Method and apparatus for coating a substrate

Abstract

The present disclosure provides a method and apparatus for coating a substrate. An apparatus and method for coating a substrate includes preheating a first portion of the substrate to a first temperature. The method includes spraying a first material from a material applicator such that the first material is applied to the preheated first portion of the substrate. The first material includes a first solvent component and a first coating component. The first temperature is higher than ambient temperature and lower than a boiling point of the first coating component.

Description

Technical Field

[0001] The present disclosure relates to a method and apparatus for coating a substrate. Background Art

[0002] The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.

[0003] Typical coating applicators and methods can result in dripping or flowing of the coating, which can lead to an undesirable aesthetic appearance or functionality of the coating. This can be especially the case when some regions of the substrate to be coated are oriented differently relative to gravity than other regions.

[0004] Additionally, some coating applicators only work with relatively low-viscosity materials, which may have a higher tendency to flow or drip.

[0005] The teachings of the present disclosure address these and other problems of typical coating applicators and methods. Summary of the Invention

[0006] This section provides an overview of the present disclosure and is not a full disclosure of its entire scope or all of its features.

[0007] According to one form, the present disclosure provides a method of coating a substrate, the method comprising: preheating a first portion of the substrate to a first temperature; and ejecting a first material from a material applicator such that the first material is applied to the preheated first portion of the substrate. The first material comprises a first solvent component and a first coating component. The first temperature is higher than ambient temperature and lower than the boiling point of the first coating component.

[0008] In variants of the method of the above paragraphs that can be implemented individually or in any combination: the preheating is performed by a heater located on a robotic tool, where the material applicator is located on the robotic tool; the preheating is performed by an infrared heater; the preheating of the first part of the substrate is performed by a heater that directs heat to the first part of the substrate in a targeted manner, the first part being smaller than the overall substrate; the preheating of the first part of the substrate is performed by a heater that directs heat to the entire substrate; the method further includes preheating a second part of the substrate to a second temperature that is higher than the first temperature and lower than the boiling point of the first coating component, the second part of the substrate being closer to a vertical orientation than the first part of the substrate, and ejecting the first material from the material applicator such that the first material is applied to the preheated second part of the substrate; the method further includes adjusting the first temperature based on the orientation of the first part of the substrate relative to gravity; the method further includes: preheating a second part of the substrate to a second temperature that is different from the first temperature, and ejecting a second material from the material applicator such that the second material is applied to the preheated second part of the substrate, the second material including a second solvent component and a second coating component different from the first coating component, where the second temperature is higher than the ambient temperature and lower than the boiling point of the second coating component; the method further includes adjusting the first temperature based on a characteristic of the first coating component, where the characteristic includes at least one of an absorptivity, a heat absorption coefficient, and a heat transfer coefficient; the preheating of the first part of the substrate is performed by a heater, where the heater is operated while the material applicator ejects the first material, and the method further includes moving the heater and the material applicator relative to the substrate along a path such that the first part is heated by the heater before the ejected first material is applied to the first part; the preheating of the first part of the substrate is performed by a heater, where the heater is operated while the material applicator ejects the first material, and the method further includes moving the substrate relative to the material applicator and the heater along a path such that the first part is heated by the heater before the ejected first material is applied to the first part; the first temperature is in the range of 45 °C to 105 °C (including the end values); the first temperature is sufficient to evaporate one or more solvents of the first solvent component to increase the viscosity of the first material to more than 0.1 Newton-seconds per square meter within 60 seconds of the first material contacting the substrate; the first temperature is sufficient to evaporate one or more solvents of the first solvent component to increase the viscosity of the first material by a predetermined percentage within 60 seconds of the first material contacting the substrate.

[0009] In another form, the present disclosure provides a method of coating a substrate, comprising: preheating a first portion of the substrate to a first temperature; ejecting a first material from a material applicator such that the first material is applied to the preheated first portion of the substrate, the first material comprising a first solvent component and a first coating component, wherein the first temperature is higher than ambient temperature and lower than the boiling point of the first coating component; preheating a second portion of the substrate to a second temperature, the second temperature being higher than the first temperature and lower than the boiling point of the first coating component, the second portion of the substrate being closer to a vertical orientation than the first portion of the substrate; and ejecting the first material from the material applicator such that the first material is applied to the preheated second portion of the substrate.

[0010] In a variation of the method of the above paragraph, the preheating of the first portion of the substrate and the preheating of the second portion of the substrate are performed by a heater that directs heat to the first portion of the substrate in a targeted manner and directs heat to the second portion of the substrate in a targeted manner, the first portion being less than the entirety of the substrate and the second portion of the substrate being less than the entirety of the substrate.

