Chip transfer mechanism, die bonder and die bonding method

Abstract

The invention relates to the technical field of chip packaging, and particularly discloses a chip transfer mechanism, a die bonder and a die bonding method. The mechanism comprises a stand column and a transferring assembly. The transferring assembly is movably connected to the stand column, the transferring assembly comprises an assembly base and two taking and placing units arranged on the assembly base, one taking and placing unit is located at a crystal taking position, the other taking and placing unit is located at a crystal placing position, and the assembly base can drive the two taking and placing units to move so as to exchange the positions of the two taking and placing units; the pick-and-place unit located at the crystal pick-and-place position is used for pick-and-place of chips, and the pick-and-place unit located at the crystal placing position is used for release of chips. According to the mechanism, parallel execution of crystal taking-transferring and crystal placing-resetting actions of the two taking and placing units is achieved, the serial process of traditional single-station operation is compressed into parallel circulation, the symmetrical station switching design avoids time loss of no-load return in the crystal taking and placing process of the single taking and placing unit, the carrying period is shortened, and the working efficiency is improved. The continuity of the carrying process is enhanced, and the working efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and particularly to a chip transfer mechanism, a die bonder, and a die bonding method. Background Art

[0002] In the process of chip processing or assembly, chip transfer is a key operation step, and its efficiency and accuracy directly affect the quality and cost of the entire chip production process. With the development of semiconductor technology, the size of chips is becoming increasingly miniaturized, while the size of substrates is constantly expanding. Traditional die bonding equipment faces dual challenges in the transfer and die bonding links: on the one hand, the smaller the chip, the higher the requirements for the position accuracy and angle accuracy of die bonding; on the other hand, the high-density chip arrangement per unit area poses higher requirements for the production capacity of the equipment.

[0003] Traditional chip transfer mechanisms usually adopt a serial process of single-station operation, that is, a single pick-and-place unit needs to sequentially complete actions such as crystal picking, transfer, crystal placing, and resetting. This method has obvious drawbacks: during the crystal picking and placing processes, the pick-and-place unit returns empty, resulting in a large amount of time loss, a long chip handling cycle, low efficiency, and it is difficult to meet the production capacity requirements of high-density chip arrays. In addition, the traditional rotary handling method is prone to positioning errors due to inertia and cannot meet the strict requirements of micro-chips for accuracy and thermal expansion coefficient matching.

[0004] At the same time, the existing equipment has a complex structure and cumbersome coordinated movement of components, resulting in interference between the module for supplying / placing chips and the transfer mechanism. This not only increases the floor area and maintenance cost of the equipment, but also is more likely to cause positioning deviations due to the complex mechanical path in the micro-chip scenario. The above problems highlight the urgent need for a new type of die bonding equipment: while ensuring micron-level positioning accuracy, it is necessary to improve the chip transfer volume per unit time through parallel operation and symmetric station design to meet the dual standards of high precision and high throughput in modern semiconductor production. Summary of the Invention

[0005] The purpose of the present invention is to provide a chip transfer mechanism, a die bonder, and a die bonding method, which compress the traditional serial process of single-station operation into a parallel loop. The design of symmetric station switching avoids the time loss of the single pick-and-place unit returning empty during the crystal picking and placing processes, shortens the handling cycle, enhances the continuity of the handling process, and improves work efficiency.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] A chip transfer mechanism is used to transport chips, and the chip transfer mechanism includes a column and a transfer component; the transfer component is movably connected to the column, and the transfer component includes a component seat and two pick-and-place units arranged on the component seat, one of the pick-and-place units is located at a crystal retrieval position, and the other pick-and-place unit is located at a crystal placement position, and the component seat can drive the two pick-and-place units to move to swap the positions of the two pick-and-place units; the pick-and-place unit located at the crystal retrieval position is used to take the chip, and the pick-and-place unit located at the crystal placement position is used to release the chip.

[0008] As an optional technical solution for the chip transfer mechanism, the component seat can rotate relative to the column around the axis of the component seat, the axis of the component seat extends in the vertical direction, and the two pick-and-place units are symmetrically arranged about the axis of the component seat.

[0009] As an optional technical solution of the chip transfer mechanism, the pick-and-place unit is slidably disposed on the component seat along the vertical direction.

[0010] As an optional technical solution for the chip transfer mechanism, the pick-and-place unit includes a swing arm and a suction nozzle arranged on the swing arm, and the suction nozzle can absorb and release the chip.

[0011] As an optional technical solution of the chip transfer mechanism, the chip transfer mechanism further includes an air supply component, and the air supply component is used to provide positive pressure and / or negative pressure to the suction nozzle.

[0012] As an optional technical solution of the chip transfer mechanism, the suction nozzle can rotate around the axis of the suction nozzle relative to the swing arm, and the axis of the suction nozzle extends along the vertical direction.

[0013] As an optional technical solution for the chip transfer mechanism, the transfer component also includes two self-rotation drive units and two synchronous wheels and synchronous belts. The self-rotation drive units are fixed on the component seat, and the output end of each self-rotation drive unit is coordinated with one of the suction nozzles through one of the synchronous wheels and synchronous belts.

[0014] As an optional technical solution for the chip transfer mechanism, the movement trajectory of the pick-and-place unit between the crystal retrieval position and the crystal placement position is a semicircular arc, and the movement trajectory passes through the capture position. Two visual capture units are provided on the column, and each of the visual capture units corresponds to one of the pick-and-place units, and is used to photograph the pick-and-place unit located at the capture position.

[0015] Die bonder, used for assembling chips onto a substrate. The die bonder includes a feeding and discharging line body and at least one die bonding module. The die bonding module includes a handling mechanism, a substrate carrying platform, a chip loading mechanism, a mother-daughter ring loading and unloading component, and the above-mentioned chip transfer mechanism. The handling mechanism is used to handle the substrate between the feeding and discharging line body and the substrate carrying platform. The substrate carrying platform can carry and drive the substrate to move. A mother-daughter ring is detachably installed on the chip loading mechanism. The mother-daughter ring carries chips. The chip loading mechanism can carry and drive the mother-daughter ring to move. A mother-daughter ring cartridge is detachably installed on the mother-daughter ring loading and unloading component. The mother-daughter ring loading and unloading component is used to handle the mother-daughter ring between the mother-daughter ring cartridge and the chip loading mechanism.

[0016] Die bonding method, applied to the above-mentioned die bonder, includes the following steps:

[0017] S1: Use the handling mechanism to handle the substrate from the feeding and discharging line body to the substrate carrying platform, and use the mother-daughter ring loading and unloading component to handle the mother-daughter ring from the mother-daughter ring cartridge to the chip loading mechanism;

[0018] S2: Use the substrate carrying platform to adjust the position of the substrate, and use the chip loading mechanism to adjust the position of the mother-daughter ring;

[0019] S3: Control the picking and placing unit at the crystal picking position to pick up the chip from the mother-daughter ring, and control the picking and placing unit at the crystal placing position to release the chip onto the substrate;

[0020] S4: Use the component seat to swap the positions of the two picking and placing units;

[0021] S5: Judge whether the substrate assembly is completed. If so, continue with S6. If not, return to S2;

[0022] S6: Use the handling mechanism to handle the substrate from the substrate carrying platform to the feeding and discharging line body, and use the feeding and discharging line body to convey the substrate out of the die bonder; use the mother-daughter ring loading and unloading component to handle the mother-daughter ring from the chip loading mechanism to the mother-daughter ring cartridge.

[0023] Advantages of the present invention:

[0024] The chip transfer mechanism is provided with a component seat and two pick-and-place units. By swapping the positions of the two pick-and-place units on the component seat, one pick-and-place unit can place the chip while the other pick-and-place unit can take the chip synchronously, realizing the parallel execution of the "crystal retrieval-transfer" and "crystal placement-reset" actions of the two pick-and-place units, compressing the serial process of traditional single-station operation into a parallel cycle. The symmetrical station switching design avoids the time loss of the traditional single pick-and-place unit in the process of empty return during the crystal retrieval and crystal placement process, thereby greatly shortening the cycle time of chip handling, significantly enhancing the continuity of the chip handling process, and improving the overall work efficiency. In addition, the symmetrical layout design of the two pick-and-place units ensures the dynamic balance of the mechanism during the switching process, avoiding the positioning error caused by inertia in traditional rotary handling, and is suitable for the continuous transfer scenario of high-density chip arrays. The above-mentioned structural limitations make the various components of the chip transfer mechanism compactly laid out and clearly divided, and the components used to supply and place chips can be independent of the chip transfer mechanism, which helps to reduce the mutual influence between the solid crystal equipment, simplifies the mechanical movement path of the pick-and-place unit, avoids the complex coordinated movement of multiple components, improves the smoothness of the entire chip processing or assembly process, realizes the simplified design of the specific mechanism, makes the chip handling process more orderly, reduces the complexity and floor space of the mechanism, and reduces equipment costs and maintenance difficulties.

[0025] The die bonding machine integrates multiple components such as the feeding and discharging line, the handling mechanism, the substrate platform, the chip loading mechanism, the mother-and-child ring loading and unloading assembly, and the chip transfer mechanism. All components work together. The mother-and-child ring loading and unloading assembly realizes the handling of the mother-and-child ring, the handling mechanism realizes the handling of the substrate, and the chip transfer mechanism realizes the handling of the chip. It can realize the loading and unloading functions of the substrate and the mother-and-child ring, the automatic transfer of the chip from the mother-and-child ring to the substrate, and the die bonding operation, realizing the automation process of chip assembly. The linkage of multiple mechanisms reduces manual intervention, improves the intelligence level of the production line, improves production efficiency, ensures production efficiency and die bonding quality, and meets various needs of die bonding production. At the same time, the handling mechanism cooperates with the feeding and discharging line to support the continuous feeding of the substrate and the unloading of the substrate after processing; the mother-and-child ring loading and unloading assembly cooperates with the chip loading mechanism to support the continuous feeding of the mother-and-child ring and the recycling of empty mother-and-child rings, thereby improving the utilization rate of the production line.

