Mounting device and method for controlling mounting device

Abstract

The invention provides a mounting device and a control method of the mounting device, which can mount a large electronic component without increasing the size of the device. The mounting device includes: a mounting head; a suction nozzle which is supported by the mounting head and holds an electronic component; the suction nozzle moving device enables the suction nozzle to move in the axial direction relative to the mounting head; a camera which is supported by the mounting head and captures an image of a substrate on which the electronic component is mounted from above; and a camera moving device that moves the camera in the vertical direction with respect to the suction nozzle.

Description

Technical Field

[0001] The technology disclosed in this specification relates to an installation device and a control method for the installation device. Background Art

[0002] In the manufacturing process of electronic devices, an installation device for mounting electronic components on a substrate is used. In the installation device, a mounting head having a nozzle for holding an electronic component moves relative to the substrate supported on a worktable, and the electronic component adsorbed by the tip of the nozzle is transported to a specified mounting position on the substrate for mounting. In such an installation device, when identifying alignment marks on the substrate or teaching the adsorption position of the electronic component to the nozzle, a camera for photographing the lower part of the mounting head is mounted on the mounting head (for example, Patent Documents 1 and 2). Prior Art Documents Patent Documents

[0003] Patent Document 1: Japanese Patent Laid-Open Publication No. 2007-150267 Patent Document 2: International Publication No. 2017 / 013696 Summary of the Invention

[0004] In the case where a camera is mounted on the mounting head as in the past, when mounting a large electronic component, in order to prevent the camera from colliding with the electronic component already mounted on the substrate, the movement path of the mounting head may become complicated. In addition, in the case of using a camera with a long focal length, there are problems such as increased costs, increased size of the mounting head, and increased height of the device itself. The object of the technology disclosed in this specification is to mount a large electronic component without increasing the size of the device.

[0006] This specification discloses an installation device. The installation device includes: a mounting head; a nozzle supported by the mounting head for holding an electronic component; a nozzle moving device for moving the nozzle relative to the mounting head in the axial direction; a camera supported by the mounting head for photographing the substrate on which the electronic component is mounted from above; and a camera moving device for moving the camera relative to the nozzle in the vertical direction.

[0007] According to the technology disclosed in this specification, it is possible to mount a large electronic component without increasing the size of the device. Brief Description of the Drawings

[0008] Figure 1 It is a side view schematically showing the installation device of the embodiment. Figure 2 It is a top view schematically showing the installation device of the embodiment. Figure 3 It is a view schematically showing the mounting head of the embodiment. Figure 4 This is a diagram for explaining the actions during shooting. Figure 5 This is a diagram for explaining the actions during component adsorption. Figure 6 This is a diagram for explaining the actions during shooting while a component is being adsorbed. Figure 7 This is a flowchart showing the installation process of the embodiment. Figure 8 This is a flowchart showing the confirmation process when adsorption fails. Detailed Embodiment

[0009] Hereinafter, the embodiment will be described with reference to the accompanying drawings. In the embodiment, an XYZ orthogonal coordinate system is defined, and the positional relationships of each part are described with reference to this XYZ orthogonal coordinate system. The direction parallel to the X-axis of the specified plane is defined as the X-axis direction. The direction parallel to the Y-axis of the specified plane orthogonal to the X-axis is defined as the Y-axis direction. The direction parallel to the Z-axis orthogonal to the specified plane is defined as the Z-axis direction. The rotational direction or tilting direction centered on the Z-axis direction is defined as the θZ direction. In the embodiment, the specified plane is parallel to the horizontal plane. The Z-axis is parallel to the vertical axis, and the Z-axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. In addition, the specified plane may be inclined with respect to the horizontal plane. Further, in the embodiment, the specified plane including the X-axis and the Y-axis is appropriately referred to as the XY plane.

[0010] [Mounting Device] Figure 1 This is a side view schematically showing the mounting device 10 of the embodiment. Figure 2 This is a top view schematically showing the mounting device 10 of the embodiment. The mounting device 10 is a device for mounting an electronic component 2 onto a substrate 1.

[0011] As Figure 1 and Figure 2 shown, the mounting device 10 includes a base member 12, a conveying device 14, a worktable 16, a worktable moving device 18, a component supply device 20, a mounting head 22, a head moving device 24, a chamber 28, and a control device 50.

