Printing ink flattening device for printed circuit board

Abstract

The invention relates to the technical field of circuit board processing, in particular to a printed circuit board ink flattening device which comprises a processing table and a flattening roller and further comprises a sealing bin arranged on the processing table. The placing plate is arranged in the sealing bin in a sliding manner, and the placing plate is used for placing a circuit board; the fixing assembly is arranged on the machining table, the fixing assembly is used for fixing the circuit board placed on the placing plate, and when the printing ink flattening device for the printed circuit board is used, the design of automatically adjusting the flattening strength enables the flattening device to adapt to circuit boards with different thicknesses; each circuit board can be properly flattened, the problems of poor flattening effect or circuit board damage and the like caused by too large or too small flattening force can be avoided by accurately controlling the flattening force, and ink on the surface of the flattened circuit board is ensured to be uniform and flat.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and particularly to a printed circuit board ink flattening device. Background Art

[0002] Printed circuit board ink flattening is a key process in electronic product manufacturing, aiming to ensure that the ink on the circuit board can be evenly and smoothly covered to improve the aesthetics and electrical performance of the circuit board. This process uses a specific flattening device to flatten the ink coated on the surface of the circuit board. During the flattening process, the circuit board is first cleaned and pre-treated to ensure that the ink can adhere smoothly. Subsequently, the ink is evenly coated on the circuit board to form the required circuit pattern. Then, the flattening device simultaneously flattens the ink on the upper and lower surfaces of the circuit board by adjusting the pressure and position of the flattening component to reduce phenomena such as ink protrusions and unevenness. For circuit boards with different thicknesses, the adjustment of the flattening pressure is crucial. Thinner circuit boards may be damaged due to excessive pressure, resulting in a decline in the performance and reliability of the circuit board; while for thicker circuit boards, if the pressure is insufficient, the ink may not be completely flattened, leaving protrusions or unevenness, which will also affect the quality and performance of the circuit board. Therefore, when operating the flattening operation, the operator needs to accurately adjust the flattening pressure according to the actual thickness of the circuit board, which requires a lot of time and effort for the staff to make careful adjustments, not only increasing the complexity of the operation, but also leading to a decline in production efficiency and an increase in costs. For this reason, we propose a printed circuit board ink flattening device. Summary of the Invention

[0003] One technical problem to be solved by this application is that when the operator performs the flattening operation, it is necessary to accurately adjust the flattening pressure according to the actual thickness of the circuit board, which requires a lot of time and effort for the staff to make careful adjustments, not only increasing the complexity of the operation, but also leading to a decline in production efficiency and an increase in costs.

[0004] To solve the above technical problem, the embodiment of this application provides a printed circuit board ink flattening device, including a processing table and a flattening roller, and further including a sealed chamber, the sealed chamber is arranged on the processing table; a placement plate, the placement plate is slidably arranged in the sealed chamber, and the circuit board is placed by using the placement plate; a fixing component, the fixing component is arranged on the processing table, and the circuit board placed on the placement plate is fixed by using the fixing component; a driving unit, the driving unit is arranged in the sealed chamber, and the placement plate is driven by the driving unit to move up and down in the sealed chamber, changing the distance between the placement plate and the flattening roller, and further changing the extrusion pressure between the two.

[0005] In some embodiments, the fixing component includes a placing member disposed on the placing board, and the placing member is used to carry the circuit board. An adsorbing member is disposed on the placing member, and the circuit board on the placing board is adsorbed and fixed by the adsorbing member. An opening and closing member is disposed on the adsorbing member, and the opening and closing member is used to control the opening and closing of the adsorbing member. An exhaust member is disposed on the sealed chamber, and the exhaust member is used to discharge the gas in the sealed chamber.

[0006] In some embodiments, the placing member includes an installation groove disposed on the processing table, and the installation groove is connected to the sealed chamber. A plurality of power chambers are disposed in the sealed chamber. A plurality of connecting rods are slidably disposed on the power chamber. A first telescopic rod is disposed on the connecting rod, and one end of the first telescopic rod is connected to the placing board. A compression spring is sleeved on the first telescopic rod.

