Method for removing adhesive member, method for regenerating polishing pad using same, and polishing pad manufactured using method for regenerating polishing pad

Abstract

In a polishing pad regeneration method of the present application, the polishing pad is a polishing pad including a main pad member and a worn adhesive member attached to the main pad member, the polishing pad regeneration method may include the steps of: chemically removing the adhesive member from the main pad member; removing damaged parts of an upper side part and a side surface part of the main cushion member; judging whether the diameter and the thickness of the main cushion component are the thickness capable of forming a groove with the depth larger than or equal to the standard depth again or not; re-forming a groove on the upper surface of the main pad member according to the determination result; and attaching a new adhesive member to the lower surface of the main pad member in which the groove is formed, thereby regenerating the polishing pad having a diameter relatively smaller than the predetermined diameter.

Description

Technical Field

[0001] The present application relates to a method for regenerating a worn polishing pad, and more particularly, to a method for chemically removing an adhesive member from a polishing pad, a method for regenerating a polishing pad using the same, and a polishing pad manufactured using the method for regenerating a polishing pad. Background Art

[0002] Generally, semiconductor devices can be manufactured through processes such as exposure, etching, diffusion, and deposition. At this time, when the deposition process and the etching process are repeatedly performed on a wafer, a topological structure appears on the wafer surface, and this surface topological structure (non-uniformity of film thickness) can cause process defects during the photolithography process, making it difficult to perform subsequent processes. Therefore, there is a problem of reduced production yield of the device.

[0003] As the number of layers stacked on the wafer increases, the topological structure on the wafer surface gradually deepens, making the above problems more serious. Therefore, in order to prevent process defects and facilitate subsequent processes, a planarization process must be performed on the wafer surface having a topological structure to planarize the wafer surface.

[0004] One of the planarization processes for planarizing the wafer surface is the Chemical Mechanical Polishing (CMP) process. The above CMP process is a process for planarizing the wafer surface chemically and mechanically using a polishing pad and a slurry. In a state where the surface of the polishing pad attached to the platen is in contact with the surface of the wafer to be polished, while chemically polishing the wafer surface by supplying the slurry, mechanical polishing is performed through the polishing pad, thereby planarizing the wafer surface.

[0005] Generally, the polishing pad is formed with grooves of various shapes on the surface (for example, the polishing surface) in contact with the surface of the wafer to be polished, so as to easily remove reaction products generated between the film chemically etched by the slurry during the CMP process. As the CMP process proceeds, not only the slurry supplied to the polishing pad adheres in the above grooves, but also polishing residues such as reaction products accumulate. These polishing residues can cause scratches on the surface of the semiconductor wafer to be polished during the CMP process, resulting in defects and thus reducing the production yield.

[0006] In addition, as the CMP process is repeated, the polishing pad is worn, the pad thickness gradually decreases, and the groove depth of the polishing pad also gradually decreases. When the depth of the above grooves is less than the set standard depth, the grooves are partially damaged, resulting in a problem of reduced polishing efficiency of the polishing pad. Due to these problems, the damaged polishing pad is discarded.

[0007] Currently, in the CMP process, the usage of polishing pads is increasing continuously, while the worn polishing pads are discarded without being reused. Therefore, a regeneration technology for worn polishing pads is required. In order to regenerate worn polishing pads, it is necessary to first remove the adhesive member from the pad member of the worn polishing pad.

[0008] In the past, the above-mentioned adhesive member was physically removed from the above-mentioned pad member. For example, when using a jig to remove the above-mentioned adhesive member, surface roughness occurred on the above-mentioned adhesive member, resulting in deterioration of surface uniformity. Due to the surface roughness of the above-mentioned adhesive member, there is a problem that it is difficult to regenerate worn polishing pads. In addition, when the adhesive member is physically removed, the above-mentioned pad member is damaged, so the above-mentioned worn polishing pad must be discarded. Summary of the Invention

[0009] Technical Problem

[0010] This application is developed to solve the above problems, and its purpose is to provide a method for easily removing the adhesive member without damaging the pad member, a polishing pad regeneration method using this method, and a polishing pad manufactured using this polishing pad regeneration method.

[0011] In addition, another object of this application is to provide an adhesive member removal method that can chemically remove the adhesive member from the pad member by using an organic solvent, thereby preventing damage to the polishing pad and increasing the reuse rate of the polishing pad, a polishing pad regeneration method using this method, and a polishing pad manufactured using this polishing pad regeneration method.

[0012] In addition, another object of this application is to provide an adhesive member removal method that can easily remove the above-mentioned adhesive member from the pad member by using an organic solvent without causing damage when the depth of the groove becomes lower than the standard depth capable of performing the CMP process due to continuous CMP processes, so as to be able to re-groove the pad member.

[0013] In addition, another object of this application is to provide a polishing pad regeneration method that can regenerate a large-sized polishing pad into a small-sized polishing pad without damaging the pad member by using an adhesive member removal method using an organic solvent, and a polishing pad manufactured using this method.

[0014] In addition, another object of this application is to provide a polishing pad regeneration method that re-grooves the pad member from which the adhesive member has been removed by using a method of removing the adhesive member with an organic solvent to re-form a groove having a depth capable of polishing on the above-mentioned pad member, thereby extending the service life of the polishing pad, and a polishing pad manufactured using the same.

[0015] In addition, another object of the present application is to provide a polishing pad regeneration method and a polishing pad manufactured using the same, which can extend the reuse rate and service life of the polishing pad. When the worn polishing pad due to the continuous CMP process has a thickness that cannot re-form a groove deeper than the standard depth capable of performing the CMP process, the auxiliary pad member is attached to the pad member from which the adhesive member is removed by impregnation with an organic solvent to supplement the pad thickness, and then a groove with a standard depth capable of performing CMP is formed.

[0016] In addition, another object of the present application is to provide a method for regenerating a polishing pad with reduced size by performing a re-grooving process after removing damaged portions on the upper surface and side surfaces of the polishing pad, and a polishing pad manufactured using the method.

[0017] Solution to the problem

[0018] To achieve the above object, the method for removing the adhesive member of the present application may include the following steps: providing a main pad member having an adhesive member composed of an adhesive and a film member attached to one surface; and chemically removing the adhesive member from the main pad member.

[0019] The adhesive member may include a double-sided tape formed by coating the adhesive on both surfaces of the film member.

[0020] The adhesive may include a polyacrylic adhesive or an epoxy material, and the film member may include a polyethylene film.

[0021] The step of removing the adhesive member may include immersing the pad member in an organic solvent at room temperature for 1 minute to 5 minutes.

[0022] The organic solvent may be composed of two polar organic solvents, one non-polar organic solvent, and a non-ionic surfactant. The contents of the two polar organic solvents may be 10 wt% to 30 wt% and 50 wt% to 80 wt% respectively, the content of the non-polar organic solvent is 1 wt% to 20 wt%, and the content of the non-ionic surfactant is 0.1 wt% to 1 wt%.

[0023] The step of removing the adhesive member may include immersing the pad member in the organic solvent such that the adhesive of the adhesive member is substantially completely removed and the film member of the adhesive member is separated from the pad member.

[0024] The step of removing the adhesive member may include the following steps: immersing the pad member in the organic solvent to partially remove the adhesive of the film member such that the film member is in a state where it can be easily removed from the pad member; and physically separating the film member from the pad member.

[0025] The step of physically separating the thin film member from the above-mentioned pad member may include physically separating the thin film member from the above-mentioned pad member using a fixture or physically separating the thin film member by a cutting method using a cutting device.

[0026] The step of removing the above-mentioned adhesive member may include the following steps: immersing the above-mentioned pad member in the above-mentioned organic solvent so as to remove only the adhesive of the above-mentioned adhesive member from the edge portion of the above-mentioned pad member; and physically separating the above-mentioned thin film member from the above-mentioned pad member using a fixture.

[0027] After the step of removing the above-mentioned adhesive member by immersing the above-mentioned pad member in an organic solvent to remove the adhesive polishing pad, the step of removing the adhesive member may further include immersing the above-mentioned pad member in an organic solvent to remove the adhesive remaining on the surface of the above-mentioned pad member from which the above-mentioned adhesive member has been removed.

[0028] After removing the above-mentioned adhesive member from the above-mentioned pad member, it may further include a step of cleaning the above-mentioned pad member from which the above-mentioned adhesive member has been removed. The above-mentioned cleaning step may be performed by using at least one of a physical cleaning method, a dry cleaning method, and a wet cleaning method. The above-mentioned physical cleaning method may include brush scrubbing cleaning, the above-mentioned dry cleaning method may include blowing cleaning, tornado cleaning, or plasma cleaning, and the above-mentioned wet cleaning method may include water jet cleaning, jet cleaning, bubble jet cleaning, ultrasonic cleaning, or megahertz ultrasonic cleaning.

[0029] A buffer pad member may be interposed between the above-mentioned main pad member and the above-mentioned adhesive member, and the step of removing the above-mentioned adhesive member from the above-mentioned pad member may include removing the above-mentioned adhesive member from the above-mentioned main pad member or the above-mentioned buffer pad member.

[0030] In addition, in a method for regenerating a polishing pad according to the present application, the above-mentioned polishing pad is a worn polishing pad including a main pad member and an adhesive member and having a predetermined diameter, the above-mentioned main pad member is formed with a plurality of grooves having a depth less than a standard depth capable of performing a polishing process, the above-mentioned adhesive member is attached to the above-mentioned main pad member and is composed of an adhesive and a thin film member, and the method for regenerating the polishing pad may include the following steps: chemically removing the above-mentioned adhesive member from the above-mentioned main pad member; removing damaged portions on the upper side and side surfaces of the above-mentioned main pad member; determining whether the diameter and thickness of the above-mentioned main pad member are such that grooves having a depth greater than or equal to the standard depth can be re-formed; re-forming grooves on the upper surface of the above-mentioned main pad member according to the above-mentioned determination result; and attaching a new adhesive member to the lower surface of the above-mentioned main pad member formed with the above-mentioned grooves, thereby regenerating a polishing pad having a diameter relatively smaller than the above-mentioned predetermined diameter.

[0031] The above-mentioned adhesive may include an acrylic adhesive or an epoxy material. The above-mentioned film member may include a polyethylene film. The above-mentioned bonding member may include a double-sided tape, and the double-sided tape is formed by coating the above-mentioned adhesive on both surfaces of the above-mentioned film member.

[0032] The step of removing the above-mentioned bonding member may include immersing the above-mentioned main pad member in an organic solvent at room temperature for 1 minute to 5 minutes.

[0033] The above-mentioned organic solvent may be composed of two polar organic solvents, one non-polar organic solvent and a non-ionic surfactant. The contents of the two polar organic solvents may be 10% by weight to 30% by weight and 50% by weight to 80% by weight respectively. The content of the non-polar organic solvent may be 1% by weight to 20% by weight, and the content of the non-ionic surfactant may be 0.1% by weight to 1% by weight.

[0034] The step of removing the above-mentioned bonding member may include immersing the above-mentioned main pad member in the above-mentioned organic solvent so that the adhesive of the above-mentioned bonding member is actually completely removed and the film member of the above-mentioned bonding member is separated from the above-mentioned main pad member.

