Wafer bonding machine for grinding and polishing

Abstract

The invention relates to the technical field of wafer processing, and discloses a wafer bonding machine for grinding and polishing, the wafer bonding machine comprises a fixing mechanism, a fixing assembly is fixedly arranged in the fixing mechanism, and a closing assembly is fixedly arranged on the inner wall of the fixing mechanism. The plurality of arc-shaped plates are in a stacked state, when the arc-shaped plates rotate, the center positions of the plurality of arc-shaped plates form a circular clamping area, the area clamps and limits the side wall of a wafer at the top of the microporous ceramic vacuum chuck, and when the wafer is clamped and limited, the side wall of the wafer at the top of the microporous ceramic vacuum chuck is clamped and limited. The wafer is guaranteed to be located at the center position of the micropore ceramic vacuum suction cup through pushing of the multiple arc-shaped plates, then the micropore ceramic vacuum suction cup generates adsorption force, and under the influence of the adsorption force and side wall clamping force, it is guaranteed that the device can conduct clamping and adsorption treatment on wafers of different specifications.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing equipment, and specifically relates to a wafer bonding machine for grinding and polishing. Background Art

[0002] Among them, this equipment relates to the field of manufacturing special equipment for semiconductor devices. In the manufacture of integrated circuits, it is manufactured by other metal processing machinery such as a machine tool fieldbus control system. Since wafer semiconductor materials are rich in resources, low in manufacturing cost, and good in processability, they are important matrix materials for integrated circuits. The dimensional accuracy, geometric accuracy, surface cleanliness, and surface micro-lattice structure of wafers directly determine the quality of integrated circuit manufacturing processes.

[0003] When grinding and polishing wafers, it is necessary to limit the position through a clamping tool, and a vacuum chuck is a conventional limiting component. However, when in use, it is necessary to select the corresponding chuck specification according to the size of different wafers, which will increase the use cost of the equipment. In view of the above problems, the following solutions are proposed. Summary of the Invention

[0004] To solve the above technical problems, the present invention provides a wafer bonding machine for grinding and polishing, including a fixing mechanism. A fixing component is fixedly arranged inside the fixing mechanism, and a closing component is fixedly arranged on the inner wall of the fixing mechanism. The closing component is used to clamp and limit the position of the wafer;

[0005] An adsorption mechanism is fixedly installed on the inner wall of the fixing component and is used to adsorb the wafer to ensure that the wafer will not be displaced due to the influence of external forces during the grinding process;

[0006] A limiting mechanism is fixedly installed on the inner wall of the adsorption mechanism and is used to provide power for the adsorption of the adsorption mechanism and limit the operation of the adsorption mechanism;

[0007] Among them, before use, the wafer is first restricted to the top of the fixing mechanism through the fixing mechanism. Subsequently, the limiting mechanism applies an external negative pressure inside the adsorption mechanism, so that the adsorption mechanism adsorbs the wafer.

[0008] Preferably, a cylinder is arranged inside the fixing mechanism. A bracket is fixedly connected to the inner wall of the cylinder, and a mounting ring is fixedly connected to the top of the bracket. The fixing mechanism includes:

[0009] A fixing component is fixedly arranged on the inner wall of the cylinder, providing an installation position for the adsorption mechanism and the limiting mechanism and providing driving power;

[0010] A closing component is fixedly arranged on the inner wall of the cylinder, and the power generated by the fixing component will be transmitted to the closing component;

[0011] Among them, the power generated by the fixing component will be transmitted to the closing component, so that the closing component clamps and limits the external wafer, restricting the left - right lateral movement of the wafer.

[0012] Preferably, the adsorption mechanism includes:

[0013] An adsorption component, which is fixedly arranged inside the fixing component through an adsorbent for performing negative - pressure adsorption on the external wafer;

[0014] The adsorbent includes a fixing bracket fixedly connected to the inner wall of the mounting ring. A microporous ceramic vacuum chuck is fixedly connected to the inner wall of the fixing bracket. A transmission pipe is slidably connected to the inner wall of the through - hole of the bracket;

[0015] An exhaust component, which is fixedly arranged on the inner wall of the bracket through a transmission member to provide a path for the transmission of negative pressure;

[0016] The transmission member includes a fixing disk fixedly connected to the inner wall of the transmission pipe;

[0017] Among them, when the external negative pressure enters from the transmission pipe and acts on the inner wall of the microporous ceramic vacuum chuck, the transmission of the external negative pressure is realized.

[0018] Preferably, the limiting mechanism includes:

[0019] A limiting component, which is fixedly arranged on the inner wall of the fixing disk through a support member to limit the efficiency of negative - pressure transmission;

[0020] The support member includes four fixing rods fixedly connected to the bottom of the bracket. Limiting grooves are opened on the inner walls of the four fixing rods;

[0021] An obstruction component, which is fixedly arranged on the top of the fixing bracket through a hydraulic component and uses compressive force to limit the sliding of the transmission pipe;

[0022] The hydraulic component includes a hydraulic telescopic rod penetrating and connecting to the top of the fixing bracket. A first spring is fixedly connected to the outer wall of the hydraulic telescopic rod;

[0023] Among them, when the external negative pressure enters the inner wall of the transmission pipe, the negative pressure will pass through the inner wall of the through - hole of the fixing disk. At this time, the obstruction component will drive the limiting component to operate, and through the application of the fixing rods, the sliding of the transmission pipe is restricted.

[0024] Preferably, the fixing component includes a number of through - holes opened on the top of the mounting ring. An L - shaped frame is fixedly connected to the outer wall of the cylinder. One end of the L - shaped frame away from the cylinder is fixedly connected to a fixing ring, and a motor is fixedly connected to the top of the fixing ring;

[0025] Among them, during equipment operation, the motor transmits power to drive the closing component to operate and clamp and limit the wafer.

