upper cover 31 of the semiconductor processing chamber 3 and a lower half portion 1b provided on the main body 32 of the semiconductor processing chamber 3. When the upper cover 31 is opened, the upper half portion 1a and the lower half portion 1b are separated from each other. Thereby, the power supply connection block 21 is grounded to remove the charge from the target 4; when the upper cover 31 is closed, the upper half portion 1a and the lower half portion 1b are combined with each other. Thereby, the grounding of the power supply connection block 21 is released, and thus the charge removal from the target 4 is stopped.

[0069] Figure 2 is a left view showing an enlarged detail of the A region in Figure 1 according to an embodiment of the present invention. To more clearly show the charge removal device 1, the power supply connection block 21 is omitted in Figure 2 .

[0070] As Figure 2 shown, the charge removal device 1 may include a space portion 11. The space portion 11 may be provided on the upper cover 31 of the semiconductor processing chamber 3 and is formed with a first space 11a and a second space 11b communicating with the first space 11a. For easy distinction, the boundary line between the first space 11a and the second space 11b is marked with a dashed line. The first space 11a is used to accommodate at least a part of the power supply connection block 21, that is, the first space 11a may partially coincide with the position on the upper cover 31 for setting the power supply connection block 21. The space portion 11 may be formed by a separate housing and provided on the upper cover 31 by combining the housing with the upper cover 31, or may be directly formed by opening a specified space in the upper cover 31.

[0071] Figure 2The case where the second space 11b is located above the first space 11a is shown, but the present invention is not limited thereto. The second space 11b may also be located beside the first space 11a. As long as the space portion 11 when the second space 11b is located above the first space 11a and each component disposed in the space portion 11 described below are horizontally laid down as a whole, the space portion 11 when the second space 11b is located beside the first space 11a and each component disposed in the space portion 11 described below can be obtained. Therefore, hereinafter, taking the case where the second space 11b is located above the first space 11a as a reference, the charge removing device 1 of the present invention will be described, and the case where the second space 11b is located beside the first space 11a will not be repeatedly described.

[0072] In addition, the charge removing device 1 may further include a contact portion 12. The contact portion 12 is movably disposed in the second space 11b to approach or separate from the first space 11a according to the opening or closing of the upper cover 31. In addition, the contact portion 12 may be grounded. For example, a ground wire (not shown) may be separately connected to form a movable ground terminal to selectively ground the power connection block 21, so as to charge-remove the target 4 at an appropriate time.

[0073] In addition, the charge removing device 1 may further include a stopper portion 13. The stopper portion 13 is disposed on the main body 32 of the semiconductor processing chamber 3 and is used to adjust the relative position of the contact portion 12 in the second space 11b, so that the contact portion 12 selectively approaches or separates from the first space 11a, so that the contact portion 12 selectively contacts or separates from the power connection block 21. The stopper portion 13 may be formed in a rod shape extending in the vertical direction as shown in Figure 2 , but the present invention is not limited thereto. The stopper portion 13 may be formed into a required shape and size according to the shapes, sizes, etc. of the space portion 11 and the contact portion 12, and those skilled in the art can make appropriate selections according to actual needs.

[0074] At this time, the space portion 11 and the contact portion 12 constitute the main part of the upper half portion 1a shown in Figure 1 , and the stopper portion 13 constitutes the main part of the lower half portion 1b shown in Figure 1 .

[0075] Although not shown, in order for the stopper portion 13 and the contact portion 12 to cooperate with each other stably, the contact surfaces of the contact portion 12 and the stopper portion 13 may be formed into shapes matching each other, such as a convex block and a groove, or a groove matching the contour shape of the upper surface of the stopper portion 13 may be formed on the lower surface of the contact portion 12.

[0076] Figure 3 In (a) and (b) are schematic diagrams showing the states of the static elimination device according to an embodiment of the present invention when the upper cover of the semiconductor processing chamber is open and closed, respectively.

[0077] As Figure 3 shown in (a), when the upper cover 31 is open, the contact portion 12 is located on the side of the second space 11b close to the first space 11a, so as to contact the power connection block 21 provided in the first space 11a. Thereby, the target 4 is grounded, and thus the target 4 is statically eliminated.

[0078] As Figure 3 shown in (b), when the upper cover 31 is closed, with the space portion 11 as a reference, the contact portion 12 is pushed by the stopper portion 13 from the side of the second space 11b close to the first space 11a to the other side of the second space 11b away from the first space 11a, so as to be separated from the power connection block 21 provided in the first space 11a. Thereby, the grounding of the target 4 is released, and thus the static elimination of the target 4 is stopped.