[0007] In some embodiments, the adsorbing member includes a plurality of air holes opened on the placing board, and the air holes are communicated with the sealed chamber. A fixing plate is disposed in the air hole. An extending rod is rotatably disposed on the fixing plate. A first sealing plate is disposed at one end of the extending rod, and the first sealing plate is attached to the placing board. A second sealing plate used in cooperation with the first sealing plate is disposed on the fixing plate, and the second sealing plate is rotatably connected to the extending rod. Through holes are opened on both the first sealing plate and the second sealing plate.

[0008] In some embodiments, the opening and closing member includes a positioning plate disposed in the air hole. A connecting groove is opened on the extending rod. A sliding rod is slidably disposed in the connecting groove, and the sliding rod penetrates through the first positioning plate. A first limiting plate is disposed on the sliding rod. A second limiting plate is disposed on the extending rod. A buffer spring is sleeved on the sliding rod between the first limiting plate and the second limiting plate. A bearing plate is disposed on the sliding rod, and the bearing plate is higher than the placing board in the horizontal direction. A spiral groove is opened on the sliding rod. A pushing rod used in cooperation with the spiral groove is disposed in the connecting groove, and the pushing rod is slidably connected to the spiral groove.

[0009] In some embodiments, the exhaust member includes an exhaust pipe disposed on the sealed chamber. One end of the exhaust pipe is communicated with the installation groove. A first installation plate is disposed in the exhaust pipe. A moving rod is slidably disposed on the first installation plate. A closing plate is disposed at one end of the moving rod located in the installation pipe. A second installation plate is disposed in the exhaust pipe, and the closing plate is attached to the second installation plate. A closing spring is sleeved on the moving rod between the closing plate and the first installation plate. A linkage rod is disposed at one end of the moving rod away from the closing plate. A sliding groove is opened in the installation groove, and the linkage rod is slidably connected to the sliding groove.

[0010] In some embodiments, the driving unit includes a rotating member disposed in the sealed chamber, and the rotating member is used to drive the placing board to lift. A power member is disposed in the sealed chamber, and the power member is used to provide power for the operation of the rotating member.

[0011] In some embodiments, the rotating member includes a vertical plate disposed in the power bin. A rotating shaft is rotatably disposed on the vertical plate. A plurality of rotating lead screws are rotatably disposed in the power bin. The rotating lead screws are threadedly connected to the connecting rod. A worm gear is disposed on the rotating lead screw. Worm gears engaging with the worm gear are disposed at both ends of the rotating shaft.

[0012] In some embodiments, the power member includes a power gear disposed on the rotating shaft. A plurality of power racks engaging with the power gear are slidably disposed in the sealing bin. A plurality of clamping plates are disposed in the sealing bin. A second expansion rod is disposed on the clamping plate. One end of the second expansion rod is connected to the power rack. A return spring is sleeved on the second expansion rod. A triangular plate is disposed at one end of the power rack away from the second expansion rod. An installation frame is disposed on the placement plate. An extrusion rod is disposed on the installation frame. An extrusion plate for cooperating with the triangular plate is disposed at one end of the extrusion rod.

[0013] In some embodiments, the bearing plate is made of rubber.

[0014] The present invention has at least the following beneficial effects:

[0015] 1. Improve the flattening accuracy: The design of automatically adjusting the flattening force enables the flattening device to adapt to circuit boards of different thicknesses, ensuring that each circuit board can be properly flattened. By precisely controlling the flattening force, problems such as poor flattening effect or circuit board damage caused by excessive or insufficient force can be avoided, ensuring that the ink on the surface of the flattened circuit board is uniform and flat.

[0016] 2. Improve production efficiency: The design of automatically adjusting the flattening force reduces the steps of manually adjusting the flattening force, reduces the complexity and labor intensity of manual operation. Since the manual adjustment time is reduced, the entire flattening process can be carried out more quickly and efficiently, thereby improving production efficiency.