[0012] The base member 12 supports the conveying device 14, the worktable 16, the worktable moving device 18, the component supply device 20, the mounting head 22, and the head moving device 24 respectively.

[0013] The conveying device 14 conveys the substrate 1 supplied to the mounting device 10 to a processing position where the electronic component 2 is mounted by the mounting head 22. The processing position is defined on the conveying path of the conveying device 14. In the embodiment, the conveying device 14 conveys the substrate 1 in the X-axis direction.

[0014] The conveying device 14 includes: a conveyor belt 14A that conveys the substrate 1 in the X-axis direction; and a guiding member 14B that guides the substrate 1.

[0015] The guiding member 14B is long in the X-axis direction. A pair of guiding members 14B are provided. The pair of guiding members 14B are separated from each other in the Y-axis direction. One guiding member 14B is disposed at a position on the +Y side with respect to the substrate 1. The other guiding member 14B is disposed at a position on the -Y side with respect to the substrate 1.

[0016] The conveyor belt 14A is annular. A pair of conveyor belts 14A are provided. The conveyor belt 14A is supported by the guiding member 14B via a driving pulley and a driven pulley. The conveyor belt 14A is hung on the driving pulley and the driven pulley. One conveyor belt 14A is supported by one guiding member 14B. The other conveyor belt 14A is supported by the other guiding member 14B.

[0017] In the pair of conveyor belts 14A, the conveyor belt 14A disposed on the +Y side supports the +Y side end of the lower surface of the substrate 1. The conveyor belt 14A disposed on the -Y side supports the -Y side end of the lower surface of the substrate 1. The driving pulley is rotated by a driving motor (not shown), thereby conveying the substrate 1 in the X-axis direction.

[0018] By an actuator (not shown), one guiding member 14B can move in the Y-axis direction with respect to the other guiding member 14B. One guiding member 14B is separated from the other guiding member 14B in the Y-axis direction, thereby releasing the support of the conveyor belt 14A for the substrate 1.

[0019] The workbench 16 supports the substrate 1. The workbench 16 supports the substrate 1 conveyed to the processing position from the -Z side.

[0020] The workbench moving device 18 moves the workbench 16. In the embodiment, the workbench moving device 18 moves the workbench 16 in the Y-axis direction and the Z-axis direction, respectively. The workbench moving device 18 includes a Y-axis motor that generates power to move the workbench 16 in the Y-axis direction, and a Z-axis motor that generates power to move the workbench 16 in the Z-axis direction.

[0021] After the substrate 1 is conveyed to the processing position by the conveying device 14, the workbench 16 is moved in the +Z direction by the workbench moving device 18, so that the workbench 16 supports the substrate 1 from below, and the substrate 1 is transferred from the conveying device 14 to the workbench 16. Then, the guiding member 14B on the +Y side moves in the Y-axis direction and moves away from the other guiding member 14B, thereby releasing the support of the conveyor belt 14A for the substrate 1. In addition, the workbench 16 moves in the +Z direction to support the substrate 1, and the support of the conveyor belt 14A for the substrate 1 is released.

[0022] When transferring the substrate 1 from the workbench 16 to the conveying device 14, the workbench 16 moves in the -Y direction until one side of the substrate 1 reaches the conveyor belt 14A, and the guiding member 14B on the +Y side moves in the -Y direction until the opposite side of the substrate 1 reaches the conveyor belt 14A. If the workbench 16 is moved in the -Z direction by the workbench moving device 18, the support of the substrate 1 by the workbench 16 is released, and the substrate 1 is supported on the conveyor belt 14A.

[0023] The component supply device 20 supplies the electronic components 2. The component supply device 20 includes a plurality of tape feeders. The tape feeders hold a plurality of electronic components 2. The component supply device 20 supplies at least one of the plurality of electronic components 2 to the supply position. The component supply device 20 is arranged on the -Y side of the conveying device 14. In addition, the component supply device 20 can also be respectively arranged on the +Y side and the -Y side of the conveying device 14.

[0024] The mounting head 22 mounts the electronic component 2 onto the substrate 1. The mounting head 22 supports the suction nozzle 30 and the camera 40. The mounting head 22 holds the electronic component 2 supplied from the component supply device 20 by the suction nozzle 30 and mounts it onto the substrate 1. The mounting head 22 can move between the supply position where the electronic component 2 is supplied from the component supply device 20 and the processing position where the substrate 1 is arranged. The mounting head 22 holds the electronic component 2 supplied to the supply position by the suction nozzle 30, and after moving to the processing position, mounts the electronic component 2 onto the surface of the substrate 1 arranged at the processing position.