[0079] Therefore, according to the present invention, when it is necessary to inspect or replace the target 4, only by performing the action of opening the upper cover 31, the target 4 can be automatically statically eliminated, without the need to first open the upper cover 31 to expose the target 4 outward and then manually temporarily connect a grounding wire to the target 4 or the power connection block 21 for connecting the target 4 to the power supply as in the past. That is, the present invention provides a new type of efficient and safe static elimination solution for the target.

[0080] Furthermore, as Figure 2 shown, as a preferred embodiment, a spring 14 may be further disposed on the other side of the second space 11b away from the first space 11a to apply a thrust force towards the first space 11a to the contact portion 12.

[0081] Referring again to Figure 3 (a), when the upper cover 31 is open, the thrust force applied by the spring 14 to the contact portion 12 can ensure that the contact portion 12 closely contacts the power connection block 21, so as to prevent the contact portion 12 from detaching from the power connection block 21, thereby ensuring the stability and reliability of the static elimination operation for the target 4.

[0082] Referring again to Figure 3In (b), when the upper cover 31 is closed, the spring 14 can absorb the impact generated when the contact portion 12 contacts the stopper portion 13, so as to prevent the contact portion 12 and the stopper portion 13 from being damaged. At the same time, the thrust force exerted by the spring 14 on the contact portion 12 can stably fix the contact portion 12 on the stopper portion 13, so as to prevent the contact portion 12 from detaching from the stopper portion 13.

[0083] As another preferred embodiment, as Figure 2 shown, a guide hole 15 may be further formed on one side of the space portion 11 away from the first space 11a in the second space 11b. At the same time, a protruding guide rod 16 may be further formed on the surface of the contact portion 12 away from the first space 11a. The guide rod 16 can be aligned with and inserted into the guide hole 15 to guide the movement of the contact portion 12. Further, a stepped portion 15a may be provided at the outer end of the guide hole 15, and a radially protruding boss portion 16a may be provided at the top of the guide rod 16. The boss portion 16a can be stuck to the stepped portion 15a to limit the contact portion 12 within the second space 11b.

[0084] Referring again to Figure 3 In (a), when the upper cover 31 is opened, the guide hole 15 and the guide rod 16 cooperate with each other to ensure that the contact portion 12 stably moves towards the power connection block 21, so as to prevent the contact portion 12 from failing to contact the power connection block 21 due to the deviation of the moving direction, or being damaged due to hitting the inner wall of the space portion 11. As the contact portion 12 contacts the power connection block 21, the boss portion 16a also gets stuck to the stepped portion 15a to limit the further movement of the contact portion 12 towards the first space 11a, thereby preventing the contact portion 12 and the power connection block 21 from being damaged due to excessive application of the gravity of the contact portion 12 or the thrust of the spring 14 to the contact surface between the contact portion 12 and the power connection block 21.

[0085] Referring again to Figure 3 In (b), when the upper cover 31 is closed, the guide hole 15 and the guide rod 16 cooperate with each other to ensure that the contact portion 12 stably moves in a direction away from the power connection block 21, so as to prevent the contact portion 12 from being damaged due to hitting the inner wall of the space portion 11 due to the deviation of the moving direction.

[0086] As another preferred embodiment, although not shown, a spring gasket may be provided between the first space 11a and the second space 11b. For example, the spring gasket may be disposed on the surface of the power connection block 21 close to the second space 11b, so that the contact portion 12 can contact the power connection block 21 more tightly, thereby ensuring the stability and reliability of the static elimination operation for the target 4. At the same time, when the contact portion 12 contacts the power connection block 21, it can also play a buffering role between the contact portion 12 and the power connection block 21 to prevent the contact portion 12 and the power connection block 21 from colliding with each other and being damaged.

