PCBA board repair equipment

Abstract

The present invention provides a PCBA board repair device, which relates to the technical field of repair devices and includes a bottom plate, a gantry, a horizontal transfer mechanism, a second camera assembly, a solder dotting assembly, a solder scraping assembly, a defective component removal and mounting assembly, and a melting and welding assembly. The horizontal transfer mechanism is arranged on the bottom plate and includes a Y-direction, a first X-direction moving module, and a placement plate. On the placement plate, there are a carrier platform, a solder replenishing assembly, a qualified component placement table, and a first camera assembly. The second camera assembly, the solder dotting assembly, the solder scraping assembly, the defective component removal and mounting assembly, and the melting and welding assembly are arranged in sequence along the X-direction on the gantry. The second camera assembly identifies defective components, the suction nozzle of the defective component removal and mounting assembly removes the defective components, the solder scraping assembly scrapes the remaining solder paste flat, the solder dotting assembly replenishes the solder paste, and the laser of the melting and welding assembly heats and dissolves the solder paste and welds the qualified components, realizing full automation of the repair process and high repair efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of repair equipment, and particularly to a PCBA board repair equipment. Background Art

[0002] With the continuous development of electronic devices towards miniaturization and light weight, more dense and tiny electronic components, such as resistors, inductors or capacitors, etc., are encapsulated on the PCBA board. During the production and manufacturing process, when component abnormalities occur and repairs are required, the existing repair method is to manually operate a hot air blower and use hot air to heat and repair the components. The heating area of the hot air is large, which will have an adverse impact on the surrounding components of the components to be repaired, and accurate repair cannot be achieved. In addition, manual operation is time-consuming and laborious, and the repair efficiency is low. Summary of the Invention

[0003] The purpose of the present invention is to provide a PCBA board repair equipment, which realizes a fully automated process from removing to welding and replacing components with high density on the PCBA board.

[0004] To achieve the above object, the technical solution of the embodiment of the present invention is as follows:

[0005] A PCBA board repair equipment includes:

[0006] A bottom plate;

[0007] A gantry, provided above the bottom plate;

[0008] A horizontal transfer mechanism, provided on the bottom plate. The horizontal transfer mechanism includes a Y-direction moving module, a first X-direction moving module provided on the Y-direction moving module, and a placement plate provided on the first X-direction moving module. A carrier platform, a tin replenishing component, a qualified component placement table, and a first camera component are provided on the placement plate. A carrier is installed on the carrier platform, and a PCBA board to be repaired is placed in the carrier;

[0009] A second camera component, provided on the gantry, for identifying defective components to be repaired on the PCBA board;

[0010] A tin dotting component, a tin scraping component, a removal and mounting component, and a melting and welding component are all provided on the gantry. The second camera component, the tin dotting component, the tin scraping component, the removal and mounting component, and the melting and welding component are arranged in sequence along the X-direction on the gantry;

[0011] A distance sensor, provided on the gantry, for obtaining distance information between the distance sensor and the PCBA board to be repaired;

[0012] The solder replenishment component is used to store solder paste. The melting and soldering component is used to heat and dissolve the solder paste under the identified defective components. The pick-and-place removal component is used to pick up and remove the defective components. The solder scraping component is used to scrape flat the remaining solder paste on the soldering position of the PCBA board after the defective components are removed. The solder dispensing component is used to take out the solder paste from the solder replenishment component and supplement it to the soldering position after the defective components are removed.

[0013] The pick-and-place removal component is also used to pick up qualified components from the qualified component placement table and mount them to the soldering position after the defective components are removed. The first camera component is used to take pictures of the bottom of the qualified components before they are mounted, and confirm the mounting positions of the qualified components to be mounted to the soldering position after the defective components are removed. The melting and soldering component is also used to heat and solder the mounted qualified components.

