Optical module

Abstract

The invention discloses an optical module. The optical module comprises a light source assembly and an optical amplification assembly, the optical amplification assembly is optically connected with the light source assembly, and the optical amplification assembly is used for performing optical amplification on an optical signal output by the light source assembly, so that the optical module has relatively high output power. Moreover, the main circuit board, the light source assembly and the light amplification assembly are arranged in a stacked manner, that is, through reasonable arrangement of the light source assembly and the light amplification assembly, the size of the optical module can meet the requirement of an MSA protocol, and the added light amplification assembly can be contained, so that the optical module has high output power.

Description

Technical Field

[0001] This application relates to the technical field of optical communication devices, and particularly to an optical module. Background Art

[0002] An optical module is an optical communication device that performs optical-electric and electric-optical conversions. In recent years, the global market scale of cloud computing data centers has been continuously expanding, and the construction of 5G telecommunication networks has been fully launched. The market demand for high-speed optical modules is also increasing day by day. Products of various series and types have been successively launched to provide the best optical module solutions for customers in fields such as cloud computing data centers and non-relay transmission.

[0003] Currently, due to the limitations of silicon photonics technology, the output power of coherent optical modules is relatively low. In view of this, coherent optical modules can improve the output power by integrating an optical amplifier. However, protocols such as MSA (multi-source agreement) have strict requirements on the size of coherent optical modules, and it is currently difficult for coherent optical modules to integrate an optical amplifier while meeting the requirements of relevant protocols. Summary of the Invention

[0004] This application provides an optical module that increases an optical amplification component inside the optical module to improve the power of the optical signal output by the optical module under the condition of meeting the size requirements of the protocol.

[0005] This application provides an optical module, including: a housing with an accommodation cavity inside; a main circuit board accommodated in the accommodation cavity; a light source component accommodated in the accommodation cavity and electrically connected to the main circuit board; and an optical amplification component accommodated in the accommodation cavity and electrically connected to the main circuit board, and the optical amplification component is optically connected to the light source component, and the optical amplification component is used to amplify the optical signal output by the light source component; wherein, the main circuit board, the light source component, and the optical amplification component are arranged in a stacked manner.

[0006] In an embodiment of this application, the optical amplification component includes a pump source device, a wavelength division multiplexer, an amplification optical fiber, and an isolator; one end of the amplification optical fiber is connected to the wavelength division multiplexer, and the other end is connected to the isolator; the wavelength division multiplexer is used to couple the optical signal output by the light source component and the pump light output by the pump source device into the amplification optical fiber; wherein, the pump source device and the amplification optical fiber are arranged on one side of the main circuit board, and the wavelength division multiplexer and the isolator are arranged on the other side of the main circuit board.

[0007] In an embodiment of this application, the main circuit board is disposed opposite to the light source component, the pump source device and the amplification optical fiber are arranged on the side of the main circuit board facing away from the light source component, and the wavelength division multiplexer and the isolator are arranged between the main circuit board and the light source component.

[0008] In an embodiment of the present application, the optical amplification component further includes: an optical variable attenuator optically connected to the isolator; and an optical monitoring detector optically connected to the optical variable attenuator; wherein the optical variable attenuator, the optical monitoring detector, the wavelength division multiplexer, and the isolator are located on the same side of the main circuit board and arranged side by side.

[0009] In an embodiment of the present application, the optical module has a first direction, a second direction, and a third direction that are perpendicular to each other in pairs. The light source component and the optical amplification component are stacked on top of each other in the first direction. The length of the optical module in the second direction is less than the length of the optical module in the third direction; wherein the wavelength division multiplexer and the isolator are located on one side of the optical variable attenuator in the second direction, and the wavelength division multiplexer is closer to the optical variable attenuator than the isolator, and the optical monitoring detector is located on the other side of the optical variable attenuator in the second direction.

[0010] In an embodiment of the present application, the optical amplification component further includes: a connecting optical fiber optically connected to the pump source device, the wavelength division multiplexer, the isolator, the optical variable attenuator, and the optical monitoring detector, and the connecting optical fiber and the wavelength division multiplexer, the isolator, the optical variable attenuator, and the optical monitoring detector are located on the same side of the main circuit board; wherein the connecting optical fiber includes a first fiber coiling portion, a second fiber coiling portion, a third fiber coiling portion, and a fourth fiber coiling portion connected in sequence; the first fiber coiling portion and the third fiber coiling portion are respectively located on both sides of the optical variable attenuator in the second direction, and the first fiber coiling portion is close to the isolator, and the third fiber coiling portion is close to the optical monitoring detector; the second fiber coiling portion and the fourth fiber coiling portion are respectively located on both sides of the optical variable attenuator in the third direction.

[0011] In an embodiment of the present application, the amplification optical fiber is wound around the outer periphery of the pump source device.

[0012] In an embodiment of the present application, the optical module has a first direction, a second direction, and a third direction that are perpendicular to each other in pairs. The light source component and the optical amplification component are stacked on top of each other in the first direction. The length of the optical module in the second direction is less than the length of the optical module in the third direction; wherein the pump source device is inclined with respect to both the second direction and the third direction.