[0026] This die bonding method forms a standardized and orderly die bonding process through clear steps, from the loading of the substrate and the mother-daughter ring, position adjustment, picking and placing of the chip, swapping of the positions of the picking and placing unit, to the judgment of whether the assembly is completed and the final loading and unloading. It is easy to achieve automated control, ensuring that the chip can be accurately assembled onto the substrate and guaranteeing the efficient and accurate progress of the die bonding process. Dynamically adjusting the positions of the mother-daughter ring and the substrate enables timely adjustment of the chip picking position and the chip placing position, avoiding the situation of the chip transfer mechanism stopping and waiting, and thus enabling continuous operation without interruption, which helps to improve the working efficiency of the die bonder. The automatic recycling of the empty trays and the automatic recycling of the substrates are synchronized with the production rhythm, enhancing the overall efficiency of the production line. Through multiple position adjustments and the judgment of the completion of the assembly, it is ensured that the chip is assembled onto the substrate, avoiding missing or misplacing, and improving the yield rate and assembly efficiency of the product. Description of the Drawings

[0027] Figure 1 is a schematic structural diagram of the chip transfer mechanism provided by an embodiment of the present invention;

[0028] Figure 2 is a top view schematic diagram of the chip transfer mechanism, the substrate and the mother-daughter ring provided by an embodiment of the present invention;

[0029] Figure 3 is a sectional view of the chip transfer mechanism provided by an embodiment of the present invention;

[0030] Figure 4 is a schematic structural diagram of the die bonder provided by an embodiment of the present invention;

[0031] Figure 5 is a schematic structural diagram of the chip loading mechanism provided by an embodiment of the present invention;

[0032] Figure 6 is Figure 5 a partial sectional view of A in

[0033] Figure 7 is Figure 5 a partial enlarged view of B in

[0034] Figure 8 is a front view schematic diagram of the feeding and discharging line body provided by an embodiment of the present invention;

[0035] Figure 9 is a schematic structural diagram of the feeding and discharging line body provided by an embodiment of the present invention;

[0036] Figure 10 is a schematic structural diagram of the first blocking unit provided by an embodiment of the present invention;

[0037] Figure 11 is a schematic structural diagram of the platen, the feeding and discharging line body and the handling device provided by an embodiment of the present invention;

[0038] Figure 12 is a schematic structural view of a substrate carrier platform provided by an embodiment of the present invention;

[0039] Figure 13 is a schematic structural view of a mother - son ring loading and unloading assembly provided by an embodiment of the present invention from a first perspective;

[0040] Figure 14 is a schematic structural view of a mother - son ring loading and unloading assembly provided by an embodiment of the present invention from a second perspective;

[0041] Figure 15 is a schematic structural view of a mother - son ring loading and unloading assembly provided by an embodiment of the present invention from a third perspective;

[0042] Figure 16 is a top view of a mother - son ring loading and unloading assembly provided by an embodiment of the present invention;

[0043] Figure 17 is a schematic structural view of a mother - son ring cartridge provided by an embodiment of the present invention;

[0044] Figure 18 is a side view of a mother - son ring cartridge provided by an embodiment of the present invention;

[0045] Figure 19 is Figure 18 a partial enlarged view of C in

[0046] Figure 20 is Figure 18 a partial enlarged view of D in

[0047] Figure 21 is a schematic structural view of a substrate gripper provided by an embodiment of the present invention from a first perspective;

[0048] Figure 22 is a schematic structural view of a substrate gripper provided by an embodiment of the present invention from a second perspective;

[0049] Figure 23 is a schematic structural view of a handling device provided by an embodiment of the present invention.

[0050] In the figure:

[0051] X, the first direction; Y, the second direction; Z, the vertical direction;

[0052] 100, platen;

[0053] 200, Chip transfer mechanism; 201, Column; 202, Swing arm; 204, First vision monitoring unit; 205, Second vision monitoring unit; 206, First vision capture unit; 207, Second vision capture unit; 208, Rotation drive unit; 209, Component seat; 210, Voice coil drive unit; 211, Guide rail; 212, Self-rotation drive unit; 213, Synchronous pulley and synchronous belt; 214, Pneumatic rotary joint; 215, Suction nozzle; 216, First negative pressure solenoid valve; 217, Second negative pressure solenoid valve; 218, First positive pressure solenoid valve; 219, Second positive pressure solenoid valve; 220, Swing arm air circuit mounting seat; 221, Ion fan; 222, Crystal picking position; 223, Crystal placing position; 224, First trajectory; 225, Second trajectory;

[0054] 300, Base;

[0055] 400, Substrate carrier platform; 401, Platform seat; 402, First rolling guide rail; 403, First platform linear motor stator; 404, First platform linear motor mover; 405, Platform motor mounting plate; 406, First grating read head; 407, Second rolling guide rail; 408, Second platform linear motor stator; 409, Second platform linear motor mover; 410, Fixture mounting seat; 411, Second grating read head; 412, Substrate fixture; 413, First cylinder; 414, Second cylinder;

[0056] 500, Chip loading mechanism; 501, Mechanism seat; 502, First mechanism guide rail; 503, First mechanism linear motor stator; 504, First mechanism linear motor mover; 505, Mechanism motor mounting plate; 506, Third grating read head; 507, Second mechanism guide rail; 508, Second mechanism linear motor stator; 509, Second mechanism linear motor mover; 510, Upper mounting plate; 511, Fourth grating read head; 512, Crystal ring mounting plate; 513, Rotation drive unit; 514, Mounting ring synchronous belt; 515, Reciprocating drive unit; 516, Clip; 517, Mother-daughter ring positioning strip; 518, Bearing; 519, Mounting ring; 520, Mother-daughter ring; 521, First drive unit shaft; 522, Second drive unit shaft; 523, Third drive unit shaft; 524, Fifth grating read head; 525, Adsorption cap; 526, Membrane vacuum pumping device; 527, Thimble; 528, Membrane adsorption air hole; 530, Mother-daughter ring movement area;

[0057] 600, feeding and discharging line; 601, motor mounting plate; 602, support plate; 607, barcode scanner; 611, width adjustment drive unit; 612, width adjustment synchronous belt; 613, lead screw; 615, guide shaft; 617, guide block; 621, first roller drive unit; 622, third roller drive unit; 623, first transmission synchronous belt; 624, third transmission synchronous belt; 628, first roller fixed side; 629, second roller fixed side; 638, first roller movable side; 639, The second rolling material movable side; 64, the first blocking unit; 641, the first control drive unit; 642, the first area in-place sensor; 643, the first mounting block; 65, the second blocking unit; 66, the third blocking unit; 670, the lower material level sensor; 680, the feeding unit; 691, the first area; 692, the second area; 693, the third area; 694, the fourth area; 695, the first conveyor; 696, the second conveyor; 697, the third conveyor; 698, the fourth conveyor;

[0058] 700, handling device; 701, device column; 702, display; 703, translation linear module; 704, lifting linear module; 71, substrate clamp; 705, clamp bottom plate; 706, clamp rolling guide; 707, first clamp driving unit; 708, second clamp driving unit; 709, clamp in place sensor; 710, clamp seat; 711, clamp body;

[0059] 800, mother-and-child ring loading and unloading assembly; 801, support column; 802, clamping claw transport track; 803, transport lifting drive unit; 804, transport clamping drive unit; 805, mother-and-child ring clamping claw; 806, material box lifting track; 807, mother-and-child ring material box; 8071, support bar; 8072, stopper; 80721, guide surface; 80722, pressing surface; 8073, top block; 8074, top block elastic member; 8075, material box frame; 8076, linear bearing; 8077, guide rod; 8078, handle; 808, first position sensor; 809, material box clamping drive unit; 810, pressing block; 811, second position sensor;

[0060] 900, substrate; 901, platform movement area. DETAILED DESCRIPTION

[0061] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0062] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions. Moreover, the first feature being "above", "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "under" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0063] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected" and "coupled" shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0064] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0065] As Figures 1 to 3 shown, the present embodiment provides a chip transfer mechanism 200 for handling chips. The chip transfer mechanism 200 includes a column 201 and a transfer assembly; the transfer assembly is movably connected to the column 201. The transfer assembly includes an assembly base 209 and two pick-and-place units provided on the assembly base 209. One pick-and-place unit is located at the crystal picking position 222, and the other pick-and-place unit is located at the crystal placing position 223. The assembly base 209 can drive the two pick-and-place units to move so as to swap the positions where the two pick-and-place units are located; the pick-and-place unit located at the crystal picking position 222 is used to pick up chips, and the pick-and-place unit located at the crystal placing position 223 is used to release chips.

[0066] The chip transfer mechanism 200 is provided with a component seat 209 and two pick-and-place units. By swapping the positions of the two pick-and-place units through the component seat 209, one pick-and-place unit can place the chip while the other pick-and-place unit can take the chip synchronously, realizing the parallel execution of the "crystal taking-transfer" and "crystal placing-reset" actions of the two pick-and-place units, compressing the serial process of the traditional single-station operation into a parallel cycle, and the symmetrical station switching design avoids the time loss of the traditional single pick-and-place unit in the process of empty return during the crystal taking and crystal placing process, thereby greatly shortening the cycle time of chip handling, significantly enhancing the continuity of the chip handling process, and improving the overall work efficiency. In addition, the symmetrical layout design of the two pick-and-place units ensures the dynamic balance of the mechanism during the switching process, avoids the positioning error caused by inertia in the traditional rotary handling, and is suitable for the continuous transfer scenario of high-density chip arrays. The above-mentioned structural limitations make the various components of the chip transfer mechanism 200 compactly laid out with clear division of labor, and the components used to supply and place chips can be independent of the chip transfer mechanism 200, which helps to reduce the mutual influence between the solid crystal equipment, simplifies the mechanical movement path of the pick-and-place unit, avoids the complex coordinated movement of multiple components, improves the smoothness of the entire chip processing or assembly process, realizes the simplified design of the specific mechanism, makes the chip handling process more orderly, reduces the complexity and floor space of the mechanism, and reduces the equipment cost and maintenance difficulty.

[0067] In this embodiment, the chip is a Mini LED chip as an example, and the chip transfer mechanism 200 is used to assemble the Mini LED chip onto the substrate 900 .

[0068] In this embodiment, the component seat 209 can rotate relative to the column 201 around the axis of the component seat 209 , the axis of the component seat 209 extends along the vertical direction Z, and the two pick-and-place units are symmetrically arranged about the axis of the component seat 209 .

[0069] The two pick-and-place units are symmetrically arranged about the axis of the component seat 209, which simplifies the position switching path of the pick-and-place units, optimizes the action cycle, and can ensure the position accuracy of the pick-and-place units when switching between the crystal retrieval position 222 and the crystal placement position 223, ensuring the accurate pick-up and release of the chip. The component seat 209 can rotate around the vertical axis so that when the pick-and-place unit rotates and swaps positions, the center of gravity of the mechanism is stable, the movement is smoother, the shaking and error are reduced, and the risk of chip damage is reduced, so that the movement of the pick-and-place unit between the crystal retrieval position 222 and the crystal placement position 223 has good repeatability and consistency, which is conducive to improving the stability of chip handling. The symmetrically distributed pick-and-place units form an inertia compensation effect through rotation, reduce the load fluctuation of the drive components, and this symmetrical structure facilitates mechanical design and control, reducing deviations during movement. In addition, the vertical Z layout reduces the space required for lateral movement, is suitable for high-density production lines, and is compatible with compact equipment structures.

[0070] Further, the pick-and-place unit is slidably disposed on the component seat 209 along the vertical direction Z.

[0071] The pick-and-place unit is slidably disposed on the component seat 209 along the vertical direction Z, which can adjust the height difference between the pick-and-place unit and the substrate 900, flexibly adjust the height of the pick-and-place unit, control the pick-and-place unit to approach the substrate 900 when picking and placing chips, and move away from the substrate 900 after picking and placing. By coordinating the sliding lifting and rotating actions, the pick-and-place trajectory is optimized, thereby avoiding the situation of position conflict between the chip and the substrate 900.

[0072] In this embodiment, the pick-and-place unit includes a swing arm 202 and a suction nozzle 215 disposed on the swing arm 202, and the suction nozzle 215 can adsorb and release chips.

[0073] The pick-and-place unit adopts the structure of the swing arm 202 and the suction nozzle 215. The suction nozzle 215 can adsorb and release chips. This adsorption type pick-and-place method can provide reliable adsorption force, facilitate the grasping and releasing of chips, reduce the damage to chips, ensure the integrity and quality of chips, and can accurately complete the transfer of chips by controlling the adsorption and release actions of the suction nozzle 215. The combined structure of the swing arm 202 and the suction nozzle 215 provides a flexible radial movement range, and the swing path of the swing arm 202 is controllable, which helps to accurately position and is convenient to reach the crystal picking position 222 and the crystal placing position 223.

[0074] In this embodiment, a voice coil drive unit 210 and a guide rail 211 extending along the vertical direction Z are installed on the component seat 209. A sliding member is provided on the swing arm 202, and the sliding member is slidably engaged with the guide rail 211. The output end of the voice coil drive unit 210 is connected to the sliding member to drive the swing arm 202 to move along the vertical direction Z. Specifically, the voice coil drive unit 210 is a motor.