[0035] The step of removing the above-mentioned bonding member may include the following steps: immersing the above-mentioned main pad member in the above-mentioned organic solvent so that the adhesive of the above-mentioned film member is partially removed, so that the above-mentioned film member is in a state where it can be easily removed from the above-mentioned main pad member, or only removing the adhesive of the above-mentioned bonding member from the edge portion of the above-mentioned main pad member; and physically separating the above-mentioned film member from the above-mentioned main pad member using a jig or a cutting device.

[0036] After the step of removing the above-mentioned bonding member by immersing the above-mentioned main pad member in an organic solvent, the step may further include immersing the above-mentioned main pad member in the organic solvent to remove the adhesive remaining on the surface of the above-mentioned main pad member from which the above-mentioned bonding member has been removed.

[0037] In the step of removing the damaged portion of the above-mentioned main pad member, the upper side portion is removed in a manner of removing the damaged portion of the above-mentioned groove, the damaged portion of the side surface portion is removed, or the upper side portion is removed in a manner of completely removing the above-mentioned groove, and the damaged portion of the side surface portion is removed, wherein the damaged portions of the above-mentioned upper side portion and the side surface portion may be removed sequentially or simultaneously.

[0038] In a state where the diameter of the main pad member has a renewable thickness, the step of reforming the groove may include the following steps: If the thickness of the main pad member is determined to be a thickness capable of reforming a groove with a depth greater than or equal to the standard depth, perform a re-grooving operation on the upper surface of the main pad member to form a groove with a depth greater than or equal to the standard depth on the main pad member; If the thickness of the main pad member is determined not to be a thickness capable of reforming a groove with a depth greater than or equal to the standard depth, attach an auxiliary pad member to the other side of the main pad member to supplement the thickness of the main pad member, and then perform a re-grooving operation on the upper surface of the main pad member to form a groove with a depth greater than or equal to the standard depth on the main pad member.

[0039] The pad member may be made of a polyurethane-based material, and the auxiliary pad member may be made of a polyurethane-based material having a recovery coefficient characteristic the same as or similar to that of the pad member.

[0040] The polishing pad regeneration method may further include the following steps: Perform a cleaning process before and after removing the bonding member to remove foreign substances accumulated on the upper surface of the main pad member of the worn polishing pad and in the groove; Perform a cleaning process after removing the damaged part of the main pad member; Perform a cleaning process after reforming the groove. The above cleaning processes may be performed sequentially or simultaneously at once.

[0041] In addition, in a polishing pad regeneration method of the present application, the polishing pad is a worn polishing pad including a main pad member, a buffer pad member, and a bonding member and having a predetermined size. The main pad member is formed with a plurality of grooves having a depth less than the standard depth capable of performing a polishing process. The buffer pad member is attached to the main pad member, and the bonding member is attached to the buffer pad member and is composed of an adhesive and a film member. The polishing pad regeneration method may include the following steps: Chemically remove the bonding member from the buffer pad member; Remove the damaged parts of the upper side and side faces of the main pad member; Judge whether the diameter and thickness of the main pad member are a thickness capable of reforming a groove with a depth greater than or equal to the standard depth; As a judgment result, in a state where the diameter of the main pad member is renewable, if the thickness of the main pad member is a thickness capable of forming a groove with a depth greater than or equal to the standard depth, reform a groove on the upper surface of the main pad member. If the thickness of the main pad member is not a thickness capable of forming a groove with a depth greater than or equal to the standard depth, supplement the thickness of the main pad member so as to be capable of forming a groove with a depth greater than or equal to the standard depth, and then reform a groove on the upper surface of the main pad member; Attach a new bonding member to the main pad member on which the groove has been reformed, thereby regenerating a polishing pad having a diameter relatively smaller than the predetermined diameter.

[0042] The step of removing the above-mentioned adhesive member may include immersing the above-mentioned main pad member in an organic solvent at room temperature for 1 minute to 5 minutes.

[0043] The step of reforming the above-mentioned groove may include, if the thickness of the above-mentioned main pad member is such that a groove with a depth greater than or equal to the above-mentioned standard depth can be reformed, performing a re-grooving operation on the upper surface of the above-mentioned main pad member to which the buffer pad member with the above-mentioned adhesive member removed is attached, so as to form a groove with a depth greater than or equal to the standard depth in the above-mentioned main pad member.

[0044] In the step of reforming the above-mentioned groove, if the thickness of the above-mentioned main pad member is not such that a groove with a depth greater than or equal to the above-mentioned standard depth can be reformed, the following steps may be included: separating the above-mentioned buffer pad member from the above-mentioned main pad member; attaching an auxiliary pad member to the above-mentioned main pad member from which the above-mentioned buffer pad member has been removed to supplement the thickness of the above-mentioned main pad member; reforming a groove with a depth greater than or equal to the standard depth by performing a re-grooving operation on the upper surface of the main pad member from which the damaged part has been removed; and re-attaching the buffer pad member to the above-mentioned auxiliary pad member.

[0045] In the step of removing the above-mentioned buffer pad member from the above-mentioned main pad member, when the above-mentioned buffer pad member is directly attached to the above-mentioned main pad member, it can be removed by using a fixture. When the above-mentioned buffer pad member is attached to the above-mentioned main pad member through the same adhesive member as the above-mentioned adhesive member, it may include removing it by performing the same process as the process of removing the above-mentioned adhesive member from the above-mentioned buffer pad member.

[0046] The step of re-attaching the above-mentioned buffer pad member to the above-mentioned auxiliary pad member may include attaching the buffer pad member to the above-mentioned auxiliary pad member by repeatedly using the buffer pad member separated from the above-mentioned main pad member or attaching a new buffer pad member to the above-mentioned auxiliary pad member.

[0047] In addition, the present application provides a polishing pad regenerated by the above-mentioned method for removing an adhesive member and a method for regenerating a polishing pad using the same.

[0048] Effects of the Invention

[0049] As described above, according to the present embodiment, the adhesive member composed of a double-sided adhesive can be easily removed from the pad member, so that damage to the polishing pad caused by the removal of the adhesive member can be prevented. Therefore, the reuse rate of the worn polishing pad can be improved.

[0050] In addition, if the depth of the groove becomes lower than the standard depth at which the CMP process can be performed due to continuous CMP, the adhesive member is removed from the pad member using an organic solvent, and then a part of the upper surface of the pad member or the entire damaged groove is removed, and the pad member is regrooved so that a groove having a standard depth can be formed in the pad member. Therefore, since the expensive polishing pad can be recycled instead of being discarded, the service life of the polishing pad can be extended.

[0051] On the other hand, when the thickness of the pad member becomes too thin to form a groove having a standard depth, the adhesive member is removed from the pad member using an organic solvent, and then the thickness capable of forming a groove is ensured by attaching an auxiliary pad member to the pad member, and the pad member is regrooved so that a groove having a standard depth can be formed in the pad member. Therefore, the expensive polishing pad can be reused, thereby extending the service life of the polishing pad.

[0052] In addition, when the side surface of the polishing pad of a predetermined size is worn or damaged, the adhesive member is removed from the pad member using an organic solvent, the damaged side portion is removed, and then a regrooving process is performed to regenerate the polishing pad with a reduced size, thereby improving the reuse rate of the polishing pad. Description of the Drawings

[0053] Figure 1 is a schematic perspective view of a CMP apparatus as a semiconductor manufacturing apparatus according to an embodiment of the present application.

[0054] Figure 2a and Figure 2b shows a cross-sectional structure of a polishing pad used in a CMP process before and after use according to an embodiment of the present application.

[0055] Figures 3a to 3i is a cross-sectional view showing an example of a regeneration method of a polishing pad used in a CMP process according to an embodiment of the present application.

[0056] Figures 4a to 4g is a cross-sectional view showing another example of a regeneration method of a polishing pad used in a CMP process according to an embodiment of the present application.

[0057] Figures 5a to 5c is a view showing the state before and after removing the adhesive member according to an embodiment of the present application.

[0058] Figure 6 is a flowchart showing a regeneration method of a polishing pad used in a CMP process according to another embodiment of the present application.

[0059] Figures 7a to 7hA cross-sectional view showing an example of a method for regenerating a polishing pad used in a CMP process according to another embodiment of the present application.

[0060] Figures 8a to 8e A cross-sectional view showing another example of a method for regenerating a polishing pad used in a CMP process according to another embodiment of the present application.

[0061] Figure 9 A flowchart for explaining a method for regenerating a polishing pad used in a CMP process according to another embodiment of the present application.

[0062] Reference numerals:

[0063] 201, 201a - 201n: Polishing pad

[0064] 211: Main pad member

[0065] 211d, 211k, 211n: Pad members

[0066] 213, 213a, 213b, 213d, 213h - 213k, 213n: Grooves

[0067] 215d, 215g, 215k, 215n: Auxiliary pad members

[0068] 217, 217b, 217d, 217i, 217k, 217m, 217n: Adhesive members

[0069] 219, 219k, 219n: Buffer pad members Detailed description

[0070] The present application can be variously deformed and can have various embodiments. Hereinafter, the embodiments (or examples) will be described in detail. However, it should be understood that the present application is not limited to a specific factual manner and includes all changes, equivalents, and substitutes belonging to the idea and technical scope of the present application.

[0071] The terms used in this specification are used to describe various embodiments of the present application, but do not intend to limit the scope of the present application. As long as it is not clearly distinguished and described in the text, the description indicating the singular should be understood to include the plural. In the present application, terms such as "including" or "composed of" are intended to specify the presence of the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and should not be understood to exclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0072] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. Terms that are the same as those defined in a commonly used dictionary shall be interpreted as having a meaning consistent with the meaning in the context of the relevant art, and, if not explicitly defined in this specification, shall not be interpreted as having an abnormal or overly formal meaning.

[0073] Terms such as "first", "second", etc. may be used to describe various structural elements, but the above terms do not limit the above structural elements. The above terms are used to distinguish one structural element from another. For example, without departing from the scope of this application, the first component may be named the second component, and similarly, the second component may be named the first component.

[0074] Terms such as upper end, lower end, upper surface, lower surface, or upper and lower parts are used to distinguish the relative positions of structural elements. For example, for the sake of convenience in description, when the upper side of a figure is named the upper part and the lower side of the figure is named the lower part, in fact, without departing from the scope of the claims of this application, the upper part may be named the lower part, and the lower part may be named the upper part.

[0075] The terms used in this application are only used to describe specific embodiments and are not intended to limit this application. As long as it is not clearly distinguished and described in the text, a description indicating the singular should be understood to include the plural. In this application, terms such as "including" or "having" are intended to specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and it should be understood that the presence or addition of one or more other features or numbers, steps, operations, components, parts, or combinations thereof is not precluded in advance.

[0076] Hereinafter, a method for regenerating a polishing pad according to an embodiment of the present application and a method for manufacturing a polishing pad using the same will be described in detail with reference to the accompanying drawings.

[0077] Figure 1 FIG. is a schematic diagram showing an example of a CMP apparatus according to an embodiment of the present application.

[0078] Refer to Figure 1 , a CMP apparatus 100 according to an embodiment of the present application includes a polishing pad 20 disposed on a platen 10 which is a disk-shaped rotating table. The rotating table 10 is mounted on a central shaft 15 and can rotate about the central shaft 15. The polishing pad 20 can be attached to the rotating table 10 through an adhesive member 30. For example, a pad member of the polishing pad 20 to be described later can be attached to the rotating table 10 through the adhesive member 30.

[0079] In addition, the above CMP apparatus 100 may be provided with a wafer head 40 to which the wafer W is attached such that the surface of the wafer W to be polished faces the polishing surface of the polishing pad 20. The CMP apparatus 100 may further include a slurry supply device 50 for supplying slurry 55 to the polishing surface of the polishing pad 20.