[0011] In another form, the present disclosure provides an apparatus for coating a substrate with at least one material. The apparatus includes: a material applicator; a heater; at least one device configured to provide relative movement between the substrate and the material applicator and between the substrate and the heater; and a controller. The material applicator is configured to eject the at least one material. The controller communicates with the at least one device, the material applicator, and the heater. The controller is configured to control the operation of the at least one device, the material applicator, and the heater such that the heater directs heat toward a first portion of the substrate and the material applicator subsequently applies the at least one material to the heated first portion.

[0012] In variations of the apparatus of the above paragraphs that may be implemented singly or in any combination: at least one material includes a solvent component and a coating component, wherein the controller is configured to operate a heater to heat the first portion to a first temperature that is higher than the ambient temperature and lower than the boiling point of the coating component; the controller is configured to adjust the operation of the heater to heat the first portion to a certain temperature based on the orientation of the first portion of the substrate relative to gravity; the controller is configured to adjust the operation of the heater to heat the first portion to a certain temperature based on the properties of the at least one material, wherein the properties include at least one of absorptivity, heat absorption coefficient, and heat transfer coefficient.

[0013] Based on the description provided herein, additional applicable fields will become apparent. It should be understood that the description and specific examples are intended for illustrative purposes only and are not intended to limit the scope of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] For a better understanding of the present disclosure, various forms of the present disclosure will now be described by way of example with reference to the accompanying drawings, in which:

[0015] Figure 1 is a schematic side view of a spraying system for coating a substrate according to the teachings of the present disclosure;

[0016] Figure 2 is Figure 1 a schematic front view of a material applicator of the spraying system of

[0017] Figure 3 is Figure 2 a schematic front view of an array body of the material applicator of

[0018] Figure 4 is Figure 3 a schematic cross-sectional view of the array body of

[0019] Figure 5 is Figure 1 a schematic side view of a part of the spraying system of

[0020] Figure 6 is Figure 1 a schematic side view of a part of the spraying system of

[0021] Figure 7 a schematic side view of a part of a spraying system according to a second configuration of the teachings of the present disclosure;

[0022] Figure 8 is a schematic side view of a part of a spraying system in a third configuration in accordance with the teachings of the present disclosure; and

[0023] Figure 9 is a schematic side view of a part of a spraying system in a fourth configuration in accordance with the teachings of the present disclosure.

[0024] The accompanying drawings described herein are for illustrative purposes only and are not intended to limit the scope of the present disclosure in any way. Detailed Description

[0025] The following description is merely exemplary in nature and is not intended to limit the present disclosure, application, or uses. It should be understood that throughout the drawings, corresponding reference numerals indicate like or corresponding parts and features. Examples are provided to fully convey the scope of the present disclosure to those skilled in the art. Numerous specific details, such as the types of specific components, devices, and methods, are set forth to provide a thorough understanding of variations of the present disclosure. It will be apparent to those skilled in the art that specific details are not required and that the examples provided herein may include alternative embodiments and are not intended to limit the scope of the present disclosure. In some examples, well-known processes, well-known device structures, and well-known techniques are not described in detail.

[0026] The present disclosure provides various devices, methods, and systems for controlling the application of coatings to motor vehicles in a high-volume production environment, which reduce overspray and improve the conversion efficiency of coatings. It should be understood that the reference to motor vehicles is merely exemplary, and in accordance with the teachings of the present disclosure, other objects to be painted (such as industrial equipment and appliances, etc.) can also be painted. Additionally, the use of "coating" or "painting" should not be construed as limiting the present disclosure, and thus other materials such as coatings, primers, sealants, cleaning solvents, etc. should be understood to fall within the scope of the present disclosure.

[0027] Generally, the teachings of the present disclosure are based on a droplet spray generating device, where a perforated membrane is driven by a piezoelectric transducer. Such devices and their variations are described in U.S. Patent Nos. 6,394,363, 7,550,897, 7,977,849, 8,317,299, 8,191,982, 9,156,049, 7,976,135, 9,452,442 and U.S. Published Application Nos. 2014 / 0110500, 2016 / 0228902, and 2016 / 0158789, which patents are incorporated herein by reference in their entirety.

[0028] Now referring to Figure 1, which schematically depicts a side view of a spraying system 100 for painting or coating a part or substrate 101 using a robotic tool (e.g., robotic arm 102). Although the robotic arm 102 is shown, other robotic tools may also be used, as described below. The robotic arm 102 is coupled to at least one material applicator 104 and a frame 106. A material source 108 (e.g., a paint source) is included and includes at least one material M( Figure 1 The material M shown in 1 , M 2 , M 3 ,......, M n ; also simply referred to herein as "material M"). In some aspects of the present disclosure, the at least one material M includes different paint materials, different adhesive materials, different sealant materials, etc. The robotic arm 102 moves relative to the frame 106 according to XYZ coordinates such that the material applicator 104 moves on the surface S (marked in Figure 4 ) of the substrate 101. Moreover, a power supply 110 is configured to supply power to the robotic arm 102 and the frame 106. The robotic arm 102 and the frame 106 are configured to supply the material M from the material source 108 to the material applicator 104 such that a coating is applied to the surface of the substrate 101.