[0075] In an implementation manner of this embodiment, the chip transfer mechanism 200 further includes a gas supply assembly, and the gas supply assembly is used to provide positive pressure and negative pressure to the suction nozzle 215.

[0076] The gas supply assembly provides positive pressure and negative pressure to the suction nozzle 215. The negative pressure can realize the adsorption of chips, and the positive pressure can be used to assist in releasing chips, which helps to shorten the cycle of a single operation, ensures the smooth progress of the adsorption and release actions of the suction nozzle 215 on the chips, ensures the stability and reliability of the chip transfer process, reduces the chip dropout rate, and improves work efficiency and accuracy.

[0077] In another implementation manner of this embodiment, the air supply assembly is only used to provide positive pressure to the nozzle 215, and the chip transfer mechanism 200 completes the adsorption action of the chip through other components. In another implementation manner of this embodiment, the air supply assembly is only used to provide negative pressure to the nozzle 215, and the chip transfer mechanism 200 assists in releasing the chip through other components, or there is no component for assisting in releasing the chip.

[0078] In this embodiment, the chip transfer mechanism 200 further includes a swing arm air path mounting seat 220, and the relative position of the swing arm air path mounting seat 220 and the column 201 is fixed. The swing arm air path mounting seat 220 is located below the component seat 209, and the swing arm air path mounting seat 220 has a first air path, a second air path, a third air path, and a fourth air path. The first air path passes through the first positive pressure solenoid valve 218 to the first negative pressure solenoid valve 216 and is connected to the nozzle 215 on a swing arm 202 to provide positive pressure for the nozzle 215. The second air path provides negative pressure for the nozzle 215 on the swing arm 202 through the second negative pressure solenoid valve 217. The third air path passes through the second positive pressure solenoid valve 219 to the second negative pressure solenoid valve 217 and is connected to the nozzle 215 on the other swing arm 202 to provide positive pressure for the nozzle 215. The fourth air path provides negative pressure for the nozzle 215 through the second positive pressure solenoid valve 219.

[0079] An air pipe rotary joint 214 is provided on the component seat 209, and all the above air paths pass through the air pipe rotary joint 214.

[0080] The components for adsorbing the chip and assisting in releasing the chip are conventional settings in the art, and their specific structures and working principles are common knowledge in the art. They can be set with reference to the prior art. This is not the focus of this embodiment and will not be elaborated here.

[0081] Exemplarily, the nozzle 215 can rotate relative to the swing arm 202 around the axis of the nozzle 215, and the axis of the nozzle 215 extends along the vertical direction Z.

[0082] The nozzle 215 can rotate relative to the swing arm 202 around its vertical axis. The rotation adjustment cooperates with the movement of the swing arm 202 to achieve multi-dimensional attitude control. Thus, during the handling process, according to the angle requirements of chip installation on the substrate 900, the orientation of the chip can be accurately adjusted after picking up the chip. Thereby, the influence of the swing angle of the swing arm 202 is avoided, and further, the requirements for different placement angles during chip assembly can be met, enabling the chip to be accurately installed on the substrate 900, thereby improving the quality of die bonding.

[0083] Furthermore, the transfer assembly further includes two self-rotation drive units 212 and two synchronous pulley synchronous belts 213. The self-rotation drive units 212 are fixedly arranged on the component seat 209, and the output end of each self-rotation drive unit 212 is in transmission cooperation with a nozzle 215 through a synchronous pulley synchronous belt 213.

[0084] The rotation drive unit 212 in the transfer component is in transmission cooperation with the nozzle 215 through the synchronous pulley and synchronous belt 213, which can accurately control the rotation angle and speed of the nozzle 215, so as to correct the deviation according to the offset rotation during the rotation of the swing arm 202, ensure the accuracy of chip angle adjustment, ensure the accuracy of chip angle adjustment, and further improve the reliability of die bonding. At the same time, the driving mode of the synchronous pulley and synchronous belt 213 can minimize the influence caused by the movement of the picking and placing unit along the vertical direction Z, ensuring that the rotation drive unit 212 can drive the nozzle 215 to rotate precisely as required while the picking and placing unit moves up and down. Specifically, the rotation drive unit 212 is a motor.

[0085] In this embodiment, the movement trajectory of the picking and placing unit between the crystal picking position 222 and the crystal placing position 223 is a semi-circle, and the movement trajectory passes through the capture position. There are two vision capture units provided on the column 201, and each vision capture unit corresponds to a picking and placing unit for photographing the picking and placing unit located at the capture position. Specifically, the movement trajectory of the center of the nozzle 215 provided on one picking and placing unit is the first trajectory 224, and the movement trajectory of the center of the nozzle 215 provided on the other picking and placing unit is the second trajectory 225.

[0086] The picking and placing unit moves in a semi-circle between the crystal picking position 222 and the crystal placing position 223, and the movement trajectory passes through the capture position. There is a vision capture unit corresponding to the picking and placing unit provided on the column 201. The vision capture unit can photograph the picking and placing unit located at the capture position in real time, accurately obtain the position and attitude information of the chip, provide accurate data support for subsequent picking and placing operations and the rotation operation of the nozzle 215, so as to precisely adjust the movement of the picking and placing unit, realize the precise positioning of the chip during handling, improve the accuracy of chip handling, and achieve the purpose of deviation correction during the chip transfer process. In addition to monitoring the position and attitude, the vision capture unit can also detect the appearance of the chip and timely discover defects or damages on the chip surface. If a defective chip is detected, it can be timely fed back to the control system for timely measures to be taken for adjustment or processing, improving the product quality and the yield rate.

[0087] The above structure embeds the vision detection node into the transfer path through trajectory planning, avoiding additional docking time, shortening the chip attitude detection and position correction time, and improving the trajectory detection efficiency. The synchronous matching mechanism of the dual vision capture units and the movement trajectory can capture the chip offset in real time and dynamically correct the release position through the feedback system to ensure that the alignment accuracy when the chip is released meets the packaging requirements.

[0088] Specifically, the visual capture unit is disposed above the transfer assembly. The two visual capture units are respectively the first visual capture unit 206 and the second visual capture unit 207. The capture position of the first visual capture unit 206 is set on the first trajectory 224. The angle between the line connecting the capture position and the rotation center and the second direction Y is θ°. The capture position of the second visual capture unit 207 is set on the second trajectory 225. The angle between the line connecting the capture position and the rotation center and the second direction Y is β°.

[0089] In this embodiment, a plurality of die bonding pads are provided on the substrate 900. Each die bonding pad is adapted to a chip. The pick-and-place unit located at the die placement position 223 can release the chip to the corresponding die bonding pad.

[0090] Further, a first visual monitoring unit 204 and a second visual monitoring unit 205 are further provided on the column 201. The first visual monitoring unit 204 is used to photograph the chip adsorbed by the pick-and-place unit located at the chip picking position 222, and complete the image recognition and positioning coordinates of the chip. The second visual monitoring unit 205 is used to photograph the die bonding pad corresponding to the chip on the pick-and-place unit located at the die placement position 223, complete the image recognition and positioning coordinates of the die bonding pad, and the detection of the die-bonded chip.

[0091] Both the first visual monitoring unit 204 and the second visual monitoring unit 205 are disposed above the transfer assembly. Specifically, both the first visual monitoring unit 204 and the second visual monitoring unit 205 are cameras.

[0092] The chip transfer mechanism 200 further includes a rotation driving unit 208. The rotation driving unit 208 is disposed on the column 201, and the output end of the rotation driving unit 208 is fixedly connected to the component seat 209. Specifically, the rotation driving unit 208 is a motor.

[0093] As Figures 1 to 23 shown, this embodiment further provides a die bonder for assembling chips on the substrate 900. The die bonder includes an in-out feeding line body 600 and at least one die bonding module. The die bonding module includes a handling mechanism, a substrate carrying platform 400, a chip loading mechanism 500, a mother-daughter ring loading and unloading assembly 800, and the above-mentioned chip transfer mechanism 200. The handling mechanism is used to handle the substrate 900 between the in-out feeding line body 600 and the substrate carrying platform 400. The substrate carrying platform 400 can carry and drive the substrate 900 to move. The chip loading mechanism 500 is detachably installed with a mother-daughter ring 520. The mother-daughter ring 520 carries chips. The chip loading mechanism 500 can carry and drive the mother-daughter ring 520 to move. The mother-daughter ring loading and unloading assembly 800 is detachably installed with a mother-daughter ring cartridge 807. The mother-daughter ring loading and unloading assembly 800 is used to handle the mother-daughter ring 520 between the mother-daughter ring cartridge 807 and the chip loading mechanism 500.

[0094] This die bonder integrates multiple components such as the in-out feeding line 600, the handling mechanism, the substrate loading platform 400, the chip loading mechanism 500, the mother-daughter ring loading and unloading assembly 800, and the chip transfer mechanism 200. These components work together. The mother-daughter ring loading and unloading assembly 800 realizes the handling of the mother-daughter ring 520, the handling mechanism realizes the handling of the substrate 900, and the chip transfer mechanism 200 realizes the handling of the chip. It can achieve the loading and unloading functions of the substrate 900 and the mother-daughter ring 520, the automatic transfer of the chip from the mother-daughter ring 520 to the substrate 900, and the die bonding operation, realizing the automated process of chip assembly. The linkage of multiple mechanisms reduces manual intervention, improves the intelligent level of the production line, increases production efficiency, ensures production efficiency and die bonding quality, and meets various requirements of die bonding production. At the same time, the handling mechanism cooperates with the in-out feeding line 600 to support the continuous feeding of the substrate 900 and the unloading of the substrate 900 after processing; the mother-daughter ring loading and unloading assembly 800 cooperates with the chip loading mechanism 500 to support the continuous feeding of the mother-daughter ring 520 and the recycling of the empty mother-daughter ring 520, improving the line utilization rate.

[0095] Specifically, the chip loading mechanism 500 is used to carry the mother-daughter ring 520. The chip loading mechanism 500 can locate the position of the chip according to the system algorithm and drive the mother-daughter ring 520 to move within the range of the mother-daughter ring movement area 530 in the horizontal plane. The substrate loading platform 400 is used to carry the substrate 900. The substrate loading platform 400 can locate the position of the bonding pad according to the program and image recognition information and drive the substrate 900 to accurately position within the range of the platform movement area 901 in the horizontal plane.

[0096] The chip transfer mechanism 200 further includes an ion fan 221. The ion fan 221 is arranged on the column 201 and faces the mother-daughter ring 520 to eliminate the static electricity of the chips on the mother-daughter ring 520.

[0097] As Figure 2 、 Figure 4 and Figure 12 shown, the substrate loading platform 400 is used to place the substrate 900. The substrate loading platform 400 can accurately locate the position of the die bonding pad on the substrate 900 according to the program and image recognition information obtained by the second vision monitoring unit 205.

[0098] The substrate carrier platform 400 includes a platform base 401, a platform motor mounting plate 405, a jig mounting seat 410, and two first rolling guide rails 402. The first rolling guide rails 402 are provided on the platform base 401 and extend along the first direction X. A number of platform sliders are provided at the bottom of the platform motor mounting plate 405. The first rolling guide rails 402 are slidably engaged with the platform sliders, and the platform motor mounting plate 405 can move relative to the platform base 401 in the first direction X. The first platform linear motor stator 403 is provided on the platform base 401 and located between the two first rolling guide rails 402. The first platform linear motor mover 404 is disposed below the platform motor mounting plate 405. The first platform linear motor mover 404 is rotationally engaged with the first platform linear motor stator 403 to drive the platform motor mounting plate 405 to move along the first direction X. A first grating read head 406 is fixedly provided on the platform base 401, and the first grating read head 406 is used to feedback the position information of the platform motor mounting plate 405.

