Mounting device and method for controlling mounting device

Abstract

The invention provides a mounting device and a control method of the mounting device, which can quickly correct the position deviation in a turret-type mounting head. The mounting apparatus includes: a plurality of suction nozzles that hold an electronic component mounted on a substrate; a mounting head having a turret for supporting the plurality of suction nozzles at the peripheral edge; a nozzle drive device that moves each of the plurality of nozzles in a direction parallel to the drive shaft with respect to the turret and rotates the turret about the rotation shaft; an imaging device which is supported by the mounting head and captures an image of the electronic component held by the suction nozzle from a direction parallel to a drive shaft of the suction nozzle; the control device calculates and stores the offset amount of the position of the electronic component recognized from the shot image shot by the shooting device from the initial position, and when the change amount of the offset amount obtained last in the plurality of suction nozzles with the calculated offset amount relative to the past offset amount exceeds a threshold value and the positive and negative of the offset direction are the same, the offset amount obtained last in the plurality of suction nozzles with the calculated offset amount exceeds the threshold value. And a correction process for determining that correction of the origin in the rotation direction of the rotation shaft is necessary.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a mounting device and a control method for the mounting device. Background Art

[0002] In the technical field of mounting devices, a turret-type mounting head in which a plurality of suction nozzles are arranged circumferentially is known (for example, refer to Patent Document 1). Such a mounting head is configured such that a plurality of suction nozzles arranged around a turret base whose rotation axis is inclined from the vertical direction rotate as the turret base rotates, and the drive shaft of only the lowermost suction nozzle faces the vertical direction. The turret base rotates, for example, by gear drive. Prior Art Documents Patent Documents

[0003] Patent Document 1: Japanese Patent Laid-Open Publication No. 2022-091054 Summary of the Invention Problems to be Solved by the Invention

[0004] However, in a turret-type mounting head, since the origin of the rotation direction of the rotation axis sometimes suddenly undergoes gear shift during production or after maintenance, the offset amount is periodically measured using a jig suction nozzle, and angle correction is performed. Conventionally, correction has been performed at a predetermined interval. However, in the case where a gear shift occurs immediately after correction, production continues with the position of the drive shaft of the suction nozzle offset until the next correction cycle, and there is a possibility of defective quality due to the mounting position of the components being offset.

[0005] An object of the technology disclosed in this specification is to quickly perform correction when a position shift occurs in a turret-type mounting head. Means for Solving the Problems

[0006] This specification discloses a mounting device. The mounting device includes: a plurality of suction nozzles that hold electronic components to be mounted on a substrate; a mounting head having a turret that supports the plurality of suction nozzles with a peripheral portion; a suction nozzle drive device that moves the plurality of suction nozzles relative to the turret in a direction parallel to a drive shaft and rotates the turret about a rotation axis; an imaging device that is supported by the mounting head and images the electronic components held by the suction nozzles from a direction parallel to the drive shaft of the suction nozzle; and a control device that calculates and stores an offset amount by which the position of the electronic components recognized from the captured image captured by the imaging device is offset from an initial position, and in the plurality of suction nozzles for which the offset amount has been calculated, when the change amount of the last obtained offset amount with respect to the past offset amount exceeds a threshold and the positive and negative of the offset direction are the same, it is determined that a correction process for correcting the origin of the rotation direction of the rotation axis is required. Advantages of the Invention

[0007] According to the technology disclosed in this specification, when a position shift occurs in a turret-type mounting head, correction can be performed rapidly. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a side view schematically showing the mounting device of the embodiment. Figure 2 It is a top view schematically showing the mounting device of the embodiment. Figure 3 It is a side view showing the mounting head of the embodiment. Figure 4 It is a diagram for explaining the operation of the mounting head of the embodiment. Figure 5 It is a schematic diagram showing the auxiliary jig nozzle of the embodiment. Figure 6 It is a diagram showing an example of a captured image using a photographing device. Figure 7 It is a diagram showing an example of a captured image using a photographing device. Figure 8 It is a functional block diagram showing the control device of the embodiment. Figure 9 It is a diagram showing a normal distribution curve corresponding to a histogram of the offset amount of the embodiment. Figure 10 It is a diagram showing a normal distribution curve corresponding to a histogram of the offset amount of the embodiment. Figure 11 It is a flowchart showing the mounting process of the embodiment. Figure 12 It is a flowchart showing the recognition process of the embodiment. Figure 13 It is a flowchart showing the judgment process of the embodiment. Figure 14 It is a flowchart showing the correction process of the embodiment. Figure 15 It is a block diagram showing the computer system of the embodiment. DETAILED DESCRIPTION OF THE EMBODIMENT

[0009] Hereinafter, embodiments will be described with reference to the drawings. In the embodiments, an XgYgZg orthogonal coordinate system is defined, and the positional relationships of the respective parts are described with reference to this XgYgZg orthogonal coordinate system. The direction parallel to the Xg axis of the specified plane is defined as the Xg-axis direction. The direction parallel to the Yg axis of the specified plane orthogonal to the Xg axis is defined as the Yg-axis direction. The direction parallel to the Zg axis orthogonal to the specified plane is defined as the Zg-axis direction. The rotation direction or tilt direction centered on the Xg-axis direction is defined as the θXg direction. The rotation direction or tilt direction centered on the Yg-axis direction is defined as the θYg direction. The rotation direction or tilt direction centered on the Zg-axis direction is defined as the θZg direction. In the embodiments, the specified plane is parallel to the horizontal plane. The Zg axis is parallel to the vertical axis, and the Zg-axis direction is the up-down direction. The +Zg side is the upper side, and the -Zg side is the lower side. In addition, the specified plane may be inclined with respect to the horizontal plane. Further, in the embodiments, the specified plane including the Xg axis and the Yg axis is appropriately referred to as the XgYg plane.

[0010] [Mounting device] Figure 1 is a side view schematically showing the mounting device 1 of the embodiment. Figure 2 is a top view schematically showing the mounting device 1 of the embodiment. The mounting device 1 is a device for mounting an electronic component C on a substrate P. As Figure 1 and Figure 2 shown, the mounting device 1 includes a base member 2, a substrate conveying device 3, a component supply device 4, a nozzle storage portion 51 for storing a suction nozzle 5 and an auxiliary jig nozzle J, a component storage portion 52 for storing the electronic component C, a mounting head 6 having the suction nozzle 5, a head moving device 7, a nozzle moving device 8, and a control device 9. In addition, the mounting device 1 further includes an operation device (not shown) for an operator to operate, a display device (not shown) for displaying various information, a warning device for generating an alarm using light and sound, etc.