[0029] The earth's gravity (i.e., gravity) acts in the negative Z direction of the coordinate system used herein.

[0030] Reference Figure 2 , which schematically shows a front view of a material applicator 104 or atomizer according to the teachings of the present disclosure. The material applicator 104 may also be referred to as a print head. In one form of the present disclosure, the material applicator 104 includes an array body 210 or nozzle having an applicator array 212, the applicator array including a plurality of micro applicators 214 or sub-nozzles. In some aspects of the present disclosure, the array body 210 having the applicator array 212 is positioned on a base 216. In one configuration, the base 216 is supported at the end of an articulated robotic arm 102( Figure 1 ). In another configuration, the base 216 is supported by a gantry (not shown) or a boom (not shown), which may be stationary (when the substrate 101 moves) or robotic, to move relative to the substrate 101 in one, two, or three dimensions (shown in Figure 4 ). Each of the micro applicators 214 includes a plurality of holes 218 through which the material M( Figure 4 ) is ejected such that atomized droplets 220( Figure 4 ) of the material are provided.

[0031] As described above, the material M( Figure 4)Typically a liquid material (e.g., primer, base coat, clear coat, etc.), but optionally includes dispersed solids (such as metal particles or other particles) to provide a particular aesthetic appearance. The material M includes a coating component and a solvent component. The coating component is configured to remain on the substrate 101 after drying or curing to form a finished coating. The coating component may include one or more coating materials. It should be understood that the substrate 101 prior to coating the coatings discussed herein may have an original surface coated with a coating or may already have one or more other coatings (e.g., primer) thereon. The solvent component is a solvent or solvent blend configured to reduce the viscosity of the material below the viscosity of the coating component. The solvent component is configured such that the viscosity of the material M allows the material M to be ejected from the small holes 218 when the microapplicator plate 312 is actuated by the actuator 314, but is sufficient to inhibit the outflow of the material M from the plurality of holes 218 when the actuator 314 is turned off. The solvent component is configured to evaporate faster than the coating component at a temperature below the boiling point of the coating component.

[0032] The microapplicators 214 may be arranged in any configuration (such as a regular or irregular pattern across the array body 210). Although shown as circular in shape, the array body 210 may be of any shape. For example, in one form, the array body 210 may be linear or rectangular in shape, and the microapplicators 214 may be arranged in a linear or rectangular pattern.

[0033] Reference Figure 3 and Figure 4 , each of the microapplicators 214 includes a nozzle body 310, a microapplicator plate 312, and an actuator 314. Each microapplicator plate 312 defines a plurality of holes 218 extending therethrough. The actuator 314 may be a transducer, such as a piezoelectric material. The microapplicator plate 312 is in mechanical communication with the actuator 314 such that activation of the actuator 314 (e.g., a control module 112 that supplies power to the actuator 314) causes the microapplicator plate 312 to vibrate or oscillate, as Figure 4 schematically depicted by the horizontal (z - direction) double - headed arrow in

[0034] In the example provided, the array body 210 includes a material inlet 316 corresponding to each microapplicator 214. The array body 210 includes a rear wall 318 and at least one side wall 320 such that a reservoir 322 for containing the material M is provided between the rear wall 318 and the microapplicator plate 312. In the example provided, the at least one side wall 320 is a single cylindrical side wall. In another form, the at least one side wall 320 includes a plurality of side walls or surfaces defining the perimeter of the reservoir 322. In the example provided, the rear wall 318, the side wall 320, and the side of the microapplicator plate 312 facing the rear wall 318 cooperate to define the reservoir 322. The inlet 316 is in fluid communication with the reservoir 322 such that the material M flows through the inlet 316 and into the reservoir 322. In the example provided, the actuator 314 is positioned to contact the microapplicator plate 312 near the outer perimeter of the microapplicator plate 312. In another form, not specifically shown, the actuator 314 is positioned between the microapplicator plate 312 and the nozzle body 310 such that the nozzle body 310 supports the actuator 314 and the actuator 314 supports the microapplicator plate 312. In one configuration, the actuator 314 is an annular shape disposed about the axis 410 of the microapplicator plate 214. In another configuration, not specifically shown, the actuator 314 may be integrally formed with the microapplicator plate 312 such that supplying power to the microapplicator plate 312 causes the microapplicator plate 312 to oscillate. In the example provided, the control module 112( Figure 1 ) is in electrical communication with the actuator 314 to supply power to the actuator 314 and control the operation of the actuator.