[0099] Two second rolling guide rails 407 extending along the second direction Y are provided at the top of the platform motor mounting plate 405. Mounting seat sliders are provided at the bottom of the jig mounting seat 410. The second rolling guide rails 407 are slidably engaged with the mounting seat sliders, and the second rolling guide rails 407 can move relative to the platform motor mounting plate 405 in the second direction Y. The second platform linear motor stator 408 is provided on the platform motor mounting plate 405 and located between the two second rolling guide rails 407. The second platform linear motor mover 409 is disposed below the jig mounting seat 410. The second platform linear motor mover 409 is rotationally engaged with the second platform linear motor stator 408 to drive the jig mounting seat 410 to move along the second direction Y. A second grating read head 411 is fixedly provided on the platform motor mounting plate 405, and the second grating read head 411 is used to feedback the position information of the platform motor mounting plate 405.

[0100] A substrate jig 412 is mounted on the jig mounting seat 410. A number of jig adsorption air holes are provided on the substrate jig 412. The bottom ends of the jig adsorption air holes are communicated with a jig vacuum pumping device, and the jig vacuum pumping device is used to adsorb the substrate 900. The jig vacuum pumping device can provide vacuum conduction for the substrate jig 412 to tightly adsorb the substrate 900 on the upper surface of the substrate jig 412. A first cylinder 413 and a second cylinder 414 are also provided on the substrate jig 412. The first cylinder 413 is used to drive two opposite first clamping members to selectively clamp the substrate 900 along the first direction X, and the second cylinder 414 is used to drive two opposite second clamping members to selectively clamp the substrate 900 along the second direction Y.

[0101] In this embodiment, the first direction X and the second direction Y are perpendicular to each other and both are perpendicular to the vertical direction Z.

[0102] As Figures 17 to 20As shown, the mother - and - son ring cartridge 807 is used to carry the mother - and - son rings 520. The mother - and - son ring cartridge 807 includes a cartridge frame 8075. The cartridge frame 8075 has a number of storage spaces evenly distributed along the vertical direction Z. Each storage space is used to store a mother - and - son ring 520. A support unit and a top block 8073 are provided in the storage space. The support unit is used to horizontally carry the mother - and - son ring 520. One end of the support unit is fixedly connected to the cartridge frame 8075, and a stop block 8072 is fixedly provided at the other end. The top block 8073 is elastically connected to the cartridge frame 8075 through a top - block elastic member 8074. The top block 8073 can move closer to or away from the stop block 8072 along the moving direction, and the moving direction is parallel to the horizontal plane. The top - block elastic member 8074 is used to push the top block 8073 to move towards the stop block 8072. The mother - and - son ring 520 placed in the storage space is clamped between the stop block 8072 and the top block 8073. Specifically, the moving direction is parallel to the first direction X.

[0103] The cartridge frame 8075 of the mother - and - son ring cartridge 807 has a number of storage spaces evenly distributed along the vertical direction Z, which can orderly store multiple mother - and - son rings 520 in a limited space, realizing the efficient storage of the mother - and - son rings 520, making full use of the vertical space, improving the space utilization rate, and facilitating the batch management of the mother - and - son rings 520. The support unit is used to horizontally carry the mother - and - son rings 520, ensuring that the mother - and - son rings 520 maintain a stable horizontal state in the storage space, reducing the risk of damage caused by shaking or tilting, and ensuring the storage safety of the mother - and - son rings 520. Through the stop block 8072 and the movable top block 8073, the mother - and - son rings 520 can be firmly clamped between them, preventing the mother - and - son rings 520 from shifting or shaking in the cartridge, and ensuring the storage stability. The top block 8073 is elastically connected to the cartridge frame 8075 through the top - block elastic member 8074 and reciprocates along the moving direction, clamping the mother - and - son rings 520 between the stop block 8072 and the top block 8073, realizing the reliable fixation of the mother - and - son rings 520. When clamping and placing the mother - and - son rings 520, the top - block elastic member 8074 can play a buffering role to avoid hard damage to the mother - and - son rings 520.

[0104] Specifically, a handle 8078 for easy gripping is provided at the top end of the cartridge frame 8075.

[0105] In this embodiment, on the side of the stop block 8072 facing the top block 8073, there are a connected pressing surface 80722 and a guiding surface 80721. The pressing surface 80722 is used to fit with the side wall of the mother - and - son ring 520. The guiding surface 80721 is located above the pressing surface 80722, and the guiding surface 80721 and the pressing surface 80722 are arranged at an angle.

[0106] The pressing surface 80722 of the stopper 8072 is in contact with the side wall of the mother-daughter ring 520, which can more accurately limit the movement of the mother-daughter ring 520 in the horizontal direction, improve the positioning accuracy of the mother-daughter ring 520 in the storage space, ensure the position accuracy of the mother-daughter ring 520 in the storage space, and is beneficial to the accuracy of subsequent clamping and using operations. The guiding surface 80721 is located above the pressing surface 80722 and is arranged at an angle with the pressing surface 80722, providing a guiding function for the operation of placing the mother-daughter ring 520 into the storage space, making it easier for the mother-daughter ring 520 to accurately reach the corresponding position in the storage space, reducing the operation difficulty, and improving the convenience and efficiency of placing the mother-daughter ring 520.

[0107] Further, along the vertical direction Z from top to bottom, the guiding surface 80721 is inclined away from the top block 8073.

[0108] The guiding surface 80721 is inclined away from the top block 8073 along the vertical direction Z from top to bottom. When the mother-daughter ring 520 is placed into the storage space from top to bottom, the guiding surface 80721 can guide the mother-daughter ring 520 to slide smoothly to the pressing surface 80722, so that the mother-daughter ring 520 can slide into the storage space more smoothly when placed, thereby further optimizing the process of placing the mother-daughter ring 520 into the storage space, reducing the jamming and obstruction during the placement process, and improving the smoothness and efficiency of the operation of taking and placing the mother-daughter ring 520.

[0109] In this embodiment, the support unit includes at least two support bars 8071 arranged at intervals in the second direction Y. The support bars 8071 extend along the first direction X, and a stopper 8072 is fixedly connected to each support bar 8071. Specifically, there are two support bars 8071.

[0110] The design of the support unit composed of the support bars 8071 arranged at intervals can support the mother-daughter ring 520 from multiple positions, ensure the support stability of the mother-daughter ring 520 in the horizontal direction, and prevent the mother-daughter ring 520 from tilting or shaking due to single-point support.

[0111] Exemplarily, a guiding rod 8077 is fixedly connected to the end of the top block 8073 away from the stopper 8072. The guiding rod 8077 is movably connected to the cartridge frame 8075. The guiding rod 8077 passes through the top block elastic member 8074 and is coaxial with the top block elastic member 8074.

[0112] One end of the top block 8073 away from the stop block 8072 is fixedly connected with a guide rod 8077. The guide rod 8077 is movably connected to the cartridge frame 8075 and passes through the top block elastic member 8074 and is coaxial with it, providing precise guidance for the movement of the top block 8073, ensuring the movement accuracy of the top block 8073 in the horizontal direction, ensuring that the reciprocating movement of the top block 8073 in the moving direction is more stable and accurate, avoiding deviation of the top block 8073 during the movement process, and ensuring the action accuracy of clamping and releasing the mother-daughter ring 520.

[0113] Further, a linear bearing 8076 is fixedly connected to the cartridge frame 8075. The number of linear bearings 8076 is the same as that of the guide rods 8077, and each linear bearing 8076 is in sliding fit with a guide rod 8077.

[0114] A linear bearing 8076 is fixedly connected to the cartridge frame 8075. The linear bearing 8076 is in sliding fit with the guide rod 8077, which can effectively reduce the friction force when the guide rod 8077 moves, make the movement of the top block 8073 smoother and more flexible, and at the same time reduce the wear of components, improving the operation efficiency and service life of the entire mechanism.

[0115] As Figures 13 to 16 shown, the mother-daughter ring loading and unloading assembly 800 is used to transport the mother-daughter rings 520 in different storage spaces of the mother-daughter ring cartridge 807 to the chip loading mechanism 500, and can also carry out the mother-daughter rings 520 in the chip loading mechanism 500 out and place them in different storage spaces in the mother-daughter ring cartridge 807. The mother-daughter ring loading and unloading assembly 800 includes a gripper handling module, a cartridge lifting module and the above-mentioned mother-daughter ring cartridge 807. The cartridge lifting module is used to drive the mother-daughter ring cartridge 807 along one end in the vertical direction Z. The gripper handling module can extend into the mother-daughter ring cartridge 807 to pick up and place the mother-daughter rings 520.

[0116] The mother-daughter ring loading and unloading assembly 800 includes a gripper handling module, a cartridge lifting module and a mother-daughter ring cartridge 807. The cartridge lifting module can drive the mother-daughter ring cartridge 807 to move along the vertical direction Z. The gripper handling module can extend into the mother-daughter ring cartridge 807 to pick up and place the mother-daughter rings 520, realizing the automatic operation of loading and unloading the mother-daughter rings 520, improving the flexibility and production efficiency of loading and unloading, and being able to adapt to different production requirements.

[0117] Further, the gripper handling module includes a gripper handling track 802, a handling lifting drive unit 803, a handling clamping drive unit 804 and two mother-daughter ring grippers 805. The handling lifting drive unit 803 can move relative to the gripper handling track 802 in the horizontal plane. The handling lifting drive unit 803 is used to drive the handling clamping drive unit 804 to move along the vertical direction Z. The handling clamping drive unit 804 can drive the two mother-daughter ring grippers 805 to approach or move away from each other to clamp or release the mother-daughter rings 520.

[0118] The handling lifting drive unit 803 of the gripper handling module can move relative to the gripper handling track 802 in a horizontal plane, and can also drive the handling gripper drive unit 804 to move along the vertical direction Z. The handling gripper drive unit 804 can drive two mother-daughter ring grippers 805 to approach or move away from each other. Through the coordinated work of each drive unit on the gripper handling module, multi-dimensional flexible operation of clamping and handling the mother-daughter ring 520 is realized, meeting the picking and placing requirements of the mother-daughter ring 520 at different positions and heights, and improving the accuracy and stability of the operation.

[0119] Exemplarily, the cartridge lifting module includes a cartridge lifting track 806, a cartridge clamping drive unit 809, and at least a pair of pressing blocks 810. The cartridge clamping drive unit 809 can move relative to the cartridge lifting track 806 along the vertical direction Z. The pressing blocks 810 are connected to the output end of the cartridge clamping drive unit 809. The cartridge clamping drive unit 809 is used to drive each pair of pressing blocks 810 to approach or move away from each other to clamp or release the mother-daughter ring cartridge 807.

[0120] The cartridge clamping drive unit 809 of the cartridge lifting module can drive each pair of pressing blocks 810 to approach or move away from each other to clamp or release the mother-daughter ring cartridge 807, ensuring the stability of the mother-daughter ring cartridge 807 during the lifting process, preventing the mother-daughter ring cartridge 807 from shaking or falling, and ensuring the safety and stability of the loading and unloading process.

[0121] Specifically, the cartridge lifting module further includes a first position sensor 808 and a second position sensor 811. The first position sensor 808 is arranged on the cartridge clamping drive unit 809 and is used to monitor whether the mother-daughter ring 520 is stored in each storage space. The second position sensor 811 is arranged on the cartridge lifting track 806 and is used to monitor whether the mother-daughter ring cartridge 807 is currently installed on the cartridge lifting module, so as to ensure the monitoring ability of the cartridge lifting module for the mother-daughter ring cartridge 807 during the automated movement process.