[0011] The base member 2 supports the substrate conveying device 3, the component supply device 4, the nozzle storage portion 51, the component storage portion 52, the mounting head 6, the head moving device 7, and the nozzle moving device 8, respectively.

[0012] The substrate transfer device 3 transfers the substrate P to the mounting area DM. The mounting area DM is defined on the transfer path of the substrate transfer device 3. In the embodiment, the substrate transfer device 3 transfers the substrate P in the Xg-axis direction. The substrate P before mounting the electronic component C is fed into the substrate transfer device 3 from the -Xg side end of the base member 2. The substrate transfer device 3 transfers the fed substrate P in the +Xg direction and stops the substrate P in the mounting area DM. The mounting head 6 mounts the electronic component C on the surface of the substrate P disposed in the mounting area DM. The substrate transfer device 3 transfers the substrate P after mounting the electronic component C in the +Xg direction. The substrate P after mounting the electronic component C is sent out from the +Xg side end of the base member 2.

[0013] The component supply device 4 supplies the electronic component C to the supply area SM. The component supply device 4 includes a plurality of tape feeders. The supply area SM of the electronic component C is defined by the tape feeder. The tape feeder conveys a carrier tape holding a plurality of electronic components C. By conveying the carrier tape, at least one of the plurality of electronic components C is supplied to the supply area SM. In the embodiment, the component supply device 4 is disposed on both the +Yg side and the -Yg side of the substrate transfer device 3. In addition, the component supply device 4 may be disposed on either the +Yg side or the -Yg side of the substrate transfer device 3.

[0014] The nozzle 5 releasably holds the electronic component C. The nozzle 5 is a suction nozzle that adsorbs and holds the electronic component C. An opening is provided at the front end of the nozzle 5. The opening of the nozzle 5 is connected to the vacuum system. In a state where the front end of the nozzle 5 is in contact with the electronic component C, a suction operation is performed from the opening provided at the front end of the nozzle 5, thereby adsorbing the electronic component C to the front end held by the nozzle 5. By releasing the suction operation from the opening, the electronic component C is released from the nozzle 5. In addition, the nozzle 5 may be a gripping nozzle that grips and holds the electronic component C.

[0015] The nozzle storage unit 51 stores the nozzle 5 and the auxiliary jig nozzle J in order to detach and attach the nozzle 5 and the auxiliary jig nozzle J to and from the mounting head 6 by automatic control. The nozzle storage unit 51 is disposed within the movable area of the mounting head 6. The mounting head 6 changes the mounted nozzle 5 or auxiliary jig nozzle J in the nozzle storage unit 51. When the mounting device 1 changes the nozzle 5 mounted on the mounting head 6, when changing from the nozzle 5 to the auxiliary jig nozzle J, or when changing from the auxiliary jig nozzle J to the nozzle 5, the mounting head 6 is moved to a specified position in the nozzle storage unit 51, the mounted nozzle 5 or auxiliary jig nozzle J is released, and a new nozzle 5 or auxiliary jig nozzle J is mounted. In addition, the nozzle storage unit 51 may separately provide a storage unit for storing the nozzle 5 and a storage unit for storing the auxiliary jig nozzle J.

[0016] The component storage unit 52 is a box that stores the electronic components C held by the suction nozzles 5 of the mounting head 6 and not yet mounted on the substrate P. That is, in the mounting apparatus 1, it serves as a waste bin for discarding the electronic components C that have not been mounted on the substrate P. The nozzle storage unit 51 is disposed within the movable range of the mounting head 6. When there are electronic components C held by the mounting head 6 that have not been mounted on the substrate P, the mounting apparatus 1 moves the mounting head 6 to a position opposite to the component storage unit 52 and releases the held electronic components C, thereby dropping the electronic components C into the component storage unit 52.

[0017] The mounting head 6 holds the electronic components C supplied from the component supply device 4 with the suction nozzles 5 and mounts them on the substrate P. The mounting head 6 is provided with a plurality of suction nozzles 5. The mounting head 6 is driven by supplying air pressure to the mounted suction nozzles 5, and thus can hold the electronic components C to be held under appropriate conditions (suction or gripping).

[0018] The mounting head 6 can move between the supply area SM for supplying the electronic components C and the mounting area DM where the substrate P is disposed. The supply area SM and the mounting area DM are defined at different positions in the XgYg plane. The mounting head 6 can move in each of the Xg-axis direction, Yg-axis direction, and Zg-axis direction between the supply area SM and the mounting area DM by the head moving device 7. The mounting head 6 holds the electronic components C supplied in the supply area SM with the suction nozzles 5, and after moving to the mounting area DM, mounts the electronic components C on the substrate P disposed in the mounting area DM.

[0019] The head moving device 7 can move the mounting head 6 in each of the Xg-axis direction, Yg-axis direction, and Zg-axis direction. The head moving device 7 includes an Xg-axis moving device 71 that moves the mounting head 6 in the Xg-axis direction, a Yg-axis moving device 72 that moves the mounting head 6 in the Yg-axis direction, and a Zg-axis moving device 73 that moves the mounting head 6 in the Zg-axis direction.

[0020] The Zg-axis moving device 73 is connected to the mounting head 6. By driving the Zg-axis moving device 73, the mounting head 6 moves in the Zg-axis direction. The Xg-axis moving device 71 is connected to the mounting head 6 through the Zg-axis moving device 73. By driving the Xg-axis moving device 71, the Zg-axis moving device 73 moves in the Xg-axis direction, thereby moving the mounting head 6 in the Xg-axis direction. The Yg-axis moving device 72 is connected to the mounting head 6 through the Xg-axis moving device 71 and the Zg-axis moving device 73. By driving the Yg-axis moving device 72, the Xg-axis moving device 71 moves in the Yg-axis direction, thereby moving the mounting head 6 in the Yg-axis direction.

[0021] In an embodiment, the Yg-axis moving device 72 includes a pair of Yg-axis moving devices 72, which are supported by column portions 21 respectively arranged at four corners of the base member 2. The Yg-axis moving device 72 includes, for example: a Yg-axis guiding member extending in the Yg-axis direction; a Yg-axis sliding member guided by the Yg-axis guiding member to slide in the Yg-axis direction; and a Yg-axis actuator generating power for moving the Yg-axis sliding member in the Yg-axis direction. The Yg-axis guiding member is supported by two column portions 21 arranged in the Yg-axis direction. The Yg-axis sliding member supports the Xg-axis moving device 71.

[0022] The Xg-axis moving device 71 includes: an Xg-axis guiding member supported by the Yg-axis sliding member of the Yg-axis moving device 72 and extending in the Xg-axis direction; an Xg-axis sliding member guided by the Xg-axis guiding member to slide in the Xg-axis direction; and an Xg-axis actuator generating power for moving the Xg-axis sliding member in the Xg-axis direction. The Xg-axis sliding member supports the Zg-axis moving device 73.