[0013] In an embodiment of the present application, opposite ends of the housing respectively have an optical interface and an electrical interface. The optical interface is used for optically connecting to an optical fiber outside the optical module, and one end of the main circuit board is electrically connected to a device outside the optical module through the electrical interface; wherein both the light source component and the optical amplification component are arranged close to the optical interface.

[0014] In an embodiment of the present application, the optical module has a first direction, a second direction, and a third direction that are perpendicular to each other in pairs. The light source component and the optical amplification component are stacked on top of each other in the first direction, and the length of the optical module in the second direction is less than the length of the optical module in the third direction. Wherein, the housing is divided into a first housing part and a second housing part along the third direction. An electrical interface is provided at the end of the second housing part for mating with the interface of an external device, and an optical interface is provided at the end of the first housing part. A radiator is provided outside the first housing part on the outer side of the first cover. The accommodation cavity is divided into a first sub-cavity and a second sub-cavity that communicate with each other along the third direction. The first sub-cavity is located in the first housing part, and the second sub-cavity is located in the second housing part. The maximum length of the first sub-cavity in the first direction is greater than the maximum length of the second sub-cavity in the first direction. The light source component and the optical amplification component are accommodated in the first sub-cavity, and the light source component is close to the side of the first cover, which is beneficial for the light source component to dissipate heat from the first cover and its radiator.

[0015] In an embodiment of the present application, a groove is formed on the inner wall of the first housing part in the first direction, and the groove is recessed in the first direction away from the first sub-cavity.

[0016] In an embodiment of the present application, the optical module has a first direction, a second direction, and a third direction that are perpendicular to each other in pairs. The light source component and the optical amplification component are stacked on top of each other in the first direction, and the length of the optical module in the second direction is less than the length of the optical module in the third direction. Wherein, the length of the housing in the third direction is 96.5 mm to 106.5 mm.

[0017] In an embodiment of the present application, the optical module further includes: a pull ring, which includes a force application part and at least two sliding arms. The force application part is connected to the housing through each sliding arm, and the force application part and the housing are spaced apart from each other in the third direction. The outside drives the pull ring to move by applying a force to the force application part to release the lock between the optical module and the external optical cage. Wherein, the length of the force application part in the third direction is 3 mm to 6 mm.

[0018] Correspondingly, the present application further provides an optical module, including: a housing with an accommodation cavity inside; a main circuit board accommodated in the accommodation cavity; a light source component accommodated in the accommodation cavity and electrically connected to the main circuit board; and an optical amplification component accommodated in the accommodation cavity and electrically connected to the main circuit board, and the optical amplification component is optically connected to the light source component. The optical amplification component is used to amplify the optical signal output by the light source component. Wherein, the optical amplification component includes a pump source device, a wavelength division multiplexer, an isolator, and an amplification optical fiber. One end of the amplification optical fiber is connected to the wavelength division multiplexer, and the other end is connected to the isolator. The wavelength division multiplexer is used to couple the optical signal output by the light source component and the pump light output by the pump source device into the amplification optical fiber. The pump source device, the wavelength division multiplexer, the isolator, and the amplification optical fiber are respectively arranged on opposite sides of the main circuit board.

[0019] The beneficial effects of this application are as follows: Different from the prior art, this application provides an optical module. The optical module includes a light source component and an optical amplification component. The optical amplification component is optically connected to the light source component and is used to optically amplify the optical signal output by the light source component, so that the optical module has a relatively high output power. Moreover, the main circuit board, the light source component, and the optical amplification component of this application are stacked, that is, by reasonably arranging the light source component and the optical amplification component, the size of the optical module can not only meet the requirements of the MSA protocol but also accommodate the added optical amplification component, so as to achieve a high output power of the optical module. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of this application. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0021] Figure 1 is a schematic side view structure diagram of a prior art coherent optical module;

[0022] Figure 2 is a schematic structure diagram of an embodiment of the optical module of this application;

[0023] Figure 3 is Figure 2 a schematic cross-sectional structure diagram of the optical module shown;

[0024] Figure 4 is Figure 2 a schematic diagram of a first embodiment of the partial structure of the optical module shown;

[0025] Figure 5 is Figure 2 a schematic diagram of a second embodiment of the partial structure of the optical module shown;

[0026] Figure 6 is a schematic diagram of an embodiment of the optical amplification component of this application.

[0027] Description of the Reference Numerals:

[0028] 10 Optical module; 11 Housing; 111 Accommodating cavity; 1111 First sub-cavity; 1112 Second sub-cavity; 112 First housing part; 113 Second housing part; 114 First cover; 115 Second cover; 116 Optical interface; 117 Electrical interface; 118 Groove; 12 Main circuit board; 13 Pull ring; 131 Force application part; 132 Slide arm; 14 Heat sink; 15 Silicon photonics chip; 20 Light source assembly; 30 Optical amplification assembly; 31 Pump source device; 33 Wavelength division multiplexer; 34 Isolator; 35 Tunable optical attenuator; 36 Optical monitoring detector; 37 Connecting optical fiber; 371 First fiber coiling part; 372 Second fiber coiling part; 373 Third fiber coiling part; 374 Fourth fiber coiling part; 38 Amplifying optical fiber. Detailed implementation manners

[0029] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of the present application. In addition, it should be understood that the specific implementation manners described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the orientation words such as "upper", "lower", "left", and "right" generally refer to the upper, lower, left, and right in the actual use or working state of the device, specifically the drawing direction in the accompanying drawings.

