Manufacturing process of high-performance inner-layer ultra-thick copper circuit board

Abstract

The invention relates to the technical field of circuit board processing, in particular to a manufacturing process of a high-performance inner-layer ultra-thick copper circuit board which comprises a bearing table, a back plate and the like. A back plate is arranged on the bearing table. Printing ink is stored through the storage box, the situation that printing ink is not evenly printed due to printing ink diffusion is avoided, and the printing ink printing effect of equipment is improved; through the structure that the middle of the flow dividing rod is high and the two sides of the flow dividing rod are low, ink is slowly collected into the storage box along the flow dividing rod in cooperation with flowability of the ink, the problem that the ink utilization rate is low is solved, and meanwhile the situation that the ink is accumulated and hardened for a long time is avoided. The circuit board is ejected upwards through the ejector rod, then a worker can hold the lower side of the circuit board with hands to take out the circuit board, and the circuit board is prevented from being damaged while the worker conducts discharging conveniently. And the circuit board is accurately placed on the upper side of the fixing frame through cooperation of a guide plate and a limiting block, so that feeding by workers is more convenient.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and particularly to a manufacturing process for a high-performance inner-layer ultra-thick copper circuit board. Background Art

[0002] In screen printing, a special screen plate is pressed against the surface of the circuit board, and then ink is smeared on the surface of the screen plate, so that the ink adheres to the surface of the circuit board through the mesh holes of the screen plate. Existing methods of storing ink are to spread it on the side of the screen plate without holes, and then scrape the ink with a squeegee for printing. However, due to the fluidity of the ink itself, during the lifting and lowering process of the screen plate, the ink will spread irregularly on the surface of the screen plate, resulting in uneven thickness of the ink printed on the circuit board during the process of scraping the ink with the squeegee, thereby reducing the production quality. At the same time, during the ink scraping process, two ink tracks will remain on both sides of the squeegee, and the remaining ink cannot be contacted by the squeegee, resulting in the gradual accumulation of ink on the surface of the screen plate, reducing the utilization rate of the ink. At the same time, the long-term accumulated ink is prone to caking when contacting the air, making it more difficult to clean the screen plate subsequently. Summary of the Invention

[0003] In order to overcome the disadvantages that the ink spreads irregularly on the surface of the screen plate, resulting in uneven thickness of the ink printed on the circuit board, low utilization rate of the remaining ink, and easy caking and difficult cleaning when contacting the air, the present invention provides a manufacturing process for a high-performance inner-layer ultra-thick copper circuit board.

[0004] The technical implementation scheme of the present invention is: a manufacturing process for a high-performance inner-layer ultra-thick copper circuit board, which is characterized by including the following steps: S1: Substrate preparation: Cut the circuit board substrate of the whole board through a cutting device, and cut out the same specification size according to production requirements; S2: Image transfer: Closely attach the dry film to the surface of the circuit board by hot pressing; S3: Etching: Immerse the circuit board in the etching solution to remove the exposed copper layer, thereby forming a circuit pattern; S4: Drilling: Use a device to open through holes on the circuit board to enable the copper layers between the circuit board layers to be interconnected; S5: Solder mask layer production: After covering the surface of the circuit board through a screen printing device, scrape the ink on the screen, and the ink penetrates through the mesh holes of the screen into the designated area of the circuit board, and forms a solder mask layer after curing treatment; S6: Shaping: Cut the outer shape of the circuit board through a cutting device according to the final size requirements of the circuit board.

[0005] The screen printing equipment described in the manufacturing process S5 includes a carrier table, a back plate, a screen plate, and a feeding component; a back plate is arranged on the carrier table; a feeding component is installed on the back plate; a screen plate is installed on the feeding component; it also includes a sealing cover, a storage box, a fixing frame, and an adjusting component; a sealing cover for preventing dust from contaminating the ink is installed on the carrier table; a cover plate is arranged on the sealing cover; several elastic covers are arranged on the sealing cover, and the elastic covers are made of elastic fabric material; several storage boxes for preventing ink diffusion are arranged on the screen plate; a push plate is slidably connected in each storage box; the push plate is connected to the lower side of the storage box through a spring; a fixing frame is installed on the upper side of the carrier table; several protruding parts are arranged on the fixing frame; an adjusting component is installed inside the carrier table.