[0035] Still referring to Figure 4 , the material M is supplied to the reservoir 322 at a very low pressure or no pressure such that the surface tension of the material M prevents the material M from flowing through the holes 218 of the microapplicator plate 312 unless the actuator 314 is activated and oscillating. That is, when the actuator 314 is activated and vibrating, the material M is ejected through and / or from the plurality of holes 218 to provide a stream of atomized droplets 220. The stream of atomized droplets 220 propagates generally parallel to the microapplicator axis 410 and forms a coating C on the surface S of the substrate 101. The substrate 101 can be any suitable workpiece, such as a vehicle part, a frame, or a body. As Figure 4 schematically depicted, the atomized droplets 220 have a narrow droplet size distribution (e.g., average droplet diameter).

[0036] Referring to Figure 5, the heater 510 can be positioned to preheat the substrate 101 before the material applicator 104 deposits the material M on the substrate 101. The heater 510 can be of any suitable type. In one form, the heater 510 is an infrared radiation (IR) heater. In another form, the heater 510 is a convection heater.

[0037] In the provided example, with respect to the movement of the material applicator 104 relative to the substrate 101, the heater 510 is positioned in front of the material applicator 104. In the provided example, the heater 510 is mounted adjacent to the material applicator 104 on the robotic arm 102 to move with it. The control module 112 is configured to control the end of the robotic arm 102 to move along a predetermined path such that the material applicator 104 and the heater 510 are spaced apart from the substrate 101, and such that the heater 510 heats the portion 514 of the substrate 101 in a targeted manner immediately before the material applicator 104 applies the material M to the portion 514. In other words, the heater can be configured to heat less than the entire substrate.

[0038] In another form not specifically shown, the heater 510 can be mounted to a separate robotic arm that is controlled by the control module 112 to follow a predetermined path simultaneously with but immediately before the robotic arm 102 having the material applicator 104, and to follow the predetermined path to apply the material M to the portion 514 after heating the portion 514 in a targeted manner. In other words, the heater can be configured to heat less than the entire substrate.

[0039] In another form not specifically shown, the heater can heat the entire substrate immediately before the material applicator 104 deposits the material M. For example, the substrate 101 can be placed inside a heating chamber (not shown), and then the material applicator 104 can apply the material M inside the chamber or immediately after removing the heated substrate 101 from the chamber.

[0040] Returning to the provided example, the paths followed by the heater 510 and the material applicator 104 are relative to the path of the substrate 101. In other words, the robotic tool (e.g., the robotic arm 102) can move the heater 510 and the material applicator 104 while the substrate 101 remains stationary, or the heater 510 and the material applicator 104 can remain stationary while the robotic tool (e.g., the robotic arm 102 or the conveyor system) moves the substrate 101 or one or more robotic tools can move the substrate 101, the heater 510, and the material applicator 104. In other words, as used herein, statements such as the heater 510 and the material applicator 104 move relative to the substrate 101 encompass all such configurations and do not refer only to the heater 510 and the material applicator 104 moving relative to the ground, unless so specifically described.

[0041] The heater 510 and the material applicator 104 can follow any path relative to the substrate 101. Although the portion of the substrate 101 shown in Figures 5 to 9 is shown as being flat for simplicity of illustration, the substrate 101 can also have any shape and can include curved and / or curvilinear portions. The paths of the heater 510 and the material applicator 104 relative to the substrate 101 can follow the curved and curvilinear portions of the substrate 101.

[0042] is shown in a number of alternative coordinate sets Figure 5 to show variations of a portion of the paths that the heater 510 and the material applicator 104 can take relative to the substrate 101. Although the relative movement in the X direction is shown by the arrow 516, it should be understood that the path can optionally be a two-dimensional or three-dimensional path that can include relative movement in other directions. In one form, a portion of the path can be such that gravity acts on the atomized droplets 220 transverse to the path and substantially parallel to the surface of the substrate 101 (e.g., into or out of Figure 5 the page shown in Figure 5 ). In another form, a portion of the path can be such that gravity acts on the atomized droplets 220 transverse to the path and toward the surface of the substrate 101 (e.g., downward as shown in Figure 5 ). In another form, a portion of the path can be such that gravity acts on the atomized droplets 220 transverse to the path and away from the surface of the substrate 101 (e.g., upward as shown in Figure 5 ).

[0043] is shown in a number of alternative coordinate sets Figure 6 to show variations of a portion of the paths that the heater 510 and the material applicator 104 can take relative to the substrate 101. Although the relative movement in the Z direction is shown by the arrow 616, it should be understood that the path can optionally be a two-dimensional or three-dimensional path that can include relative movement in other directions. In one form, a portion of the path can be such that gravity acts on the atomized droplets 220 substantially parallel to the path and substantially parallel to the surface of the substrate 101 (e.g., upward or downward as shown in Figure 5 ).

