PCB Soldering Machine

Abstract

The present application provides a PCB welding machine, comprising a first folding device, a plate picking device, a welding device, and a transmission mechanism. The first folding device includes a first lifting mechanism and a first bending head, the first lifting mechanism being used to drive the first bending head up and down. The plate picking device is used to fit the PCB onto the second pin of the stator assembly. The welding device includes a welding workbench, a second folding device, a welding mechanism, and a detection mechanism. The welding workbench is used to place the stator assembly. The second folding device is used to bend the second pin to fit the PCB pad. The welding mechanism solders the second pin to the pad. The detection mechanism is used to detect the assembly quality of the PCB and stator assembly. The transmission mechanism is used to transport the stator assembly between the first folding device, the plate picking device, and the welding device. The PCB welding machine automatically completes multiple processes, effectively improving assembly efficiency and can complete assembly of the PCB and stator assembly within 25 seconds.

Description

Technical Field

[0001] The present application belongs to the field of motor assembly equipment, and more specifically, to a PCB welding machine. Background Art

[0002] The drive motor is a common power structure and a key component in related products. Its primary function is to generate driving torque and is an electromagnetic device that converts or transmits electrical energy based on the law of electromagnetic induction. To reduce the size of the drive motor, the stator assembly's windings are soldered to the PCB (Printed Circuit Board) in a plug-in format.

[0003] The existing plug-in PCB soldering process involves the following steps: first, a bending machine is used to bend the first pin of the stator assembly; second, manual material removal is used to insert the unbent second pin of the stator assembly into the PCB; third, the inserted stator assembly and PCB are manually placed into the bending machine; fourth, the bending machine bends the second pin into contact with the PCB pad; and fifth, as described in Chinese patent CN220943590U, the stator assembly and PCB are manually placed onto a carrier assembly. A transmission line then passes the carrier assembly through welding and testing stations, where soldering and testing are performed sequentially. Consequently, existing plug-in PCB soldering solutions involve numerous steps and are inefficient. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a PCB welding machine to solve the problem of low welding efficiency of PCB welding solutions existing in the related art.

[0005] To achieve the above objectives, the technical solutions adopted in the embodiments of the present application are:

[0006] A PCB welding machine is provided, comprising:

[0007] A first bending line device includes a first lifting mechanism and a first bending head, wherein the first bending head has a plurality of pressing blocks distributed at circumferential intervals, and the first lifting mechanism is used to drive the first bending head to move up and down so that the plurality of pressing blocks respectively bend the plurality of first pins of the stator assembly;

[0008] A board picking device, used for sleeve the PCB onto the second pin of the stator assembly;

[0009] A welding device comprising a welding workbench, a second folding line device, a welding mechanism, and a detection mechanism, wherein the welding workbench is used to place the stator assembly, the second folding line device is used to bend the second pin and attach it to the pad of the PCB, the welding mechanism welds the second pin to the pad, and the detection mechanism is used to detect the assembly quality of the PCB and the stator assembly;

[0010] A transmission mechanism is used to transfer the stator assembly between the first folding device, the plate picking device and the welding device.

[0011] In one embodiment, the first folding device further includes a lifting bracket, which is installed at the output end of the first lifting mechanism, and the first bending head and the plate picking device are installed on the lifting bracket at intervals along the horizontal direction.

[0012] In one embodiment, the plate picking device includes a plate picking bracket and a plurality of elastic negative pressure members, the plate picking bracket is mounted on the lifting bracket, and the plurality of elastic negative pressure members are distributed at intervals along the circumference of the plate picking bracket.

[0013] In one embodiment, the plate picking device also includes a rigid limiting column, which is installed on the lifting bracket. The rigid limiting column is arranged parallel to the elastic negative pressure part, and the bottom end of the rigid limiting column is higher than the bottom end of the elastic negative pressure part in the initial state.

[0014] In one embodiment, the bottom end of the rigid limiting column is higher than the bottom end of the elastic negative pressure member when it is at 2 / 3 of the compression limit length.

[0015] In one embodiment, the elastic negative pressure member comprises a rubber suction cup having a vertically penetrating negative pressure hole, and the bottom end of the rubber suction cup is used to directly absorb the PCB.

[0016] In one embodiment, the rubber suction cup includes a first shaft segment, a second shaft segment and a third shaft segment from top to bottom. The outer diameter of the first shaft segment is larger than the outer diameters of the second shaft segment and the third shaft segment. The outer diameter of the second shaft segment gradually decreases and then gradually increases from top to bottom, and the outer diameter of the third shaft segment gradually increases from top to bottom.

[0017] In one embodiment, the plate picking bracket is mounted on the lifting bracket via a buffer rubber sleeve; the elastic modulus of the buffer rubber sleeve is greater than the elastic modulus of the elastic negative pressure member.

[0018] In one embodiment, the plate picking bracket is provided with a travel trigger, and the lifting bracket is provided with a lifting switch, and the lifting switch is electrically connected to the first lifting mechanism.