[0030] In the present application, unless otherwise clearly defined and limited, the terms "connected", "connected to", "stacked", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0031] The present application provides an optical module, which will be described in detail below. It should be noted that the description order of the following embodiments does not limit the preferred order of the embodiments of the present application. And in the following embodiments, each embodiment has its own emphasis. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0032] The coherent optical module in QSFP-DD (Quad Small Form Factor Pluggable-Double Density) package adopts a silicon photonics modulation scheme, and its output power is limited by silicon photonics technology. For the 100G transmission scenario, the output power of traditional coherent optical modules can only reach about -6.5dBm. For the 400G transmission scenario, the output power of traditional coherent optical modules can only reach about -9dBm. Moreover, in order to ensure the output power of -6.5dBm to -9dBm, traditional coherent optical modules have sacrificed certain OSNR (Optical Signal Noise Ratio) performance. The above factors limit the application of traditional coherent optical modules in the point-to-point transmission scenario without repeaters.

[0033] The coherent optical module can improve the output power by integrating an EDFA (Erbium Doped Fiber Amplifier), so that the output power of the coherent optical module can reach +5dBm. In the IP over DWDM transmission scenario and the point-to-point transmission scenario, the coherent optical module integrated with EDFA can optimize the network structure and reduce the deployment cost. Moreover, the coherent optical module integrated with EDFA can also be compatible with the emerging ROADM (Reconfigurable Optical Add-Drop Multiplexer) line system and play an important role in the metro / regional ROADM network.

[0034] However, the length and width dimensions of the traditional EDFA package are 35mm * 20mm. The length and width dimensions of the QSFP-DD coherent optical module specified by the MSA protocol are 127.86mm * 18.35mm. It can be seen that the width of the EDFA is greater than the width of the coherent optical module, which results in that the EDFA cannot be packaged in the QSFP-DD coherent optical module or smaller models of coherent optical modules. Moreover, the four dimensions (i.e., A1, A2, A3, and A4) of the coherent optical module as well as the total length of the optical module including the pull ring need to meet the requirements of the MSA protocol. Therefore, how to package the EDFA in the coherent optical module and ensure that the size of the coherent optical module meets the requirements of the MSA protocol is an urgent problem to be solved. Figure 1 The four dimensions (i.e., A1, A2, A3, and A4) of the coherent optical module as well as the total length of the optical module including the pull ring need to meet the requirements of the MSA protocol. Therefore, how to package the EDFA in the coherent optical module and ensure that the size of the coherent optical module meets the requirements of the MSA protocol is an urgent problem to be solved.

[0035] In view of this, the embodiments of the present application provide an optical module, which not only has a high output power, but also the size of the optical module in the embodiments of the present application can meet the protocol requirements. The following will be elaborated in detail.

[0036] Please refer to Figure 2 and Figure 3 ,Figure 2 FIG. Figure 2 is a schematic structural diagram of an embodiment of an optical module according to the present application. Figure 3 is Figure 2 a schematic cross-sectional structure diagram of the optical module shown in FIG. Figure 3 .

[0037] In one embodiment, the optical module 10 includes a housing 11. The housing 11 serves as a basic carrier of the optical module 10 and is used to encapsulate and protect the remaining components of the optical module 10. Specifically, an accommodation cavity 111 is provided inside the housing 11, and the accommodation cavity 111 is used to accommodate the remaining components of the optical module 10. The housing 11 further includes a first cover 114 and a second cover 115. The optical module 10 has a first direction (as indicated by the arrow Z in FIG. Figure 3 , the same below), a second direction (as indicated by the arrow X in FIG. Figure 2 , the same below), and a third direction (as indicated by the arrows Y in FIGS. Figure 2 and Figure 3 , the same below), which are perpendicular to each other in pairs. The first cover 114 and the second cover 115 are covered with each other along the first direction to form the accommodation cavity 111, that is, the accommodation cavity 111 is located between the first cover 114 and the second cover 115. The length of the optical module 10 in the second direction is less than the length of the optical module 10 in the third direction. The first direction is the height direction of the optical module 10, the second direction is the width direction of the optical module 10, and the third direction is the length direction of the optical module 10.

[0038] The optical module 10 further includes a light source assembly 20, a main circuit board 12, and an optical amplification assembly 30. The light source assembly 20, the main circuit board 12, and the optical amplification assembly 30 are all accommodated in the accommodation cavity 111. The optical amplification assembly 30 is optically connected to the light source assembly 20, and both the light source assembly 20 and the optical amplification assembly 30 are electrically connected to the main circuit board 12. The optical amplification assembly 30 is used to optically amplify the optical signal output by the light source assembly 20, so that the optical module 10 of this embodiment has a relatively high output power.