[0122] When removing the mother-daughter ring 520 from the mother-daughter ring cartridge 807, the following processes are included: using the cartridge lifting module to lift and adjust the target storage space to the corresponding picking position, detecting that the current storage space has the mother-daughter ring 520 by using the first position sensor 808, then moving the mother-daughter ring gripper 805 into place, driving the mother-daughter ring gripper 805 to clamp the mother-daughter ring 520 by the handling gripper drive unit 804, and then controlling the mother-daughter ring gripper 805 to move a predetermined distance towards the top block 8073 until the top block 8073 is pushed to the compressed position to avoid position conflict between the mother-daughter ring 520 and the guiding surface 80721. Subsequently, control the mother-daughter ring cartridge 807 to descend so that the mother-daughter ring 520 is located at the opening of the target storage space and is spaced apart from the stop block 8072. Finally, the gripper handling module takes out the mother-daughter ring 520.

[0123] When placing the empty mother-daughter ring 520 into the mother-daughter ring magazine 807, the following processes are included: using the magazine lifting module to lift and adjust the target storage space to the corresponding feeding position, using the first position sensor 808 to detect that there is no mother-daughter ring 520 in the current storage space, driving the mother-daughter ring gripper 805 holding the mother-daughter ring 520 by the gripper handling module, passing through the opening of the target storage space and entering the mother-daughter ring magazine 807, and pushing the top block 8073 to the compressed position to avoid position conflicts between the mother-daughter ring 520 and the guiding surface 80721. Subsequently, control the mother-daughter ring magazine 807 to rise so that the mother-daughter ring 520 contacts the support bar 8071, and the handling and gripping drive unit 804 drives the mother-daughter ring gripper 805 to release the mother-daughter ring 520; the top block elastic member 8074 drives the top block 8073 to move towards the stop block 8072, pushing the mother-daughter ring 520 to contact the pressing surface 80722.

[0124] In this embodiment, the chip loading mechanism 500 is used to place the mother-daughter ring 520, and the chip loading mechanism 500 can accurately locate the position of the chip on the mother-daughter ring 520 according to the program and image recognition information obtained by the first vision monitoring unit 204.

[0125] As Figures 5 to 7 shown, the mother-daughter ring 520 is detachably installed on the chip loading mechanism 500. The mother-daughter ring 520 includes a ring body and an elastic blue film. The blue film is configured to close the opening of the ring body. The blue film is used to carry the chip. The chip loading mechanism 500 includes a mechanism base 501, a crystal ring positioning unit, a mounting ring 519, and an adsorption cap 525; the crystal ring positioning unit is movably connected to the mechanism base 501, and the crystal ring positioning unit can move relative to the mechanism base 501 in a horizontal plane; the mounting ring 519 is rotatably connected to the crystal ring positioning unit, and the mounting ring 519 can rotate relative to the crystal ring positioning unit around the axis of the mounting ring 519. The axis of the mounting ring 519 extends along the vertical direction Z. The mounting ring 519 is used to carry and drive the ring body to rotate. The crystal ring positioning unit selectively positions the ring body on the mounting ring 519; the adsorption cap 525 is movably connected to the mechanism base 501, and the adsorption cap 525 can move relative to the mechanism base 501 in a horizontal plane. The adsorption cap 525 passes through the crystal ring positioning unit and the mounting ring 519. The top end of the adsorption cap 525 is provided with an adsorption surface and a top pin 527. The adsorption surface selectively adsorbs the lower surface of the blue film, and the top pin 527 is used to lift the lower surface of the blue film to make part of the blue film deform upward.

[0126] The chip loading mechanism 500 is detachably installed with a mother-daughter ring 520, which facilitates the replacement and maintenance of the mother-daughter ring 520, provides a stable placement platform for the chips, and improves the usage efficiency of the chip loading mechanism 500. The blue film of the mother-daughter ring 520 can carry the chips, and the elastic blue film can adapt to different operations to avoid chip damage. The crystal ring positioning unit can move within the horizontal plane, and the mounting ring 519 can rotate around the vertical axis. The cooperation of the two can accurately adjust the position and angle of the mother-daughter ring 520, facilitating the precise positioning and adjustment of the ring body, improving the accuracy of chip loading, and contributing to the subsequent picking and placing operations of the chips. The adsorption cap 525 can move within the horizontal plane, and the adsorption surface at its top can adsorb the lower surface of the blue film. The ejector pin 527 can jack up the blue film to cause partial deformation, which helps to separate the chips from the blue film, facilitates chip picking, and is convenient for subsequent transfer.

[0127] In this embodiment, the ejector pin 527 is disposed at the center of the adsorption surface, and the ejector pin 527 extends in a direction perpendicular to the adsorption surface.

[0128] The ejector pin 527 is disposed at the center of the adsorption surface and extends perpendicular to the adsorption surface, which can more accurately jack up the target position on the blue film, make the blue film deform evenly upward stably, ensure that the chips can be stably separated from the blue film, thereby improving the accuracy and stability of chip separation and the success rate of chip picking.

[0129] Exemplarily, the chip loading mechanism 500 further includes a film vacuuming device 526. A plurality of film adsorption air holes 528 are evenly distributed on the adsorption surface. The film adsorption air holes 528 are communicated with the film vacuuming device 526, and the film vacuuming device 526 is used to adsorb the blue film.

[0130] The film vacuuming device 526 adsorbs the blue film through the film adsorption air holes 528, which can provide a stable adsorption force, ensure the tight fit of the blue film and the adsorption surface, prevent the blue film from shaking or shifting during the chip separation process, and improve the reliability of loading.

[0131] In this embodiment, the chip loading mechanism 500 further includes a first drive unit shaft 521, a second drive unit shaft 522, and a third drive unit shaft 523. The output end of the first drive unit shaft 521 is fixedly connected to the second drive unit shaft 522, and the first drive unit shaft 521 is used to drive the second drive unit shaft 522 to reciprocate along the first direction X; the output end of the second drive unit shaft 522 is fixedly connected to the third drive unit shaft 523, and the second drive unit shaft 522 is used to drive the third drive unit shaft 523 to reciprocate along the second direction Y; the output end of the third drive unit shaft 523 is fixedly connected to the ejector pin 527, and the third drive unit shaft 523 is used to drive the ejector pin 527 to reciprocate along the vertical direction Z. Specifically, the adsorption cap 525 is fixedly provided on the third drive unit shaft 523 so that the relative positions of the third drive unit shaft 523 and the adsorption cap 525 are fixed.

[0132] Through the cooperation of the first drive unit shaft 521, the second drive unit shaft 522 and the third drive unit shaft 523, the adsorption cap 525 is driven to move in the first direction X and the second direction Y which are perpendicular to each other, and the ejector pin 527 is driven to move in the vertical direction Z. Thus, the flexible movement of the adsorption cap 525 in the horizontal plane is realized, and the ejector pin 527 ejects the chip as required, thereby ensuring the precise grasping and positioning of the chip, accurately reaching the target position for chip adsorption operation, and helping to improve the flexibility and accuracy of feeding.

[0133] Specifically, a fifth grating reader 524 is fixedly installed on the mechanism base 501, and the fifth grating reader 524 is used to feedback the position information of the adsorption cap 525.

[0134] Exemplarily, the crystal ring positioning unit further includes a mechanism motor mounting plate 505 and a crystal ring mounting plate 512. The mechanism motor mounting plate 505 is movably connected to the mechanism base 501, and the mechanism motor mounting plate 505 can reciprocally move relative to the mechanism base 501 along the first direction X; the crystal ring mounting plate 512 is movably connected to the mechanism motor mounting plate 505, and the crystal ring mounting plate 512 can reciprocally move relative to the mechanism motor mounting plate 505 along the second direction Y. The mounting ring 519 is rotatably connected to the crystal ring mounting plate 512.

[0135] The mechanism motor mounting plate 505 and the crystal ring mounting plate 512 of the crystal ring positioning unit reciprocally move along the first direction X and the second direction Y which are perpendicular to each other respectively, and can precisely adjust the positions of the mounting ring 519 and the mother-daughter ring 520 in the horizontal plane, thereby realizing the precise positioning of the mother-daughter ring 520 and improving the positioning accuracy of chip feeding.

[0136] Further, at the top of the mechanism base 501, there are a first mechanism linear motor stator 503 and two first mechanism guide rails 502. The first mechanism guide rails 502 extend along the first direction X, and the first mechanism linear motor stator 503 is arranged between the two first mechanism guide rails 502. At the bottom of the mechanism motor mounting plate 505, there are a first mechanism linear motor mover 504 and several mechanism sliders. The mechanism sliders are slidably matched with the first mechanism guide rails 502, and the first mechanism linear motor mover 504 is rotationally matched with the first mechanism linear motor stator 503 to drive the mechanism motor mounting plate 505 to move along the first direction X; at the top of the mechanism motor mounting plate 505, there are a second mechanism linear motor stator 508 and two second mechanism guide rails 507. The second mechanism guide rails 507 extend along the second direction Y, and the second mechanism linear motor stator 508 is arranged between the two second mechanism guide rails 507. At the bottom of the crystal ring mounting plate 512, there are a second mechanism linear motor mover 509 and several mounting plate sliders. The mounting plate sliders are slidably matched with the second mechanism guide rails 507, and the second mechanism linear motor mover 509 is rotationally matched with the second mechanism linear motor stator 508 to drive the crystal ring mounting plate 512 to move along the second direction Y.

[0137] The cooperation between the stator 503 of the first mechanism linear motor and the mover 504 of the first mechanism linear motor drives the motor mounting plate 505 of the mechanism to move smoothly along the first direction X, ensuring the stability of the crystal ring positioning. At the same time, the first mechanism guide rail 502 is in sliding fit with the mechanism slider, ensuring the stability and accuracy of the movement of the motor mounting plate 505 of the mechanism, enabling the motor mounting plate 505 of the mechanism to move efficiently along the first direction X.

[0138] The cooperation between the stator 508 of the second mechanism linear motor and the mover 509 of the second mechanism linear motor drives the crystal ring mounting plate 512 to move smoothly along the second direction Y, ensuring the stability of the crystal ring positioning. At the same time, the sliding fit between the second mechanism guide rail 507 and the mounting plate slider ensures the stability and accuracy of the movement of the crystal ring mounting plate 512, enabling the crystal ring mounting plate 512 to move efficiently along the second direction Y, further improving the positioning accuracy of the mother-daughter ring 520.

[0139] Specifically, the bottom end of the crystal ring mounting plate 512 is fixedly connected with an upper mounting plate 510, and the mounting plate slider is arranged on the upper mounting plate 510; a third grating reader head 506 is fixedly arranged on the mechanism base 501, and the third grating reader head 506 is used to feedback the position information of the motor mounting plate 505 of the mechanism; a fourth grating reader head 511 is fixedly arranged on the motor mounting plate 505 of the mechanism, and the fourth grating reader head 511 is used to feedback the position information of the crystal ring mounting plate 512.

[0140] In this embodiment, the chip loading mechanism 500 further includes a mother-daughter ring positioning strip 517 and a clip 516. The mother-daughter ring positioning strip 517 is fixedly arranged on the crystal ring positioning unit and is in contact with the outer side wall of the ring body of the mother-daughter ring 520 placed on the mounting ring 519; the clip 516 is movably connected to the crystal ring positioning unit, and the clip 516 can approach or move away from the mother-daughter ring positioning strip 517 to press against the outer side wall of the ring body of the mother-daughter ring 520, so that the mother-daughter ring 520 is clamped between the clip 516 and the mother-daughter ring positioning strip 517.

[0141] The cooperation between the mother-daughter ring positioning strip 517 and the clip 516 can firmly clamp the mother-daughter ring 520 on the crystal ring positioning unit, preventing the mother-daughter ring 520 from shifting during rotation or movement, ensuring the accuracy and stability of chip loading.