[0019] In one embodiment, when the buffer rubber sleeve is at 2 / 3 of the compression limit length, the travel triggering member triggers the lifting switch to stop the first lifting mechanism.

[0020] In one embodiment, the second bending line device includes a radial drive mechanism, a second lifting mechanism, a second bending head and a bending jig; the second lifting mechanism and the bending jig are installed on the radial drive mechanism, and move toward or away from the welding workbench under the drive of the radial drive mechanism; the bending jig has a bending positioning opening, which is used to wrap the second pin, and the second bending head is installed on the second lifting mechanism, and the second lifting mechanism drives the second bending head to move from top to bottom into the bending positioning opening.

[0021] In one embodiment, the number of the second folding line devices is two, and the two second folding line devices are located on opposite sides of the welding workbench.

[0022] In one embodiment, the shape of the bending positioning opening is triangular, the width of the bending positioning opening gradually decreases toward the radial driving mechanism, and the shape of the second bending head is adapted to the shape of the bending positioning opening.

[0023] In one embodiment, the welding mechanism includes a third lifting mechanism and a welding head, and the third lifting mechanism drives the welding head to move from top to bottom to approach the welding workbench.

[0024] In one embodiment, the welding head is mounted on the third lifting mechanism via a first rotating mechanism, and the first rotating mechanism drives the welding head to rotate around a vertical direction.

[0025] In one embodiment, the detection mechanism includes two laser radars distributed at intervals, and the two laser radars jointly detect the same welding pad.

[0026] In one embodiment, the welding device further includes a photoelectric detection component, which is electrically connected to the second folding device and is used to detect whether the second pin exists at the working position of the second folding device.

[0027] The PCB welding machine provided by the embodiment of the present application has at least the following beneficial effects: the first lifting mechanism drives the first bending head to descend, and the multiple pressing blocks of the first bending head automatically bend the multiple first pins of the stator assembly; the transmission mechanism automatically transmits the stator assembly to the bottom of the board picking device, and the board picking device picks up the PCB and automatically puts it on the second pin of the stator assembly; the transmission mechanism automatically transmits the put-on stator assembly and PCB to the welding workbench of the welding device; the second folding line device automatically bends the second pin and sticks it on the soldering pad of the PCB; the welding mechanism automatically welds the second pin to the soldering pad to realize the welding and assembly of the PCB and the stator assembly; the detection mechanism detects the assembly quality of the PCB and the stator assembly on site; based on this, the PCB welding machine automatically completes a series of operations such as bending the first pin, inserting the PCB and the stator assembly, bending the second pin, welding and quality inspection, realizing multi-process integrated automated operation, making the assembly process smoother and more efficient, effectively improving the assembly efficiency, and the automated operation reduces the links of manual participation and improves the assembly consistency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or exemplary technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0029] Figure 1 This is a schematic diagram of the assembly of the stator assembly and PCB;

[0030] Figure 2 for Figure 1 A schematic structural diagram of the stator assembly in FIG.

[0031] Figure 3 for Figure 1 Schematic diagram of the structure of the PCB;

[0032] Figure 4 Schematic diagram of the structure of the PCB welding machine in the embodiment of the present application;

[0033] Figure 5 Schematic diagram of the structure of the first folding line device and the board picking device of the PCB welding machine in the embodiment of the present application;

[0034] Figure 6 Schematic diagram of the operation of the first bending head of the first folding device in an embodiment of the present application;

[0035] Figure 7 for Figure 6 A local enlarged view of point A;

[0036] Figure 8Schematic diagram of the working state of the board picking device of the PCB welding machine in the embodiment of the present application;

[0037] Figure 9 A schematic diagram of the structure of the rubber suction cup of the plate picking device;

[0038] Figure 10 Schematic diagram of the operation of the welding device of the PCB welding machine in an embodiment of the present application;

[0039] Figure 11 Schematic diagram of the structure of the second folding line device of the welding device in the embodiment of the present application;

[0040] Figure 12 This is another perspective view of the welding device of the PCB welding machine in the embodiment of the present application;

[0041] Figure 13 This is a detection principle diagram of the detection mechanism of the welding device in an embodiment of the present application.

[0042] Among them, the main marks of the drawings in the figure are:

[0043] 10. Stator assembly; 11. First pin; 12. Second pin; 20. PCB; 21. Solder pad; 22. Limiting notch;

[0044] 100, first folding device; 110, first lifting mechanism; 120, first bending head; 121, pressing block; 130, lifting bracket; 140, lifting switch; 150, folding workbench;

[0045] 200, plate picking device; 210, plate picking bracket; 220, elastic negative pressure member; 221, rubber suction cup; 222, negative pressure hole; 223, first shaft section; 224, second shaft section; 225, third shaft section; 230, rigid limit column; 240, buffer rubber sleeve; 250, travel trigger; 260, plate measuring circuit component;

[0046] 300, welding device; 310, welding workbench; 311, second rotating mechanism; 320, second folding device; 321, radial drive mechanism; 322, second lifting mechanism; 323, second bending head; 324, bending fixture; 325, bending positioning port; 330, welding mechanism; 331, third lifting mechanism; 332, welding head; 333, first rotating mechanism; 340, detection mechanism; 341, laser radar; 342, visual sensor; 350, photoelectric detection assembly;

[0047] 400. Transmission mechanism. DETAILED DESCRIPTION

[0048] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0049] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0050] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" means two or more, unless otherwise clearly and specifically defined. "Several" means one or more, unless otherwise clearly and specifically defined.