[0039] Please refer to FIGS. Figure 4 and Figure 5 together. Figure 4 and Figure 5 , Figure 4 which is Figure 2 a schematic diagram of a first embodiment of the partial structure of the optical module shown in FIG. Figure 4 . Figure 5 is Figure 2 a schematic diagram of a second embodiment of the partial structure of the optical module shown in FIG. Figure 5 . Among them, Figure 4 the first cover 114 and the light source assembly 20 of the optical module 10 are omitted, and Figure 4 FIG. Figure 2 shows Figure 2 a top view of the optical module 10 shown in FIG. Figure 4 . Figure 5 The second cover 115 of the optical module 10 is omitted, and Figure 5 FIG. Figure 2 shows Figure 2 a bottom view of the optical module 10 shown in FIG. Figure 5 . The optical amplification assembly 30 of the embodiments of the present application will be described below.​​​​​​​​

[0040] In one embodiment, the main circuit board 12 integrates a signal circuit and a power supply circuit. The main circuit board 12 connects the electronic components in the optical module 10 according to the circuit design through circuit traces to achieve electrical functions such as power supply, electrical signal transmission, and grounding. The two opposite ends of the housing 11 in the third direction respectively have an optical interface 116 and an electrical interface 117. The optical interface 116 is used for optical connection with an optical fiber outside the optical module 10. One end of the main circuit board 12 is electrically connected to a device outside the optical module 10 through the electrical interface 117. One end of the main circuit board 12 is designed with a gold finger, which is used to connect to an electrical connector of an optical cage on a customer device through the electrical interface 117. The main circuit board 12 also integrates an electrical chip (not shown in the figure) for controlling and / or processing electrical signals, such as a DSP (Digital Signal Processor), etc.

[0041] In one embodiment of the present application, the components of the optical amplification component 30 are connected by optical fibers, and the packaging shell of the optical amplification component 30 is omitted. The components of the optical amplification component 30 are directly arranged in the accommodation cavity 111 of the housing 11 of the optical module 10. In this embodiment, the main circuit board 12, the light source component 20, and the components of the optical amplification component 30 are stacked and arranged inside the housing 11. In this way, in this embodiment, by reasonably arranging the light source component 20 and the optical amplification component 30, the stacked structure formed by the light source component 20 and the optical amplification component 30 is relatively compact, which can improve the utilization rate of the internal space of the optical module 10, so that the size of the optical module 10 can not only meet the requirements of the MSA protocol but also accommodate the added optical amplification component 30 to achieve a high output power of the optical module 10.

[0042] Specifically, in one embodiment, the optical amplification component 30 includes a pump source device 31, a wavelength division multiplexer 33, an isolator 34, and an amplification optical fiber 38. The amplification optical fiber 38 is preferably an erbium-doped optical fiber, forming an erbium-doped fiber amplifier (EDFA). The wavelength division multiplexer 33 is optically connected to the light source component 20 and the pump source device 31 respectively. The isolator 34 is optically connected to the wavelength division multiplexer 33 through the amplification optical fiber 38. One end of the amplification optical fiber 38 is connected to the wavelength division multiplexer 33, and the other end is connected to the isolator 34. One end of the wavelength division multiplexer 33 is connected to the amplification optical fiber 38, and the other end is optically connected to the light source component 20 and the pump source device 31 respectively. The wavelength division multiplexer 33 is used to couple the optical signal output by the light source component 20 and the pump light output by the pump source device 31 into the amplification optical fiber 38. The wavelength division multiplexer 33 may specifically be an IWDM (isolated wavelength division multiplexer 33), etc.

[0043] In one embodiment, please refer to Figure 6 , Figure 6The system block diagram of the optical amplification component 30 according to the embodiment of the present application is shown. In this embodiment, the optical amplification component 30 further includes an adjustable optical attenuator 35 and an optical monitoring detector 36. The adjustable optical attenuator 35 is optically connected to the isolator 34, and the optical monitoring detector 36 is optically connected to the adjustable optical attenuator 35. A modulator is integrated on the main circuit board 12. The light source component 20 is optically connected to the wavelength division multiplexer 33 through the modulator. The optical signal output by the light source component 20 is modulated by the modulator and then input into the wavelength division multiplexer 33. The wavelength division multiplexer 33 combines the optical signal output by the light source component 20 and the pump light output by the pump source device 31 into one path and inputs it into the amplification optical fiber 38. The pump light output by the pump source device 31 excites the amplification optical fiber 38 to amplify the optical signal output by the light source component 20, and then outputs it through the isolator 34, the adjustable optical attenuator 35, and the optical monitoring detector 36 in sequence, so that the optical module 10 has a relatively high output power. The output power of the optical module 10 according to the embodiment of the present application can reach +5 dBm.

[0044] In the embodiment of the present application, the optical amplification component 30 does not adopt an independent packaging shell, but arranges its respective devices at different positions on the main circuit board 12. Specifically, in this embodiment, the pump source device 31, the wavelength division multiplexer 33, the isolator 34, and the amplification optical fiber 38 are respectively arranged on opposite sides of the main circuit board 12. Specifically, the pump source device 31 and the amplification optical fiber 38 are arranged on one side of the main circuit board 12, and the wavelength division multiplexer 33 and the isolator 34 are arranged on the other side of the main circuit board 12. The pump source device 31 and the amplification optical fiber 38 are located on one side of the main circuit board 12 in the first direction, and the wavelength division multiplexer 33 and the isolator 34 are located on the other side of the main circuit board 12 in the first direction. In this way, the optical amplification component 30 in this embodiment saves the packaging shell compared with the traditional EDFA, and by reasonably arranging each functional device of the optical amplification component 30, the optical amplification component 30 is integrated into the optical module 10. It can not only use the optical amplification component 30 to increase the output power of the optical module 10, but also ensure that the size of the optical module 10 meets the protocol requirements. And, in this embodiment, considering that the volume of the pump source device 31 is larger than the other devices of the optical amplification component 30, the pump source device 31 is arranged on both sides of the main circuit board 12 with the wavelength division multiplexer 33 and the isolator 34 respectively, so as to improve the utilization rate of the internal space of the optical module 10 and further ensure that the size of the optical module 10 meets the protocol requirements.