[0080] In the CMP process using the above CMP apparatus 100, in a state where the surface of the wafer W to be polished attached to the wafer head 40 is in contact with the polishing surface of the polishing pad 20 attached to the rotating platen 10, slurry 55 is injected onto the polishing surface of the polishing pad 20 by the slurry supply device 50, and then the wafer head 40 and the rotating platen 10 are rotated to simultaneously perform a chemical reaction and physical polishing, so as to planarize the wafer surface.

[0081] Figure 2a and Figure 2b FIGS. are diagrams showing a polishing pad before and after a CMP process according to an embodiment of the present application. Figure 2a FIG. is a cross-sectional view showing a polishing pad before a CMP process, i.e., before wear, according to an embodiment of the present application. Figure 2b FIG. is a cross-sectional view showing a polishing pad after a CMP process, i.e., after wear, according to an embodiment of the present application.

[0082] Referring to Figure 2a and Figure 2b , a polishing pad according to an embodiment of the present application will be described as follows.

[0083] Referring to Figure 2a , a polishing pad 201 according to an embodiment may include a main pad member 211 and an adhesive member 217. The above polishing pad 201 may be attached to the upper surface of the platen ( Figure 1 10 in). That is, the above main pad member 211 may be attached to the upper surface of the rotating platen 10 through the adhesive member 217.

[0084] In the CMP process, the above main pad member 211 contacts the surface of the wafer W to be polished and performs chemical and mechanical planarization on the above wafer W together with the slurry 55 supplied from the Figure 1 slurry supply unit 50.

[0085] A plurality of grooves 213 may be formed on the polishing surface of the above main pad member 211 opposite to the surface of the wafer W to be polished. As Figure 2a shown, before the CMP process, the above main pad member 211 may have a thickness T 0 , and the portion where the above grooves 213 are formed may have a thickness a 0and a diameter R0 of a predetermined size. Each groove 213 of the main pad member 211 may have a depth D 0 . The depth D 0 may be greater than or equal to a standard depth. The standard depth may refer to the minimum depth of each groove 213 in which the polishing pad 201 can perform a polishing (CMP) process

[0086] The bonding member 217 may be composed of an adhesive and a film member. For example, the adhesive may include an acrylic adhesive, an epoxy material, etc., and the film member may include a polyethylene film, etc. The bonding member 217 may include a double-sided tape formed by coating the adhesive as a bonding material on both surfaces of the polyethylene film

[0087] The polishing pad 201 may be attached to the upper surface of a platen ( Figure 1 in 10). That is, the main pad member 211 may be attached to the upper surface of the rotating platen 10 through the bonding member 217. One surface of the bonding member 217 is attached to the main pad member 211, and the other surface is attached to the surface of the rotating platen 10 so that the polishing pad 201 can be attached to the rotating platen 10

[0088] In the CMP process, in a state where the main pad member 211 is attached to the rotating platen 10 through the bonding member 217, the main pad member 211 contacts the surface of the wafer W to be polished, so that it can be combined with the slurry 55 supplied from Figure 1 the slurry supply unit 50 to perform chemical and mechanical planarization on the wafer W

[0089] When the groove 213 has a depth D greater than or equal to the standard depth 0 and the main pad member 211 has a thickness T 0 and the polishing pad 201 with a diameter R0 is repeatedly subjected to the CMP process for a long time, the polishing pad 201 may gradually wear. Therefore, the depth D 0 of the groove 213 gradually decreases, and the thickness T 0 of the main pad member 211 also gradually decreases. As described above, when the CMP process is repeatedly performed, the polishing pad 201 may be worn or damaged

[0090] As Figure 2b shown, in the worn polishing pad 201a due to repeated formation for the CMP process, the depth of each groove 213a of the main pad member 211 gradually decreases, so it may have a depth D less than the minimum depth (standard depth) capable of performing the CMP process 1, the above depth may be less than the depth D of each groove 213 of the main pad member 211 of the above polishing pad 201 before the CMP process 0 . Additionally, the main pad member 211 of the above polishing pad 201 may have a thickness T less than the thickness T of the main pad member 211 of the above polishing pad 201 before the CMP process 0 of thickness T 1 . Additionally, due to repeated CMP processes, not only the shape of the above groove 213 but also the side surface portion of the main pad member 211 may be damaged.

[0091] Thus, in the above worn polishing pad 201 in which the above groove 213 and side surface portion are damaged, the depth D of the above groove 213 1 becomes less than the minimum depth at which the CMP process can be performed, i.e., the standard depth, resulting in poor polishing efficiency and polishing performance. Therefore, it is difficult to perform a normal polishing process. As a result, the above polishing pad may be discarded. However, the present application can provide a method for regenerating and reusing a polishing pad whose depth is less than the standard depth and which cannot be normally polished due to damage to the peripheral portion, rather than discarding it. The above polishing pad regeneration method mainly includes: a first step process of removing the bonding member for attaching the polishing pad to the rotary platen 10 from the above main pad member; and a second step process of removing the damaged portion of the polishing pad 201 from which the above bonding member has been removed and performing a re-grooving operation on the main pad member, thereby manufacturing a reusable polishing pad.

[0092] Figures 3a to 3i is a cross-sectional view for illustrating an example of a method for regenerating a worn polishing pad according to an embodiment of the present application. Figure 6 is a flowchart for illustrating a method for regenerating a worn polishing pad according to an embodiment of the present application.

[0093] Hereinafter, reference will be made to Figures 3a to 3i and Figure 6 to describe in detail a method for regenerating a polishing pad according to an embodiment of the present application.

[0094] First, a cleaning process (S600) can be performed on a polishing pad, such as Figure 2b the worn polishing pad 201a. Various foreign substances such as reaction products and process residues generated during the repeated CMP process accumulate on the upper surface of the main pad member 211 and the groove 213a. Therefore, the above cleaning process can be performed to remove the foreign substances accumulated on the above polishing pad 201a.

[0095] In an embodiment of the present application, the polishing pad 201a can be cleaned by physical cleaning, dry cleaning, wet cleaning, chemical cleaning, etc. The above physical cleaning can include brush scrubbing cleaning, etc. The above dry cleaning can include air blowing cleaning, tornado cleaning, plasma cleaning, etc. The above wet cleaning can include water jet cleaning, stream jet cleaning, bubble jet cleaning, ultrasonic cleaning, or mega sonic cleaning, etc. The above chemical cleaning can include diluted HF (DHF) cleaning, Buffered Oxide Etch (BOE) cleaning, Sulfuric Acid Peroxide Mixture (SPM) cleaning, Ammonium Peroxide Mixture (APM) cleaning, and Hydrochloric Peroxide Mixture (HPM) cleaning, etc. In addition to the above cleaning processes, various cleaning methods can also be used to perform the cleaning process of the polishing pad 201a.

[0096] Referring to Figure 3a , after the cleaning process of the polishing pad, the bonding member 217 is separated (S610) from the above polishing pad ( Figure 2b 201a in), that is, the main pad member 211.

[0097] In an embodiment of the present application, an organic solvent can be used to chemically remove the bonding member 217 from the main pad member 211. The method of chemically removing the bonding member 217 can include dipping the polishing pad 201a into an organic solvent and removing the polyethylene film of the bonding member 217 from the main pad member 211.

[0098] For example, the bonding member 217 can be removed by dipping it into an organic solvent at room temperature for 1 minute to 5 minutes.

[0099] The method of chemically removing the bonding member 217 can include dipping the pad member into the organic solvent such that the adhesive of the bonding member is actually completely removed and the film member of the bonding member is separated from the pad member.

[0100] In the method of chemically removing the adhesive member 217 described above, after removing the adhesive member 217 from the main pad member 211, the main pad member 211 can be immersed in an organic solvent a second time to further remove any adhesive that may remain on the surface of the main pad member 211.

[0101] The method of chemically removing the adhesive member 217 described above may further include removing the adhesive member 217 from the main pad member 211 and then cleaning the main pad member 211 of the polishing pad from which the adhesive member 217 has been removed. The cleaning process in S610 can be carried out in the same manner as the cleaning process in S600.

[0102] For example, the organic solvent may consist of two polar organic solvents, one non-polar organic solvent, and a non-ionic surfactant. The content of the two polar organic solvents may be 10% to 30% by weight and 50% to 80% by weight, respectively, the content of the non-polar organic solvent is 1% to 20% by weight, and the content of the non-ionic surfactant is 0.1% to 1% by weight. In addition, the polar organic solvents may include dimethyl sulfoxide, acetonitrile, tetrahydrofuran, methanol, ethanol, isopropanol, ethyl acetate, acetone, dimethyl carbonate, dimethylformamide, dimethylacetamide, etc. The non-polar organic solvents may include 1,4-dioxane, hexane, toluene, diethyl ether, petroleum ether, cyclohexane, chloroform, hydrofluorocarbon, etc. ane (1,4-dioxane), hexane, toluene, diethyl ether, petroleum ether, cyclohexane, chloroform, hydrofluorocarbon, etc.

[0103] By immersing the polishing pad in the organic solvent under the above conditions to remove the adhesive component of the adhesive member 217, the adhesive member 217 can be easily removed from the main pad member 211. Therefore, the polyethylene film of the adhesive member 217 can be easily and simply removed from the main pad member 211 without damaging the polishing pad 201a, specifically, the main pad member 211.

[0104] Referring to FIG. 5, it can be seen that the adhesive component of the adhesive member has been successfully removed by the above immersion process. Specifically, asFigure 5a As shown, when the polishing pad is immersed in an organic solvent at room temperature for 1 minute to 5 minutes, as Figure 5b shown, the adhesive component of the bonding member is removed, so that the film component is in a state where it can be easily removed. Figure 5c The pad member from which the bonding member is removed without damage is shown.

[0105] In an embodiment of the present application, an example of removing the bonding member is shown as follows: by fully immersing the above-mentioned bonding member 217 in an organic solvent, so that the adhesive of the above-mentioned bonding member 217 is actually completely removed. However, in another embodiment, the above-mentioned polishing pad 201a may be immersed in the above-mentioned organic solvent for a period of time to form a state where the polyethylene-like film of the above-mentioned bonding member 217 can be easily removed from the above-mentioned main pad member 211, and then the above-mentioned bonding member 217 is physically removed from the above-mentioned main pad member 211.

[0106] As an example, the above-mentioned main pad member 211 may be immersed in an organic solvent to partially remove the above-mentioned adhesive, and then the above-mentioned bonding member 217 is physically separated from the above-mentioned main pad member 211 using a jig or the above-mentioned bonding member 217 is physically separated from the above-mentioned main pad member 211 by a cutting method using a skiving device.

[0107] As another example, the above-mentioned main pad member 211 may be immersed in an organic solvent so that only the adhesive is removed from the edge portion of the above-mentioned main pad member 211, and then the above-mentioned bonding member 217 may be physically separated from the above-mentioned main pad member 211 using a jig.

[0108] As described above, the adhesive is removed by the above-mentioned organic solvent impregnation to form a state where the ethylene-based film can be easily removed, and then the above-mentioned bonding member 217 can be physically removed from the above-mentioned main pad member. Therefore, the bonding member can be easily separated from the main pad member without damaging the main pad member.