[0051] In the description of this application, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0052] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0053] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, when the phrases "in one embodiment" or "in some embodiments" appear in various places throughout this specification, not all references are to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0054] Figure 1 A schematic diagram shows the assembled stator assembly 10 and PCB 20. The first pin 11 of the stator assembly 10 is bent and located at the bottom of the PCB 20, out of the way of the PCB 20. The second pin 12 of the stator assembly 10 passes through the PCB 20, is bent and soldered to the pad 21 on the PCB 20, electrically connecting the stator assembly 10 and PCB 20. The stator assembly 10 and PCB 20 form an assembly. Figure 2 The stator assembly 10 is shown in the figure. The first pin 11 and the second pin 12 have been bent. Before assembly, Figure 2 The first pin 11 and the second pin 12 of the stator assembly 10 are upright, rather than bent, which is required before welding. Figure 3 The PCB 20 in the assembly is shown. Specifically, the PCB 20 is provided with a limiting notch 22, the pad 21 is located at the edge of the limiting notch 22, the second pin 12 passes through the limiting notch 22, and is bent inwardly, attached to the pad 21, and then soldered. Figure 2 and Figure 3 In one embodiment, the stator assembly 10 has six groups of first pins 11, which need to be bent before being inserted into the PCB 20 to avoid interference with the PCB 20. The stator assembly 10 has six groups of second pins 12, which need to pass through the PCB 20 and be soldered to corresponding pads 21. Each group of second pins 12 contains two pins.

[0055] See also Figure 4 The PCB welding machine provided by the embodiment of the present application is now described. The PCB welding machine includes a first folding line device 100, a board picking device 200, a welding device 300 and a transmission mechanism 400. Figure 5 and Figure 6 The first bending device 100 includes a first lifting mechanism 110 and a first bending head 120. The first bending head 120 has a plurality of pressing blocks 121 spaced apart circumferentially. The first lifting mechanism 110 is used to drive the first bending head 120 up and down so that the plurality of pressing blocks 121 respectively bend the plurality of first pins 11 of the stator assembly 10. The board picking device 200 is used to place the PCB 20 onto the second pins 12 of the stator assembly 10.

[0056] See also Figure 10The welding device 300 includes a welding workbench 310, a second folding device 320, a welding mechanism 330, and a detection mechanism 340. The welding workbench 310 is used to place the stator assembly 10. The second folding device 320 is used to bend the second pin 12 and attach it to the pad 21 of the PCB 20. The welding mechanism 330 solders the second pin 12 to the pad 21. The detection mechanism 340 is used to detect the assembly quality of the PCB 20 and the stator assembly 10. The transmission mechanism 400 is used to transfer the stator assembly 10 between the first folding device 100, the board picking device 200, and the welding device 300.

[0057] The specific working process is as follows: the first lifting mechanism 110 drives the first bending head 120 to descend, and the multiple pressing blocks 121 of the first bending head 120 automatically bend the multiple first pins 11 of the stator assembly 10. The transmission mechanism 400 automatically transfers the stator assembly 10 to the bottom of the board picking device 200. The board picking device 200 picks up the PCB20 and automatically puts it on the second pin 12 of the stator assembly 10. The transmission mechanism 400 automatically transfers the nested stator assembly 10 and PCB20 to the welding workbench 310 of the welding device 300. The second folding device 320 automatically bends the second pin 12 and places it on the pad 21 of the PCB20. The welding mechanism 330 automatically welds the second pin 12 to the pad 21 to achieve welding and assembly of the PCB20 and the stator assembly 10. The inspection mechanism 340 inspects the assembly quality of the PCB20 and the stator assembly 10 on site.

[0058] Based on this, the PCB welding machine automatically completes a series of operations such as bending the first pin 11, inserting PCB20 and stator assembly 10, bending the second pin 12, welding and quality inspection, realizing multi-process integrated automated operation, making the assembly process smoother and more efficient, effectively improving assembly efficiency, and automated operation reduces the links of manual participation and improves assembly consistency.

[0059] In one embodiment, refer to 4, the transmission mechanism 400 can be a multi-axis manipulator, a transfer manipulator, a conveyor belt, or a rotating disc, and no sole limitation is made here. For example, the transmission mechanism 400 is a rotating disc, and the first folding device 100, the plate picking device 200, and the welding device 300 are sequentially spaced along the circumference of the rotating disc. The stator assembly 10 is placed on the rotating disc, and as the rotating disc rotates, it passes through the first folding device 100, the plate picking device 200, and the welding device 300 in sequence, and the first pin 11 is bent, the PCB 20 is mounted, and the second pin 12 is bent and welded. For example, the first folding device 100, the plate picking device 200, and the welding device 300 are distributed along a straight line, and the transmission mechanism 400 is a transfer manipulator. The transfer manipulator realizes the linear transport of the stator assembly 10 by clamping the stator assembly 10, and the first pin 11 is bent, the PCB 20 is mounted, and the second pin 12 is bent and welded in sequence.