[0017] 3. Ensure product quality: Automatically adjusting the flattening force can prevent quality problems such as deformation and cracking of the circuit board caused by excessive flattening force. Precise control of the flattening force can ensure the uniform distribution of the ink on the surface of the circuit board, improving the aesthetics and reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 It is of the present invention Figure 1 Explosion structure schematic diagram;

[0020] Figure 3 It is of the present invention Figure 1 Schematic diagram of the structure with the flattening roller removed;

[0021] Figure 4 Schematic diagram of the explosion structure of the sealed bin of the present invention;

[0022] Figure 5 Schematic diagram of the structure of the driving unit of the present invention;

[0023] Figure 6 For the present invention Figure 5 Schematic diagram of the enlarged structure of area A in;

[0024] Figure 7 Schematic diagram of the explosion structure of the exhaust part of the present invention;

[0025] Figure 8 Schematic diagram of the structure of the opening and closing part of the present invention;

[0026] Figure 9 For the present invention Figure 8 Schematic diagram of the explosion structure;

[0027] Figure 10 Schematic diagram of the structure of the second embodiment of the present invention.

[0028] In the figure: 1, processing table; 2, flattening roller; 3, placing plate; 4, fixing component; 5, placing part; 51, installation groove; 52, sealed bin; 53, power bin; 54, connecting rod; 55, first telescopic rod; 56, extrusion spring; 6, adsorbing part; 61, air hole; 62, fixing plate; 63, extension rod; 64, first sealing plate; 65, second sealing plate; 66, through hole; 7, opening and closing part; 71, positioning plate; 72, connecting groove; 73, sliding rod; 74, first limiting plate; 75, second limiting plate; 76, buffer spring; 77, bearing plate; 78, spiral groove; 79, pushing rod; 8, exhaust part; 81, exhaust pipe; 82, first mounting plate; 83, moving rod; 84, closing plate; 85, second mounting plate; 86, closing spring; 87, connecting rod; 88, sliding groove; 9, driving unit; 10, rotating part; 101, vertical plate; 102, rotating shaft; 103, rotating lead screw; 104, worm gear; 105, worm; 11, power part; 111, power gear; 112, power rack; 113, clamping plate; 114, second telescopic rod; 115, reset spring; 116, triangular plate; 117, mounting frame; 118, extrusion rod; 119, extrusion plate. Detailed implementation manners

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0030] Example 1: Please refer to Figures 1-9 , the present invention provides a technical solution: a printed circuit board ink flattening device, including a processing table 1 and a flattening roller 2, and further including a sealed chamber 52, the sealed chamber 52 is arranged on the processing table 1; a placement plate 3, the placement plate 3 is slidably arranged in the sealed chamber 52, and the circuit board is placed by using the placement plate 3; a fixing component 4, the fixing component 4 is arranged on the processing table 1, and the circuit board placed on the placement plate 3 is fixed by using the fixing component 4.

[0031] A driving unit 9, the driving unit 9 is arranged in the sealed chamber 52, and the placement plate 3 is driven by the driving unit 9 to move up and down in the sealed chamber 52, changing the distance between the placement plate 3 and the flattening roller 2, and further changing the extrusion pressure between the two.

[0032] The advantage of setting the driving unit 9 is that when flattening the ink of the printed circuit board, the flattening force of the flattening roller 2 can be automatically adjusted according to the thickness of the circuit board. The design of automatically adjusting the flattening force enables the flattening device to adapt to circuit boards of different thicknesses, ensuring that each circuit board can be properly flattened. By precisely controlling the flattening force, problems such as poor flattening effect or circuit board damage caused by too large or too small force can be avoided, ensuring that the ink on the surface of the flattened circuit board is uniform and flat. At the same time, the design of automatically adjusting the flattening force reduces the steps of manually adjusting the flattening force, reducing the complexity and labor intensity of manual operation. Since the manual adjustment time is reduced, the entire flattening process can be carried out more quickly and efficiently, thereby improving production efficiency. Moreover, automatically adjusting the flattening force can prevent quality problems such as deformation and cracking of the circuit board caused by too large flattening force, and precise control of the flattening force can ensure the uniform distribution of the ink on the surface of the circuit board, improving the aesthetics and reliability of the product.

[0033] The fixing component 4 includes a placement member 5 arranged on the placement plate 3, the circuit board is carried by using the placement member 5, an adsorbing member 6 is arranged on the placement member 5, the circuit board on the placement plate 3 is adsorbed and fixed by using the adsorbing member 6, an opening and closing member 7 is arranged on the adsorbing member 6, the opening and closing of the adsorbing member 6 is controlled by using the opening and closing member 7, and an exhaust member 8 is arranged on the sealed chamber 52, and the gas in the sealed chamber 52 is discharged by using the exhaust member 8.