[0045] Further, the main circuit board 12 is disposed opposite to the light source component 20. The pump source device 31 and the amplification optical fiber 38 are stacked on the side of the main circuit board 12 facing away from the light source component 20, and the wavelength division multiplexer 33 and the isolator 34 are stacked between the main circuit board 12 and the light source component 20. The main circuit board 12, the light source component 20, and the optical amplification component 30 form a four-layer stacked structure.

[0046] In one embodiment, a radiator 14 is provided outside the housing 11 for dissipating heat from the optical module 10. In this embodiment, the housing 11 is divided into a first housing portion 112 and a second housing portion 113 along a third direction. The first housing portion 112 and the second housing portion 113 are connected to each other. The above-mentioned radiator 14 is provided outside the first cover 114 of the first housing portion 112. The accommodation cavity 111 is divided into a first sub-cavity 1111 and a second sub-cavity 1112 along the third direction. The first sub-cavity 1111 and the second sub-cavity 1112 communicate with each other. The first sub-cavity 1111 is located in the first housing portion 112, and the second sub-cavity 1112 is located in the second housing portion 113. In this embodiment, considering that the first housing portion 112 has a relatively large space and is provided with the radiator 14, the maximum length H1 of the first sub-cavity 1111 in the first direction can be set to be greater than the maximum length H2 of the second sub-cavity 1112 in the first direction, so that the first sub-cavity 1111 in the first housing portion 112 has sufficient space to accommodate the light source assembly 20 and the optical amplification assembly 30. Therefore, the light source assembly 20 and the optical amplification assembly 30 are accommodated in the first sub-cavity 1111, which is conducive to the simultaneous layout of the light source assembly 20 and the optical amplification assembly 30 in the optical module 10. In addition, in this embodiment, the light source assembly 20 and the optical amplification assembly 30 are arranged in the first housing portion 112, so that the light source assembly 20 and the optical amplification assembly 30 are close to the radiator 14, especially the light source assembly 20 is close to the side of the first cover 114, which is conducive to the light source assembly 20 dissipating heat from the first cover 114 and the radiator 14 thereon, thereby being beneficial to improving the heat dissipation effect of the light source assembly 20 and the optical amplification assembly 30.

[0047] Further, a groove 118 is formed on the inner wall of the first housing portion 112 in the first direction. The groove 118 is recessed in the first direction away from the first sub-cavity 1111, so that the maximum length H1 of the first sub-cavity 1111 in the first direction is greater than the maximum length H2 of the second sub-cavity 1112 in the first direction. Figure 3 Exemplarily, grooves 118 are formed on the lower surface of the first cover 114 in the first direction and the upper surface of the second cover 115 in the first direction.

[0048] It should be noted that the second housing portion 113 is used to cooperate with the interface of an external device. The length (i.e., thickness) of the second housing portion 113 in the first direction is limited by a standard. Since the first housing portion 112 does not need to be inserted into the interface of the external device, the length of the first housing portion 112 in the first direction can be greater than the length of the second housing portion 113 in the first direction, so that a groove 118 can be formed on the inner wall of the first housing portion 112 in the first direction.

[0049] In one embodiment, the heat sink 14 includes a plurality of heat dissipation columns distributed in an array to increase the heat dissipation area of the optical module 10 through the plurality of heat dissipation columns, thereby improving the heat dissipation efficiency of the optical module 10. Of course, in other embodiments of the present application, the heat sink 14 may further include heat dissipation structures such as heat dissipation fins, which are not limited herein.

[0050] In this embodiment, considering the relatively large volume of the pump source device 31 and the sufficient space on the side of the main circuit board 12 facing away from the heat sink 14, the pump source device 31 and the amplification optical fiber 38 are arranged on the side of the main circuit board 12 facing away from the heat sink 14. In addition, it is also convenient for the pump source device 31 to be thermally connected to the second cover 115 for heat dissipation through the second cover 115. The wavelength division multiplexer 33 and the isolator 34 are located on the side of the main circuit board 12 facing the heat sink 14 and are arranged between the main circuit board 12 and the light source assembly 20. In this way, the various devices of the optical amplification assembly 30 are reasonably arranged to improve the utilization rate of the internal space of the optical module 10 and further ensure that the size of the optical module 10 meets the protocol requirements.

[0051] In one embodiment, both the light source assembly 20 and the optical amplification assembly 30 are arranged close to the optical interface 116. In this way, in this embodiment, by reasonably designing the arrangement positions of the light source assembly 20 and the optical amplification assembly 30 in the third direction, the utilization rate of the internal space of the optical module 10 can be improved, and further the size of the optical module 10 can be ensured to meet the protocol requirements.