[0014] Furthermore,

[0015] The second camera component includes a first Z-direction moving module and a second camera element arranged on the first Z-direction moving module. The second camera element is used to take pictures of the PCBA board moving below it under the drive of the first Z-direction moving module, and identify the defective components to be repaired on the PCBA board. The melting and soldering component includes a second X-direction moving module arranged on the gantry, a fifth Z-direction moving module arranged on the second X-direction moving module, and a laser arranged on the fifth Z-direction moving module. The laser is used to heat and dissolve the solder paste under the identified defective components under the drive of the second X-direction moving module and the fifth Z-direction moving module. The pick-and-place removal component includes a fourth Z-direction moving module and a suction nozzle arranged on the fourth Z-direction moving module. The suction nozzle is used to pick up and remove the defective components under the drive of the fourth Z-direction moving module. The solder scraping component includes a third Z-direction moving module and a solder scraping element arranged on the third Z-direction moving module. The solder scraping element is used to scrape flat the remaining solder paste on the soldering position of the PCBA board after the defective components are removed under the drive of the third Z-direction moving module. The solder dispensing component includes a second Z-direction moving module and a solder dispensing element arranged on the second Z-direction moving module. The solder dispensing element takes out the solder paste from the solder replenishment component and supplements it to the soldering position after the defective components are removed under the drive of the second Z-direction moving module. The suction nozzle is also used to pick up qualified components from the qualified component placement table and mount them to the soldering position after the defective components are removed under the drive of the fourth Z-direction moving module. The laser is also used to heat and solder the mounted qualified components.

[0016] Furthermore,

[0017] The suction nozzle is arranged along the Z direction, and the laser beam direction of the laser is set at an angle of 35 degrees with the suction nozzle.

[0018] Furthermore,

[0019] The vehicle platform is further provided with a positioning component for mounting and positioning the vehicle. The positioning component includes a pallet, an X-direction bar, a Y-direction bar, and a tightening block. The X-direction bar, Y-direction bar, and tightening block are all arranged on the pallet. The pallet is used to support the vehicle. A tightening screw is arranged in the tightening block, and the tightening screw is used to tighten the vehicle so that the adjacent two sides of the vehicle are tightly attached to the X-direction bar and Y-direction bar correspondingly.

[0020] Furthermore,

[0021] The vehicle platform further includes a driving motor. The driving shaft of the driving motor is arranged along the Z direction, and the pallet is arranged on the driving shaft of the driving motor. The driving motor is used to drive the pallet to rotate.

[0022] Furthermore,

[0023] The vehicle includes a base and a cover plate. Two mounting grooves are arranged in the base. The mounting grooves are used to place the PCBA board to be repaired, and the mounting depth of the mounting grooves is 0.1 mm lower than the thickness of the PCBA board to be repaired. Two clearance holes corresponding to the two mounting grooves are arranged on the cover plate. The contour of the orthographic projection of the clearance hole on the mounting groove is located within the mounting groove, and the distance between the contour of the orthographic projection and the groove wall of the mounting groove is 2 mm. Two positioning pins are further arranged on the base, and positioning holes corresponding to the two positioning pins one by one are arranged on the cover plate.

[0024] Furthermore,

[0025] The qualified component placement table is provided with a plurality of partition bars. The space between two adjacent partition bars is divided into a placement channel for placing qualified components. The cross section of the placement channel is arranged in an inverted T shape.

[0026] Furthermore,

[0027] The tin replenishing component includes a mounting plate, a rotating motor arranged on the mounting plate, a rotating disk arranged on the driving shaft of the rotating motor, and a scraping block arranged on the mounting plate. The rotating disk is provided with an annular groove for accommodating solder paste. The scraping block extends into the annular groove. A scraping paste arc-shaped groove is arranged in the scraping block. The center of the scraping paste arc-shaped groove coincides with the center of the rotating disk, and the size of the groove opening of the scraping paste arc-shaped groove gradually decreases along the rotating direction of the rotating disk.

[0028] Furthermore,

[0029] A defective product box for collecting the replaced defective components is further arranged on the mounting plate.

[0030] Further,

[0031] A sponge box for mounting a wet sponge is further provided on the mounting plate.

[0032] Compared with the prior art, the embodiments of the present invention at least have the following technical effects:

[0033] In the PCBA board repair device of the embodiment of the present invention, the horizontal transfer mechanism is arranged on the bottom plate. The horizontal transfer mechanism carries a carrier platform, a solder replenishment component, a qualified component placement table, and a first camera component. The second camera component, the solder dotting component, the solder scraping component, the removal and mounting component, and the melting and welding component are arranged in sequence along the X direction on the gantry. The horizontal transfer mechanism moves the PCBA board to be repaired on the carrier platform to a specified position. Then, the second camera component takes a picture of the PCBA board to accurately identify the position of the defective component. Subsequently, the laser heats and dissolves the solder paste under the defective component, and the suction nozzle sucks and removes it. After the solder scraping part scrapes the remaining solder paste on the welding position flat, the solder dotting part takes out the solder paste from the solder replenishment component and replenishes it to the welding position. Then the suction nozzle sucks a qualified component from the qualified component placement table, and the camera in the first camera component takes a picture of the bottom of the qualified component to confirm the mounting position of the qualified component. The suction nozzle then mounts the qualified component to the welding position after the defective component is removed. Finally, the laser heats and welds the mounted component. Based on the relative position settings of each mechanism, the mechanisms act in sequence, and the actions are coherent without conflict, realizing full automation of the repair process and high repair efficiency. Description of the Drawings

