Immersion Liquid Cooling Device and Electronic Equipment

Abstract

The present application discloses an immersion liquid cooling device and an electronic device, relating to the technical field of heat dissipation, including a housing main body, a cover body and a pressing mechanism. The housing main body and the cover body form a closed accommodation cavity for accommodating a coolant and having at least one space suitable for installing electronic components to be cooled; the pressing mechanism is arranged on a surface of the cover body close to the accommodation cavity and at a position corresponding to the space. When the cover body closes the accommodation cavity, the pressing mechanism corresponding to the installation position abuts against the top of the electronic component to be cooled and can also be clamped on both sides in the thickness direction thereof, which can solve the technical problem of limiting the vertical position and the horizontal position of the electronic component to be cooled respectively in one operation. Moreover, since the assembly of the pressing mechanism and the electronic component to be cooled is realized synchronously with the closed state of the cover body, there is no need for a separate assembly process, and thus, the technical effect of improving the operation convenience can be achieved.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation, and particularly to an immersion liquid cooling device and an electronic device. Background Art

[0002] Immersion liquid cooling devices are widely used in the heat dissipation field of electronic devices. It includes a housing, and a sealed accommodation cavity is arranged inside the housing. Electronic components to be cooled are arranged in this accommodation cavity, and there is an insulating coolant, so that the electronic components to be cooled are immersed in the coolant, thereby taking away at least part of the heat of the electronic components to be cooled to achieve a heat dissipation effect. However, currently, the electronic components to be cooled are generally fixed in the accommodation cavity through connection structures such as screws and bolts. Therefore, there are problems of inconvenient operation when installing and removing the electronic components to be cooled.

[0003] To solve the above deficiencies, some immersion liquid cooling devices adopt quick-release mechanisms such as buckles and pins, and set them between the side of the electronic components to be cooled and the main body of the housing. However, since the connection position of the quick-release mechanism is on the side of the server main body and is at a position relatively close to the bottom of the accommodation cavity, there is still the deficiency of being difficult to operate. Summary of the Invention

[0004] In view of the above problems in the background art, this application provides an immersion liquid cooling device and an electronic device to at least solve the problem of inconvenient operation in the related art.

[0005] This application provides an immersion liquid cooling device, including: a housing, including a main body of the housing; a cover body, which is detachably arranged on the main body of the housing, and the main body of the housing and the cover body form a closed accommodation cavity, the accommodation cavity is used to hold the coolant, and has at least one space suitable for installing electronic components to be cooled; a pressing mechanism, arranged on the side of the cover body close to the accommodation cavity and at a position corresponding to the space; wherein, when the cover body is in the closed state, the pressing mechanism is configured to abut against the top of the electronic component to be cooled and clamp on both sides of the electronic component to be cooled along the thickness direction of the electronic component to be cooled, and when the cover body is in the open state, it disengages from the electronic component to be cooled.

[0006] This application also provides an electronic device, including: an immersion liquid cooling device, the main body of the housing of the immersion liquid cooling device defines an accommodation cavity, and there is a space in the accommodation cavity; electronic components to be cooled, detachably arranged in the space; wherein, the electronic components to be cooled include at least one of a computing node, a switching node, and a storage node.

[0007] Based on the above-mentioned immersion liquid cooling device and electronic device, the cover is movably disposed on the housing body, and the pressing mechanism is disposed on the cover. When the cover is in a closed state, it abuts against the top of the electronic component to be cooled, thereby pressing down the electronic component to be cooled to limit the vertical position of the electronic component to be cooled. Moreover, since the pressing mechanism also clamps both sides of the electronic component to be cooled in the thickness direction, the horizontal position of the electronic component to be cooled can also be limited. In this way, the assembly position of the pressing mechanism and the electronic component to be cooled is located at the top of the electronic component to be cooled, which is beneficial to observing the relative position between the pressing mechanism and the electronic component to be cooled. Moreover, since the assembly of the pressing mechanism and the electronic component to be cooled is synchronized with the closed state of the cover and no separate assembly process is required, the operation convenience can be effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] To more clearly illustrate the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0009] Figure 1 is a perspective view of the immersion liquid cooling device according to the embodiment of the present application;

[0010] Figure 2 is a usage state diagram of the cover of the immersion liquid cooling device according to the embodiment of the present application in a closed state;

[0011] Figure 3 is a perspective view of the pressing mechanism according to the present application;

[0012] Figure 4 is Figure 3 a perspective view of the pressing mechanism shown with a part of the pressing portion hidden;

[0013] Figure 5 is a partial cross-sectional view of the housing body of the immersion liquid cooling device according to the present application along the horizontal direction;

[0014] Figure 6 is an enlarged view of the first card seat according to the present application;

[0015] Figure 7 is an enlarged view of the second card seat according to the present application;

[0016] Figure 8 is a perspective view of the first card seat, the second card seat, the limiting mechanism and a part of the lifting mechanism according to the present application;

[0017] Figure 9 is a perspective view of the electronic component to be cooled according to the present application;

[0018] Figure 10 Is a perspective view of another part of the lifting mechanism of this application;

[0019] Figure 11 Is Figure 9 A perspective view of another angle of the electronic component to be heat-dissipated shown;

[0020] Figure 12 Is a partial enlarged view of the fourth actuating part of this application.

[0021] Among them, the above-mentioned drawings include the following reference numerals:

[0022] 100, Immersion liquid cooling device;

[0023] 101, Housing main body; 1011, First side plate; 1012, Second side plate; 1013, Bottom plate; 1014, Second sliding groove; 1015, Guide groove;

[0024] 102, Cover body;

[0025] 103, Pressing mechanism; 1031, Mounting part; 10311, First plate-shaped part; 10312, First sleeve; 1032, Pressing part; 10321, Second sleeve; 10322, First block-shaped part; 10323, Gasket; 1033, Clamping part; 10331, First end; 10332, Second end; 1034, First connecting rod; 1035, Elastic part;

[0026] 104, First pipe body;

[0027] 105, Second pipe body;

[0028] 106, Accommodating cavity;

[0029] 107, First card seat; 1071, First through hole;

[0030] 108, Second card seat; 1081, First sliding groove;

[0031] 109, Limiting mechanism; 1091, Locking part; 10911, First locking end; 1092, First actuating part; 10921, Screw sleeve; 10922, Threaded rod; 109221, First section; 109222, Second section; 10923, Second connecting rod; 10924, Handle end;

[0032] 110. Jacking mechanism; 1101. Second plate-shaped member; 11011. First connecting portion; 1102. Second actuating portion; 11021. First lead screw; 11022. First lead nut; 11023. First gear; 11024. Second gear; 11025. First motor; 1103. Third actuating portion; 11031. Second lead screw; 11032. Second lead nut; 11033. Guide block; 11034. Second motor; 1104. Cylinder; 1105. Bracket;

[0033] 111. Fourth actuating portion; 1111. Third connecting rod; 1112. Third lead nut; 1113. Third lead screw; 1114. Third motor;

[0034] 200. Electronic component to be cooled; 201. Second locking end; 202. Second connecting portion. Detailed implementation manner

[0035] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.

[0036] It should be noted that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. The terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. The terms "parallel", "perpendicular", "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, and the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, and the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of any one of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0037] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0038] Figure 1 It is a perspective view of the immersion liquid cooling device according to an embodiment of the present application. Figure 2 It is a usage state diagram of the cover body of the immersion liquid cooling device according to an embodiment of the present application in a closed state.

[0039] The present application provides an immersion liquid cooling device, such as Figure 1 and Figure 2As shown in the figure, it includes a housing and a pressing mechanism 103. The housing includes a housing main body 101 and a cover body 102. The cover body 102 is movably arranged on the housing main body 101. The housing main body 101 and the cover body 102 form a closed accommodation cavity 106 for accommodating a coolant and having at least one space suitable for installing the electronic component 200 to be cooled. The pressing mechanism 103 is arranged on the side of the cover body 102 close to the accommodation cavity 106 and at a position corresponding to the space. Among them, when the cover body 102 is in a closed state, the pressing mechanism 103 is configured to abut against the top of the electronic component 200 to be cooled and clamp both sides of the electronic component 200 to be cooled along the thickness direction of the electronic component 200 to be cooled. When the cover body 102 is in an open state, it disengages from the electronic component 200 to be cooled.

