Etching equipment for circuit board

Abstract

The invention relates to the technical field of circuit board etching, in particular to circuit board etching equipment which comprises a base, an inlet and outlet formed in the base, spraying pieces arranged in the base and a conveying assembly arranged between the spraying pieces. A linkage assembly is arranged on the side wall of the base and connected with the conveying assembly, a moving assembly is arranged on the inner side wall of the base, and the linkage assembly drives the moving assembly to synchronously move along with the circuit board. The moving assembly is provided with an overturning part, the fixing plate can rotate by 180 degrees under the cooperation of the moving assembly and the overturning part, the circuit board is etched firstly, the circuit board is overturned by 180 degrees when etching is about to be completed, old etching liquid on the circuit board is removed, then the etching liquid is sprayed from bottom to top, the circuit board is etched, and uncompleted copper is left. After the etching is completed, the circuit board passes through the water absorption roller, so that the etching efficiency of the circuit board is not influenced, and lateral erosion is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board etching, and specifically to an etching device for a circuit board. Background Art

[0002] Circuit board etching is a key step in the manufacturing process of printed circuit boards. Its main purpose is to remove the unnecessary copper parts from the circuit board to form the required circuit pattern. During the chemical etching process, an etching solution is usually used to dissolve the copper foil parts not covered by the protective layer. The etching solution reacts chemically with the copper foil to dissolve the unnecessary copper parts, thereby forming a circuit pattern on the circuit board.

[0003] A phenomenon occurs during the etching process, specifically referring to the fact that the etching solution etches the material not only in the vertical direction but also etches both sides of the material in the horizontal direction. This phenomenon is particularly common in circuit board etching, especially after the metal surface is etched to a certain depth, new metal surfaces appear on the exposed two sides, and the etching solution will etch in both the vertical direction and the two sides simultaneously.

[0004] The formation process of side etching is as follows: At the beginning of etching, the surface of the circuit part of the circuit board is protected by a mask, and the rest of the surface is in contact with the etching solution. At this time, the etching proceeds vertically downward. When the copper surface is etched to a certain depth, new copper surfaces appear on the exposed two sides. At this time, the etching solution etches not only in the vertical direction but also in the two sides. As the etching depth increases, the etched area of the copper on both sides also increases, resulting in the side etching phenomenon. And as the etching time prolongs, the etching solution will gradually accumulate on the circuit board. When the etching solution accumulates on the circuit board to a certain extent and reaches the position of the metal board surface, the etching solution cannot continue to etch downward, and it will exacerbate the degree of diffusion of the etching solution to both sides of the circuit, thereby exacerbating the side etching. Side etching has a significant impact on product quality. It can make the graphic lines or dots on the convex surface become thinner and smaller, cause the graphics to deform or the dimensions to have errors, and even lead to product scrapping in severe cases.

[0005] To solve this problem, some techniques attempt to use the method of spraying the etching solution on the circuit board from bottom to top. The original intention of this method is to reduce the accumulation of the etching solution on the circuit board by changing the spraying direction of the etching solution, thereby reducing the occurrence of side etching and improving the etching accuracy of the circuit board. However, this method also has certain limitations. Due to the action of gravity, the etching solution will flow downward rapidly after being sprayed onto the circuit board, which will lead to a shortening of the contact time between the etching solution and the circuit board. The reduction of the contact time will reduce the corrosion efficiency of the etching solution on the copper layer, thereby increasing the etching time of the circuit board.

[0006] Therefore, an etching device for a circuit board is proposed. Summary of the Invention

[0007] The object of the present invention is to provide an etching device for a circuit board. After the circuit board undergoes preliminary etching to a certain extent, the device uses a flipping member to flip the circuit board in time for subsequent etching, ensuring both the etching accuracy and the etching efficiency of the circuit board.

[0008] To achieve the above object, the present invention provides the following technical solutions:

[0009] An etching device for a circuit board, comprising a base, an entrance and exit opened on the base, a spraying member provided in the base, a conveying assembly provided between the spraying members, a linkage assembly provided on the side wall of the base, the linkage assembly being connected to the conveying assembly, a moving assembly provided on the inner side wall of the base, the linkage assembly driving the moving assembly to move synchronously with the circuit board, a flipping member provided on the moving assembly, the flipping member being able to flip 180° under the movement of the moving assembly, a fixing plate provided on the flipping member, the fixing plate being able to switch between the upper spraying member area and the lower spraying member area in cooperation with the flipping member, and when switching, the fixing plate being able to flip 180° around its axis, the fixing plate reciprocating between the upper spraying member area and the lower spraying member area, and a clamping member is further provided in the fixing plate, and the clamping member can fix the circuit board in the fixing plate.