[0034] Figure 1 It is a schematic structural diagram in an embodiment;

[0035] Figure 2 It is a schematic structural diagram of the horizontal transfer mechanism in an embodiment;

[0036] Figure 3 It is a schematic structural diagram of the solder replenishment component in an embodiment;

[0037] Figure 4 It is a schematic structural diagram of the qualified component placement table in an embodiment;

[0038] Figure 5 It is a schematic structural diagram of the carrier platform in an embodiment;

[0039] Figure 6 It is a schematic structural diagram when the second camera component, the solder dotting component, the solder scraping component, the removal and mounting component, and the melting and welding component are arranged on the gantry in an embodiment.

[0040] Explanation of the Reference Numerals in the Drawings:

[0041] 10. Bottom plate;

[0042] 20. Gantry

[0043] 30. Horizontal transplanting mechanism; 31. Y-direction moving module; 32. First X-direction moving module; 33. Placing board; 34. Carrier platform; 340. Positioning component; 3400. Pallet; 3401. X-direction bar; 3402. Y-direction bar; 3403. Tightening block; 3404. Driving motor; 341. Carrier; 3410. Base; 3411. Installation groove; 3412. Cover plate; 3413. Clearance hole; 35. Solder replenishing component; 350. Mounting plate; 351. Rotary motor; 352. Rotary disk; 3520. Annular groove; 353. Scraping block; 3530. Scraping paste arc-shaped groove; 354. Defective product box; 355. Sponge box; 36. Qualified component placing table; 360. Partition bar; 361. Placing channel; 37. First camera component

[0044] 40. Second camera component; 41. First Z-direction moving module; 42. Second camera part

[0045] 50. Spot soldering component; 51. Second Z-direction moving module; 52. Spot soldering part

[0046] 60. Tin scraping component; 61. Third Z-direction moving module; 62. Tin scraping part

[0047] 70. Rejection and mounting component; 71. Fourth Z-direction moving module; 72. Suction nozzle

[0048] 80. Melting and welding component; 81. Fifth Z-direction moving module; 82. Laser

[0049] 90. Distance sensor Detailed implementation manners

[0050] The technical solution of the present invention will be further elaborated in detail below in conjunction with the specification drawings and specific embodiments. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. In the following description, the expression "some embodiments" is described, which describes a subset of all possible embodiments. However, it should be understood that "some embodiments" may be the same subset or different subsets of all possible embodiments, and may be combined with each other without conflict.