[0040] It should be noted that the pressing mechanism 103 being located at a position corresponding to the installation of the electronic component 200 to be cooled means that when the cover body 102 is in a closed state, the pressing mechanism 103 is exactly above a space for installing the electronic component 200 to be cooled, so as to abut against the top of the electronic component 200 to be cooled located in this space and clamp both sides of the electronic component 200 to be cooled.

[0041] In some exemplary embodiments, the electronic component 200 to be cooled includes, but is not limited to, at least one of a computing node, a switching node, and a storage node.

[0042] The computing node includes, but is not limited to, a combination of at least a part of a processor, a memory, an accelerator, a storage device, and a network interface card. Of course, it may also include other electronic components for processing compute-intensive tasks.

[0043] The switching node includes, but is not limited to, a local area network switch, a wide area network switch, and other electronic components for data transmission and switching in a network.

[0044] The storage node includes, but is not limited to, a large-capacity hard disk, a solid-state drive, and other electronic components for storing and managing data. It should be understood that the embodiments of the present application are not limited thereto.

[0045] For example, the above-mentioned immersion liquid cooling device can be applied to high-power servers (such as a single CPU exceeding 1000W, and / or the overall power of a server cabinet reaching more than 30kW), optical module devices, battery devices and their components (such as blade batteries and battery modules formed by blade batteries), communication base stations, and other high-power device heat dissipation scenarios.

[0046] In some exemplary embodiments, such as Figure 1 and Figure 2As shown, the housing main body 101 includes but is not limited to a structure configured to be generally a rectangular parallelepiped, specifically including a bottom plate 1013 at the bottom, and a first side plate 1011 and a second side plate 1012 orthogonal to the bottom plate 1013. The portion surrounded by the bottom plate 1013, the first side plate 1011, and the second side plate 1012 forms a receiving cavity 106 with an opening at the upper part. The cover body 102 is detachably provided at the opening position of the housing main body 101 and has a Figure 1 shown open state and a Figure 2 shown closed state. Among them, when the cover body 102 is in the open state, the electronic components 200 to be cooled can be loaded into the receiving cavity 106 through the opening, or the electronic components 200 to be cooled can be removed from the receiving cavity 106 through the opening; when the cover body 102 is in the closed state, the receiving cavity 106 is closed to prevent the coolant from overflowing through the opening. Among them, the above-mentioned coolant is an insulating liquid, specifically including but not limited to dielectric oil, fluorinated liquid, water-based coolant (such as a mixture of ethylene glycol and propylene glycol), and other coolants suitable for immersion liquid cooling devices.

[0047] As Figure 1 and Figure 2 shown, based on the housing main body 101 with the above-mentioned rectangular parallelepiped structure, it has a length direction (X direction), a width direction (Y direction), and a height direction (Z direction). Specifically, a plurality of spaces are uniformly arranged in the receiving cavity 106 along the length direction (X direction) of the housing main body 101 to arrange a plurality of electronic components 200 to be cooled. Further, the electronic components 200 to be cooled are also configured to be generally a rectangular parallelepiped structure, and the thickness direction of the electronic components 200 to be cooled is parallel to the length direction of the housing main body 101. On this basis, unless otherwise specified, the length direction, width direction, height direction of the housing main body 101, and the thickness direction of the electronic components 200 to be cooled can be understood as the Figure 1 and Figure 2 shown directions. The following will describe the embodiments of the present application in conjunction with the drawings.

[0048] According to an embodiment of the present application, as Figure 1 and Figure 2 shown, it further includes a first pipe body 104 and a second pipe body 105. The first pipe body 104 and the second pipe body 105 are arranged on the housing main body 101, and the first pipe body 104 and the second pipe body 105 are respectively communicated with the receiving cavity 106. Among them, one of the first pipe body 104 and the second pipe body 105 is used as an inlet pipe for inputting the coolant into the receiving cavity 106, and the other is used as a drain pipe for discharging the coolant from the receiving cavity 106.

[0049] In some exemplary embodiments, as Figure 1 and Figure 2As shown, the first pipe body 104 and the second pipe body 105 include but are not limited to being inserted through the second side plate 1012. Further, the ends of the first pipe body 104 and the second pipe body that are outside the housing main body 101 are communicated with an external circulation mechanism (not shown in the figure, such as including pipelines, valves, pumps, heat exchangers, liquid tanks, etc.), so that after the coolant exchanges heat with the electronic components 200 to be cooled and other heating elements located in the accommodation cavity 106, it can enter the circulation mechanism to exchange heat again to release heat and enter the next cycle. Among them, the first pipe body 104 can be used as an inlet pipe, that is, the pipeline for the coolant to enter the accommodation cavity 106; the second pipe body 105 can be used as a drain pipe, that is, the pipeline for the coolant to enter the accommodation cavity 106. Similarly, the first pipe body 104 can also be used as a drain pipe, and the second pipe body 105 can also be used as an inlet pipe.

[0050] In such an embodiment, the pressing mechanism 103 is disposed on the cover body 102 to abut against the top of the electronic component 200 to be cooled when the cover body 102 is in a closed state, so as to press down the electronic component 200 to be cooled to limit the vertical position of the electronic component 200 to be cooled. And, since the pressing mechanism 103 also clamps both sides of the electronic component 200 to be cooled in the thickness direction, the horizontal position of the electronic component 200 to be cooled can also be limited. This makes the assembly position of the pressing mechanism 103 and the electronic component 200 to be cooled located at the top of the electronic component 200 to be cooled, which is beneficial to observing the relative position of the pressing mechanism 103 and the electronic component 200 to be cooled. And, since the assembly of the pressing mechanism 103 and the electronic component 200 to be cooled is realized synchronously with the closed state of the cover body 102 without a separate assembly process, the convenience of operation can be effectively improved.

[0051] Figure 3 It is a perspective view of the pressing mechanism of the present application. Figure 4 is Figure 3 A perspective view of the pressing mechanism shown with some pressing parts hidden.

[0052] According to an embodiment of the present application, as Figure 1 、 Figure 3 and Figure 4 shown, the pressing mechanism 103 includes a mounting portion 1031, a pressing portion 1032 and an elastic portion 1035. The mounting portion 1031 is disposed on the cover body 102. The pressing portion 1032 is movably disposed on the mounting portion 1031. The elastic portion 1035 is disposed between the pressing portion 1032 and the mounting portion 1031 and is configured to apply a pressure to the pressing portion 1032 away from the mounting portion 1031.

[0053] In some exemplary embodiments, as Figure 1 、 Figure 3 and Figure 4As shown, the clamping mechanism 103 is arranged on the end surface of the cover body 101 facing the accommodating cavity 106, and is arranged corresponding to the space. In detail, a clamping mechanism 103 can be arranged corresponding to each space. The corresponding relationship between the clamping mechanism 103 and the space can be understood as follows: when the cover body 102 is in a closed state, the clamping mechanism 103 is located exactly above a space. If an electronic component 200 to be cooled is arranged in the space, the pressing portion 1032 of the clamping mechanism 103 is exactly against the top of the electronic component 200 to be cooled (such as Figure 1 The upper end surface of the electronic component 200 to be cooled is abutted against the elastic part 1035. At this time, the elastic part 1035 is in a compressed state. The pressing part 1032 can apply the elastic force generated by the compression deformation of the elastic part 1035 to the electronic component 200 to be cooled in the form of pressure. At this time, since the lower part of the electronic component 200 to be cooled is restricted in the space, the pressing part 1032 can restrict the electronic component 200 to be cooled in the vertical direction and continue to provide downward pressure to the electronic component 200 to be cooled, so as to prevent it from escaping from the space and maintain a good contact state. It should be understood that the embodiments of the present application are not limited to this.

[0054] For example, the mounting portion 1031 and the pressing portion 1032 may also be configured as a block structure, and the elastic portion 1035 may be a compression spring located between the two block structures.

