Solder paste printing equipment

Abstract

The invention belongs to the technical field of solder paste printing machines, and particularly relates to solder paste printing equipment. The Y-direction driving part is used for driving the clamping mechanism to move in the Y direction, so that the clamping mechanism clamps the supporting pin from the first inserting groove and places the supporting pin in the second inserting groove; the conveying mechanism conveys the circuit board to the position above the workbench in the X direction, the second Z-direction driving piece drives the workbench to move upwards, and the workbench ejects the circuit board away from the conveying mechanism through the supporting pins; the Y-direction driving part is further used for driving the scraper mechanism to move in the Y direction so that the scraper mechanism can print the solder paste on the steel mesh to the circuit board. According to the invention, the workbench supports the circuit board through the supporting pins, and the circuit board is not in direct contact with the workbench, so that the circuit board is conveniently transferred between the workbench and the conveying mechanism, solder paste on the circuit board is not adhered to the workbench, and the cleanliness of the workbench and the printing quality of the circuit board are ensured.

Description

Technical Field

[0001] The present invention belongs to the technical field of solder paste printers, and particularly relates to a solder paste printing device. Background Art

[0002] A circuit board is a core component in electronic products. With the development of electronic products towards miniaturization and precision, the production of circuit boards is usually completed by surface mount technology (SMT). The first process in circuit board production is to print solder paste on the circuit board, and usually a solder paste printer is used to automatically print the solder paste onto the circuit board.

[0003] The solder paste printer includes a stencil conveying mechanism, a circuit board conveying mechanism, and a squeegee. The circuit board conveying mechanism can convey the circuit board to the paste printing station, the stencil conveying mechanism can convey the stencil to the paste printing station, and the stencil is located above the circuit board. The squeegee can scrape the solder paste on the stencil onto the circuit board, thereby completing the solder paste printing work on the circuit board.

[0004] In the prior art, the circuit board directly completes the solder paste printing work on the circuit board conveying mechanism or the workbench. However, the circuit board is easily adhered to the circuit board conveying mechanism or the workbench, which is not convenient for the blanking of the circuit board on the solder paste printer, reduces the blanking power of the solder paste printer, and reduces the paste printing quality of the circuit board. Summary of the Invention

[0005] The embodiments of the present invention provide a solder paste printing device to solve the technical problems such as the circuit board being easily adhered to the circuit board conveying mechanism or the workbench in the prior art.

[0006] An embodiment of the present invention provides a solder paste printing device, including a base, a support frame, a conveying mechanism, a lifting mechanism, a feeding mechanism, a Y-direction driving member, a squeegee mechanism, and a clamping mechanism. The conveying mechanism is installed on the base and is used to move the circuit board along the X direction. The support frame is installed on the base and is provided with a Y-direction chute for supporting the stencil. The Y-direction driving member is installed on the support frame and is connected to the squeegee mechanism and the clamping mechanism. The feeding mechanism includes a first Z-direction driving member installed on the base and a feeding table installed on the first Z-direction driving member. The feeding table is provided with a first insertion slot for installing a support pin. The lifting mechanism includes a second Z-direction driving member installed on the base and a workbench installed on the second Z-direction driving member. The workbench is provided with a second insertion slot. The Y-direction driving member is used to drive the clamping mechanism to move along the Y direction, so that the clamping mechanism clamps the support pin from the first insertion slot and places it in the second insertion slot. The conveying mechanism conveys the circuit board above the workbench along the X direction. The second Z-direction driving member drives the workbench to move upward, and the workbench pushes the circuit board away from the conveying mechanism through the support pins. The Y-direction driving member is further configured to drive the squeegee mechanism to move along the Y direction, so that the squeegee mechanism prints the solder paste on the stencil onto the circuit board.

[0007] Optionally, the solder paste printing device further includes a cleaning mechanism. The cleaning mechanism includes a support plate, a feeding roller, a winding roller, a guiding roller, a winding driving member, a material moving driving member, a third Z-direction driving member, an adsorption box, and a spraying device. The feeding roller, the winding roller, and the guiding roller are all rotatably mounted on the support plate. The winding driving member and the adsorption box are both mounted on the support plate, and the winding driving member is connected to the winding roller. The wiping member released by the feeding roller bypasses the guiding roller and is wound around the winding roller after being adsorbed by the adsorption box. The material moving driving member is mounted on the support plate and is connected to the spraying device. The third Z-direction driving member is mounted on the support plate and is connected to the adsorption box. The material moving driving member is configured to drive the spraying device to move along the X direction, so that the spraying device sprays the cleaning agent onto the wiping member. The third Z-direction driving member is configured to drive the adsorption box to move up and down, so that the adsorption box drives the wiping member thereon to abut against the bottom surface of the stencil. The winding driving member drives the winding roller to wind up the wiping member, so that the wiping member wipes the solder paste on the bottom surface of the stencil.

[0008] Optionally, the solder paste printing device further includes a wiping mechanism. The wiping mechanism includes a wiping driving assembly, a wiping rod, and a wiping roll detachably sleeved on the wiping rod. The wiping driving assembly is mounted on the base and is connected to the wiping rod. The wiping roll is used for wiping the solder paste on the bottom surface of the stencil.

[0009] Optionally, the squeegee mechanism includes a squeegee frame, a push rod driving member, a push rod, a squeegee driving member, and a squeegee body. The squeegee frame is slidably mounted on the support frame along the Y direction. The Y-direction driving member is connected to the squeegee frame and is configured to drive the squeegee frame to move along the Y direction. The push rod driving member is mounted on the squeegee frame and is configured to drive the push rod to move along the Z direction. The push rod is used for pushing the stencil to move in the Y-direction chute. The squeegee driving member is mounted on the squeegee frame and is connected to the squeegee body. The squeegee body is used for printing the solder paste on the stencil onto the circuit board.