[0109] In an embodiment of the present application, an example of performing a cleaning process (S600) to remove foreign substances accumulated on the upper surface and grooves of the polishing pad and then performing a process (S610) of removing the bonding member 217 is shown, but the present application is not limited thereto. In another embodiment, the above-mentioned process (S610) of removing the bonding member 217 may be performed, and then the above-mentioned cleaning process (S600) may be performed.

[0110] For example, in the S610 process, the above-mentioned bonding member 217 is removed, and a cleaning process is performed on the surface of the main pad member 211 (the surface opposite to the surface formed with the groove) from which the bonding member 217 has been removed. Subsequently, in the S600 process, a cleaning process for removing foreign matters accumulated on the upper surface of the main pad member 211 and the groove 213a can be sequentially performed.

[0111] In another example, in the S610 process, the above-mentioned bonding member 217 is removed, and a process of cleaning the surface of the main pad member 211 (the surface opposite to the surface formed with the groove) from which the bonding member 217 has been removed is performed. At the same time, a cleaning process for removing foreign matters accumulated on the upper surface of the above-mentioned main pad member 211 and the groove can be performed (S610).

[0112] Since the upper side portion and the side surface portion of the above-mentioned main pad member 211 including the above-mentioned groove 213a are damaged due to repeated CMP processes, the damaged portion of the above-mentioned main pad member 211 can be removed (S620). Next, the dimension of the width R12 of the above-mentioned main pad member 211 after removing the damaged side surface portion is measured, and it is determined whether the measured width of the above-mentioned main pad member 211 is a dimension that can be regenerated (S630). The width of the above-mentioned main pad member 211 can be measured using a surface detector of a laser 3D displacement measuring device, but the present application is not limited thereto.

[0113] As an example, in the process of removing the damaged portion of the above-mentioned main pad member 211, a planarization process can be performed on the upper side portion to completely remove the groove, and then the damaged portion of the side surface portion is removed, or the damaged portion of the side surface portion is removed, and then the groove is completely removed by a planarization process. As another example, the damaged portion of the side surface portion can be removed while performing a planarization process on the upper side portion to completely remove the groove. For example, the process of removing the damaged portion of the above-mentioned main pad member 211 can be performed using a re-grooving device.

[0114] In the cross-sectional structure, the width R12 of the above-mentioned main pad member 211 can actually refer to the diameter of the polishing pad (for example, refer to Figure 1 20). After the S620 process, the width R12 of the above-mentioned main pad member 211, for example, the diameter R12 of the above-mentioned main pad member 211 can be smaller than the diameter R0 of the polishing pad 201. It is determined whether the diameter R12 of the above-mentioned main pad member 211 has a size that can be regenerated into a polishing pad having a diameter relatively smaller than the diameter R12. As a judgment result, if it cannot be regenerated into a polishing pad having a diameter relatively smaller than the diameter R0 of the polishing pad 201, it can be discarded.

[0115] Among them, the width (diameter) R12 of the main pad member 211 having a renewable size may mean that it can be regenerated into a polishing pad with a smaller size than the above-mentioned worn polishing pad. For example, this means that if the above-mentioned polishing pad 201 is a polishing pad for polishing a 12-inch wafer, the polishing pad regenerated by the polishing pad regeneration process described below can be a polishing pad for an 8-inch, 6-inch, etc. wafer. For example, the sizes of the above-mentioned wafers are exemplary, and the present application is not limited thereto.

[0116] As a judgment result, if the size of the above-mentioned main pad member 211 has a size that can be regenerated into a polishing pad smaller than the diameter R0 of the polishing pad 201, the subsequent polishing pad regeneration process can be performed. First, the thickness of the above-mentioned main pad member 211 can be measured (S640), and then it is judged whether the measured thickness of the above-mentioned main pad member 211 is a thickness that can form a groove with a depth greater than or equal to the standard depth on the upper surface of the above-mentioned main pad member 211 (S650).

[0117] Although in an embodiment of the present application, the operation of measuring the width of the above-mentioned main pad member 211 in the S630 process to judge whether it is a renewable size and the operation of measuring the thickness of the above-mentioned main pad member 211 in the S640 and S650 processes to judge whether it is a renewable size are shown to be performed in sequence, the present application is not limited thereto.

[0118] As an example, the S630 process and the S640 process can be combined, so as to perform the operations of simultaneously measuring the width and thickness of the above-mentioned main pad member 211 and judging whether the measured width is a renewable size and the operation of judging whether the width measured in the S650 process is a renewable size in sequence. As another example, the S630, S640, and S650 processes can be combined, so as to perform the operation of simultaneously measuring the width and thickness of the above-mentioned main pad member 211 and judging whether the measured width and thickness are renewable sizes. As another example, in the S640 and S650 processes, the operation of measuring the thickness of the main pad member 211 and judging whether the measured thickness is a renewable size is performed, and then the S630 process is performed to perform the operation of measuring the width of the above-mentioned main pad member 211 and judging whether the measured width is a renewable size.

[0119] As the judgment result of the S630 and S650 steps, as Figure 3b shown, if the width R12 of the main pad member 211 of the polishing pad from which the damaged part of the groove has been removed is a width that can form a groove with a depth greater than or equal to the standard depth and the thickness T of the main pad member 211 of the polishing pad 12 is a thickness that can form a groove with a depth greater than or equal to the standard depth (S650: Yes), then by performing the re-grooving process, a groove with a depth greater than or equal to the standard depth can be formed in the above-mentioned main pad member 211.

[0120] Specifically, as Figure 3b shown, in the above-mentioned main pad member 211 of the polishing pad, the above-mentioned groove 213a is completely removed in the damaged part removal process (S630), so that the surface of the above-mentioned main pad member 211 can be flattened. Therefore, the above-mentioned main pad member 211 can have a thickness less than the above-mentioned thickness T 1 of thickness T 12 , the thickness T of the above-mentioned main pad member 211 12 can be a thickness a capable of forming a groove with a depth greater than or equal to the above-mentioned standard depth 0 . On the other hand, since the damaged side surface of the above-mentioned main pad member 211 is also removed, the above-mentioned main pad member 211 can have a width R12 capable of being regenerated into a small-sized polishing pad.

[0121] Although in this embodiment, a flattening process is shown such that the thickness T of the above-mentioned main pad member 211 12 has the same size as the thickness a of the main pad member 211 of the part where the groove is formed, the present application is not limited thereto, and the above-mentioned thickness T 0 can be less than the thickness a within the range of the thickness capable of forming a groove with a depth greater than or equal to the standard depth 12 . 0 .

[0122] Subsequently, since the thickness and width of the main pad member 211 of the polishing pad from which the damaged part of the groove has been removed in step S620 are the thicknesses capable of forming a polishable groove with a depth greater than or equal to the standard depth, therefore, as Figure 3c shown, a re-grooving operation can be performed on the above-mentioned main pad member 211 to form a groove 213b in the above-mentioned main pad member 211 (S675). Therefore, the above-mentioned main pad member 211 has the above-mentioned thickness T 12 , and a groove 213b with a depth D greater than or equal to the standard depth 12 can be formed.

[0123] After forming the groove 213b with the above-mentioned depth D in the above-mentioned main pad member 211 12 , a cleaning process can be performed on the above-mentioned main pad member 211. The cleaning process performed after forming the above-mentioned groove can be performed in the same manner as at least one of the cleaning process for removing foreign matters in the groove in step S600, the cleaning process for removing the residue of the adhesive member in step S610, and the cleaning process for removing the residue after removing the damaged part of the main pad member in step S620.

[0124] Next, as Figure 3d shown, a new adhesive member 217b is attached to the upper surface on which the groove 213b is formed and has a thickness T 12The lower surface of the main pad member 211 described above, so that the polishing pad 201b can be regenerated (S685). The bonding member 217b can be made of the same material as the bonding member 217. Therefore, the regenerated polishing pad 201b can include a groove 213b formed on the upper surface having a depth D greater than or equal to the standard depth 12 of the main pad member 211 and a bonding member 217b attached to the lower surface of the main pad member 211, and can have a diameter R12 smaller than the diameter R0 before polishing.

[0125] As a result of the determination in step S640, as Figure 3e shown, when the thickness T1" of the main pad member 211 of the polishing pad from which the damaged portion of the groove has been removed is not a thickness capable of forming a groove having a depth greater than or equal to the standard depth (S640: No), a re-grooving process can be performed to form a groove having a depth greater than or equal to the standard depth in the main pad member 211. Therefore, after supplementing the thickness of the main pad member 211, a re-grooving process can be performed to form a groove having a depth greater than or equal to the standard depth in the main pad member 211.

[0126] Specifically, as Figure 3e shown, in the polishing pad 201c in which the bonding member is removed from the main pad member 211, the groove 213a" of the main pad member 211 can have a depth D 1 less than the above depth D 1 " and less than the standard depth, and the main pad member 211 can have a thickness less than the above thickness T 1 " and less than the thickness T 1 " capable of forming a groove having a depth greater than or equal to the standard depth.

[0127] As Figure 3f shown, in the damaged portion removal process (S620) of the main pad member 211 of the polishing pad, the groove 213a" of the main pad member 211 and its side surface portion are removed. Therefore, the main pad member 211 can have a thickness T 1 " less than the above thickness T 13 " and a width R14 less than the above width R0. Since the groove 213a" is completely removed by the flattening process, the thickness T 13 of the main pad member 211 can be equal to or less than the thickness a 0 " of the portion where the groove 213a" is formed.

[0128] Subsequently, since it has been determined in steps S630 and S640 that the main pad member 211 from which the groove and the side surface portion have been removed in step S620 has a renewable width R14 and a thickness T that cannot form a groove having a depth greater than or equal to the standard depth13 , therefore, as Figure 3g shown, an auxiliary pad member 215d for supplementing the thickness of the main pad member is attached to the lower surface of the main pad member 211 (S660). Therefore, the pad member 211d may include the main pad member 211 and the auxiliary pad member 215d attached to the main pad member 211, and since it includes the thickness T of the main pad member 211 13 it may have a thickness T capable of forming a groove with a depth greater than or equal to the standard depth 14 .

[0129] The main pad member 211 may be made of a polyurethane-based material. The auxiliary pad member 215d may be made of a polyurethane-based material having a recovery coefficient characteristic the same as or similar to that of the main pad member 211. The auxiliary pad member 215d may have a thickness greater than or equal to the thickness of the groove removed in step S620. For example, the auxiliary pad member 215d may have a thickness of 700 μm to 2000 μm. As an example, the auxiliary pad member 215d may be attached to the main pad member 211 by a pressing method. In the embodiment of the present application, the auxiliary pad member 215d is shown to be made of the same material as the main pad member 211, but the present application is not necessarily limited thereto.

[0130] Subsequently, as Figure 3h shown, the main pad member 211 having a thickness T capable of forming a groove with a depth greater than or equal to the standard depth by attaching the auxiliary pad member 215d to the main pad member 211 14 is re-grooved, so that a groove 213d with a depth D greater than or equal to the standard depth can be formed on the upper surface of the main pad member 211 14 (S670).

[0131] As Figure 3i shown, after the groove 213d is formed on the upper surface of the main pad member 211, a new adhesive member 217d is attached to the auxiliary pad member 215d to regenerate the polishing pad 201d (S680). Therefore, the polishing pad 201d may include a pad member 211d and an adhesive member 217d. The pad member 211d is composed of the main pad member 211 and the auxiliary pad member 215d and has a thickness T 14 , the main pad member 211 has a groove 213d with a depth D greater than or equal to the standard depth formed on its upper surface 14 , the auxiliary pad member 215d is attached to the lower surface of the main pad member 211, and the adhesive member 217d is attached to the auxiliary pad member 215d. The polishing pad 201d may have a diameter R14 smaller than the diameter R0 before the polishing.