[0055] In addition, the elastic portion 1035 may also be a part of the mounting portion 1031 and / or the pressing portion 1032 .

[0056] For example, the elastic part 1035 can also adopt an air spring or a hydraulic spring. One end of the air spring (or hydraulic spring) can be installed on the cover body 102, and the other end can face the electronic component 200 to be dissipated to directly press against the top of the electronic component 200 to be dissipated.

[0057] According to the embodiments of the present application, Figure 3 and Figure 4 As shown, the pressing mechanism 103 further includes at least one pair of clamping parts 1033. The pair of clamping parts 1033 includes two clamping parts 1033, and the two clamping parts 1033 are symmetrically arranged on both sides of the pressing part 1032 along the thickness direction of the electronic component 200 to be cooled, and are connected to the pressing part 1032. When the cover 102 is in a closed state, the pressing part 1032 abuts against the top of the electronic component 200 to be cooled, so that the pressing part 1032 is close to the mounting part 1031, and at least one pair of clamping parts 1033 are close to each other, so as to clamp the two opposite sides of the electronic component 200 to be cooled.

[0058] According to the embodiments of the present application, Figure 3 and Figure 4As shown, the first end 10331 of the clamping portion 1033 is pivotally connected to the mounting portion 1031, and the second end 10332 of the clamping portion 1033, which is opposite to the first end 10331, extends out from the abutting surface of the pressing portion 1032. The pressing mechanism 103 further includes a first connecting rod 1034. One end of the first connecting rod 1034 is pivotally connected to the pressing portion 1032, and the other end of the first connecting rod 1034 is pivotally connected to the portion of the clamping portion 1033 between the first end 10331 and the second end 10332.

[0059] In some exemplary embodiments, such as Figure 3 and Figure 4 As shown, the pressing mechanism 103 includes, but is not limited to, a pair of clamping portions 1033, and the pair of clamping portions includes two clamping portions 1033. Specifically, each clamping portion 1033 includes, but is not limited to, a sheet-like structure configured to be generally "convex" in shape, including a narrower first end 10331 and a wider second end 10332. Among them, the first end 10331 is pivotally connected to the mounting portion 1031, the second end 10332 extends toward the pressing portion 1032 and protrudes from the pressing portion 1032. Further, the second ends 10332 of the two clamping portions 1033 are also symmetrically located on both sides of the pressing portion 1032.

[0060] In some exemplary embodiments, the second end 10332 of the clamping portion 1033 includes, but is not limited to, a tubular structure, and the tubular structures formed by the two second ends 10332 are parallel to each other, so that when clamping the electronic component 200 to be cooled, a line contact can be formed with the end face of the electronic component 200 to be cooled. Further, the portion of the clamping portion 1033 between the first end 10331 and the second end 10332 is pivotally connected to the outside of the pressing portion 1032 through the first connecting rod 1034, thus forming a lever structure.

[0061] In such an embodiment, the two clamping portions 1033 protrude from the side of the pressing portion 1032 facing the electronic component 200 to be cooled. When the pressing portion 1032 abuts against the top of the electronic component 200 to be cooled (refer to Figure 1As shown, when the top can be the top in the length direction of the electronic component 200 to be cooled, or of course it can also be the top in the width direction of the electronic component 200 to be cooled, the pressing portion 1032 approaches the mounting portion 1031. Due to the action of the first link 1034, a pulling force approaching the mounting portion 1031 is applied to the middle position of the clamping portion 1033. However, since the position of the first end 10331 of the clamping portion 1033 is restricted to the mounting portion 1031, therefore, it can be regarded that the second end 10332 of the clamping portion 1033 swings around the fulcrum (the connection position between the clamping portion 1033 and the other end of the first link 1034), so as to approach the electronic component 200 to be cooled until it clamps on the surface of the electronic component 200 to be cooled, thereby synchronously realizing the restriction of the electronic component 200 to be cooled in the height direction (Z direction) and the length direction (X direction) of the housing main body.

[0062] According to an embodiment of the present application, as Figure 3 and Figure 4 shown, the mounting portion 1031 includes a first plate-shaped member 10311 and a first sleeve 10312. The first plate-shaped member 10311 is disposed on the cover body 102. The first sleeve 10312 is disposed on the first plate-shaped member 10311 in a direction orthogonal to the first plate-shaped member 10311.

[0063] According to an embodiment of the present application, as Figure 3 and Figure 4 shown, the pressing portion 1032 includes a second sleeve 10321 sleeved on the outside of the first sleeve 10312, and an elastic portion 1035 is provided between the first sleeve 10312 and the second sleeve 10321.

[0064] According to an embodiment of the present application, as Figure 3 and Figure 4 shown, the pressing portion 1032 further includes a first block-shaped member 10322 and a gasket 10323. The first block-shaped member 10322 is disposed at the end of the second sleeve 10321 facing away from the first sleeve 10312, and the first block-shaped member 10322 protrudes radially from the second sleeve 10321. The gasket 10323 is disposed on the end face of the first block-shaped member 10322 facing away from the second sleeve 10321 to abut against the top of the electronic component 200 to be cooled. Among them, the gasket 10323 is made of an elastic material.

[0065] In some exemplary embodiments, as Figure 3 and Figure 4As shown, the first plate-shaped member 10311 includes but is not limited to a sheet-shaped mechanism configured as a substantially rectangular shape. Further, the first sleeve 10312 is hollow and connected to the first plate-shaped member 10311. The first sleeve 10312 and the first plate-shaped member 10311 are connected by, but is not limited to, integral formation, riveting, welding, bonding, and any other directions. In this way, one end of the first sleeve 10312 is closed by the first plate-shaped member 10311.

[0066] In some exemplary embodiments, Figure 3 and Figure 4 As shown, the second sleeve 10321 is hollow and includes but is not limited to being sleeved on one end of the first sleeve 10312 away from the first plate-shaped member 10311. In detail, one end of the second sleeve 10321 away from the first sleeve 10312 is closed by the first block-shaped member 10322. Further, the outer diameter of the first sleeve 10312 can be configured to be substantially the same as the inner diameter of the second sleeve 10321, so that the second sleeve 10321 is coaxially sleeved outside the first sleeve 10312. Similarly, the inner diameter of the first sleeve 10312 can also be configured to be substantially the same as the outer diameter of the second sleeve 10321, so that the first sleeve 10312 is sleeved outside the second sleeve 10321. That is, a sealed hollow area is defined between the first sleeve 10312 and the second sleeve 10321, and an elastic part 1035 is provided in the hollow area to provide pressure to separate the mounting part 1031 and the pressing part 1032 when the elastic part 1035 is compressed. The elastic part 1035 includes but is not limited to a compression spring, a disc spring, a pneumatic spring, or any other elastic mechanism suitable for providing pressure to the pressing part 1032.

[0067] In some exemplary embodiments, Figure 3 and Figure 4As shown, the first block-shaped member 10322 is formed at the end of the second sleeve 10321 facing away from the first sleeve 10312 and protrudes radially outward from the second sleeve 10321. Specifically, the first block-shaped member 10322 has two ends in the long direction and two ends in the short direction. The distance between the two ends in the short direction is less than the distance between the two ends in the long direction, and the distance between the two ends in the short direction is less than the distance between the second ends 10332 of the two clamping portions 1033, so as to prevent the first block-shaped member 10322 from being too wide and hindering the clamping process of the clamping portion 1033. Further, in the projection along the axial direction of the second sleeve 10321 with the end face of the first block-shaped member 10322 as the projection plane, the projection of the second sleeve 10321 coincides with the projection of the first block-shaped member 10322, and the area of the projection of the second sleeve 10321 is smaller than the area of the projection of the first block-shaped member 10322. In this way, when the first block-shaped member 10322 abuts against the top of the electronic component 200 to be cooled, the pressure applied by the elastic portion 1035 is dispersed, so as to prevent the electronic component 200 to be cooled from being damaged due to too concentrated pressure.

