Mobile phone mainboard desoldering device with collecting mechanism

Abstract

The invention relates to the technical field of desoldering devices, and discloses a mobile phone mainboard desoldering device with a collecting mechanism, which comprises a workbench, a fixing device, a tin collecting device, a knocking device and a jacking device, a supporting plate is fixedly connected to the top of the workbench, a desoldering head is fixedly connected to the lower surface of the supporting plate, a collecting box is slidably connected to the inner wall of the workbench, and an elastic arc plate is fixedly connected to the inner wall of the workbench. The fixing device comprises a rotating plate, a rotating rod, a motor, a clamping plate and a rubber block, the rotating plate is rotationally connected to the inner wall of the workbench, the rotating rod is fixedly connected to the inner wall of the rotating plate, the motor is fixedly connected to the front portion of the workbench, and the clamping plate is slidably connected to the inner wall of the rotating plate through an elastic piece; according to the device, discharged and collected elements can be buffered, and damage caused by collision during element collection is prevented.

Description

Technical Field

[0001] The present invention relates to the technical field of desoldering devices, and specifically to a mobile phone motherboard desoldering device with a collection mechanism. Background Art

[0002] Mobile phone motherboard desoldering refers to the process of removing some components (such as chips, connectors, etc.) from the motherboard of a mobile phone.

[0003] The patent with the application number CN202222354029.2 provides a mobile phone motherboard desoldering device with a collection mechanism, including the main body of the mobile phone motherboard desoldering device. There are a feeding port and a discharging port respectively arranged on both sides of the main body of the mobile phone motherboard desoldering device. A protective cover is placed at the discharging port of the main body of the mobile phone motherboard desoldering device. A collection mechanism is arranged inside the protective cover. The collection mechanism includes a distance-adjustable lifting part placed inside the protective cover. A material receiving part is arranged on the distance-adjustable lifting part. A limiting part is arranged between the material receiving part and the distance-adjustable lifting part. Through the arranged collection mechanism in this application, the distance-adjustable lifting part in the collection mechanism can drive the material receiving part to move up and down. The material receiving part can collect the carrier carrying the motherboard. The materials collected by the material receiving part are limited by the limiting part, thereby realizing automatic material collection, that is, workers do not need to stay at the discharging port all the time, reducing the labor input and being beneficial to use. However, when collecting the components desoldered from the motherboard and the motherboard, the components and the motherboard will fall into the carrier, and the direct dropping easily causes collisions between the motherboard and the components and the carrier, resulting in damage to the components. Therefore, a mobile phone motherboard desoldering device with a collection mechanism is proposed to solve the above-mentioned problems. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a mobile phone motherboard desoldering device with a collection mechanism aiming at the deficiencies in the above-mentioned prior art.

[0005] To solve the above technical problems, the technical solution adopted by the present invention is: a mobile phone motherboard desoldering and soldering device with a collection mechanism, including a workbench, and further including a fixing device, a tin collection device, a knocking device, and a lifting device; a support plate is fixedly connected to the top of the workbench, a desoldering head is fixedly connected to the lower surface of the support plate, a collection box is slidably connected to the inner wall of the workbench, and an elastic arc plate is fixedly connected to the inner wall of the workbench; the fixing device includes a rotating plate, a rotating rod, a motor, a clamping plate, and a rubber block, the rotating plate is rotatably connected to the inner wall of the workbench, the rotating rod is fixedly connected to the inner wall of the rotating plate, the motor is fixedly connected to the front of the workbench, the clamping plate is slidably connected to the inner wall of the rotating plate through an elastic member, and the rubber block is slidably connected to the inner wall of the clamping plate through an elastic member; the tin collection device is arranged on the inner wall of the workbench, the knocking device is arranged on the lower surface of the rotating plate, and the lifting device is arranged on the lower surface of the elastic arc plate; the output end of the motor is fixedly connected to the front end of the rotating rod, the surface of the rotating rod is rotatably connected to the inner wall of the workbench, an arc surface is arranged on the inner wall of the workbench, the collection box is located below the elastic arc plate, push one side of the motherboard into the clamping plate on one side, at this time the clamping plate will move and compress the elastic member, and then push the other side of the motherboard into the clamping plate on the other side, at this time the elastic member will push the four clamping plates together to clamp the motherboard, preventing the motherboard from shaking during desoldering, thereby affecting the desoldering effect of the motherboard. At the same time, when the clamping plate clamps the motherboard, the rubber block in the clamping plate will press the motherboard from top to bottom on the rotating plate under the action of the elastic member, further limiting and fixing it, and it can be applicable to motherboards of different thicknesses. When the components on the motherboard are desoldered, the motor will start and drive the rotating rod to rotate, the rotating rod will drive the rotating plate to rotate, and then the rotating plate will drive the motherboard to rotate and face downwards. At this time, the desoldered components on the motherboard will fall on the elastic arc plate, and the elastic arc plate will buffer them, so that the components slide down from both sides of the arched elastic arc plate to the inner wall of the workbench and finally fall into the collection box to achieve the collection of components. When the rotating plate drives the motherboard to rotate, at the same time, the rotation of the rotating plate will push the upward-arched elastic arc plate to arch downwards. When the rotating plate passes over the elastic arc plate, the elastic arc plate will reset again through its own elastic force and arch upwards. When arching upwards, it can promote the components on the surface to slide to both sides, improving the collection effect.