[0060] In one embodiment, the PCB welding machine includes a control mechanism, which is electrically connected to the first folding line device 100, the board picking device 200, the welding device 300 and the transmission mechanism 400, so that the first folding line device 100, the board picking device 200, the welding device 300 and the transmission mechanism 400 can smoothly perform the processes of bending the first pin 11, threading the PCB 20, bending the second pin 12, welding, and testing according to the production rhythm.

[0061] In one embodiment, see Figure 6 and Figure 7 As a specific embodiment of the PCB welding machine provided in the embodiment of the present application, the pressing block 121 is an arc piece, and multiple pressing blocks 121 are located on the same circumference and are distributed at intervals. Multiple pressing blocks 121 are distributed at intervals along the circumference to form a stable annular structure, which can synchronously position and bend multiple first pins 11 of the stator assembly 10, and ensure that the bending angle and position height of each first pin 11 are consistent, avoiding the offset or angle inconsistency of the first pin 11 caused by single-point pressing, and improving assembly accuracy. The interval between two adjacent pressing blocks 121 forms a space to accommodate the second pin 12, so that when the first pin 11 is bent, the second pin 12 will not be bent.

[0062] In one embodiment, see Figures 5 to 7 As a specific embodiment of the PCB welding machine provided in the embodiment of the present application, the first folding line device 100 also includes a lifting bracket 130, which is installed at the output end of the first lifting mechanism 110, and the first bending head 120 and the plate picking device 200 are installed on the lifting bracket 130 at intervals in the horizontal direction. The first lifting mechanism 110 drives the first bending head 120 and the plate picking device 200 to rise and fall synchronously through the lifting bracket 130, which reduces the power components and makes full use of the space, making the structure of the entire first folding line device 100 more compact, reducing the footprint of the PCB welding machine, and reducing the control difficulty of the PCB welding machine. When the upper stator assembly 10 is bending the first pin 11, the next stator assembly 10 and the PCB 20 are sleeved, which improves the continuity of the operation, and the lifting bracket 130 simultaneously bears the bending reaction force and the sleeve reaction force, which is conducive to force balance.

[0063] In one embodiment, see Figure 4 The first bending device 100 further includes a bending workbench 150 having two workstations, which are respectively located directly below the first bending head 120 and the plate picking device 200. The workstations have positioning holes for limiting the position of the stator assembly 10 to ensure that the stator assembly 10 is stable during operation.

[0064] In one embodiment, the PCB 20 may be loaded onto the board picking device 200 via the transmission mechanism 400 , or may be loaded via other mechanisms, which are not specifically limited herein.

[0065] In one embodiment, see Figure 5 and Figure 8 As a specific embodiment of the PCB welding machine provided in the embodiment of the present application, the board picking device 200 includes a board picking bracket 210 and a plurality of elastic negative pressure members 220. The board picking bracket 210 is installed on the lifting bracket 130, and the plurality of elastic negative pressure members 220 are distributed at intervals along the circumference of the board picking bracket 210. The plurality of elastic negative pressure members 220 work simultaneously to form a multi-point adsorption force to ensure that the PCB20 is subjected to uniform force during the picking process. On the one hand, the elastic negative pressure member 220 has an elastic buffering function, which can adapt to slight deformations or unevenness of the surface of the PCB20, ensure that the adsorption surface is closely fitted with the PCB20, and improve the success rate of picking; on the other hand, it can squeeze out the air through elastic compression to form a larger fitting surface with the PCB20, thereby increasing the adsorption force.

[0066] In one embodiment, see Figure 8 As a specific implementation of the PCB welding machine provided in the embodiment of the present application, the board picking device 200 also includes a rigid limiting column 230. The rigid limiting column 230 is installed on the lifting bracket 130. The rigid limiting column 230 is arranged parallel to the elastic negative pressure member 220. The bottom end of the rigid limiting column 230 is higher than the bottom end of the elastic negative pressure member 220 in the initial state. When the board picking device 200 descends, the bottom end of the elastic negative pressure member 220 contacts the PCB 20 before the rigid limiting column 230, thereby achieving flexible pressing of the PCB 20 and avoiding damage to the PCB 20. As the elastic negative pressure member 220 descends and compresses, increasing the adsorption area, the rigid limiting column 230 abuts against the PCB 20, limiting excessive compression of the elastic negative pressure member 220, and indicating that the elastic negative pressure member 220 has been adsorbed in place.

[0067] Specifically, the bottom end of the rigid limiting post 230 is higher than the bottom end of the elastic negative pressure member 220 when it is at 2 / 3 of its maximum compression length. For example, if the maximum compression length of the elastic negative pressure member 220 is 3 cm, when the elastic negative pressure member 220 is compressed to 2 cm, the bottom end of the rigid limiting post 230 contacts the PCB 20, limiting further compression of the elastic negative pressure member 220. As a result, the maximum compression of the elastic negative pressure member 220 is 2 cm.