[0025] The head moving device 24 moves the mounting head 22. In the embodiment, the head moving device 24 moves the mounting head 22 in the X-axis direction and the Y-axis direction respectively. The head moving device 24 includes: an X-axis moving device 24X that moves the mounting head 22 in the X-axis direction; and a Y-axis moving device 24Y that moves the mounting head 22 in the Y-axis direction. The X-axis moving device 24X and the Y-axis moving device 24Y each include an actuator. The X-axis moving device 24X is connected to the mounting head 22. By the operation of the X-axis moving device 24X, the mounting head 22 moves in the X-axis direction. The Y-axis moving device 24Y is connected to the mounting head 22 through the X-axis moving device 24X. By the operation of the Y-axis moving device 24Y, the X-axis moving device 24X moves in the Y-axis direction, so that the mounting head 22 moves in the Y-axis direction.

[0026] The chamber 28 has an internal space that houses the base member 12, the conveying device 14, the workbench 16, the workbench moving device 18, the component supply device 20, the mounting head 22, and the head moving device 24 respectively.

[0027] In addition, a dispenser (not shown) can be accommodated in the internal space of the chamber 28. The dispenser applies paste solder to the substrate 1. The dispenser moves in the X-axis direction, Y-axis direction, and Z-axis direction at positions on the +Z side with respect to the conveying device 14. The dispenser and the mounting head 22 can move independently. After the paste solder is applied to the surface of the substrate 1 by the dispenser, the electronic component 2 is mounted on the substrate 1 by the mounting head 22.

[0028] [Mounting head] Figure 3 FIG. schematically shows the mounting head 22 of the embodiment. As Figure 3 shown, a nozzle 30 and a camera 40 are arranged on the mounting head 22. In the embodiment, the nozzle 30 includes two nozzles 30 at positions separated by a predetermined distance in the X-axis direction.

[0029] The nozzle 30 releasably holds the electronic component 2. The nozzle 30 is a suction nozzle that adsorbs and holds the electronic component 2. An opening 30A is provided at the lower end of the nozzle 30.

[0030] The nozzle 30 is connected to the lower end of the shaft 32. The shaft 32 is supported by the mounting head 22 such that its axis is parallel to the Z-axis direction. The nozzle 30 is mounted on the shaft 32 such that its axis is parallel to the vertical direction. One shaft 32 is provided for one nozzle 30. A plurality of nozzles 30 are respectively connected to a plurality of shafts 32.

[0031] The mounting head 22 has a nozzle moving device 34 for moving the nozzle 30. The nozzle moving device 34 moves the shaft 32 in the Z-axis direction and the θZ direction respectively. The nozzle moving device 34 is supported by the mounting head 22. One nozzle moving device 34 is provided for one shaft 32. A plurality of nozzle moving devices 34 are respectively connected to a plurality of shafts 32.

[0032] The nozzle 30 is supported by the mounting head 22 via the shaft 32 and the nozzle moving device 34. The nozzle moving device 34 moves the nozzle 30 by moving the shaft 32 in the Z-axis direction and the θZ direction. The nozzle 30 is supported so as to be able to move up and down and rotate about an axis with respect to the mounting head 22. The nozzle 30 can move in the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction respectively by the head moving device 24 and the nozzle moving device 34. By moving the nozzle 30, the electronic component 2 held by the nozzle 30 can also move in the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction respectively.

[0033] The opening 30A of the nozzle 30 is connected to a vacuum system via the interior of the shaft 32. With the lower end of the nozzle 30 in contact with the electronic component 2, by performing a suction operation through the opening 30A provided at the lower end of the nozzle 30, the electronic component 2 is adsorbed and held at the lower end of the nozzle 30. By releasing the suction operation from the opening 30A, the electronic component 2 is released from the nozzle 30.

[0034] In the embodiment, the nozzle 30 has a plurality of adsorption portions (openings 30A) arranged horizontally. The plurality of adsorption portions can be arranged in a row in only one horizontal direction, or can be arranged two-dimensionally in the horizontal plane direction. The nozzle 30 having a plurality of openings 30A adsorbs the upper surface of the large-sized electronic component 2 through the plurality of openings 30A, thereby enabling stable adsorption, holding, and conveyance of the electronic component 2.

