Copper plate liquid cooling heat dissipation power module

Abstract

The invention provides a copper plate liquid cooling heat dissipation power module, and relates to the technical field of power semiconductors, the copper plate liquid cooling heat dissipation power module comprises a radiator, a power module body is fixed on the front surface of the radiator, and an exchange pump is fixed on the back surface of the radiator; a cooling liquid cavity for containing cooling liquid is formed in the exchange pump, cooling liquid channels communicated with the cooling liquid cavity are formed in the power module body, the radiator and the exchange pump, and the exchange pump pumps the cooling liquid into the power module body from the cooling liquid cavity through the cooling liquid channels for heat dissipation. The heat dissipation device has the advantages that cooling liquid is driven by the exchange pump to circularly flow, an active heat dissipation mode is adopted, and the heat dissipation efficiency can be greatly improved. An original power module is improved, cooling liquid is directly injected into the power module body through the exchange pump and the cooling liquid channel, and heat dissipation is better facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of power semiconductors, and particularly to a copper plate liquid-cooled heat dissipation power module. Background Art

[0002] As a core component in modern electronic devices, the efficient and stable operation of power modules is crucial for the performance of the entire system. However, during operation, these modules generate a large amount of heat energy due to the high-speed operation of internal electronic components. If this heat is not timely and effectively dissipated, the module temperature will rise sharply, which will seriously threaten its stability and reliability. A long-term high-temperature working environment will not only reduce the working efficiency of power modules and accelerate their aging process, but may also directly cause module damage, trigger system failures, and result in incalculable losses in severe cases.

[0003] In the current market, for the heat dissipation problem of power modules, the mainstream solutions mainly focus on natural convection heat dissipation technology. Natural convection heat dissipation is a passive heat dissipation method that relies on the natural flow of air to carry away heat. Its advantages are simple structure, relatively low cost, and no additional energy consumption. However, the effect of this heat dissipation method is often limited by environmental conditions, such as factors like air flow velocity and temperature gradient, resulting in limited heat dissipation efficiency and difficulty in meeting the increasing heat dissipation requirements of high-power density modules.

[0004] In contrast, liquid-cooled heat dissipation technology, as another advanced solution, can more effectively remove heat from power modules by utilizing the high thermal conductivity of liquids (such as water, ethylene glycol, etc.). Liquid-cooled systems usually include key components such as circulation pumps, radiators, and coolant, and can achieve rapid heat transfer and dissipation. Nevertheless, the existing liquid-cooled solutions are not perfect. Due to uneven liquid distribution or unreasonable flow path design, the heat dissipation effect may be uneven, with too high temperature in some areas, affecting the heat dissipation efficiency and possibly causing local thermal stress damage to the module.

[0005] In view of the limitations of the above two heat dissipation solutions, it is particularly urgent to develop a new, efficient, and economical heat dissipation structure for power modules. Summary of the Invention

[0006] Aiming at the problems existing in the prior art, the present invention provides a copper plate liquid-cooled heat dissipation power module, including:

[0007] A radiator, on the front of which a power module body is fixed, and on the back of which an exchange pump is fixed;

[0008] The exchange pump is provided with a coolant chamber for containing coolant. The power module body, the radiator and the exchange pump are provided with coolant channels communicating with the coolant chamber. The exchange pump pumps the coolant from the coolant chamber through the coolant channels into the power module body for heat dissipation.

[0009] Preferably, a first round hole is provided on the back surface of the power module body, a second round hole penetrating through the radiator is provided on the radiator, and a third round hole is provided on the front surface of the exchange pump;

[0010] The positions of the first round hole, the second round hole and the third round hole correspond to each other, forming a coolant channel communicating the power module body and the coolant chamber.

[0011] Preferably, the upper cover plate of the power module body is provided with an opening for inserting PIN pins, and an adhesive layer is attached to the inner wall of the opening.

[0012] Preferably, an adhesive layer is attached to the contact portion between the upper cover plate of the power module body and the power board.

[0013] Preferably, fins are provided on the back surface of the radiator, and a slot for placing the exchange pump is provided in the middle area of the fins.

[0014] Preferably, fins are provided on the back surface of the exchange pump.

[0015] Preferably, a coolant injection hole communicating with the coolant chamber is provided on the back surface of the exchange pump.

[0016] Preferably, a motor is provided in the exchange pump, and rollers are provided in the coolant chamber, and the motor drives the rollers to rotate.

[0017] Preferably, a heat dissipation silicone grease is applied to the contact surface between the radiator and the power module.

[0018] Preferably, a heat dissipation silicone grease is applied to the contact surface between the exchange pump and the radiator.

[0019] The above technical solutions have the following advantages or beneficial effects:

[0020] 1. By driving the coolant to circulate through the exchange pump, it is an active heat dissipation method, which can greatly improve the heat dissipation efficiency.