[0006] Preferably, the tin collecting device includes a first heating plate, a filter plate and a box body. The first heating plate is fixedly connected to the inner wall of the workbench, the filter plate is fixedly connected to the inner wall of the workbench, and the box body is fixedly connected to both sides of the collecting box. The tin collecting device further includes an inclined plate, a second heating plate, an outer plate and an inner plate. The inclined plate is fixedly connected to the bottom wall inside the box body, the second heating plate is fixedly connected to the top of the inclined plate, the outer plate is rotatably connected to the nickel coin at the front of the box body through a torsion spring, and the inner plate is slidably connected to the inner wall of the outer plate through a spring. The front part of the inner plate is in contact with the inner wall of the workbench, the surface of the box body is in contact with the inner wall of the workbench, the filter plate is made of heat-conducting metal, and the top of the second heating plate is in contact with the bottom of the filter plate. When the component falls on the inner wall of the workbench, the tin liquid generated during desoldering will also fall on the inner wall of the workbench at the same time, and fall into the box body through the arc-shaped inner wall of the workbench. The first heating plate will heat the inner wall of the workbench to prevent the tin liquid from solidifying and thus being unable to be collected. When the tin liquid and the component slide to the filter plate, the filter plate will separate the component and the tin liquid, and the tin liquid will pass through the filter plate and enter the box body to be collected. After the tin liquid enters the box body, it will slide down through the inclined plate and accumulate in the front area of the box body. The second heating plate will heat the filter plate to prevent the filter plate from having a low temperature and causing the tin liquid to cool in the filter holes, thereby causing blockage of the filter plate. When the collecting box is pulled out, it will drive the box body to be pulled out together. At this time, the box body will drive the outer plate to move forward, the outer plate will drive the inner plate to move forward, and the inner plate will be blocked by the inner wall of the workbench and rotate. The inner plate will drive the outer plate to rotate. Then the worker manually rotates the outer plate so that the inner plate rotates to the lower part, and the inner plate will push out the tin blocks that have accumulated and cooled and solidified in front of the box body to prevent the tin blocks from adhering to the inner wall of the box body and being difficult to take out and recycle.

[0007] Preferably, the knocking device includes a first magnet, a second magnet, a fixing plate, a transmission plate and a knocking block. The first magnet is slidably connected to the inner wall of the rotating plate through an elastic member. The second magnet is fixedly connected to the inner wall of the workbench. The fixing plate is fixedly connected to the bottom of the rotating plate. The transmission plate is rotatably connected to the surface of the fixing plate through a torsion spring. The knocking block is fixedly connected to the upper surface of the transmission plate. The knocking device further includes a first elastic plate, an elastic telescopic rod and a first magnetic plate. Both sides of the first elastic plate are fixedly connected to the lower surface of the rotating plate. The elastic telescopic rod is fixedly connected to the upper surface of the first elastic plate. The first magnetic plate is fixedly connected to the lower surface of the first elastic plate. The surface of the elastic telescopic rod is in contact with the inner wall of the rotating plate. The surface of the knocking block is in contact with the lower surface of the first elastic plate. The surface of the transmission plate is in contact with the surface of the first magnet. The first magnet and the second magnet attract each other magnetically. The surface of the transmission plate is in contact with the inner wall of the rotating plate. When the rotating plate rotates 180 degrees, the main board on the rotating plate faces a certain direction. At this time, the second magnet will attract the first magnet through magnetic attraction. The first magnet will move in the rotating plate and push the transmission plate to rotate. The transmission plate will drive the knocking block to displace. The knocking block will knock on the rotating plate, causing the rotating plate and the main board on its surface to vibrate. The vibration can prompt the remaining solder on the main board to fall off, preventing solder residue. When the transmission plate rotates, it will push the first elastic plate to deform through the knocking block. The first elastic plate will drive the elastic telescopic rod to move towards the main board. The elastic telescopic rod will knock on the back of the main board, which can further knock off the remaining solder on the main board.