[0026] Preferably, the closing assembly includes a rotating column rotatably connected to the inner walls of several through holes. First-stage gears are fixedly connected to the upper and lower ends of the rotating column. A rotating ring is rotatably connected to the inner wall of the cylinder, and a toothed ring is fixedly connected to the inner wall of the rotating ring. The inner wall of the toothed ring is meshed with the side wall of the first-stage gear. An arc-shaped plate is fixedly connected to the outer wall of the rotating column, and the output shaft of the motor is fixedly connected to the outer wall of the first-stage gear. A number of second arc-shaped plates are fixedly connected to the side wall of the rotating column. Before use, the wafer is first placed on the top of the micro-porous ceramic vacuum chuck. Among them, a number of arc-shaped plates are in a stacked state. When the arc-shaped plates rotate, a circular clamping area will be formed at the central positions of the a number of arc-shaped plates, so that the arc-shaped plates change from the Figure 5 state F in Figure 4 to the state G in;

[0027] Among them, after the motor transmits power to the mounting ring, the mounting ring ensures that the remaining first-stage gears rotate in the same direction through the toothed ring. While clamping and restricting the wafer, the pushing of multiple arc-shaped plates ensures that the wafer is at the center position of the micro-porous ceramic vacuum chuck. Subsequently, the micro-porous ceramic vacuum chuck generates an adsorption force. Under the influence of the adsorption force and the side wall clamping force, it is ensured that the device can perform clamping and adsorption processing on wafers of different specifications.

[0028] Preferably, the adsorption assembly includes an input pipe connected to the bottom of the transmission pipe in a penetrating manner. The end of the transmission pipe far from the input pipe is connected to a rubber cylinder in a penetrating manner. The end of the rubber cylinder far from the transmission pipe is fixedly and hermetically connected to the bottom of the fixed bracket. When the arc-shaped plate restricts the wafer, at this time, the second arc-shaped plate at the bottom will continue to rotate synchronously. At this time, the side wall of the rotating second arc-shaped plate will contact the side wall of the rubber cylinder and compress the rubber cylinder to deform;

[0029] Among them, the external negative pressure is transmitted to the inside of the transmission pipe through the input pipe and then transmitted to the micro-porous ceramic vacuum chuck through the rubber cylinder, so that the micro-porous ceramic vacuum chuck generates an adsorption force. The deformed part of the rubber cylinder will be in the gap between the second arc-shaped plate and the micro-porous ceramic vacuum chuck. At this time, the contraction of the rubber cylinder will force the transmission pipe to slide upward along the inner wall of the bracket. The rubber cylinder will block the outer holes of the micro-porous ceramic vacuum chuck and limit the transmission path of the outer holes of the micro-porous ceramic vacuum chuck. Through the application of the above components, when the size of the wafer is smaller than that of the micro-porous ceramic vacuum chuck, the second arc-shaped plate will drive the rubber cylinder to block the redundant positions of the micro-porous ceramic vacuum chuck, avoiding the reduction of the adsorption force at the central position caused by the redundant holes and affecting the adsorption effect of the micro-porous ceramic vacuum chuck.

[0030] Preferably, the exhaust assembly includes a sliding plate slidably connected to the inner wall of the through-hole of the fixed plate. A hollow support is fixedly connected to the bottom of the sliding plate. One end of the hollow support away from the sliding plate is fixedly connected to a first limiting plate. An obstruction assembly is provided inside the device. When the input pipe transmits negative pressure, the force of the negative pressure will enter the inside of the transmission pipe and force the hollow support and the sliding plate to slide downward along the inner wall of the through-hole of the fixed plate. At this time, a gap is formed between the top of the sliding plate and the inner wall of the through-hole of the fixed plate, and the negative pressure will be transmitted to the top of the fixed plate through the above gap and act on the bottom of the microporous ceramic vacuum suction cup through the rubber cylinder;

[0031] Among them, when the negative pressure enters the inside of the transmission pipe, the force of the negative pressure will force the sliding plate and the hollow support to slide downward along the inner wall of the fixed plate.

[0032] Preferably, the limiting assembly includes an L-shaped sliding groove opened on the inner wall of the fixed plate. The inner wall of the L-shaped sliding groove is in through connection with the inner wall of the hydraulic telescopic rod. A piston plate is slidably connected to the inner wall of the L-shaped sliding groove. A limiting rod is fixedly connected to the inner wall of the piston plate. When the hollow support moves downward under negative pressure, the hollow support will drive the second limiting plate to press the hydraulic telescopic rod, so that the hydraulic oil inside the hydraulic telescopic rod enters the inside of the L-shaped sliding groove and forces the piston plate to move outward along the transverse inner wall of the L-shaped sliding groove. The outward-moving piston plate drives the limiting rod to insert into the inner wall of the limiting groove. At this time, the limiting groove restricts the upward movement of the transmission pipe through the limiting rod. Through the application of the above components, it is ensured that when negative pressure appears inside the rubber cylinder, the transmission pipe is restricted from moving, avoiding large deformation of the rubber cylinder caused by negative pressure and affecting the adsorption force of the microporous ceramic vacuum suction cup;

[0033] Among them, when the negative pressure forces the sliding plate to slide downward, the first spring is compressed, so that the internal hydraulic oil is transmitted to the inside of the L-shaped sliding groove through the L-shaped sliding groove, forcing the piston plate to slide outward along the inner wall of the L-shaped sliding groove, and inserting the limiting rod into the inner wall of the limiting groove to restrict the upward movement of the transmission pipe.