[0021] 2. In the existing technical solutions, the liquid cooling heat dissipation solution does not inject the coolant into the power module. In the present invention, the original power module is improved, and the coolant is directly injected into the interior of the power module body through the exchange pump and the coolant channel, which is more conducive to heat dissipation. Description of the Drawings

[0022] Figure 1In a preferred embodiment of the present invention, an exploded view of a copper plate liquid-cooled heat dissipation power module;

[0023] Figure 2 In a preferred embodiment of the present invention, a sectional view of a copper plate liquid-cooled heat dissipation power module;

[0024] Figure 3 In a preferred embodiment of the present invention, a top view of the power module body;

[0025] Figure 4 In a preferred embodiment of the present invention, a bottom view of the power module body;

[0026] Figure 5 In a preferred embodiment of the present invention, a structural schematic diagram of the radiator;

[0027] Figure 6 In a preferred embodiment of the present invention, a structural schematic diagram of the exchange pump. Detailed implementation manners

[0028] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. The present invention is not limited to this embodiment, and other embodiments may also fall within the scope of the present invention as long as they conform to the gist of the present invention.

[0029] In a preferred embodiment of the present invention, in view of the above problems existing in the prior art, a copper plate liquid-cooled heat dissipation power module is provided, as Figure 1 - Figure 2 shown, including:

[0030] A radiator 1, with a power module body 2 fixed to the front of the radiator 1, and an exchange pump 3 fixed to the back of the radiator 1;

[0031] The exchange pump 3 is provided with a coolant chamber 31 for accommodating the coolant. Coolant channels 4 communicating with the coolant chamber are provided on the power module body 2, the radiator 1, and the exchange pump 3. The exchange pump 3 pumps the coolant from the coolant chamber 31 through the coolant channels 4 into the power module body 2 for heat dissipation.

[0032] Specifically, in this embodiment, liquid-cooled heat dissipation is adopted. By driving the coolant (preferably fluorinated liquid in this embodiment) to circulate through the exchange pump 3, it is an active heat dissipation method, which can greatly improve the heat dissipation efficiency. And in the prior art solutions, the liquid-cooled heat dissipation solution does not inject the coolant into the power module. In this embodiment, the original power module is improved, and the fluorinated liquid is directly injected into the interior of the power module body 2 through the exchange pump 3 and the coolant channels 4, which is more conducive to heat dissipation.

[0033] In a preferred embodiment of the present invention, a first round hole 41 is provided on the back surface of the power module body, a second round hole 42 penetrating the radiator is provided on the radiator, and a third round hole 43 is provided on the front surface of the exchange pump;

[0034] The first round hole 41, the second round hole 42 and the third round hole 43 are in corresponding positions, forming a coolant channel 4 that connects the power module body 1 and the coolant chamber 31.

[0035] Specifically, as Figure 4 - Figure 6 shown, the first round hole 41, the second round hole 42 and the third round hole 43 with corresponding positions are successively formed on the power module body, the radiator and the exchange pump to form a coolant channel 4 connecting the coolant chamber, for circulating the coolant (preferably using a fluorinated liquid in this embodiment) between the power module body 1 and the coolant chamber 31 for heat dissipation.

[0036] There are two groups of cooling channels 4. The flow direction of the coolant in one group is from the power module body 1 to the coolant chamber, and the flow direction of the coolant in the other group is from the coolant chamber to the power module body 1 to enable the coolant to circulate.

[0037] In a preferred embodiment of the present invention, as Figure 3 shown, the upper cover plate 21 of the power module body 2 is provided with an opening 22 for inserting PIN pins, and an adhesive layer is attached to the inner wall of the opening.

[0038] In a preferred embodiment of the present invention, an adhesive layer is attached to the contact portion between the upper cover plate 21 and the power board 23 of the power module body 2.

[0039] Specifically, in this power module body 2, it includes an upper cover plate 21 and a power board 23. A plurality of electronic components are provided on the power board 23. A certain accommodation space is formed between the upper cover plate 21 and the power board 23 to enable the coolant to contact and exchange heat with the electronic components. The upper cover plate 21 is subjected to special sealing treatment. A soft adhesive layer is attached to the inner wall of the opening 22 so that after the PIN pin is inserted, it is in close contact with the hole wall to prevent liquid leakage. A soft adhesive layer is also attached around the upper cover plate 21 for the purpose of fitting with the power board 23 to prevent liquid leakage.

[0040] In a preferred embodiment of the present invention, fins 11 are provided on the back surface of the radiator 1, and a slot 12 for placing the exchange pump is provided in the middle area of the fins 11.

[0041] Specifically, the radiator 1 in this embodiment is made of all aluminum. Fins 11 are provided on the radiator 1 to increase the heat dissipation area and improve the heat dissipation efficiency, and a slot 12 is also opened to place the exchange pump 3.