[0035] In addition, the number of nozzles 30 is not limited to two, and can also be three or more. Three or more nozzles 30 can be arranged in a single row, or can be arranged in two or more rows. Further, the nozzle 30 can also be a clamping nozzle that clamps and holds the electronic component 2.

[0036] The camera 40 photographs the substrate 1 and the electronic component 2. The camera 40 is, for example, an OCC (Optical Camera Communication) camera. The camera 40 photographs in the -Z direction.

[0037] The camera 40 is connected to the lower end of the support member 42. The mounting head 22 has a camera moving device 44 that moves the camera 40. The camera moving device 44 moves the support member 42 in the Z-axis direction. The camera moving device 44 is supported so as to be able to move up and down relative to the mounting head 22.

[0038] The camera 40 is supported by the mounting head 22 via the support member 42 and the camera moving device 44. The camera moving device 44 moves the camera 40 by moving the support member 42 in the Z-axis direction. The camera 40 can move in the X-axis direction, Y-axis direction, and Z-axis direction respectively by the head moving device 24 and the camera moving device 44.

[0039] In the embodiment, the camera 40 is disposed between two nozzles 30. Further, the camera 40 is preferably disposed at the center of the plurality of nozzles 30 in a top view. For example, when eight nozzles 30 are arranged in a single row, it is preferably arranged in the order of four nozzles 30, the camera 40, and four nozzles 30.

[0040] In a state where the nozzle 30 and the camera 40 are respectively located at the positions raised to the +Z side, the lower end of the camera 40 is located above the lower end (opening 30A) of the nozzle 30. That is, the camera 40 can be retracted to a position above the electronic component 2 held by adsorption of the nozzle 30.

[0041] In the embodiment, the camera 40 photographs the surface of the substrate 1 supported on the workbench 16 from the +Z side of the substrate 1. The camera 40 can photograph, for example, the alignment marks provided on the surface of the substrate 1. In the embodiment, the camera 40 photographs the upper surface of the electronic component 2 held by the component supply device 20 from the +Z side of the electronic component 2. The camera 40 can photograph, for example, the adsorption position of the electronic component 2 held by the component supply device 20. By moving in the Z-axis direction, the camera 40 can clearly photograph at least from the height of the surface of the substrate 1 supported on the workbench 16 to the height of the upper surface of the large electronic component 2 held by the component supply device 20 without extending the focal length of the camera 40 itself.

[0042] Figure 4 This is a diagram for explaining the operation during photographing. In Figure 4 the example shown, it shows the state of photographing the surface of the substrate 1 supported on the workbench 16.

[0043] When the mounting head 22 moves to the substrate 1 supported on the workbench 16, the camera 40 is supported on the mounting head 22 with its lower end retracted to a position above the lower end of the nozzle 30. When starting the photographing of the camera 40, the camera moving device 44 lowers the camera 40 in the -Z direction. The lower end of the camera 40 descends to a position below the lower end (opening 30A) of the nozzle 30. Thereby, the camera 40 can align the height and focus with the surface of the substrate 1 within the moving range of the camera 40.

[0044] In addition, in Figure 4 the example shown, the state of photographing the surface of the substrate 1 has been described, but the same applies when photographing the electronic component 2 held by the component supply device 20 to confirm the adsorption position of the electronic component 2 and when photographing the electronic component 2 mounted on the substrate 1 to confirm the mounting position of the electronic component 2. That is, as long as the camera 40 is retracted upward during normal times to avoid interference between the camera 40 and the electronic component 2, and the focus is aligned with the lower-positioned object to be photographed by lowering the camera 40 during photographing. Alternatively, the camera 40 can be retracted upward only when predicting interference with the electronic component 2.

[0045] Figure 5 This is a diagram for explaining the operation during component adsorption. In Figure 5 the example shown, it shows the state of adsorbing and holding the electronic component 2 held by the component supply device 20 with the nozzle 30.