[0051] It should be further noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intervening element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element at the same time. The terms "vertical", "horizontal", "inner", "outer", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0052] Such as Figures 1-6As shown in the figure, in an embodiment of the present invention, a PCBA board repair device includes a bottom plate 10, a gantry 20, a horizontal transfer mechanism 30, a second camera assembly 40, a solder dotting assembly 50, a solder scraping assembly 60, a rejection and mounting assembly 70, and a melting and welding assembly 80. The gantry 20 is disposed above the bottom plate 10, and the horizontal transfer mechanism 30 is disposed on the bottom plate 10. The horizontal transfer mechanism 30 includes a Y-direction movement module 31, a first X-direction movement module 32 disposed on the Y-direction movement module 31, and a placement plate 33 disposed on the first X-direction movement module 32. A carrier platform 34, a solder replenishment assembly 35, a qualified component placement table 36, and a first camera assembly 37 are disposed on the placement plate 33. A carrier 341 is installed on the carrier platform 34, and a PCBA board to be repaired is placed in the carrier 341. The qualified component placement table 36 places qualified components to be mounted. The second camera assembly 40 is disposed on the gantry 20. The second camera assembly 40 includes a first Z-direction movement module 41 and a second camera member 42 disposed on the first Z-direction movement module 41. The second camera member 42 takes pictures of the PCBA board moving below it under the drive of the first Z-direction movement module 41 to identify and locate the defective components on the PCBA board. The solder dotting assembly 50 is disposed on the gantry 20. The solder dotting assembly 50 includes a second Z-direction movement module 51 and a solder dotting member 52 disposed on the second Z-direction movement module 51. The solder scraping assembly 60 is disposed on the gantry 20. The solder scraping assembly 60 includes a third Z-direction movement module 61 and a solder scraping member 62 disposed on the third Z-direction movement module 61. The rejection and mounting assembly 70 is disposed on the gantry 20. The rejection and mounting assembly 70 includes a fourth Z-direction movement module 71 and a suction nozzle 72 disposed on the fourth Z-direction movement module 71. The melting and welding assembly 80 is disposed on the gantry 20. The melting and welding assembly 80 includes a second X-direction movement module (not shown in the figure) disposed on the gantry, a fifth Z-direction movement module 81 disposed on the second X-direction movement module, and a laser 82 disposed on the fifth Z-direction movement module 81. The second camera assembly 40, the solder dotting assembly 50, the solder scraping assembly 60, the rejection and mounting assembly 70, and the melting and welding assembly 80 are arranged in sequence along the X-direction on the gantry 20. The solder replenishment assembly 35 stores solder paste. The laser 82 heats and dissolves the solder paste under the drive of the second X-direction movement module and the fifth Z-direction movement module 81 below the identified defective components. The suction nozzle 72 is used to suck and remove the defective components under the drive of the fourth Z-direction movement module 71. The solder scraping member 62 scrapes the remaining solder paste on the welding position of the PCBA board after the defective components are removed under the drive of the third Z-direction movement module 61. The solder dotting member 52 takes out the solder paste from the solder replenishment assembly 35 and replenishes it to the welding position after the defective components are removed under the drive of the second Z-direction movement module 51.The nozzle 72 sucks the qualified components from the qualified component placement table 36 under the drive of the fourth Z-direction moving module 71 and mounts them on the soldering position after the defective components are removed. The camera in the first camera assembly 37 takes pictures of the bottom of the qualified components before being mounted to confirm the mounting position of the qualified components on the soldering position after the defective components are removed. The laser 82 heats and solders the mounted qualified components. The horizontal transplanting mechanism 30, the second camera assembly 40, the tin-pointing assembly 50, the tin-scraping assembly 60, the removal and mounting assembly 70, and the melting and soldering assembly 80 act in the X, Y, and Z directions and cooperate with each other to complete the repair.

[0053] In the above technical solution, the second imaging component 40 can accurately capture the PCBA board that moves below it through the first Z-direction movement module 41. By using image recognition technology, it can quickly and accurately locate the defective components to be repaired on the PCBA board. This high-precision recognition ability avoids the errors that may occur in manual positioning, ensures that the subsequent repair operations can accurately act on the target position, improves the accuracy and reliability of the repair. The camera of the first imaging component 37 captures from the bottom of the qualified component before it is mounted, and can accurately confirm the mounting position of the qualified component. This dual imaging positioning mechanism greatly improves the mounting accuracy of the components and reduces problems such as mounting failure or poor soldering caused by position deviation. Each component is arranged in sequence along the X-direction on the gantry 20. This layout method enables the PCBA board to not need to be frequently moved to different devices or workstations during the repair process, greatly reducing the handling time and waiting time during the repair process. From the identification and removal of defective components, to the cleaning and tin replenishment of the soldering position, to the mounting and soldering of qualified components, each process in the entire repair process is continuous and does not conflict, significantly improving the repair efficiency. Each component is equipped with an independent Z-direction movement module, which can quickly and accurately reach the specified height for operation. For example, the laser 82 can quickly heat and dissolve the solder paste below the defective component under the drive of the fifth Z-direction movement module 81, and the suction nozzle 72 can quickly suck and remove the defective component under the drive of the fourth Z-direction movement module 71. This efficient motion control enables each repair step to be quickly completed, improving the overall repair speed. This device realizes full automation of the repair process. From the movement of the PCBA board, the identification and removal of defective components, the cleaning and tin replenishment of the soldering position, to the mounting and soldering of qualified components, all operations are automatically completed by the device without manual intervention. This not only reduces the errors and uncertainties brought by manual operations, but also avoids the fluctuations in production efficiency caused by human factors, and can ensure the stability and consistency of the repair quality. The automated repair device can run continuously for 24 hours, greatly improving the utilization rate and production efficiency of the device. Compared with the traditional manual repair method, this device can complete more repair tasks in the same time, effectively reducing the production cost and improving the production efficiency of the enterprise. The tin scraping component 60 can effectively scrape the remaining solder paste on the soldering position of the PCBA board after the defective component is removed, avoiding the influence of the residual solder paste on the subsequent mounting and soldering, and ensuring the cleanliness and flatness of the soldering position. The tin spotting component 50 takes an appropriate amount of solder paste from the tin replenishment component 35 and replenishes it to the soldering position, ensuring the sufficiency and uniform distribution of the solder paste on the soldering position. The laser 82 heats and solders the qualified component to be mounted. This heating method can accurately control the soldering temperature and time, enabling the solder paste to melt and solidify under the best conditions, thereby ensuring the quality of the solder joints.Laser heating also has the advantages of concentrated heat and little impact on surrounding components, avoiding the thermal damage problems that may occur in traditional heating methods, and further improving the welding quality. The device uses a camera component to identify and position the PCBA board and components, and can adapt to PCBA boards and components of different sizes and shapes. Regardless of how the size of the PCBA board changes, as long as it is within the processing range of the device, the device can accurately identify and position it through the camera component, and then complete the repair operation according to the preset program. The solder replenishment component 35 stores solder paste, and the dispensing component 50 can accurately take out an appropriate amount of solder paste for replenishment according to the requirements of different welding positions. This flexible solder replenishment method enables the device to adapt to various welding requirements and improves the versatility and adaptability of the device. The PCBA board repair device also includes a distance sensor 90, which is arranged on the gantry 20. The distance sensor 90 is used to obtain the distance information between the distance sensor 90 and the PCBA board to be repaired. The distance sensor 90 is arranged on the gantry 20 and is used to obtain the distance information between the distance sensor 90 and the PCBA board to be repaired in real time. This design can ensure that tools such as the nozzle 72 and the laser 82 always maintain the optimal height position during operation, avoiding poor contact or damage to the PCBA board caused by height errors. Through precise height control, the device can achieve more stable and reliable repair operations. The real-time monitoring function of the distance sensor 90 enables the device to automatically adjust the heights of tools such as the nozzle 72 and the laser 82 according to the actual height of the PCBA board. This automatic height adjustment function not only improves the operation accuracy but also reduces the need for manual intervention, further enhancing the automation level and operation efficiency of the device.