[0132] Figures 3a to 3i The polishing pad regeneration method according to an embodiment shown can stably chemically remove the bonding member 217 from the main pad member 211 using an organic solvent and regenerate the polishing pads 201b and 201d having dimensions relatively smaller than the dimensions before regeneration, thereby improving the regeneration rate of the polishing pad.

[0133] In addition, in the regenerated polishing pads 201b and 201d, the main pad member 211 or the pad member 211d including the auxiliary pad member 215d has a thickness T 12 、T 14 that can form grooves with a depth greater than or equal to the standard depth, and the depths D 12 、D 14 of the grooves 213b and 213d are greater than or equal to the standard depth, so that the required CMP function can be exerted, improving the polishing efficiency and polishing performance.

[0134] In addition, while performing a re-grooving operation on a single main pad member having a sufficient thickness or a main pad member attached with an auxiliary pad member, the damaged part of the side surface of the main pad member is removed, thereby providing a regenerated polishing pad having a smaller size than the worn polishing pad, and thus the regeneration rate of the polishing pad can be improved.

[0135] As an example, as Figures 3a to 3i shown, the polishing pad regeneration method according to an embodiment shows performing a re-grooving operation on the main pad member after completely removing the above grooves, but the present application is not limited thereto. As another example, the worn polishing pad can also be regenerated into a polishing pad having a relatively smaller size by performing a re-grooving operation on the main pad member after partially removing the grooves.

[0136] Another example of a method for regenerating a polishing pad by partially removing the damaged part of the groove, removing the side surface of the pad member, and then performing a re-grooving operation so that the groove has a depth greater than or equal to the standard depth according to an embodiment of the present application will be described below.

[0137] Figures 4a to 4g It is a cross-sectional view for explaining another example of the method for regenerating a worn polishing pad according to an embodiment of the present application.

[0138] Hereinafter, with reference to Figures 4a to 4g and Figure 6 will be described in detail another example of the method for regenerating a worn polishing pad according to an embodiment of the present application.

[0139] Similar to the polishing pad regeneration method of an example, the cleaning process (S600) for the worn polishing pad 210e, the process of removing the bonding member (S610), the process of removing the damaged part of the side surface after partially removing the damaged part of the upper side of the worn polishing pad 201e (S620), the process of measuring the width of the polishing pad and determining whether it is a renewable width (S630), and the process of measuring the thickness of the polishing pad (S640) can be performed in sequence.

[0140] However, different from the polishing pad regeneration method of an example that completely removes the grooves, in the process of removing the damaged part of the polishing pad 201e (S620), the process (S620) can be performed in such a way that the grooves 213e of the main pad member 211 are partially removed. For example, the process (S620) can be performed on the main pad member 211 in such a way that the grooves 213e are partially removed, and the damaged parts of the grooves and the damaged parts of the side surface can be removed sequentially or simultaneously.

[0141] Refer to Figure 4a , in the worn polishing pad 201e from which the bonding member has been removed through the bonding member removal process ( Figure 6 S610 in it), the main pad member 211 having grooves 213e with a depth D less than the standard depth is formed on the upper surface and has a thickness T 15 and a width (or diameter) R15. 15 As described above, after performing the processes from S600 to S640, it can be determined whether the thickness measured from the main pad member 211 from which the grooves 213e have been partially removed later is a thickness capable of forming a groove for polishing, that is, whether it is a thickness capable of forming a groove with a depth greater than or equal to the standard depth (S650).

[0142] As a result of the determination in step S650, as

[0143] shown, if the thickness T Figure 4b ' of the main pad member 211 having grooves 213e' with partially removed damaged parts formed on the upper surface is a thickness capable of forming a groove with a depth greater than or equal to the standard depth (S650: Yes), a re-grooving process is performed to be able to form a groove with a depth greater than or equal to the standard depth in the main pad member 211. 15 Specifically, the grooves 213e and the side surface of the main pad member 211 of the polishing pad 201e are damaged and / or worn due to repeated CMP processes. Therefore, in the above process (S620), the grooves 213e can be partially removed, and the side surface can be removed. Thus, as

[0144] shown, Figure 4bAs shown, the groove 213e' of the main pad member 211 may have a depth D' that is less than the depth D 15 of the depth D 15 '. Additionally, the main pad member 211 may have a thickness T' that is less than the thickness T 15 of the thickness T 15 ', but may have a renewable thickness and a diameter R15' that is less than the diameter R15, and may have a renewable diameter. The width R15' of the main pad member 211 may refer to the renewable diameter R15' of the polishing pad.

[0145] Subsequently, since the main pad member 211 from which the damaged portions of the groove and the side surface have been removed in step S620 has a thickness and width capable of forming a groove that can be polished, as Figure 4c shown, by performing a re-grooving operation on the main pad member 211, a groove 213f can be formed in the main pad member 211 (S675). Therefore, the main pad member 211 has a thickness (T 16 = T 15 ') and a width (R16 = R15'), and a groove 213f having a depth D greater than or equal to the standard depth can be formed 16 in it.

[0146] After a groove 213f having the depth D 16 is formed in the main pad member 211, a cleaning process for the main pad member 211 can be performed. The cleaning process performed after forming the groove 213f can be carried out in the same manner as at least one of the polishing pad cleaning process in step S600, the cleaning process for removing the residue of the bonding member in step S610, and the cleaning process for removing foreign matter in the groove in step S620.

[0147] Next, as Figure 4d shown, a new bonding member 217f is attached to the lower surface of the main pad member 211 to enable the regeneration of the polishing pad 201f (S685). The bonding member 217f may be made of the same material as the bonding member 217. Therefore, the polishing pad 201f may include the main pad member 211 and the bonding member 217f attached to the lower surface of the main pad member 211, and the main pad member 211 has a groove 213f with the depth D 16 formed on its upper surface and has the thickness T 16 .

[0148] As a result of the determination in step S650, as Figure 4eAs shown, when the thickness T15" of the main pad member 211 with a groove 213e" formed on the upper surface to partially remove the damaged portion is not a thickness capable of forming a groove with a depth greater than or equal to the standard depth (S650: No), it is not possible to form a groove with a depth greater than or equal to the standard depth in the main pad member 211 by performing a re-grooving process. Therefore, after supplementing the thickness of the main pad member 211, it is possible to form a groove with a depth greater than or equal to the standard depth in the main pad member 211 by performing a re-grooving process.

[0149] Specifically, as Figure 4e shown, in the above process (S630), the groove of the main pad member 211 of the polishing pad is partially removed, and the side surface portion is removed. Therefore, the main pad member 211 may have a thickness T less than the above-mentioned thickness T 15 and a thickness T 15 ", and has a non-renewable thickness, and has a width R15" less than the above-mentioned width R15, and has a renewable width.

[0150] Therefore, the damaged portion of the main pad member 211 is removed and has a thickness T that cannot form a groove with a depth greater than or equal to the standard depth 15 ", so a process for supplementing the thickness of the main pad member 211 can be performed to enable the formation of a groove with a depth greater than or equal to the standard depth.

[0151] First, as Figure 4f shown, the pad member 211g can be regenerated (S660) by attaching an auxiliary pad member 215g for supplementing the thickness of the main pad member 211 to the lower surface of the main pad member 211. The auxiliary pad member 215g can be attached to the main pad member 211 by a pressing method. Therefore, the pad member 211g can include the main pad member 211 and the auxiliary pad member 215g attached to the main pad member 211, and can have a width (R15" = R17) and a thickness T 17 .

[0152] The auxiliary pad member 215g can be made of the same material as the main pad member 211. In an embodiment of the present application, the main pad member 211 may be made of a polyurethane-based material. The auxiliary pad member 215g can be made of a polyurethane-based material having the same or similar restitution coefficient characteristics as the main pad member 211. The thickness of the pad member 211g is a thickness T corresponding to the sum of the thickness T 15 " of the main pad member 211 and the thickness of the auxiliary pad 215g 17, and in subsequent processes, it can have a sufficient thickness capable of forming a groove with a depth greater than or equal to the standard depth. The above auxiliary pad member 215g can have a thickness greater than or equal to the thickness of the groove removed in step S620. For example, the above auxiliary pad 215g can have a thickness of 700 μm to 2000 μm. Although an example is shown where the above auxiliary pad member 215g can be made of the same material as the above main pad member 211, the present application is not necessarily limited to this.

[0153] Next, by performing a re-grooving operation on the upper surface of the above pad member 211g, that is, the upper surface of the above main pad member 211, a groove 213g with a depth D greater than or equal to the standard depth can be formed on the upper surface of the above main pad member 211 17 (S670).

[0154] As Figure 4g shown, a new adhesive member 217g can be attached to the lower surface of the above pad member 211g, for example, the lower surface of the above auxiliary pad member 215g, thereby regenerating the polishing pad 201g (S680). The above adhesive member 217g can be composed of the same adhesive member as the above adhesive member 217. Therefore, the above regenerated polishing pad 201g has a thickness T 17 and a width R17, and can include a pad member 211g and an adhesive member 217g. The above pad member 211g has a groove 213g with the above depth D formed on its upper surface 17 and is composed of the above main pad member 211 and auxiliary pad member 215g. The above adhesive member 217g is attached to the lower surface of the above auxiliary pad member 215g.

[0155] Figures 7a to 7h FIG. is an example showing a method for regenerating a polishing pad according to another embodiment of the present application. Figure 9 FIG. is a flowchart for explaining a method for regenerating a polishing pad according to another embodiment of the present application.

[0156] Next, with reference to Figures 7a to 7h and Figure 9 an example of a method for regenerating a polishing pad according to another embodiment of the present application will be described.

[0157] As Figure 7a shown, the worn polishing pad 201h can include a main pad member 211, a buffer pad member 219, and an adhesive member 217. The above main pad member 211 can have a groove 213h with a depth D formed on its upper surface. The above groove 213h can have a depth D less than the standard depth 21 , and the above main pad member 211 can have a thickness T 21 and a width (diameter) R21. 21

[0158] First, a cleaning process (S900) can be performed on the worn polishing pad 201h. During the repeated CMP process, various foreign substances such as reaction products and process residues accumulate on the upper surface and the grooves 213h of the main pad member 211. Therefore, the above-mentioned cleaning process can be carried out to remove the foreign substances accumulated on the polishing pad 201h. Similarly to an embodiment, in the cleaning process (S900) according to another embodiment, the polishing pad 201h can be cleaned by using physical cleaning, dry cleaning, wet cleaning, chemical cleaning, etc.

[0159] Subsequently, as Figure 7b shown, in the polishing pad 201h, the bonding member 217 can be removed from the buffer pad member 219 (S910). In another embodiment of the present application, an organic solvent can be used to chemically remove the bonding member 217 from the buffer pad member 219. The method of chemically removing the bonding member 217 may include dipping the polishing pad 201h in an organic solvent and removing the polyethylene film of the bonding member 217 from the buffer pad member 219. In another embodiment, the bonding member 217 can be removed by dipping in an organic solvent at room temperature for 1 minute to 5 minutes.