[0023] The Zg-axis moving device 73 includes: a Zg-axis guiding member supported by the Xg-axis sliding member of the Xg-axis moving device 71 and extending in the Zg-axis direction; a Zg-axis sliding member guided by the Zg-axis guiding member to slide in the Zg-axis direction; and a Zg-axis actuator generating power for moving the Zg-axis sliding member in the Zg-axis direction. The Zg-axis sliding member supports the mounting head 6.

[0024] [Mounting head] Figure 3 is a side view showing the mounting head 6 of the embodiment. The mounting head 6 is of a turret type. As Figure 3 shown, the mounting head 6 includes a housing 61, a rotor shaft 62, and a turret 63. In addition, a photographing device 64 and a mirror 65 are arranged on the mounting head 6.

[0025] The housing 61 is connected to the Zg-axis moving device 73. The housing 61 supports the rotor shaft 62, the photographing device 64, and the mirror 65.

[0026] The rotor shaft 62 is supported by at least a part of the housing 61. The rotor shaft 62 has the axis as the rotation axis AX and is rotatably supported by the housing 61 with the rotation axis AX as the center. The rotation axis AX is inclined with respect to the Zg-axis. One end side of the rotor shaft 62 is supported by the housing 61, and the other end side supports the turret 63.

[0027] The turret 63 is supported by the housing 61 via the rotor shaft 62. The turret 63 supports a plurality of suction nozzles 5. The turret 63 rotates with the rotation axis AX as the center. The plurality of suction nozzles 5 are arranged at intervals on the peripheral portion of the turret 63. By rotating the turret 63 with the rotation axis AX as the center, the plurality of suction nozzles 5 move in the Zg-axis direction (vertical direction) while rotating around the rotation axis AX.

[0028] The nozzle 5 can move in the axial direction parallel to the specified drive shaft relative to the turret 63. In addition, the nozzle 5 can move in the rotational direction centered on the drive shaft. In the embodiment, the drive shaft of the nozzle 5 is appropriately referred to as the Zc axis, the direction parallel to the Zc axis is appropriately referred to as the Zc axis direction, and the rotational direction centered on the Zc axis is appropriately referred to as the θZc direction. In addition, the rotational direction centered on the rotation axis AX is appropriately referred to as the rotational direction of the rotation axis AX.

[0029] When the nozzle 5 is arranged at the first position LP in the circumferential direction of the rotation axis AX, it is arranged at the lowermost position on the rotation path. When the nozzle 5 is arranged at the second position TP in the circumferential direction of the rotation axis AX, it is arranged at the uppermost position on the rotation path. The first position LP and the second position TP are opposed to each other in the radial direction of the rotation axis AX. The drive shaft of the nozzle 5 arranged at the first position LP is parallel to the Zg axis. The drive shaft of the nozzle 5 arranged at the second position TP is inclined with respect to the Zg axis.

[0030] The photographing device 64 photographs the electronic component C held by the nozzle 5 located at the second position TP from the Zc axis direction. The photographing device 64 is supported by the housing 61. A reflecting mirror 65 is arranged between the optical path of the photographing device 64 and the nozzle 5. The photographing device 64 photographs the electronic component C held by the nozzle 5 from the Zc axis direction via the reflecting mirror 65.

[0031] The reflecting mirror 65 is supported by the housing 61. The reflecting mirror 65 is arranged below the photographing device 64. The optical axis of the optical system of the photographing device 64 is parallel to the reflection axis of the Zc axis reflected by the reflecting mirror 65. In addition, the photographing device 64 may photograph the electronic component C held by the nozzle 5 from the Zc axis direction without passing through the reflecting mirror 65.

[0032] The nozzle moving device 8 can move the nozzle 5 in each of the rotational direction of the rotation axis AX, the Zc axis direction, and the θZc direction. The nozzle moving device 8 has: a rotation device 81 that moves the nozzle 5 in the rotational direction of the rotation axis AX; a Zc axis moving device 82 that moves the nozzle 5 in the Zc axis direction; and a θZc moving device 83 that moves the nozzle 5 in the θZc direction.

[0033] The rotation device 81 includes an actuator that generates power to rotate the turret 63 around the rotation axis AX. The rotation device 81 is connected to the rotor shaft 62. The rotation device 81 rotates the turret 63 by rotating the rotor shaft 62. The turret 63 rotates inside the housing 61. If the turret 63 rotates around the rotation axis AX, the plurality of nozzles 5 rotate around the rotation axis AX.

[0034] The Zc-axis moving device 82 is provided for each of the plurality of suction nozzles 5. The Zc-axis moving device 82 includes an actuator that generates power to move the suction nozzle 5 in the Zc-axis direction. At least a part of the Zc-axis moving device 82 is disposed on the turret 63. The plurality of suction nozzles 5 can move in the Zc-axis direction respectively.

[0035] The θZc moving device 83 includes an actuator that generates power to move the suction nozzle 5 in the θZc direction. At least a part of the θZc moving device 83 is disposed on the turret 63. In the embodiment, the plurality of suction nozzles 5 move synchronously in the θZc direction.

[0036] The suction nozzle 5 can move in each of the Xg-axis direction, Yg-axis direction, Zg-axis direction, the rotational direction of the rotation axis AX, Zc-axis direction, and θZc direction through the head moving device 7 and the suction nozzle moving device 8. In the embodiment, the suction nozzles 5 are equally arranged around the rotation axis AX.

[0037] [Operation of the mounting head] Figure 4 This is a diagram for explaining the operation of the mounting head 6 of the embodiment. In Figure 4 the example shown, the mounting head 6 has 16 suction nozzles 5.

[0038] When the suction nozzle 5 is disposed at the first position LP, it holds the electronic component C supplied from the component supply device 4 to the supply area SM. The drive shaft of the suction nozzle 5 disposed at the first position LP is parallel to the Zg-axis. The suction nozzle 5 can hold the electronic component C disposed in the supply area SM by moving in the Zc-axis direction.

[0039] After holding the electronic component C at the first position LP, the suction nozzle 5 rotates around the rotation axis AX by the rotation of the turret 63 and revolves around the rotation axis AX to reach the second position TP. When the suction nozzle 5 is disposed at the second position TP, the imaging device 64 images the electronic component C held by the suction nozzle 5. The imaging device 64 images the electronic component C before being supplied from the supply area SM and mounted on the substrate P.