[0044] Although shown for ease of illustration Figure 5 and Figure 6 as having paths along the X axis or the Z axis, it should be understood that the path and orientation of the substrate 101 can not be directly along either axis such that gravity can act at an angle relative to the substrate 101 such that gravity acts in a direction that is not perpendicular or parallel to the substrate 101.

[0045] The path can be such that it traverses more than one portion of the substrate, where different portions are in different orientations relative to gravity. In other words, some portions of the substrate 101 can be more vertical (i.e., less horizontal) than other portions. For example, the path can be such that the heater 510 and the material applicator 104 traverse a first portion and then traverse a second portion. In one form, the second portion can be in an orientation such that gravity will tend to cause more dripping than the orientation of the first portion. For example, the second portion can be closer to a vertical orientation than the first portion, or gravity can act more in a direction away from the surface of the substrate 101 (e.g., when the second portion is the underside of the substrate 101).

[0046] The control module 112 is configured to operate the heater 510 and the material applicator 104 simultaneously as they move along the path relative to the substrate 101 such that a particular portion is first preheated and then the material is applied to the preheated portion. The control module 112 is configured to operate the heater 510 to heat the substrate 101 to a temperature that is above ambient temperature but below the boiling point of the material M. The temperature is sufficient to cause one or more solvents in the solvent component to evaporate to increase the viscosity of the material M.

[0047] In one form, the temperature can be below the curing point of the coating component and below the boiling point of the solvent component. In one form, the temperature can be higher than or equal to 45 °C, and in some forms, can be higher than or equal to 60 °C. In one form, the temperature can be equal to or below 105 °C. In one form, the temperature may be sufficient to evaporate one or more solvents of the first solvent component to increase the viscosity of the first material to be equal to or higher than a predetermined viscosity within a predetermined time range of contacting the substrate 101. In one form, the predetermined viscosity can be achieved within 60 seconds of the first material contacting the substrate 101. In one form, the predetermined viscosity can be achieved within 30 seconds of the first material contacting the substrate 101. In another form, the predetermined viscosity can be achieved within 20 seconds of the first material contacting the substrate 101. In one form, the predetermined viscosity can be 100 centipoise (0.1 Newton-second per square meter). In one form, the temperature may be sufficient to evaporate one or more solvents of the solvent component to increase the viscosity of the material M by a predetermined percentage within a predetermined time range of contacting the substrate 101. In one form, the predetermined time range can be 60 seconds. In another form, the predetermined time range can be 30 seconds. In another form, the predetermined time range can be 20 seconds. In one form, the predetermined percentage can be in the range of 120% to 200% (including the end values).

[0048] The control module 112 can be configured to adjust the operation of the heater 510 based on the orientation of a portion of the substrate 101 relative to gravity to adjust the temperature to which the heater heats the portion of the substrate 101. In the example provided above, the control module 112 can be configured to operate the heater 510 to preheat a first portion to a first temperature and a second portion to a second temperature higher than the first temperature. The first temperature and the second temperature are each higher than the ambient temperature and lower than the boiling point of the coating component. This may cause more of the solvent component to evaporate faster along the second portion than along the first portion to reduce flow or dripping along the second portion.

[0049] Alternatively or additionally, the control module 112 can be configured to adjust the operation of the heater 510 based on the overall properties of the material M being ejected or based on the properties of the coating component or based on the properties of the solvent component to adjust the temperature at which it heats the portion of the substrate 101. For example, the control module 112 can be configured to eject a first material along one portion of the substrate 101 and a different second material along a different portion of the substrate 101. The second material can have different solvent components and / or different absorption rates, and / or different heat absorption coefficients, and / or different heat transfer coefficients. For example, the control module 112 can be configured to adjust the operation of the heater 510 such that for a material that tends to evaporate faster, the temperature of the portion of the substrate 101 to which it will be applied will be lower than the temperature of the portion of the substrate 101 to which a material that tends to evaporate slower is applied.

[0050] Reference Figure 7 , in another form, the heater 510 can be positioned to direct heat toward the side of the substrate 101 opposite the material applicator 104. In this form, the heater 510 can be coupled to the same robotic tool (e.g., robotic arm 102) or a separate robotic tool controlled by the control module 112, or the heater can be stationary if the robotic tool is configured to move the substrate 101 relative to the ground.

[0051] Reference Figure 8 , in another form, a second heater 810 can be positioned to direct heat toward the side of the substrate 101 opposite the material applicator 104 and the heater 510. In this form, the heater 810 can be coupled to the same robotic tool (e.g., robotic arm 102) or a separate robotic tool controlled by the control module 112, or the heater can be stationary if the robotic tool is configured to move the substrate 101 relative to the ground.