[0087] As another preferred embodiment, as Figure 2 shown, the static elimination device 1 may further include an insulating portion 13a, and the insulating portion 13a may be disposed on at least a part of the outer surface of the stopper portion 13 to prevent the static elimination operation for the target 4 from being interfered due to the conductivity of the stopper portion 13. For example, the insulating portion 13a may be disposed at the lower part of the stopper portion 13 to insulate the stopper portion 13 from the main body 32. Although not shown, the insulating portion 13a may be disposed on the side surface of the stopper portion 13 to further separate the stopper portion 13 from the power connection block 21 while ensuring the insulation between the stopper portion 13 and the power connection block 21. In addition, although not shown, the insulating portion 13a may be disposed at the upper part of the stopper portion 13 to insulate the stopper portion 13 from the contact portion 12. Thus, it can be avoided that the charge that the main body 32 may carry is conducted to the target 4 through the stopper portion 13 when the upper cover 31 is closed or when the contact portion 12 contacts the stopper portion 13 and the power connection block 21 at the same time, thereby affecting the effect of the static elimination operation.

[0088] The material of the insulating portion 13a may be selected from commonly used insulating materials in the art (such as rubber, plastic, etc.), and the shape and size of the insulating portion 13a may be appropriately selected according to actual needs. In addition, the stopper portion 13 itself may also be made of an insulating material.

[0089] Above, the static elimination device of the present invention has been described based on the case where the second space is located above the first space. Hereinafter, a preferred embodiment that can be realized only when the second space is located beside the first space will be described.

[0090] Figure 4 is a left view showing an enlarged view of the details in the A area in another embodiment according to the present invention. In order to more clearly show the static elimination device 1, the power connection block 21 is omitted in Figure 1 In Figure 4

[0091] As Figure 4 shown, when the second space 11b is located on the side of the first space 11a, the lower surface of the contact portion 12 may include an inclined surface 12a, which is inclined in a manner of gradually moving away from the first space 11a from top to bottom, and is used to contact the stopper portion 13 when the upper cover 31 is closed. Thus, when the upper cover 31 is closed, the inclined surface 12a and the upper surface of the stopper portion 13 cooperate with each other, enabling the contact portion 12 to move in a direction away from the power connection block 21.

[0092] Figure 5 Figures (a) and (b) in

[0093] As Figure 5 shown in (a) of

[0094] Figures (a) and (b) in Figure 5 shown in (b) of

[0095] Although not shown, as a preferred embodiment, the upper surface of the stopper portion 13 may be formed to have the same inclination as the inclined surface 12a, so that the inclined surface 12a and the upper surface of the stopper portion 13 fit with each other, enabling the contact portion 12 to be pushed more stably and smoothly by the stopper portion 13. At the same time, the contact area between the contact portion 12 and the stopper portion 13 is increased, thereby reducing the wear of the inclined surface 12a and the upper surface of the stopper portion 13.

[0096] Although not shown, as another preferred embodiment, balls, rollers, drums, etc. may be arranged on the upper surface of the stopper portion 13, so that the contact portion 12 can be pushed more stably and smoothly by the stopper portion 13.

[0097] Above, taking the case where the contact part moves in a way of overall translation as an example, the charge removal device of the present invention has been described in detail. However, the present invention is not limited thereto. The contact part may also be a structure where one end is fixed and the other end rotates around the one end, and the other end can be pushed by the stopper part, so as to approach or move away from the first space as the upper cover is opened or closed. In addition, the guide hole (which can be appropriately selected from round holes, square holes, long holes, etc.), the guide rod (which can be appropriately selected from straight shapes or curved shapes, etc.), the spring, the spring washer, the insulating part, etc. can also be applied to such a charge removal device in the same way, which will not be elaborated here.

[0098] Hereinafter, the power supply connection device of the present invention will be described in detail, but the description content repeated with the above-mentioned charge removal device of the present invention will be omitted.

[0099] Figure 6 FIG. is a schematic diagram showing a power supply connection device according to an embodiment of the present invention in combination with the upper cover and the main body of a semiconductor processing chamber.

[0100] As shown in Figure 6 the power supply connection device 2 may include: the charge removal device 1 of the present invention for removing charge from the target 4 provided in the semiconductor processing chamber 3; and a power supply connection block 21 provided on the upper cover 31 of the semiconductor processing chamber 3 and at least a part thereof is disposed in the first space 11a of the space part 11 of the charge removal device 1 for connecting the target 4 and the power supply.

[0101] Among them, the power supply connection block 21 may be a commonly used power supply connection block in the art, and the present invention is not limited thereto.