[0034] The advantage of the fixed component 4 is that when flattening the ink on the printed circuit board, negative pressure adsorption is used to fix the circuit board instead of the conventional clamping method. The negative pressure adsorption fixing method can quickly fix the circuit board on the workbench without the need for additional clamping or fixing devices, thus saving operation time. At the same time, the negative pressure adsorption fixing method will not cause any physical damage to the circuit board, such as scratches, indentations, etc. Compared with the traditional clamping method, negative pressure adsorption is gentler and safer, which can ensure the integrity of the circuit board during the flattening process. Moreover, the negative pressure adsorption fixing method is applicable to circuit boards of different sizes and shapes, with high flexibility. This fixing method can adapt to various complex circuit board shapes to ensure uniform treatment during the flattening process.

[0035] The placing member 5 includes a mounting groove 51 provided on the processing table 1. The mounting groove 51 is connected to a sealing chamber 52. A plurality of power chambers 53 are provided in the sealing chamber 52. A plurality of connecting rods 54 are slidably provided on the power chamber 53. A first telescopic rod 55 is provided on the connecting rod 54. One end of the first telescopic rod 55 is connected to the placing plate 3. A compression spring 56 is sleeved on the first telescopic rod 55.

[0036] The suction member 6 includes a plurality of air holes 61 opened on the placing plate 3. The air holes 61 communicate with the sealing chamber 52. A fixing plate 62 is provided in the air holes 61. An extension rod 63 is rotatably provided on the fixing plate 62. One end of the extension rod 63 is provided with a first sealing plate 64. The first sealing plate 64 fits with the placing plate 3. A second sealing plate 65 used in cooperation with the first sealing plate 64 is provided on the fixing plate 62. The second sealing plate 65 is rotatably connected to the extension rod 63. Through holes 66 are opened on both the first sealing plate 64 and the second sealing plate 65.

[0037] The advantage of the suction member 6 is that the negative pressure adsorption fixing method will not cause any physical damage to the circuit board, such as scratches, indentations, etc. Compared with the traditional clamping method, negative pressure adsorption is gentler and safer, which can ensure the integrity of the circuit board during the flattening process.

[0038] The opening and closing member 7 includes a positioning plate 71 provided in the air hole 61. A connecting groove 72 is opened on the extension rod 63. A sliding rod 73 is slidably provided in the connecting groove 72. The sliding rod 73 penetrates through the positioning plate 71. A first limiting plate 74 is provided on the sliding rod 73. A second limiting plate 75 is provided on the extension rod 63. A buffer spring 76 is sleeved on the sliding rod 73 between the first limiting plate 74 and the second limiting plate 75. A bearing plate 77 is provided on the sliding rod 73, and the bearing plate 77 is higher than the placing plate 3 in the horizontal direction. A spiral groove 78 is opened on the sliding rod 73. A pushing rod 79 used in cooperation with the spiral groove 78 is provided in the connecting groove 72. The pushing rod 79 is slidably connected to the spiral groove 78.

[0039] The exhaust component 8 includes an exhaust pipe 81 provided on the sealing chamber 52. One end of the exhaust pipe 81 communicates with the installation groove 51. An installation plate 82 is provided inside the exhaust pipe 81. A moving rod 83 is slidably provided on the installation plate 82. A closing plate 84 is provided at one end of the moving rod 83 located inside the installation pipe. An installation plate 85 is provided inside the exhaust pipe 81. The closing plate 84 is in contact with the installation plate 85. A closing spring 86 is sleeved between the closing plate 84 and the installation plate 82 on the moving rod 83. A linkage rod 87 is provided at one end of the moving rod 83 away from the closing plate 84. A sliding groove 88 is provided in the installation groove 51. The linkage rod 87 is slidably connected with the sliding groove 88.