[0068] Based on this, the elastic negative pressure member 220 will suffer fatigue damage during repeated compression and release, with greater compression resulting in more severe fatigue damage. By adjusting the height of the rigid limiter 230, the maximum compression of the elastic negative pressure member 220 can be precisely controlled to 2 / 3 of its maximum compression length, preventing degradation or failure of elastic properties due to excessive compression, thereby maintaining stable operation of the plate pickup device 200. At the same time, excessive compression can also result in an excessively large contact area for the elastic negative pressure member 220, increasing the risk of leakage.

[0069] In a specific embodiment, combining Figure 5 and Figure 8 The board pickup device 200 also includes a board testing circuit component 260. The rigid limiting posts 230 are conductive and electrically connected to the board testing circuit component 260. There are three rigid limiting posts 230. When the first rigid limiting post 230 contacts the PCB 20, a test voltage is supplied to the PCB 20. When the second rigid limiting post 230 contacts the PCB 20, the real-time voltage of the PCB 20 is obtained. When the third rigid limiting post 230 contacts the PCB 20, the real-time current at the contact point of the PCB 20 is obtained. The board testing circuit component 260 adjusts the test voltage in real time according to the real-time current until the measured real-time voltage reaches a preset voltage value. This avoids voltage drops caused by intermediate transmission components such as the rigid limiting posts 230, which may cause the actual test voltage of the PCB 20 to be lower than the preset test voltage, thereby causing errors in the test of the board testing circuit component 260, thereby improving test accuracy.

[0070] In one embodiment, see Figure 8 and Figure 9 As a specific implementation of the PCB welding machine provided in an embodiment of the present application, the elastic negative pressure member 220 includes a rubber suction cup 221. The rubber suction cup 221 has a vertically extending negative pressure hole 222. The bottom end of the rubber suction cup 221 is used to directly adsorb the PCB 20. The rubber suction cup 221 includes a first shaft segment 223, a second shaft segment 224, and a third shaft segment 225 from top to bottom. The outer diameter of the first shaft segment 223 is larger than the outer diameters of the second shaft segment 224 and the third shaft segment 225. The outer diameter of the second shaft segment 224 gradually decreases and then gradually increases from top to bottom, and the outer diameter of the third shaft segment 225 gradually increases from top to bottom.

[0071] Based on this, the first shaft segment 223 has a large outer diameter, which increases the installation area and enables stable installation of the rubber suction cup 221. The second shaft segment 224 changes its outer diameter by first shrinking and then expanding. The outer diameter of the middle position of the second shaft segment 224 is small, which is easy to compress and deform at both ends, thereby improving the elastic deformation ability of the rubber suction cup 221. The outer diameter of the third shaft segment 225 gradually increases, forming a "bell-mouth" shape. The bottom increases the adsorption area, increases the contact area with the surface of PCB20, reduces air leakage, and improves the adsorption force; the top has a small outer diameter, which makes it easy for the bottom of the third shaft segment 225 to turn outward, further expanding the adsorption area and improving the elastic deformation ability of the third shaft segment 225. This makes the contact between the bottom of the rubber suction cup 221 and the surface of PCB20 softer, reducing mechanical damage to PCB20.

[0072] Specifically, among the first shaft segment 223, the second shaft segment 224 and the third shaft segment 225, the outer diameter of the first shaft segment 223 is the largest, and the thickness of the first shaft segment 223 is the largest, which enhances the structural strength, resists compression and bending deformation, provides a stable support foundation, avoids the position deviation of PCB20 caused by the shaking of the rubber suction cup 221, ensures the picking accuracy, ensures the alignment of PCB20 with the second pin 12, and prevents excessive deformation of the rubber suction cup 221.

[0073] Specifically, the thickness of the second shaft segment 224 and the third shaft segment 225 remains unchanged, so the negative pressure holes 222 of the second shaft segment 224 and the third shaft segment 225 change with the change of their outer diameters, and the diameters of the negative pressure holes 222 are precisely controlled, that is, the negative pressure holes 222 in the second shaft segment 224 first gradually shrink and then gradually expand, and the negative pressure holes 222 in the third shaft segment 225 gradually expand, which is beneficial to the elastic deformation of the second shaft segment 224 and the third shaft segment 225, and improves the deformation ability of the rubber suction cup 221.

[0074] In one embodiment, see Figure 8 and Figure 9 As a specific embodiment of the PCB welding machine provided in the embodiment of the present application, the board pick-up bracket 210 is mounted on the lifting bracket 130 via a cushioning rubber sleeve 240. The cushioning rubber sleeve 240 acts as a flexible medium to absorb impact energy, thereby preventing the board pick-up bracket 210 and the lifting bracket 130 from impacting each other during the downward pressing process of the board pick-up bracket 210.