[0052] In one embodiment, as Figure 4 shown, the wavelength division multiplexer 33 and the isolator 34 are located on one side of the variable optical attenuator 35 in the second direction, and the wavelength division multiplexer 33 is relatively closer to the variable optical attenuator 35 than the isolator 34. The optical monitoring detector 36 is located on the other side of the variable optical attenuator 35 in the second direction. The positions of the variable optical attenuator 35 and the optical monitoring detector 36 on the main circuit board 12 are relatively fixed. The variable optical attenuator 35 is located in the middle region of the main circuit board 12 in the second direction, and the optical monitoring detector 36 is located at one side edge of the main circuit board 12 in the second direction. The wavelength division multiplexer 33 and the isolator 34 are located on the side of the variable optical attenuator 35 away from the optical monitoring detector 36. And, since the volume of the wavelength division multiplexer 33 is larger than that of the isolator 34, the isolator 34 is arranged at the edge position of the main circuit board 12 in the second direction, and the wavelength division multiplexer 33 is arranged between the isolator 34 and the variable optical attenuator 35, so that the isolator 34 can avoid the connection optical fiber 37 described below. There is not enough space between the variable optical attenuator 35 and the optical monitoring detector 36 to arrange the wavelength division multiplexer 33. In this way, in this embodiment, the various functional devices of the optical amplification assembly 30 are reasonably arranged to improve the utilization rate of the internal space of the optical module 10 and further ensure that the size of the optical module 10 meets the protocol requirements.

[0053] Furthermore, the optical amplification component 30 further includes a connecting optical fiber 37, which is optically connected to the pump source device 31, the wavelength division multiplexer 33, the isolator 34, the variable optical attenuator 35, and the optical monitoring detector 36. A silicon photonics chip 15 is also integrated on the main circuit board 12. The light source component 20 is optically connected to the silicon photonics chip 15 through the connecting optical fiber 37, and the silicon photonics chip 15 is also optically connected to the wavelength division multiplexer 33 through the connecting optical fiber 37. The isolator 34 and the variable optical attenuator 35, and the variable optical attenuator 35 and the optical monitoring detector 36 are optically connected through the connecting optical fiber 37.

[0054] The connecting optical fiber 37, the wavelength division multiplexer 33, the isolator 34, the variable optical attenuator 35, and the optical monitoring detector 36 are located on the same side of the main circuit board 12. The length of the connecting optical fiber 37 is relatively long, so the connecting optical fiber 37 is wound around the circumference of the housing 11 in a coil. Therefore, the connecting optical fiber 37 includes a first coiling portion 371, a second coiling portion 372, a third coiling portion 373, and a fourth coiling portion 374 connected in sequence. The first coiling portion 371 and the third coiling portion 373 are respectively located on both sides of the variable optical attenuator 35 in the second direction, and the first coiling portion 371 is close to the isolator 34, and the third coiling portion 373 is close to the optical monitoring detector 36. The second coiling portion 372 and the fourth coiling portion 374 are respectively located on both sides of the variable optical attenuator 35 in the third direction. In this embodiment, since the volume of the isolator 34 and the volume of the optical monitoring detector 36 are small, the isolator 34 and the optical monitoring detector 36 are arranged at the edge position of the main circuit board 12 in the second direction to avoid the first coiling portion 371 and the third coiling portion 373 of the connecting optical fiber 37, which is beneficial to reducing the size of the optical amplification component 30 in the first direction, and further improving the utilization rate of the internal space of the optical module 10 to ensure that the size of the optical module 10 meets the protocol requirements.

[0055] In one embodiment, as Figure 5 shown, the pump source device 31 is inclined with respect to both the second direction and the third direction. In this way, in this embodiment, on the basis of ensuring that the pump source device 31 does not significantly affect the size of the optical module 10 in the second direction, the space occupied by the pump source device 31 in the third direction is reduced as much as possible, so that the area of the main circuit board 12 where the pump source device 31 is not provided in the third direction is sufficient for arranging other electronic devices, thus improving the utilization rate of the internal space of the optical module 10 to ensure that the size of the optical module 10 meets the protocol requirements. Further, the amplification optical fiber 38 is wound around the outer periphery of the pump source device 31.

[0056] It should be noted that the optical amplification component 30 in the embodiments of the present application can be an EDFA (Erbium Doped Fiber Amplifier), etc., where the amplification optical fiber 38 is an erbium-doped optical fiber. The working principle of the above optical amplification component 30 belongs to the understanding scope of those skilled in the art and will not be elaborated here.

[0057] In the embodiments of the present application, the light source component 20 includes a light output device 21 and a light source circuit board 22. The light output device 21 is electrically connected to the light source circuit board 22. The light source circuit board 22 is integrated with a logic control circuit. The light source circuit board 22 is used to control the light output device 21 to output an optical signal. The light source circuit board 22 can be electrically connected to the main circuit board 12 through a flexible circuit board or a pluggable electrical connector, etc. The light output device 21 includes an airtight package box, and there is a package cavity inside the airtight package box. The light output device 21 further includes a tunable laser module, and the tunable laser module is encapsulated in the package cavity. The tunable laser module is used to generate an optical signal with a tunable wavelength. In this embodiment, the tunable laser module uses a semiconductor gain chip in cooperation with a tunable external cavity to generate a wavelength-tunable laser with a narrow line width. The light output device 21 further includes an output head, and the output head is used to output the optical signal generated by the tunable laser module.