[0142] In this embodiment, the crystal ring mounting plate 512 is provided with a reciprocating driving unit 515, and the output end of the reciprocating driving unit 515 is connected with a clip 516 to drive the clip 516 to move. Specifically, the reciprocating driving unit 515 is a cylinder.

[0143] Furthermore, there are two clips 516, which are symmetrically arranged with respect to the movement trajectory of the output end of the reciprocating drive unit 515; the clips 516 are hinged to the crystal ring mounting plate 512, and the clips 516 can swing relative to the crystal ring mounting plate 512 between an avoidance position and a pressing position. The clip 516 in the avoidance position is spaced from the mother-daughter ring 520 placed on the mounting ring 519, and the clip 516 in the pressing position presses against the mother-daughter ring 520 placed on the mounting ring 519. The clip 516 is also elastically connected to the crystal ring mounting plate 512 through an elastic member, and the elastic member is used to drive the clip 516 to move to the avoidance position, and the reciprocating drive unit 515 can push the clip 516 to move to the pressing position.

[0144] Exemplarily, a rotation drive unit 513 is provided on the crystal ring positioning unit. The mounting ring 519 is rotationally matched with the crystal ring positioning unit through a bearing 518. The bearing 518 provides positioning and guidance for the rotation of the mother-daughter ring 520, and the rotation drive unit 513 is in transmission cooperation with the mounting ring 519 through a mounting ring synchronous belt 514.

[0145] The rotation drive unit 513 is in transmission cooperation with the mounting ring 519 through the mounting ring synchronous belt 514, enabling the mounting ring 519 to rotate precisely around the axis smoothly, realizing the angular adjustment of the mother-daughter ring 520, meeting the requirements of different chip loading, and providing a reliable guarantee for the circumferential positioning of the chip.

[0146] As Figures 21 to 23 shown, the handling mechanism includes a device column 701 and a substrate gripper 71. The substrate gripper 71 can move relative to the device column 701 in a plane perpendicular to the first direction X.

[0147] This handling mechanism enables the substrate gripper 71 to move relative to the device column 701 in a plane perpendicular to the first direction X, realizing the handling of the substrate 900 in a two-dimensional plane, expanding the working space and flexibility of the substrate 900 handling, and meeting the requirements for picking and placing the substrate 900 at different positions. By integrating the substrate gripper 71 with the device column 701, the overall integration degree of the handling mechanism is improved, and the floor area is reduced.

[0148] In this embodiment, the handling mechanism further includes a translation linear module 703 and a lifting linear module 704. The translation linear module 703 is arranged on the device column 701, and the output end of the translation linear module 703 is connected to the lifting linear module 704 for driving the lifting linear module 704 to move along the second direction Y. The output end of the lifting linear module 704 is connected to the substrate gripper 71 for driving the substrate gripper 71 to move along the vertical direction Z.

[0149] The settings of the translation linear module 703 and the lifting linear module 704 enable the substrate gripper 71 to move in the second direction Y and the vertical direction Z. Combined with the driving of the substrate 900 by the substrate gripper 71 in the first direction X, the handling of the substrate 900 in three-dimensional space is realized, improving the flexibility and applicability of the handling and meeting the handling requirements of the substrate 900 at different positions. Through the precise control of the above linear modules, precise handling and positioning of the substrate 900 in all directions can be achieved.

[0150] Exemplarily, the handling mechanism further includes a display 702 provided on the device column 701. The display 702 is used to display in real time the moving speed, position information, and clamping state of the gripper unit.

[0151] The display 702 can display in real time the moving speed, position information, and clamping state of the gripper unit. The operator can timely understand the working conditions of the gripper, which is convenient for adjustment and troubleshooting, improving the safety and reliability of the handling mechanism. Through the real-time monitoring of the state of the gripper unit, potential faults and abnormal conditions can be discovered in time, early warning and handling can be carried out in advance, and the reliability and stability of the handling mechanism can be improved.

[0152] As Figure 11 、 Figure 21 and Figure 22 shown, the substrate gripper 71 is used for picking and placing the substrate 900. The substrate gripper 71 includes a gripper bottom plate 705 and two gripper units provided on the gripper bottom plate 705. The gripper units can slide relative to the gripper bottom plate 705 in the first direction X. One gripper unit can press against the substrate 900 with a first driving force, and the other gripper unit can press against the substrate 900 with a second driving force. The first driving force and the second driving force are in opposite directions, and the absolute value of the first driving force is less than the absolute value of the second driving force; after the two gripper units clamp the substrate 900, the gripper units and the substrate 900 form an integral body, and the substrate 900 is driven to slide relative to the gripper bottom plate 705 with the combined driving force of the two gripper units until it reaches the limit position on the gripper bottom plate 705.

[0153] The two gripper units on the substrate gripper 71 can slide relative to the gripper bottom plate 705 in the first direction X, and the applied forces are different in magnitude and opposite in direction. This differential design can flexibly adjust the distance between the two gripper units according to the size and position of the substrate 900 to achieve stable positioning of different specifications of the substrate 900 and improve the efficiency of the picking and placing operation. After the gripper units clamp the substrate 900 and form an integral body and slide to the limit position with the combined driving force, the clamping and positioning of the substrate 900 can be completed quickly and accurately, ensuring that the substrate 900 is stably fixed in the substrate gripper 71, reducing the shaking and displacement during the handling process, and improving the overall working efficiency.

[0154] In this embodiment, the jaw unit includes a jaw base 710 and two jaw bodies 711. The jaw base 710 is slidably engaged with the jaw bottom plate 705. The jaw body 711 can slide relative to the jaw base 710 along the second direction Y, and the jaw body 711 is used to grip the substrate 900.

[0155] The jaw body 711 can slide relative to the jaw base 710 along the second direction Y, and the first direction X is perpendicular to the second direction Y, which increases the adjustment dimension of the jaw in the horizontal plane, can better adapt to the position and posture of the substrate 900, improves the gripping accuracy, and helps to grip the substrate 900 more precisely. Since the jaw body 711 has the adjustment ability in two mutually perpendicular directions, the substrate jaw 71 can better adapt to substrates 900 of different shapes and sizes.

[0156] Furthermore, a gripping through groove is provided at the edge of the jaw body 711, and the substrate 900 can be partially inserted and matched in the gripping through groove. The groove wall of the gripping through groove is provided with an elastic anti-slip layer.

[0157] The design of the gripping through groove at the edge of the jaw body 711 enables the substrate 900 to be partially inserted and matched, increasing the stability of gripping. The setting of the elastic anti-slip layer can prevent the jaw from damaging the surface of the substrate 900. The elastic anti-slip layer on the groove wall can increase the friction with the substrate 900, prevent the substrate 900 from sliding or falling off during the gripping process, protect the integrity of the substrate 900, and improve the reliability of gripping.

[0158] Exemplarily, a jaw rolling guide 706 extending along the first direction X is provided on the jaw bottom plate 705. The jaw unit is movably engaged with the jaw rolling guide 706. A jaw in-place sensor 709 is provided on the jaw bottom plate 705, and the jaw in-place sensor 709 is used to monitor the clamping state of the jaw unit.

[0159] The jaw rolling guide 706 provides a stable path for the sliding of the jaw unit, enables the jaw unit to move smoothly, improves the flexibility and response speed of the operation, and reduces the energy loss. The jaw in-place sensor 709 can monitor the presence or absence of the substrate 900 on the substrate jaw 71 in real time, to judge whether the substrate 900 always remains on the jaw unit during the transportation of the substrate jaw 71, and can also detect whether there is a substrate 900 clamped between the two jaw units before the jaw unit grips the substrate 900, to ensure that the jaw unit operates as expected and avoid damaging the equipment due to misoperation; the setting of the jaw in-place sensor 709 facilitates the realization of automatic control and helps to improve the safety and reliability of the substrate jaw 71.

[0160] In one implementation of this embodiment, a first jaw driving unit 707 is provided on the jaw bottom plate 705, and the output end of the first jaw driving unit 707 is connected to a jaw unit; and a second jaw driving unit 708 is provided on the jaw bottom plate 705, and the output end of the second jaw driving unit 708 is connected to another jaw unit. Specifically, both the first jaw driving unit 707 and the second jaw driving unit 708 are cylinders. Due to the difference in their powers, there is a difference in the absolute values between the first driving force and the second driving force.

[0161] The first jaw driving unit 707 and the second jaw driving unit 708 respectively drive the two jaw units, and independently control the driving force and position of the movement of each jaw unit through different driving methods, which is convenient for adjusting the force application and position of the jaw unit according to actual needs, and thus can realize a more flexible and precise gripping operation to adapt to different working scenarios.

[0162] In other implementations of this embodiment, it is only defined that a first jaw driving unit 707 is provided on the jaw bottom plate 705, and the output end of the first jaw driving unit 707 is connected to a jaw unit, or it is only defined that a second jaw driving unit 708 is provided on the jaw bottom plate 705, and the output end of the second jaw driving unit 708 is connected to another jaw unit.

[0163] In this embodiment, the ratio of the absolute value of the first driving force to the absolute value of the second driving force is 1:N, where N is greater than 1; the direction of the combined driving force of the two jaw units is the same as the direction of the second driving force, and the value of the combined driving force is the difference between the absolute value of the second driving force and the absolute value of the first driving force.

[0164] Clarifying the ratio of the absolute values of the first driving force and the second driving force and the calculation method of the combined driving force enables the jaw unit to move at a reasonable speed when gripping the substrate 900, avoiding damage to the substrate 900 caused by too fast a speed or affecting the work efficiency due to too slow a speed, so as to quickly complete the gripping and moving operations of the substrate 900. Precise driving force control helps to quickly adjust the jaw spacing, thereby improving the accuracy of substrate 900 gripping and positioning, and ensuring the smoothness of the overall movement and the work quality.

[0165] Continue to refer to Figure 4 , there are two die bonding modules. The handling mechanism in one die bonding module is used to pick up or release the substrate 900 at the first stop position, realizing the handling of the substrate 900 between the feeding and discharging line body 600 and the substrate carrier platform 400 in this die bonding module; the handling mechanism in the other die bonding module is used to pick up or release the substrate 900 at the second stop position, realizing the handling of the substrate 900 between the feeding and discharging line body 600 and the substrate carrier platform 400 in this die bonding module; the feeding and discharging line body 600 can drive the substrate 900 to pass through the first stop position and the second stop position successively.

[0166] Two die bonding modules are provided, and the feeding and discharging line body 600 can drive the substrate 900 to pass through the first stop position and the second stop position of the two die bonding modules successively, so that die bonding operations can be performed on different substrates 900 at the same time, which helps the feeding and discharging line body 600 to segmentally control and optimize the transfer efficiency of the substrate 900 and avoid process congestion. Through the multi-station parallel mode, the above improvement realizes the parallel operation of the two modules, reduces the waiting time between processes, improves the output per unit time, and improves the production efficiency of the die bonder.

[0167] As Figures 1 to 23 As shown in the figure, the die bonder further includes a platen 100 and a base 300. The platen 100 is installed on the base 300, and all the other components are installed on the platen 100. Specifically, the platform seat 401 is fixed on the platen 100, the mechanism seat 501 is fixed on the platen 100, the material box lifting track 806 is fixed on the platen 100, and the gripper transfer track 802 is fixed on the platen 100 through the support column 801.

[0168] On the platen 100, the two die bonding modules are symmetrically arranged with respect to the second direction Y. In the second direction Y, the transfer mechanism and the substrate-carrying platform 400 in the same die bonding module are located on one side of the chip transfer mechanism 200, and the feeding and discharging line body 600 is also located on this side; the chip loading mechanism 500 and the mother-daughter ring loading and unloading assembly 800 in the same die bonding module are located on the other side of the chip transfer mechanism 200.