[0034] Preferably, the obstruction assembly includes a second limiting plate fixedly connected to one end of the hollow support away from the first limiting plate. A sliding rod is fixedly connected to the top of the hydraulic telescopic rod. The outer wall of the sliding rod is slidably connected to the inner wall of the through-hole of the second limiting plate. The bottom of the second limiting plate is in contact with the top of the hydraulic telescopic rod. After the grinding is completed, the input pipe will transmit high-pressure gas to the rubber cylinder. At this time, the high-pressure gas will force the sliding plate to move upward. At this time, the first spring will drive the hydraulic telescopic rod to reset. At this time, the limiting rod will move away from the fixed rod, and the hollow support will drive the second limiting plate to move upward. At this time, the high-pressure gas will be ejected outward through the gap formed between the bottom of the sliding plate and the top of the fixed plate. The ejected gas is ejected outward through the holes of the microporous ceramic vacuum suction cup. At this time, the motor generates a flip, so that the arc plate changes from the Figure 4 state of G in Figure 5 to the state of F in;

[0035] Among them, when negative pressure is generated, the sliding rod will compress the hydraulic telescopic rod to cause deformation. When high-pressure gas appears inside the transmission pipe, the high-pressure gas will push the sliding plate upward, so that the high-pressure gas is discharged upward through the gap between the bottom of the sliding plate and the inner wall of the through hole of the fixed disk. Since the arc-shaped plates are in a stacked state, during the contraction process of the arc-shaped plates, the impurities accumulated on the top of the arc-shaped plates will be scraped off and fall, and finally fall downward through the gap between the fixed brackets. When excess impurities fall on the surface of the microporous ceramic vacuum chuck, the pressure sprayed outside the microporous ceramic vacuum chuck will push the impurities to be sprayed outside and fall downward through the gap of the fixed bracket. Through the application of the above components, when the input pipe is in use, it can shield the unused area of the microporous ceramic vacuum chuck, and after grinding is completed, the impurities on the outer wall of the arc-shaped plate are removed again, reducing the probability of blockage of the holes of the microporous ceramic vacuum chuck and extending the service life of the equipment.

[0036] The present invention has the following beneficial effects:

[0037] (1) Aiming at the problem that the adsorption mold needs to be replaced due to different sizes of wafers, an adsorption mechanism and a limiting mechanism are provided inside the equipment. Before use, the wafer is first placed on the top of the microporous ceramic vacuum chuck. Among them, several arc-shaped plates are in a stacked state. When the arc-shaped plates rotate, a circular clamping area will be formed at the central positions of the several arc-shaped plates, so that the arc-shaped plates change from the Figure 5 state F in Figure 4 to the state G in

[0038] (2) Utilizing the characteristic that the above-mentioned rotating ring drives the first gear to rotate, an arc-shaped plate two and a rubber cylinder are provided inside the equipment. When the arc-shaped plate restricts the wafer, at this time, the arc-shaped plate two at the bottom will continue to rotate synchronously. At this time, the side wall of the rotating arc-shaped plate two will contact the side wall of the rubber cylinder and compress the rubber cylinder to cause deformation. The deformed part of the rubber cylinder will be in the gap between the arc-shaped plate two and the microporous ceramic vacuum chuck. At this time, the contraction of the rubber cylinder will force the transmission pipe to slide upward along the inner wall of the bracket, and the rubber cylinder will block the outer holes of the microporous ceramic vacuum chuck, restricting the transmission path of the external holes of the microporous ceramic vacuum chuck. Through the application of the above components, when the size of the wafer is smaller than that of the microporous ceramic vacuum chuck, the arc-shaped plate two will drive the rubber cylinder to block the redundant positions of the microporous ceramic vacuum chuck, avoiding the reduction of the adsorption force at the central position caused by the redundant holes and affecting the adsorption effect of the microporous ceramic vacuum chuck.

[0039] (3) The present invention utilizes the characteristic that the above-mentioned rubber cylinder deforms due to the operation of the second arc-shaped plate. A blocking component is arranged inside the device. When the input pipe transmits negative pressure, the force of the negative pressure will enter the interior of the transmission pipe and force the hollow support and the sliding plate to slide downward along the inner wall of the through-hole of the fixed disk. At this time, a gap is formed between the top of the sliding plate and the inner wall of the through-hole of the fixed disk, and the negative pressure will be transmitted to the top of the fixed disk through the above gap and act on the bottom of the microporous ceramic vacuum suction cup through the rubber cylinder. When the hollow support moves downward under negative pressure, the hollow support will drive the second limiting plate to press the hydraulic telescopic rod, so that the hydraulic oil inside the hydraulic telescopic rod enters the L-shaped sliding groove and forces the piston plate to move outward along the inner wall of the horizontal direction of the L-shaped sliding groove. The outward-moving piston plate drives the limiting rod to insert into the inner wall of the limiting groove. At this time, the limiting groove restricts the upward movement of the transmission pipe through the limiting rod. Through the application of the above components, when negative pressure appears inside the rubber cylinder, the transmission pipe is restricted and no longer moves, avoiding large deformation of the rubber cylinder caused by negative pressure and affecting the adsorption force of the microporous ceramic vacuum suction cup.

[0040] (4) After the present invention is used up, the residual impurities from grinding will accumulate on the top of the arc-shaped plate. After grinding is completed, the input pipe will transmit high-pressure gas to the rubber cylinder. At this time, the high-pressure gas will force the sliding plate to move upward. At this time, the first spring will drive the hydraulic telescopic rod to reset. At this time, the limiting rod will move away from the fixed rod, and the hollow support will drive the second limiting plate to move upward. At this time, the high-pressure gas will spray out through the gap formed between the bottom of the sliding plate and the top of the fixed disk, and the sprayed gas will spray out through the holes of the microporous ceramic vacuum suction cup. At this time, the motor generates a reverse rotation, so that the arc-shaped plate changes from the Figure 4 state G in Figure 5 to the state F in. Since the arc-shaped plates are in a stacked state, during the contraction process of the arc-shaped plates, the impurities accumulated on the top of the arc-shaped plates will be scraped off and dropped, and finally dropped downward through the gaps between the fixed brackets. When the excess impurities fall on the surface of the microporous ceramic vacuum suction cup, the external spraying pressure of the microporous ceramic vacuum suction cup will push the impurities out and drop downward through the gaps of the fixed brackets. Through the application of the above components, when the input pipe is in use, it can shield the unused area of the microporous ceramic vacuum suction cup, and after grinding is completed, it can remove the impurities on the outer wall of the arc-shaped plate again, reduce the probability of blockage of the holes of the microporous ceramic vacuum suction cup, and extend the service life of the device. Description of the Drawings

