Three-dimensional surface processing method, device, equipment, system and storage medium

Abstract

The invention discloses a three-dimensional surface processing method, device, equipment, system and a storage medium, and the three-dimensional surface processing method comprises the following steps: obtaining a three-dimensional model and a first processing graph of a to-be-processed object, and rendering the first processing graph to the three-dimensional model to obtain a second processing graph; layering the second processing pattern to obtain a plurality of processing layers arranged along the Z-axis direction and processing sub-patterns distributed on each processing layer; and according to the processing sub-graph on each processing layer, a processing path of each processing layer is determined, a processing path of the second processing graph is obtained, and layered processing is carried out on the to-be-processed object based on the processing path of the second processing graph. The method and the device are used for solving the problem of pattern distortion caused by influence of change of a three-dimensional surface on pattern processing while realizing three-dimensional surface processing, optimizing the processing effect and improving the processing efficiency.

Description

Technical Field

[0001] The present application relates to the field of CNC machining technology, and in particular to a three-dimensional surface machining method, device, equipment, system and storage medium. Background Art

[0002] At present, most of the existing laser processing technologies are based on plane processing and lack three-dimensional surface processing. When processing three-dimensional surfaces, it is impossible to design the processing path in combination with the processing graphics and the changes in the three-dimensional surface. As a result, the three-dimensional surface can easily affect the graphics processing during processing. The processed graphics are distorted due to the changes in the three-dimensional surface, affecting the processing effect.

[0003] In addition, because the Z-axis load of the processing head of the existing processing equipment is large, when the processing thickness is too large, the movement speed and acceleration of the processing head in the Z-axis direction are very different from the movement speed and acceleration in the X-axis and Y-axis directions, and the three-axis linkage cannot be well realized, affecting the processing efficiency.

[0004] Therefore, how to avoid the impact of three-dimensional changes on graphic processing while achieving three-dimensional surface processing, and optimize processing effects and improve processing efficiency have become technical problems that need to be solved at present. Summary of the invention

[0005] The main purpose of this application is to provide a three-dimensional surface processing method, device, equipment, system and storage medium, aiming to solve the technical problems of how to realize three-dimensional surface processing, and how to avoid graphic distortion and deformation and improve processing efficiency while realizing three-dimensional surface processing.

[0006] To achieve the above purpose, the present application proposes a three-dimensional surface processing method, comprising the following steps:

[0007] Acquire a three-dimensional model of the object to be processed and a first processing graphic, render the first processing graphic to the three-dimensional model, and obtain a second processing graphic;

[0008] The second processing pattern is layered to obtain multiple processing layers arranged along the Z-axis direction and the processing sub-patterns distributed on each processing layer;

[0009] According to the processing sub-graphics on each processing layer, the processing path of each processing layer is determined, and the processing path of the second processing graphic is obtained, so as to perform layered processing on the object to be processed based on the processing path of the second processing graphic.

[0010] In one embodiment, the step of layering the second processing pattern to obtain multiple processing layers arranged along the Z-axis direction specifically includes:

[0011] Get layer height setting information;

[0012] The second processing pattern is layered according to the layer height setting information to obtain multiple processing layers arranged along the Z-axis direction.

[0013] In one embodiment, the step of layering the second processed pattern specifically includes:

[0014] Pre-stratifying the second processing pattern with a first preset number of layers to obtain a multi-layer pre-stratification; if the middle processing layer in the multi-layer pre-stratification does not correspond to the midpoint position of the second processing pattern, adjusting the height of each layer of the pre-stratification and / or the first preset number of layers to make the middle processing layer correspond to the midpoint position of the second processing pattern;

[0015] Alternatively, an intermediate reference layer of the second processed pattern is determined according to the midpoint position of the second processed pattern, and the second processed pattern is pre-layered based on the intermediate reference layer.

[0016] In one embodiment, from top to bottom along the Z-axis direction, the processing surface of the next processing layer is not smaller than the processing surface of the previous processing layer.

[0017] In one embodiment, after executing the steps of obtaining multiple processing layers arranged along the Z-axis direction and obtaining processing sub-patterns distributed on each processing layer, the three-dimensional surface processing method further includes the following steps:

[0018] The interactive interface of the terminal previews and displays the effect of the processed sub-graphics on each processing layer on the three-dimensional model.

[0019] In one embodiment, the step of determining the processing path of each processing layer according to the processing sub-graph on each processing layer specifically includes:

[0020] According to the processing sub-graphics on each processing layer, the layer processing start point and the layer processing end point of each processing layer are determined, and the processing path is determined according to the layer processing start point and the layer processing end point.