[0169] In this embodiment, the two transfer mechanisms are jointly arranged on the same device column 701, the device column 701 is fixed on the platen 100, and the device column 701 and the two transfer mechanisms form a transfer device 700.

[0170] As Figures 8 to 10As shown, the loading and unloading line body 600 is used to convey the substrate 900 supplied by the feeding unit 680. The feeding unit 680 outputs M substrates 900 each time, where M is an integer greater than one. The loading and unloading line body 600 includes a first area 691, (M - 1) second areas 692, a third area 693, and a fourth area 694 arranged in sequence along the first direction X. The first area 691 is provided with a first conveyor 695 and a first blocking unit 64. The first conveyor 695 is used to receive the substrate 900 output by the feeding unit 680, and the first conveyor 695 can drive the substrate 900 to move to the next area. The first blocking unit 64 selectively blocks the substrate 900 from moving to the next area. The second area 692 is provided with a second conveyor 696 and a second blocking unit 65. The second conveyor 696 can drive the substrate 900 to move to the previous area and the next area. The second blocking unit 65 selectively blocks the substrate 900 from moving to the previous area. The third area 693 is provided with a third conveyor 697 and a third blocking unit 66. The third conveyor 697 is used to drive the substrate 900 to move to the next area. The third blocking unit 66 selectively blocks the substrate 900 from moving to the next area. The fourth area 694 is provided with a fourth conveyor 698, and the fourth conveyor 698 is used to drive the substrate 900 to be conveyed out of the loading and unloading line body 600.

[0171] By setting the loading and unloading line body 600 in different areas, it can orderly receive, convey, and output a batch of substrates 900, improving the transmission efficiency and smoothness of the substrates 900 and meeting the requirements of large-scale production. Each area is provided with a conveyor and a blocking unit, which can selectively block the movement of the substrate 900 according to production needs, facilitating the control of the stay and movement of the substrate 900 in different areas, achieving precise control of the transmission rhythm and position of the substrate 900, avoiding the accumulation or chaos of the substrate 900, and thus adapting to diverse production processes.

[0172] In this embodiment, the first conveyor 695 in the first area 691 and the second conveyor 696 in the first second area 692 are an integrated first conveyor assembly. The first conveyor assembly can drive the substrate 900 to reciprocate along the first direction X. The third conveyor 697 in the third area 693 and the fourth conveyor 698 in the fourth area 694 are an integrated second conveyor assembly. The second conveyor assembly is used to drive the substrate 900 to move away from the first conveyor assembly along the first direction X.

[0173] The first transmission component and the second transmission component adopt an integrated structure, which reduces the number of components and connection points, simplifies the structure of the feed-in and feed-out line 600, reduces the manufacturing cost and maintenance difficulty, reduces the complexity of the feed-in and feed-out line 600, and enables the substrate 900 to be synchronously and stably transmitted in the component, which is convenient for the installation, commissioning and maintenance of the feed-in and feed-out line 600, and helps to improve the transmission efficiency. The integrated transmission component can provide more stable transmission power, ensure that the substrate 900 moves smoothly during the transmission process, and reduce transmission failures caused by structural connection problems. The first transmission component can drive the substrate 900 to reciprocate along the first direction X, so that the substrate 900 can move flexibly between the first area 691 and the second area 692; the second transmission component drives the substrate 900 away from the first transmission component to achieve orderly output of the substrate 900.

[0174] Furthermore, a first blocking unit 64 is disposed on the first conveying component, and the first blocking unit 64 includes a first control drive unit 641 and a first area in-position sensor 642. The first area in-position sensor 642 is used to monitor the first stop position. The output end of the first control drive unit 641 can extend into or out of the first conveying component, so that the substrate 900 moving toward the second conveying component can be positioned at the first stop position.

[0175] The first blocking unit 64 monitors the first stop position through the first area in-position sensor 642, and the first control drive unit 641 can accurately stop the substrate 900 at the position, thereby realizing the accurate positioning of the substrate 900 in the first area 691, providing an accurate position basis for subsequent processing or handling operations, and improving production accuracy. With the cooperation of the sensor and the drive unit, the automatic control of the positioning of the substrate 900 can be realized, thereby improving the degree of automation and production efficiency of production.

[0176] Specifically, the first blocking unit 64 further includes a first mounting block 643 , which is fixedly connected to the first conveying assembly, and the first control driving unit 641 and the first area arrival sensor 642 are mounted on the first mounting block 643 .

[0177] In this embodiment, the second blocking unit 65 is arranged on the first conveying component, and the second blocking unit 65 includes a second control driving unit and a second area in-position sensor, and the second area in-position sensor is used to monitor the second stop position. The output end of the second control driving unit can extend into or out of the first conveying component, so that the substrate 900 moving away from the second conveying component can be positioned at the second stop position.

[0178] The second blocking unit 65 can monitor the second stop position and position the substrate 900 moving away from the second conveying component at the second stop position, thereby satisfying the positioning control capability of the substrate 900 during reverse conveyance, improving the positioning control of the substrate 900 in the first conveying component, facilitating better connection with the operations in the front and rear areas, and ensuring the accurate position of the substrate 900 in the second area 692, meeting the needs of different production processes, making the conveying control of the feed and discharge line 600 more flexible and comprehensive, and improving the continuity of the overall production process.

[0179] Specifically, the second blocking unit 65 further includes a second mounting block, the second mounting block is fixedly connected to the first transmission assembly, and the second control driving unit and the second area arrival sensor are mounted on the second mounting block.

[0180] Exemplarily, the third blocking unit 66 is arranged on the second conveying component, and the third blocking unit 66 includes a third control driving unit and a third area in-position sensor, and the third area in-position sensor is used to monitor the third stop position, and the output end of the third control driving unit can extend into or out of the second conveying component, so that the substrate 900 moving away from the first conveying component can be positioned at the third stop position.

[0181] The third blocking unit 66 can monitor the third stop position, so that the substrate 900 moving away from the first conveying assembly is positioned at the third stop position, ensuring the accurate position of the substrate 900 in the third area 693, providing guarantee for the smooth discharge of the substrate 900, and providing accurate position information for subsequent handling or processing operations. The above improvements refine the control of the feeding and discharging line 600 on the conveying process of the substrate 900, and improve the refinement of the production process.

[0182] Specifically, the third blocking unit 66 further includes a third mounting block, the third mounting block is fixedly connected to the second conveying assembly, and the third control driving unit and the third area in-position sensor are mounted on the third mounting block.

[0183] In one implementation of the present embodiment, the first conveying component has a first roller fixed side 628 and a first roller movable side 638 extending along the first direction X, the first roller fixed side 628 is rotatably connected to the first transmission synchronous belt 623, the first roller movable side 638 is rotatably connected to the second transmission synchronous belt, the first transmission synchronous belt 623 and the second transmission synchronous belt are used to carry and convey the substrate 900; and the second conveying component has a second roller fixed side 629 and a second roller movable side 639 extending along the first direction X, the second roller fixed side 629 is rotatably connected to the third transmission synchronous belt 624, the second roller movable side 639 is rotatably connected to the fourth transmission synchronous belt, the third transmission synchronous belt 624 and the fourth transmission synchronous belt are used to carry and convey the substrate 900.

[0184] The first conveying component and the second conveying component carry and convey the substrate 900 through a transmission synchronous belt. The rotational connection mode of the synchronous belt can provide stable conveying power, and has the advantages of smooth transmission, low noise, etc., and can reliably realize the conveying function of the substrate 900. The setting of the above-mentioned multiple transmission synchronous belts can adapt to substrates 900 of different sizes and specifications, and improve the versatility and adaptability of the in-out feeding line body 600.

[0185] In other embodiments of this embodiment, only the first conveying component is limited to have a first rolling material fixed side 628 and a first rolling material movable side 638 extending along the first direction X. A first transmission synchronous belt 623 is rotatably connected to the first rolling material fixed side 628, and a second transmission synchronous belt is rotatably connected to the first rolling material movable side 638. The first transmission synchronous belt 623 and the second transmission synchronous belt are used to carry and convey the substrate 900; or only the second conveying component is limited to have a second rolling material fixed side 629 and a second rolling material movable side 639 extending along the first direction X. A third transmission synchronous belt 624 is rotatably connected to the second rolling material fixed side 629, and a fourth transmission synchronous belt is rotatably connected to the second rolling material movable side 639. The third transmission synchronous belt 624 and the fourth transmission synchronous belt are used to carry and convey the substrate 900.

[0186] A motor mounting plate 601 and a support plate 602 are fixedly connected to the platen 100. A guide shaft 615 extending along the second direction Y is fixedly connected to the support plate 602. A lead screw 613 extending along the second direction Y is rotatably connected to the support plate 602. The lead screw 613 can rotate relative to the support plate 602 around the axis of the lead screw 613. A guide block 617 is fixedly connected to the second rolling material fixed side 629. The guide block 617 is in transmission cooperation with the lead screw 613, and the guide block 617 and the guide block 617 are used to achieve the purpose of adjusting the track width. A width adjustment driving unit 611 is fixedly connected to the motor mounting plate 601. The output end of the width adjustment driving unit 611 is in transmission cooperation with the lead screw 613 through a width adjustment synchronous belt 612 for driving the lead screw 613 to rotate. A first rolling material driving unit 621 is further provided on the first rolling material fixed side 628. The first rolling material driving unit 621 is used to drive the first transmission synchronous belt 623 to rotate; a second rolling material driving unit is further provided on the first rolling material movable side 638. The second rolling material driving unit is used to drive the second transmission synchronous belt to rotate; a third rolling material driving unit 622 is further provided on the second rolling material fixed side 629. The third rolling material driving unit 622 is used to drive the third transmission synchronous belt 624 to rotate; a fourth rolling material driving unit is further provided on the second rolling material movable side 639. The fourth rolling material driving unit is used to drive the fourth transmission synchronous belt to rotate. Specifically, all the rolling material driving units are cylinders, and the width adjustment driving unit 611 is a cylinder.

[0187] Further, the first rolling material movable side 638 can approach or move away from the first rolling material fixed side 628 along the second direction Y; the second rolling material movable side 639 can approach or move away from the second rolling material fixed side 629 along the second direction Y.

[0188] The first rolling material movable side 638 can approach or move away from the first rolling material fixed side 628 along the second direction Y, and the second rolling material movable side 639 can approach or move away from the second rolling material fixed side 629 along the second direction Y. The width of the conveying channel can be adjusted according to the width of the substrate 900, enhancing the adaptability of the feeding and discharging line body 600 to substrates 900 of different widths, improving the flexibility and practicality of the equipment, meeting the conveying requirements of substrates 900 of different specifications, enabling the feeding and discharging line body 600 to be applied to diverse production scenarios, and expanding the application range of the feeding and discharging line body 600.

[0189] In this embodiment, a blanking position sensor 670 is provided on the second conveying component, and the blanking position sensor 670 is used to monitor the substrate 900 located at the output end of the second conveying component.

[0190] The blanking position sensor 670 can monitor the substrate 900 located at the output end of the second conveying component in real time, facilitating timely understanding of the discharging situation of the substrate 900, realizing effective monitoring and automatic control of the discharging process, providing accurate information for subsequent blanking operations, and facilitating the realization of an automatic blanking process. By timely feedback of the position information of the substrate 900, the time arrangement of the blanking operation can be optimized, the blanking waiting time can be reduced, and the overall production efficiency can be improved.

[0191] Exemplarily, a barcode scanner 607 is provided on the first conveying component, and the barcode scanner 607 is used to scan the workpiece information of the substrate 900 located at the first stop position.