[0054] Such as Figures 1-6As shown, in an embodiment of the present invention, the vehicle platform 34 is further provided with a positioning component 340 for mounting and positioning the vehicle 341. The positioning component 340 includes a pallet 3400, an X-direction stop bar 3401, a Y-direction stop bar 3402, and a tightening block 3403. The X-direction stop bar 3401, the Y-direction stop bar 3402, and the tightening block 3403 are all arranged on the pallet 3400. The pallet 3400 is used to support the vehicle 341. A tightening screw is arranged inside the tightening block 3403. After the tightening screw tightens the vehicle 341, the adjacent two sides of the vehicle 341 are correspondingly pressed against the X-direction stop bar 3401 and the Y-direction stop bar 3402. Through the cooperation of the X-direction stop bar 3401, the Y-direction stop bar 3402, and the tightening block 3403, the vehicle 341 can be accurately positioned and fixed on the pallet 3400. The X-direction stop bar 3401 and the Y-direction stop bar 3402 respectively limit the movement of the vehicle 341 in the X-direction and the Y-direction, ensuring the accurate position of the vehicle 341 in the horizontal direction. This positioning method can effectively avoid the repair error caused by the position deviation of the vehicle 341 during the repair process, and improve the accuracy and quality of the repair. The tightening screw inside the tightening block 3403 can perform a tightening operation on the vehicle 341, so that the adjacent two sides of the vehicle 341 are correspondingly pressed against the X-direction stop bar 3401 and the Y-direction stop bar 3402. This tightening method can significantly enhance the stability of the vehicle 341 during the repair process, preventing the vehicle 341 from loosening or shifting due to vibration or other external forces during the operation of the equipment, thus ensuring the smooth progress of the repair operation. The design of the positioning component 340 makes the installation and disassembly process of the vehicle 341 more convenient. The pallet 3400 is used to support the vehicle 341, and the operation of the tightening screw is simple and fast. Just tighten or loosen it to complete the fixing or release of the vehicle 341. This design greatly reduces the time required for the installation and disassembly of the vehicle 341, improves the operation efficiency of the equipment, especially in the case where the vehicle 341 needs to be frequently replaced, and can significantly improve the production efficiency. The present positioning component 340 is applicable to vehicles 341 of different sizes and shapes. As long as the size of the vehicle 341 is within the bearing range of the pallet 3400, by adjusting the positions of the X-direction stop bar 3401 and the Y-direction stop bar 3402 and the tightening degree of the tightening screw, the stable positioning of the vehicle 341 can be achieved. This good adaptability enables the equipment to meet diverse production requirements, without the need to frequently replace the positioning device due to changes in the vehicle 341, further improving the versatility and flexibility of the equipment. The tightening method of the tightening screw can provide a stable clamping force and is not easy to loosen during the operation of the equipment. This stable tightening effect helps to extend the service life of the equipment, reduce equipment failures caused by component loosening or shifting, and improve the long-term operation stability and reliability of the equipment.