[0160] As an example, the method of chemically removing the bonding member 217 may include dipping the main pad member in the organic solvent such that the adhesive of the bonding member 217 is actually completely removed and the film member of the bonding member 217 is separated from the buffer pad member 219.

[0161] In the method of chemically removing the bonding member 217, after removing the bonding member 217 from the buffer pad member 219, the polishing pad 201h can be dipped in the organic solvent a second time to further remove the adhesive that may remain on the surface of the buffer pad member 219.

[0162] For example, the organic solvent may be composed of two polar organic solvents, one non-polar organic solvent, and a non-ionic surfactant. The contents of the two polar organic solvents may be 10% by weight to 30% by weight and 50% by weight to 80% by weight respectively, the content of the non-polar organic solvent is 1% by weight to 20% by weight, and the content of the non-ionic surfactant is 0.1% by weight to 1% by weight. Additionally, the polar organic solvents may include dimethyl sulfoxide, acetonitrile, tetrahydrofuran, methanol, ethanol, isopropanol, ethyl acetate, acetone, dimethyl carbonate, dimethylformamide, dimethylacetamide, etc. The non-polar organic solvents may include 1,4-di alkane, hexane, toluene, diethyl ether, petroleum ether, cyclohexane, chloroform, hydrofluorocarbon, etc.

[0163] In addition, the method of chemically removing the adhesive member 217 described above may further include cleaning the main pad member 211 from which the adhesive member 217 has been removed after removing the adhesive member 217 from the buffer pad member 219. The cleaning process in S910 may be performed in the same manner as the cleaning process in S900.

[0164] By immersing the polishing pad in an organic solvent under the above conditions to remove the adhesive component of the adhesive member 217, the adhesive member 217 can be easily and simply removed from the buffer pad member 219. Therefore, the polyethylene film of the adhesive member 217 can be easily and simply removed from the buffer pad member 219 without damaging the polishing pad 201h, specifically, the main pad member 211.

[0165] As shown in an embodiment described with reference to FIG. 5, it can be seen that the adhesive of the adhesive member is substantially completely removed by the organic solvent impregnation method, so that the adhesive member is separated from the pad member.

[0166] In an example of another embodiment of the present application, an example of removing the adhesive member is shown in the following manner: by sufficiently immersing the adhesive member 217 in an organic solvent so that the adhesive of the adhesive member 217 is actually completely removed. However, in another embodiment, the polishing pad 201h may be immersed in the organic solvent for a period of time to form a state in which the polyethylene film of the adhesive member 217 can be easily removed from the buffer pad member 219, and then the adhesive member 217 is physically removed from the buffer pad member 219.

[0167] Specifically, the main pad member 211 may be immersed in an organic solvent to partially remove the adhesive, and then the adhesive member 217 is physically separated from the buffer pad member 219 using a jig or the adhesive member 217 is physically separated from the buffer pad member 219 by cutting using a cutting device.

[0168] As another example, the main pad member 211 may be immersed in an organic solvent so that the adhesive is only removed from the edge portion of the buffer pad member 219, and then the adhesive member 217 can be physically separated from the buffer pad member 219 using a jig.

[0169] As described above, by removing the adhesive through the above-mentioned organic solvent impregnation to form a state in which the ethylene film can be easily removed, and then the adhesive member 217 can be physically removed from the buffer pad member 219. Therefore, the adhesive member can be easily separated from the pad member without damaging the pad member.

[0170] In another embodiment, a process (S910) of removing the bonding member 217 is illustrated after performing a cleaning process (S900) for removing foreign substances accumulated on the upper surface and the grooves of the polishing pad. However, the present application is not limited thereto. Similarly to an embodiment, after performing the process (S910) of removing the bonding member 217, the above-mentioned cleaning process (S900) is performed, or the cleaning process for the surface of the buffer pad member 219 after removing the bonding member 217 in the process S910 and the cleaning process in the process S900 are performed simultaneously.

[0171] Since the upper side portion and the side surface portion including the above-mentioned grooves 213h of the above-mentioned main pad member 211 are worn and / or damaged by repeated CMP processes, the damaged portion of the above-mentioned polishing pad 201h can be removed (S920). Since the damaged portion of the upper side portion of the above-mentioned main pad member 211 is partially removed, only a part of the above-mentioned grooves 213 can be removed, and the damaged portion of the side surface portion can be removed. Similarly to an embodiment, in the method of removing the damaged portion of the above-mentioned main pad member 211, the damaged portion of the groove and the damaged portion of the side surface portion can be removed sequentially, or the damaged portion of the groove and the damaged portion of the side surface portion can be removed simultaneously.

[0172] Next, the width R21' and the thickness T' of the above-mentioned main pad member 211 from which the damaged side surface portion has been removed are measured (S930), and it can be determined whether the measured width and thickness of the above-mentioned main pad member 211 have renewable dimensions (S940). A surface detector using a laser 3D displacement measuring device can be used to measure the width and thickness of the above-mentioned main pad member 211, but the present application is not limited thereto. 21 As shown, when removing the damaged portion of the polishing pad in the process S920, the above-mentioned groove 213h' of the above-mentioned main pad member 211 can have a depth D' smaller than the above-mentioned depth D, and the above-mentioned main pad member 211 can have a thickness T' smaller than the above-mentioned thickness T. In addition, the above-mentioned main pad member 211 can have a width R21' smaller than the above-mentioned width R21, that is, a diameter R21' smaller than the above-mentioned diameter R21.

[0173] As Figure 7c shown, when removing the damaged portion of the polishing pad in the process S920, the above-mentioned groove 213h' of the above-mentioned main pad member 211 can have a depth D' smaller than the above-mentioned depth D 21 of 21 depth D 21 and the above-mentioned main pad member 211 can have a thickness T' smaller than the above-mentioned thickness T 21 . In addition, the above-mentioned main pad member 211 can have a width R21' smaller than the above-mentioned width R21, that is, a diameter R21' smaller than the above-mentioned diameter R21.

[0174] Judge the width R21' of the main pad member 211 above, for example, whether the diameter R21' of the polishing pad 201h above has a size that can be regenerated into a polishing pad with a reduced size. As a judgment result, if the size of the diameter R21' of the polishing pad 201h cannot be regenerated into a polishing pad with a reduced size, it can be discarded. Among them, the width R21' of the main pad member 211 having a renewable size means that the worn polishing pad above can be regenerated into a polishing pad with a relatively smaller diameter, so the regeneration process of the subsequent process can be carried out. Therefore, it can be judged the thickness T measured from the main pad member 211 from which the groove 213h above is partially removed 21 ' whether it is the thickness capable of forming a polishable groove, that is, whether it is the thickness capable of forming a groove with a depth greater than or equal to the standard depth.

[0175] In another example, similarly to the above example, the width of the main pad member can be measured first, and it can be judged whether the measured width has a renewable size. Subsequently, if the above width is a renewable width, the thickness of the main pad member 211 above can be measured, and it can be judged whether the measured thickness has a renewable size. As another example, after removing the damaged part of the main pad member above, the width and thickness of the main pad member are measured simultaneously, it is judged whether the measured width has a renewable size, and then it can be judged whether the measured thickness has a renewable size.

[0176] As the judgment result of steps S930 and S940, as Figure 7c shown, if the width R21' of the main pad member 211 of the polishing pad from which the damaged part of the groove has been removed is a renewable width and the thickness T of the polishing pad member 211 21 ' is the thickness capable of forming a groove with a depth greater than or equal to the standard depth (S940: Yes), then through the re-grooving process, a groove with a depth greater than or equal to the standard depth can be formed in the main pad member 211 above.

[0177] Specifically, as Figure 7c shown, in the main pad member 211 of the polishing pad, in the damaged part removal process (S930), the groove 213a is partially removed, so the main pad member 211 can have a thickness less than the above thickness T 21 and capable of forming a groove with a depth greater than or equal to the above standard depth, the thickness T 21 '. In addition, the damaged part of the side surface of the main pad member 211 is removed, so that the main pad member 211 can have a width R21' capable of being regenerated into a polishing pad with a relatively small size.

[0178] Subsequently, since the thickness and width of the main pad member 211 of the polishing pad from which the damaged part of the groove has been removed in step S920 have the thickness of a polishable groove with a depth greater than or equal to the standard depth, therefore, asFigure 7d As shown, a re-grooving operation is performed on the main pad member 211 above to form a groove 213i in the main pad member 211 (S975). Thus, the main pad member 211 has the above thickness (T 22 = T 21 '), and a groove 213i with a depth D greater than or equal to the standard depth can be formed. 22

[0179] After a groove 213i with the above depth D 22 is formed in the main pad member 211, a cleaning process for the main pad member 211 can be performed. The cleaning process performed after forming the groove can be carried out in the same manner as at least one of the cleaning processes for removing foreign matter in the groove in step S900, the cleaning process for removing the residue of the bonding member in step S910, and the cleaning process for removing the residue after removing the damaged part of the main pad member in step S920.

[0180] Next, a new bonding member 217i is attached to the lower surface of the buffer pad member 219 having a groove 213i formed on the upper surface and having a thickness T 22 to regenerate the polishing pad 201i (S995). The bonding member 217i can be made of the same material as the bonding member 217. Thus, the regenerated polishing pad 201i can include the main pad member 211, the buffer pad member 219, and the bonding member 217i and have a diameter (R22 = R21') smaller than the diameter R21 before polishing. The main pad member 211 has a groove 213i with a depth D greater than or equal to the standard depth formed on the upper surface. The buffer pad member 219 is attached to the lower surface of the main pad member 211, and the bonding member 217i is attached to the lower surface of the main pad member 211. 22

[0181] As a result of the determination in step S940, if the thickness of the main pad member 211 of the polishing pad 201j from which the damaged part of the groove has been removed is not the thickness capable of forming a groove with a depth greater than or equal to the standard depth (S940: No), then a groove with a depth greater than or equal to the standard depth cannot be formed in the main pad member 211 by performing the re-grooving process. Therefore, after supplementing the thickness of the main pad member 211, a re-grooving process can be performed to form a groove with a depth greater than or equal to the standard depth in the main pad member 211.

[0182] Specifically, as Figure 7e shown, in the polishing pad 201j from which the bonding member has been removed from the buffer pad member 219 through the bonding member removal process (S910) as described above, the main pad member 211 has a thickness T 23 ​​and a width R23, and the groove 213j formed on the upper surface of the main pad member 211 may have a depth D 23 .

[0183] Due to the damage and / or wear of the groove 213j and the side surface of the main pad member 211 of the polishing pad 201j due to repeated CMP processes, in the process (S920), the groove 213j is partially removed, and the side surface may be removed. Therefore, as Figure 7f shown, the groove 213j of the main pad member 211 may have a depth D 23 less than the depth D 23 '. In addition, the main pad member 211 may have a thickness T 23 less than the thickness T 23 ', and may have a non-renewable thickness, and may have a width R23' less than the width R23, and may have a renewable diameter. The width R23' of the main pad member 211 may refer to the diameter R23' of a polishing pad that can be regenerated to a smaller size than the size before polishing.

[0184] Subsequently, the damaged part of the main pad member 211 is removed to have a thickness T 23 ' of a groove with a depth greater than or equal to the standard depth, so a process for supplementing the thickness of the main pad member 211 can be performed to be able to form a groove with a depth greater than or equal to the standard depth.