[0006] More preferably, the feeding component includes an electric slide rail, a slider, a first electric push rod, a second electric push rod, and a scraper; the electric slide rail is fixedly connected to the front side of the back plate; the slider is slidably connected to the electric slide rail; several first electric push rods are fixedly connected to the front side of the slider through a connecting rod; the telescopic end of each first electric push rod is fixedly connected to the adjacent elastic cover; a scraper is fixedly connected to the lower side of each first electric push rod; several second electric push rods are fixedly connected to the front side of the back plate; the telescopic ends of several second electric push rods are jointly fixedly connected to the screen plate.

[0007] More preferably, it further includes a flow dividing rod; a flow dividing rod for preventing ink residue is fixedly connected to both the front side and the rear side of the screen plate; each flow dividing rod is arranged with a higher middle part and lower sides; a hole is opened on one side of each storage box facing the flow dividing rod, and each hole is communicated with the upper side of the adjacent flow dividing rod.

[0008] More preferably, it further includes a top rod; a top rod for facilitating the worker to take out the circuit board is slidably connected to the fixing frame.

[0009] More preferably, several turning plates for preventing ink overflow are rotatably connected in each storage box through torsion springs; convex blocks are arranged on the push plate, and each convex block contacts the lower side of the adjacent turning plate; each turning plate is located at the hole opened in the storage box.

[0010] More preferably, a shielding block for preventing the ink from drying up is arranged on each scraper.

[0011] More preferably, it further includes a guiding plate; a guiding plate for assisting the worker to position the circuit board is slidably connected to the fixing frame.

[0012] More preferably, it further includes a limiting block; several limiting blocks for adapting to different sizes of circuit boards are slidably connected to the front side of the guiding plate; each limiting block is connected to the guiding plate through a spring.

[0013] More preferably, it further includes a roller; a roller for facilitating the cleaning of ink is rotatably connected inside the guiding plate, and the roller is made of sponge material.

[0014] Beneficial effects: The present invention realizes the storage of ink through a storage box, avoiding the uneven ink printing caused by ink diffusion and improving the ink printing effect of the equipment; Through the structure of the shunt rod with a high middle and low sides on both sides, combined with the fluidity of the ink itself, the ink slowly collects along the shunt rod into the storage box, thus solving the problem of low ink utilization rate and avoiding the situation of long-term ink accumulation and caking; The circuit board is lifted upward by the ejector rod, and then the worker can hold the lower side of the circuit board by hand and take it out, which is convenient for the worker to unload the material and avoids damaging the circuit board at the same time; The circuit board is accurately placed on the upper side of the fixed frame through the cooperation of the guiding plate and the limiting block, making it more convenient for the worker to load the material. Brief description of the drawings

[0015] Figure 1 It is a three-dimensional structure schematic diagram of the present invention; Figure 2 It is a state diagram of the cover plate of the present invention in the raised state; Figure 3 It is a combined cross-sectional view of the carrier table and the sealing cover of the present invention; Figure 4 It is an exploded view of the screen plate, the storage box and the fixed frame of the present invention; Figure 5 It is a cross-sectional view of the storage box of the present invention; Figure 6 It is a three-dimensional structure schematic diagram of the ejector rod of the present invention; Figure 7 It is a combined three-dimensional structure schematic diagram of the guiding plate and the limiting block of the present invention; Figure 8 It is a three-dimensional structure schematic diagram of the roller of the present invention.

[0016] The marks in the figure are: 1 - carrier table, 2 - back plate, 3 - sealing cover, 3001 - cover plate, 3002 - elastic cover, 4 - screen plate, 5 - storage box, 5001 - push plate, 5002 - rotating plate, 101 - electric slide rail, 102 - slider, 103 - first electric push rod, 104 - second electric push rod, 105 - scraper, 10501 - blocking block, 106 - ejector rod, 107 - fixed frame, 10701 - protruding part, 108 - shunt rod, 201 - guiding plate, 202 - limiting block, 203 - roller. Detailed implementation manners

[0017] The present invention will be further described below in conjunction with the embodiments shown in the drawings.

[0018] Embodiment 1 A manufacturing process for a high-performance inner-layer ultra-thick copper circuit board, characterized by comprising the following steps: S1: Substrate Preparation: Cut the circuit board substrate of the whole board using a cutting device, and cut out the same-sized specifications according to production requirements; S2: Image Transfer: Closely attach the dry film to the surface of the circuit board by means of hot pressing; S3: Etching: Immerse the circuit board in the etching solution to remove the exposed copper layer, thereby forming a circuit pattern; S4: Drilling: Use a device to open through holes on the circuit board so that the circuit board layers can be interconnected with copper attachment between layers; S5: Solder Mask Layer Production: After covering the surface of the circuit board with a screen printing device, scrape the ink on the screen, and the ink penetrates through the mesh holes of the screen into the designated area of the circuit board, and forms a solder mask layer after curing treatment; S6: Shaping: Cut the shape of the circuit board according to the final size requirements of the circuit board using a cutting device.