[0068] In some illustrative embodiments, such as Figure 3 and Figure 4 As shown, the pressing mechanism 103 further includes a gasket 10323 disposed on the abutting surface where the first block-shaped member 10322 abuts against the electronic component 200 to be cooled. Specifically, the gasket 10323 is made of, but not limited to, silica gel, rubber, gel, sponge, and any other elastic material, so as to prevent the first block-shaped member 10322 from forming hard contact with the electronic component 200 under the action of pressure, thereby further preventing the damage of the electronic component 200 caused by too concentrated pressure.

[0069] Figure 5 It is a partial cross-sectional view of the shell main body of the immersion liquid cooling device of the present application along the horizontal direction. Figure 6 It is an enlarged view of the first card holder of the present application. Figure 7 It is an enlarged view of the second card holder of the present application.

[0070] According to an embodiment of the present application, as Figures 5 to 7 shown, the immersion liquid cooling device 100 further includes a first card holder 107 and a second card holder 108. The first card holder 107 is disposed on one inner wall of the shell main body 101. The second card holder 108 is disposed on the inner wall of the shell main body 101 facing the first card holder 107, and a space is defined between the first card holder 107 and the second card holder 108.

[0071] According to an embodiment of the present application, as Figure 6 and Figure 7 shown, the facing end faces of the first card holder 107 and the second card holder 108 are provided with accommodation grooves, and the electronic component 200 to be cooled is slidably disposed in the accommodation grooves.

[0072] In some exemplary embodiments, as Figures 5 to 7 shown, the first card holder 107 and the second card holder 108 include, but are not limited to, inner walls disposed on opposite sides of the housing body 101 in the width direction (Y direction). Specifically, the facing end faces of the first card holder 107 and the second card holder 108 form a substantially U-shaped receiving groove. Further, the receiving groove formed by the first card holder 107 and the second card holder 108 is a through groove, that is, the upper end of the receiving groove of the first card holder 107 and the second card holder 108 is open, so that the electronic component 200 to be cooled can be inserted from the open end. Wherein, the width of the receiving groove can be configured to be substantially the same as the thickness of the electronic component 200 to be cooled, so as to accurately confine the electronic component 200 to be cooled in the space and prevent the electronic component 200 to be cooled from shaking within the first card holder 107 and the second card holder 108.

[0073] Figure 8 This is a perspective view of the first card holder, the second card holder, the limiting mechanism and a part of the lifting mechanism of the present application.

[0074] According to an embodiment of the present application, as Figure 8 shown, the immersion liquid cooling device 100 further includes a limiting mechanism 109. The limiting mechanism 109 includes a locking portion 1091 and a first actuating portion 1092. The portion of the locking portion 1091 facing the first card holder 107 has a first locking end 10911, and the locking portion 1091 is configured to move between a first position where the first locking end 10911 engages with the second locking end 201 of the electronic component 200 to be cooled, and a second position where it disengages from the second locking end 201. The first actuating portion 1092 is configured to actuate the locking portion 1091 to move between the first position and the second position. Wherein, in the state where the locking portion 1091 is in the first position, the electronic component 200 to be cooled is held in the space.

[0075] In some exemplary embodiments, as Figure 6 and Figure 8 shown, a groove structure adapted to receive the locking portion 1091 is provided on the end face of the first card holder 107 facing away from the second card holder 108. Further, a plurality of first through holes 1071 penetrating the first card holder 107 are provided at the bottom of the groove structure, so as to allow the first locking end 10911 of the locking portion 1091 to pass through the first through holes 1071 and be connected to the inside of the second locking end 201 of the electronic component 200 to be cooled.

[0076] In some exemplary embodiments, as Figure 6 and Figure 8As shown, the first actuating part 1092 is disposed on the side of the locking part 1091 away from the first clamping seat 107. Specifically, the first actuating part 1092 can adopt a linear actuator, that is, the locking part 1091 is moved between a first position and a second position along the width direction (Y direction) of the housing body 101, so that the first locking end 10911 passes through the first through hole 1071 (that is, is connected to the second locking end 201), or is hidden within the first through hole 1071 (that is, is disengaged from the second locking end 201).

[0077] In some illustrative embodiments, as Figure 8 shown, the locking part 1091 includes but is not limited to being configured as a bar structure. Specifically, the shape and size of the groove structure formed by the bar structure and the first clamping seat 107 are substantially the same, that is to say, the locking part 1091 can enter the groove structure under the action of the first actuating part 1092, or be disengaged from the groove structure.

[0078] Figure 9 This is a three-dimensional view of the electronic component to be heat-dissipated according to the present application.

[0079] According to an embodiment of the present application, as Figure 8 and Figure 9 shown, the locking part 1091 extends along a direction parallel to the first clamping seat 107, the locking part 1091 has at least two first locking ends 10911, and the at least two first locking ends 10911 are arranged at intervals along the extending direction of the locking part 1091.

[0080] According to an embodiment of the present application, as Figure 8 and Figure 9 shown, the first locking end 10911 forms a convex part, and the second locking end 201 of the electronic component 200 to be heat-dissipated forms a concave part that cooperates with the convex part.

[0081] In some illustrative embodiments, as Figure 8 shown, the locking part 1091 has a plurality of first locking ends 10911 along its extending direction. Specifically, the first locking end 10911 includes but is not limited to being configured as a columnar structure. Further, as Figure 9 shown, a columnar blind hole with a spacing, size and length substantially the same as that of the columnar structure is provided on the side of the electronic component 200 to be heat-dissipated facing the first locking end 10911.

[0082] In such an embodiment, the first actuating part 1092 of the limiting mechanism 109 is adapted to drive the locking part 1091 to displace relative to the electronic component 200 to be cooled. In a state where the locking part 1091 is in the first position, the first locking end 10911 cooperates with the second locking end 201 of the electronic component 200 to be cooled. Since the displacement direction of the first locking end 10911 (the width direction (Y direction) of the housing body) is orthogonal to the sliding direction of the electronic component 200 to be cooled relative to the first card seat 107 (the height direction (Z direction) of the housing body), accordingly, the sliding position of the electronic component 200 to be cooled along the first card seat 107 can be restricted, so that it is accurately restricted in space, to prevent the pressing mechanism 103 from causing the electronic component 200 to be cooled to move around in space due to factors such as the flow of the coolant and / or the buoyancy force on the electronic component 200 to be cooled when cooperating with the top of the electronic component 200 to be cooled. Furthermore, the pressing mechanism 103 can cooperate with the electronic component 200 to be cooled accurately.

[0083] According to an embodiment of the present application, as Figure 8 shown, the first actuating part 1092 includes a threaded rod 10922, two screw sleeves 10921 and two second connecting rods 10923. The threaded rod 10922 extends along a direction parallel to the locking part 1091, and has a first section 109221 and a second section 109222 with opposite thread helix directions. One of the two screw sleeves 10921 is sleeved on the first section 109221, and the other is sleeved on the second section 109222. One ends of the two second connecting rods 10923 are pivotally arranged on respective one screw sleeve 10921, and the other ends of the two second connecting rods 10923 are pivotally arranged on the locking part 1091.

[0084] In some exemplary embodiments, as Figure 8 shown, the extending direction of the threaded rod 10922 is parallel to the extending direction of the first card seat 107 and the extending direction of the locking part 1091, and specifically can extend along the height direction (Z direction) of the housing body, and the locking part 1091 is located between the threaded rod 10922 and the first card seat 107. Specifically, a first section 109221 and a second section 109222 with opposite thread helix directions are formed in the middle of the axial direction of the threaded rod 10922. The two screw sleeves 10921 are respectively sleeved on the first section 109221 and the second section 109222, and form a threaded fit with the first section 109221 and the second section 109222. Further, one sides of the two screw sleeves 10921 facing the locking part 1091 are connected by the second connecting rods 10923.

[0085] In some exemplary embodiments, as Figure 8As described above, the upper end of the threaded rod 10922 forms a handle end 10924. Specifically, the handle end 10924 includes, but is not limited to, a structure configured to be generally disc-shaped and having a larger diameter than the threaded rod 10922 for the user to turn for operation. Further, the threaded rod 10922 is disposed, for example, in a groove formed in the housing body 101 to limit the distance between the threaded rod 10922 and the first clamping seat 107 and to be able to rotate idly about the axis of the threaded rod 10922.