[0010] It can be seen that in the prior art, due to the action of gravity, the etching solution will flow downward rapidly after being sprayed onto the circuit board, which will lead to a shortening of the contact time between the etching solution and the circuit board. The reduction of the contact time will reduce the corrosion efficiency of the etching solution on the copper layer, thereby increasing the etching time of the circuit board. This device is provided with a flipping member. When the circuit board enters the base, it moves in the base through the conveying assembly. When it enters the base, the upper spraying member sprays the etching solution to etch the circuit board. After the etching solution etches for a period of time and etches a part of the copper on the surface of the circuit board, the flipping member flips the circuit board 180° so that the side of the circuit board to be etched faces downward. At this time, the spraying member sprays the etching solution from the bottom up onto the circuit board to etch the remaining unetched copper surface of the circuit board; as can be seen from the background technology, as the etching depth increases, the etching area of the two side metal surfaces also increases. The part that first contacts the etching solution has a longer contact time with the etching solution, and the etching depth towards both sides is also greater. When this device sprays, the overall contact time between the front of the etching solution and the circuit board is reduced, and the etching depth is also reduced, thereby reducing side etching. Moreover, when the circuit board is flipped and the etching solution is etched from the bottom up, due to the action of gravity, when the etching solution impacts the copper surface, the etching solution will quickly drop, reducing the residence time of the etching solution on the copper surface, thereby reducing the probability of side etching. And this device flips the circuit board when the circuit board is about to be etched to completion. During the flipping process, the old etching solution will be removed, and the new etching solution etches the remaining uncompleted copper from the bottom up, which does not affect the etching efficiency of the circuit board and will also reduce side etching.

[0011] Preferably, the two sets of spraying members are arranged to intersect with each other above and below the conveying assembly. The two sets of spraying members are respectively fixedly connected to the inner top of the base and the conveying assembly. The two sets of spraying members provide two spraying methods. Initially, the etching solution etches the circuit board from top to bottom. When the etching is about to be completed, the other set of etching solution etches the circuit board from top to bottom.

[0012] Preferably, the conveying assembly includes a connecting block, a water leakage port, and multiple sets of conveying members. The connecting block is fixedly installed in the middle of the base, and the connecting block penetrates through the inlet and outlet of the base. The water leakage port is opened on the connecting block; the conveying member includes a first tapered tooth, a second tapered tooth, multiple sets of rollers, and a rotating shaft. The rotating shaft is rotatably connected in the connecting block. Multiple sets of the rollers are fixedly installed on the rotating shaft. The first tapered tooth is fixedly installed at one end of the rotating shaft. The second tapered tooth is rotatably connected to one side of the bevel gear, and the first tapered tooth and the second tapered tooth are meshed with each other; multiple sets of the conveying members are linearly arrayed in the connecting block, and no conveying member is provided above the spraying member. The conveying assembly moves the circuit board from the inlet of the base to the outlet of the base, and the motor drives the conveying members to rotate synchronously.

[0013] Preferably, the conveying assembly further includes a cleaning member. The cleaning member includes a baffle, a water-absorbing roller, and a water drainage port. The water-absorbing roller is fixedly connected to the rotating shaft and is arranged near the outlet of the base. The baffle is semi-circular. The baffle is fixedly connected to the connecting block. The water-absorbing roller is arranged in the baffle and is in contact with the edge of the baffle. The water drainage port is opened at the bottom of the baffle. The water-absorbing roller can effectively remove the residual etching solution on the surface of the circuit board, avoid further etching of the circuit board by the etching solution after the circuit board is etched, and the water-absorbing roller can also remove the colloidal crust on the board.

[0014] Preferably, the linkage assembly includes a first circular tooth, a second circular tooth, a convex block, a switching block, a first spring, and a rotating rod. The first circular tooth is fixedly connected to the rotating shaft. The diameter of the first circular tooth is smaller than the diameter of the second circular tooth. The second circular tooth is rotatably connected to the side wall of the base. The first circular tooth and the second circular tooth are meshed with each other. The switching block is arranged on one side of the second circular tooth. The convex block is arranged below the rotating rod. The rotating rod is rotatably connected to the center of the second circular tooth. The first spring is arranged between the rotating rod and the second circular tooth. The linkage assembly rotates synchronously with the driving member.

[0015] Preferably, the moving component includes a rotating wheel, a belt, a moving block, a second spring and a limiting block. The rotating wheel is rotatably connected to the inner side wall of the base, and the rotating wheel is connected to the rotating rod. The belt is fixedly connected to the rotating wheel. The moving block is fixedly connected to the end of the belt. The limiting block is fixedly installed on the inner side wall of the base, and the moving block is slidably connected within the limiting block. The second spring is disposed between the limiting block and the moving block. The linkage component can drive the moving block to move synchronously with the circuit board.

[0016] Preferably, the flipping member includes a cavity, a fixed rod, a connecting shaft, a third gear and a rack. The cavity is formed in the base. The fixed rod is slidably connected within the cavity. The connecting shaft is movably connected to one side of the fixed rod. The third gear is fixedly connected to the connecting shaft. The rack is fixedly connected to the base, and the third gear meshes with the rack. The length of the rack is half of the circumference of the third gear. The tooth diameters of the third gear and the rack are the same. The flipping member drives the circuit board to flip. When the flipping member drives the circuit board to flip, the etching solution is still under continuous high-pressure spraying. The flipping member can avoid the impact of the etching solution on the circuit board during flipping.