[0019] As Figures 1 - 6 shown, the screen printing device described in the manufacturing process S5 includes a carrier table 1, a back plate 2, a screen plate 4, and a loading component; a back plate 2 is arranged on the carrier table 1; a loading component is installed on the back plate 2; a screen plate 4 is installed on the loading component; It also includes a sealing cover 3, a storage box 5, a fixing frame 107, and an adjusting component; a sealing cover 3 is installed on the carrier table 1; a cover plate 3001 is arranged on the sealing cover 3; two elastic covers 3002 are arranged on the sealing cover 3, and the elastic cover 3002 is made of elastic cloth material; two storage boxes 5 are arranged on the screen plate 4; a push plate 5001 is slidably connected in each storage box 5; the push plate 5001 is connected to the lower side of the storage box 5 through a spring; a fixing frame 107 is installed on the upper side of the carrier table 1; a plurality of protruding parts 10701 are arranged on the fixing frame 107; an adjusting component is installed in the carrier table 1.

[0020] The loading component includes an electric slide rail 101, a slider 102, a first electric push rod 103, a second electric push rod 104, and a scraper 105; the electric slide rail 101 is fixedly connected to the front side of the back plate 2; the slider 102 is slidably connected to the electric slide rail 101; two first electric push rods 103 are fixedly connected to the front side of the slider 102 through a connecting rod; the telescopic end of each first electric push rod 103 is fixedly connected to the adjacent elastic cover 3002; a scraper 105 is fixedly connected to the lower side of each first electric push rod 103; two second electric push rods 104 are fixedly connected to the front side of the back plate 2; the telescopic ends of the two second electric push rods 104 are jointly fixedly connected to the screen plate 4.

[0021] It also includes a shunt rod 108; a shunt rod 108 is fixedly connected to the front side and the rear side of the screen plate 4; each shunt rod 108 is set to be high in the middle and low on both sides; a hole is opened on one side of each storage box 5 facing the shunt rod 108, and each hole is communicated with the upper side of the adjacent shunt rod 108.

[0022] The fixing frame 107 further includes a push rod 106 ; the push rod 106 is slidably connected to the fixing frame 107 .

[0023] Each storage box 5 is rotatably connected to a plurality of rotating plates 5002 via a torsion spring; a protrusion is provided on the push plate 5001 , and each of the protrusions contacts the lower side of the adjacent rotating plate 5002 ; each rotating plate 5002 is located at a hole opened in the storage box 5 .

[0024] A shielding block 10501 is provided on each scraper 105 .

[0025] Before screen printing the circuit board, in order to avoid the influence of external dust on the ink quality, a sealing cover 3 is set on the carrier table 1 to mask and seal the processing area, reducing the risk of dust contaminating the ink. When the circuit board needs to be placed, the worker first lifts the cover plate 3001, then places the circuit board on the fixing frame 107 for calibration, closes the cover plate 3001, then the worker pours the ink on the left side of the screen plate 4, and then controls all the second electric push rods 104 on the back plate 2 to move downward, so that the second electric push rods 104 drive the screen plate 4 to fit on the upper side of the fixing frame 107, clamping the circuit board between the screen plate 4 and the fixing frame 107. Then, the electric slide rail 101 is started to drive the slider 102 to move to the left, thereby driving all the first electric push rods 103 and the squeegee 105 to move to the upper left of the screen plate 4. During this process, by compressing and stretching the elastic cover 3002, the first electric push rod 103 can also seal the processing area through the elastic cover 3002, the cover plate 3001 and the sealing cover 3 during movement, avoiding the ink being contaminated by dust. Then, control the first electric push rod 103 to extend downward, thereby pushing the squeegee 105 to contact the ink on the left side of the screen plate 4. Then, start the electric slide rail 101 again to drive the slider 102 to slide to the right at a uniform speed, so that the squeegee 105 pushes the ink from the left side of the screen plate 4 to the right side, and the ink can penetrate through the mesh holes on the screen plate 4 onto the circuit board, while the ink intercepted by the screen plate 4 stays on the surface of the screen plate 4, thereby accurately applying the ink to the specified position on the circuit board through the mesh holes of the screen plate 4. During the process of applying the ink, considering that the ink is only placed in the non-porous area on the left side of the screen plate 4, during the lowering and rising of the screen plate 4, the fluidity of the ink itself will cause it to spread on the screen plate 4, which will cause the ink to be difficult to concentrate in the application area, and then the ink printed on the surface of the circuit board will be uneven in thickness, thus affecting the production quality. Therefore, storage boxes 5 are arranged on the left and right sides of the screen plate 4, and the ink is stored in the storage boxes 5 to avoid the ink from spreading during non-use or the lifting and lowering of the screen plate 4. When the ink needs to be used, only control the second electric push rod 104 to extend, driving the screen plate 4 and the storage box 5 to move downward, so that the push plate 5001 contacts the protrusion 10701 on the fixing frame 107. Then, the screen plate 4 continues to move downward, and at this time, the push plate 5001 is restricted by the protrusion 10701 and cannot continue to move downward, so that the push plate 5001 moves upward relative to the storage box 5, thereby stretching the spring between the push plate 5001 and the storage box 5, thus pushing the ink stored in the storage box 5 upward. When the ink liquid level is higher than the upper side of the storage box 5, it overflows on the upper side of the screen plate 4. At this time, the screen plate 4 also clamps the circuit board on the fixing frame 107, and then the ink can be printed through the squeegee 105. By using the storage box 5, the situation of uneven ink printing caused by ink diffusion is avoided, improving the ink printing effect of the equipment. When the screen plate 4 rises and resets, the push plate 5001 drives the push plate 5001 back to the initial position under the reset of the spring.