[0008] Preferably, the lifting device includes an elastic plate II and a scraping plate. The elastic plate II is fixedly connected to the lower surface of the elastic arc plate. The scraping plate is fixedly connected to the side of the elastic plate II away from the elastic arc plate. The lower surface of the scraping plate after displacement is respectively in contact with the inner wall of the workbench and the top of the filter plate. The lifting device further includes an elastic plate III, a limiting plate, a magnetic plate II, a transmission rod, a clamping plate and a jacking rod. The two sides of the elastic plate III are fixedly connected to the upper surface of the elastic arc plate. The magnetic plate II is fixedly connected to the lower surface of the elastic plate III. The limiting plate is fixedly connected to the surface of the magnetic plate II. The transmission rod is rotatably connected to both sides of the magnetic plate II through a torsion spring. The clamping plate is fixedly connected to the end of the transmission rod away from the magnetic plate II. The jacking rod is fixedly connected to the lower surface of the transmission rod. The surface of the transmission rod is in contact with the inner wall of the elastic plate II. One side of the clamping plate close to the transmission rod is in contact with the surface of the elastic plate II. The magnetic plate II and the magnetic plate I attract each other magnetically. The upper surface of the elastic plate III is in contact with the bottom of the magnetic plate I. The surface of the magnetic plate II is in contact with the inner wall of the elastic arc plate. The top of the limiting plate is in contact with the lower surface of the elastic arc plate. When the rotating plate rotates and pushes the elastic arc plate to arch downward, the elastic arc plate will push the elastic plate II to contact the arc surface of the workbench and cause the two elastic plates II to deform toward both sides. The elastic plate II will drive the scraping plate to slide on the arc surface of the workbench. The scraping plate will drive the components remaining on the inner wall of the workbench to move upward. When the elastic arc plate drives the elastic plate II to reset, the elastic plate II drives the scraping plate to reset. At this time, the scraping plate reset no longer supports the components. At this time, the lifted components will slide again on the arc surface of the inner wall of the workbench, so that the components can slide again and enter the collection box. When the elastic plate I deforms upward, it will drive the magnetic plate I to move upward. The magnetic plate I will drive the magnetic plate II to move upward through magnetic attraction. The magnetic plate II will drive the limiting plate to move upward. The limiting plate will drive the elastic arc plate to arch upward again, so that the components remaining on the upper surface of the elastic arc plate slide down from both sides. When the rotating plate pushes the elastic plate III and the elastic arc plate to deform downward, the elastic plate III will push the magnetic plate II to move downward. When the magnetic plate II moves downward, it will drive the transmission rod to move downward. The transmission rod will drive the elastic plate II to rotate downward through the clamping plate, so that the elastic plate II drives the scraping plate to rotate above the filter plate, thereby increasing the area where the scraping plate moves on the inner wall of the workbench, ensuring that all the components remaining on the inner wall of the workbench can be pushed to slide again. And when the scraping plate moves downward and contacts the filter plate, it will generate a knocking vibration on the filter plate. The filter plate will vibrate and drop the tin liquid in the filter holes to prevent the tin liquid from blocking the holes. When the magnetic plate II drives the transmission rod to move downward, the transmission rod will drive the jacking rod to move downward. The jacking rod will knock on the filter plate again, which can further knock down the tin liquid in the filter plate. And the jacking rod will also push the transmission rod to rotate on the magnetic plate II in the reverse direction to prevent the transmission rod from affecting the continued downward movement of the magnetic plate II.

[0009] The present invention adopts the above technical solutions and can bring the following beneficial effects: 1. The mobile phone motherboard desoldering device with a collection mechanism, through the coordinated operation among the workbench, support plate, desoldering head, rotating plate, rotating rod, motor, clamping plate, rubber block, collection box, and elastic arc plate, pushes one side of the motherboard into the clamping plate on one side. At this time, the clamping plate will move and compress the elastic member. Then, the other side of the motherboard is pushed into the clamping plate on the other side. At this time, the elastic member will push the four clamping plates together to clamp the motherboard, preventing the motherboard from shaking during desoldering, thereby affecting the desoldering effect of the motherboard. At the same time, when the clamping plate clamps the motherboard, the rubber block in the clamping plate will press the motherboard onto the rotating plate from top to bottom under the action of the elastic member, further limiting and fixing it, and it can be applicable to motherboards of different thicknesses. When the components on the motherboard are desoldered, the motor will start and drive the rotating rod to rotate. The rotating rod will drive the rotating plate to rotate. Then, the rotating plate will drive the motherboard to rotate and face down. At this time, the desoldered components on the motherboard will fall onto the elastic arc plate, and the elastic arc plate will buffer them, causing the components to slide down from both sides of the arched elastic arc plate to the inner wall of the workbench and finally fall into the collection box, realizing the collection of components.

[0010] 2. The mobile phone motherboard desoldering device with a collection mechanism, through the coordinated operation among the first heating plate, filter plate, box body, inclined plate, second heating plate, outer plate, and inner plate, when the components fall onto the inner wall of the workbench, the molten tin generated during desoldering will also fall onto the inner wall of the workbench at the same time. It falls into the box body through the arc-shaped inner wall of the workbench. The first heating plate will heat the inner wall of the workbench to prevent the molten tin from solidifying and thus being unable to be collected. When the molten tin and the components slide to the filter plate, the filter plate will separate the components and the molten tin. The molten tin will pass through the filter plate and enter the box body to be collected. After the molten tin enters the box body, it will slide down along the inclined plate to accumulate in the front area of the box body. The second heating plate will heat the filter plate to prevent the filter plate from having a low temperature, resulting in the cooling of the molten tin in the filter holes and thus causing the blockage of the filter plate. When the collection box is pulled out, it will drive the box body to be pulled out together. At this time, the box body will drive the outer plate to move forward. The outer plate will drive the inner plate to move forward. The inner plate is blocked by the inner wall of the workbench and rotates. The inner plate will drive the outer plate to rotate. Then, the worker manually rotates the outer plate to make the inner plate rotate to the lower side. The inner plate will push out the tin blocks that have accumulated and cooled and solidified in front of the box body, preventing the tin blocks from adhering to the inner wall of the box body and being difficult to take out and recycle.

[0011] 3. The mobile phone motherboard desoldering device with a collection mechanism, through the cooperation of Magnet 1, Magnet 2, fixed plate, drive plate, knocking block, Elastic Plate 1, elastic telescopic rod, and Magnetic Plate 1, when the rotating plate rotates 180 degrees, the orientation of the motherboard on the rotating plate is such that at this time, Magnet 2 will attract Magnet 1 through magnetic attraction, and Magnet 1 will move in the rotating plate and push the drive plate to rotate. The drive plate will drive the knocking block to displace, and the knocking block will knock on the rotating plate, causing the rotating plate and the motherboard on its surface to vibrate. Vibration can prompt the remaining solder on the motherboard to fall off, preventing solder residue. When the drive plate rotates, it will push Elastic Plate 1 to deform through the knocking block, and Elastic Plate 1 will drive the elastic telescopic rod to move towards the motherboard. The elastic telescopic rod knocks on the back of the motherboard, which can further knock off the remaining solder on the motherboard.