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0042] Figure 1Schematic cross-sectional view of the overall structure of the present invention;

[0043] Figure 2 Schematic diagram of the overall structure of the present invention;

[0044] Figure 3 Schematic cross-sectional view of the fixing component of the present invention;

[0045] Figure 4 Schematic cross-sectional view of the closing component of the present invention;

[0046] Figure 5 Schematic diagram of the adsorption component of the present invention;

[0047] Figure 6 Schematic diagram of the arc plate of the present invention;

[0048] Figure 7 Schematic cross-sectional view of the limiting group of the present invention;

[0049] Figure 8 Schematic cross-sectional view of the exhaust component of the present invention;

[0050] Figure 9 For the present invention Figure 8 Enlarged schematic diagram of A in

[0051] In the attached drawings, the list of components represented by each reference numeral is as follows:

[0052] In the figure: 1. Fixing mechanism; 11. Fixing component; 12. Closing component; 13. Cylinder; 111. Bracket; 112. Mounting ring; 113. Through hole; 114. Motor; 115. L-shaped frame; 116. Fixing ring; 121. Rotating column; 122. Gear 1; 123. Rotating ring; 124. Tooth ring; 125. Arc plate; 126. Second arc plate; 2. Adsorption mechanism; 21. Adsorption component; 22. Exhaust component; 211. Fixed bracket; 212. Microporous ceramic vacuum suction cup; 213. Transmission pipe; 214. Rubber cylinder; 215. Input pipe; 221. Fixed disk; 222. Sliding plate; 223. Hollow bracket; 224. First limiting plate; 3. Limiting mechanism; 31. Limiting component; 32. Obstructing component; 311. Fixed rod; 312. Limiting groove; 313. L-shaped sliding groove; 314. Piston plate; 315. Limiting rod; 321. Hydraulic telescopic rod; 322. Spring 1; 323. Second limiting plate; 324. Sliding rod. Detailed implementation manners

[0053] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0054] Embodiment 1. Please refer to Figure 1 - Figure 6 , the present invention is a wafer bonding machine for grinding and polishing, including a fixing mechanism 1. A fixing component 11 is fixedly arranged inside the fixing mechanism 1, and a closing component 12 is fixedly arranged on the inner wall of the fixing mechanism 1. The closing component 12 is used to clamp and limit the position of the wafer;

[0055] An adsorption mechanism 2 is fixedly installed on the inner wall of the fixing component 11 and is used to adsorb the wafer to ensure that the wafer will not be misaligned due to the influence of external forces during the grinding process;

[0056] A limiting mechanism 3 is fixedly installed on the inner wall of the adsorption mechanism 2 and is used to provide power for the adsorption of the adsorption mechanism 2 and limit the operation of the adsorption mechanism 2;

[0057] Among them, before use, first limit the wafer on the top of the fixing mechanism 1 through the fixing mechanism 1. Subsequently, the limiting mechanism 3 applies an external negative pressure inside the adsorption mechanism 2, so that the adsorption mechanism 2 adsorbs the wafer.

[0058] A cylinder 13 is arranged inside the fixing mechanism 1. A bracket 111 is fixedly connected to the inner wall of the cylinder 13, and a mounting ring 112 is fixedly connected to the top of the bracket 111. The fixing mechanism 1 includes:

[0059] The fixing component 11 is fixedly arranged on the inner wall of the cylinder 13, provides an installation position for the adsorption mechanism 2 and the limiting mechanism 3, and provides driving power;

[0060] The closing component 12 is fixedly arranged on the inner wall of the cylinder 13, and the power generated by the fixing component 11 will be transmitted to the closing component 12;

[0061] Among them, the power generated by the fixing component 11 will be transmitted to the closing component 12, so that the closing component 12 clamps and limits the external wafer to limit the left and right horizontal movement of the wafer.

[0062] The adsorption mechanism 2 includes:

[0063] The adsorption component 21 is fixedly arranged inside the fixing component 11 through an adsorbent and is used to perform negative pressure adsorption on the external wafer;

[0064] The suction and attachment member includes a fixed bracket 211 fixedly connected to the inner wall of the mounting ring 112. A microporous ceramic vacuum suction cup 212 is fixedly connected to the inner wall of the fixed bracket 211. A transfer tube 213 is slidably connected to the inner wall of the through hole of the bracket 111;

[0065] An exhaust assembly 22 is fixedly arranged on the inner wall of the bracket 111 through a transfer member, providing a path for the transmission of negative pressure;

[0066] The transfer member includes a fixed disk 221 fixedly connected to the inner wall of the transfer tube 213;

[0067] Among them, when external negative pressure enters from the transfer tube 213 and acts on the inner wall of the microporous ceramic vacuum suction cup 212, the transmission of external negative pressure is realized.

[0068] The limiting mechanism 3 includes:

[0069] A limiting component 31 is fixedly arranged on the inner wall of the fixed disk 221 through a support member, restricting the efficiency of negative pressure transmission;

[0070] The support member includes four fixed rods 311 fixedly connected to the bottom of the bracket 111. Limiting grooves 312 are formed in the inner walls of the four fixed rods 311;

[0071] An obstruction component 32 is fixedly arranged on the top of the fixed bracket 211 through a hydraulic member, using compressive force to restrict the sliding of the transfer tube 213;

[0072] The hydraulic member includes a hydraulic telescopic rod 321 penetrating and connected to the top of the fixed bracket 211. A first spring 322 is fixedly connected to the outer wall of the hydraulic telescopic rod 321;

[0073] Among them, when external negative pressure enters the inner wall of the transfer tube 213, the negative pressure will pass through the inner wall of the through hole of the fixed disk 221. At this time, the obstruction component 32 will drive the limiting component 31 to operate, and through the application of the fixed rods 311, the sliding of the transfer tube 213 is restricted.