[0086] In such an embodiment, it can be considered that the threaded rod 10922, the two second connecting rods 10923, and the locking portion 1091 enclose an isosceles trapezoid structure. On this basis, it can be understood that the extension directions of the two second connecting rods 10923 form an included angle, such as a structure forming a generally "eight" shape. When the user turns the threaded rod 10922 through the handle end 10924, since the relative position between the threaded rod 10922 and the first clamping seat 107 is limited, therefore, the threaded rod 10922 can only rotate idly about a fixed axis. The circumferential rotation of the two screw sleeves 10921 is limited by the second connecting rods 10923. Therefore, the two screw sleeves 10921 can only move relatively closer to or away from each other along the axial direction of the threaded rod 10922, thereby changing the base angles of the isosceles trapezoid structure. That is, the smaller the base angle, the closer the locking portion 1091 is to the threaded rod 10922 (i.e., the farther away from the first clamping seat 107), and the larger the base angle, the farther the locking portion 1091 is from the threaded rod 10922 (i.e., the closer to the first clamping seat 107), so that the locking portion 1091 moves between the first position and the second position to further connect the first locking end 10911 of the locking portion 1091 to the second locking end 201 of the electronic component 200 to be cooled, or to disengage from the second locking end 201 of the electronic component 200 to be cooled. It should be understood that the embodiments of the present application are not limited thereto.

[0087] For example, in addition to using the handle end 10924 to drive the fixed-axis rotation of the threaded rod 10922, a motor or other driving means can also be used to rotate it forward or backward.

[0088] On this basis, through the cooperation of the pressing mechanism 103 and the limiting mechanism 109, the electronic component 200 to be cooled can be limited in multiple directions without using a connecting mechanism such as screws or bolts and without using a quick-release structure such as a pin in the space in the accommodation cavity 106. In this way, when installing and removing the electronic component 200 to be cooled, neither a special tool is required, nor can the quick-release and quick-installation of the electronic component 200 to be cooled be achieved.

[0089] Figure 10 This is a perspective view of another part of the lifting mechanism of the present application. Figure 11 For Figure 9A perspective view of the electronic component to be cooled from another angle as shown.

[0090] According to an embodiment of the present application, as Figure 8 , Figure 10 and Figure 11 shown, the immersion liquid cooling device 100 further includes a lifting mechanism 110. The lifting mechanism 110 includes a second plate-shaped member 1101 and a second actuating portion 1102. The second plate-shaped member 1101 is disposed between the first card seat 107 and the second card seat 108, and is configured to move in the height direction between a third position at the bottom of the accommodating cavity 106 and a fourth position higher than the third position. The second plate-shaped member 1101 has a first connecting portion 11011, and the first connecting portion 11011 is configured to detachably connect with a second connecting portion 202 of the electronic component 200 to be cooled. The second actuating portion 1102 is configured to move the second plate-shaped member 1101 between the third position and the fourth position.

[0091] In some illustrative embodiments, as Figure 8 , Figure 10 and Figure 11 shown, the second card seat 108 has a first sliding groove 1081 provided in the vertical direction. Specifically, both ends of the second plate-shaped member 1101 in the width direction (Y direction) of the housing main body 101 are respectively fitted into the first card seat 107 and the second card seat 108. Further, the end portion of the second plate-shaped member 1101 located in the second card seat 108 is also slidably disposed in the first sliding groove 1081 of the second card seat 108, thereby restricting the movement of the second plate-shaped member 1101 in the vertical direction.

[0092] In some illustrative embodiments, as Figure 8 and Figure 11 shown, the upper end surface of the second plate-shaped member 1101 has a first connecting portion 11011, and the bottom surface of the electronic component 200 to be cooled has a second connecting portion 202 adapted to the first connecting portion 11011. Specifically, the first connecting portion 11011 and the second connecting portion 202 are respectively a concave portion and a convex portion, so that the electronic component 200 to be cooled can be plugged into the second plate-shaped member 1101. Further, the electronic component 200 to be cooled may have a plurality of second connecting portions 202, and the second plate-shaped member 1101 may have first connecting portions 11011 corresponding to the number of the second connecting portions 202 (including but not limited to two as Figure 8 and Figure 11 shown).

[0093] Among them, the first connecting portion 11011 may form a concave portion, and the second connecting portion 202 may form a convex portion, or the first connecting portion 11011 may form a convex portion, and the second connecting portion 202 may form a concave portion.

[0094] In some illustrative embodiments, such as Figure 8 shown, the second actuating part 1102 is connected to the second plate-shaped part 1101 to drive the second plate-shaped part 1101 to move between a third position and a fourth position, so that the electronic components 200 to be cooled located on the second plate-shaped part 1101 can rise or fall with the second plate-shaped part 1101.

[0095] In such an embodiment, the electronic components 200 to be cooled can rise or fall in the accommodation cavity 106 through the lifting mechanism 110. Thus, when the electronic components 200 to be cooled malfunction, or during maintenance and repair, they can be lifted at least partially above the liquid level by the lifting mechanism 110, so that the electronic components 200 to be cooled can be taken out without directly contacting the coolant. This can prevent problems such as short circuits caused by impurities (such as conductive debris and particles) contaminating the coolant when users directly contact the liquid level with tools or hands. Similarly, when there is coolant in the accommodation groove, the user also first lifts the second plate-shaped part 1101 to a higher fourth position, so that, without directly contacting the liquid level, the electronic components 200 to be cooled are first connected to the second plate-shaped part 1101, and then the second plate-shaped part 1101 is moved to a lower third position, so that the electronic components 200 to be cooled are immersed below the liquid level of the coolant. It should be understood that the embodiments of the present application are not limited thereto.

[0096] For example, the numbers of the first connecting part 11011 and the second connecting part 202 can also be configured as 1, 2, 3, 4, or any other number.

[0097] Again, the first connecting part 11011 can be a convex part, while the second connecting part 202 can be a concave part.

[0098] Also, in addition to the concave-convex fit, the first connecting part 11011 and the second connecting part 202 can also be connected by snap fit, interference fit, or any other means.

[0099] According to the embodiments of the present application, as Figure 8 and Figure 10 shown, the second actuating part 1102 includes a first lead screw 11021, a first nut 11022, and a first motor 11025. The first lead screw 11021 extends in a direction parallel to the second card seat 108. The first nut 11022 is sleeved on the first lead screw 11021 and is connected to the second plate-shaped part 1101. The first motor 11025 is configured to drive the first lead screw 11021 to rotate around its axis, so that the second plate-shaped part 1101 moves between a third position and a fourth position with the first nut 11022. Among them, in the state where the second plate-shaped part 1101 is in the fourth position, at least a part of the electronic components 200 to be cooled is exposed above the liquid level of the coolant.

[0100] In some exemplary embodiments, as Figure 8 and Figure 10 shown, the first lead screw 11021 extends in a direction parallel to the extending direction of the second card holder 108 (the height direction (Z direction) of the housing body), and a first gear 11023 (which can be regarded as a driven gear) is coaxially arranged at the lower end of the first lead screw 11021. Further, a second gear 11024 (which can be regarded as a driving gear) is arranged at the output end of the first motor 11025, so as to output torque to the first lead screw 11021 in a state where the second gear 11024 meshes with the first gear 11023, so that the first lead screw 11021 rotates about its axis. Among them, the arrangement of the first lead screw 11021 is similar to that of the threaded rod 10922 in the above embodiment, that is, the first lead screw 11021 is located in the groove formed by the housing body 101, so that the relative position between the first lead screw 11021 and the second card holder 108 is limited, and it can rotate idly about its axis.

[0101] In such an embodiment, since the circumferential rotation of the second plate-shaped member 1101 is restricted by the first chute 1081 of the second card holder 108, when the first lead screw 11021 rotates about its axis, the first lead screw sleeve 11022 connected to the second plate-shaped member 1101 moves along the axis of the first lead screw 11021 (i.e., rises or falls) under the action of the thread fit with the first lead screw 11021, so as to raise or lower the electronic component 200 to be cooled. It should be understood that the embodiments of the present application are not limited thereto.