[0046] The head moving device 24 moves the mounting head 22 toward the component supply device 20. At this time, when the camera 40 is in the lowered position, the camera moving device 44 raises the camera 40 in the +Z direction, and retracts the camera 40 so that the lower end of the camera 40 is located above the lower end of the suction nozzle 30 in the most raised position. The suction nozzle moving device 34 lowers the suction nozzle 30 in the -Z direction until the opening 30A of the suction nozzle 30 (see Figure 3 ) to a position where the upper surface of the electronic component 2 abuts. By supplying vacuum pressure to the opening 30A of the suction nozzle 30, the electronic component 2 is sucked at the opening 30A.

[0047] The nozzle moving device 34 raises the nozzle 30 to a predetermined height in the +Z direction. The electronic component 2 is held by suction at the lower end of the nozzle 30 and is lifted in the +Z direction together with the nozzle 30. At this time, the lower end of the camera 40 is located above the lower end of the nozzle 30, and the upper surface of the electronic component 2 is located below the lower end of the camera 40. Therefore, even if the electronic component 2 held by the nozzle 30 is a longer component in the X-axis direction, interference with the camera 40 can be prevented.

[0048] Figure 6 This is a diagram for explaining the action of shooting during the component adsorption. Figure 6 In the illustrated example, a state in which the electronic component 2 held by the component supply device 20 is photographed in a state in which the electronic component 2 is sucked and held by the suction nozzle 30 is shown.

[0049] For example, suppose that the suction nozzle 30 ( Figure 6 The electronic component 2 is then held by the suction nozzle 30 on the right side of the nozzle 30 ( Figure 6 In such a situation, the operation of the mounting device 10 is temporarily stopped due to the error of adsorption and holding, and the operator sometimes uses the camera 40 to confirm the adsorption position of the electronic component 2 to be adsorbed and held by the other suction nozzle 30 while the electronic component 2 is adsorbed and held by one suction nozzle 30.

[0050] In such a case, if the electronic component 2 held by the suction nozzle 30 of one party is a component that is longer in the X-axis direction, there is a possibility of interference with the electronic component 2 when the camera 40 is lowered. Therefore, the suction nozzle moving device 34 rotates the suction nozzle 30 of one party by 90 degrees about an axis (in the θZ direction). The electronic component 2 held by the suction nozzle 30 of one party rotates by 90 degrees in the θZ direction together with the suction nozzle 30. As a result, the electronic component 2 retreats from the area directly below the camera 40. After that, the camera moving device 44 lowers the camera 40 in the -Z direction in the same manner as during normal shooting.

[0051] [Control device] Figure 2 The control device 50 shown controls each part of the mounting device 10. The control device 50 includes at least one processor, a main memory, a memory, and an interface. The processor is a CPU (Central Processing Unit). The main memory includes non-volatile memories such as ROM (Read Only Memory) and volatile memories such as RAM (Random Access Memory). Examples of the memory include a hard disk drive (HDD), a solid state drive (SSD), a magnetic disk, an optical disk, a CD-ROM, and a DVD-ROM. The interface includes an input / output circuit. The functions of the processor are stored as a program in the memory. The processor reads the program from the memory and expands it in the main memory, and executes processing according to the program.

[0052] [Mounting process] Figure 7 is a flowchart showing the mounting process of the embodiment. The control device 50 of the mounting device 10 executes the Figure 7 processing of the flowchart shown. In addition, in the mounting process, the adsorption position of the electronic component 2 in the component supply device 20, the mounting coordinates of the electronic component 2 on the substrate 1, etc. are pre-stored in the mounting device 10 through teaching performed before the Figure 7 mounting process shown.

[0053] The substrate 1 is conveyed to the mounting device 10. The control device 50 controls the head moving device 24 to move the mounting head 22 to the shooting start position above the substrate 1 of the camera 40 (step SA1). The shooting start position indicates, for example, a position where the shooting area of the camera 40 is an area including any corner of the substrate 1.

[0054] The control device 50 controls the camera moving device 44 to move the camera 40 in the -Z direction (step SA2). The lower end of the camera 40 descends to a position lower than the lower end (opening 30A) of the nozzle 30. Thereby, the focus of the camera 40 is aligned with the surface of the substrate 1 in terms of height.

[0055] The control device 50 causes the camera 40 to perform photographing of the surface of the substrate 1 (step SA3). Specifically, the mounting head 22 is moved in the X-axis direction and the Y-axis direction by the head moving device 24, and while changing the photographing position of the camera 40, the entire area of the surface of the substrate 1 is photographed with the camera 40. The image photographed by the camera 40 is output to the control device 50. The control device 50 processes the image and detects the alignment mark.