[0012] 4. The mobile phone motherboard desoldering device with a collection mechanism, through the cooperation of Elastic Plate 2, scraping plate, Elastic Plate 3, limiting plate, Magnetic Plate 2, drive rod, clamping plate, and ejector rod, when the rotating plate rotates and pushes the elastic arc plate to arch downward, the elastic arc plate will push Elastic Plate 2 to contact the arc surface of the workbench and cause the two Elastic Plates 2 to deform towards both sides. Elastic Plate 2 will drive the scraping plate to slide on the arc surface of the workbench, and the scraping plate will drive the remaining components on the inner wall of the workbench to move upward. When the elastic arc plate drives Elastic Plate 2 to reset, Elastic Plate 2 drives the scraping plate to reset. At this time, the scraping plate no longer supports the components when it resets. At this time, the lifted components will slide again on the arc surface of the inner wall of the workbench, enabling the components to slide again and enter the collection box. Description of the Drawings

[0013] Figure 1 is a schematic diagram of the overall structure of the present invention; Figure 2 is a semi-sectional view of the workbench structure of the present invention; Figure 3 is a semi-sectional view of the rotating plate structure of the present invention; Figure 4 is a schematic diagram of the box body structure of the present invention; Figure 5 is a semi-sectional view of the box body structure of the present invention; Figure 6 is a schematic diagram of the Magnet 1 structure of the present invention; Figure 7 is a schematic diagram of the Elastic Plate 1 structure of the present invention; Figure 8 is a semi-sectional view of the Elastic Plate 2 structure of the present invention.

[0014] In the figure: 1, workbench; 2, support plate; 3, desoldering head; 4, fixing device; 41, rotating plate; 42, rotating rod; 43, motor; 44, clamping plate; 45, rubber block; 5, collection box; 6, elastic arc plate; 7, tin collection device; 71, heating plate 1; 72, filter plate; 73, box body; 731, inclined plate; 732, heating plate 2; 733, outer plate; 734, inner plate; 8, knocking device; 81, magnet 1; 82, magnet 2; 83, fixing plate; 84, transmission plate; 85, knocking block; 851, elastic plate 1; 852, elastic telescopic rod; 853, magnetic plate 1; 9, lifting device; 91, elastic plate 2; 92, scraping plate; 921, elastic plate 3; 922, limiting plate; 923, magnetic plate 2; 924, transmission rod; 925, clamping plate; 926, ejector rod. Detailed implementation manner

[0015] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0016] Please refer to Figures 1-5, an embodiment of the present invention is: a mobile phone motherboard desoldering device with a collection mechanism, including a workbench 1, and further including a fixing device 4, a tin collecting device 7, a knocking device 8 and a lifting device 9; a support plate 2 is fixedly connected to the top of the workbench 1, a desoldering head 3 is fixedly connected to the lower surface of the support plate 2, a collection box 5 is slidably connected to the inner wall of the workbench 1, and an elastic arc plate 6 is fixedly connected to the inner wall of the workbench 1; the fixing device 4 includes a rotating plate 41, a rotating rod 42, a motor 43, a clamping plate 44 and a rubber block 45, the rotating plate 41 is rotatably connected to the inner wall of the workbench 1, the rotating rod 42 is fixedly connected to the inner wall of the rotating plate 41, the motor 43 is fixedly connected to the front of the workbench 1, the clamping plate 44 is slidably connected to the inner wall of the rotating plate 41 through an elastic member, and the rubber block 45 is slidably connected to the inner wall of the clamping plate 44 through an elastic member. Push one side of the motherboard into the clamping plate 44 on one side. At this time, the clamping plate 44 will move and compress the elastic member. Then push the other side of the motherboard into the clamping plate 44 on the other side. At this time, the elastic member will push the four clamping plates 44 together to clamp the motherboard, preventing the motherboard from shaking during desoldering, thereby affecting the desoldering effect of the motherboard. At the same time, when the clamping plate 44 clamps the motherboard, the rubber block 45 in the clamping plate 44 will press the motherboard onto the rotating plate 41 from top to bottom under the action of the elastic member, further limiting and fixing it, and can be applicable to motherboards of different thicknesses; the tin collecting device 7 is arranged on the inner wall of the workbench 1, the knocking device 8 is arranged on the lower surface of the rotating plate 41, and the lifting device 9 is arranged on the lower surface of the elastic arc plate 6; the output end of the motor 43 is fixedly connected to the front end of the rotating rod 42, the surface of the rotating rod 42 is rotatably connected to the inner wall of the workbench 1, and an arc surface is arranged on the inner wall of the workbench 1. The collection box 5 is located below the elastic arc plate 6. When the components on the motherboard are desoldered, the motor 43 will start and drive the rotating rod 42 to rotate. The rotating rod 42 will drive the rotating plate 41 to rotate. Then the rotating plate 41 will drive the motherboard to rotate and face down. At this time, the desoldered components on the motherboard will fall on the elastic arc plate 6, and the elastic arc plate 6 will buffer it, so that the components will slide from both sides of the arched elastic arc plate 6 to the inner wall of the workbench 1 and finally fall into the collection box 5 to realize the collection of components. When the rotating plate 41 drives the motherboard to rotate, at the same time, the rotation of the rotating plate 41 will push the upward arched elastic arc plate 6 to arch downward. When the rotating plate 41 passes over the elastic arc plate 6, the elastic arc plate 6 will reset again through its own elastic force and arch upward. When arching, it can promote the components on the surface to slide to both sides and improve the collection effect.