[0010] Optionally, the squeegee mechanism further includes a solder paste receiving assembly, which includes a solder paste receiving driving member, a support member, a first transfer arm, a second transfer arm, and a solder paste receiving spatula; the support member is installed on the squeegee frame, one end of the first transfer arm is hinged to the support member, and the other end of the first transfer arm is hinged to the solder paste receiving spatula; The second transfer arm includes a first connecting arm and a second connecting arm that obliquely connects the first connecting arm. The solder paste receiving driving member is installed on the squeegee frame and connected to the first connecting arm. The connecting portion of the first connecting arm and the second connecting arm is hinged to the support member. The second connecting arm is hinged to the solder paste receiving spatula, and the second connecting arm is parallel to the first transfer arm; The solder paste receiving driving member is used to drive the solder paste receiving spatula to flip through the first connecting arm so that the solder paste receiving spatula receives the solder paste dropped by the squeegee body.

[0011] Optionally, the conveying mechanism includes a sensing component, an automatic adjustment component, and two conveying components arranged at intervals. The conveying component includes a support guide rail installed on the base and a conveying assembly installed on the support guide rail; the automatic adjustment component is connected to the support guide rail and is used to adjust the distance between the two conveying components; The sensing component includes a sensing transmitter and a sensing receiver installed at intervals on the support guide rail. The sensing component is located between the two conveying components and is used to detect whether there is an obstruction between the two support guide rails.

[0012] Optionally, the conveying mechanism further includes two clamping components, and the clamping components are installed on the support guide rail in one-to-one correspondence; The clamping component includes a clamping driving member and a clamping plate installed at the output end of the clamping driving member; the clamping driving member is installed on the support guide rail and connected to the clamping plate, and is used to drive the clamping plate to clamp the circuit board on the workbench from opposite ends.

[0013] Optionally, the first Z-direction driving member includes a scissor driving member, two scissor assemblies, and a bottom plate installed on the base; the two scissor assemblies are installed at intervals between the bottom plate and the feeding table; The scissor assembly includes a first support arm, a second support arm, a first roller installed on the first support arm, and a second roller installed on the second support arm; the middle part of the first support arm is rotationally connected to the middle part of the second support arm; the first roller abuts against the feeding table, and one end of the first support arm away from the first roller is rotatably installed on the bottom plate; the second roller abuts against the bottom plate, and one end of the second support arm away from the second roller is rotatably installed on the feeding table; The scissor drive is installed on the first support arm and connected to the second support arm.

[0014] Optionally, the clamping mechanism includes a clamping frame, a vision camera and a clamping assembly both installed on the clamping frame; the clamping assembly is slidably installed on the support frame in the Y direction, and the Y-direction drive is connected to the clamping frame; the clamping assembly is used for clamping the support pin.

[0015] Optionally, the solder paste printing device further includes a printing outer cover, the printing outer cover includes a cover door assembly, an opening and closing drive, and an outer cover with an internal space; the base, the support frame, the conveying mechanism, the lifting mechanism, the feeding mechanism, the Y-direction drive, the squeegee mechanism and the clamping mechanism are all installed in the internal space; The cover door assembly includes a display screen, a top plate and a door panel connecting the top plate, the top plate is perpendicular to the door panel, and the display screen is installed on the outer surface of the door panel; a top through hole communicating with the internal space is provided at the top of the outer cover, and a door through hole communicating with the internal space is provided at the front or rear of the outer cover; One end of the top plate away from the door panel is rotatably connected to the side wall of the top through hole; the opening and closing drive is installed on the inner wall of the internal space and connected to the door panel; the opening and closing drive is used to drive the cover door assembly to rotate so that the top plate closes the top through hole and the door panel closes the door through hole, or to open the door through hole by the door panel; A first through hole is provided on the left side wall of the outer cover, and a second through hole is provided on the right side wall of the outer cover, and the first through hole and the second through hole are located at opposite ends of the conveying mechanism.

[0016] In the present invention, the stencil moves in the Y-direction chute to above the workbench; the Y-direction driving member drives the clamping mechanism to move between the feeding table and the workbench, and the clamping mechanism transfers the support pins in the second insertion groove to the second insertion groove; the conveying mechanism conveys the circuit board to above the workbench, and the second Z-direction driving member drives the workbench to move upward, and the workbench takes the circuit board on the conveying mechanism away through the support pins; the Y-direction driving member drives the squeegee mechanism to move in the Y-direction, and the squeegee mechanism prints the solder paste on the stencil onto the circuit board; the second Z-direction driving member drives the workbench to move downward, and the workbench transfers the circuit board to the conveying mechanism; the conveying mechanism then conveys the circuit board to the blanking station. In the present invention, the workbench supports the circuit board through the support pins, so that the circuit board does not directly contact the workbench, which facilitates the transfer of the circuit board between the workbench and the conveying mechanism, and the solder paste on the circuit board will not adhere to the workbench, ensuring the cleanliness of the workbench and the printing quality of the circuit board. In addition, the clamping mechanism can transfer the support pins between the workbench and the feeding table, so that the support pins on the workbench can be replaced in time, ensuring the cleanliness of the support pins on the workbench. In addition, the solder paste printing equipment has a compact structure, small occupied space and high automation degree. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments of the present invention. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 It is a schematic structural diagram of a solder paste printing device provided by an embodiment of the present invention; Figure 2 It is a schematic internal structural diagram of a solder paste printing device provided by an embodiment of the present invention; Figure 3 It is a schematic structural diagram of a jacking mechanism and a conveying mechanism of a solder paste printing device provided by an embodiment of the present invention; Figure 4 It is a schematic structural diagram of a clamping mechanism of a solder paste printing device provided by an embodiment of the present invention; Figure 5 It is a partial schematic structural diagram of a conveying mechanism of a solder paste printing device provided by an embodiment of the present invention; Figure 6 It is a schematic structural diagram of a squeegee mechanism of a solder paste printing device provided by an embodiment of the present invention; Figure 7It is a schematic structural diagram of a solder paste receiving component of a solder paste printing device provided by an embodiment of the present invention; Figure 8 It is a schematic structural diagram of a feeding mechanism of a solder paste printing device provided by an embodiment of the present invention; Figure 9 It is a schematic structural diagram of a cleaning mechanism of a solder paste printing device provided by an embodiment of the present invention; Figure 10 It is a schematic structural diagram of a wiping mechanism of a solder paste printing device provided by an embodiment of the present invention; Figure 11 It is a schematic structural diagram of a cover door component of a solder paste printing device provided by an embodiment of the present invention.