[0056] If the photographing of the entire surface of the substrate 1 is completed and the alignment mark is recognized, the control device 50 controls the camera moving device 44 to move the camera 40 in the +Z direction (step SA4). The lower end of the camera 40 rises to a position higher than the lower end of the nozzle 30 at the maximum rising position. Thereby, the camera 40 retreats to a position higher than the electronic component 2 held and adsorbed by the nozzle 30.

[0057] The control device 50 sets the execution count i to i = 1 and starts loop processing (step SA5). In the loop processing, while i ≤ n holds, the processing from step SA6 to step SA9 is repeated n times. Further, n is the number of electronic components 2 mounted on the substrate 1, and i is the order of mounting the electronic component 2 to the specified mounting position on the substrate 1.

[0058] The control device 50 controls the head moving device 24 to move the mounting head 22 to the component supply position of the i-th mounted electronic component 2 held by the component supply device 20 (step SA6). At this time, according to the height of the electronic component 2 held by the component supply device 20, the height of the moving mounting head 22 is set within a range where there is no interference between the lower end of the nozzle 30 and the electronic component 2. In step SA4, since the camera 40 is retreated to a position higher than the lower end of the nozzle 30, similarly, the camera 40 also does not interfere with the electronic component 2.

[0059] The control device 50 controls the nozzle moving device 34 to move the nozzle 30 in the -Z direction until the opening 30A of the nozzle 30 (refer to Figure 3 ) abuts against the upper surface of the electronic component 2. By the vacuum pressure supplied to the opening 30A of the nozzle 30, the nozzle 30 adsorbs the electronic component 2 with the opening 30A (step SA7). The control device 50 controls the nozzle moving device 34 to move the nozzle 30 in the +Z direction to lift the i-th electronic component 2 from the component supply device 20.

[0060] The control device 50 controls the head moving device 24 to move the mounting head 22 to the mounting position on the substrate 1 of the i-th mounted electronic component 2 (step SA8). At this time, the height of the mounting head 22 during movement is set within a range where there is no interference between the electronic component 2 held by the nozzle 30 and the electronic component 2 already mounted on the substrate 1, based on the height of the electronic component 2 already mounted on the substrate 1 and the height of the electronic component 2 held by the nozzle 30. In step SA4, since the camera 40 is retracted to a position above the lower end of the nozzle 30, similarly, the camera 40 also does not interfere with the electronic component 2 already mounted on the substrate 1.

[0061] The control device 50 controls the nozzle moving device 34 to move the nozzle 30 in the -Z direction until the i-th electronic component 2 adsorbed and held by the nozzle 30 abuts against the mounting position on the surface of the substrate 1. The control device 50 releases the adsorption and holding of the i-th electronic component 2 by the nozzle 30 by stopping the vacuum pressure supplied to the opening 30A of the nozzle 30. The control device 50 controls the nozzle moving device 34 to move the nozzle 30 in the +Z direction. Thereby, the i-th electronic component 2 is mounted on the substrate 1 (step SA9).

[0062] The control device 50 resets the execution count i to i = i + 1 in the loop process and returns to step SA6. The processes from step SA6 to step SA7 are executed n times. If all the electronic components 2 are mounted on the respective specified positions on the substrate 1, the loop process ends (step SA8).

[0063] In addition, in the above description, the case of transporting and mounting the electronic components 2 one by one has been described. However, in the case where the mounting head 22 has a plurality of nozzles 30 as in the embodiment, the processes from step SA6 to step SA9 can also be executed in parallel according to the number of nozzles 30.

[0064] In addition, when the mounting device 10 has a dispenser, in the above process, before mounting the electronic component 2 on the specified mounting position of the substrate 1, the paste solder is applied to this area of the substrate 1 by the dispenser. For example, after step SA4, the paste solder can be applied to the coating areas corresponding to all of the n electronic components 2 at once, or the application of the paste solder and the mounting of the electronic component 2 can be repeated for each electronic component 2.