[0074] Embodiment 2, please refer to Figure 7 - Figure 9 , the present invention is a wafer bonding machine for grinding and polishing. On the basis of Example 1, the fixing component 11 includes a plurality of through holes 113 formed in the top of the mounting ring 112. An L-shaped frame 115 is fixedly connected to the outer wall of the cylinder 13. One end of the L-shaped frame 115 away from the cylinder 13 is fixedly connected to a fixing ring 116. A motor 114 is fixedly connected to the top of the fixing ring 116;

[0075] Among them, during the operation of the device, the motor 114 transmits power to drive the closing component 12 to operate and clamp and restrict the wafer.

[0076] The closing assembly 12 includes a rotating column 121 rotatably connected to the inner walls of a number of through holes 113. At the upper and lower ends of the rotating column 121, a first gear 122 is fixedly connected. A rotating ring 123 is rotatably connected to the inner wall of the cylinder 13. A toothed ring 124 is fixedly connected to the inner wall of the rotating ring 123. The inner wall of the toothed ring 124 is meshed with the side wall of the first gear 122. An arc-shaped plate 125 is fixedly connected to the outer wall of the rotating column 121. The output shaft of the motor 114 is fixedly connected to the outer wall of the first gear 122. A number of second arc-shaped plates 126 are fixedly connected to the side wall of the rotating column 121. Before use, the wafer is first placed on the top of the microporous ceramic vacuum chuck 212. Among them, a number of arc-shaped plates 125 are in a stacked state. When the arc-shaped plate 125 rotates, a circular clamping area will be formed at the central position of a number of arc-shaped plates 125, so that the arc-shaped plate 125 moves from Figure 5 state F in Figure 4 to state G in

[0077] Among them, after the motor 114 transmits power to the mounting ring 112, the mounting ring 112 ensures that the remaining first gears 122 rotate in the same direction through the toothed ring 124. While clamping and restricting the wafer, the pushing of a number of arc-shaped plates 125 ensures that the wafer is at the central position of the microporous ceramic vacuum chuck 212. Subsequently, the microporous ceramic vacuum chuck 212 generates an adsorption force. Under the influence of the adsorption force and the side wall clamping force, it is ensured that the device can perform clamping and adsorption processing on wafers of different specifications.

[0078] The adsorption assembly 21 includes an input pipe 215 connected to the bottom of the transmission pipe 213 in a through manner. One end of the transmission pipe 213 away from the input pipe 215 is connected to a rubber cylinder 214 in a through manner. One end of the rubber cylinder 214 away from the transmission pipe 213 is hermetically and fixedly connected to the bottom of the fixed bracket 211. When the arc-shaped plate 125 restricts the wafer, at this time, the second arc-shaped plates 126 at the bottom will continue to rotate synchronously. At this time, the side wall of the rotating second arc-shaped plate 126 will contact the side wall of the rubber cylinder 214 and compress the rubber cylinder 214 to deform;

[0079] Among them, the external negative pressure is transmitted to the inside of the transmission pipe 213 through the input pipe 215, and is transmitted to the microporous ceramic vacuum suction cup 212 through the rubber cylinder 214, so that the microporous ceramic vacuum suction cup 212 generates an adsorption force. The deformed part of the rubber cylinder 214 will be in the gap between the second arc-shaped plate 126 and the microporous ceramic vacuum suction cup 212. At this time, the contraction of the rubber cylinder 214 will force the transmission pipe 213 to slide upward along the inner wall of the bracket 111. The rubber cylinder 214 will block the outer holes of the microporous ceramic vacuum suction cup 212 and limit the transmission path of the outer holes of the microporous ceramic vacuum suction cup 212. Through the application of the above components, when the wafer specification is smaller than the microporous ceramic vacuum suction cup 212, the second arc-shaped plate 126 will drive the rubber cylinder 214 to block the redundant positions of the microporous ceramic vacuum suction cup 212, avoiding the decrease of the adsorption force at the central position caused by the redundant holes and affecting the adsorption effect of the microporous ceramic vacuum suction cup 212.

[0080] The exhaust assembly 22 includes a sliding plate 222 slidably connected to the inner wall of the through hole of the fixed plate 221. A hollow bracket 223 is fixedly connected to the bottom of the sliding plate 222. A first limiting plate 224 is fixedly connected to one end of the hollow bracket 223 away from the sliding plate 222. An obstruction assembly 32 is provided inside the device. When the input pipe 215 transmits negative pressure, the force of the negative pressure will enter the inside of the transmission pipe 213 and force the hollow bracket 223 and the sliding plate 222 to slide downward along the inner wall of the through hole of the fixed plate 221. At this time, a gap is formed between the top of the sliding plate 222 and the inner wall of the through hole of the fixed plate 221. The negative pressure will be transmitted to the top of the fixed plate 221 through the above gap and act on the bottom of the microporous ceramic vacuum suction cup 212 through the rubber cylinder 214;

[0081] Among them, when the negative pressure enters the inside of the transmission pipe 213, the force of the negative pressure will force the sliding plate 222 and the hollow bracket 223 to slide downward along the inner wall of the fixed plate 221.