[0017] Preferably, a groove is further formed in the connecting shaft. A rotating rod is disposed within the groove. The rotating rod is rotatably connected to the third gear. A sector gear is provided on the rotating rod. A tooth is meshed with the sector gear. The tooth is fixedly connected to the base.

[0018] Preferably, the fixing plate is fixedly connected to one end of the connecting shaft. The width of the upper end of the fixing plate is shorter than the width of the lower end of the fixing plate. A rounded corner is provided on one side of the fixing plate. The setting of the fixing plate can make the circuit board more stable during flipping.

[0019] Preferably, the clamping member includes a third spring, a rotating shaft and a clamping rod. The third spring is fixedly connected within the fixing plate. The clamping rod is fixedly connected to the third spring. The clamping rod is rotatably connected within the fixing plate via the rotating shaft, and the rotating shaft is concentric with the rotating rod. The clamping member can automatically clamp the circuit board and release the limitation on the circuit board.

[0020] Preferably, an extrusion plate is further fixedly connected within the cavity. The extrusion plate is located on one side of the baffle. The extrusion plate releases the limitation of the clamping block on the circuit board, facilitating the circuit board to move out of the base.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0022] 1. When etching the circuit board in the present invention, the circuit board is first subjected to preliminary etching. When the etching is nearly completed, the circuit board is flipped 180° to remove the old etching solution on the board. Subsequently, the etching solution is sprayed from bottom to top to continue etching the remaining uncompleted copper on the circuit board. This bottom-to-top spraying method can effectively reduce the side etching phenomenon. Because when the spraying part sprays at high pressure from bottom to top for etching, due to the action of gravity, the etching solution will quickly fall downward after being sprayed onto the circuit board, which will lead to a shortened contact time between the etching solution and the circuit board, thereby reducing side etching. Moreover, changing the etching treatment method to a combination of two spraying methods also reduces the overall accumulation time of the etching solution on the circuit board, avoiding the situation where when the etching solution accumulates to a certain extent on the circuit board, it intensifies the diffusion of the etching solution to both sides of the circuit, and helps to maintain the accuracy and clarity of the etched pattern.

[0023] 2. The present invention combines horizontal etching and flipped etching, which can improve the etching efficiency of the circuit board: During the horizontal etching process, although the part near the edge of the circuit board is more likely to have the etching solution flow out due to the water flow pressure, the etching solution accumulates in the central area and is unevenly distributed on the board surface, resulting in low utilization rate of the etching solution in some areas. However, its etching efficiency is fast. After flipped etching, the etching solution can cover the entire board surface more evenly, improving the utilization rate of the etching solution. Since the combination of horizontal etching and flipped etching makes the etching more uniform, it reduces the number of repeated etching times required due to local uneven etching, thereby improving the overall etching efficiency.

[0024] 3. In the existing circuit board etching technology, when the circuit board is being horizontally transported, the part near the edge has the etching solution flowing out more easily, resulting in frequent exchange of the old and new etching solutions, making the etching rate faster and the side etching phenomenon more obvious. In this case, the etching effect in the central area of the board is relatively poor because the etching solution is prone to form a "pool effect" in the central area, resulting in restricted flow of the etching solution. By adopting the flipped etching technology, the circuit board can be flipped after etching to a certain extent, so that the central area of the board, which originally had a relatively poor etching effect, can be etched more fully. This flipped etching method not only improves the etching uniformity of the entire board surface, but also effectively avoids the problems of etching solution accumulation and side etching caused by long-term unidirectional etching. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic structural diagram of an etching device for a circuit board according to the present invention;

[0026] Figure 2 It is a schematic structural diagram of another angle of an etching device for a circuit board according to the present invention;

[0027] Figure 3 It is a sectional view of an etching device for a circuit board according to the present invention;

[0028] Figure 4 Cross-sectional plan view of an etching device for a circuit board according to the present invention;

[0029] Figure 5 Schematic structural view of the cleaning part of the present invention;

[0030] Figure 6 is Figure 4 Enlarged view of part A of;

[0031] Figure 7 Schematic structural view of the moving component of the present invention;

[0032] Figure 8 Schematic structural view of the flipping part of the present invention;

[0033] Figure 9 Top cross-sectional view of an etching device for a circuit board according to the present invention;

[0034] Figure 10 Schematic diagram of the circuit board flipping path of the present invention.