[0055] As Figures 1-6As shown, in an embodiment of the present invention, the vehicle platform 34 further includes a driving motor 3404. The driving shaft of the driving motor 3404 is arranged along the Z direction. The pallet 3400 is disposed on the driving shaft of the driving motor 3404. The driving motor 3404 is used to drive the pallet 3400 to rotate. The driving shaft of the driving motor 3404 is arranged along the Z direction, and the pallet 3400 is mounted thereon. Through the rotation of the driving motor 3404, the flexible rotation of the vehicle 341 and the PCBA board thereon can be achieved. This design enables the PCBA board to be quickly adjusted to any required angle, so as to better cooperate with the various components of the repair equipment for operation. For example, when the second camera assembly 40 takes pictures and identifies defective components on the PCBA board, the driving motor 3404 can quickly adjust the PCBA board to the optimal shooting angle, improving the accuracy and efficiency of identification. When the pick-and-place assembly 70 removes defective components by sucking and removing them, the rotation function can ensure that the suction nozzle 72 can accurately align with the defective components, reducing operation errors caused by angle deviation. During the mounting process of qualified components, the driving motor 3404 can adjust the PCBA board to an angle that perfectly matches the mounting position of the qualified components, thus ensuring the accuracy and reliability of mounting. In addition, this rotation function can also reduce the time and labor costs required for manually adjusting the angle of the PCBA board, further improving the automation degree and overall efficiency of the repair process. Through the precise control of the driving motor 3404, the equipment can achieve more flexible, efficient and accurate repair operations, significantly improving the repair quality and production efficiency.

[0056] As Figures 1-6As shown, in an embodiment of the present invention, the vehicle 341 includes a base 3410 and a cover plate 3412. Two installation grooves 3411 are provided in the base 3410 for placing the PCBA board to be repaired. The installation depth of the installation groove 3411 is 0.1 mm lower than the thickness of the PCBA board to be repaired. Two clearance holes 3413 corresponding to the two installation grooves 3411 are provided on the cover plate 3412. The contour of the orthographic projection of the clearance hole 3413 on the installation groove 3411 is located within the installation groove 3411, and the distance between the contour of the orthographic projection and the groove wall of the installation groove 3411 is 2 mm. The base 3410 is further provided with two positioning pins, and the cover plate 3412 is provided with positioning holes corresponding to the two positioning pins one by one. The two installation grooves 3411 in the base 3410 can accommodate two PCBA boards to be repaired at the same time, significantly improving the production efficiency of the equipment, so that two PCBA boards can be processed simultaneously in one repair operation. The installation depth of the installation groove 3411 is 0.1 mm lower than the thickness of the PCBA board, and the PCBA board can protrude from the installation groove 3411. In addition, a magnet is provided between the base 3410 and the cover plate 3412. Through the above solution, it is ensured that the PCBA board can be stably placed in the installation groove 3411. The clearance holes 3413 on the cover plate 3412 correspond to the installation grooves 3411, and the contour of the orthographic projection of the clearance hole 3413 is located within the installation groove 3411, with a distance of 2 mm from the groove wall. It not only provides enough space for the repair operation, but also ensures that the cover plate 3412 can closely cover and press the PCBA board by means of magnetic attraction, preventing it from being contaminated or damaged by the outside during the repair process. The design of the clearance holes 3413 also allows tools of the repair equipment (such as the suction nozzle 72, the soldering tip 52, etc.) to accurately contact specific positions on the PCBA board without being interfered by the cover plate 3412, thereby improving the flexibility and accuracy of the repair operation.

[0057] As Figures 1-6 shown, in an embodiment of the present invention, the qualified component placement table 36 is provided with a plurality of partition strips 360. The space between adjacent two partition strips 360 is partitioned into a placement channel 361 for placing qualified components. The cross-section of the placement channel 361 is in an inverted T shape. The design of the inverted T-shaped cross-section enables the placement channel 361 to have sufficient space in the vertical direction, facilitating the insertion and removal of components. At the same time, it can be closely arranged in the horizontal direction, improving the space utilization rate of the placement table.