[0058] The optical monitoring detector 36 of the above optical amplification component 30 has a small size and can be placed between the light output device 21 and the main circuit board 12. The wavelength division multiplexer 33, the isolator 34, and the variable optical attenuator 35 have relatively large sizes and can be placed between the light source circuit board 22 and the main circuit board 12, while the pump source device 31 and the amplification optical fiber 38 are arranged on the other side of the main circuit board 12, so that the stacked structure of the light source component 20, the main circuit board 12, and the optical amplification component 30 can be made more compact.

[0059] Please continue to refer to Figure 2 . In one embodiment, in order to arrange the light source component 20 and the optical amplification component 30 inside the optical module 10, while ensuring that the overall length of the optical module 10 remains unchanged and meeting the requirements of the protocol standard for specific dimensions, the length of the housing 11 of the optical module 10 with the radiator 14 is lengthened. Therefore, the length L1 of the housing 11 in the third direction in this embodiment is 96.5 mm to 106.5 mm, such as 96.5 mm, 96.12 mm, 97.35 mm, 98.16 mm, 99.68 mm, 101.66 mm, 102.41 mm, 103.72 mm, 104.69 mm, 106.5 mm, etc. In this way, there is enough space in the accommodation cavity 111 inside the housing 11, so that the length of the main circuit board 12 in the third direction can also be appropriately lengthened to arrange the light source component 20 and the optical amplification component 30, ensuring that the optical module 10 has a high output power.

[0060] In one embodiment, the optical module 10 further includes a pull ring 13, and the pull ring 13 is connected to the housing 11. The pull ring 13 is used to release the lock between the optical module 10 and the optical cage. Specifically, when the optical module 10 is plugged into the optical cage, the outside pulls the pull ring 13, so that the pull ring 13 releases the lock between the optical module 10 and the optical cage, and then allows the optical module 10 to be pulled out from the optical cage. Specifically, the pull ring 13 includes a force application portion 131 and at least two sliding arms 132. The force application portion 131 is connected to the housing 11 through each sliding arm 132. The outside drives the pull ring 13 to move by applying a force to the force application portion 131 to release the lock between the optical module 10 and the optical cage. The force application portion 131 and the housing 11 are spaced apart from each other in the third direction, and the user applies a force to the force application portion 131 through the gap between the force application portion 131 and the housing 11.

[0061] Considering that the length of the housing 11 of the optical module 10 is lengthened, in order to ensure that the overall length of the optical module 10 and the length L2 of the gap between the force application portion 131 on the pull ring 13 and the housing 11 meet the requirements, in this embodiment, the length L3 of the force application portion 131 in the third direction is reduced. Specifically, the length L3 of the force application portion 131 in the third direction is 3 mm to 6 mm, such as 3 mm, 3.5 mm, 4 mm, 4.5 mm, 5 mm, 5.5 mm, 6 mm, etc. In this way, there is a sufficiently large gap between the force application portion 131 and the housing 11, which can facilitate the pluggable connection between the external optical fiber and the optical interface 116 of the optical module 10. At the same time, the length L3 of the force application portion 131 in the third direction in this embodiment is not too small, which can ensure that the force application portion 131 has sufficient structural strength and sufficient space for marking.

[0062] The above provides a detailed introduction to the optical module provided in this application. Specific examples are used in this article to elaborate on the principle and implementation manner of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application; at the same time, for those of ordinary skill in the art, according to the idea of this application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to this application.

Claims

1. An optical module, It is characterized in that include: A shell body having a containing cavity inside; A main circuit board is accommodated in the accommodation cavity; A light source assembly is accommodated in the accommodation cavity and electrically connected to the main circuit board; as well as An optical amplifier component is accommodated in the accommodating cavity and electrically connected to the main circuit board, and the optical amplifier component is optically connected to the light source component, and the optical amplifier component is used to amplify the optical signal output by the light source component; Wherein, the main circuit board, the light source assembly and the optical amplification assembly are stacked.

2. The optical module according to claim 1, It is characterized in that The optical amplification component includes a pump source device, a wavelength division multiplexer, an amplifying optical fiber and an isolator; One end of the amplifying optical fiber is connected to the wavelength division multiplexer, and the other end is connected to the isolator; The wavelength division multiplexer is used to couple the optical signal output by the light source assembly and the pump light output by the pump source device into the amplifying optical fiber; The pump source device and the amplifying optical fiber are arranged on one side of the main circuit board, and the wavelength division multiplexer and the isolator are arranged on the other side of the main circuit board.

3. The optical module according to claim 2, It is characterized in that The main circuit board is arranged opposite to the light source assembly, the pump source device and the amplifying optical fiber are arranged on a side of the main circuit board away from the light source assembly, and the wavelength division multiplexer and the isolator are arranged between the main circuit board and the light source assembly.