[0035] In the figure: 1, base; 2, entrance and exit; 3, spraying part; 4, conveying component; 5, linkage component; 6, moving component; 7, flipping part; 8, fixing plate; 9, clamping part; 41, connecting block; 42, water leakage port; 43, conveying piece; 431, conical tooth one; 432, conical tooth two; 433, roller; 434, rotating shaft; 44, cleaning part; 441, baffle; 442, water absorption roller; 443, water drainage port; 51, circular tooth one; 52, circular tooth two; 53, convex block; 54, switching block; 55, spring one; 56, rotating rod; 61, runner; 62, belt; 63, moving block; 64, spring two; 65, limiting block; 71, cavity; 72, fixing rod; 73, connecting shaft; 74, gear three; 75, rack; 731, groove; 732, rotating rod; 733, sector gear; 734, tooth; 81, rounded corner; 91, spring three; 92, rotating shaft; 93, clamping rod; 10, pressing plate. Detailed implementation manners

[0036] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0037] Please refer to Figures 1 to 10 , the present invention provides an etching device for a circuit board, and the technical solution is as follows:

[0038] As an implementation manner of the present invention, refer to Figures 1 to 3, An etching device for a circuit board, comprising a base 1, an entrance and exit 2 opened on the base 1, a spraying member 3 arranged inside the base 1, a conveying assembly 4 arranged between the spraying members 3, a linkage assembly 5 arranged on the side wall of the base 1, the linkage assembly 5 is connected to the conveying assembly 4, a moving assembly 6 is arranged on the inner side wall of the base 1, the linkage assembly 5 drives the moving assembly 6 to move synchronously with the circuit board, a flipping member 7 is arranged on the moving assembly 6, a fixing plate 8 is arranged on the flipping member 7, and the fixing plate 8 can rotate 180° under the cooperation of the moving assembly 6 and the flipping member 7. A clamping member 9 is further arranged inside the fixing plate 8, and the clamping member 9 can temporarily fix the circuit board inside the fixing plate 8.

[0039] It can be seen that due to the action of gravity, the etching solution will flow downward rapidly after being sprayed onto the circuit board, which will lead to a shortening of the contact time between the etching solution and the circuit board. The reduction of the contact time will reduce the corrosion efficiency of the etching solution on the copper layer, thereby increasing the etching time of the circuit board. Moreover, for thick copper circuit boards, the thicker the copper layer, the longer the etching time, resulting in a larger amount of side etching. The device is provided with a flipping member 7. When the circuit board enters the base 1, it moves inside the base 1 through the conveying assembly 4. When it enters the base 1, the upper spraying member 3 sprays out the etching solution to etch the circuit board. After the etching solution has etched for a period of time and etched a part of the copper on the surface of the circuit board, the flipping member 7 flips the circuit board 180° so that the side of the circuit board to be etched faces downward. At this time, the spraying member 3 sprays the etching solution from bottom to top onto the circuit board to etch the remaining unetched copper surface of the circuit board; as can be seen from what is mentioned in the background art, as the etching depth increases, the etching area of the two side metal surfaces also increases. The part that first comes into contact with the etching solution has a longer contact time with the etching solution, and the etching depth towards both sides is also large. When the device sprays, the overall contact time between the front of the etching solution and the circuit board is reduced, and the etching depth is also reduced, thereby reducing side etching. And when the circuit board is flipped and the etching solution is etched from bottom to top, due to the reason of gravity, when the etching solution impacts the copper surface, the etching solution will quickly drop, reducing the residence time of the etching solution on the copper surface, thereby reducing the probability of side etching. And when the circuit board is about to be etched to completion, the circuit board is flipped, and the old etching solution will be removed during the flipping process. The etching solution etches the remaining uncompleted copper from bottom to top, which does not affect the etching efficiency of the circuit board and will also reduce side etching.

[0040] As an implementation manner of the present invention, referring to Figure 4 , the spraying member 3 is divided into two groups, and the two groups of spraying members 3 are respectively arranged staggered above and below the conveying assembly 4. The two groups of spraying members 3 are respectively fixedly connected to the inner top of the base 1 and the conveying assembly 4. The two groups of spraying members 3 provide two spraying methods. Initially, the etching solution etches the circuit board from top to bottom. When the etching is about to be completed, the other group of etching solution etches the circuit board from top to bottom.

[0041] As an implementation manner of the present invention, referring to Figure 1 , Figure 3 and Figure 9 , the conveying assembly 4 includes a connecting block 41, a water leakage port 42 and multiple groups of conveying members 43. The connecting block 41 is fixedly installed in the middle of the base 1, and the connecting block 41 penetrates through the inlet and outlet on the base 1. The water leakage port 42 is opened on the connecting block 41; the conveying member 43 includes a first tapered tooth 431, a second tapered tooth 432, multiple groups of rollers 433 and a rotating shaft 434. The rotating shaft 434 is rotatably connected in the connecting block 41. Multiple groups of rollers 433 are fixedly installed on the rotating shaft 434. The first tapered tooth 431 is fixedly installed at one end of the rotating shaft 434. The second tapered tooth 432 is rotatably connected to one side of the bevel gear, and the first tapered tooth 431 and the second tapered tooth 432 are meshed with each other; multiple groups of conveying members 43 are linearly arrayed in the connecting block 41, and no conveying member 43 is provided above the spraying member 3. No conveying member 43 is provided above the spraying member 3 to ensure that there is no obstruction when the spraying member 3 etches the circuit board from bottom to top. The conveying assembly 4 moves the circuit board from the inlet of the base 1 to the outlet of the base 1. Among them, the motor drives the rotating shaft 434 to rotate. When rotating, the first tapered tooth 431 drives multiple groups of second tapered teeth 432 to rotate simultaneously, and then drives the rest of the rotating shafts 434 to rotate synchronously. Thus, the multiple groups of rollers 433 rotate together to drive the circuit board to move, and the circuit board is divided into an etching part and a substrate B.