[0052] Reference Figure 9, in another form, the second heater 910 and the second material applicator 912 can be positioned to heat the material and direct the material toward the side of the substrate 101 opposite to the material applicator 104 and the heater 510. The material ejected by the second material applicator 912 can be the same as or different from the material ejected from the material applicator 104. The second heater 910 and the second material applicator 912 can be similar to the heater 510 and the material applicator 104. The second heater 910 and the second material applicator 912 can be directly opposite to the heater 510 and the material applicator 104 and follow similar but mirror-image paths on opposite sides of the substrate 101, or can follow different paths. In this form, the heater 910 and the second material applicator 912 can be coupled to the same robotic tool (e.g., the robotic arm 102) or separate robotic tools controlled by the control module 112, or if the robotic tool is configured to move the substrate 101 relative to the ground, the heater can be stationary.

[0053] Although not specifically shown, in any of the configurations shown and described herein, additional heaters can be mounted adjacent to the material applicator 104 and / or the second material applicator 912 to follow the material applicator 104 and / or the second material applicator 912 to further dry or cure the coating C after the coating is applied.

[0054] In any of the configurations shown and described herein, one or more sensors (not specifically shown) can communicate with the control module 112 and be configured to detect the temperature of a portion of the substrate 101. The sensors can optionally be non-contact sensors such that they do not contact the substrate 101.

[0055] For this purpose, the present disclosure also includes a method for coating a substrate using the spraying system 100 as discussed above. In the method, the control module 112 is configured to control the operation of the heater, the robotic tool, and the material applicator to perform the steps of the method.

[0056] In one form, the method includes: preheating a first portion of the substrate 101 to a first temperature; and ejecting a first material from the material applicator 104 such that the first material is applied to the preheated first portion of the substrate 101. The first material includes a first solvent component and a first coating component. The first temperature is higher than the ambient temperature and lower than the boiling point of the first coating component.

[0057] In one form, the preheating can be performed by a heater located on the robotic tool (e.g., the robotic arm 102), and the material applicator 104 can be located on the robotic tool.

[0058] In one form, preheating can be performed by an infrared heater (e.g., heater 510).

[0059] In one form, preheating of a first portion of substrate 101 can be performed by heater 510, which directs heat to the first portion of substrate 101 in a targeted manner, the first portion being less than the entirety of substrate 101.

[0060] In one form, preheating of a first portion of substrate 101 can be performed by a heater (not specifically shown) that directs heat to the entirety of the substrate.

[0061] In one form, the method can include preheating a second portion of the substrate to a second temperature that is higher than the first temperature and lower than the boiling point of the first coating component. The second portion of substrate 101 is closer to a vertical orientation than the first portion of substrate 101. The method can further include: ejecting a first material from material applicator 104 such that the first material is applied to the preheated second portion of substrate 101.

[0062] In one form, the method can further include adjusting the first temperature based on the orientation of the first portion of substrate 101 relative to gravity.

[0063] In one form, the method can further include: preheating a second portion of substrate 101 to a second temperature that is different from the first temperature; and ejecting a second material from material applicator 104 such that the second material is applied to the preheated second portion of substrate 101. The second material can include a second solvent component and a second coating component different from the first coating component. The second temperature is higher than ambient temperature and lower than the boiling point of the second coating component.

[0064] In one form, the method can include adjusting the first temperature based on a property of the first coating component, where the property includes at least one of absorptivity, heat absorption coefficient, and heat transfer coefficient.

[0065] In one form, preheating of a first portion of the substrate can be performed by a heater (e.g., heater 510), where the heater is operated while material applicator 104 ejects a first material, and the method further includes: moving the heater and material applicator 104 relative to substrate 101 along a path such that the first portion is heated by the heater before the ejected first material is applied to the first portion.

[0066] In one form, preheating of a first portion of the substrate 101 can be performed by a heater (e.g., heater 510), where the heater is operated while the material applicator 104 jets a first material, and the method further includes: moving the substrate 101 relative to the material applicator 104 and the heater along a path such that the first portion is heated by the heater before the jetted first material is applied to the first portion.

[0067] In one form, the first temperature is in the range of 45 °C to 105 °C (including the end values).

[0068] In another form, the first temperature is in the range of 60 °C to 105 °C (including the end values).

[0069] In one form, the first temperature may be sufficient to evaporate one or more solvents of the first solvent component to increase the viscosity of the first material to higher than 0.1 Newton-seconds per square meter within 60 seconds of the first material contacting the substrate.

[0070] In one form, the temperature can be below the curing point of the coating component and below the boiling point of the solvent component.

[0071] In one form, the temperature can be higher than or equal to 45 °C.