[0017] The tin collecting device 7 includes a first heating plate 71, a filter plate 72 and a box body 73. The first heating plate 71 is fixedly connected to the inner wall of the workbench 1, the filter plate 72 is fixedly connected to the inner wall of the workbench 1, and the box body 73 is fixedly connected to both sides of the collecting box 5. When the components fall on the inner wall of the workbench 1, the tin liquid generated during desoldering will also fall on the inner wall of the workbench 1 at the same time. It falls into the box body 73 through the arc-shaped inner wall of the workbench 1. The first heating plate 71 heats the inner wall of the workbench 1 to prevent the tin liquid from solidifying and thus being unable to be collected. When the tin liquid and the components slide to the filter plate 72, the filter plate 72 separates the components and the tin liquid. The tin liquid will pass through the filter plate 72 and enter the box body 73 to be collected. The tin collecting device 7 also includes an inclined plate 731, a second heating plate 732, an outer plate 733 and an inner plate 734. The inclined plate 731 is fixedly connected to the bottom wall inside the box body 73, the second heating plate 732 is fixedly connected to the top of the inclined plate 731, the outer plate 733 is rotatably connected to the nickel coin at the front of the box body 73 through a torsion spring, and the inner plate 734 is slidably connected to the inner wall of the outer plate 733 through a spring. The front part of the inner plate 734 is in contact with the inner wall of the workbench 1, the surface of the box body 73 is in contact with the inner wall of the workbench 1, the filter plate 72 is made of heat-conducting metal, the top of the second heating plate 732 is in contact with the bottom of the filter plate 72. After the tin liquid enters the box body 73, it will slide down through the inclined plate 731 and accumulate in the front area of the box body 73. The second heating plate 732 heats the filter plate 72 to prevent the filter plate 72 from having a low temperature, which causes the tin liquid to cool in the filter holes and thus causes the blockage of the filter plate 72. When the collecting box 5 is pulled out, it will drive the box body 73 to be pulled out together. At this time, the box body 73 will drive the outer plate 733 to move forward, the outer plate 733 will drive the inner plate 734 to move forward, and the inner plate 734 is blocked by the inner wall of the workbench 1 and rotates. The inner plate 734 will drive the outer plate 733 to rotate. Then the worker manually rotates the outer plate 733 so that the inner plate 734 rotates to the lower side, and the inner plate 734 will push out the tin blocks that have accumulated and cooled and solidified in front of the box body 73 to prevent the tin blocks from adhering to the inner wall of the box body 73 and being difficult to take out and recycle.

[0018] Working principle: Push one side of the main board into the clamping plate 44 on one side. At this time, the clamping plate 44 will move and compress the elastic member. Then, push the other side of the main board into the clamping plate 44 on the other side. At this time, the elastic member will push the four clamping plates 44 together to clamp the main board, preventing the main board from shaking during desoldering, which will affect the desoldering effect of the main board. At the same time, when the clamping plate 44 clamps the main board, the rubber block 45 in the clamping plate 44 will press the main board from top to bottom on the rotating plate 41 under the action of the elastic member, further limiting and fixing it, and it can be applicable to main boards of different thicknesses. When the components on the main board are desoldered, the motor 43 will start and drive the rotating rod 42 to rotate. The rotating rod 42 will drive the rotating plate 41 to rotate. Then, the rotating plate 41 will drive the main board to rotate and face down. At this time, the desoldered components on the main board will fall on the elastic arc plate 6, and the elastic arc plate 6 will buffer them, so that the components will slide down from both sides of the arched elastic arc plate 6 to the inner wall of the workbench 1 and finally fall into the collection box 5 to achieve the collection of components. When the rotating plate 41 drives the main board to rotate, at the same time, the rotation of the rotating plate 41 will push the upward arched elastic arc plate 6 to arch downward. When the rotating plate 41 passes over the elastic arc plate 6, the elastic arc plate 6 will reset upward again through its own elastic force. When arching, it can promote the components on the surface to slide to both sides, improving the collection effect.

[0019] When the components fall on the inner wall of the workbench 1, the tin liquid generated during desoldering will also fall on the inner wall of the workbench 1 at the same time. It will fall into the box body 73 through the arc-shaped inner wall of the workbench 1. The heating plate 1 71 will heat the inner wall of the workbench 1 to prevent the tin liquid from solidifying and thus being unable to be collected. When the tin liquid and the components slide to the filter plate 72, the filter plate 72 will separate the components and the tin liquid. The tin liquid will pass through the filter plate 72 and enter the box body 73 to be collected. After the tin liquid enters the box body 73, it will slide down through the inclined plate 731 and accumulate in the front area of the box body 73. The heating plate 2 732 will heat the filter plate 72 to prevent the filter plate 72 from having a low temperature, which will cause the tin liquid to cool in the filter holes and block the filter plate 72. When the collection box 5 is pulled out, it will drive the box body 73 to be pulled out together. At this time, the box body 73 will drive the outer plate 733 to move forward. The outer plate 733 will drive the inner plate 734 to move forward. The inner plate 734 is blocked by the inner wall of the workbench 1 and rotates. The inner plate 734 will drive the outer plate 733 to rotate. Then, the worker manually rotates the outer plate 733 so that the inner plate 734 rotates to the lower part, and the inner plate 734 will push out the cooled and solidified tin blocks accumulated in front of the box body 73 to prevent the tin blocks from adhering to the inner wall of the box body 73 and being difficult to take out and recycle.