[0102] For example, other transmission mechanisms other than gears can also be adopted between the first lead screw 11021 and the first motor 11025, such as belts and pulleys.

[0103] Again, in addition to using a lead screw, a lead screw sleeve and the second plate-shaped member 1101, the second actuating part 1102 can also adopt other linear actuators, such as electric push rods, cylinders, oil cylinders, etc.

[0104] According to the embodiments of the present application, as Figure 8 and Figure 10As shown, the immersion liquid cooling device 100 includes a plurality of spaces, and at least two spaces have a second plate-shaped member 1101. The lifting mechanism 110 further includes a third actuating portion 1103 and a clutch mechanism. The third actuating portion 1103 has a first motor 11025 movably disposed in the third actuating portion 1103 in a direction parallel to the thickness direction of the electronic component 200 to be cooled, so that the first motor 11025 moves between at least two spaces to face one of the first lead screws 11021. The clutch mechanism is disposed between the third actuating portion 1103 and the first motor 11025, so that the output end of the first motor 11025 is connected to the first lead screw 11021, or the output end of the first motor 11025 is disconnected from the first lead screw 11021.

[0105] In some illustrative embodiments, as Figure 8 and Figure 10 shown, the accommodation cavity 106 has a plurality of spaces, and the arrangement of the plurality of spaces is similar to that of the above embodiments, such as being arranged along the length direction (X direction) of the housing body 101. Therefore, it will not be elaborated here. Specifically, the third actuating portion 1103 is configured with a clutch mechanism and is movable along the length direction (X direction) of the housing body 101, so that the first motor 11025 can reciprocate between the plurality of spaces to face different first lead screws 11021, and through the cooperation of the first gear 11023 and the second gear 11024, selective driving of the second plate-shaped member 1101 in a certain space is achieved.

[0106] In such an embodiment, the third actuating portion 1103 can control a plurality of first lead screws 11021 at different times through one first motor 11025, that is, the second plate-shaped members 1101 in different spaces are adjusted. In this way, the control of a plurality of electronic components 200 to be cooled can be achieved only through one third actuating portion 1103, which is beneficial to reducing the structural complexity of the immersion liquid cooling device 100 and correspondingly reducing the manufacturing cost. It should be understood that the embodiments of the present application are not limited thereto.

[0107] For example, first motors 11025 can also be arranged on at least two of the first lead screws 11021 respectively.

[0108] Again, at least two first motors 11025 can also be configured in the third actuating portion 1103 to simultaneously control at least two second plate-shaped members 1101 to move up and down synchronously (or at different times).

[0109] According to the embodiments of the present application, as Figure 8 , Figure 10 and Figure 11As shown, the third actuating part 1103 includes a second lead screw 11031, a second nut 11032 and a second motor 11034. The second lead screw 11031 extends in a direction parallel to the thickness direction of the electronic component 200 to be cooled. The second nut 11032 is sleeved on the second lead screw 11031. The output end of the second motor 11034 is connected to one axial end of the second lead screw 11031. Among them, the second nut 11032 has a guide block 11033, and the guide block 11033 is slidably arranged in the accommodating cavity 106 in a direction parallel to the second lead screw 11031.

[0110] According to an embodiment of the present application, as Figure 8 , Figure 10 and Figure 11 shown, the clutch mechanism includes a cylinder 1104. The cylinder block of the cylinder 1104 is arranged on the second nut 11032. The piston of the cylinder 1104 extends in a direction orthogonal to the second lead screw 11031 and faces the first lead screw 11021. The first motor 11025 is arranged on the piston. Among them, when the piston is in the outstroke state, the output end of the first motor 11025 is connected to the first lead screw 11021, and when the piston is in the return stroke state, the output end of the first motor 11025 is disengaged from the first lead screw 11021.

[0111] In some exemplary embodiments, as Figure 8 and Figure 10 shown, the bottom plate 1013 of the housing main body 101 is provided with a second chute 1014 arranged along the length direction (X direction) of the housing main body 101. Specifically, the second nut 11032 is sleeved on the second lead screw 11031, and a guide block 11033 is arranged on the end face facing the second chute 1014. The guide block 11033 is slidably arranged in the second chute 1014. Further, one axial end of the second lead screw 11031 is connected to the output end of the second motor 11034 to drive the guide block 11033 to move along the axial direction of the second lead screw 11034 through the second lead screw 11034. Among them, the second motor 11034 and the first motor 11025 include but are not limited to using stepper motors to accurately control the positions of the second nut 11033 and the second plate-shaped member 1101 by controlling the number of rotation turns of the motor output end.

[0112] In some exemplary embodiments, as Figure 10As shown, the cylinder block of the cylinder 1104 is connected to the second wire sleeve 11032, and the piston of the cylinder 1104 faces the first lead screw 11021. Specifically, a bracket 1105 is further provided on the part where the piston extends out of the cylinder block, and the first motor 11025 is located on the bracket 1105. In this way, through the forward and return movements of the piston, the first motor 11025 can be connected to or disengaged from any one of the first lead screws 11021, thereby functioning as a clutch mechanism. It should be understood that the embodiments of the present application are not limited thereto.

[0113] For example, the third actuator 1103 can also adopt other linear actuators, such as electric push rods, cylinders, oil cylinders, etc.

[0114] Again, in addition to using the cylinder 1104, the clutch mechanism can also adopt other clutch mechanisms suitable for feeding or retracting the first motor 11025 and the second gear 11024.

[0115] Figure 12 It is a partial enlarged view of the fourth actuator of the present application.

[0116] According to an embodiment of the present application, as Figure 12 shown, the cover body 102 is pivotally arranged on the housing main body 101. The immersion liquid cooling device further includes a fourth actuator 111, and the fourth actuator 111 is configured to make the cover body 102 have an open state and a closed state.

[0117] According to an embodiment of the present application, as Figure 12 shown, the housing main body 101 has a first side plate 1011 and a second side plate 1012 orthogonal to the first side plate 1011. The cover body 102 is pivotally arranged on the first side plate 1011, and the top surface of the second side plate 1012 has a guide groove 1015 arranged in a direction orthogonal to the first side plate 1011. The fourth actuator 111 includes a third lead screw 1113, a third wire sleeve 1112, a third connecting rod 1111 and a third motor 1114. The third lead screw 1113 is rotatably arranged in the guide groove 1015 along the horizontal direction. The third wire sleeve 1112 is sleeved on the third lead screw 1113. One end of the third connecting rod 1111 is pivotally connected to the third wire sleeve 1112, and the other end of the third lead screw 1113 is pivotally connected to the end surface of the cover body 102 facing the accommodation cavity 106. The output end of the third motor 1114 is connected to one axial end of the third lead screw 1113.

[0118] In some exemplary embodiments, referring to Figure 1 and Figure 12As shown in the figure, the cover 102 is pivotally connected to the first side plate 1011, and the opening and closing of the cover 102 and the opening and closing angle are controlled by the fourth actuating part 111. Specifically, a guiding groove 1015 is provided on the upper end surface of the first side plate 1011, and the part of the fourth actuating part 111 except the third connecting rod 1111 is located in the guiding groove 1015. Among them, the third lead screw 1113 is rotatably arranged in the guiding groove 1015, and a third motor 1114 is arranged at one end of its axis to control its fixed-axis rotation. Further, the third lead screw sleeve 1112 is sleeved on the third lead screw 1113 and is threadedly connected to the third lead screw 1113. One end of the third connecting rod 1111 is pivotally connected to the third lead screw sleeve 1112, and the other end of the third connecting rod 1111 is pivotally connected to the end surface of the cover 102. Furthermore, the other first side plate 1011 opposite to the fourth actuating part 111 is also configured as a guide post, and a sliding sleeve is sleeved outside the guide post, and a similar third connecting rod 1111 is arranged between the sliding sleeve and the cover 102.