[0042] As an implementation manner of the present invention, referring to Figure 4 and Figure 5 , the conveying assembly 4 further includes a cleaning member 44. The cleaning member 44 includes a baffle 441, a water-absorbing roller 442 and a water drainage port 443. The water-absorbing roller 442 is fixedly connected to the rotating shaft 434, and the water-absorbing roller 442 is arranged near the outlet of the base 1. The baffle 441 is semi-circular. The baffle 441 is fixedly connected to the connecting block 41. The water-absorbing roller 442 is arranged in the baffle 441, and the water-absorbing roller 442 is attached to the edge of the baffle 441. The water drainage port 443 is opened at the bottom of the baffle 441. When the circuit board passes through the water-absorbing roller 442 after etching is completed, the water-absorbing roller 442 adsorbs the residual etching solution on the circuit board by rotating, effectively removing the etching solution on the surface of the circuit board and avoiding further etching of the circuit board by the etching solution after the circuit board is etched. Moreover, during the etching process, the etching solution reacts chemically with copper, and the generated copper salts and other by-products may form a colloidal substance on the copper surface. The water-absorbing roller 442 can also remove the colloidal crust on the board. After removal, the water-absorbing roller 442 can squeeze out the water and impurities on the water-absorbing roller 442 by rubbing against the baffle 441.

[0043] As an implementation manner of the present invention, referring to Figure 2, the linkage component 5 includes a first circular tooth 51, a second circular tooth 52, a convex block 53, a switching block 54, a first spring 55 and a rotating rod 56. The first circular tooth 51 is fixedly connected to the rotating shaft 434. The diameter of the first circular tooth 51 is smaller than that of the second circular tooth 52. The second circular tooth 52 is rotatably connected to the side wall of the base 1. The first circular tooth 51 and the second circular tooth 52 are meshed with each other. The switching block 54 is arranged on one side of the second circular tooth 52. The convex block 53 is arranged below the rotating rod 56. The rotating rod 56 is rotatably connected to the center of the second circular tooth 52. The first spring 55 is arranged between the rotating rod 56 and the second circular tooth 52. The linkage component 5 rotates synchronously with the transmission part. When the motor drives the rotating shaft 434 to rotate, the rotating shaft 434 drives the first circular tooth 51 to rotate, thereby driving the second circular tooth 52 to rotate. Then, during the rotation of the second circular tooth 52, the convex block 53 is driven to operate accordingly. After the first circular tooth 51 rotates several circles, due to the position of the convex block 53, it takes one rotation of the second circular tooth 52 to reach above the rotating rod 56. Then, when it continues to rotate, the convex block 53 drives the rotating rod 56 and the second circular tooth 52 to rotate synchronously. When the convex block 53 drives the rotating rod 56 to rotate to the switching block 54, the switching block 54 will squeeze the rotating rod 56. Under the action of the first spring 55, the rotating rod 56 will move outwards, and the convex block 53 is disconnected from the rotating rod 56. Then, the convex block 53 will pass through the inside of the rotating rod 56, and the rotating rod 56 is released from the limit.

[0044] As an implementation manner of the present invention, refer to Figure 4 and Figure 7 , the moving component 6 includes a runner 61, a belt 62, a moving block 63, a second spring 64 and a limiting block 65. The runner 61 is rotatably connected to the inner side wall of the base 1, and the runner 61 is connected to the rotating rod 56. The belt 62 is fixedly connected to the runner 61. The moving block 63 is fixedly connected to the end of the belt 62. The limiting block 65 is fixedly installed on the inner side wall of the base 1, and the moving block 63 is slidably connected in the limiting block 65. The second spring 64 is arranged between the limiting block 65 and the moving block 63. When the rotating rod 56 rotates, it drives the runner 61 to rotate simultaneously. When the runner 61 rotates, the belt 62 is wound around the runner 61. When winding, the moving block 63 will move on the limiting block 65, and the second spring 64 will be gradually compressed. When the convex block 53 passes through the inside of the rotating rod 56 and the rotating rod 56 is released from the limit, due to the elastic potential energy, the second spring 64 will make the moving block 63 return to its original position. The second circular tooth 52 drives the convex block 53 to continue to rotate, driving the rotating rod 56 to continue to rotate.

[0045] As an implementation manner of the present invention, refer to Figure 3, the flipping member 7 includes a cavity 71, a fixing rod 72, a connecting shaft 73, a third gear 74, and a rack 75. The cavity 71 is formed in the base 1. The fixing rod 72 is slidably connected in the cavity 71. The connecting shaft 73 is movably connected to one side of the fixing rod 72. The third gear 74 is fixedly connected to the connecting shaft 73. The rack 75 is fixedly connected to the base 1, and the third gear 74 meshes with the rack 75. The length of the rack 75 is half of the circumference of the third gear 74. The flipping member 7 drives the circuit board to flip. When the flipping member 7 drives the circuit board to flip, the etching solution is still under continuous high-pressure spraying. The flipping member 7 can avoid the impact of the etching solution on the circuit board during flipping. When the belt 62 drives the fixing rod 72 and the connecting shaft 73 to move in the cavity 71, when the third gear 74 on the connecting shaft 73 passes by the rack 75, the third gear 74 rotates 180°, so that the fixing plate 8 on the connecting shaft 73 flips 180°.