[0072] In one form, the temperature can be higher than or equal to 60 °C.

[0073] In one form, the temperature can be below 105 °C.

[0074] In one form, the temperature may be sufficient to evaporate one or more solvents of the first solvent component to increase the viscosity of the first material to equal to or higher than a predetermined viscosity within a predetermined time range of contacting the substrate 101. In one form, this predetermined viscosity can be achieved within 60 seconds of the first material contacting the substrate 101. In one form, this predetermined viscosity can be achieved within 30 seconds of the first material contacting the substrate 101. In another form, this predetermined viscosity can be achieved within 20 seconds of the first material contacting the substrate 101. In one form, this predetermined viscosity can be 100 centipoise (0.1 Newton-seconds per square meter).

[0075] In one form, the temperature may be sufficient to evaporate one or more solvents of the solvent component to increase the viscosity of material M by a predetermined percentage within a predetermined time range of contacting the substrate 101. In one form, this predetermined time range can be 60 seconds. In another form, this predetermined time range can be 30 seconds. In another form, this predetermined time range can be 20 seconds. In one form, this predetermined percentage can be in the range of 120% to 200% (including the end values).

[0076] In another form, the present disclosure provides a method of coating a substrate 101, the method including preheating a first portion of the substrate 101 to a first temperature. The method includes: ejecting a first material from a material applicator 104 such that the first material is applied to the preheated first portion of the substrate 101, the first material including a first solvent component and a first coating component. The first temperature is higher than the ambient temperature and lower than the boiling point of the first coating component. The method includes preheating a second portion of the substrate 101 to a second temperature, the second temperature being higher than the first temperature and lower than the boiling point of the first coating component. The second portion of the substrate 101 is closer to a vertical orientation than the first portion of the substrate. The method includes: ejecting the first material from the material applicator 104 such that the first material is applied to the preheated second portion of the substrate 101.

[0077] In one form, the preheating of the first portion of the substrate 101 and the preheating of the second portion of the substrate 101 are performed by a heater (e.g., heater 510), the heater directing heat to the first portion of the substrate 101 in a targeted manner and directing heat to the second portion of the substrate 101 in a targeted manner, the first portion being less than the entirety of the substrate 101 and the second portion of the substrate being less than the entirety of the substrate 101.

[0078] Unless expressly indicated otherwise herein, all numerical values indicating mechanical / thermal properties, percentage compositions, dimensions, and / or tolerances or other characteristics should be understood to be modified by the word "about" or "approximately" when describing the scope of the present disclosure. This modification is desired for various reasons, including: industrial practice; material, manufacturing, and assembly tolerances; and test capabilities.

[0079] As used herein, the phrase "at least one of A, B, and C" should be construed to represent the logic (A or B or C) using non-exclusive logic "or" and should not be construed to mean "at least one of A, at least one of B, and at least one of C".

[0080] In the present application, the terms "controller" and / or "module" may refer to, be part of, or include the following: application specific integrated circuit (ASIC); digital, analog, or mixed analog / digital discrete circuits; digital, analog, or mixed analog / digital integrated circuits; combinational logic circuits; field programmable gate array (FPGA); processor circuits (shared, dedicated, or group) that execute code; memory circuits (shared, dedicated, or group) that store code executed by the processor circuits; other suitable hardware components that provide the described functionality (e.g., operational amplifier circuit integrator as part of a heat flux data module); or a combination of some or all of the above, such as in a system-on-chip.

[0081] The term memory is a subset of the term computer-readable medium. As used herein, the term computer-readable medium does not encompass transitory electrical or electromagnetic signals propagated through a medium such as on a carrier wave; thus, the term computer-readable medium can be considered tangible and non-transitory. Non-limiting examples of non-transitory tangible computer-readable media are non-volatile memory circuits such as flash memory circuits, erasable programmable read-only memory circuits, or mask read-only circuits, volatile memory circuits such as static random access memory circuits or dynamic random access memory circuits, magnetic storage media such as analog or digital magnetic tape or hard disk drives, and optical storage media such as CDs, DVDs, or Blu-ray discs.

[0082] The devices and methods described in this application can be implemented, in part or in whole, by a special-purpose computer created by configuring a general-purpose computer to execute one or more specific functions embodied in a computer program. The functional blocks, flowchart components, and other elements described above serve as software specifications that can be translated into a computer program by routine work of a technician or programmer.

[0083] The description of the present disclosure is merely exemplary in nature and, thus, variations that do not depart from the substance of the present disclosure are intended to be within the scope of the present disclosure. Such variations should not be regarded as departing from the spirit and scope of the present disclosure.