[0192] Setting the barcode scanner 607 on the first conveying component can automatically scan the workpiece information of the substrate 900 located at the first stop position, realizing the automatic, rapid, and accurate acquisition of the information of the substrate 900, reducing manual intervention, and improving the information management level in the production process. The rapid and accurate acquisition of the workpiece information is realized, the production efficiency and accuracy are improved, and it is convenient for subsequent production management and quality traceability.

[0193] By obtaining the workpiece information of the substrate 900, the relevant information of the substrate 900 can be associated with each link in the production process, facilitating quality traceability of products and production process monitoring, contributing to the realization of automated production management. By obtaining the workpiece information of the substrate 900, the production progress, product quality, etc. can be monitored and managed in real time, improving the efficiency and accuracy of production management. According to the workpiece information obtained by scanning, the production links and relevant parameters of the problematic substrate 900 can be quickly located, facilitating quality analysis and improvement, improving product quality, and helping to promptly discover and solve problems that occur in the production process.

[0194] Exemplarily, the first transfer assembly and the second transfer assembly are fixedly connected to the platen 100.

[0195] As Figures 8 to 11 shown, each handling mechanism corresponds to a second area 692 or a third area 693, and the handling mechanism is used to transfer the substrate 900 between the substrate-carrying platform 400 and the corresponding second area 692 or third area 693.

[0196] The die bonder combines M die bonding modules and the in-out feeding line body 600. Each component cooperates with each other, and can perform die bonding operations on multiple substrates 900 simultaneously, realizing the automated assembly process of the chips from the mother-daughter ring 520 to the substrate 900, improving the integration and automation degree of production, reducing manual intervention, improving the production efficiency and production capacity of the die bonder, and meeting the requirements of large-scale production. The handling mechanism therein can realize the rapid transfer of the substrate 900 between different areas and the substrate-carrying platform 400, ensuring the coherence of the production process. The above structural improvement reduces the waiting time of each component, and the processing time after an alarm or downtime of a certain die bonding module will not affect the other die bonding modules, helping to improve the working efficiency of the die bonder.

[0197] This embodiment also provides an in-out feeding method, which is applied to the above-mentioned in-out feeding line body 600, and includes the following steps:

[0198] Step 1: Use the feeding unit 680 to supply M substrates 900 to the first area 691.

[0199] Step 2: Use the first transfer member 695, the third transfer member 697 and all the second transfer members 696 to convey the substrate 900 in a direction away from the feeding unit 680.

[0200] Step 3: Control the first blocking unit 64, the third blocking unit 66 and all the second blocking units 65 to work. Use the first blocking unit 64 to block the movement of the substrate 900 in the first area 691. When there is no substrate 900 in the first second area 692, transfer a substrate 900 to the first second area 692, and then continue to block the movement of the substrate 900. When there is no substrate 900 in the first area 691, control the second transfer member 696 in the first second area 692 to move towards the feeding unit 680 and block it through the corresponding second blocking unit 65. When the second transfer member 696 in the previous second area 692 moves towards the feeding unit 680, control the second transfer member 696 in the next second area 692 to move towards the feeding unit 680 and block it through the corresponding second blocking unit 65. When there is a substrate 900 in the third area 693, control the third blocking unit 66 to block the movement of the substrate 900.

[0201] Step 4: After all the substrates 900 are processed, control the first transfer member 695, the third transfer member 697, the fourth transfer member 698 and all the second transfer members 696 to convey the substrates 900 in a direction away from the feeding unit 680, and control all the first blocking units 64, the third blocking unit 66 and all the second blocking units 65 to stop blocking the substrates 900.

[0202] This loading and unloading method controls the feeding, conveying and blocking units step by step, clarifies the steps such as feeding, conveying, blocking and unloading, enables the substrate 900 to move orderly on the loading and unloading line body 600 according to a predetermined process, avoids the chaos and collision of the substrate 900 during the conveying process, and ensures the continuity and high efficiency of production. During the processing, by controlling the blocking unit, the conveying and blocking units can be flexibly controlled according to the state of the substrates 900 in each area to complete the conveying and positioning of the substrate 900, coordinate the processing and transmission of the substrate 900, reduce the waiting time of the substrate 900 during the conveying process, closely match the loading and unloading process with the processing procedures, improve the overall production efficiency, and at the same time reduce the production errors caused by improper manual operation.

[0203] Continue to refer to Figures 1 to 23 , this embodiment also provides a die bonding method, which is applied to the above die bonder and includes the following steps:

[0204] Step 1: Use the handling mechanism to transfer the substrate 900 from the loading and unloading line body 600 to the substrate carrier platform 400, and use the mother-daughter ring loading and unloading assembly 800 to transfer the mother-daughter ring 520 from the mother-daughter ring magazine 807 to the chip loading mechanism 500.

[0205] Step 2: Adjust the position of the substrate 900 using the substrate carrier platform 400, and adjust the position of the mother-daughter ring 520 using the chip loading mechanism 500.

[0206] Step 3: Control the pick-and-place unit located at the chip picking position 222 to pick up the chip from the mother-daughter ring 520, and control the pick-and-place unit located at the chip placing position 223 to release the chip onto the substrate 900.

[0207] Step 4: Use the component seat 209 to swap the positions of the two pick-and-place units.

[0208] Step 5: Determine whether the substrate 900 is assembled. If so, proceed to Step 6; if not, return to Step 2.

[0209] Step 6: Use the handling mechanism to transfer the substrate 900 from the substrate carrier platform 400 to the in-out feeding line body 600, and use the in-out feeding line body 600 to convey the substrate 900 out of the die bonder; use the mother-daughter ring loading and unloading component 800 to transfer the mother-daughter ring 520 from the chip loading mechanism 500 to the mother-daughter ring magazine 807.

[0210] This die bonding method forms a standardized and orderly die bonding process through clear steps, from the feeding, position adjustment of the substrate 900 and the mother-daughter ring 520, picking and placing of the chip, swapping of the positions of the pick-and-place units, to determining whether the assembly is completed and the final loading and unloading. It is easy to achieve automatic control, ensuring that the chip can be accurately assembled onto the substrate 900, and guaranteeing the efficient and accurate progress of the die bonding process. Dynamically adjusting the positions of the mother-daughter ring 520 and the substrate 900 enables timely adjustment of the chip picking position 222 and the chip placing position 223, avoiding the situation where the chip transfer mechanism 200 stops waiting, and enabling continuous operation without interruption, which helps to improve the working efficiency of the die bonder. The automatic recycling of the empty trays is synchronized with the automatic recycling of the substrate 900 and the production rhythm, improving the overall efficiency of the production line. Through multiple position adjustments and determination of the completion of assembly, it is ensured that the chip is assembled onto the substrate 900, avoiding missing or misplacing, and improving the yield and assembly efficiency of the product.

[0211] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, rather than limiting the embodiments of the present invention. For those of ordinary skill in the art, other different forms of changes or variations can be made based on the above description. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the claims of the present invention.

Claims

1. A chip transfer mechanism, used for transporting chips, characterized in that: The chip transfer mechanism comprises: Column (201); A transfer component is movably connected to the column (201), and the transfer component includes a component seat (209) and two pick-and-place units arranged on the component seat (209), one of the pick-and-place units is located at a crystal retrieval position (222), and the other of the pick-and-place units is located at a crystal placement position (223), and the component seat (209) can drive the two pick-and-place units to move so as to swap the positions of the two pick-and-place units; the pick-and-place unit located at the crystal retrieval position (222) is used to pick up the chip, and the pick-and-place unit located at the crystal placement position (223) is used to release the chip.

2. The chip transfer mechanism according to claim 1, characterized in that: The component seat (209) can rotate relative to the column (201) around the axis of the component seat (209), the axis of the component seat (209) extends along the vertical direction (Z), and the two pick-and-place units are symmetrically arranged about the axis of the component seat (209).

3. The chip transfer mechanism according to claim 2, characterized in that: The pick-and-place unit is slidably arranged on the component seat (209) along the vertical direction (Z).

4. The chip transfer mechanism according to claim 2, characterized in that: The pick-and-place unit comprises a swing arm (202) and a suction nozzle (215) arranged on the swing arm (202), and the suction nozzle (215) can absorb and release the chip.

5. The chip transfer mechanism according to claim 4, characterized in that: The chip transfer mechanism further comprises an air supply component, wherein the air supply component is used to provide positive pressure and / or negative pressure to the suction nozzle (215).

6. The chip transfer mechanism according to claim 4, characterized in that: The suction nozzle (215) is capable of rotating relative to the swing arm (202) around an axis of the suction nozzle (215), and the axis of the suction nozzle (215) extends along the vertical direction (Z).

7. The chip transfer mechanism according to claim 6, characterized in that: The transfer assembly further comprises two self-rotating drive units (212) and two synchronous wheel and synchronous belts (213); the self-rotating drive units (212) are fixedly mounted on the assembly seat (209); and the output end of each self-rotating drive unit (212) is in transmission cooperation with a suction nozzle (215) via one of the synchronous wheel and synchronous belts (213).

8. The chip transfer mechanism according to claim 2, characterized in that: The movement trajectory of the pick-and-place unit between the crystal picking position (222) and the crystal placing position (223) is a semicircular arc, and the movement trajectory passes through a capture position. Two visual capture units are provided on the column (201), and each of the visual capture units corresponds to one of the pick-and-place units and is used to capture the pick-and-place unit located at the capture position.

9. A die bonding machine, used for assembling a chip on a substrate (900), characterized in that: The die bonding machine comprises an inlet and outlet line (600) and at least one die bonding module, the die bonding module comprises a transport mechanism, a substrate carrier platform (400), a chip loading mechanism (500), a mother-and-child ring loading and unloading assembly (800), and a chip transfer mechanism according to any one of claims 1 to 8, the transport mechanism is used to transport the substrate (900) between the inlet and outlet line (600) and the substrate carrier platform (400), the substrate carrier platform (400) can carry and drive the substrate (900) ) movement, a mother-and-child ring (520) is detachably mounted on the chip loading mechanism (500), the mother-and-child ring (520) carries a chip, the chip loading mechanism (500) can carry and drive the mother-and-child ring (520) to move, a mother-and-child ring material box (807) is detachably mounted on the mother-and-child ring loading and unloading assembly (800), the mother-and-child ring loading and unloading assembly (800) is used to carry the mother-and-child ring (520) between the mother-and-child ring material box (807) and the chip loading mechanism (500).

10. A die bonding method, characterized in that: The die bonding machine according to claim 9 comprises the following steps: S1: using the transport mechanism to transport the substrate (900) from the inlet and outlet line (600) to the substrate carrier platform (400), and using the mother-and-child ring loading and unloading assembly (800) to transport the mother-and-child ring (520) from the mother-and-child ring material box (807) to the chip loading mechanism (500); S2: using the substrate-carrying platform (400) to adjust the position of the substrate (900), and using the chip loading mechanism (500) to adjust the position of the mother-child ring (520); S3: controlling the pick-and-place unit located at the crystal retrieval position (222) to take the chip from the mother-child ring (520), and controlling the pick-and-place unit located at the crystal placement position (223) to release the chip onto the substrate (900); S4: using the component seat (209) to swap the positions of the two pick-and-place units; S5: Determine whether the substrate (900) is assembled, if so, proceed to S6, if not, return to S2; S6: using the transport mechanism to transport the substrate (900) from the substrate carrier platform (400) to the feed and discharge line (600), and using the feed and discharge line (600) to transfer the substrate (900) out of the die bonding machine; using the mother-and-child ring loading and unloading assembly (800) to transport the mother-and-child ring (520) from the chip loading mechanism (500) to the mother-and-child ring box (807).

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