[0019] The reference numerals in the specification are as follows: 1. Base; 2. Support frame; 21. Y-direction chute; 3. Conveyor mechanism; 31. Sensing component; 311. Sensing transmitter; 312. Sensing receiver; 32. Automatic adjustment component; 33. Conveyor component; 331. Support guide rail; 332. Conveyor assembly; 34. Clamping component; 341. Clamping drive; 342. Clamping plate; 4. Lifting mechanism; 41. Second Z-direction drive; 42. Workbench; 421. Second insertion slot; 5. Feeding mechanism; 51. First Z-direction drive; 511. Scissor assembly; 5111. First support arm; 5112. Second support arm; 5113. First roller; 5114. Second roller; 512. Bottom plate; 52. Feeding table; 521. First insertion slot; 53. Scissor drive; 6. Y-direction drive; 7. Blade mechanism; 71. Blade holder; 72. Push rod drive; 73. Push rod; 74. Blade drive; 75. Blade body; 76. Solder paste receiving component; 761. Solder paste receiving drive; 762. Support member; 763. First transfer arm; 764. Second transfer arm; 7641. First connecting arm; 7642. Second connecting arm; 765. Solder paste shovel; 8. Clamping mechanism; 81. Clamping frame; 82. Vision camera; 83. Clamping assembly; 9. Cleaning mechanism; 91. Support plate; 92. Feeding roller; 93. Receiving roller; 94. Guide roller; 95. Receiving drive; 96. Transfer drive; 97. Third Z-direction drive; 98. Adsorption box; 99. Sprayer; 10. Wiping mechanism; 101. Wiping drive assembly; 102. Wiping rod; 103. Wiping roll; 20. Printing outer cover; 201. Cover door component; 2011. Display screen; 2012. Top plate; 2013. Door panel; 202. Opening and closing drive; 203. Outer cover; 2031. Internal space; 2032. First through hole; 30. Support pin. Detailed implementation manners

[0020] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clear and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0021] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0022] In the description of the present invention, it should be noted that, unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0023] As Figure 1 and Figure 2 shown, an embodiment of the present invention provides a solder paste printing device, including a base 1, a support frame 2, a conveying mechanism 3, a lifting mechanism 4, a feeding mechanism 5, a Y-direction driving member 6, a squeegee mechanism 7, and a clamping mechanism 8; the conveying mechanism 3 is installed on the base 1 and is used to move the circuit board in the X direction; it can be understood that the conveying mechanism 3 includes, but is not limited to, a belt conveying assembly, etc., and the support frame 2 is located above the conveying mechanism 3.

[0024] As Figure 2 and Figure 3 shown, the support frame 2 is installed on the base 1 and is provided with a Y-direction chute 21 for supporting the stencil; the Y-direction driving member 6 is installed on the support frame 2 and connects the squeegee mechanism 7 and the clamping mechanism 8; the Y-direction driving member 6 includes, but is not limited to, a pneumatic cylinder, a hydraulic cylinder, a lead screw nut assembly, etc., and the Y-direction driving member 6 is used to drive the squeegee mechanism 7 and the clamping mechanism 8 to move in the Y direction.

[0025] As Figure 8As shown, the feeding mechanism 5 includes a first Z-direction driving member 51 mounted on the base 1 and a feeding table 52 mounted on the first Z-direction driving member 51. A first insertion slot 521 for mounting the support pin 30 is provided on the feeding table 52. Understandably, a plurality of first insertion slots 521 are provided on the feeding table 52 at intervals, and a support pin 30 can be mounted in each of the insertion slots. The first Z-direction driving member 51 includes, but is not limited to, a lead screw nut assembly, a scissor assembly, etc.

[0026] As Figure 3 As shown, the lifting mechanism 4 includes a second Z-direction driving member 41 mounted on the base 1 and a workbench 42 mounted on the second Z-direction driving member 41. A second insertion slot 421 is provided on the workbench 42. Understandably, the second Z-direction driving member 41 includes, but is not limited to, a pneumatic cylinder, a hydraulic cylinder, a lead screw nut assembly, etc. A plurality of second insertion slots 421 are provided on the workbench 42 at intervals, and a support pin 30 can be mounted in each of the second insertion slots 421.

[0027] The Y-direction driving member 6 is used to drive the clamping mechanism 8 to move in the Y direction, so that the clamping mechanism 8 clamps the support pin 30 from the first insertion slot 521 and places it in the second insertion slot 421. The conveying mechanism 3 conveys the circuit board above the workbench 42 in the X direction. The second Z-direction driving member 41 drives the workbench 42 to move upward, and the workbench 42 pushes the circuit board away from the conveying mechanism 3 through the support pin 30. The Y-direction driving member 6 is also used to drive the squeegee mechanism 7 to move in the Y direction, so that the squeegee mechanism 7 prints the solder paste on the stencil onto the circuit board.