[0046] As an embodiment of the present invention, referring to Figure 3 and Figure 8 , a groove 731 is further formed in the connecting shaft 73. A rotating rod 732 is arranged in the groove 731. The rotating rod 732 is rotatably connected to the third gear 74. A sector gear 733 is arranged on the rotating rod 732. A tooth 734 meshes with the sector gear 733. The tooth 734 is fixedly connected to the base 1. When the connecting shaft 73 translates, the sector gear 733 on the rotating rod 732 will pass by the tooth 734, and at this time the rotating rod 732 rotates.

[0047] As an embodiment of the present invention, referring to Figure 3 , the fixing plate 8 is fixedly connected to one end of the connecting shaft 73. The upper end of the fixing plate 8 is shorter than the lower part of the fixing plate 8. A rounded corner 81 is arranged on one side of the fixing plate 8. The arrangement of the fixing plate 8 can make the circuit board more stable during flipping. When the fixing plate 8 flips 180°, at this time the longer end of the fixing plate 8 is at the lower part, and the rounded corner 81 facilitates the circuit board to enter the fixing plate 8.

[0048] As an embodiment of the present invention, referring to Figure 6 , the clamping member 9 includes a third spring 91, a rotating shaft 92, and a clamping rod 93. The third spring 91 is fixedly connected in the fixing plate 8. The clamping rod 93 is fixedly connected to the third spring 91. The clamping rod 93 is rotatably connected in the fixing plate 8 through the rotating shaft 92, and the rotating shaft 92 is concentric with the rotating rod 732. The clamping member 9 can automatically clamp the circuit board and release the limit on the circuit board. When the third gear 74 rotates, it drives the rotating shaft 92 to rotate synchronously.

[0049] As an embodiment of the present invention, referring to Figure 3 and 4, an extrusion plate 10 is also fixedly connected inside the cavity 71. The extrusion plate 10 is located on one side of the baffle 441. The extrusion plate 10 releases the limitation of the clamping block on the circuit board, facilitating the circuit board to move out of the base 1.

[0050] Working principle: In order to avoid the etching solution accumulating on the circuit board to a certain extent, which will exacerbate the diffusion of the etching solution to both sides of the circuit while ensuring the etching efficiency of the circuit board, the device drives the conveying component 4 to convey the circuit board in the base 1 through a motor. Initially, the spraying part 3 sprays the circuit board from above. When the circuit board is etched to a certain extent, the circuit board will reach the position of the fixing plate 8. The rotation of the rotating rod 56 drives the translation of the moving block 63, causing the gear three 74 on the moving block 63 to pass through the rack 75, driving the fixing plate 8 on it to flip. Before flipping, the clamping rod 93 in the fixing plate 8 will also fix the circuit board in the fixing plate 8 to prevent the circuit board on it from slipping when the fixing plate 8 flips. After flipping, the spraying part 3 sprays the circuit board from bottom to top until the fixing plate 8 moves to the position of the extrusion plate 10 to release the limitation of the circuit board, enabling the circuit board to move out of the base 1 through the friction of the water-absorbing roller 442. Subsequently, the fixing plate 8 will reset to flip the next incoming circuit board.

[0051] Initial etching of the circuit board: When etching the circuit board, first start the etching equipment. The operator places the circuit board on the roller 433 directly below the entrance of the base 1, and the motor drives the roller 433 to rotate to drive the circuit board to move forward. At this time, the spraying part 3 located above the circuit board sprays the etching solution to conduct preliminary etching on the circuit board;

[0052] The circuit board is fixed in the fixing plate 8 (refer to Figure 10Parts C and D): While the roller 433 rotates, the rotating shaft 434 drives the first circular gear 51 to rotate. After the first circular gear 51 rotates, it drives the second circular gear 52 to rotate. The circumference of the second circular gear 52 is equal to the length from the entrance to above the fixed plate 8. Also, since the initial position of the convex block 53 is below the rotating rod 56, when the first circular gear 51 rotates several circles and drives the second circular gear 52 to rotate one circle, the convex block 53 can be rotated above the rotating rod 56. When the convex block 53 rotates from below the rotating rod 56 to above it, the circuit board has been moved to the position between the fixed plates 8 through the transmission of the roller 433, and the substrate B of the circuit board is located within the fixed plate 8. At the same time, the roller 433 continues to rotate. At this time, the convex block 53 drives the rotating rod 56 to rotate synchronously with the second circular gear 52. The runner 61 on the rotating rod 56 rotates synchronously with the roller 433 at this time, causing the belt 62 to wind around the runner 61. During the winding process, the belt 62 drives the moving block 63 to move horizontally at the bottom of the limiting block 65, so the moving block 63 moves synchronously with the circuit board. Driven by the moving block 63, the connecting shaft 73 moves accordingly. And during the moving process, the rotating rod 732 in the connecting shaft 73 will pass through the tooth teeth 734. Then, the sector gear 733 on the rotating rod 732 meshes with the tooth teeth 734 to generate rotation. Also, since the rotating shaft 92 on the clamping rod 93 is at the center of the circle of the rotating rod 732, the rotating rod 732 drives the clamping rod 93 to deflect clockwise to fix the circuit board within the fixed plate 8, and a magnetic force is generated at the bottom of the fixed plate 8 to fix the angle of the clamping rod 93.