[0119] In such an embodiment, when the third motor 1114 drives the third lead screw 1113 to rotate around a fixed axis, since the circumferential rotation of the third lead screw sleeve 1112 is restricted by the guiding groove 1015, therefore, it can only slide along the axis of the third lead screw, and then the included angle of the third connecting rod 1111 relative to the end surface of the cover 102 is adjusted, so as to realize the opening and closing and opening degree control of the cover 102. The guide post, the sliding sleeve and the third connecting rod 1111 arranged on the other first side plate 1011 play a role of auxiliary support to disperse the force borne by the third connecting rod 1111 connected to the third lead screw sleeve 1112. When the cover 102 is in a closed state, the third connecting rod 1111 is also located in the guiding groove, so that the opening formed by the cover 102 and the housing main body 101 is tightly closed.

[0120] Based on the same inventive concept, the present application also provides an electronic device, which can be further referred to Figure 1 As shown in the figure, the electronic device includes an immersion liquid cooling device 100 and electronic components 200 to be cooled. The housing main body 101 of the immersion liquid cooling device defines a containing cavity 106, and there is a space in the containing cavity 106. The electronic components 200 to be cooled are detachably arranged in the space; among them, the electronic components 200 to be cooled include but are not limited to at least one of a computing node, a switching node and a storage node.

[0121] In some illustrative embodiments, the computing node includes, but is not limited to, a combination of at least a part of a processor, memory, accelerator, storage device, and network interface card. Of course, it may also include other electronic components for processing compute-intensive tasks. The switching node includes, but is not limited to, a local area network switch, a wide area network switch, and other electronic components for data transmission and switching in the network. The storage node includes, but is not limited to, a large-capacity hard disk, a solid-state drive, and other electronic components for storing and managing data. Based on the above technical nodes, the electronic device includes, but is not limited to, a server system.

[0122] In some illustrative embodiments, the immersion liquid cooling device 100 of the electronic device has a plurality of spaces, and at least a part of the spaces are detachably provided with the electronic components 200 to be cooled. Among them, for the related implementation manners of the immersion liquid cooling device 100, reference may be made to the Figures 1 to 12 illustrative embodiments shown above. Therefore, they will not be elaborated here.

[0123] In such an implementation manner, the pressing mechanism 103 of the immersion liquid cooling device 100 is disposed on the cover body 102 so as to abut against the top of the electronic components 200 to be cooled when the cover body 102 is in a closed state, thereby pressing down the electronic components 200 to be cooled to limit the vertical position of the electronic components 200 to be cooled. Moreover, since the pressing mechanism 103 also clamps both sides of the electronic components 200 to be cooled in the thickness direction, the horizontal position of the electronic components 200 to be cooled can also be limited. This makes the assembly position of the pressing mechanism 103 and the electronic components 200 to be cooled located at the top of the electronic components 200 to be cooled, which is conducive to observing the relative position between the pressing mechanism 103 and the electronic components 200 to be cooled. Moreover, since the assembly of the pressing mechanism 103 and the electronic components 200 to be cooled is realized synchronously with the closed state of the cover body 102 without a separate assembly process, the convenience of operation can be effectively improved.

[0124] On this basis, the first actuating part 1092 of the limiting mechanism 109 is adapted to drive the locking part 1091 to displace relative to the electronic component 200 to be cooled. In the state where the locking part 1091 is in the first position, the first locking end 10911 cooperates with the second locking end 201 of the electronic component 200 to be cooled. Since the displacement direction of the first locking end 10911 (the width direction (Y direction) of the housing main body) is orthogonal to the sliding direction of the electronic component 200 to be cooled relative to the first card seat 107 (the height direction (Z direction) of the housing main body), the sliding position of the electronic component 200 to be cooled along the first card seat 107 can be restricted, so that it can be accurately restricted in space, so as to prevent the pressing mechanism 103 from causing the electronic component 200 to be cooled to move around in space due to factors such as the flow of the coolant and / or the buoyancy force on the electronic component 200 to be cooled when cooperating with the top of the electronic component 200 to be cooled. Furthermore, the pressing mechanism 103 can cooperate with the electronic component 200 to be cooled accurately.

[0125] Furthermore, the electronic component 200 to be cooled can be raised or lowered in the accommodation cavity 106 by the lifting mechanism 110. In this way, when the electronic component 200 to be cooled fails, or is maintained and repaired, it can be made to rise at least partially above the liquid level by the lifting mechanism 110, so that the electronic component 200 to be cooled can be taken out without contacting the coolant. Thus, it is possible to prevent problems such as short circuits caused by impurities (such as conductive debris and particles) contaminating the coolant when the user directly contacts the liquid level with tools or hands. Similarly, when there is coolant in the accommodation groove, the user also first raises the second plate-shaped member 1101 to a higher fourth position, so that, without directly contacting the liquid level, the electronic component 200 to be cooled is first connected to the second plate-shaped member 1101, and then the second plate-shaped member 1101 is moved to a lower third position, so that the electronic component 200 to be cooled is immersed below the liquid level of the coolant. It should be understood that the embodiments of the present application are not limited thereto.

[0126] For example, in addition to being pivotally connected to the housing main body 101, the cover body 102 can also be separated from the housing main body 101, such as being arranged above the accommodation cavity 106 of the housing main body 101 in a hoisting manner, so that the cover body 102 has an open state and a closed state with different hoisting heights.

[0127] The above has introduced in detail an immersion liquid cooling device and an electronic device provided by this application. Specific examples are used in this article to elaborate on the principle and implementation manner of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application. It should be noted that for those of ordinary skill in the art of this technology, without departing from the principle of this application, several improvements and modifications can still be made to this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. An immersion liquid cooling device, characterized in that, Comprising: A housing, comprising: A housing main body (101); A cover body (102) which is disposed on the housing main body (101) in an openable and closable manner. The housing main body (101) and the cover body (102) form a closed accommodation cavity (106). The accommodation cavity (106) is used for accommodating a coolant and has at least one space suitable for installing an electronic component to be cooled (200); A pressing mechanism (103) which is disposed on a side of the cover body (102) close to the accommodation cavity (106) and is located at a position corresponding to the space. The pressing mechanism (103) comprises: A mounting portion (1031) which is disposed on the cover body (102); A pressing portion (1032) which is movably disposed on the mounting portion (1031); An elastic portion (1035) which is disposed between the pressing portion (1032) and the mounting portion (1031) and is configured to apply a pressure to the pressing portion (1032) away from the mounting portion (1031); At least one pair of clamping portions (1033). In a pair of the clamping portions (1033), there are two clamping portions (1033). The two clamping portions (1033) are symmetrically disposed on both sides of the pressing portion (1032) along the thickness direction of the electronic component to be cooled (200) and are connected to the pressing portion (1032); Wherein, when the cover body (102) is in a closed state, the pressing portion (1032) abuts against the top of the electronic component to be cooled (200), so that the pressing portion (1032) approaches the mounting portion (1031), and at least one pair of the clamping portions (1033) approach each other to clamp on two opposite sides of the electronic component to be cooled (200); Wherein, when the cover body (102) is in a closed state, the pressing mechanism (103) is configured to abut against the top of the electronic component to be cooled (200) and clamp on two sides of the electronic component to be cooled (200) along the thickness direction of the electronic component to be cooled (200). When the cover body (102) is in an open state, the pressing mechanism (103) disengages from the electronic component to be cooled (200).

2. The immersion liquid cooling device according to claim 1, wherein, The clamping portion (1033) has a first end (10331) and a second end (10332) which are away from each other. The first end (10331) is pivotally connected to the mounting portion (1031). The second end (10332) protrudes from the pressing portion (1032) and extends beyond the abutting surface of the pressing portion (1032); The pressing mechanism (103) further comprises a first connecting rod (1034). One end of the first connecting rod (1034) is pivotally connected to the pressing portion (1032), and the other end of the first connecting rod (1034) is pivotally connected to a portion of the clamping portion (1033) between the first end (10331) and the second end (10332); 3. The immersion liquid cooling device according to claim 2, characterized in that, The mounting portion (1031) comprises: A first plate-shaped member (10311) which is disposed on the cover body (102); The first sleeve (10312) is disposed on the first plate-shaped member (10311) in a direction orthogonal to the first plate-shaped member (10311).