[0028] Specifically, the stencil moves in the Y-direction chute 21 to above the workbench 42; the Y-direction driving member 6 drives the clamping mechanism 8 to move between the feeding table 52 and the workbench 42, and the clamping mechanism 8 transfers the support pins 30 in the second socket 421 to the second socket 421; the conveying mechanism 3 conveys the circuit board to above the workbench 42, and the second Z-direction driving member 41 drives the workbench 42 to move upward. The workbench 42 drives the circuit board on the conveying mechanism 3 away through the support pins 30; the Y-direction driving member 6 drives the squeegee mechanism 7 to move in the Y-direction, and the squeegee mechanism 7 prints the solder paste on the stencil onto the circuit board; the second Z-direction driving member 41 drives the workbench 42 to move downward, and the workbench 42 transfers the circuit board to the conveying mechanism 3; the conveying mechanism 3 then conveys the circuit board to the discharging station. In the present invention, the workbench 42 supports the circuit board through the support pins 30, so that the circuit board does not directly contact the workbench 42, which facilitates the transfer of the circuit board between the workbench 42 and the conveying mechanism 3, and the solder paste on the circuit board will not adhere to the workbench 42, ensuring the cleanliness of the workbench 42 and the printing quality of the circuit board. In addition, the clamping mechanism 8 can transfer the support pins 30 between the workbench 42 and the feeding table 52, so that the support pins 30 on the workbench 42 can be replaced in time, ensuring the cleanliness of the support pins 30 on the workbench 42. Furthermore, the solder paste printing device has a compact structure, small occupied space, and high automation degree.

[0029] In one embodiment, as Figure 9 shown, the solder paste printing device further includes a cleaning mechanism 9. The cleaning mechanism 9 includes a support plate 91, a feeding roller 92, a winding roller 93, a guiding roller 94, a winding driving member 95, a moving driving member 96, a third Z-direction driving member 97, an adsorption box 98, and a spraying device 99; the feeding roller 92, the winding roller 93, and the guiding roller 94 are all rotatably installed on the support plate 91, the winding driving member 95 and the adsorption box 98 are both installed on the support plate 91, and the winding driving member 95 is connected to the winding roller 93; the wiping member released by the feeding roller 92 bypasses the guiding roller 94 and is adsorbed by the adsorption box 98 and then wound around the winding roller 93; it can be understood that the winding driving member 95 includes, but is not limited to, a rotating motor, etc. During the process of the winding driving member 95 driving the winding roller 93 to rotate, the feeding roller 92 will continuously release the wiping member, and the wiping member includes, but is not limited to, wiping paper, wiping tape, wiping cloth, etc.

[0030] The material transfer driving member 96 is installed on the support plate 91 and connected to the sprayer 99; the third Z-direction driving member 97 is installed on the support plate 91 and connected to the adsorption box 98; it can be understood that the sprayer 99 stores a cleaning agent, and the material transfer driving member 96 includes but is not limited to pneumatic cylinders, belt assemblies, linear motors, etc.; the sprayer 99 can spray the cleaning agent onto the wiping member in front of the adsorption box 98; the third Z-direction driving member 97 includes but is not limited to pneumatic cylinders, hydraulic cylinders, etc.

[0031] The material transfer driving member 96 is used to drive the sprayer 99 to move along the X direction, so that the sprayer 99 sprays the cleaning agent onto the wiping member; the third Z-direction driving member 97 is used to drive the adsorption box 98 to lift and lower, so that the adsorption box 98 drives the wiping member thereon to abut against the bottom surface of the stencil; the material collection driving member 95 drives the material collection roller 93 to wind up the wiping member, so that the wiping member wipes the solder paste on the bottom surface of the stencil.

[0032] Specifically, the material transfer driving member 96 drives the sprayer 99 to move along the X direction, and the sprayer 99 sprays the cleaning agent onto the wiping member in front of the adsorption box 98; the material collection driving member 95 drives the material collection roller 93 to rotate, and the material collection roller 93 drives the wiping member with the cleaning agent adhered thereto to move above the adsorption box 98; the third Z-direction driving member 97 drives the adsorption box 98 to move upward, and the adsorption box 98 drives the wiping member with the cleaning agent already adhered thereto to abut against the bottom surface of the stencil; the stencil slides along the Y-direction chute 21, so that the wiping member above the adsorption box 98 can wipe the solder paste on the bottom surface of the stencil. The third Z-direction driving member 97 drives the adsorption box 98 to move downward. After the test piece on the adsorption box 98 is separated from the stencil, the material collection driving member 95 drives the material collection roller 93 to rotate, and the material collection roller 93 can wind the used wiping member around the material collection roller 93. In the present invention, the wiping member is adhered with the cleaning agent and then used to wipe the stencil, ensuring the cleanliness of the stencil after wiping; and the stencil wiping device has a simple structure, high wiping efficiency, and low manufacturing cost.

[0033] In an embodiment, as Figure 10 shown, the solder paste printing equipment further includes a wiping mechanism 10. The wiping mechanism 10 includes a wiping driving assembly 101, a wiping rod 102, and a wiping roll 103 detachably sleeved on the wiping rod 102; the wiping driving assembly 101 is installed on the base 1 and connected to the wiping rod 102, and the wiping roll 103 is used to wipe the solder paste on the bottom surface of the stencil. It can be understood that the wiping roll 103 includes but is not limited to a sponge sleeve, etc.; the wiping driving assembly 101 can drive the wiping rod 102 to move along the X direction and the Y direction, so that the wiping rod 102 can wipe the solder paste on the bottom surface of the stencil.

[0034] Further, after the wiping member wipes the bottom surface of the stencil once, the wiping roll 103 wipes the bottom surface of the stencil again, further ensuring the cleanliness of the stencil and the dryness of the bottom surface of the stencil, and avoiding accidents caused by excessive residual cleaning agent on the bottom surface of the stencil.