[0020] Please refer to Figures 6-8, on the basis of the above embodiments, in another embodiment of the present invention, the knocking device 8 includes a first magnet 81, a second magnet 82, a fixing plate 83, a transmission plate 84 and a knocking block 85. The first magnet 81 is slidably connected to the inner wall of the rotating plate 41 through an elastic member, the second magnet 82 is fixedly connected to the inner wall of the workbench 1, the fixing plate 83 is fixedly connected to the bottom of the rotating plate 41, the transmission plate 84 is rotatably connected to the surface of the fixing plate 83 through a torsion spring, and the knocking block 85 is fixedly connected to the upper surface of the transmission plate 84. When the rotating plate 41 rotates 180 degrees, the main board on the rotating plate 41 faces. At this time, the second magnet 82 will attract the first magnet 81 through magnetic attraction, and the first magnet 81 will move in the rotating plate 41 and push the transmission plate 84 to rotate. The transmission plate 84 will drive the knocking block 85 to displace, and the knocking block 85 will knock on the rotating plate 41, causing the rotating plate 41 and the main board on its surface to vibrate. The vibration can prompt the residual solder on the main board to fall off, preventing solder residue; the knocking device 8 further includes a first elastic plate 851, an elastic telescopic rod 852 and a first magnetic plate 853. Both sides of the first elastic plate 851 are fixedly connected to the lower surface of the rotating plate 41, the elastic telescopic rod 852 is fixedly connected to the upper surface of the first elastic plate 851, and the first magnetic plate 853 is fixedly connected to the lower surface of the first elastic plate 851; the surface of the elastic telescopic rod 852 is in contact with the inner wall of the rotating plate 41, the surface of the knocking block 85 is in contact with the lower surface of the first elastic plate 851, the surface of the transmission plate 84 is in contact with the surface of the first magnet 81, the first magnet 81 and the second magnet 82 are magnetically attracted to each other, and the surface of the transmission plate 84 is in contact with the inner wall of the rotating plate 41. When the transmission plate 84 rotates, it will push the first elastic plate 851 to deform through the knocking block 85. The first elastic plate 851 will drive the elastic telescopic rod 852 to move towards the main board, and the elastic telescopic rod 852 will knock on the back of the main board, which can further knock off the residual solder on the main board.

[0021] The lifting device 9 includes an elastic plate II 91 and a scraper 92. The elastic plate II 91 is fixedly connected to the lower surface of the elastic arc plate 6. The scraper 92 is fixedly connected to the side of the elastic plate II 91 away from the elastic arc plate 6. The lower surface of the scraper 92 after displacement is in contact with the inner wall of the workbench 1 and the top of the filter plate 72 respectively. When the rotating plate 41 rotates and pushes the elastic arc plate 6 to arch downward, the elastic arc plate 6 will push the elastic plate II 91 to contact the arc surface of the workbench 1, and cause the two elastic plates II 91 to deform toward both sides. The elastic plate II 91 will drive the scraper 92 to slide on the arc surface of the workbench 1, and the scraper 92 will drive the components remaining on the inner wall of the workbench 1 to move upward. When the elastic arc plate 6 drives the elastic plate II 91 to reset, the elastic plate II 91 drives the scraper 92 to reset. At this time, the scraper 92 resets and no longer supports the components. At this time, the lifted components will slide on the arc surface of the inner wall of the workbench 1 again, so that the components can slide again and enter the collection box 5;The lifting device 9 further includes an elastic plate three 921, a limiting plate 922, a magnetic plate two 923, a transmission rod 924, a clamping plate 925 and a ejector rod 926. Both sides of the elastic plate three 921 are fixedly connected to the upper surface of the elastic arc plate 6. The magnetic plate two 923 is fixedly connected to the lower surface of the elastic plate three 921. The limiting plate 922 is fixedly connected to the surface of the magnetic plate two 923. The transmission rod 924 is rotatably connected to both sides of the magnetic plate two 923 through a torsion spring. The clamping plate 925 is fixedly connected to one end of the transmission rod 924 away from the magnetic plate two 923. The ejector rod 926 is fixedly connected to the lower surface of the transmission rod 924. The surface of the transmission rod 924 is in contact with the inner wall of the elastic plate two 91. One side of the clamping plate 925 close to the transmission rod 924 is in contact with the surface of the elastic plate two 91. The magnetic plate two 923 and the magnetic plate one 853 attract each other magnetically. The upper surface of the elastic plate three 921 is in contact with the bottom of the magnetic plate one 853. The surface of the magnetic plate two 923 is in contact with the inner wall of the elastic arc plate 6. The top of the limiting plate 922 is in contact with the lower surface of the elastic arc plate 6. When the elastic plate one 851 deforms upward, it will drive the magnetic plate one 853 to move upward. The magnetic plate one 853 will drive the magnetic plate two 923 to move upward through magnetic attraction. The magnetic plate two 923 will drive the limiting plate 922 to move upward. The limiting plate 922 will drive the elastic arc plate 6 to arch upward again, so that the components remaining on the upper surface of the elastic arc plate 6 slide off from both sides. When the rotating plate 41 pushes the elastic plate three 921 and the elastic arc plate 6 to deform downward, the elastic plate three 921 will push the magnetic plate two 923 to move downward. When the magnetic plate two 923 moves downward, it will drive the transmission rod 924 to move downward. The transmission rod 924 will drive the elastic plate two 91 to rotate downward through the clamping plate 925, so that the elastic plate two 91 drives the scraping plate 92 to rotate above the filter plate 72. Furthermore, the moving area of the scraping plate 92 on the inner wall of the workbench 1 can be increased, ensuring that all the remaining components on the inner wall of the workbench 1 can be pushed to slide again. And when the scraping plate 92 moves downward and contacts the filter plate 72, it will generate a knocking vibration on the filter plate 72. The filter plate 72 will vibrate and drop the tin liquid in the filter holes to prevent the tin liquid from blocking the holes. When the magnetic plate two 923 drives the transmission rod 924 to move downward, the transmission rod 924 will drive the ejector rod 926 to move downward. The ejector rod 926 will knock on the filter plate 72 again, which can further knock down the tin liquid in the filter plate 72. And the ejector rod 926 will also push the transmission rod 924 to rotate on the magnetic plate two 923 in the reverse direction to prevent the transmission rod 924 from affecting the continuous downward movement of the magnetic plate two 923.;