[0042] In a preferred embodiment of the present invention, fins 32 are provided on the back surface of the exchange pump 3.

[0043] Specifically, the exchange pump 3 in this embodiment is made of copper. Fins 32 are provided on the exchange pump 3 to increase the heat dissipation area and improve the heat dissipation efficiency.

[0044] In a preferred embodiment of the present invention, a coolant injection hole 33 communicating with the coolant chamber 31 is provided on the back of the exchange pump 3.

[0045] In a preferred embodiment of the present invention, a motor is provided in the exchange pump 3, and a roller 34 is provided in the coolant chamber. The motor drives the roller 34 to rotate.

[0046] Specifically, in this embodiment, a fluorinated liquid is added to the coolant chamber 31 from the coolant injection hole 33 of the exchange pump 3, and then the injection hole is sealed with a rubber plug. The external power supply is connected to make the motor work, driving the internal roller 34 to rotate, and thus the fluorinated liquid can be driven to circulate.

[0047] In a preferred embodiment of the present invention, heat dissipation silicone grease is applied to the contact surface between the radiator 1 and the power module 2.

[0048] In a preferred embodiment of the present invention, heat dissipation silicone grease is applied to the contact surface between the exchange pump 3 and the radiator 1.

[0049] Specifically, in this embodiment, heat dissipation silicone grease is evenly applied to the contact surfaces between the various components to make the heat conduction efficiency higher.

[0050] During use, first attach the improved power module body 2 to the radiator 1. Heat dissipation silicone grease is evenly applied between the radiator 1 and the power module body 2 to make the heat conduction efficiency between the radiator 1 and the power module body 2 higher. Then place the exchange pump 3 in the middle groove 12 of the radiator 1. Heat dissipation silicone grease is also evenly applied between the exchange pump 3 and the radiator 1. After placement, place a screw through the mounting hole 24 on the front of the power module body 2, pass through the radiator 2, and lock it to the exchange pump 3 to tightly connect the three together. After connection, add a coolant (preferably a fluorinated liquid in this embodiment) from the coolant injection hole 33 of the exchange pump 3, and then seal the coolant injection hole 33 with a rubber plug. Connect the external power supply to make the motor work, driving the internal roller 34 to rotate, and thus the fluorinated liquid can be driven to circulate between the power module body 1 and the coolant chamber 31 for heat dissipation.

[0051] The above are only preferred embodiments of the present invention, and thus do not limit the implementation manners and protection scope of the present invention. For those skilled in the art, it should be realized that all equivalent replacements and obvious changes made by using the content of this specification and the drawings should be included in the protection scope of the present invention.

Claims

1. A copper plate liquid cooling power module, characterized in that: include: A radiator, wherein a power module body is fixed on the front side of the radiator, and an exchange pump is fixed on the back side of the radiator; The exchange pump is provided with a cooling liquid cavity for containing cooling liquid, the power module body, the radiator and the exchange pump are provided with a cooling liquid channel connected with the cooling liquid cavity, and the exchange pump pumps the cooling liquid from the cooling liquid cavity through the cooling liquid channel into the power module body for heat dissipation.

2. The copper plate liquid cooling power module according to claim 1 is characterized in that: A first circular hole is provided on the back of the power module body, a second circular hole penetrating the radiator is provided on the radiator, and a third circular hole is provided on the front of the exchange pump; The first circular hole, the second circular hole and the third circular hole are located in corresponding positions to form a cooling liquid channel connecting the power module body and the cooling liquid cavity.

3. The copper plate liquid cooling power module according to claim 1 is characterized in that: The upper cover plate of the power module body is provided with an opening for inserting a PIN needle, and an adhesive layer is attached to the inner wall of the opening.

4. The copper plate liquid cooling power module according to claim 1, characterized in that: An adhesive layer is attached to the contact portion between the upper cover plate of the power module body and the power board.

5. The copper plate liquid cooling power module according to claim 1, characterized in that: The back side of the radiator is provided with fins, and the middle area of ​​the fins is provided with a slot for placing the exchange pump.

6. The copper plate liquid cooling power module according to claim 1, characterized in that: The back side of the exchange pump is provided with fins.

7. The copper plate liquid cooling power module according to claim 1, characterized in that: A coolant injection hole communicating with the coolant cavity is provided on the back of the exchange pump.

8. The copper plate liquid cooling power module according to claim 1, characterized in that: A motor is arranged in the exchange pump, a roller is arranged in the cooling liquid cavity, and the motor drives the roller to rotate.

9. The copper plate liquid cooling power module according to claim 1, characterized in that: The contact surface between the heat sink and the power module is coated with heat dissipation silicone grease.

10. The copper plate liquid cooling power module according to claim 1, characterized in that: The contact surface between the exchange pump and the radiator is coated with heat dissipation silicone grease.

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