4. The optical module according to claim 2 or 3, It is characterized in that The optical amplification component also includes: an adjustable optical attenuator optically connected to the isolator; and an optical monitoring detector, optically connected to the adjustable optical attenuator; The adjustable optical attenuator, the optical monitoring detector, the wavelength division multiplexer and the isolator are located on the same side of the main circuit board and arranged side by side.

5. The optical module according to claim 4, It is characterized in that The optical module has a first direction, a second direction and a third direction which are perpendicular to each other in pairs, the light source assembly and the optical amplifier assembly are stacked on each other in the first direction, and the length of the optical module in the second direction is less than the length of the optical module in the third direction; The wavelength division multiplexer and the isolator are located on one side of the adjustable optical attenuator in the second direction, and the wavelength division multiplexer is closer to the adjustable optical attenuator relative to the isolator, and the optical monitoring detector is located on the other side of the adjustable optical attenuator in the second direction.

6. The optical module according to claim 5, It is characterized in that The optical amplification component also includes: A connecting optical fiber is optically connected to the pump source device, the wavelength division multiplexer, the isolator, the adjustable optical attenuator, and the optical monitoring detector, and the connecting optical fiber, the wavelength division multiplexer, the isolator, the adjustable optical attenuator, and the optical monitoring detector are located on the same side of the main circuit board; Wherein, the connecting optical fiber includes a first fiber coiling portion, a second fiber coiling portion, a third fiber coiling portion, and a fourth fiber coiling portion that are sequentially connected; the first fiber coiling portion and the third fiber coiling portion are respectively located on both sides of the variable optical attenuator in the second direction, and the first fiber coiling portion is close to the isolator, and the third fiber coiling portion is close to the optical monitoring detector; the second fiber coiling portion and the fourth fiber coiling portion are respectively located on both sides of the variable optical attenuator in the third direction.

7. The optical module according to claim 2 or 3, characterized in that, the amplifying optical fiber is disposed around the pump source device.

8. The optical module according to claim 2 or 3, characterized in that, the optical module has a first direction, a second direction, and a third direction that are perpendicular to each other in pairs. The light source component and the optical amplification component are stacked on top of each other in the first direction. The length of the optical module in the second direction is less than the length of the optical module in the third direction; wherein, the pump source device is inclined with respect to both the second direction and the third direction.

9. The optical module according to claim 1, characterized in that, opposite ends of the housing respectively have an optical interface and an electrical interface. The optical interface is used for optical connection with an optical fiber outside the optical module. One end of the main circuit board is electrically connected to a device outside the optical module through the electrical interface; wherein, both the light source component and the optical amplification component are disposed close to the optical interface.

10. The optical module according to claim 1, characterized in that, the optical module has a first direction, a second direction, and a third direction that are perpendicular to each other in pairs. The light source component and the optical amplification component are stacked on top of each other in the first direction. The length of the optical module in the second direction is less than the length of the optical module in the third direction; wherein, the housing is divided into a first housing portion and a second housing portion along the third direction. The accommodation cavity is divided into a first sub-cavity and a second sub-cavity that are communicated with each other along the third direction. The first sub-cavity is located in the first housing portion, and the second sub-cavity is located in the second housing portion; the maximum length of the first sub-cavity in the first direction is greater than the maximum length of the second sub-cavity in the first direction. The second housing portion is used to cooperate with an interface of an external device. The first housing portion is provided with a radiator, and the light source component and the optical amplification component are accommodated in the first sub-cavity.

11. The optical module according to claim 10, characterized in that, a groove is formed on the inner wall of the first housing portion in the first direction, and the groove is recessed in the first direction away from the first sub-cavity.

12. The optical module according to claim 1, characterized in that, the optical module has a first direction, a second direction, and a third direction that are perpendicular to each other in pairs. The light source component and the optical amplification component are stacked on top of each other in the first direction. The length of the optical module in the second direction is less than the length of the optical module in the third direction; wherein, the length of the housing in the third direction is 96.5 mm to 106.5 mm.

13. The optical module according to claim 12, wherein, the optical module further comprises: a pull ring, including a force application part and at least two sliding arms, the force application part is connected to the housing through each of the sliding arms, and the force application part and the housing are spaced apart from each other in the third direction, and the outside drives the pull ring to move by applying a force to the force application part to release the locking between the optical module and the external optical cage; wherein, the length of the force application part in the third direction is 3 mm to 6 mm.

14. An optical module, wherein, it comprises: a housing, having an accommodation cavity inside; a main circuit board, accommodated in the accommodation cavity; a light source assembly, accommodated in the accommodation cavity and electrically connected to the main circuit board; and an optical amplification assembly, accommodated in the accommodation cavity and electrically connected to the main circuit board, and the optical amplification assembly is optically connected to the light source assembly, and the optical amplification assembly is used for amplifying the optical signal output by the light source assembly; wherein, the optical amplification assembly includes a pump source device, a wavelength division multiplexer, an isolator and an amplification optical fiber, one end of the amplification optical fiber is connected to the wavelength division multiplexer, and the other end is connected to the isolator, and the wavelength division multiplexer is used for coupling the optical signal output by the light source assembly and the pump light output by the pump source device into the amplification optical fiber; the pump source device, the wavelength division multiplexer, the isolator and the amplification optical fiber are respectively arranged on opposite sides of the main circuit board.

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