[0065] [Camera startup process when the device is temporarily stopped] Figure 8 It is a flowchart showing the confirmation process when adsorption fails. The control device 50 of the mounting device 10 executes the Figure 8 process shown in the flowchart according to a pre-stored program. For example, in Figure 7In step SA7 of the flowchart shown, when the suction nozzle 30 fails to suck the electronic component 2, the mounting device 10 temporarily stops the mounting process. At this time, the control device 50 starts, for example, by accepting a prescribed operation for confirming the suction position through the camera 40. Figure 8 the processing of the flowchart shown.

[0066] The control device 50 determines whether there is a suction nozzle 30 that has sucked the electronic component 2 (step SB1). For example, in the mounting device 10 having two suction nozzles 30 in the embodiment, when the suction and holding of the electronic component 2 by the other suction nozzle 30 fails after the electronic component 2 has been sucked and held by one suction nozzle 30, since one suction nozzle 30 has sucked the electronic component 2, it is determined that there is a suction nozzle 30 that has sucked the electronic component 2. The determination in step SB1 is made, for example, based on a preset control program for the mounting process and the progress of the processing so far.

[0067] When the control device 50 determines that there is no suction nozzle 30 that has sucked the electronic component 2 (step SB1: No), it transfers to step SB2. When the control device 50 determines that there is a suction nozzle 30 that has sucked the electronic component 2 (step SB1: Yes), it determines whether the camera 40 may interfere with the electronic component 2 (step SB2). For example, when the electronic component 2 sucked and held by the suction nozzle 30 is a component that is long in the X-axis direction and a part of the electronic component 2 is located directly below the camera 40, it is determined that the camera 40 may interfere with the electronic component 2. The determination in step SB2 is made, for example, based on the information of the electronic component 2 stored in advance.

[0068] When the control device 50 determines that there is no possibility of the camera 40 interfering with the electronic component 2 (step SB2: No), it transfers to step SB3. When the control device 50 determines that there is a possibility of the camera 40 interfering with the electronic component 2 (step SB2: Yes), it rotates the suction nozzle 30 that has sucked the electronic component 2 by 90 degrees about an axis (in the θZ direction) (step SB3). The control device 50 controls the suction nozzle moving device 34 to rotate the suction nozzle 30 by 90 degrees about an axis (in the θZ direction). The electronic component 2 held by suction by the suction nozzle 30 rotates by 90 degrees in the θZ direction together with the suction nozzle 30. Thereby, the electronic component 2 retreats from the area directly below the camera 40.

[0069] The control device 50 moves the camera 40 downward (step SB4). The control device 50 controls the camera moving device 44 to lower the camera 40 in the -Z direction.

[0070] The control device 50 photographs the electronic component 2 for which adsorption has failed by means of the camera 40 (step SB5). The photographing area of the camera 40 can be arbitrarily changed by the operator. That is, during the photographing by the camera 40, the mounting head 22 can be moved by manual operation of the operator.

[0071] [Effect] As described above, according to the present embodiment, since the camera 40 can be moved relative to the nozzle 30 in the Z-axis direction, when the nozzle 30 holds the electronic component 2, the camera 40 can be moved to a position above the lower end of the nozzle 30, and when the camera 40 photographs the substrate 1 or the like, the camera 40 can be moved downward to focus. Thus, for example, even if the mounting head 22 is located at a high position in order to avoid a large electronic component 2, it is possible to focus on the object to be photographed even with a camera 40 having a short focal length. Therefore, it is possible to mount a large electronic component 2 without complicating the movement path of the mounting head 22 or increasing the size of the apparatus by mounting a camera 40 having a long focal length so as not to cause the camera 40 to collide with the electronic components 2 already mounted on the substrate 1.

[0072] In addition, the camera 40 of the embodiment can be moved to a position above the lower end of the nozzle 30 in a state where the nozzle 30 is located at the uppermost +Z side position. Therefore, even in a state where the nozzle 30 is located at an arbitrary height, it is possible to retract to a position above the lower end of the nozzle 30. Therefore, the movement path of the mounting head 22 can be set according to the height of the nozzle 30. In addition, during the period in which the nozzle 30 holds the electronic component 2, it is possible to retract to a position above the electronic component 2 held by the nozzle 30.

[0073] In addition, in the embodiment, a plurality of nozzles 30 are arranged at positions separated in the horizontal direction, and the camera 40 is arranged at the center of the plurality of nozzles 30 when viewed from above. Thus, when thermal expansion occurs in the support member of the nozzle 30 of the mounting head 22 due to environmental changes such as temperature and humidity, it is possible to suppress the influence of changes in the relative distance between each nozzle 30 and the camera 40.