[0040] After the electronic component C held at the second position TP is imaged, the suction nozzle 5 rotates around the rotation axis AX by the rotation of the turret 63 and revolves around the rotation axis AX to return to the first position LP. When the suction nozzle 5 is disposed at the first position LP, it mounts the electronic component C on the substrate P disposed in the mounting area DP. The drive shaft of the suction nozzle 5 disposed at the first position LP is parallel to the Zg-axis. The suction nozzle 5 can mount the electronic component C on the substrate P by moving in the Zc-axis direction.

[0041] [Auxiliary jig suction nozzle] Figure 5It is a schematic diagram showing the auxiliary jig nozzle J of the embodiment. The auxiliary jig nozzle J is a jig for detecting the position of the drive shaft (Zc axis) of the nozzle 5 and measuring the origin position of the rotation direction of the rotation axis AX of the turret 63.

[0042] As Figure 5 shown, the auxiliary jig nozzle J is installed on the mounting head 6 instead of the nozzle 5. When the mounting device 1 performs the measurement using the auxiliary jig nozzle J, it moves the mounting head 6 to the nozzle storage part 51, releases the nozzle 5 located at the first position LP from the mounting head 6, and installs the auxiliary jig nozzle J instead at the mounting position of the nozzle 5. The axis of the auxiliary jig nozzle J installed on the mounting head 6 coincides with the Zc axis.

[0043] The auxiliary jig nozzle J has a reflecting surface JF orthogonal to the Zc axis at the lower end. The reflecting surface JF can be detected based on the captured image captured by the imaging device 64. The auxiliary jig nozzle J is installed on the mounting head 6 and is configured to the Figure 4 shown second position TP by the rotation of the turret 63 around the rotation axis AX. The auxiliary jig nozzle J located at the second position TP is captured by the imaging device 64.

[0044] Figure 6 And Figure 7 is a diagram showing an example of the captured image using the imaging device 64. As Figure 6 And Figure 7 shown, at least the reflecting surface JF of the auxiliary jig nozzle J is captured in the captured image.

[0045] As Figure 6 shown, when the center of the auxiliary jig nozzle J is located at the specified reference point (the center in the embodiment) of the captured image, it indicates that the drive shaft (Zc axis) of the nozzle 5 has not shifted and the origin position of the rotation direction of the rotation axis AX of the turret 63 has not shifted. As Figure 7 shown, when the center of the auxiliary jig nozzle J deviates from the specified origin of the captured image, it indicates that the drive shaft (Zc axis) of the nozzle 5 has shifted and the origin position of the rotation direction of the rotation axis AX of the turret 63 has shifted. In addition, based on the direction and magnitude of the deviation of the center of the auxiliary jig nozzle J, the direction and magnitude of the deviation of the origin position of the rotation direction of the rotation axis AX of the turret 63 can be calculated.

[0046] [Control device] Figure 8 It is a functional block diagram showing the control device 9 of the embodiment. The control device 9 includes a computer system. The control device 9 can be directly provided in the mounting device 1 or can exist separately through a network. In the embodiment, the so-called control of the mounting head 6 includes controlling the head moving device 7. The so-called control of the nozzle 5 includes controlling the nozzle moving device 8.

[0047] The control device 9 includes a nozzle control unit 91, a mounting control unit 92, a photographing control unit 93, a component recognition unit 94, a jig center recognition unit 95, an offset calculation unit 96, an offset determination unit 97, a correction amount calculation unit 98, and a storage unit 99.

[0048] The nozzle control unit 91 controls the nozzle 5. The nozzle control unit 91 causes the nozzle 5 located at the first position LP to hold the upper surface of the electronic component C supplied to the supply area SM. The nozzle control unit 91 rotates the turret 63 to move the nozzle 5 holding the electronic component C to the second position TP. The nozzle control unit 91 rotates the turret 63 to move the nozzle 5 holding the electronic component C recognized by the photographing device 64 at the second position TP to the first position LP. The nozzle control unit 91 moves the nozzle 5 located at the first position LP in the Zc-axis direction and the θZc direction at a specified mounting position of the substrate P located in the mounting area DM to mount the electronic component C on the substrate P.

[0049] The mounting control unit 92 controls the mounting head 6. The mounting control unit 92 moves the mounting head 6 to the supply area SM for supplying the electronic component C, the mounting area DM where the substrate P is arranged, the nozzle storage unit 51, and the component storage unit 52, respectively.

[0050] The photographing control unit 93 controls the photographing device 64. The photographing control unit 93 controls the photographing device 64 to obtain a photographed image of the electronic component C held by the nozzle 5 located at the second position TP photographed from the Zc-axis direction.

[0051] The component recognition unit 94 recognizes the electronic component C based on the photographed image of the electronic component C photographed by the photographing device 64. The component recognition unit 94 processes the photographed image by, for example, edge extraction to recognize the electronic component C.

[0052] The jig center recognition unit 95 recognizes the center of the auxiliary jig nozzle J based on the photographed image of the auxiliary jig nozzle J photographed by the photographing device 64. The jig center recognition unit 95 processes the photographed image by, for example, edge extraction to recognize the reflection portion JF of the auxiliary jig nozzle J, and estimates the center of the auxiliary jig nozzle J based on the image processing result.

[0053] The offset calculation unit 96 calculates the offset by which the position of the electronic component C identified by the component identification unit 94 is offset from the initial position. The offset of the position of the electronic component C represents, for example, the offset between the adsorption position of the nozzle 5 preset by teaching and the actual adsorption position identified from the captured image. The offset calculated here corresponds to the offset of the drive shaft of the nozzle 5. The offset calculation unit 96 calculates the offset for at least two of the plurality of nozzles 5 in use. The offset calculation unit 96 may also calculate the offset for all the nozzles 5 in use. In the embodiment, the offset calculation unit 96 calculates the offset in the X-axis direction. In addition, the offset calculation unit 96 calculates the median value of the offset for each nozzle 5 stored in the storage unit 99. The offset calculation unit 96 may also calculate the average value of the offset for each nozzle 5 stored in the storage unit 99.

[0054] The offset determination unit 97 determines whether the change amount of the offset exceeds a threshold value for the nozzle 5 for which the offset calculation unit 96 has calculated the offset. The threshold value is an arbitrary value preset in advance. The threshold value is based on the median value or the average value of the offset stored in the storage unit 99. That is, when the newly calculated offset is greater than the value obtained by adding the threshold value to the median value or the average value, or when the newly calculated offset is less than the value obtained by subtracting the threshold value from the median value or the average value, the offset determination unit 97 determines that the change amount of the offset exceeds the threshold value.