[0040] When the flattening roller 2 contacts the circuit board and exerts extrusion on the circuit board, the circuit board descends and drives the placement plate 3 to descend synchronously, squeezing the gas in the sealing chamber 52. When the circuit board descends, it first squeezes the bearing plate 77, driving the sliding rod 73 to descend against the elastic force of the buffer spring 76. When the sliding rod 73 descends, the spiral groove 78 provided thereon descends synchronously, thereby driving the push rod 79 slidably connected with the spiral groove 78 to rotate. The rotation of the push rod 79 drives the extension rod 63 to rotate. The rotation of the extension rod 63 drives the sealing plate 64 to rotate so that the through hole 66 provided on the sealing plate 64 communicates with the through hole 66 on the sealing plate 65; at the same time, after a high pressure is formed in the sealing chamber 52, the gas pushes the closing plate 84 to separate from the installation plate 85, so that the gas is discharged, and the circuit board is fixed on the placement plate 3 under the adsorption of the air holes 61.

[0041] The driving unit 9 includes a rotating member 10 provided in the sealing chamber 52. The rotating member 10 is used to drive the placement plate 3 to lift and lower. A power member 11 is provided in the sealing chamber 52. The power member 11 is used to provide power for the operation of the rotating member 10.

[0042] The rotating member 10 includes a vertical plate 101 provided in the power chamber 53. A rotating shaft 102 is rotatably provided on the vertical plate 101. A plurality of rotating lead screws 103 are rotatably provided in the power chamber 53. The rotating lead screws 103 are threadedly connected with the connecting rod 54. A worm gear 104 is provided on the rotating lead screw 103. Worm gears 105 engaged with the worm gear 104 are provided at both ends of the rotating shaft 102.

[0043] The advantage of the rotating member 10 is that it can automatically adjust the flattening force of the flattening roller 2 according to the thickness of the circuit board. The design of automatically adjusting the flattening force enables the flattening device to adapt to circuit boards of different thicknesses, ensuring that each circuit board can be properly flattened. By precisely controlling the flattening force, problems such as poor flattening effect or circuit board damage caused by excessive or insufficient force can be avoided.

[0044] The power component 11 includes a power gear 111 disposed on the rotating shaft 102. A plurality of power racks 112 engaged with the power gear 111 are slidably disposed in the sealed chamber 52. A plurality of clamping plates 113 are disposed in the sealed chamber 52. A second telescopic rod 114 is disposed on the clamping plate 113. One end of the second telescopic rod 114 is connected to the power rack 112. A return spring 115 is sleeved on the second telescopic rod 114. A triangular plate 116 is disposed at one end of the power rack 112 away from the second telescopic rod 114. An installation frame 117 is disposed on the placement plate 3. An extrusion rod 118 is disposed on the installation frame 117. An extrusion plate 119 for cooperating with the triangular plate 116 is disposed at one end of the extrusion rod 118.

[0045] While the placement plate 3 descends, it will synchronously drive the extrusion rod 118 and the extrusion plate 119 located on the extrusion rod 118 to descend. The descent of the extrusion plate 119 thus pushes the triangular plate 116 and the power rack 112 connected to the triangular plate 116 to move. While the power rack 112 moves, it pushes the power gear 111 engaged with it to rotate. The rotation of the power gear 111 drives the rotating shaft 102 connected to it to rotate. While the rotating shaft 102 rotates, it drives the worm gears 105 disposed on both sides of it to rotate. The rotation of the worm gears 105 drives the worm wheels 104 to rotate. The rotation of the worm wheels 104 drives the rotating lead screw 103 to rotate. The rotation of the rotating lead screw 103 drives the connecting rod 54 threadedly connected to it to rotate. The rotation of the linkage rod 87 drives the first telescopic rod 55 to rise. The rise of the first telescopic rod 55 causes the compression spring 56 to be compressed, thereby making the driving force received by the placement plate 3 stronger and generating a greater pressure between it and the flattening roller 2. When the flattening roller 2 resets, it will drive the push rod 79 to drive the closing plate 84 to contact and seal the sealed chamber 52, enabling the gas to be discharged. At this time, the power rack 112 will reset under the elastic force of the return spring 115.