[0074] In addition, in the embodiment, the camera 40 can also be operated in a state where the nozzle 30 holds the electronic component 2. In such a case, if a part of the electronic component 2 held by the nozzle 30 is located directly below the camera 40, when the camera 40 is lowered, interference occurs with the electronic component 2. Therefore, by rotating the nozzle 30 about an axis so that the short side direction of the electronic component 2 is aligned with the direction in which the nozzle 30 and the camera 40 are arranged, the electronic component 2 can be retracted from directly below the camera 40.

[0075] [Other Embodiments] As described above, the embodiments of the present application have been described, but the present invention is not limited to the content of these embodiments. The above embodiments and variations can be appropriately combined within the range where the processing content does not conflict. In addition, among the above components, there are elements that are easily conceivable by those skilled in the art, elements that are substantially the same, and elements within the so-called equivalent range. Furthermore, the above components can be appropriately combined. Furthermore, within the scope not departing from the gist of the above embodiments, various omissions, substitutions, or changes of the components can be made.

[0076] For example, in each of the processes described in the above embodiments, all or part of the processes described as being automatically performed can also be manually performed, or all or part of the processes described as being manually performed can also be automatically performed by a known method. In addition, except for the cases where specifically described, the processing steps, specific names, and information including various data and parameters shown in the above documents and drawings can be arbitrarily changed. For example, the various information shown in each figure is not limited to the information shown in the figure.

[0077] In addition, each component of each device shown in the drawings is a functional concept, and it is not necessarily physically configured as shown in the drawings. That is, the specific manner of dispersion and integration of each device is not limited to the manner shown in the drawings, and all or part of it can be functionally or physically dispersed and integrated in any unit according to various loads, usage conditions, etc. In addition, the above control device 50 may be composed of multiple computers divided into several functions, may exist separately via a network, and several functions of the computer may also have a cloud server that executes various functions in the form of cloud computing. In addition, the program may also be transmitted to the control device 50 via the network. Explanation of reference numerals:

[0078] 1: Substrate; 2: Electronic component; 10: Mounting device; 12: Base component; 14: Conveyor device; 14A: Conveyor belt; 14B: Guide component; 16: Workbench; 18: Workbench moving device; 20: Component supply device; 22: Mounting head; 24: Head moving device; 24X: X-axis moving device; 24Y: Y-axis moving device; 28: Chamber; 30: Nozzle; 30A: Opening; 32: Axis; 34: Nozzle moving device; 40: Camera; 42: Support component; 44: Camera moving device; 50: Control device.

Claims

1. A mounting device, characterized in that: have: Mounting head; A suction nozzle, supported by the mounting head, for holding the electronic component; A nozzle moving device, which moves the nozzle in an axial direction relative to the mounting head; a camera supported by the mounting head and configured to photograph the substrate on which the electronic component is mounted from above; and The camera moving device moves the camera in a vertical direction relative to the suction nozzle.

2. The mounting device according to claim 1, characterized in that: The camera is movable to a position above the lower end of the suction nozzle that is located at the most raised position.

3. The mounting device according to claim 1, characterized in that: When the suction nozzle holds the electronic component, the camera moving device moves the camera to a position above the lower end of the suction nozzle.

4. The mounting device according to claim 1, characterized in that: When the camera captures an image of the substrate, the camera moving device moves the camera downward.

5. The mounting device according to claim 1, characterized in that: The suction nozzle includes a plurality of suction nozzles arranged at positions separated in a horizontal direction, The camera is arranged at the center of the plurality of suction nozzles when viewed from above.

6. The mounting device according to claim 5, characterized in that: When the camera starts photographing while at least one of the plurality of nozzles is holding the electronic component and a portion of the electronic component held by the nozzle is located directly below the camera, The nozzle moving device rotates the nozzle 90 degrees around the axis.

7. A control method for an installation device, characterized in that: include: Moving the mounting head to a predetermined photographing position of a camera, wherein the camera is supported by the mounting head and photographs a substrate on which electronic components are mounted from above; The camera is caused to photograph the substrate while the camera is moved downward relative to a suction nozzle supported by the mounting head and holding the electronic component; as well as The electronic component is held by the suction nozzle in a state where the camera is moved above the suction nozzle.

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