[0022] Working principle: When the rotating plate 41 rotates 180 degrees, the main board on the rotating plate 41 faces a certain direction. At this time, the second magnet 82 will attract the first magnet 81 through magnetic attraction, and the first magnet 81 will move in the rotating plate 41 and push the transmission plate 84 to rotate. The transmission plate 84 will drive the knocking block 85 to displace, and the knocking block 85 will knock on the rotating plate 41, causing the rotating plate 41 and the main board on its surface to vibrate. The vibration can prompt the remaining solder on the main board to fall off, preventing solder residue. When the transmission plate 84 rotates, it will push the first elastic plate 851 to deform through the knocking block 85, and the first elastic plate 851 will drive the elastic telescopic rod 852 to move towards the main board. The elastic telescopic rod 852 knocks on the back of the main board, which can further knock off the remaining solder on the main board.

[0023] When the rotating plate 41 rotates and pushes the elastic arc plate 6 to arch upwards, the elastic arc plate 6 will push the second elastic plate 91 to contact the arc surface of the workbench 1, and cause the two second elastic plates 91 to deform towards both sides. The second elastic plate 91 will drive the scraper 92 to slide on the arc surface of the workbench 1, and the scraper 92 will drive the components remaining on the inner wall of the workbench 1 to move upwards. When the elastic arc plate 6 drives the second elastic plate 91 to reset, the second elastic plate 91 drives the scraper 92 to reset. At this time, the scraper 92 no longer supports the components when it resets. At this time, the lifted components will slide again on the arc surface of the inner wall of the workbench 1, so that the components can slide again and enter the collection box 5. When the first elastic plate 851 deforms upwards, it will drive the first magnetic plate 853 to move upwards. The first magnetic plate 853 will drive the second magnetic plate 923 to move upwards through magnetic attraction. The second magnetic plate 923 will drive the limiting plate 922 to move upwards. The limiting plate 922 will drive the elastic arc plate 6 to arch upwards again, so that the components remaining on the upper surface of the elastic arc plate 6 slide off from both sides. When the rotating plate 41 pushes the third elastic plate 921 and the elastic arc plate 6 to deform downwards, the third elastic plate 921 will push the second magnetic plate 923 to move downwards. When the second magnetic plate 923 moves downwards, it will drive the transmission rod 924 to move downwards. The transmission rod 924 will drive the second elastic plate 91 to rotate downwards through the clamping plate 925, so that the second elastic plate 91 drives the scraper 92 to rotate above the filter plate 72. Thus, the area where the scraper 92 moves on the inner wall of the workbench 1 can be increased, ensuring that all the remaining components on the inner wall of the workbench 1 can be pushed to slide again. And when the scraper 92 moves downwards and contacts the filter plate 72, it will generate a knocking vibration on the filter plate 72. The filter plate 72 will vibrate the solder in the filter holes to make it fall off, preventing the solder from blocking the holes. When the second magnetic plate 923 drives the transmission rod 924 to move downwards, the transmission rod 924 will drive the ejector rod 926 to move downwards. The ejector rod 926 will knock on the filter plate 72 again, which can further knock off the solder in the filter plate 72. And the ejector rod 926 will also push the transmission rod 924 to rotate on the second magnetic plate 923 in the reverse direction, preventing the transmission rod 924 from affecting the continuous downward movement of the second magnetic plate 923.

[0024] The present invention provides a mobile phone motherboard desoldering device with a collection mechanism. There are many methods and ways to specifically implement this technical solution. The above description is only the preferred embodiment of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention. Each component not clearly defined in this embodiment can be implemented by using the prior art.

Claims

1. A mobile phone motherboard desoldering device with a collecting mechanism, comprising a workbench (1), characterized in that: It also includes a fixing device (4), a tin collecting device (7), a knocking device (8) and a lifting device (9); The top of the workbench (1) is fixedly connected to a support plate (2), the lower surface of the support plate (2) is fixedly connected to a desoldering head (3), the inner wall of the workbench (1) is slidably connected to a collection box (5), and the inner wall of the workbench (1) is fixedly connected to an elastic arc plate (6); The fixing device (4) comprises a rotating plate (41), a rotating rod (42), a motor (43), a clamping plate (44) and a rubber block (45); the rotating plate (41) is rotatably connected to the inner wall of the workbench (1); the rotating rod (42) is fixedly connected to the inner wall of the rotating plate (41); the motor (43) is fixedly connected to the front of the workbench (1); the clamping plate (44) is slidably connected to the inner wall of the rotating plate (41) via an elastic member; and the rubber block (45) is slidably connected to the inner wall of the clamping plate (44) via an elastic member; The tin collecting device (7) is arranged on the inner wall of the workbench (1), the knocking device (8) is arranged on the lower surface of the rotating plate (41), and the lifting device (9) is arranged on the lower surface of the elastic arc plate (6).