[0046] During use, when the flattening roller 2 contacts the circuit board and exerts extrusion on the circuit board, the circuit board descends and drives the placement plate 3 to descend synchronously, squeezing the gas in the sealed chamber 52. When the circuit board descends, it first squeezes the bearing plate 77, driving the sliding rod 73 to descend against the elastic force of the buffer spring 76. When the sliding rod 73 descends, the spiral groove 78 formed on it descends synchronously, thereby driving the push rod 79 slidably connected to the spiral groove 78 to rotate. The rotation of the push rod 79 drives the extension rod 63 to rotate. The rotation of the extension rod 63 drives the first sealing plate 64 to rotate, causing the through hole 66 formed on the first sealing plate 64 to communicate with the through hole 66 on the second sealing plate 65; at the same time, after a high pressure is formed in the sealed chamber 52, the gas pushes the closing plate 84 to separate from the second installation plate 85, enabling the gas to be discharged, and the circuit board is fixed on the placement plate 3 by the adsorption of the air holes 61.

[0047] While the placement plate 3 descends, it will simultaneously drive the extrusion rod 118 and the extrusion plate 119 located on the extrusion rod 118 to descend. As the extrusion plate 119 descends, it pushes the triangular plate 116 and the power rack 112 connected to the triangular plate 116 to move. While the power rack 112 moves, it pushes the power gear 111 meshing with it to rotate. The rotation of the power gear 111 drives the rotation shaft 102 connected to it to rotate. While the rotation shaft 102 rotates, it drives the worm gears 105 arranged on both sides of it to rotate. The rotation of the worm gears 105 drives the worm wheels 104 to rotate. The rotation of the worm wheels 104 drives the rotating lead screw 103 to rotate. The rotation of the rotating lead screw 103 drives the connecting rod 54 threadedly connected to it to rotate. The rotation of the linkage rod 87 drives the first telescopic rod 55 to rise. The rise of the first telescopic rod 55 compresses the compression spring 56, thereby making the driving force received by the placement plate 3 stronger, generating a greater pressure between it and the flattening roller 2. When the flattening roller 2 resets, it will drive the push rod 79 to drive the closing plate 84 to contact and seal the inside of the sealing chamber 52, enabling the gas to be discharged. At this time, the power rack 112 will reset under the elastic force of the return spring 115.

[0048] Embodiment 2: Please refer to Figure 10 , the present invention provides a technical solution: The bearing plate 77 is made of rubber material. The rubber bearing plate 77 can avoid damaging the circuit board when contacting the circuit board.

[0049] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0050] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention.

Claims

1. A printed circuit board ink flattening device, comprising a processing table (1) and a flattening roller (2), characterized in that: Also includes: A sealing chamber (52), wherein the sealing chamber (52) is arranged on the processing table (1); A placement plate (3), the placement plate (3) being slidably disposed in the sealing chamber (52), and the circuit board is placed by means of the placement plate (3); A fixing component (4), the fixing component (4) being arranged on the processing table (1), and being used to fix a circuit board placed on the placement plate (3); A driving unit (9) is arranged in the sealing chamber (52), and the driving unit (9) drives the placement plate (3) to move up and down in the sealing chamber (52), thereby changing the distance between the placement plate (3) and the flattening roller (2), and further changing the extrusion pressure between the two.

2. The printed circuit board ink flattening device according to claim 1, characterized in that: The fixing component (4) comprises a placement piece (5) arranged on the placement plate (3), the placement piece (5) being used to carry the circuit board, the placement piece (5) being provided with an adsorption piece (6), the circuit board on the placement plate (3) being adsorbed and fixed by the adsorption piece (6), the adsorption piece (6) being provided with an opening and closing piece (7), the opening and closing piece (7) being used to control the opening and closing of the adsorption piece (6), the sealing chamber (52) being provided with an exhaust piece (8), the exhaust piece (8) being used to exhaust the gas in the sealing chamber (52).

3. The printed circuit board ink flattening device according to claim 2, characterized in that: The placement member (5) comprises a mounting groove (51) arranged on the processing table (1), the mounting groove (51) being connected to a sealing chamber (52), a plurality of power chambers (53) being arranged in the sealing chamber (52), a plurality of connecting rods (54) being slidably arranged on the power chamber (53), a telescopic rod (55) being arranged on the connecting rod (54), one end of the telescopic rod (55) being connected to the placement plate (3), and a compression spring (56) being sleeved on the telescopic rod (55).