[0055] When the change amount of the offset of all the nozzles 5 exceeds the threshold value and the offset direction coincides with either the +X side or the -X side, the offset determination unit 97 determines that a correction process for correcting the origin of the rotation direction of the rotation shaft AX is required. In other words, the offset determination unit 97 monitors the change of the offset for all the nozzles 5, and when the offset changes sharply in the same direction and exceeds the threshold value for all the nozzles 5, it determines that a correction process for correcting the origin of the rotation direction of the rotation shaft AX is required. In addition, when the change amount of the offset of only a part of the nozzles 5 exceeds the threshold value, or when the change amount of the offset of all the nozzles 5 exceeds the threshold value but the offset directions do not coincide, it can be determined that a malfunction other than the offset of the rotation direction of the rotation shaft AX has occurred.

[0056] The correction amount calculation unit 98 calculates the correction amount of the origin of the rotation direction of the rotation shaft AX based on the position of the center of the auxiliary jig nozzle J identified by the jig center identification unit 95. The correction amount calculation unit 98 calculates the correction amount of the origin of the rotation direction of the rotation shaft AX that returns the center position of the auxiliary jig nozzle J to the reference point based on the offset of the center position of the auxiliary jig nozzle J from a specified reference point in the captured image.

[0057] The storage unit 99 stores the offset calculated by the offset calculation unit 96. The storage unit 99 stores and accumulates the offset for each of the multiple nozzles 5 in use. The storage unit 9 stores at least any one of the median value and the average value of the offset for each of the respective nozzles 5 calculated by the offset calculation unit 96. The storage unit 99 stores the threshold value of the change amount of the offset.

[0058] Figure 9 and Figure 10 is a graph showing a normal distribution curve corresponding to the histogram of the offset of the embodiment. Figure 9 and Figure 10 In [the figure], the horizontal axis represents the offset in the X-axis direction, and the vertical axis represents the number of data.

[0059] In Figure 9 In the example shown, for the offsets of three nozzles #01, #02, and #03 among the multiple nozzles 5, a normal distribution curve corresponding to the histogram of the past 100 points is shown. The median value MV1 of the nozzle #01 is calculated by the offset calculation unit 96. The median value MV2 of the nozzle #02 is calculated by the offset calculation unit 96. The median value MV3 of the nozzle #03 is calculated by the offset calculation unit 96.

[0060] Figure 10 is for Figure 9 a graph of data with newly identified and calculated offsets added. The new offset NV1 of the nozzle #01 is calculated by the offset calculation unit 96. The new offset NV2 of the nozzle #02 is calculated by the offset calculation unit 96. The new offset NV3 of the nozzle #03 is calculated by the offset calculation unit 96.

[0061] The offset determination unit 97 determines whether the change amount of the new offset NV1 with respect to the median value MV1 of the accumulated offset exceeds the threshold value for the nozzle #01. The offset determination unit 97 determines whether the change amount of the new offset NV2 with respect to the median value MV2 of the accumulated offset exceeds the threshold value for the nozzle #02. The offset determination unit 97 determines whether the change amount of the new offset NV3 with respect to the median value MV3 of the accumulated offset exceeds the threshold value for the nozzle #03.

[0062] The offset determination unit 97 determines whether the change amount of the offset exceeds the threshold value among all the nozzles #01, #02, and #03. The offset determination unit 97 determines whether the positive and negative of the offset direction are the same among all the nozzles #01, #02, and #03. As Figure 10 shown, when the offset changes sharply in the same direction among all the nozzles #01, #02, and #03, the offset determination unit 97 determines that a correction process for correcting the origin of the rotation direction of the rotation axis AX is required.

[0063] Installation Method Figure 11 is a flowchart showing the installation process of the embodiment. The control device 9 of the installation device 1 executes the Figure 11 processing of the flowchart shown. In addition, in the installation process, the adsorption position of the electronic component C in the component supply device 4, the mounting coordinates of the electronic component C on the substrate P, etc. are Figure 11 pre-stored in the installation device 1 through teaching performed before the installation process shown.

[0064] The substrate P is transported to the installation device 1. The substrate transport device 3 transports the substrate P to the installation area DM. The alignment process of the substrate P is executed. The installation control unit 92 controls the head movement device 7 to move the installation head 6 to the supply area SM (step SA1).

[0065] The control device 9 sets the execution number i to i = 1 and starts the loop process (step SA2). In the loop process, while i ≤ n holds, the process of step SA3 is repeated n times. In addition, n is the number that is half of the number of suction nozzles 5 used. That is, in the embodiment, an even number of suction nozzles 5 are used. i is the order in which the suction nozzles 5 are arranged in the circumferential direction of the turret 63 and is the ordinal number for identifying the suction nozzles 5.

[0066] The installation control unit 92 controls the head movement device 7 to move the installation head 6 to a position where the i-th suction nozzle 5 located at the first position LP faces the specified electronic component C held by the component supply device 4. The nozzle control unit 91 controls the nozzle movement device 8 to adsorb the electronic component C with the i-th suction nozzle 5 located at the first position LP (step SA3). The nozzle control unit 91 controls the nozzle movement device 8 to rotate the turret 63 so that the (i + 1)-th suction nozzle 5 moves to the first position LP.

[0067] In the loop process, the control device 9 re-sets the execution number i to i = i + 1 and returns to step SA3. After performing the process of step SA3 n times and adsorbing the electronic component C with the first to the n-th suction nozzles 5 among the 2n suction nozzles 5, the loop process ends (step SA4).

[0068] The control device 9 re-sets the execution number i to i = 1 and starts the loop process (step SA5). In the loop process, while i ≤ n holds, the process from step SA6 to step SA7 is repeated n times.

[0069] The (n + i)-th nozzle 5 is located at the first position LP, and the i-th nozzle 5 is located at the second position TP. The mounting control unit 92 controls the head moving device 7 to move the mounting head 6 to a position where the (n + i)-th nozzle 5 located at the first position LP faces the specified electronic component C held by the component supply device 4. The nozzle control unit 91 controls the nozzle moving device 8 to suck the electronic component C with the (n + i)-th nozzle 5 located at the first position LP (step SA6).

[0070] The imaging control unit 93 controls the imaging device 64 to image a specified imaging area including the electronic component C sucked and held by the i-th nozzle 5 located at the second position TP. The component recognition unit 94 recognizes the electronic component C based on the captured imaging image (step SA7). The nozzle control unit 91 controls the nozzle moving device 8 to rotate the turret 63 so that the (n + i + 1)-th nozzle 5 moves to the first position LP. As a result, the (i + 1)-th nozzle 5 moves to the second position TP.

[0071] The control device 9 resets the execution count i to i = i + 1 in the loop process and returns to step SA6. After performing the processes from step SA6 to step SA7 n times to recognize the electronic components C sucked and held by the nozzles 5 from the 1st to the n-th among the 2n nozzles 5 and sucking the electronic components C with the nozzles 5 from the (n + 1)-th to the 2n-th, the loop process ends (step SA8).