[0082] The limiting component 31 includes an L-shaped sliding groove 313 opened on the inner wall of the fixed disk 221. The inner wall of the L-shaped sliding groove 313 is connected to the inner wall of the hydraulic telescopic rod 321 in a penetrating manner. A piston plate 314 is slidably connected to the inner wall of the L-shaped sliding groove 313. A limiting rod 315 is fixedly connected to the inner wall of the piston plate 314. When the hollow bracket 223 moves downward under negative pressure, the hollow bracket 223 will drive the second limiting plate 323 to press the hydraulic telescopic rod 321, so that the hydraulic oil inside the hydraulic telescopic rod 321 enters the L-shaped sliding groove 313, and forces the piston plate 314 to move outward along the transverse inner wall of the L-shaped sliding groove 313. The outward-moving piston plate 314 drives the limiting rod 315 to insert into the inner wall of the limiting groove 312. At this time, the limiting groove 312 restricts the upward movement of the transmission pipe 213 through the limiting rod 315. Through the application of the above components, when a negative pressure appears inside the rubber cylinder 214, the transmission pipe 213 is restricted from moving, avoiding large deformation of the rubber cylinder 214 caused by the negative pressure and affecting the adsorption force of the microporous ceramic vacuum suction cup 212;

[0083] Among them, when the negative pressure forces the sliding plate 222 to slide downward, the first spring 322 is compressed, so that the internal hydraulic oil is transmitted to the inside of the L-shaped sliding groove 313 through the L-shaped sliding groove 313, forcing the piston plate 314 to slide outward along the inner wall of the L-shaped sliding groove 313, and inserting the limiting rod 315 into the inner wall of the limiting groove 312 to restrict the upward movement of the transmission pipe 213

[0084] The blocking component 32 includes a second limiting plate 323 fixedly connected to one end of the hollow bracket 223 away from the first limiting plate 224. A sliding rod 324 is fixedly connected to the top of the hydraulic telescopic rod 321. The outer wall of the sliding rod 324 is slidably connected to the inner wall of the through hole of the second limiting plate 323. The bottom of the second limiting plate 323 is in contact with the top of the hydraulic telescopic rod 321. After grinding is completed, the input pipe 215 will transmit high-pressure gas to the rubber cylinder 214. At this time, the high-pressure gas will force the sliding plate 222 to move upward. At this time, the first spring 322 will drive the hydraulic telescopic rod 321 to reset. At this time, the limiting rod 315 will move away from the fixed rod 311, and the hollow bracket 223 will drive the second limiting plate 323 to move upward. At this time, the high-pressure gas will spray out through the gap formed by the bottom of the sliding plate 222 and the top of the fixed disk 221. The sprayed gas sprays out through the holes of the microporous ceramic vacuum suction cup 212. At this time, the motor 114 generates a flip, so that the arc plate 125 moves from Figure 4 state G in Figure 5 transforms to state F in;

[0085] Among them, when negative pressure is generated, the sliding rod 324 will compress the hydraulic telescopic rod 321 to deform. When high-pressure gas appears inside the transmission pipe 213, the high-pressure gas will push the sliding plate 222 upward, so that the high-pressure gas is discharged upward through the gap between the bottom of the sliding plate 222 and the inner wall of the through hole of the fixed disk 221. Since the arc-shaped plates 125 are in a stacked state, during the contraction of the arc-shaped plates 125, the impurities accumulated on the top of the arc-shaped plates 125 will be scraped off and dropped, and finally fall downward through the gaps of the fixed brackets 211. When excess impurities fall on the surface of the microporous ceramic vacuum chuck 212, the external spraying pressure of the microporous ceramic vacuum chuck 212 will push the impurities to be externally sprayed and fall downward through the gaps of the fixed brackets 211. Through the application of the above components, when the input pipe 215 is in use, it can shield the unused area of the microporous ceramic vacuum chuck 212, and after grinding is completed, the impurities on the outer wall of the arc-shaped plate 125 are removed again, reducing the probability of blockage of the holes of the microporous ceramic vacuum chuck 212 and extending the service life of the equipment.

[0086] A specific application of this embodiment is as follows: Before use, install the cylinder 13 at the required position. First, place the wafer on the top of the microporous ceramic vacuum chuck 212. Among them, several arc-shaped plates 125 are in a stacked state. When the arc-shaped plates 125 rotate, a circular clamping area will be formed at the central positions of the several arc-shaped plates 125, so that the arc-shaped plates 125 change from the Figure 5 state F in Figure 4 to the state G in

[0087] And this area will clamp and limit the side wall of the wafer on the top of the microporous ceramic vacuum chuck 212. While clamping and restricting the wafer, the pushing of the multiple arc-shaped plates 125 will ensure that the wafer is at the central position of the microporous ceramic vacuum chuck 212. Subsequently, the microporous ceramic vacuum chuck 212 generates an adsorption force. Under the influence of the adsorption force and the side wall clamping force, it is ensured that the equipment can perform clamping and adsorption processing on wafers of different specifications.Taking advantage of the characteristic that the above-mentioned rotating ring 123 drives the first gear 122 to rotate, an arc-shaped plate two 126 and a rubber cylinder 214 are arranged inside the device. When the arc-shaped plate 125 restricts the wafer, the arc-shaped plate two 126 at the bottom will continue to rotate synchronously. At this time, the side wall of the rotating arc-shaped plate two 126 will contact the side wall of the rubber cylinder 214 and press the rubber cylinder 214 to deform. The deformed part of the rubber cylinder 214 will be in the gap between the arc-shaped plate two 126 and the microporous ceramic vacuum chuck 212. At this time, the contraction of the rubber cylinder 214 will force the transmission pipe 213 to slide upward along the inner wall of the bracket 111. The rubber cylinder 214 will block the outer holes of the microporous ceramic vacuum chuck 212 and limit the transmission path of the outer holes of the microporous ceramic vacuum chuck 212. Through the application of the above components, when the size of the wafer is smaller than that of the microporous ceramic vacuum chuck 212, the arc-shaped plate two 126 will drive the rubber cylinder 214 to block the redundant positions of the microporous ceramic vacuum chuck 212, avoiding the reduction of the adsorption force at the central position caused by the redundant holes and affecting the adsorption effect of the microporous ceramic vacuum chuck 212.