[0185] First, as Figure 7g shown, the buffer pad member 219 Figure 7f can be removed from the main pad member 211 (S950). Similar to an embodiment, after performing the process of removing the buffer pad member 219 from the main pad member 211, a cleaning process for the main pad member 211 is performed, and the cleaning can be performed in the same manner as at least one of the cleaning processes in step S900, the cleaning process in step S910, and the cleaning process in step S920.

[0186] For example, the buffer pad member 219 can be separated from the main pad member 211 using a jig. The method of separating the buffer pad member 219 from the main pad member 211 is not limited to the method using a jig. As another example, an organic solvent can be used to separate the buffer pad member 219 from the main pad member 211. When the buffer pad member 219 is attached to the main pad member 211 using double-sided tape, the adhesive member 217 can be separated from the buffer pad member 215 using the adhesive member removal method in step S910.

[0187] Subsequently, the pad member 211k can be regenerated by attaching an auxiliary pad member 215k for supplementing the thickness of the main pad member to the lower surface of the main pad member 211 from which the cushion pad member has been removed (S960). The auxiliary pad member 215k can be attached to the pad member 211k by a pressing method. Therefore, the pad member 211k can be composed of the main pad member 211 and the auxiliary pad member 215k and have a thickness T corresponding to that of the main pad member 211 23 " and the sum of the thicknesses of the auxiliary pad member 215k 24 , and can have a thickness large enough to form a groove with a depth greater than or equal to the standard depth in subsequent processes.

[0188] Similarly to an embodiment, the auxiliary pad member 215k can be made of the same material as the main pad member 211 and can have a thickness equal to or greater than the thickness of the groove removed in step S920. For example, it can have a thickness of 700 μm to 2000 μm.

[0189] Then, a re-grooving operation can be performed on the upper surface of the pad member 211k, i.e., the upper surface of the main pad member 211, to form a groove 213k having a depth D greater than or equal to the standard depth on the upper surface of the main pad member 211 (S970). 24 of the groove 213k(S970).

[0190] Subsequently, as Figure 7h shown, the cushion pad member 219k is attached to the lower surface of the pad member 211k, for example, the lower surface of the auxiliary pad member 215k (S980), and then the polishing pad 201k is regenerated by attaching the adhesive member 217k to the lower surface of the cushion pad member 219k (S990). As the cushion pad member 219k, the cushion pad member 219 removed in the process of S950 can be reused, or a new cushion pad member identical to the cushion pad member 219 can be included. The adhesive member 217k can be composed of a new adhesive member identical to the adhesive member 217. Therefore, the regenerated polishing pad 201k can include the pad member 211k, the cushion pad member 219k, and the adhesive member 217k. The pad member 211k can be composed of the main pad member 211 and the auxiliary pad member 215k having a thickness T 24 and a width (diameter) (R24 = R23') and having a groove 213k with the depth D formed on the upper surface 24 of the groove 213k, and the cushion pad member 219k is attached to the lower surface of the auxiliary pad member 215k.

[0191] Figures 8a to 8eA cross-sectional view for another example of a method for regenerating a worn polishing pad according to another embodiment of the present application.

[0192] The following will refer to Figures 8a to 8e and Figure 9 to describe in detail another example of a method for regenerating a worn polishing pad according to another embodiment of the present application.

[0193] Similar to the polishing pad regeneration method of another embodiment, the cleaning process (S900) for the worn polishing pad 201l, the process of removing the bonding member (S910), the process of removing the damaged part of the worn polishing pad 201l (S920), and the process of measuring the width and thickness of the polishing pad (S930) can be performed in sequence.

[0194] However, different from the polishing pad regeneration method of an example of partially removing the grooves, the process of removing the damaged parts of the upper side and the side faces of the worn polishing pad 201l can be performed (S920) so that the grooves of the main pad member 211 are completely removed. For example, a flattening process can be performed on the main pad member 211 so that the grooves are completely removed, thereby flattening the upper surface of the main pad member 211.

[0195] Therefore, as Figure 8a shown, the polishing pad 201l can include a main pad member 211 and a buffer pad member 219 from which the bonding member is removed from the buffer pad member 219, the damaged parts of the upper side and the side faces are removed, and the surface is flattened. As described in the above example, as a result of the determination in the S940 process, if the thickness T of the main pad member 211 having a renewable width R26 26 has a thickness capable of forming grooves with a depth greater than or equal to the standard depth (S940: Yes), the polishing pad can be regenerated by performing a re-grooving operation on the main pad member 211.

[0196] Specifically, as Figure 8b shown, a re-grooving operation can be performed on the main pad member 211 to form grooves 213m with a depth D greater than or equal to the standard depth on the upper surface 26 (S975). After forming the grooves 213m, an additional cleaning process can be performed in the same manner as described above.

[0197] Next, the polishing pad 201m can be regenerated by attaching a new adhesive 217m to the lower surface of the buffer pad member 219 (S995). Therefore, the polishing pad 201m can be provided with grooves 213m formed on the upper surface of the main pad member 211 and having a diameter R26 relatively smaller than the diameter before the CMP process.

[0198] As a judgment result of the S940 process, if the thickness T of the above-mentioned main pad member 211 with a renewable width R28 27 is not a size that can form a groove with a depth greater than or equal to the standard depth (S940: No), the above-mentioned main pad member 211 cannot be re-grooved. Therefore, the re-grooving operation can be performed after ensuring the sufficient thickness of the pad member to regenerate the polishing pad.

[0199] Specifically, since the thickness T of the above-mentioned main pad member 211 27 is not a sufficient thickness to form a groove with a depth greater than or equal to the standard depth, the operation of supplementing the thickness of the pad member can be performed first. The above-mentioned buffer pad member can be separated from the above-mentioned main pad member 211 (S950). Similar to an embodiment, when the above-mentioned buffer pad member is directly attached to the above-mentioned main pad member 211, the above-mentioned buffer pad member can be separated from the main pad member 211 using a jig. In addition, when the above-mentioned buffer pad member is attached to the above-mentioned main pad member 211 through an adhesive member, the above-mentioned buffer pad member can be separated from the above-mentioned main pad member 211 through the S910 process.

[0200] Subsequently, as Figure 8c shown, the pad member 211n can be regenerated (S960) by attaching the auxiliary pad member 215n to the lower surface of the above-mentioned main pad member 211 from which the above-mentioned buffer pad member is separated. Therefore, the above-mentioned pad member 211n is composed of the above-mentioned main pad member 211 and the auxiliary pad member 215n, and can have a thickness T that can form a groove with a depth greater than or equal to the standard depth due to including the above-mentioned auxiliary pad member 215n 28 .

[0201] As Figure 8d shown, by performing a re-grooving operation on the upper surface of the above-mentioned pad member 211n, for example, the upper surface of the above-mentioned main pad member 211, a groove 213n with a depth D greater than or equal to the standard depth can be formed 28 (S970). After forming the above-mentioned groove 213n, an additional cleaning process can be performed in the same manner as the above content.

[0202] Subsequently, as Figure 8e shown, the buffer pad member 219n can be attached to the lower surface of the above-mentioned pad member 211n, for example, the lower surface of the above-mentioned auxiliary pad member 215n (S980). As the above-mentioned buffer pad member 219n, the buffer pad member 219 separated in the process (S950) can be reused or a new buffer pad member can be used.

[0203] Next, the polishing pad 201n can be regenerated by attaching a new adhesive 217n to the lower surface of the buffer pad member 219n (S990). Thus, a polishing pad 201n can be provided which has a groove 213n formed on the upper surface of the main pad member described above and has a diameter R28 which is relatively smaller than the diameter before the CMP process.

[0204] Although examples in which the buffer pad member and the auxiliary pad member are each composed of a single layer are shown in the embodiments of the present application, the present application is not limited thereto, and they may each be composed of multiple layers. For example, the multiple layers may be configured to be attached by an adhesive member.

[0205] In addition, in the embodiments of the present application, the process of separating the buffer pad member from the main pad member may be removed in the S910 process, or may be performed before the S920 process or before the S930 process.

[0206] In addition, although examples in which when the thickness of the regenerated main polishing pad is insufficient to form a groove for polishing in a worn polishing pad, the process of removing the adhesive member from the main polishing pad member, the process of removing the buffer pad member from the main polishing pad member, the process of attaching the auxiliary pad member to the main pad member, and the process of re-grooving the main pad member to which the auxiliary pad member is attached are shown in the embodiments of the present application, the present application is not limited thereto. For example, the process of removing the buffer pad member from the main pad member, the process of removing the adhesive member from the buffer pad member, the process of attaching the auxiliary pad member to the main pad member, and the process of re-grooving the main pad member to which the auxiliary pad member is attached may be performed in sequence.

[0207] As described above, according to the present embodiment, the adhesive member composed of a double-sided adhesive can be easily removed from the pad member, so that damage to the polishing pad caused by the removal of the adhesive member can be prevented. Therefore, the reuse rate of the worn polishing pad can be increased.

[0208] In addition, if the depth of the groove becomes lower than the standard depth at which the CMP process can be performed due to the continuous progress of the CMP process, after removing the damaged portions of the upper side portion and the side face portion of the main pad member, a groove having a standard depth is formed on the upper surface of the main pad member, so that a polishing pad having a relatively small diameter can be regenerated. Therefore, the service life of the expensive CMP pad can be extended.

[0209] On the other hand, if the thickness of the main pad member becomes too thin to form a groove having a standard depth, the auxiliary pad member can be attached to the main pad member so that the main pad member has a thickness capable of forming a groove having a standard depth, and then a re-grooving operation is performed. Therefore, the expensive CMP pad can be reused for a long time.

[0210] As described above, the present application has been described in detail with reference to the preferred embodiments of the present application. However, those skilled in the art will understand that various modifications and changes can be made to these embodiments without departing from the spirit and scope of the present application as recited in the appended claims.

Claims

1. A method for removing an adhesive member, characterized in that: The steps include: providing a main pad member having an adhesive member composed of an adhesive and a film member attached to one surface; and The bonding member is chemically removed from the main pad member.

2. The adhesive member removal method according to claim 1, characterized in that: The adhesive member includes a double-sided tape obtained by applying the adhesive on both sides of the film member.

3. The adhesive member removal method according to claim 1, characterized in that: The adhesive comprises a polyacrylic adhesive or an epoxy material. The film member includes a polyethylene film.

4. The adhesive member removal method according to claim 1, characterized in that: The step of removing the bonding member includes immersing the pad member in an organic solvent at room temperature for 1 minute to 5 minutes.

5. The adhesive member removal method according to claim 4, characterized in that: The organic solvent consists of two polar organic solvents, a non-polar organic solvent and a non-ionic surfactant.

6. The adhesive member removal method according to claim 5, characterized in that: The contents of the two polar organic solvents are 10 to 30 wt % and 50 to 80 wt % respectively, the content of the non-polar organic solvent is 1 to 20 wt %, and the content of the nonionic surfactant is 0.1 to 1 wt %.

7. The adhesive member removal method according to claim 4, characterized in that: In the step of removing the bonding member, the pad member is immersed in the organic solvent so that the adhesive of the bonding member is substantially completely removed and the film member of the bonding member is separated from the pad member.

8. The adhesive member removal method according to claim 4, characterized in that: The step of removing the bonding member comprises the following steps: immersing the pad member in the organic solvent to partially remove the adhesive of the film member so that the film member is in a state that can be easily removed from the pad member; and The film member is physically separated from the pad member.

9. The adhesive member removal method according to claim 8, characterized in that: The step of physically separating the film member includes physically separating the film member from the pad member using a jig or physically separating the film member by cutting using a cutting device.