4. The printed circuit board ink flattening device according to claim 3, characterized in that: The adsorption member (6) comprises a plurality of air holes (61) provided on the placement plate (3), the air holes (61) being connected to the sealing chamber (52), a fixing plate (62) being arranged in the air holes (61), an extension rod (63) being rotatably arranged on the fixing plate (62), a sealing plate 1 (64) being arranged at one end of the extension rod (63), the sealing plate 1 (64) being fitted with the placement plate (3), a sealing plate 2 (65) being arranged on the fixing plate (62) and being used in conjunction with the sealing plate 1 (64), the sealing plate 2 (65) being rotatably connected to the extension rod (63), and through holes (66) being arranged on both the sealing plate 1 (64) and the sealing plate 2 (65).

5. The printed circuit board ink flattening device according to claim 4, characterized in that: The opening and closing member (7) comprises a positioning plate (71) arranged in the air hole (61); a connecting groove (72) is provided on the extension rod (63); a sliding rod (73) is slidably arranged in the connecting groove (72); the sliding rod (73) passes through the positioning plate (71); a limiting plate (74) is provided on the sliding rod (73); a limiting plate (75) is provided on the extension rod (63); a buffer spring (76) is sleeved between the limiting plate (74) and the limiting plate (75) on the sliding rod (73); a pressure plate (77) is provided on the sliding rod (73); and the pressure plate (77) is higher than the placing plate (3) in the horizontal direction; a spiral groove (78) is provided on the sliding rod (73); a pushing rod (79) used in conjunction with the spiral groove (78) is provided in the connecting groove (72); and the pushing rod (79) is slidably connected to the spiral groove (78).

6. The printed circuit board ink flattening device according to claim 5, characterized in that: The exhaust member (8) comprises an exhaust pipe (81) arranged on the sealing chamber (52), one end of the exhaust pipe (81) is connected to the mounting groove (51), a mounting plate 1 (82) is arranged in the exhaust pipe (81), a moving rod (83) is slidably arranged on the mounting plate 1 (82), one end of the moving rod (83) located in the mounting pipe is provided with a closing plate (84), a mounting plate 2 (85) is arranged in the exhaust pipe (81), the closing plate (84) is fitted with the mounting plate 2 (85), the moving rod (83) is located between the closing plate (84) and the mounting plate 1 (82) and is sleeved with a closing spring (86), a connecting rod (87) is arranged at one end of the moving rod (83) away from the closing plate (84), a sliding groove (88) is opened in the mounting groove (51), and the connecting rod (87) is slidably connected with the sliding groove (88).

7. The printed circuit board ink flattening device according to claim 6, characterized in that: The driving unit (9) comprises a rotating member (10) arranged in the sealed chamber (52), and the rotating member (10) is used to drive the placement plate (3) to rise and fall. A power member (11) is arranged in the sealed chamber (52), and the power member (11) is used to provide power for the rotating member (10) to work.

8. The printed circuit board ink flattening device according to claim 7, characterized in that: The rotating member (10) comprises a vertical plate (101) arranged in a power bin (53), a rotating shaft (102) being rotatably arranged on the vertical plate (101), a plurality of rotating screws (103) being rotatably arranged in the power bin (53), the rotating screws (103) being threadedly connected to a connecting rod (54), a worm gear (104) being arranged on the rotating screws (103), and worm gears (105) engaging with the worm gear (104) being arranged at both ends of the rotating shaft (102).

9. The printed circuit board ink flattening device according to claim 8, characterized in that: The power member (11) comprises a power gear (111) arranged on a rotating shaft (102); a plurality of power racks (112) engaged with the power gear (111) are slidably arranged in the sealing chamber (52); a plurality of positioning plates (113) are arranged in the sealing chamber (52); a second telescopic rod (114) is arranged on the positioning plate (113); one end of the second telescopic rod (114) is connected to the power rack (112); a return spring (115) is sleeved on the second telescopic rod (114); a triangular plate (116) is arranged at one end of the power rack (112) away from the second telescopic rod (114); a mounting frame (117) is arranged on the placement plate (3); a squeezing rod (118) is arranged on the mounting frame (117); and one end of the squeezing rod (118) is arranged at an squeezing plate (119) used in conjunction with the triangular plate (116).

10. The printed circuit board ink flattening device according to claim 5, characterized in that: The pressure bearing plate (77) is made of rubber.

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