[0102] As a preferred embodiment, when the second space 11b of the space part 11 is located above the first space 11a, a through hole 21a penetrating up and down may be formed in the part of the power supply connection block 21 located in the first space 11a. Specifically, the through hole 21a may be aligned with the stopper part 13 of the charge removal device 1, and the through hole 21a may accommodate the stopper part 13. Thus, it can be ensured that the contact part 12 of the charge removal device 1, the power supply connection block 21, and the stopper part 13 of the charge removal device 1 are stacked in the height direction from top to bottom, so that the structure of the power supply connection device 2 is more compact.

[0103] Figure 7 FIGS. (a) and (b) are schematic diagrams showing the states of the power supply connection device according to an embodiment of the present invention when the upper cover of the semiconductor processing chamber is opened and closed, respectively.

[0104] As shown in Figure 7As shown in (a) thereof, when the upper cover 31 is opened, the contact portion 12 abuts against the power connection block 21, whereby the target 4 is grounded, and thus the target 4 is discharged.

[0105] As Figure 7 shown in (b) thereof, when the upper cover 31 is closed, the stopper portion 13 passes through the through hole 21a and pushes the contact portion 12 away from the power connection block 21, whereby the grounding of the target 4 is released, and thus the discharging of the target 4 is stopped.

[0106] Hereinafter, the semiconductor processing chamber of the present invention will be described, but the description of the content repeated with the above-described charging and discharging device and power connection device of the present invention will be omitted.

[0107] The semiconductor processing chamber of the present invention may include the power connection device 2 of the present invention.

[0108] Although not shown, the semiconductor processing chamber may be a physical vapor deposition chamber.

[0109] The embodiments of the present invention have been described above, but this is only for helping to comprehensively understand the present invention. The present invention is not limited thereto, and those skilled in the art can make various modifications and deformations from these descriptions. Therefore, the technical idea of the present invention is not limited to the above embodiments, and the appended claims and their equivalent or equivalent deformations all belong to the scope of the present invention.

Claims

1. A static elimination device for eliminating static electricity from a target material disposed in a semiconductor processing chamber, characterized in that: include: A space portion, arranged on an upper cover of the semiconductor processing chamber, forming a first space and a second space connected to the first space and located above or to the side of the first space, wherein the first space is used to accommodate at least a portion of a power connection block, and the power connection block connects the target material with a power source; a contact portion, movably disposed in the second space and grounded; and A stopper is arranged on the main body of the semiconductor processing chamber, When the upper cover is opened, the contact portion is located at a side of the second space close to the first space, thereby contacting the power connection block disposed in the first space. When the upper cover is closed, the contact portion is pushed by the stopper from one side of the second space close to the first space to the other side of the second space away from the first space based on the space portion, thereby being separated from the power connection block arranged in the first space.

2. The static elimination device according to claim 1, characterized in that: A spring is arranged on the other side of the second space away from the first space to apply a pushing force to the contact portion toward the first space.

3. The static elimination device according to claim 1, characterized in that: The space portion is formed with a guide hole on a side of the second space away from the first space, and a protruding guide rod is formed on a surface of the contact portion on a side away from the first space. The guide rod is inserted into the guide hole to guide movement of the contact portion.

4. The static elimination device according to claim 3, characterized in that: A step portion is provided at the outer end of the guide hole, and a radially protruding boss portion is provided at the top end of the guide rod. The boss portion is locked to the step portion to restrict the contact portion within the second space.

5. The static elimination device according to claim 1, characterized in that: A spring washer is provided between the first space and the second space.

6. The static elimination device according to claim 1, characterized in that: It further includes an insulating portion, wherein the insulating portion is disposed on at least a portion of an outer surface of the stopper portion.

7. The static elimination device according to claim 1, characterized in that: When the second space is located to the side of the first space, the lower surface of the contact portion includes an inclined surface, which is inclined from top to bottom in a manner of gradually moving away from the first space, and is used to contact the stopper when the upper cover is closed.

8. A power connection device, characterized in that: include: The static elimination device according to any one of claims 1 to 7, used for eliminating static electricity from a target material arranged in a semiconductor processing chamber; as well as A power connection block is arranged on the upper cover of the semiconductor processing chamber, and at least a part of it is arranged in the first space of the space part of the static elimination device, and is used to connect the target material and the power supply.

9. The power connection device according to claim 8, characterized in that: When the second space of the space portion is located above the first space, a through hole penetrating vertically is formed in the portion of the power connection block located in the first space, and the through hole is aligned with the stopper of the static elimination device and can accommodate the stopper.

10. A semiconductor processing chamber, characterized in that: A power connection device as claimed in any one of claims 8 to 9 is provided.

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