[0058] As Figures 1-6As shown, in an embodiment of the present invention, the solder replenishing assembly 35 includes a mounting plate 350, a rotating motor 351 disposed on the mounting plate 350, a rotating disk 352 disposed on the drive shaft of the rotating motor 351, and a scraping block 353 disposed on the mounting plate 350. The rotating disk 352 is provided with an annular groove 3520 for accommodating solder paste. The scraping block 353 extends into the annular groove 3520. A scraping paste arc-shaped groove 3530 is provided in the scraping block 353. The center of the scraping paste arc-shaped groove 3530 coincides with the center of the rotating disk 352, and the size of the notch of the scraping paste arc-shaped groove 3530 gradually decreases along the rotation direction of the rotating disk 352. The solder replenishing assembly 35 drives the rotating disk 352 to rotate through the rotating motor 351, and uses the scraping paste arc-shaped groove 3530 in the scraping block 353 to evenly scrape the solder paste in the annular groove 3520. It can ensure that the solder paste is accurately distributed during rotation and always maintains a flat surface. The center of the scraping paste arc-shaped groove 3530 coincides with the center of the rotating disk 352, and the notch size decreases along the rotation direction. This structure enables the solder paste to be gradually compacted and flattened during rotation, thereby providing a uniform and stable solder paste supply during solder replenishment.

[0059] As Figures 1-6 shown, in an embodiment of the present invention, a defective product box 354 for collecting replaced defective components is further provided on the mounting plate 350. The setting of the defective product box 354 enables the repair equipment to simultaneously complete the removal and collection of defective products without an additional collection device, thereby simplifying the structure of the production line and reducing the equipment complexity.

[0060] As Figures 1-6 shown, in an embodiment of the present invention, a sponge box 355 for installing a wet sponge is further provided on the mounting plate 350. By wiping the solder point part 52 on the wet sponge, the cleanliness of the solder point part 52 is maintained, and further the accuracy of the supplementary soldering amount of the solder point part is ensured.

[0061] As Figures 1-6 shown, in an embodiment of the present invention, the suction nozzle 72 is arranged along the Z direction, and the included angle A between the laser beam direction of the laser 82 and the suction nozzle 72 is 35 degrees. The 35-degree included angle enables the laser beam to evenly heat the solder paste around the welding point, avoiding welding defects caused by uneven heating. It can ensure that the solder paste at the welding point melts and solidifies at the optimal temperature, thereby improving the welding quality and reliability. Through the setting of the 35-degree included angle, the laser 82 and the suction nozzle 72 can operate independently in the same working area without affecting each other. It not only improves the space utilization rate of the equipment but also enhances the operation flexibility, making the repair process more efficient.

[0062] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention. The protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A PCBA board repair device, characterized in that, Comprising: Base plate; Gantry, arranged above the base plate; Horizontal transplanting mechanism, arranged on the base plate, the horizontal transplanting mechanism includes a Y-direction moving module, a first X-direction moving module arranged on the Y-direction moving module, and a placement plate arranged on the first X-direction moving module. A carrier platform, a solder replenishing component, a qualified component placement table, and a first camera component are arranged on the placement plate. A carrier is installed on the carrier platform, and a PCBA board to be repaired is placed in the carrier; Second camera component, arranged on the gantry, for identifying defective components to be repaired on the PCBA board; The solder dotting component, the solder scraping component, the pick-and-place component for removing defective components, and the melting and welding component are all arranged on the gantry. The second camera component, the solder dotting component, the solder scraping component, the pick-and-place component for removing defective components, and the melting and welding component are arranged in sequence along the X-direction on the gantry; Distance sensor, the distance sensor is arranged on the gantry and is used to obtain the distance information between the distance sensor and the PCBA board to be repaired; The solder replenishing component is used to store solder paste, the melting and welding component is used to heat and dissolve the solder paste under the identified defective component, the pick-and-place component for removing defective components is used to suck and remove the defective component, the solder scraping component is used to scrape the remaining solder paste on the welding position of the PCBA board after the defective component is removed, the solder dotting component is used to take out the solder paste from the solder replenishing component and supplement it to the welding position after the defective component is removed, the pick-and-place component for removing defective components is also used to suck the qualified component from the qualified component placement table and mount it to the welding position after the defective component is removed, the first camera component is used to take a picture from the bottom of the qualified component before it is mounted to confirm the mounting position of the qualified component on the welding position after the defective component is removed, and the melting and welding component is also used to heat and weld the mounted qualified component; The solder replenishing component includes a mounting plate, a rotating motor arranged on the mounting plate, a rotating disk arranged on the driving shaft of the rotating motor, and a scraping block arranged on the mounting plate. The rotating disk is provided with an annular groove for accommodating solder paste. The scraping block extends into the annular groove. A scraping paste arc groove is arranged in the scraping block. The center of the scraping paste arc groove coincides with the center of the rotating disk, and the size of the notch of the scraping paste arc groove gradually decreases along the rotation direction of the rotating disk.