[0088] Taking advantage of the characteristic that the above-mentioned rubber cylinder 214 deforms due to the operation of the arc-shaped plate two 126, a blocking component 32 is arranged inside the device. When the input pipe 215 transmits negative pressure, the force of the negative pressure will enter the inside of the transmission pipe 213 and force the hollow bracket 223 and the sliding plate 222 to slide downward along the inner wall of the through hole of the fixed disk 221. At this time, a gap is formed between the top of the sliding plate 222 and the inner wall of the through hole of the fixed disk 221. The negative pressure will be transmitted to the top of the fixed disk 221 through the above gap and act on the bottom of the microporous ceramic vacuum chuck 212 through the rubber cylinder 214. When the hollow bracket 223 moves downward under the action of negative pressure, the hollow bracket 223 will drive the limiting plate two 323 to press the hydraulic telescopic rod 321, so that the hydraulic oil inside the hydraulic telescopic rod 321 enters the L-shaped sliding groove 313 and forces the piston plate 314 to move outward along the inner wall of the horizontal part of the L-shaped sliding groove 313. The outward-moving piston plate 314 drives the limiting rod 315 to insert into the inner wall of the limiting groove 312. At this time, the limiting groove 312 restricts the upward movement of the transmission pipe 213 through the limiting rod 315. Through the application of the above components, it is ensured that when negative pressure appears inside the rubber cylinder 214, the transmission pipe 213 is restricted and no longer moves, avoiding large deformation of the rubber cylinder 214 caused by negative pressure and affecting the adsorption force of the microporous ceramic vacuum chuck 212.

[0089] After use, the residual impurities from grinding will accumulate on the top of the arc-shaped plate 125. After grinding is completed, the input pipe 215 will transmit high-pressure gas to the rubber cylinder 214. At this time, the high-pressure gas will force the sliding plate 222 to move upward. At this time, the first spring 322 will drive the hydraulic telescopic rod 321 to reset. At this time, the limiting rod 315 will move away from the fixed rod 311, and the hollow bracket 223 will drive the second limiting plate 323 to move upward. At this time, the high-pressure gas will spray out through the gap formed by the bottom of the sliding plate 222 and the top of the fixed disk 221. The sprayed gas will spray out through the holes of the microporous ceramic vacuum suction cup 212. At this time, the motor 114 generates a flip, causing the arc-shaped plate 125 to move from Figure 4 the state of G in Figure 5 transform to the state of F in. Since the arc-shaped plates 125 are in a stacked state, during the contraction process of the arc-shaped plates 125, the impurities accumulated on the top of the arc-shaped plates 125 will be scraped off and fall, and finally fall downward through the gaps of the fixed bracket 211. When excess impurities fall on the surface of the microporous ceramic vacuum suction cup 212, the external spraying pressure of the microporous ceramic vacuum suction cup 212 will push the impurities out and fall downward through the gaps of the fixed bracket 211. Through the application of the above components, when the input pipe 215 is in use, it can shield the unused area of the microporous ceramic vacuum suction cup 212, and after grinding is completed, it can remove the impurities on the outer wall of the arc-shaped plate 125 again, reducing the probability of blockage of the holes of the microporous ceramic vacuum suction cup 212 and extending the service life of the equipment.

[0090] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and utilize the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A wafer bonding machine for grinding and polishing, characterized in that: Also includes: A fixing mechanism (1), wherein a fixing component (11) is fixedly arranged inside the fixing mechanism (1), and a closing component (12) is fixedly arranged on the inner wall of the fixing mechanism (1), and the closing component (12) is used to clamp and limit the position of a wafer; An adsorption mechanism (2), the adsorption mechanism (2) being fixedly mounted on the inner wall of the fixed component (11) and being used for adsorbing the wafer to ensure that the wafer will not be misaligned due to the influence of external forces during the grinding process; A limiting mechanism (3), wherein the limiting mechanism (3) is fixedly mounted on the inner wall of the adsorption mechanism (2) and is used to provide power for the adsorption of the adsorption mechanism (2); Before use, the wafer is first restrained on the top of the fixing mechanism (1) by the fixing mechanism (1), and then the restraining mechanism (3) applies external negative pressure to the inside of the adsorption mechanism (2), so that the adsorption mechanism (2) adsorbs the wafer.

2. A wafer bonding machine for grinding and polishing according to claim 1, characterized in that: A cylinder (13) is arranged inside the fixing mechanism (1), a bracket (111) is fixedly connected to the inner wall of the cylinder (13), and a mounting ring (112) is fixedly connected to the top of the bracket (111). The fixing mechanism (1) comprises: A fixing component (11), wherein the fixing component (11) is fixedly arranged on the inner wall of the cylinder (13), provides an installation position for the adsorption mechanism (2) and the limiting mechanism (3), and provides driving power; A closing component (12), wherein the closing component (12) is fixedly arranged on the inner wall of the cylinder (13), and the power generated by the fixing component (11) is transmitted to the closing component (12); The power generated by the fixing component (11) is transmitted to the closing component (12), so that the closing component (12) clamps and limits the external wafer.

3. A wafer bonding machine for grinding and polishing according to claim 2, characterized in that: The adsorption mechanism (2) comprises: An adsorption component (21), wherein the adsorption component (21) is fixedly arranged inside the fixed component (11) via an adsorption member and is used for negative pressure adsorption of external wafers; The adsorption component comprises a fixed bracket (211) fixedly connected to the inner wall of the mounting ring (112), a microporous ceramic vacuum suction cup (212) being fixedly connected to the inner wall of the fixed bracket (211), and a transmission tube (213) being slidably connected to the inner wall of the through hole of the bracket (111); An exhaust component (22), wherein the exhaust component (22) is fixedly arranged on the inner wall of the bracket (111) through a transmission member, and provides a path for the transmission of negative pressure; The transmission member comprises a fixed plate (221) fixedly connected to the inner wall of the transmission pipe (213); The external negative pressure enters from the transmission tube (213) and acts on the inner wall of the microporous ceramic vacuum suction cup (212), thereby realizing the transmission of the external negative pressure.