[0035] In one embodiment, as Figure 6 shown, the squeegee mechanism 7 includes a squeegee holder 71, a push rod driving member 72, a push rod 73, a squeegee driving member 74, and a squeegee body 75; the squeegee holder 71 is slidably mounted on the support frame 2 in the Y direction; the Y-direction driving member 6 is connected to the squeegee holder 71 and is used to drive the squeegee holder 71 to move in the Y direction; it can be understood that the squeegee holder 71 can be slidably mounted on the support frame 2 through a guide rail slider assembly, a guide rod sliding sleeve assembly, etc.

[0036] The push rod driving member 72 is mounted on the squeegee holder 71 and is used to drive the push rod 73 to move in the Z direction, and the push rod 73 is used to push the stencil to move in the Y-direction chute 21; the squeegee driving member 74 is mounted on the squeegee holder 71 and is connected to the squeegee body 75, and the squeegee body 75 is used to print the solder paste on the stencil onto the circuit board. It can be understood that the push rod driving member 72 and the squeegee driving member 74 include but are not limited to pneumatic cylinders, hydraulic cylinders, etc.

[0037] Specifically, the push rod driving member 72 drives the push rod 73 to move downward, the Y-direction driving member 6 drives the squeegee holder 71 to move in the Y direction on the support frame 2, and the push rod 73 can push the stencil to move in the Y-direction chute 21 from the side. When the push rod driving member 72 drives the push rod 73 to move upward, after the squeegee driving member 74 drives the squeegee body 75 to move downward, the Y-direction driving member 6 drives the squeegee holder 71 to move in the Y direction on the support frame 2, and the squeegee body 75 can print the solder paste on the stencil onto the circuit board located below. In this embodiment, the structure of the squeegee mechanism 7 is simple and has a high integration degree.

[0038] In one embodiment, as Figure 6 and Figure 7 shown, the squeegee mechanism 7 further includes a solder paste receiving assembly 76, and the solder paste receiving assembly 76 includes a solder paste receiving driving member 761, a support member 762, a first transfer arm 763, a second transfer arm 764, and a solder paste receiving shovel 765; the support member 762 is mounted on the squeegee holder 71, one end of the first transfer arm 763 is hinged to the support member 762, and the other end of the first transfer arm 763 is hinged to the solder paste receiving shovel 765; it can be understood that the support member 762 is mounted on the squeegee holder 71 and extends downward.

[0039] The second transfer arm 764 includes a first connecting arm 7641 and a second connecting arm 7642 that is inclined to connect the first connecting arm 7641. The paste receiving driving member 761 is installed on the doctor blade holder 71 and connected to the first connecting arm 7641. The connecting portion between the first connecting arm 7641 and the second connecting arm 7642 is hinged to the support member 762. The second connecting arm 7642 is hinged to the paste receiving spatula 765. The second connecting arm 7642 is parallel to the first transfer arm 763. Understandably, the first transfer arm 763, the second transfer arm 764, and the paste receiving spatula 765 form a parallelogram. The included angle between the first connecting arm 7641 and the second connecting arm 7642 is a right angle.

[0040] The paste receiving driving member 761 is used to drive the paste receiving spatula 765 to flip through the first connecting arm 7641, so that the paste receiving spatula 765 can receive the solder paste dropped by the doctor blade body 75. Understandably, the paste receiving driving member 761 includes, but is not limited to, pneumatic cylinders, hydraulic cylinders, etc.

[0041] Specifically, the paste receiving driving member 761 pushes the first connecting arm 7641 forward. The first connecting arm 7641 drives the paste receiving spatula 765 to flip through the second connecting arm 7642. The first connecting arm 7641 rotates around the support member 762, and the paste receiving spatula 765 can be in a horizontal state. The paste receiving spatula 765 in the horizontal state can receive the solder paste dropped by the doctor blade body 75. The paste receiving driving member 761 pushes the first connecting arm 7641 backward. The first connecting arm 7641 drives the paste receiving spatula 765 to flip through the second connecting arm 7642. The first connecting arm 7641 rotates around the support member 762, so that the paste receiving spatula 765 can be folded up, ensuring the compactness of the doctor blade mechanism 7. In this embodiment, after the doctor blade body 75 scrapes the solder paste, the paste receiving assembly 76 can receive the solder paste dropped by the doctor blade body 75, ensuring the cleanliness of the solder paste printing device.

[0042] In one embodiment, as Figure 5 shown, the conveying mechanism 3 includes a sensing component 31, an automatic adjustment component 32, and two conveying components 33 arranged at intervals. The conveying component 33 includes a support guide rail 331 installed on the base 1 and a conveying assembly 332 installed on the support guide rail 331. The automatic adjustment component 32 is connected to the support guide rail 331 and is used to adjust the distance between the two conveying components 33. Understandably, the two conveying components 33 can support and convey the circuit board from the left and right sides. The conveying assembly 332 includes, but is not limited to, belt conveyors, etc. The automatic adjustment component 32 includes, but is not limited to, screw nut assemblies, pneumatic cylinders, and hydraulic cylinders, etc.

[0043] The sensing component 31 includes a sensing transmitter 311 and a sensing receiver 312 that are spaced apart and installed on the support guide rail 331. The sensing component 31 is located between the two conveying components 33 and is used to detect whether there is an obstruction between the two support guide rails 331. Understandably, the sensing transmitter 311 can emit laser light towards the sensing receiver 312, and the sensing receiver 312 can receive the laser light emitted by the sensing transmitter 311; the sensing transmitter 311 and the sensing receiver 312 are spaced apart along the length direction of the support guide rail 331.