[0072] The mounting control unit 92 controls the head moving device 7 to move the mounting head 6 to the mounting area DM of the substrate P (step SA9).

[0073] The control device 9 resets the execution count i to i = 1 and starts the loop process (step SA10). In the loop process, while i ≤ n holds, the processes from step SA11 to step SA12 are repeatedly performed n times.

[0074] The i-th nozzle 5 is located at the first position LP, and the (n + i)-th nozzle 5 is located at the second position TP. The mounting control unit 92 controls the head moving device 7 to move the mounting head 6 to a position where the i-th nozzle 5 located at the first position LP faces the specified mounting position of the substrate P. The nozzle control unit 91 controls the nozzle moving device 8 to mount the electronic component C sucked and held by the i-th nozzle 5 located at the first position LP (step SA11).

[0075] The shooting control unit 93 controls the shooting device 64 to shoot a prescribed shooting area including the electronic component C held by adsorption by the (n + i)-th nozzle 5 located at the second position TP. The component recognition unit 94 recognizes the electronic component C based on the captured shooting image (step SA12). The nozzle control unit 91 controls the nozzle moving device 8 to rotate the turret 63 so that the (i + 1)-th nozzle 5 moves to the first position LP. Thereby, the (n + i + 1)-th nozzle 5 moves to the second position TP.

[0076] The control device 9 resets the execution count i to i = i + 1 in the loop process and returns to step SA11. The process from step SA11 to step SA12 is executed n times, and the electronic components C held by adsorption by the first to n-th nozzles 5 among the 2n nozzles 5 are respectively mounted on the prescribed mounting positions of the substrate P, and when the electronic components C held by adsorption by the (n + 1)-th to 2n-th nozzles 5 are recognized, the loop process ends (step SA13).

[0077] The control device 9 resets the execution count i to i = 1 and starts the loop process (step SA14). In the loop process, while i ≤ n holds, the process of step SA15 is repeatedly executed n times.

[0078] The (n + i)-th nozzle 5 is located at the first position LP, and the i-th nozzle 5 is located at the second position TP. The mounting control unit 92 controls the head moving device 7 to move the mounting head 6 to a position where it faces the (n + i)-th nozzle 5 located at the first position LP and the prescribed mounting position of the substrate P. The nozzle control unit 91 controls the nozzle moving device 8 to mount the electronic component C held by adsorption by the (n + i)-th nozzle 5 located at the first position LP (step SA15).

[0079] The control device 9 resets the execution count i to i = i + 1 in the loop process and returns to step SA15. The process of step SA15 is executed n times, and when the electronic components C held by adsorption by the (n + 1)-th to 2n-th nozzles 5 among the 2n nozzles 5 are respectively mounted on the prescribed mounting positions of the substrate P, the loop process ends (step SA16).

[0080] In addition, in the case of mounting more electronic components C than the number of nozzles 5 on the substrate P, as long as it returns to step SA1 and repeats the Figure 11 processing shown in the flowchart.

[0081] [Recognition Process] Figure 12 is a flowchart showing the recognition process of the embodiment. The control device 9 of the mounting device 1 executes the Figure 12 recognition process shown. In Figure 11Execute in steps SA7 and SA12 of the processing of the flowchart shown Figure 12 The identification process shown

[0082] The shooting control unit 93 controls the shooting device 64 to shoot a specified shooting area (step SB1) including the electronic component C held by the suction nozzle 5 located at the second position TP. The shooting device 64 shoots the electronic component C from the Zc-axis direction of the suction nozzle 5 located at the second position TP. In the embodiment, the shooting device 64 shoots the electronic component C from the Zc-axis direction via the mirror 65.

[0083] The component identification unit 94 identifies the electronic component C based on the captured image of the electronic component C captured by the shooting device 64 (step SB2).

[0084] The offset calculation unit 96 calculates the offset of the position of the electronic component C identified by the component identification unit 94 (step SB3). In the embodiment, the offset calculation unit 96 calculates the offset in the X-axis direction. The offset calculation unit 96 outputs the calculation result together with the identification data of the suction nozzle 5 to the storage unit 99. The storage unit 99 stores and accumulates the offset for each suction nozzle 5.

[0085] [Judgment process] Figure 13 It is a flowchart showing the judgment process of the embodiment. The control device 9 of the mounting device 1 executes according to a program stored in advance Figure 13 The judgment process shown. In Figure 11 After the processing of the flowchart shown or after the processing of steps SA7 and SA12, execute Figure 13 The judgment process shown.

[0086] The storage unit 99 stores the data of the offset of each suction nozzle 5 accumulated, the median value of the offset of each suction nozzle 5, and a threshold value of the change amount of the offset set in advance. In addition, the median value of the offset is used in the following description, but the average value of the offset can also be used instead.

[0087] The offset judgment unit 97 compares the last obtained offset with the median value of the offset accumulated in the storage unit 99 for each of the plurality of suction nozzles 5 that have obtained the offset of the electronic component C. The offset judgment unit 97 judges whether there is a suction nozzle 5 whose change amount of the last obtained offset with respect to the median value of the offset exceeds the threshold value (step SC1).

[0088] When the offset judgment unit 97 judges that there is no change amount of the offset exceeding the threshold value (step SC1: no), it makes Figure 13The determination process shown ends. When the offset determination unit 97 determines that there is a nozzle 5 in which the change amount of the offset exceeds the threshold value (step SC1: Yes), it determines whether the change amount of the offset exceeds the threshold value among all the nozzles 5 for which the offset of the electronic component C has been obtained (step SC2).

[0089] When the offset determination unit 97 determines that there is a nozzle 5 in which the change amount of the offset does not exceed the threshold value (step SC2: No), it proceeds to step SC5. When the offset determination unit 97 determines that the change amount of the offset exceeds the threshold value among all the nozzles 5 (step SC2: Yes), it determines whether the positive and negative of the offset direction of the nozzle 5 are all the same (step SC3). In the embodiment, the offset determination unit 97 determines whether the offset direction coincides with either the +X side or the -X side.

[0090] When the offset determination unit 97 determines that the positive and negative of the offset direction of the nozzle 5 do not match (step SC3: No), it proceeds to step SC5. When the offset determination unit 97 determines that the positive and negative of the offset direction of the nozzle 5 are all the same (step SC3: Yes), it determines that a correction process for correcting the origin of the rotation direction of the rotation axis AX is required and proceeds to step SC4.

[0091] The control device 9 executes the correction process (step SC4). For example, it executes the correction process according to the steps of the flowchart shown later. Figure 14 shown flowchart.