[0026] In the process of scraping the ink by the scraper 105, it is considered that two ink tracks are likely to be left on the front and rear sides of the scraper 105 during the movement of the scraper 105. The scraper 105 cannot scrape off the two remaining ink tracks during the scraping process or the resetting process. After multiple screen printings, the two ink tracks on the screen 4 are gradually accumulated, which leads to a significant reduction in the ink utilization rate. At the same time, it is easy to cause the ink to dry and be difficult to clean over a long period of time. Therefore, a diverter rod 108 is arranged on the front and rear sides of the screen 4 so that the front and rear distance of the screen 4 is the same as the length of the scraper 105. When two ink tracks are left on the screen 4 during the scraping process of the scraper 105, since the length of the scraper 105 is the same as the front and rear distance of the screen 4, the remaining ink flows directly to the diverter rod 108. The structure of the diverter rod 108 with a high middle part and low sides is utilized, and the ink itself The fluidity causes the ink to slowly flow along the left and right sides of the diverter rod 108 to the storage box 5, and the ink on the diverter rod 108 is collected into the storage box 5 by using the holes opened in the storage box 5, thereby solving the problem of low ink utilization rate and avoiding the long-term accumulation and hardening of ink. Furthermore, in order to prevent the ink in the storage box 5 from overflowing from the holes, a rotating plate 5002 is provided in the storage box 5, and the ink liquid level in the storage box 5 is lower than the lower side of the rotating plate 5002, thereby preventing the ink from overflowing from the holes opened in the storage box 5. At the same time, when the push plate 5001 pushes the ink to move upward, based on the view from front to back, the rotating plate 5002 is pushed clockwise by the protrusion on the push plate 5001, thereby blocking the hole opened in the storage box 5, and then the ink overflows normally from the upper side of the storage box 5, thereby preventing the ink from flowing to the diverter rod 108.

[0027] It is also taken into consideration that the circuit board needs to fit tightly with the fixed frame 107 to avoid ink printing deviation caused by the unevenness of the circuit board during printing. When the worker needs to take the circuit board, the circuit board that fits tightly on the surface of the fixed frame 107 requires the worker to press the side of the circuit board, and then lift one side of the circuit board and remove the whole. In this process, the worker presses the more fragile position of the side of the circuit board, which can easily cause damage to the circuit board, and the force applied by the worker to the circuit board is difficult to control, which can easily cause damage to the circuit board. Therefore, when the worker needs to take out the circuit board, he can hold the push rod 106 and move it upward, and then use the push rod 106 to lift the circuit board upward. It should be noted that the push rod 106 only contacts the four corners of the circuit board, and then after the circuit board is lifted for a distance, the worker can hold the bottom of the circuit board to take it out, which is convenient for the worker to unload the material while avoiding damage to the circuit board.