[0053] Circuit board flipping: (Refer to Figure 10 Parts E and F) After the circuit board is fixed within the fixed plate 8, the moving block 63 continues to move. During the moving process, the third gear 74 on the connecting shaft 73 will pass through the rack 75. The length of the rack 75 is half of the circumference of the third gear 74. The third gear 74 rotates 180°, so that the fixed plate 8 on the connecting shaft 73 drives the circuit board to flip 180°. And during the flipping process, the fixed plate 8 flips and moves at the same time, and the spraying part 3 above is still continuously spraying. When spraying, in order to avoid the pressure of the etching solution on the circuit board, the flipping is carried out at the substrate B of the circuit board, which also avoids the shielding of the fixed plate 8 during the etching of the circuit board. After the circuit board flips, the spraying liquid below starts to spray on the circuit board. At this time, most of the etching of the circuit board has been completed. The spraying part 3 sprays the etching solution from bottom to top on the circuit board, so as to etch the remaining unetched copper surface of the circuit board.

[0054] The circuit board detaches from the fixing plate 8: After the spraying member 3 etches the unetched copper surface of the circuit board from bottom to top with the etching solution and before reaching the water absorption roller 442, the pressing plate 10 presses the end of the clamping rod 93, causing the clamping rod 93 to move out of the magnetic force range on the fixing plate 8. As a result, the angle of the clamping rod 93 is restored, and the limitation of the circuit board is released, enabling the circuit board to automatically move out of the base 1 under the friction of the water absorption roller 442. In addition, when the circuit board passes through the water absorption roller 442 after etching is completed, the water absorption roller 442 rotates to adsorb the residual etching solution on the circuit board, effectively removing the etching solution on the surface of the circuit board and preventing the etching solution from further etching the circuit board after the etching is completed. During the etching process, a chemical reaction occurs between the etching solution and copper, and the generated copper salts and other by-products may form a colloidal substance on the copper surface. The water absorption roller 442 can also remove the colloidal crust on the board. After removal, the water absorption roller 442 can squeeze out the water and impurities on the water absorption roller 442 by rubbing against the baffle 441.

[0055] The fixing plate 8 returns to its original position: When the limitation of the circuit board is released, at this time, the convex block 53 drives the rotating rod 56 to rotate to the switching block 54. The switching block 54 presses the rotating rod 56. Under the action of the first spring 55, the rotating rod 56 will protrude outwards, and the convex block 53 is disconnected from the rotating rod 56. The convex block 53 passes through the inside of the rotating rod 56, and the rotating rod 56 is released from the limitation. Under the elastic potential energy of the second spring 64, the rotating wheel 61 rotates in the reverse direction, causing the moving block 63 and the rotating rod 56 to return to their original positions, thereby driving the fixing plate 8 on the moving block 63 to return to its original position. The second circular tooth 52 will also drive the convex block 53 to continue rotating. After the convex block 53 is about to reach below the rotating rod 56 again, it continues to drive the rotating rod 56 to rotate, preparing to flip the next incoming circuit board.

[0056] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board etching device, comprising a base (1), an inlet and outlet (2) provided on the base (1), two groups of spraying parts (3) arranged in the base (1), the two groups of spraying parts (3) being divided into two upper and lower groups, and a conveying assembly (4) arranged between the two groups of spraying parts (3), characterized in that: A linkage component (5) is arranged on the side wall of the base (1), and the linkage component (5) is connected to the transmission component (4). A moving component (6) is arranged on the inner side wall of the base (1), and the linkage component (5) drives the moving component (6) to move synchronously with the circuit board. A flipping member (7) is arranged on the moving component (6), and the flipping member (7) can flip 180 degrees under the movement of the moving component (6). A fixing plate (8) is arranged on the flipping member (7), and the fixing plate (8) can switch between the upper spraying member (3) area and the lower spraying member (3) area under the cooperation of the flipping member (7). When switching, the fixing plate (8) can flip 180 degrees around its axis. The fixing plate (8) moves back and forth between the upper spraying member (3) area and the lower spraying member (3) area. A clamping member (9) is also arranged in the fixing plate (8), and the clamping member (9) can fix the circuit board in the fixing plate (8).