10. The adhesive member removal method according to claim 4, characterized in that: The step of removing the bonding member comprises the following steps: immersing the pad member in the organic solvent so that the adhesive of the adhesive member is removed only from the edge portion of the pad member; and The film member is physically separated from the pad member using a clamp.

11. The adhesive member removal method according to claim 4, characterized in that: After removing the adhesive member by immersing the pad member in an organic solvent, further immersing the pad member in an organic solvent to remove the adhesive remaining on the surface of the pad member from which the adhesive member has been removed.

12. The adhesive member removal method according to claim 1, characterized in that: After removing the adhesive member from the pad member, the method further includes cleaning the pad member from which the adhesive member has been removed.

13. The adhesive member removal method according to claim 12, characterized in that: The cleaning step is performed by using at least one of a physical cleaning method, a dry cleaning method, and a wet cleaning method.

14. The adhesive member removal method according to claim 13, characterized in that: The physical cleaning method includes brush scrubbing cleaning, The dry cleaning method includes air blowing cleaning, tornado cleaning or plasma cleaning. The wet cleaning method includes water jet cleaning, jet cleaning, bubble jet cleaning, ultrasonic cleaning or megasonic cleaning.

15. The adhesive member removal method according to claim 4, characterized in that: a cushion member is interposed between the main cushion member and the adhesive member, In the step of removing the bonding member from the pad member, the bonding member is removed from the main pad member or the cushion member.

16. A method for regenerating a polishing pad, the polishing pad being a worn polishing pad having a predetermined diameter and comprising a main pad member and an adhesive member, the main pad member being formed with a plurality of grooves having a depth less than a standard depth capable of performing a polishing process, the adhesive member being attached to the main pad member and consisting of an adhesive and a film member, the method comprising the following steps: chemically removing the bonding member from the primary pad member; removing damaged portions of the upper and side portions of the main cushion member; determining whether the diameter and thickness of the main cushion member are such that a groove having a depth greater than or equal to a standard depth can be reformed; re-forming a groove on the upper surface of the main cushion member according to the determination result; and A new bonding member is attached to the lower surface of the main pad member in which the groove is formed, thereby regenerating the polishing pad having a relatively smaller diameter than the predetermined diameter.

17. The polishing pad regeneration method according to claim 16, characterized in that: The adhesive comprises a polyacrylic adhesive or an epoxy material. The film member comprises a polyethylene film, The adhesive member includes a double-sided tape obtained by applying the adhesive on both sides of the film member.

18. The polishing pad regeneration method according to claim 16, characterized in that: The step of removing the bonding member includes immersing the main pad member in an organic solvent at room temperature for 1 minute to 5 minutes.

19. The polishing pad regeneration method according to claim 18, characterized in that: The organic solvent is composed of two polar organic solvents, a non-polar organic solvent and a non-ionic surfactant. The contents of the two polar organic solvents are 10 to 30 wt % and 50 to 80 wt % respectively, the content of the non-polar organic solvent is 1 to 20 wt %, and the content of the nonionic surfactant is 0.1 to 1 wt %.

20. The polishing pad regeneration method according to claim 18, characterized in that: In the step of removing the bonding member, the main cushion member is immersed in the organic solvent so that the adhesive of the bonding member is substantially completely removed and the film member of the bonding member is separated from the main cushion member.

21. The polishing pad regeneration method according to claim 18, characterized in that: The step of removing the bonding member comprises the following steps: immersing the main cushion member in the organic solvent so that the adhesive of the film member is partially removed so that the film member is in a state that can be easily removed from the main cushion member, or removing the adhesive of the adhesive member only from the edge portion of the main cushion member; and The film member is physically separated from the main pad member using a jig or cutting device.

22. The polishing pad regeneration method according to claim 18, characterized in that: The step of removing the bonding member further includes, after removing the bonding member by immersing the main cushion member in an organic solvent, immersing the main cushion member in an organic solvent to remove adhesive remaining on the surface of the main cushion member from which the bonding member has been removed.

23. The polishing pad regeneration method according to claim 16, characterized in that: In the step of removing the damaged portion of the main cushion member, the upper side portion is removed in a manner of removing the damaged portion of the groove and the damaged portion of the side portion is removed, or the upper side portion is removed in a manner of completely removing the groove and the damaged portion of the side portion is removed, Wherein, the damaged parts of the upper side portion and the side portion are removed sequentially or simultaneously.

24. The polishing pad regeneration method according to claim 16, characterized in that: The step of reforming the groove in a state where the diameter of the main cushion member has a reproducible thickness comprises the following steps: If the thickness of the main cushion member is determined to be a thickness capable of re-forming a groove having a depth greater than or equal to the standard depth, re-grooving the upper surface of the main cushion member to form a groove having a depth greater than or equal to the standard depth on the main cushion member; If the thickness of the main pad component is judged to be not thick enough to re-form a groove with a depth greater than or equal to the standard depth, an auxiliary pad component is attached to the other side of the main pad component to supplement the thickness of the main pad component, and then the upper surface of the main pad component is re-grooved to form a groove with a depth greater than or equal to the standard depth in the main pad component.

25. The polishing pad regeneration method according to claim 24, characterized in that: The pad component is made of polyurethane material. The auxiliary pad member is made of a polyurethane-based material having the same or similar coefficient of restitution characteristics as the pad member.

26. The polishing pad regeneration method according to claim 16, characterized in that: The polishing pad regeneration method further comprises the following steps: performing a cleaning process before and after removing the bonding member to remove foreign matter accumulated on the upper surface of the main pad member of the worn polishing pad and the groove; performing a cleaning process after removing the damaged portion of the main cushion member; A cleaning process is performed after reforming the grooves, The cleaning processes are performed sequentially or simultaneously at one time.

27. A method for regenerating a polishing pad, the polishing pad comprising a main pad member, a buffer pad member and an adhesive member and having a predetermined size of wear, the main pad member being formed with a plurality of grooves having a depth less than a standard depth capable of performing a polishing process, the buffer pad member being attached to the main pad member, the adhesive member being attached to the buffer pad member and consisting of an adhesive and a film member, the method comprising the following steps: chemically removing the bonding member from the cushion member; removing damaged portions of the upper and side portions of the main cushion member; determining whether the diameter and thickness of the main cushion member are such that a groove having a depth greater than or equal to a standard depth can be reformed; As a result of the judgment, in a state where the diameter of the main cushion member is reproducible, if the thickness of the main cushion member is a thickness capable of forming a groove having a depth greater than or equal to a standard depth, then re-forming a groove on the upper surface of the main cushion member, and if the thickness of the main cushion member is not a thickness capable of forming a groove having a depth greater than or equal to the standard depth, then supplementing the thickness of the main cushion member so as to be able to form a groove having a depth greater than or equal to the standard depth, and then re-forming a groove on the upper surface of the main cushion member; A new bonding member is attached to the main pad member in which the grooves are reformed, thereby regenerating a polishing pad having a diameter relatively smaller than the predetermined diameter.

28. The polishing pad regeneration method according to claim 27, characterized in that: The adhesive comprises a polyacrylic adhesive or an epoxy material. The film member comprises a polyethylene film, The adhesive member includes a double-sided tape obtained by applying the adhesive on both sides of the film member.

29. The polishing pad regeneration method according to claim 27, characterized in that: The step of removing the bonding member includes immersing the main pad member in an organic solvent at room temperature for 1 minute to 5 minutes.

30. The polishing pad regeneration method according to claim 29, characterized in that: The organic solvent is composed of two polar organic solvents, a non-polar organic solvent and a non-ionic surfactant. The contents of the two polar organic solvents are 10 to 30 wt % and 50 to 80 wt % respectively, the content of the non-polar organic solvent is 1 to 20 wt %, and the content of the nonionic surfactant is 0.1 to 1 wt %.

31. The polishing pad regeneration method according to claim 29, characterized in that: In the step of removing the bonding member, the main cushion member is immersed in the organic solvent so that the adhesive of the bonding member is substantially completely removed and the film member of the bonding member is separated from the main cushion member.

32. The polishing pad regeneration method according to claim 29, characterized in that: The step of removing the bonding member comprises the following steps: immersing the main cushion member in the organic solvent so that the adhesive of the film member is partially removed so that the film member is in a state that can be easily removed from the main cushion member, or removing the adhesive of the adhesive member only from the edge portion of the main cushion member; and The film member is physically separated from the main pad member using a jig or cutting device.

33. The polishing pad regeneration method according to claim 29, characterized in that: The step of removing the bonding member further includes, after removing the bonding member by immersing the main cushion member in an organic solvent, immersing the main cushion member in an organic solvent to remove adhesive remaining on the surface of the main cushion member from which the bonding member has been removed.

34. The polishing pad regeneration method according to claim 27, characterized in that: In the step of removing the damaged portion of the main cushion member, the upper side portion is removed in a manner of removing the damaged portion of the groove and the damaged portion of the side portion is removed, or the upper side portion is removed in a manner of completely removing the groove and the damaged portion of the side portion is removed, Wherein, the damaged parts of the upper side portion and the side portion are removed sequentially or simultaneously.

35. The polishing pad regeneration method according to claim 27, characterized in that: In the step of reforming the groove, If the thickness of the main cushion component is such that a groove having a depth greater than or equal to the standard depth can be re-formed, a re-grooving operation is performed on the upper surface of the main cushion component to which the buffer cushion component from which the adhesive component has been removed is attached to form a groove having a depth greater than or equal to the standard depth in the main cushion component.

36. The polishing pad regeneration method according to claim 27, characterized in that: In the step of reforming the groove, if the thickness of the main cushion member is not a thickness capable of reforming a groove having a depth greater than or equal to the standard depth, the step includes: separating the cushion component from the main cushion component; attaching an auxiliary cushion member to the main cushion member from which the buffer cushion member has been removed to supplement the thickness of the main cushion member; Re-forming a groove having a depth greater than or equal to a standard depth by re-grooving the upper surface of the main pad member from which the damaged portion has been removed; and The cushion member is reattached to the auxiliary cushion member.

37. The polishing pad regeneration method according to claim 36, characterized in that: The main cushion component is made of polyurethane material. The auxiliary pad member is made of a polyurethane-based material having the same or similar coefficient of restitution characteristics as the pad member.

38. The polishing pad regeneration method according to claim 36, characterized in that: In the step of removing the cushion member from the main cushion member, When the cushion member is directly attached to the main cushion member, it is removed by using a jig. When the cushion member is attached to the main cushion member by the same adhesive member as the adhesive member, it includes removing by performing the same process as a process of removing the adhesive member from the cushion member.

39. The polishing pad regeneration method according to claim 36, characterized in that: The step of reattaching the cushion member to the auxiliary cushion member includes attaching the cushion member to the auxiliary cushion member by reusing a cushion member separated from the main cushion member or attaching a new cushion member to the auxiliary cushion member.

40. The polishing pad regeneration method according to claim 27, characterized in that: The polishing pad regeneration method further comprises the following steps: performing a cleaning process before and after removing the bonding member to remove foreign matter accumulated on the upper surface of the main pad member of the worn polishing pad and the groove; performing a cleaning process after removing the damaged portion of the main cushion member; A cleaning process is performed after reforming the grooves, The cleaning processes are performed sequentially or simultaneously at one time.

41. A polishing pad, characterized in that: The regeneration is carried out by using the polishing pad regeneration method according to claims 16 to 40.

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