[0028] When the ink is not in use, in order to prevent the ink on the squeegee 105 and the storage box 5 from drying up, the electric slide rail 101 is controlled to drive the slider 102 to move above the left storage box 5, thereby driving the first electric push rod 103 and the squeegee 105 to move above the storage box 5. Subsequently, the first electric push rod 103 is controlled to extend downward so that the squeegee 105 is immersed in the storage box 5. Then, the upper side of the storage box 5 is sealed by the shielding block 10501, thereby preventing external air from entering the storage box 5. By immersing the squeegee 105 in the storage box 5, the ink on the squeegee 105 is prevented from caking. At the same time, the shielding block 10501 is used to block air from entering the storage box 5, so that the ink can be prevented from caking during long-term storage.

[0029] Embodiment 2 Based on Embodiment 1, as Figure 1 、 Figure 7 and Figure 8 shown, it further includes a guide plate 201; the guide plate 201 is slidably connected to the fixed frame 107.

[0030] It further includes a limiting block 202; two limiting blocks 202 are slidably connected to the front side of the guide plate 201; each limiting block 202 is connected to the guide plate 201 through a spring.

[0031] It further includes a roller 203; the roller 203 is rotatably connected to the guide plate 201, and the roller 203 is made of sponge material.

[0032] During the process of placing the circuit board on the fixed frame 107, it is necessary to ensure that the coated area of the circuit board corresponds to the holes of the stencil 4 up and down. At this time, the worker needs to manually calibrate the position of the circuit board, and the whole process is relatively cumbersome. Therefore, a guide plate 201 is provided on the fixed frame 107. The worker only needs to pull the two limiting blocks 202 to move away from each other, so that the distance between the two limiting blocks 202 gradually increases, thereby compressing the springs between the limiting blocks 202 and the guide plate 201. Then, the worker presses the circuit board against the guide plate 201 and releases the limiting blocks 202. Under the action of the spring reset, the limiting blocks 202 are pushed to abut against the left and right sides of the circuit board, thereby fixing the circuit board. Finally, the worker holds the circuit board and pushes the guide plate 201 backward. When the guide plate 201 moves to the rear side of the fixed frame 107, that is, the circuit board is accurately placed on the upper side of the fixed frame 107 under the restriction of the guide plate 201 and the limiting blocks 202. At this time, by pressing the stencil 4 on the surface of the circuit board, the calibration of the holes of the circuit board and the stencil 4 is completed, making it more convenient for the worker to load materials. At the same time, during the process of pulling out the circuit board, the circuit board drives the limiting blocks 202 and the guide plate 201 to be pulled out. After unloading the circuit board, the new circuit board is calibrated and loaded. At the same time, the distance between the two limiting blocks 202 can be adjusted to adapt to circuit boards of different sizes, improving the self-adaptability of the equipment.

[0033] It is also considered that when the stencil 4 is used for ink printing multiple times, the ink at the holes of the stencil 4 is likely to drip onto the upper side of the fixed frame 107 that remains, and the lower side of the circuit board will be contaminated when the circuit board is placed. Therefore, during the feeding process of the worker, while pushing the guiding plate 201 to move backward, the roller 203 is also synchronously driven to move backward, so that the roller 203 rolls on the upper side of the fixed frame 107. The sponge material used for the roller 203 is used to adsorb the residual ink on the upper side of the fixed frame 107. It should be noted that: since the stencil 4 is relatively thin as a whole and the aperture of the mesh holes is relatively small as a whole, that is, the content of the ink cleaned is less, the small amount of residual ink on the upper side of the fixed frame 107 can be cleaned by the roller 203.

[0034] Although the present invention has been described in detail with reference to the above embodiments, it is obvious to those skilled in the art from this disclosure that various changes or modifications can be made to the present invention without departing from the principle and spirit scope of the present invention defined by the claims. Therefore, the detailed description of the embodiments of this disclosure is only used to explain, rather than to limit the present invention, and the scope of protection is defined by the content of the claims.

Claims

1. A process for manufacturing a high-performance inner layer ultra-thick copper circuit board, characterized in that: The steps include: S1: Substrate preparation: Cut the entire board of circuit board substrate through cutting equipment and cut it into the same size according to production requirements; S2: Image transfer: The dry film is tightly attached to the surface of the circuit board by heat pressing; S3: Etching: Immerse the circuit board in etching solution to remove the exposed copper layer, thereby forming a circuit pattern; S4: Drilling: Use equipment to open through holes on the circuit board so that the layers of the circuit board can be connected with each other by copper; S5: Production of solder mask: After covering the surface of the circuit board with screen printing equipment, the ink is scraped on the screen, and the ink penetrates into the designated area of ​​the circuit board through the mesh of the screen, and the solder mask is formed after curing; S6: Molding: According to the final size requirements of the circuit board, the circuit board shape is cut by cutting equipment.