2. A mobile phone motherboard desoldering device with a collecting mechanism according to claim 1, characterized in that: The output end of the motor (43) is fixedly connected to the front end of the rotating rod (42); the surface of the rotating rod (42) is rotatably connected to the inner wall of the workbench (1); the inner wall of the workbench (1) is provided with an arc surface; and the collection box (5) is located below the elastic arc plate (6).

3. A mobile phone motherboard desoldering device with a collecting mechanism according to claim 2, characterized in that: The tin collecting device (7) comprises a heating plate (71), a filter plate (72) and a box body (73); the heating plate (71) is fixedly connected to the inner wall of the workbench (1); the filter plate (72) is fixedly connected to the inner wall of the workbench (1); and the box body (73) is fixedly connected to both sides of the collecting box (5).

4. A mobile phone mainboard desoldering device with a collecting mechanism according to claim 3, characterized in that: The tin collecting device (7) further comprises an inclined plate (731), a second heating plate (732), an outer plate (733) and an inner plate (734); the inclined plate (731) is fixedly connected to the bottom wall inside the box body (73); the second heating plate (732) is fixedly connected to the top of the inclined plate (731); the outer plate (733) is rotatably connected to a nickel coin at the front of the box body (73) via a torsion spring; and the inner plate (734) is slidably connected to the inner wall of the outer plate (733) via a spring.

5. A mobile phone mainboard desoldering device with a collecting mechanism according to claim 4, characterized in that: The front portion of the inner plate (734) contacts the inner wall of the workbench (1), the surface of the box body (73) contacts the inner wall of the workbench (1), the filter plate (72) is made of heat-conducting metal, and the top of the second heating plate (732) contacts the bottom of the filter plate (72).

6. A mobile phone mainboard desoldering device with a collecting mechanism according to claim 5, characterized in that: The knocking device (8) comprises a first magnet (81), a second magnet (82), a fixed plate (83), a transmission plate (84) and a knocking block (85); the first magnet (81) is slidably connected to the inner wall of the rotating plate (41) via an elastic member; the second magnet (82) is fixedly connected to the inner wall of the workbench (1); the fixed plate (83) is fixedly connected to the bottom of the rotating plate (41); the transmission plate (84) is rotationally connected to the surface of the fixed plate (83) via a torsion spring; and the knocking block (85) is fixedly connected to the upper surface of the transmission plate (84).

7. A mobile phone mainboard desoldering device with a collecting mechanism according to claim 6, characterized in that: The knocking device (8) further comprises an elastic plate (851), an elastic telescopic rod (852) and a magnetic plate (853), wherein two sides of the elastic plate (851) are fixedly connected to the lower surface of the rotating plate (41), the elastic telescopic rod (852) is fixedly connected to the upper surface of the elastic plate (851), and the magnetic plate (853) is fixedly connected to the lower surface of the elastic plate (851).

8. A mobile phone mainboard desoldering device with a collecting mechanism according to claim 7, characterized in that: The surface of the elastic telescopic rod (852) contacts the inner wall of the rotating plate (41), the surface of the knocking block (85) contacts the lower surface of the elastic plate 1 (851), the surface of the transmission plate (84) contacts the surface of the magnet 1 (81), the magnet 1 (81) and the magnet 2 (82) are magnetically attracted to each other, and the surface of the transmission plate (84) contacts the inner wall of the rotating plate (41).

9. A mobile phone mainboard desoldering device with a collecting mechanism according to claim 8, characterized in that: The lifting device (9) comprises an elastic plate 2 (91) and a scraper (92), wherein the elastic plate 2 (91) is fixedly connected to the lower surface of the elastic arc plate (6), and the scraper (92) is fixedly connected to a side of the elastic plate 2 (91) away from the elastic arc plate (6), and the lower surface of the scraper (92) after displacement is in contact with the inner wall of the workbench (1) and the top of the filter plate (72) respectively.

10. A mobile phone mainboard desoldering device with a collecting mechanism according to claim 9, characterized in that: The lifting device (9) further comprises an elastic plate three (921), a limit plate (922), a magnetic plate two (923), a transmission rod (924), a clamping plate (925) and a lift rod (926); the two sides of the elastic plate three (921) are fixedly connected to the upper surface of the elastic arc plate (6); the magnetic plate two (923) is fixedly connected to the lower surface of the elastic plate three (921); the limit plate (922) is fixedly connected to the surface of the magnetic plate two (923); the transmission rod (924) is rotatably connected to the two sides of the magnetic plate two (923) via a torsion spring; the clamping plate (925) is fixedly connected to the transmission rod (924) away from the magnetic plate two (923). At one end of the driving rod (924), the top rod (926) is fixedly connected to the lower surface of the driving rod (924), the surface of the driving rod (924) contacts the inner wall of the second elastic plate (91), the side of the clamping plate (925) close to the driving rod (924) contacts the surface of the second elastic plate (91), the second magnetic plate (923) and the first magnetic plate (853) are magnetically attracted to each other, the upper surface of the third elastic plate (921) contacts the bottom of the first magnetic plate (853), the surface of the second magnetic plate (923) contacts the inner wall of the elastic arc plate (6), and the top of the limit plate (922) contacts the lower surface of the elastic arc plate (6).

Images