[0075] Specifically, the elastic modulus of the buffer rubber sleeve 240 is greater than the elastic modulus of the elastic negative pressure member 220. The elastic negative pressure member 220 is first elastically compressed and deformed. After the deformation of the elastic negative pressure member 220 is stable, the buffer rubber sleeve 240 is elastically deformed again. During the downward movement of the board picking device 200, the elastic negative pressure member 220 is first elastically deformed, so that the PCB 20 is flexibly aligned with the stator assembly 10. For example, the limiting notch 22 of the PCB 20 is aligned with the second pin 12 of the stator assembly 10, avoiding hard contact between the PCB 20 and the stator assembly 10, absorbing most of the impact force, reducing the impact of the board picking bracket 210 on the PCB 20, and also reducing the difficulty of aligning the PCB 20 and the stator assembly 10. After alignment, the PCB 20 fits against the top of the stator assembly 10 and the elastic negative pressure member 220 continues to deform elastically until the preset pressing force is reached. The buffer rubber sleeve 240 begins to deform elastically, avoiding excessive contact stress between the PCB 20 and the stator assembly 10 and mutual wear, thereby playing a protective role.

[0076] In one embodiment, see Figure 8 and Figure 9 As a specific embodiment of the PCB welding machine provided in an embodiment of the present application, the board pick-up bracket 210 is provided with a travel trigger 250, and the lift bracket 130 is provided with a lift switch 140. The lift switch 140 is electrically connected to the first lift mechanism 110. Based on this, when the buffer rubber sleeve 240 is compressed, the board pick-up bracket 210 moves upward relative to the lift bracket 130 until the travel trigger 250 moves upward to trigger the lift switch 140, causing the first lift mechanism 110 to stop driving the lift bracket 130 downward, thereby reducing wear, fatigue, and overload damage to the PCB 20.

[0077] Specifically, when the cushioning rubber sleeve 240 is at 2 / 3 of its maximum compression length, the travel trigger 250 triggers the lift switch 140, shutting down the first lift mechanism 110. In other words, when the cushioning rubber sleeve 240 is compressed to 2 / 3 of its maximum length, the contact pressure between the board pickup bracket 210 and the PCB 20 reaches a safety threshold. The travel trigger 250 triggers the lift switch 140, immediately shutting down the first lift mechanism 110. This precisely controls the maximum compression of the cushioning rubber sleeve 240 to 2 / 3 of its maximum compression length, preventing the board pickup bracket 210 from further downward pressure and thus preventing deformation, cracking, or damage to internal components of the PCB 20 caused by excessive downward pressure.

[0078] In one embodiment, see Figure 10 and Figure 11As a specific embodiment of the PCB welding machine provided in the embodiment of the present application, the second folding line device 320 includes a radial driving mechanism 321, a second lifting mechanism 322, a second bending head 323 and a bending jig 324. The second lifting mechanism 322 and the bending jig 324 are installed on the radial driving mechanism 321, and move toward or away from the welding workbench 310 under the drive of the radial driving mechanism 321. The bending jig 324 has a bending positioning opening 325, and the bending positioning opening 325 is used to wrap the second pin 12. The second bending head 323 is installed on the second lifting mechanism 322, and the second lifting mechanism 322 drives the second bending head 323 to move from top to bottom into the bending positioning opening 325.

[0079] The radial drive mechanism 321 drives the second lifting mechanism 322 and the bending jig 324 to move simultaneously toward the welding workbench 310, so that the bending positioning opening 325 of the bending jig 324 surrounds the second pin 12. At this time, the second bending head 323 is located above the bending jig 324, and the second lifting mechanism 322 drives the second bending head 323 to descend, inserting it into the bending positioning opening 325, pressing and bending the second pin 12 located in the bending positioning opening 325 and attaching it to the pad 21 of the PCB 20. Based on this, the bending positioning opening 325 of the bending jig 324 wraps around the second pin 12, fixing the position of the second pin 12, ensuring that the second pin 12 does not deviate during the bending process, and improving the bending accuracy.

[0080] In one embodiment, see Figure 11 As a specific implementation of the PCB welding machine provided in an embodiment of the present application, the shape of the bending positioning opening 325 is triangular, the width of the bending positioning opening 325 gradually decreases toward the direction approaching the radial driving mechanism 321, and the shape of the second bending head 323 is adapted to the shape of the bending positioning opening 325.

[0081] As the radial drive mechanism 321 is driven, the bending jig 324 gradually approaches the second pin 12. The wide base of the bending opening 325 guides the second pin 12 into the opening and gradually and precisely clamps it at the top corner of the triangular opening 325, effectively limiting the radial freedom of the second pin 12 and preventing it from shifting due to vibration or external forces during the bending process, ensuring the accuracy of the bending angle and position. The triangular shape of the second bending head 323 fits perfectly with the bending opening 325, forming a rigid constraint that further reduces the shaking of the second pin 12.

[0082] In one embodiment, see Figure 10As a specific embodiment of the PCB welding machine provided in this application, two second bending devices 320 are provided, located on opposite sides of the welding workbench 310. These two second bending devices 320 can simultaneously bend the second pins 12 on both sides of the stator assembly 10, doubling the efficiency. Simultaneous bending of both sides of the stator assembly 10 ensures uniform force on the stator assembly 10 and the PCB 20, preventing component tilt or warping caused by unilateral bending.