2. The circuit board etching device according to claim 1, characterized in that: The two groups of spraying components (3) are arranged alternately above and below the conveying component (4), and the two groups of spraying components (3) are respectively fixedly connected to the inner top of the base (1) and the conveying component (4).

3. The etching device for a circuit board according to claim 2, characterized in that: The transmission component (4) comprises a connection block (41), a water leakage port (42) and a plurality of transmission members (43); the connection block (41) is fixedly mounted in the middle of the base (1), and the connection block (41) passes through an inlet and an outlet on the base (1); the water leakage port (42) is provided on the connection block (41); the transmission member (43) comprises a conical tooth 1 (431), a conical tooth 2 (432), a plurality of rollers (433) and a rotating shaft (434); the rotating shaft (434) is rotatably connected in the connecting block (41), the roller (433) is fixedly mounted on the rotating shaft (434), the conical tooth 1 (431) is fixedly mounted on one end of the rotating shaft (434), the conical tooth 2 (432) is rotatably connected to one side of the bevel gear, and the conical tooth 1 (431) and the conical tooth 2 (432) are meshed with each other; a plurality of groups of the transmission members (43) are linearly arrayed in the connecting block (41), and no transmission member (43) is arranged above the spray member (3).

4. The etching device for a circuit board according to claim 3, characterized in that: The conveying assembly (4) further comprises a cleaning member (44), the cleaning member (44) comprising a baffle (441), a water suction roller (442) and a drainage port (443), the water suction roller (442) being fixedly connected to the rotating shaft (434), and the water suction roller (442) being arranged at an outlet close to the base (1), the baffle (441) being semicircular, the baffle (441) being fixedly connected to the connecting block (41), the water suction roller (442) being arranged inside the baffle (441), and the water suction roller (442) being in contact with an edge of the baffle (441), and the drainage port (443) being opened at the bottom of the baffle (441).

5. The circuit board etching device according to claim 4, characterized in that: The linkage assembly (5) comprises a first round tooth (51), a second round tooth (52), a protrusion (53), a switching block (54), a first spring (55) and a rotating rod (56); the first round tooth (51) is fixedly connected to the rotating shaft (434); the diameter of the first round tooth (51) is smaller than the diameter of the second round tooth (52); the second round tooth (52) is rotatably connected to the side wall of the base (1); the first round tooth (51) and the second round tooth (52) are meshed with each other; the switching block (54) is arranged on one side of the second round tooth (52); the protrusion (53) is arranged below the rotating rod (56); the rotating rod (56) is rotatably connected to the center of the second round tooth (52); and the first spring (55) is arranged between the rotating rod (56) and the second round tooth (52).

6. A circuit board etching device according to claim 4 or 5, characterized in that: The moving assembly (6) comprises a rotating wheel (61), a belt (62), a moving block (63), a second spring (64) and a limit block (65); the rotating wheel (61) is rotatably connected to the inner side wall of the base (1), and the rotating wheel (61) is connected to the rotating rod (56); the belt (62) is fixedly connected to the rotating wheel (61); the moving block (63) is fixedly connected to the end of the belt (62); the limit block (65) is fixedly installed on the inner side wall of the base (1), and the moving block (63) is slidably connected in the limit block (65); and the second spring (64) is arranged between the limit block (65) and the moving block (63).

7. The circuit board etching device according to claim 6, characterized in that: The flip member (7) comprises a cavity (71), a fixing rod (72), a connecting shaft (73), a gear three (74) and a rack (75); the cavity (71) is opened on the base (1); the fixing rod (72) is slidably connected in the cavity (71); the connecting shaft (73) is movably connected to one side of the fixing rod (72); the gear three (74) is fixedly connected to the connecting shaft (73); the rack (75) is fixedly connected to the base (1); the gear three (74) and the rack (75) are meshed with each other; the length of the rack (75) is half the circumference of the gear three (74); and the gear three (74) and the rack (75) have the same tooth diameter.

8. The circuit board etching device according to claim 7, characterized in that: The connecting shaft (73) is further provided with a groove (731), the groove (731) is provided with a rotating rod (732), the rotating rod (732) is rotatably connected to the gear three (74), the rotating rod (732) is provided with sector teeth (733), the sector teeth (733) are meshed with teeth (734), and the teeth (734) are fixedly connected to the base (1).

9. The etching device for a circuit board according to claim 8, characterized in that: The fixing plate (8) is fixedly connected to one end of the connecting shaft (73), the width of the upper end of the fixing plate (8) is shorter than the width of the lower end of the fixing plate (8), and a rounded corner (81) is provided on one side of the fixing plate (8).

10. The circuit board etching device according to claim 9, characterized in that: The clamping member (9) comprises a spring three (91), a rotating shaft (92) and a clamping rod (93); the spring three (91) is fixedly connected in the fixed plate (8); the clamping rod (93) is fixedly connected to the spring three (91); the clamping rod (93) is rotatably connected in the fixed plate (8) via the rotating shaft (92); the rotating shaft (92) is concentric with the rotating rod (732); an extrusion plate (10) is also fixedly connected in the cavity (71); the extrusion plate (10) is located on one side of the baffle (441).

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