4. The immersion liquid cooling device according to claim 3, wherein The pressing portion (1032) includes a second sleeve (10321) sleeved on the outer side of the first sleeve (10312), and an elastic portion (1035) is disposed between the first sleeve (10312) and the second sleeve (10321).

5. The immersion liquid cooling device according to claim 4, wherein The pressing portion (1032) further includes: A first block-shaped member (10322) is disposed at an end of the second sleeve (10321) facing away from the first sleeve (10312), and the first block-shaped member (10322) protrudes radially from the second sleeve (10321) along the second sleeve (10321); A gasket (10323) is disposed on an end face of the first block-shaped member (10322) facing away from the second sleeve (10321) to abut against the top of the electronic component to be heat-dissipated (200); Wherein, the gasket (10323) is made of an elastic material.

6. The immersion liquid cooling device according to claim 1, wherein It further includes: A first card seat (107) is disposed on an inner wall of one side of the housing body (101); A second card seat (108) is disposed on an inner wall of the housing body (101) facing the first card seat (107), and a space is defined between the first card seat (107) and the second card seat (108).

7. The immersion liquid cooling device according to claim 6, wherein Receiving grooves are disposed on end faces of the first card seat (107) and the second card seat (108) facing each other, and the electronic component to be heat-dissipated (200) is slidably disposed in the receiving grooves.

8. The immersion liquid cooling device according to claim 6 or 7, characterized in that It further includes a limiting mechanism (109), and the limiting mechanism (109) includes: A locking portion (1091), a portion of the locking portion (1091) facing the first card seat (107) has a first locking end (10911), and the locking portion (1091) is configured to move between a first position where the first locking end (10911) is engaged with a second locking end (201) of the electronic component to be heat-dissipated (200) and a second position where the second locking end (201) is disengaged; A first actuating portion (1092) is configured to actuate the locking portion (1091) to move between the first position and the second position; Wherein, in a state where the locking portion (1091) is in the first position, the electronic component to be heat-dissipated (200) is held in the space.

9. The immersion liquid cooling device according to claim 8, wherein The first actuating portion (1092) includes: A threaded rod (10922) extends in a direction parallel to the locking portion (1091), and has a first section (109221) and a second section (109222) with opposite thread directions; Two screw sleeves (10921), one of the two screw sleeves (10921) is sleeved on the first section (109221), and the other is sleeved on the second section (109222); Two second linkages (10923), one end of each of the two second linkages (10923) is pivotally arranged on one of the respective screw sleeves (10921), and the other end of each of the two second linkages (10923) is pivotally arranged on the locking portion (1091).

10. The immersion liquid cooling device according to claim 9, characterized in that, The locking portion (1091) extends in a direction parallel to the first card seat (107), and the locking portion (1091) has at least two first locking ends (10911), and at least two of the first locking ends (10911) are arranged at intervals along the extending direction of the locking portion (1091).

11. The immersion liquid cooling device according to claim 10, wherein, The first locking end (10911) forms a convex portion, and the second locking end (201) of the electronic component to be heat-dissipated (200) forms a concave portion that cooperates with the convex portion.

12. The immersion liquid cooling device according to claim 6, wherein, It further includes a jacking mechanism (110), and the jacking mechanism (110) includes: A second plate-shaped member (1101), arranged between the first card seat (107) and the second card seat (108), configured to move in the height direction between a third position at the bottom of the accommodation cavity (106) and a fourth position higher than the third position, and the second plate-shaped member (1101) has a first connecting portion (11011), and the first connecting portion (11011) is configured to detachably connect with the second connecting portion (202) of the electronic component to be heat-dissipated (200); A second actuating portion (1102), configured to move the second plate-shaped member (1101) between the third position and the fourth position.

13. The immersion liquid cooling device according to claim 12, characterized in that, The second actuating portion (1102) includes: A first lead screw (11021), extending in a direction parallel to the second card seat (108); A first lead screw sleeve (11022), sleeved on the first lead screw (11021) and connected to the second plate-shaped member (1101); A first motor (11025), configured to drive the first lead screw (11021) to rotate around the axis, so that the second plate-shaped member (1101) moves between the third position and the fourth position along with the first lead screw sleeve (11022); Wherein, in a state where the second plate-shaped member (1101) is in the fourth position, at least a part of the electronic component to be heat-dissipated (200) is exposed above the liquid level of the coolant.

14. The immersion liquid cooling device according to claim 13, wherein The accommodation cavity (106) includes a plurality of spaces, and at least two of the spaces have the second plate-shaped member (1101); The jacking mechanism (110) further includes: A third actuating portion (1103), the first motor (11025) is movably arranged on the third actuating portion (1103) in a direction parallel to the thickness direction of the electronic component to be heat-dissipated (200), so that the first motor (11025) moves between at least two of the spaces to face one of the first lead screws (11021); A clutch mechanism is disposed between the third actuating part (1103) and the first motor (11025) to connect the output end of the first motor (11025) to the first lead screw (11021), or to disconnect the output end of the first motor (11025) from the first lead screw (11021).

15. The immersion liquid cooling device according to claim 14, wherein, The third actuating part (1103) includes: A second lead screw (11031) extending in a direction parallel to the thickness direction of the electronic component to be cooled (200); A second nut sleeve (11032) sleeved on the second lead screw (11031); A second motor (11034) whose output end is connected to an axial end of the second lead screw (11031); Wherein, the second nut sleeve (11032) has a guiding block (11033), and the guiding block (11033) is slidably disposed in the accommodating cavity (106) in a direction parallel to the second lead screw (11031).

16. The immersion liquid cooling device according to claim 15, wherein, The clutch mechanism includes a cylinder (1104), the cylinder body of the cylinder (1104) is disposed on the second nut sleeve (11032), the piston of the cylinder (1104) extends in a direction orthogonal to the second lead screw (11031) and faces the first lead screw (11021); The first motor (11025) is disposed on the piston; Wherein, when the piston is in the forward stroke state, the output end of the first motor (11025) is connected to the first lead screw (11021), and when the piston is in the return stroke state, the output end of the first motor (11025) is disengaged from the first lead screw (11021).

17. The immersion liquid cooling device according to claim 1, wherein The cover body (102) is pivotally disposed on the housing main body (101); The immersion liquid cooling device further includes a fourth actuating part (111), and the fourth actuating part (111) is configured to enable the cover body (102) to have the open state and the closed state.

18. The immersion liquid cooling device according to claim 17, wherein The housing main body (101) has a first side plate (1011) and a second side plate (1012) orthogonal to the first side plate (1011), the cover body (102) is pivotally disposed on the first side plate (1011), and the top surface of the second side plate (1012) has a guiding groove (1015) disposed in a direction orthogonal to the first side plate (1011); The fourth actuating part (111) includes: A third lead screw (1113) rotatably disposed in the guiding groove (1015) in the horizontal direction; A third nut sleeve (1112) sleeved on the third lead screw (1113); A third connecting rod (1111), one end of the third connecting rod (1111) is pivotally connected to the third nut sleeve (1112), and the other end of the third lead screw (1113) is pivotally connected to the end surface of the cover body (102) facing the accommodating cavity (106); A third motor (1114) whose output end is connected to an axial end of the third lead screw (1113).

19. The immersion liquid cooling device according to claim 1, wherein, It further includes a first tube body (104) and a second tube body (105), the first tube body (104) and the second tube body (105) are disposed on the housing main body (101), and the first tube body (104) and the second tube body (105) are respectively communicated with the accommodating cavity (106); Wherein, one of the first tube body (104) and the second tube body (105) serves as an inlet tube for inputting cooling liquid into the accommodating cavity (106), and the other serves as a drain tube for discharging the cooling liquid from the accommodating cavity (106).

20. An electronic device, characterized in that, Comprising: An immersion liquid cooling device (100) according to any one of claims 1 to 19, the housing main body (101) of the immersion liquid cooling device defines an accommodating cavity (106), and the accommodating cavity (106) has a space therein; An electronic component to be heat-dissipated (200), detachably disposed in the space; Wherein, the electronic component to be heat-dissipated (200) includes at least one of a computing node, a switching node, and a storage node.

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