[0092] In the case where there is a nozzle 5 in which the change amount of the offset exceeds the threshold value, but there is a nozzle 5 in which the change amount of the offset does not exceed the threshold value or the positive and negative of the offset direction of the nozzle 5 do not match, it can be determined that an abnormal situation other than the offset of the rotation direction of the rotation axis AX has occurred. The control device 9 executes an error notification process (step SC5). The control device 9 notifies the operator of the occurrence of an error, for example, by causing a display device (not shown) of the mounting device 1 to display a prescribed notification message or causing a warning device (not shown) of the mounting device 1 to emit a prescribed light or sound.

[0093] [Correction Process] Figure 14 is a flowchart showing the correction process of the embodiment. The control device 9 of the mounting device 1 executes the Figure 14 shown correction process. In Figure 13 shown step SC4, execute Figure 14 shown correction process.

[0094] The mounting control unit 92 controls the head moving device 7 to move the mounting head 6 toward the component storage unit 52 (step SD1).

[0095] The control device 9 releases the electronic component C from the nozzle 5 located at the first position LP (step SD2). The electronic component C is put into the component storage unit 52.

[0096] The mounting control unit 92 controls the head moving device 7 to move the mounting head 6 toward the nozzle storage unit 51 (step SD3). The nozzle 5 located at the first position LP faces the specified storage position of the nozzle storage unit 51.

[0097] The nozzle control unit 91 controls the nozzle moving device 8 to store the nozzle 5 located at the first position LP in the specified storage position of the nozzle storage unit 51 and detach it from the turret 63. The mounting control unit 92 controls the head moving device 7 to move the mounting head 6 to a position where the mounting position of the nozzle 5 at the first position LP of the turret 63 faces the auxiliary jig nozzle J. The nozzle control unit 91 controls the nozzle moving device 8 to mount the auxiliary jig nozzle J to the mounting position of the nozzle 5 at the first position LP. Through the above, the nozzle 5 located at the first position LP is replaced with the auxiliary jig nozzle J (step SD4).

[0098] The nozzle control unit 91 controls the nozzle moving device 8 to rotate the turret 63 so that the auxiliary jig nozzle J moves to the second position TP. The imaging control unit 93 controls the imaging device 64 to image a specified imaging area including the auxiliary jig nozzle J located at the second position TP (step SD5).

[0099] The jig center identification unit 95 identifies the center of the auxiliary jig nozzle J based on the captured image of the auxiliary jig nozzle J captured by the imaging device 64 (step SD6).

[0100] The correction amount calculation unit 98 calculates the correction amount of the origin in the rotation direction of the rotation axis AX based on the position of the center of the auxiliary jig nozzle J identified by the jig center identification unit 95 (step SD7). The control device 9 updates the information of the origin in the rotation direction of the rotation axis AX based on the calculated correction amount.

[0101] The nozzle control unit 91 controls the nozzle moving device 8 to rotate the turret 63 so that the auxiliary jig nozzle J moves to the first position LP. The nozzle control unit 91 controls the nozzle moving device 8 to store the auxiliary jig nozzle J located at the first position LP in the specified storage position of the nozzle storage unit 51 and detach it from the turret 63. The mounting control unit 92 controls the head moving device 7 to move the mounting head 6 to a position where the mounting position of the nozzle 5 at the first position LP of the turret 63 faces the nozzle 5 stored in the nozzle storage unit 51. The nozzle control unit 91 controls the nozzle moving device 8 to mount the nozzle 5 to the mounting position of the nozzle 5 at the first position LP. Through the above, the auxiliary jig nozzle J located at the first position LP is replaced with the nozzle 5 (step SD8).

[0102] In addition, at the start of the correction process, if there is a nozzle 5 that does not adsorb and hold the electronic component C, it is only necessary to install the auxiliary jig nozzle J instead of the nozzle 5, and steps SD1 and SD2 can be omitted. When all the nozzles 5 are in a state of adsorbing and holding the electronic component C and correction processing is required, in steps SD1 and SD2, the electronic component C is temporarily released. Therefore, after changing from the auxiliary jig nozzle J to the nozzle 5 in step SD8, the electronic component C is re-adsorbed and held by the nozzle 5.

[0103] [Computer System] Figure 15 FIG. is a block diagram of the computer system 1000 showing an embodiment. The above control device 9 includes the computer system 1000. The computer system 1000 includes a processor 1001, a main memory 1002, a memory 1003, and an interface 1004. The functions of the control device 9 are stored in the memory 1003 as a computer program. The processor 1001 reads the computer program from the memory 1003 and expands it in the main memory 1002, and executes the above processing according to the computer program. In addition, the computer program can also be transmitted to the computer system 1000 via a network.

[0104] According to the above embodiment, the computer program can execute photographing the electronic component C held by the nozzle 5 with the photographing device 64, identifying the electronic component C based on the photographed image captured by the photographing device 64, calculating and storing the offset amount by which the position of the identified electronic component C deviates from the initial position, determining whether there is a nozzle 5 in which the change amount of the last obtained offset amount with respect to the past offset amount exceeds a threshold value, determining whether the change amount of the offset amount exceeds the threshold value among all the nozzles 5 in which the offset amount has been calculated, and determining whether the positive and negative of the offset direction of the offset amount are the same. In addition, the computer program can execute photographing the auxiliary jig nozzle J with the photographing device 64, identifying the center position of the auxiliary jig nozzle J based on the photographed image captured by the photographing device 64, and calculating the correction amount for correcting the origin of the rotation direction of the rotation axis AX based on the identified center position of the auxiliary jig nozzle J.

[0105] [Effect] As described above, according to this embodiment, for the plurality of nozzles 5, the change in the amount of offset of the electronic component C held by the nozzle 5 is monitored, and by detecting that the amount of offset changes in the same direction beyond the threshold value in all of the plurality of nozzles 5, the position offset of the origin of the rotation direction of the rotation axis AX can be detected. Based on the captured image captured by the imaging device 64 that is also mounted on the conventional mounting device 1 for confirming the holding position of the electronic component C, the amount of offset of the electronic component C held by the nozzle 5 can be calculated. Therefore, the amount of offset can be calculated during normal mounting processing, and the change in the amount of offset can be monitored in parallel with the mounting processing. Therefore, in the case of a position offset, it is possible to quickly shift to the correction processing.