[0044] In this embodiment, during the process that the automatic adjustment component 32 drives one of the conveying components 33 to move towards the other conveying component 33, the sensing component 31 continuously detects whether there is an obstruction on the moving path of the conveying component 33; when there is no obstruction on the moving path, the sensing receiver 312 can receive the laser light emitted by the sensing transmitter 311, and the automatic adjustment component 32 will continue to drive the conveying component 33 to move. In this embodiment, the design of the sensing component 31 avoids the accident that an obstruction appears on the moving path of the conveying component 33 and interferes with the conveying component 33, ensuring the smoothness when the automatic adjustment component 32 drives the two conveying components 33 to approach each other; moreover, the structure of this automatic conveying mechanism 3 is simple and has a high degree of automation.

[0045] In one embodiment, the automatic adjustment component 32 includes an adjustment motor, a lead screw, and a nut sleeve installed on the support guide rail 331. The nut sleeve is threadedly sleeved on the lead screw, and the adjustment motor is connected to the lead screw. Understandably, the lead screw is rotatably installed between the two support guide rails 331. Specifically, the adjustment motor drives the lead screw to rotate, and the lead screw drives one of the support guide rails 331 to move through the nut sleeve, thereby achieving the function of adjusting the distance between the two conveying components 33. In this embodiment, the structure of the automatic adjustment component 32 is simple and the manufacturing cost is low.

[0046] In one embodiment, as Figure 5 shown, the conveying assembly 332 includes a conveying motor, a conveyor belt, and at least two pulleys that are spaced apart and rotatably installed on the support guide rail 331. The conveyor belt is wound around all the pulleys, and the conveying motor is installed on the support guide rail 331 and connected to one of the pulleys. Understandably, the number of pulleys can be set to 2, 3, 4, etc. according to actual needs. Specifically, the conveying motor drives the pulley to rotate, the pulley drives the conveyor belt to move, and the conveyor belt drives the workpiece to be conveyed thereon through friction. In this embodiment, the structure of the conveying assembly 332 is simple and the manufacturing cost is low.

[0047] In one embodiment, asFigure 3 and Figure 5 As shown, the conveying mechanism 3 further includes two clamping components 34, which are mounted on the supporting rail 331 in a one-to-one correspondence; the clamping components 34 include a clamping driver 341 and a clamping plate 342 mounted on the output end of the clamping driver 341; the clamping driver 341 is mounted on the supporting rail 331 and connected to the clamping plate 342, and is used to drive the clamping plate 342 to clamp the circuit board on the workbench 42 from opposite ends. It can be understood that the clamping driver 341 includes but is not limited to a pneumatic cylinder, a hydraulic cylinder, and a screw nut assembly, and the clamping plate 342 is mounted on the supporting rail 331 through a rail slider assembly.

[0048] Specifically, after the second Z-direction driving member 41 drives the circuit board to separate from the conveying assembly 332 through the support pin 30 on the workbench 42, the clamping driving member 341 drives the clamping plates 342 to approach each other, and the two clamping plates 342 clamp the circuit board on the workbench 42, and the scraper mechanism 7 then prints the solder paste on the steel mesh onto the circuit board. In this embodiment, the design of the clamping member 34 ensures that the circuit board is stable on the support pin 30 during the process of the scraper mechanism 7 printing the solder paste on the steel mesh onto the circuit board, thereby ensuring the solder paste printing quality of the circuit board.

[0049] In one embodiment, if Figure 8 As shown, the first Z-direction driving member 51 includes a scissor-type driving member 53, two scissor-type assemblies 511 and a base plate 512 installed on the base 1; the two scissor-type assemblies 511 are installed at intervals between the base plate 512 and the feeding table 52; it can be understood that the two scissor-type assemblies 511 are installed at intervals along the front-to-back direction between the base plate 512 and the feeding table 52; the second plug-in slot 421 is arranged on the top of the feeding table 52.

[0050] The scissor assembly 511 includes a first support arm 5111, a second support arm 5112, a first roller 5113 mounted on the first support arm 5111, and a second roller 5114 mounted on the second support arm 5112; the middle of the first support arm 5111 is rotatably connected to the middle of the second support arm 5112; the first roller 5113 abuts against the feeding table 52, and one end of the first support arm 5111 away from the first roller 5113 is rotatably mounted on the bottom plate 512; the second roller 5114 abuts against the bottom plate 512, and one end of the second support arm 5112 away from the second roller 5114 is rotatably mounted on the feeding table 52; the scissor driving member 53 is mounted on the first support arm 5111 and connects the second support arm 5112. It can be understood that the middle parts of the first support arm 5111 and the second support arm 5112 can be connected by a rotating shaft; the scissor driving member 53 includes but is not limited to a pneumatic cylinder, a hydraulic cylinder, etc.

[0051] Specifically, when the scissor driving member 53 drives the first support arm 5111 and the second support arm 5112 to approach each other, the scissor assembly 511 will lift the feeding table 52 upward; when the scissor driving member 53 drives the first support arm 5111 and the second support arm 5112 to move away from each other, the scissor assembly 511 will lower the feeding table 52 downward. When relative rotation occurs between the first support arm 5111 and the second support arm 5112, the first roller 5113 rolls on the bottom surface of the feeding table 52, and the second roller 5114 rolls on the top surface of the bottom plate 512, thereby reducing the friction between the scissor assembly 511 and the bottom plate 512 and the feeding table 52, prolonging the service life of the first Z-direction driving member 51, and ensuring the stability of the lifting of the feeding table 52.