4. A wafer bonding machine for grinding and polishing according to claim 3, characterized in that: The limiting mechanism (3) comprises: A limit assembly (31), wherein the limit assembly (31) is fixedly arranged on the inner wall of the fixed disk (221) through a support member to limit the efficiency of negative pressure transmission; The support member comprises four fixing rods (311) fixedly connected to the bottom of the bracket (111), and limiting grooves (312) are provided on the inner walls of the four fixing rods (311); An obstruction component (32), wherein the obstruction component (32) is fixedly arranged on the top of the fixed bracket (211) by means of a hydraulic component, and utilizes a compressive force to restrict the sliding of the transmission pipe (213); The hydraulic component comprises a hydraulic telescopic rod (321) which is connected to the top of the fixed bracket (211), and a spring 1 (322) is fixedly connected to the outer wall of the hydraulic telescopic rod (321); When the external negative pressure enters the inner wall of the transmission tube (213), the negative pressure will pass through the inner wall of the through hole of the fixed plate (221). At this time, the blocking component (32) will drive the limiting component (31) to operate, and through the application of the fixing rod (311), the sliding of the transmission tube (213) is limited.

5. The wafer bonding machine for grinding and polishing according to claim 4, characterized in that: The fixing assembly (11) comprises a plurality of through holes (113) formed on the top of the mounting ring (112); an L-shaped frame (115) is fixedly connected to the outer wall of the cylinder (13); an end of the L-shaped frame (115) away from the cylinder (13) is fixedly connected to a fixing ring (116); and a motor (114) is fixedly connected to the top of the fixing ring (116); When the device is in use, the motor (114) transmits power to drive the closing component (12) to operate and clamp the wafer.

6. The wafer bonding machine for grinding and polishing according to claim 5, characterized in that: The closing component (12) comprises a rotating column (121) rotatably connected to the inner walls of a plurality of through holes (113); the upper and lower ends of the rotating column (121) are fixedly connected to a gear one (122); a rotating ring (123) is rotatably connected to the inner wall of the cylinder (13); a gear ring (124) is fixedly connected to the inner wall of the rotating ring (123); the inner wall of the gear ring (124) is meshedly connected to the side wall of the gear one (122); an arc plate (125) is fixedly connected to the outer wall of the rotating column (121); the output shaft of the motor (114) is fixedly connected to the outer wall of the gear one (122); and a plurality of arc plates two (126) are fixedly connected to the side wall of the rotating column (121); After the motor (114) transmits power to the mounting ring (112), the mounting ring (112) ensures that the remaining gears (122) rotate in the same direction through the gear ring (124).

7. A wafer bonding machine for grinding and polishing according to claim 6, characterized in that: The adsorption assembly (21) comprises an input pipe (215) connected to the bottom of the transmission pipe (213); one end of the transmission pipe (213) away from the input pipe (215) is connected to a rubber tube (214); and one end of the rubber tube (214) away from the transmission pipe (213) is sealed and fixedly connected to the bottom of the fixed bracket (211); The external negative pressure is transmitted to the inside of the transmission tube (213) through the input tube (215), and is transmitted to the microporous ceramic vacuum suction cup (212) through the rubber tube (214), so that the microporous ceramic vacuum suction cup (212) generates adsorption force.

8. The wafer bonding machine for grinding and polishing according to claim 7, characterized in that: The exhaust assembly (22) comprises a sliding plate (222) slidably connected to the inner wall of the through hole of the fixed plate (221); a hollow bracket (223) is fixedly connected to the bottom of the sliding plate (222); and one end of the hollow bracket (223) away from the sliding plate (222) is fixedly connected to a limiting plate (224); When negative pressure enters the interior of the transmission tube (213), the force of the negative pressure will force the sliding plate (222) and the hollow bracket (223) to slide downward along the inner wall of the fixed plate (221).

9. The wafer bonding machine for grinding and polishing according to claim 8, characterized in that: The limiting assembly (31) comprises an L-shaped slide groove (313) provided on the inner wall of the fixed plate (221); the inner wall of the L-shaped slide groove (313) is connected to the inner wall of the hydraulic telescopic rod (321); a piston plate (314) is slidably connected to the inner wall of the L-shaped slide groove (313); and a limiting rod (315) is fixedly connected to the inner wall of the piston plate (314); When the negative pressure forces the sliding plate (222) to slide downward, the spring 1 (322) is compressed, so that the internal hydraulic oil is transmitted to the inside of the L-shaped slide groove (313) through the L-shaped slide groove (313), forcing the piston plate (314) to slide outward along the inner wall of the L-shaped slide groove (313).

10. The wafer bonding machine for grinding and polishing according to claim 9, characterized in that: The obstruction assembly (32) comprises a second limiting plate (323) fixedly connected to an end of the hollow bracket (223) away from the first limiting plate (224); the top of the hydraulic telescopic rod (321) is fixedly connected with a sliding rod (324); the outer wall of the sliding rod (324) is slidably connected to the inner wall of the through hole of the second limiting plate (323); the bottom of the second limiting plate (323) is arranged in contact with the top of the hydraulic telescopic rod (321); When negative pressure is generated, the sliding rod (324) will compress the hydraulic telescopic rod (321) to cause deformation, and when high-pressure gas appears inside the transmission tube (213), the high-pressure gas will push the sliding plate (222) upward, so that the high-pressure gas is discharged upward through the gap between the bottom of the sliding plate (222) and the inner wall of the through hole of the fixed plate (221).

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