2. The PCBA board repair device according to claim 1, characterized in that, The second camera assembly includes a first Z-direction moving module and a second camera member disposed on the first Z-direction moving module. The second camera member is configured to photograph the PCBA board that moves below it under the drive of the first Z-direction moving module, and identify defective components to be repaired on the PCBA board. The melting and soldering assembly includes a second X-direction moving module disposed on the gantry, a fifth Z-direction moving module disposed on the second X-direction moving module, and a laser disposed on the fifth Z-direction moving module. The laser is configured to heat and dissolve the solder paste below the identified defective components under the drive of the second X-direction moving module and the fifth Z-direction moving module. The removing and mounting assembly includes a fourth Z-direction moving module and a suction nozzle disposed on the fourth Z-direction moving module. The suction nozzle is configured to suck and remove the defective components under the drive of the fourth Z-direction moving module. The solder scraping assembly includes a third Z-direction moving module and a solder scraping member disposed on the third Z-direction moving module. The solder scraping member is configured to scrape the remaining solder paste on the welding position of the PCBA board after the defective components are removed under the drive of the third Z-direction moving module. The solder dotting assembly includes a second Z-direction moving module and a solder dotting member disposed on the second Z-direction moving module. The solder dotting member is configured to take out the solder paste from the solder replenishing assembly and supplement it to the welding position after the defective components are removed under the drive of the second Z-direction moving module. The suction nozzle is also configured to suck the qualified components from the qualified component placement table and mount them to the welding position after the defective components are removed under the drive of the fourth Z-direction moving module. The laser is also configured to heat and weld the mounted qualified components.

3. The PCBA board repair equipment according to claim 2, characterized in that, The suction nozzle is arranged along the Z direction, and the laser beam direction of the laser is set at an angle of 35 degrees with the suction nozzle.

4. The PCBA board repair device according to claim 1, wherein, The carrier platform is further provided with a positioning assembly for mounting and positioning the carrier. The positioning assembly includes a support plate, an X-direction stop bar, a Y-direction stop bar, and a clamping block. The X-direction stop bar, the Y-direction stop bar, and the clamping block are all disposed on the support plate. The support plate is configured to support the carrier. The clamping block is provided with a clamping screw, and the clamping screw is configured to clamp the carrier so that the adjacent two sides of the carrier are in corresponding tight contact with the X-direction stop bar and the Y-direction stop bar.

5. The PCBA board repair equipment according to claim 4, characterized in that, The carrier platform further includes a driving motor. The driving shaft of the driving motor is arranged along the Z direction, and the support plate is disposed on the driving shaft of the driving motor. The driving motor is configured to drive the support plate to rotate.

6. The PCBA board repair equipment according to claim 1, characterized in that, The carrier includes a base and a cover plate. Two mounting grooves are provided in the base. The mounting grooves are configured to place the PCBA board to be repaired, and the mounting depth of the mounting grooves is 0.1 mm lower than the thickness of the PCBA board to be repaired. Two clearance holes corresponding to the two mounting grooves are provided on the cover plate. The contour of the orthographic projection of the clearance hole on the mounting groove is located within the mounting groove, and the distance between the contour of the orthographic projection and the groove wall of the mounting groove is 2 mm. Two positioning pins are further provided on the base, and positioning holes corresponding to the two positioning pins are provided on the cover plate.

7. The PCBA board repair equipment according to claim 1, characterized in that, The qualified component placement table is provided with a plurality of partition bars, and a placement channel for placing qualified components is partitioned between two adjacent partition bars. The cross-section of the placement channel is arranged in an inverted T shape.

8. The PCBA board repair equipment according to claim 1, characterized in that, The mounting plate is further provided with a defective product box for collecting the replaced defective components.

9. The PCBA board repair equipment according to claim 1, characterized in that The mounting plate is further provided with a sponge box for mounting a wet sponge.

Images