[0083] In one embodiment, see Figure 10 As a specific embodiment of the PCB welding machine provided in an embodiment of the present application, the welding mechanism 330 includes a third lifting mechanism 331 and a welding head 332. The third lifting mechanism 331 drives the welding head 332 to move from top to bottom to approach the welding workbench 310, thereby performing a welding operation on the stator assembly 10 and the PCB 20 located on the welding workbench 310. At this time, the second pin 12 has been bent and attached to the welding pad 21. By heating the welding pad 21, the second pin 12 and the welding pad 21 can be welded and fixed. When not in operation, the welding head 332 can be fully raised away from the welding workbench 310 to leave space for the stator assembly 10 to be taken in and visually inspected.

[0084] In one embodiment, see Figure 10 As a specific embodiment of the PCB welding machine provided in an embodiment of the present application, a welding head 332 is mounted on a third lifting mechanism 331 via a first rotating mechanism 333. The first rotating mechanism 333 drives the welding head 332 to rotate vertically, thereby performing welding operations on second pins 12 and pads 21 located in different circumferential directions. Based on this, only one welding head 332 is required, and there is no need to manually replace the welding head 332 or adjust the position of the stator assembly 10. The first rotating mechanism 333 can be used to quickly switch welding angles, while also reducing the angular placement accuracy of the stator assembly 10 on the welding workbench 310. The first rotating mechanism 333 can be a rotary motor.

[0085] In one embodiment, see Figure 10 As a specific embodiment of the PCB welding machine provided in an embodiment of the present application, the welding workbench 310 is provided with a positioning turntable, which is used to position and place the stator assembly 10. A second rotating mechanism 311 is installed below the welding workbench 310. The second rotating mechanism 311 is used to drive the positioning turntable to rotate, thereby achieving rotation of the stator assembly 10 and the PCB 20, so that the second pin 12 of the stator assembly 10 and the soldering pad 21 of the PCB 20 rotate, adapting the second folding device 320 and the welding mechanism 330 to different angular positions. The second rotating mechanism 311 can be a rotary motor.

[0086] In one embodiment, see Figure 10 As a specific embodiment of the PCB welding machine provided in an embodiment of the present application, the welding device 300 further includes a photoelectric detection component 350. The photoelectric detection component 350 is electrically connected to the second folding device 320 and is used to detect whether the second pin 12 is present at the operating position of the second folding device 320. The photoelectric detection component 350 can determine in real time whether the second pin 12 is present at the operating position of the second folding device 320. If the second pin 12 is not detected, the second folding device 320 can pause to avoid ineffective bending.

[0087] Specifically, due to the small size of the second pin 12 and the pad 21, the photoelectric detection component 350 continuously detects the second pin 12 within the first preset time, determines that the second pin 12 is in place, and then the second folding device 320 starts to operate. Optionally, the first preset time is 3s to 5s.

[0088] In one embodiment, see Figure 10 As a specific embodiment of the PCB welding machine provided in an embodiment of the present application, there are two photoelectric detection assemblies 350, located on opposite sides of the welding workbench 310. The two photoelectric detection assemblies 350 respectively detect opposite sides of the stator assembly 10 and the PCB 20, implementing dual-station detection. After detection by the two photoelectric detection assemblies 350, the two second folding devices 320 respectively bend the second pins 12 of the two stations. There are two welding heads 332, located on radially opposite sides of the welding workbench 310, implementing welding operations at two stations.

[0089] In one embodiment, see Figure 12 As a specific embodiment of the PCB welding machine provided in the embodiment of the present application, the detection mechanism 340 includes two laser radars 341 spaced apart from each other. The two laser radars 341 jointly detect the same pad 21. The two laser radars 341 scan from different angles, complementing blind spots and obtaining more complete three-dimensional data.

[0090] Specifically, see Figure 12 and Figure 13 The two laser radars 341 are symmetrically distributed about the midline of the line connecting them. The light emission angles of the two laser radars 341 are respectively directed toward the midline of the line connecting them, and the light emission angles are the same. Each laser radar 341 emits three detection beams.

[0091] The detection light L at the bottom of the two laser radars 341 forms two waists of an isosceles triangle, which intersect at the bottom of the current pad 21 and are used to detect whether the pad 21 is detached.

[0092] The detection light M in the middle of the two laser radars 341 forms the two waists of an isosceles triangle, which is preset to intersect at the middle of the current pad 21. When the pad 21 and the second pin 12 are normally soldered, the detection light M contacts the solder, that is, the left and right edges of the second pin 12 are covered, and the soldering is qualified; if the detection light M contacts the pad 21 or the second pin 12, it means that the pad 21 and the second pin 12 are not soldered or the bottom of the second pin 12 is soldered but the left and right edges are not covered by the solder, the soldering area is small, and the soldering is unqualified.