2. A process for manufacturing a high-performance inner layer ultra-thick copper circuit board according to claim 1, characterized in that: The screen printing device described in the manufacturing process S5 comprises a carrier platform (1), a back plate (2), a screen plate (4) and a feeding assembly; the carrier platform (1) is provided with a back plate (2); the feeding assembly is mounted on the back plate (2); the screen plate (4) is mounted on the feeding assembly; the device also comprises a sealing cover (3), a storage box (5), a fixing frame (107) and an adjustment assembly; the carrier platform (1) is provided with a sealing cover (3) for preventing dust from contaminating the ink; the sealing cover (3) is provided with a cover plate (3001); the sealing cover (3) is provided with a cover plate (3002); the sealing cover (3) is provided with a cover plate (3003); the sealing cover (3) is provided with a cover plate (3004); the sealing cover (3) is provided with a cover plate (3005). A plurality of elastic covers (3002) are provided, and the elastic covers (3002) are made of elastic cloth; a plurality of storage boxes (5) for preventing ink diffusion are provided on the screen plate (4); a push plate (5001) is slidably connected in each storage box (5); the push plate (5001) is connected to the lower side of the storage box (5) via a spring; a fixing frame (107) is installed on the upper side of the bearing platform (1); a plurality of protrusions (10701) are provided on the fixing frame (107); and an adjustment component is installed in the bearing platform (1).

3. A process for manufacturing a high-performance inner layer ultra-thick copper circuit board according to claim 2, characterized in that: The loading assembly comprises an electric slide rail (101), a slider (102), a first electric push rod (103), a second electric push rod (104) and a scraper (105); the electric slide rail (101) is fixedly connected to the front side of the back plate (2); the slider (102) is slidably connected to the electric slide rail (101); a plurality of first electric push rods (103) are fixedly connected to the front side of the slider (102) via a connecting rod; the telescopic end of each first electric push rod (103) is fixedly connected to an adjacent elastic cover (3002); a scraper (105) is fixedly connected to the lower side of each first electric push rod (103); a plurality of second electric push rods (104) are fixedly connected to the front side of the back plate (2); and the telescopic ends of the plurality of second electric push rods (104) are fixedly connected to the mesh plate (4).

4. A process for manufacturing a high-performance inner layer ultra-thick copper circuit board according to claim 3, characterized in that: It also includes a diverter rod (108); a diverter rod (108) is fixedly connected to the front and rear sides of the screen plate (4) to prevent ink residue; each diverter rod (108) is arranged to be high in the middle and low on both sides; each storage box (5) is provided with a hole on one side facing the diverter rod (108), and each hole is connected to the upper side of an adjacent diverter rod (108).

5. The manufacturing process of a high-performance inner layer ultra-thick copper circuit board according to claim 2 is characterized by: It also includes a push rod (106); the fixed frame (107) is slidably connected to the push rod (106) for workers to take out the circuit board.

6. A process for manufacturing a high-performance inner layer ultra-thick copper circuit board according to claim 4, characterized in that: Each storage box (5) is rotatably connected to a plurality of rotating plates (5002) for preventing ink from overflowing via a torsion spring; a protrusion is provided on the push plate (5001), and each protrusion is in contact with the lower side of an adjacent rotating plate (5002); and each rotating plate (5002) is located at a hole opened in the storage box (5).

7. A process for manufacturing a high-performance inner layer ultra-thick copper circuit board according to claim 3, characterized in that: Each scraper (105) is provided with a shielding block (10501) for preventing the ink from drying up.

8. A process for manufacturing a high-performance inner layer ultra-thick copper circuit board according to claim 5, characterized in that: It also includes a guide plate (201); the fixed frame (107) is slidably connected to the guide plate (201) for assisting workers in positioning the circuit board.

9. A process for manufacturing a high-performance inner layer ultra-thick copper circuit board according to claim 8, characterized in that: It also includes a limit block (202); a plurality of limit blocks (202) adapted to circuit boards of different sizes are slidably connected to the front side of the guide plate (201); each limit block (202) is connected to the guide plate (201) via a spring.

10. A process for manufacturing a high-performance inner layer ultra-thick copper circuit board according to claim 9, characterized in that: It also includes a roller (203); the roller (203) is rotatably connected inside the guide plate (201) for facilitating cleaning of ink, and the roller (203) is made of sponge material.

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