[0052] In one embodiment, as Figure 4As shown, the clamping mechanism 8 includes a clamping frame 81, a vision camera 82 and a clamping assembly 83 both installed on the clamping frame 81; the clamping assembly 83 is slidably installed on the support frame 2 in the Y direction, and the Y-direction driving member 6 is connected to the clamping frame 81; the clamping assembly 83 is used for clamping the support pin 30. It can be understood that the vision camera 82 can photograph the positions of the first insertion slot 521 and the support pin 30 on the feeding table 52, and can also photograph the positions of the second insertion slot 421 and the support pin 30 on the workbench 42. Thus, the clamping assembly 83 can transfer the support pin 30 between the feeding table 52 and the workbench 42, ensuring the automation degree of the solder paste printing equipment. Further explained, the clamping assembly 83 includes a clamping driving member 341 and a first clamping arm and a second clamping arm installed at both output ends of the clamping driving member 341. The clamping driving member 341 drives the first clamping arm and the second clamping arm to open and close, so that the first clamping arm and the second clamping arm clamp or release the support pin 30.

[0053] In one embodiment, as Figure 1 and Figure 11 shown, the solder paste printing equipment further includes a printing outer cover 20, and the printing outer cover 20 includes a cover door assembly 201, an opening and closing driving member 202 and an outer cover 203 having an internal space 2031; the base 1, the support frame 2, the conveying mechanism 3, the lifting mechanism 4, the feeding mechanism 5, the Y-direction driving member 6, the squeegee mechanism 7 and the clamping mechanism 8 are all installed in the internal space 2031; The cover door assembly 201 includes a display screen 2011, a top plate 2012 and a door panel 2013 connecting the top plate 2012. The top plate 2012 is perpendicular to the door panel 2013, and the display screen 2011 is installed on the outer surface of the door panel 2013; a top through hole communicating with the internal space 2031 is provided at the top of the outer cover 203, and a door through hole communicating with the internal space 2031 is provided at the front or rear of the outer cover 203; it can be understood that the top plate 2012 and the door panel 2013 are integrally formed, and a corner connecting plate is provided between the top plate 2012 and the door panel 2013; the top of the door through hole communicates with the top through hole.

[0054] One end of the top plate 2012 away from the door panel 2013 is rotatably connected to the side wall of the top through hole; the opening and closing driving member 202 is installed on the inner wall of the internal space 2031 and is connected to the door panel 2013; the opening and closing driving member 202 is used to drive the cover door assembly 201 to rotate so that the top plate 2012 closes the top through hole and the door panel 2013 closes the door through hole, or so that the door panel 2013 opens the door through hole; it can be understood that the top plate 2012 can be rotatably installed on the top of the outer cover 203 through hinges, hinges, etc., and the opening and closing driving member 202 includes but is not limited to air cylinders, hydraulic cylinders, etc.

[0055] Specifically, the opening and closing driving member 202 pushes the door panel 2013 forward, and the door panel 2013 drives the top plate 2012 to rotate upward, so that the door panel 2013 can open the door through hole, and workers, conveying equipment, etc. can place the steel mesh in the Y-direction chute 21 or take out the steel mesh from the Y-direction chute 21 through the opened door through hole; the opening and closing driving member 202 pulls the door panel 2013 backward, and the door panel 2013 drives the top plate 2012 to rotate downward until the top plate 2012 closes the top through hole and the door panel 2013 closes the door through hole. In this embodiment, the cover door assembly 201 rotates upward to open the door through hole, and the cover door assembly 201 does not occupy the space on the left and right sides of the outer cover 203, and the occupied space of the printing outer cover 20 is small. In addition, the cover door assembly 201 further includes a display screen 2011 installed on the outer surface of the door panel 2013. When the cover door assembly 201 is in the open state, the user can look up to view the display screen 2011, and the solder paste printing equipment is convenient to use.

[0056] In one embodiment, as Figure 1 shown, a first through hole 2032 is provided on the left side wall of the outer cover 203, a second through hole is provided on the right side wall of the outer cover 203, and the first through hole 2032 and the second through hole are located at opposite ends of the conveying mechanism 3. It can be understood that the circuit board can be input to the conveying component 332 through the first through hole 2032, and the conveying component 332 can output the printed circuit board through the second through hole.

[0057] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A solder paste printing device, characterized in that: It includes a base, a support frame, a conveying mechanism, a lifting mechanism, a feeding mechanism, a Y-direction driving member, a scraper mechanism and a clamping mechanism; the conveying mechanism is installed on the base and is used to move the circuit board along the X direction; The support frame is installed on the base and is provided with a Y-direction slide groove for supporting the steel mesh; the Y-direction driving member is installed on the support frame and connects the scraper mechanism and the clamping mechanism; The feeding mechanism comprises a first Z-direction driving member mounted on the base and a feeding table mounted on the first Z-direction driving member, wherein the feeding table is provided with a first insertion slot for mounting a support pin; The lifting mechanism comprises a second Z-direction driving member mounted on the base and a workbench mounted on the second Z-direction driving member, wherein the workbench is provided with a second plug-in slot; The Y-direction driving member is used to drive the clamping mechanism to move along the Y-direction, so that the clamping mechanism clamps the supporting pin from the first plug-in slot and places it in the second plug-in slot; The conveying mechanism conveys the circuit board to the top of the workbench along the X direction, the second Z-direction driving member drives the workbench to move upward, and the workbench pushes the circuit board away from the conveying mechanism through the supporting pins; The Y-direction driving member is also used to drive the scraper mechanism to move along the Y-direction, so that the scraper mechanism prints the solder paste on the steel mesh onto the circuit board.