[0093] The detection light N above the two laser radars 341 forms the two legs of an isosceles triangle, which intersects at the top of the current second pin 12 and is used to detect whether the solder covers the second pin 12. If the solder does not cover the second pin 12, the second pin 12 is likely to detach from the pad 21, and the soldering stability is poor.

[0094] In one embodiment, see Figure 12 and Figure 13 As a specific embodiment of the PCB welding machine provided in an embodiment of the present application, the detection mechanism 340 includes a camera located at the midpoint of the line connecting the two laser radars 341. The camera is used to capture a top-down image of the solder joint between the second pin 12 and the pad 21. The top-down image shows the relative position of the second pin 12 and the pad 21, the solder coverage, and the shape of the solder joint, further improving the level of solder quality detection.

[0095] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A PCB welding machine, characterized in that: include: A first bending line device includes a first lifting mechanism and a first bending head, wherein the first bending head has a plurality of pressing blocks distributed at circumferential intervals, and the first lifting mechanism is used to drive the first bending head to move up and down so that the plurality of pressing blocks respectively bend the plurality of first pins of the stator assembly; A board picking device, used for sleeve the PCB onto the second pin of the stator assembly; The welding device includes a welding workbench, a second folding line device, a welding mechanism and a detection mechanism, wherein the welding workbench is used to place the stator assembly, the second folding line device is used to bend the second pin and attach it to the pad of the PCB, the welding mechanism welds the second pin and the pad, and the detection mechanism is used to detect the assembly quality of the PCB and the stator assembly; the second folding line device includes a radial drive mechanism, a second lifting mechanism, a second bending head and a bending jig; the second lifting mechanism and the bending jig are installed on the radial drive mechanism and move toward or away from the welding workbench under the drive of the radial drive mechanism; the bending jig has a bending positioning opening, which is used to wrap the second pin, and the second bending head is installed on the second lifting mechanism, which drives the second bending head to move from top to bottom into the bending positioning opening; A transmission mechanism is used to transfer the stator assembly between the first folding device, the plate picking device and the welding device.

2. The PCB welding machine according to claim 1, wherein: The first folding device further includes a lifting bracket, which is installed at the output end of the first lifting mechanism. The first bending head and the plate picking device are installed on the lifting bracket at intervals along the horizontal direction.

3. The PCB welding machine according to claim 2, wherein: The plate picking device includes a plate picking bracket and a plurality of elastic negative pressure members. The plate picking bracket is mounted on the lifting bracket. The plurality of elastic negative pressure members are distributed at intervals along the circumference of the plate picking bracket.

4. The PCB welding machine according to claim 3, wherein: The plate picking device also includes a rigid limiting column, which is installed on the lifting bracket. The rigid limiting column is arranged parallel to the elastic negative pressure part. The bottom end of the rigid limiting column is higher than the bottom end of the elastic negative pressure part in the initial state. The bottom end of the rigid limiting column is higher than the bottom end of the elastic negative pressure part when it is at 2 / 3 of the compression limit length.

5. The PCB welding machine according to claim 3, wherein: The elastic negative pressure member includes a rubber suction cup having a vertically extending negative pressure hole. The bottom end of the rubber suction cup is used to directly adsorb the PCB. The rubber suction cup includes a first shaft segment, a second shaft segment, and a third shaft segment from top to bottom. The outer diameter of the first shaft segment is larger than the outer diameters of the second shaft segment and the third shaft segment. The outer diameter of the second shaft segment gradually decreases and then gradually increases from top to bottom, and the outer diameter of the third shaft segment gradually increases from top to bottom.

6. The PCB welding machine according to claim 3, wherein: The plate picking bracket is mounted on the lifting bracket via a buffer rubber sleeve; the elastic modulus of the buffer rubber sleeve is greater than the elastic modulus of the elastic negative pressure member; The plate picking bracket is provided with a travel trigger, and the lifting bracket is provided with a lifting switch. The lifting switch is electrically connected to the first lifting mechanism. When the buffer rubber sleeve is at 2 / 3 of the compression limit length, the travel trigger triggers the lifting switch to stop the first lifting mechanism.

7. The PCB welding machine according to claim 1, wherein: There are two second folding line devices, and the two second folding line devices are located on opposite sides of the welding workbench; And / or, the shape of the bending positioning opening is triangular, the width of the bending positioning opening gradually decreases toward the direction approaching the radial driving mechanism, and the shape of the second bending head is adapted to the shape of the bending positioning opening.

8. The PCB welding machine according to any one of claims 1 to 7, wherein: The welding mechanism includes a third lifting mechanism and a welding head, wherein the third lifting mechanism drives the welding head to move from top to bottom to approach the welding workbench; The welding head is mounted on the third lifting mechanism via a first rotating mechanism, and the first rotating mechanism drives the welding head to rotate around a vertical direction.

9. The PCB welding machine according to any one of claims 1 to 7, wherein: The detection mechanism includes two laser radars distributed at intervals, and the two laser radars jointly detect the same welding pad; And / or, the welding device further includes a photoelectric detection component, the photoelectric detection component is electrically connected to the second folding device, and the photoelectric detection component is used to detect whether the second pin is present at the working position of the second folding device.

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