[0106] In addition, according to this embodiment, the auxiliary jig nozzle J can be imaged by the imaging device 64 instead of imaging the nozzle 5, and the correction amount for correcting the position offset can be calculated based on the amount of movement of the center position of the auxiliary jig nozzle J in the captured image from the initial position. The replacement of the nozzle 5 and the auxiliary jig nozzle J can be automatically processed by a known replacement mechanism for the nozzles 5. In addition, imaging of the auxiliary jig nozzle J can also be achieved by the imaging device 64 that is also mounted on the conventional mounting device 1. Therefore, even when the mounting processing is temporarily stopped for correction processing, manual operation by the operator is not required, and the correction processing can be completed and the mounting processing can be resumed. Therefore, rapid correction of the position offset can be performed.

[0107] [Other Embodiments] As described above, the embodiments of the present application have been described, but the present invention is not limited to the contents of these embodiments. The above embodiments and modifications can be appropriately combined within the range where the processing contents do not conflict. In addition, among the above components, there are elements that are easily conceived by those skilled in the art, elements that are substantially the same, and elements within the so-called equivalent range. Furthermore, the above components can be appropriately combined. Furthermore, within the scope not departing from the gist of the above embodiments, various omissions, replacements, or changes of the components can be made.

[0108] For example, in the embodiment, the median or average value of the offset data obtained multiple times in the past is compared with the offset obtained last, but it is also possible to compare the offset data obtained once in the past with the offset obtained last. In addition, it is also possible to compare the median or average value of the offset data obtained multiple times in the past with the median or average value of the data including the latest multiple offset data.

[0109] In addition, in each of the processes described in the above embodiments, all or part of the processes described as being automatically performed can also be manually performed, or all or part of the processes described as being manually performed can also be automatically performed by a known method. In addition, the processing steps, specific names, and information including various data and parameters shown in the above documents and drawings can be arbitrarily changed unless otherwise specifically described. For example, the various information shown in each figure is not limited to the information shown in the figure.

[0110] In addition, each component of each device shown in the figure is a functional concept, and it is not necessary to be physically configured as shown in the figure. That is, the specific manner of dispersion and integration of each device is not limited to the manner shown in the figure, and all or part of it can be functionally or physically dispersed and integrated in any unit according to various loads, usage conditions, etc. In addition, the above control device 9 may be composed of multiple computers divided into several functions, may exist separately via a network, and several functions of the computer may also have a cloud server that executes various functions in the form of cloud computing. In addition, the program may be transmitted to the control device 9 via the network. Description of reference numerals:

[0111] 1: Mounting device; 2: Base member; 3: Substrate conveying device; 4: Component supply device; 5: Nozzle; 6: Mounting head; 7: Head moving device; 8: Nozzle moving device; 9: Control device; 21: Support portion; 51: Nozzle storage portion; 52: Component storage portion; 61: Housing; 62: Rotor shaft; 63: Turret; 64: Imaging device; 65: Mirror; 71: Xg-axis moving device; 72: Yg-axis moving device; 73: Zg-axis moving device; 81: Rotary device; 82: Zc-axis moving device; 83: θZc moving device; 91: Nozzle control portion; 92: Mounting control portion; 93: Imaging control portion; 94: Component identification portion; 95: Fixture center identification portion; 96: Offset calculation portion; 97: Offset determination portion; 98: Correction amount calculation portion; 99: Storage portion; 1000: Computer system; 1001: Processor; 1002: Main memory; 1003: Memory; 1004: Interface; C: Electronic component; DM: Mounting area; J: Auxiliary fixture nozzle; JF: Reflection portion; LP: First position; P: Substrate; SM: Supply area; TP: Second position.

Claims

1. A mounting device, characterized in that: have: Multiple suction nozzles to hold the electronic components mounted on the substrate; A mounting head having a turret supporting a plurality of the suction nozzles by a peripheral portion; A nozzle driving device, which moves the plurality of nozzles relative to the turret in a direction parallel to the driving axis and rotates the turret around the rotation axis; A photographing device supported by the mounting head for photographing the electronic component held by the suction nozzle from a direction parallel to a driving axis of the suction nozzle; as well as Control device, The control device calculates and stores a deviation amount of the position of the electronic component recognized from the captured image captured by the capturing device from the initial position, The control device determines that correction processing is required for the origin of the rotation direction of the rotation axis when the change in the last offset amount relative to the past offset amount among the plurality of suction nozzles for which the offset amounts are calculated exceeds a threshold and the sign of the offset directions is the same.

2. The mounting device according to claim 1, characterized in that: The control device calculates and stores a median value or an average value of a plurality of offsets calculated in the past for each of the plurality of suction nozzles, The control device determines that correction processing is required to correct the origin of the rotation direction of the rotation axis when the change amount of the last obtained offset relative to the median value or the average value exceeds a threshold value and the offset directions are both positive and negative.

3. The mounting device according to claim 1, characterized in that: The control device determines that correction processing is required for the origin of the rotation direction of the rotation axis when the change in the last offset amount relative to the past offset amount exceeds a threshold and the offset directions are the same in sign.

4. The mounting device according to claim 1, characterized in that: The installation device further includes an auxiliary fixture nozzle, which can replace one of the plurality of nozzles for installation. The control device causes the photographing device to photograph the auxiliary fixture nozzle. The control device calculates a correction amount for correcting the origin of the rotation direction of the rotation axis based on the center position of the auxiliary gripper nozzle recognized from the captured image captured by the imaging device.

5. A control method for an installation device, characterized in that: The installation device comprises: Multiple suction nozzles to hold the electronic components mounted on the substrate; A mounting head having a turret supporting a plurality of the suction nozzles by a peripheral portion; A nozzle driving device, which moves the plurality of nozzles relative to the turret in a direction parallel to the driving axis and rotates the turret around the rotation axis; as well as a photographing device supported by the mounting head, for photographing the electronic component held by the suction nozzle from a direction parallel to the driving axis of the suction nozzle; The control method of the installation device comprises: photographing the electronic component held by the suction nozzle by the photographing device; recognizing the electronic component from the captured image captured by the capturing device; Calculating and storing the offset of the identified position of the electronic component from the initial position; Determine whether there is a nozzle whose last obtained offset value has a change amount relative to the past offset value that exceeds a threshold value; determining whether a change in the offset in all the nozzles among the nozzles for which the offset is calculated exceeds the threshold; and It is determined whether the offset direction of the offset is the same in sign and negative in sign.

6. The control method of the installation device according to claim 5, characterized in that: The installation device further includes an auxiliary fixture nozzle, which can replace one of the plurality of nozzles for installation. The control method of the installation device comprises: photographing the auxiliary fixture nozzle by means of the photographing device; recognizing the center position of the auxiliary fixture nozzle from the captured image captured by the capturing device; and Based on the recognized center position of the auxiliary gripper suction nozzle, a correction amount for correcting the origin of the rotation direction of the rotation axis is calculated.

Images