2. The solder paste printing device according to claim 1, characterized in that: The solder paste printing device also includes a cleaning mechanism, which includes a support plate, a feeding roller, a receiving roller, a guide roller, a receiving drive, a material transfer drive, a third Z-direction drive, an adsorption box, and a sprayer; the feeding roller, the receiving roller, and the guide roller are all rotatably mounted on the support plate, the receiving drive and the adsorption box are both mounted on the support plate, and the receiving drive is connected to the receiving roller; the wiping member released by the feeding roller bypasses the guide roller, and is adsorbed by the adsorption box and then wound around the receiving roller; The material transfer driving member is mounted on the support plate and connected to the sprayer; The third Z-direction driving member is mounted on the support plate and connected to the adsorption box; The material transfer drive is used to drive the sprayer to move along the X direction, so that the sprayer sprays the cleaning agent onto the wiping member; the third Z-direction drive is used to drive the adsorption box to rise and fall, so that the adsorption box drives the wiping member thereon to abut against the bottom surface of the steel mesh; The receiving drive member drives the receiving roller to reel in the wiping member, so that the wiping member wipes the solder paste on the bottom surface of the steel mesh.

3. The solder paste printing device according to claim 1, characterized in that: The solder paste printing equipment also includes a wiping mechanism, which includes a wiping drive assembly, a wiping rod, and a wiping roll detachably sleeved on the wiping rod; the wiping drive assembly is installed on the base and connected to the wiping rod, and the wiping roll is used to wipe the solder paste on the bottom surface of the steel mesh.

4. The solder paste printing device according to claim 1, characterized in that: The scraper mechanism comprises a scraper frame, a push rod driving member, a push rod, a scraper driving member and a scraper body; the scraper frame is slidably mounted on the support frame along the Y direction; the Y-direction driving member is connected to the scraper frame and is used to drive the scraper frame to move along the Y direction; The push rod driving member is installed on the scraper frame and is used to drive the push rod to move along the Z direction, and the push rod is used to push the steel mesh to move in the Y direction slide groove; The scraper driving member is installed on the scraper frame and connected to the scraper body. The scraper body is used to print the solder paste on the steel mesh onto the circuit board.

5. The solder paste printing device according to claim 4, characterized in that: The scraper mechanism further includes a paste receiving assembly, which includes a paste receiving driving member, a support member, a first transfer arm, a second transfer arm, and a paste receiving shovel; the support member is mounted on the scraper frame, one end of the first transfer arm is hinged on the support member, and the other end of the first transfer arm is hinged on the paste receiving shovel; The second transfer arm comprises a first connecting arm and a second connecting arm obliquely connected to the first connecting arm, the paste receiving driving member is mounted on the scraper frame and connected to the first connecting arm, the connecting portion between the first connecting arm and the second connecting arm is hinged on the supporting member, the second connecting arm is hinged on the paste receiving shovel, and the second connecting arm is parallel to the first transfer arm; The paste receiving driving member is used to drive the paste receiving shovel to flip through the first connecting arm, so that the paste receiving shovel receives the solder paste dripping from the scraper body.

6. The solder paste printing device according to claim 1, characterized in that: The conveying mechanism comprises a sensing component, an automatic adjustment component and two conveying components arranged at intervals, wherein the conveying component comprises a support rail mounted on the base and a conveying assembly mounted on the support rail; the automatic adjustment component is connected to the support rail and is used to adjust the distance between the two conveying components; The sensing component comprises a sensing transmitter and a sensing receiver which are installed on the supporting guide rails at intervals. The sensing component is located between the two conveying components and is used to detect whether there is a blocking member between the two supporting guide rails.

7. The solder paste printing device according to claim 6, characterized in that: The conveying mechanism further comprises two clamping components, and the clamping components are mounted on the supporting rail in a one-to-one correspondence; The clamping component includes a clamping drive and a clamping plate installed at the output end of the clamping drive; the clamping drive is installed on the supporting guide rail and connected to the clamping plate, and is used to drive the clamping plate to clamp the circuit board on the workbench from opposite ends.

8. The solder paste printing device according to claim 1, characterized in that: The first Z-direction driving member includes a scissor drive member, two scissor assemblies, and a bottom plate installed on the base; the two scissor assemblies are installed between the bottom plate and the feeding table at intervals; The scissor assembly comprises a first support arm, a second support arm, a first roller mounted on the first support arm, and a second roller mounted on the second support arm; the middle portion of the first support arm is rotatably connected to the middle portion of the second support arm; the first roller abuts against the feeding table, and one end of the first support arm away from the first roller is rotatably mounted on the bottom plate; the second roller abuts against the bottom plate, and one end of the second support arm away from the second roller is rotatably mounted on the feeding table; The scissor drive is mounted on the first support arm and connected to the second support arm.

9. The solder paste printing device according to claim 1, characterized in that: The clamping mechanism includes a clamping frame, a visual camera and a clamping assembly both mounted on the clamping frame; the clamping assembly is slidably mounted on the support frame along the Y direction, and the Y-direction driving member is connected to the clamping frame; the clamping assembly is used to clamp the support pin.

10. The solder paste printing device according to claim 1, characterized in that: The solder paste printing device further includes a printing cover, which includes a cover door assembly, an opening and closing driving member, and a cover with an internal space; the base, the support frame, the conveying mechanism, the lifting mechanism, the feeding mechanism, the Y-axis driving member, the scraper mechanism, and the clamping mechanism are all installed in the internal space; The cover door assembly includes a display screen, a top plate and a door plate connected to the top plate, the top plate is perpendicular to the door plate, and the display screen is mounted on the outer surface of the door plate; the top of the outer cover is provided with a top through hole connected to the internal space, and the front or rear of the outer cover is provided with a door through hole connected to the internal space; One end of the top plate away from the door plate is rotatably connected to the side wall of the top through hole; the opening and closing driving member is installed on the inner wall of the internal space and connected to the door plate; the opening and closing driving member is used to drive the cover door assembly to rotate, so that the top plate closes the top through hole and the door plate closes the door through hole, or the door plate opens the door through hole; A first through hole is provided on the left side wall of the outer cover, and a second through hole is provided on the right side wall of the outer cover. The first through hole and the second through hole are located at opposite ends of the conveying mechanism.

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