[0084] According to the present invention, a method of coating a substrate includes: preheating a first portion of the substrate to a first temperature; ejecting a first material from a material applicator such that the first material is applied to the preheated first portion of the substrate, the first material including a first solvent component and a first coating component, wherein the first temperature is higher than ambient temperature and lower than the boiling point of the first coating component; preheating a second portion of the substrate to a second temperature, the second temperature being higher than the first temperature and lower than the boiling point of the first coating component, the second portion of the substrate being closer to a vertical orientation than the first portion of the substrate; and ejecting the first material from the material applicator such that the first material is applied to the preheated second portion of the substrate.

[0085] In one aspect of the present invention, the preheating of the first portion of the substrate and the preheating of the second portion of the substrate are performed by a heater that directs heat to the first portion of the substrate in a targeted manner and directs heat to the second portion of the substrate in a targeted manner, the first portion being less than the whole of the substrate and the second portion of the substrate being less than the whole of the substrate.

[0086] In one aspect of the present invention, the preheating is performed by an infrared heater.

[0087] In one aspect of the present invention, the first temperature is in the range of 45°C to 105°C (including the end values).

Claims

1. A method for coating a substrate, comprising: preheating a first portion of the substrate to a first temperature; as well as A first material is ejected from a material applicator such that the first material is applied to the preheated first portion of the substrate, the first material comprising a first solvent component and a first coating component, wherein the first temperature is above ambient temperature and below a boiling point of the first coating component. 2 . The method of claim 1 , wherein the preheating is performed by a heater located on a robotic tool, wherein the material applicator is located on the robotic tool. 3 . The method of claim 1 , wherein the preheating of the first portion of the substrate is performed by a heater that directs heat to the first portion of the substrate in a targeted manner, the first portion being smaller than an entirety of the substrate. 4 . The method of claim 1 , wherein the preheating of the first portion of the substrate is performed by a heater that directs heat to an entirety of the substrate.

5. The method according to claim 1, further comprising: preheating a second portion of the substrate to a second temperature, the second temperature being greater than the first temperature and less than the boiling point of the first coating component, the second portion of the substrate being closer to a vertical orientation than the first portion of the substrate; as well as The first material is ejected from the material applicator such that the first material is applied to the preheated second portion of the substrate.

6. The method according to claim 1, further comprising: The first temperature is adjusted based on an orientation of the first portion of the substrate relative to gravity.

7. The method of claim 1 , further comprising preheating a second portion of the substrate to a second temperature, the second temperature being different from the first temperature; and A second material is ejected from the material applicator so that the second material is applied to the preheated second portion of the substrate, the second material comprising a second solvent component and a second coating component different from the first coating component, wherein the second temperature is above the ambient temperature and below a boiling point of the second coating component.

8. The method of claim 1, further comprising adjusting the first temperature based on a property of the first coating component, wherein the property comprises at least one of absorptivity, a heat absorption coefficient, and a heat transfer coefficient.

9. The method of claim 1 , wherein the preheating of the first portion of the substrate is performed by a heater, wherein the heater is operated while the material applicator jets the first material, and the method further comprises at least one of: moving the heater and the material applicator along a path relative to the substrate such that the first portion is heated by the heater prior to applying the ejected first material to the first portion; and The substrate is moved along a path relative to the material applicator and the heater such that the first portion is heated by the heater prior to applying the jetted first material to the first portion.

10. The method of any one of claims 1 to 9, wherein the first temperature is sufficient to evaporate one or more solvents of the first solvent component to increase the viscosity of the first material to above 0.1 Newton seconds per square meter within 60 seconds of the first material contacting the substrate.

11. The method of any one of claims 1 to 9, wherein the first temperature is sufficient to evaporate one or more solvents of the first solvent component to increase the viscosity of the first material by a predetermined percentage within 60 seconds of the first material contacting the substrate.

12. An apparatus for coating a substrate with at least one material, the apparatus comprising: a material applicator configured to eject the at least one material; Heater; at least one device configured to provide relative movement between the substrate and the material applicator and between the substrate and the heater; as well as a controller in communication with the at least one device, the material applicator, and the heater, wherein the controller is configured to control operation of the at least one device, the material applicator, and the heater such that the heater directs heat toward a first portion of the substrate and the material applicator subsequently applies the at least one material to the heated first portion.

13. The apparatus of claim 12, wherein the at least one material comprises a solvent component and a coating component, wherein the controller is configured to operate the heater to heat the first portion to a first temperature that is above ambient temperature and below a boiling point of the coating component.

14. The apparatus of claim 12, wherein the controller is configured to adjust operation of the heater to heat the first portion of the substrate to a certain temperature based on an orientation of the first portion relative to gravity.

15. The apparatus of claim 12, wherein the controller is configured to adjust operation of the heater to heat the first portion to a temperature based on a property of the at least one material, wherein the property comprises at least one of an absorptivity, a heat absorption coefficient, and a heat transfer coefficient.

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