[0021] In one embodiment, the step of determining a layer processing start point and a layer processing end point of each processing layer according to the processing sub-graphics on each processing layer, and determining the processing path according to the layer processing start point and the layer processing end point specifically includes:

[0022] If there is an interlayer intersection point between adjacent processing layers, determining the processing end point of the previous processing layer and the processing starting point of the next processing layer respectively according to the interlayer intersection point, so that the distance between the layer processing starting point of the next processing layer and the layer processing end point of the previous processing layer is minimized;

[0023] If there is no interlayer intersection between adjacent processing layers, the processing end point of the previous processing layer and the processing starting point of the next processing layer are determined respectively according to the two graphic points in the adjacent processing layers that are closest in position along the Z-axis direction, so that the distance between the layer processing starting point of the next processing layer and the layer processing end point of the previous processing layer is minimized.

[0024] In one embodiment, obtaining the processing sub-patterns distributed on each processing layer comprises the following steps:

[0025] Obtaining the intersection of the second processing pattern and each processing layer;

[0026] Based on the intersection points between the second processing pattern and each processing layer, the second processing pattern is segmented to obtain processing sub-patterns distributed on each processing layer.

[0027] In one embodiment, the method is used to control processing equipment, the processing equipment includes a processing head, and the step of performing layered processing on the object to be processed based on the processing path of the second processing graphic includes:

[0028] Control the processing head to process a processing sub-graphic of a current processing layer on the object to be processed;

[0029] If the processing sub-pattern of the current processing layer is completed, the processing head is moved along the Z-axis direction or the focal length of the processing head is adjusted so that the focus of the processing head moves to the next processing layer;

[0030] The object to be processed is processed based on the processing sub-graph on the processing layer of the next layer.

[0031] In addition, to achieve the above-mentioned purpose, the present application also proposes a three-dimensional surface processing device, comprising:

[0032] A graphics acquisition module, used to acquire a three-dimensional model of the object to be processed and a first processing graphic, and render the first processing graphic to the three-dimensional model to obtain a second processing graphic;

[0033] A layering module, used for layering the second processing pattern to obtain multiple processing layers arranged along the Z-axis direction and to obtain processing sub-patterns distributed on each processing layer;

[0034] A path determination module is used to determine the processing path of each processing layer according to the processing sub-graphics on each processing layer, obtain the processing path of the second processing graphic, and perform layered processing on the object to be processed based on the processing path of the second processing graphic.

[0035] In addition, to achieve the above purpose, the present application also proposes a processing device, including:

[0036] Processing head;

[0037] A communication component, the communication component is used to receive a processing instruction obtained according to the steps of the three-dimensional surface processing method as described above;

[0038] A controller is used to control the processing head to perform layered processing on the object to be processed based on a processing instruction.

[0039] In one embodiment, the controller is used to:

[0040] Control the processing head to process a processing sub-graphic of a current processing layer on the object to be processed;

[0041] If the processing sub-pattern of the current processing layer is completed, the processing head is moved along the Z-axis direction or the focal length of the processing head is adjusted so that the focus of the processing head moves to the next processing layer;

[0042] The object to be processed is processed based on the processing sub-graph on the processing layer of the next layer.

[0043] In addition, to achieve the above purpose, the present application also proposes a processing system, comprising:

[0044] A processing device, the processing device comprising a base plate and a processing head, the base plate comprising a processing area for placing an object to be processed, and the processing head for processing the object to be processed located in the processing area; and

[0045] A terminal device that communicates with the processing equipment, wherein the terminal device is used to execute the processing instructions generated by the three-dimensional surface processing method as described above, and send the processing instructions to the processing equipment.

[0046] In addition, to achieve the above-mentioned purpose, the present application also proposes an electronic device, including a memory, a processor and a three-dimensional surface processing program stored in the memory, characterized in that the processor executes the three-dimensional surface processing program to implement the steps of the three-dimensional surface processing method as described above.

[0047] In addition, to achieve the above-mentioned purpose, the present application also proposes a computer-readable storage medium, on which a three-dimensional surface processing program is stored. When the three-dimensional surface processing program is executed by a processor, the steps of the three-dimensional surface processing method described above are implemented.

[0048] In addition, to achieve the above-mentioned purpose, the present application also proposes a computer program product, including a three-dimensional surface processing program, which implements the steps of the three-dimensional surface processing method described above when executed by a processor.

[0049] One or more technical solutions proposed in this application have at least the following technical effects:

[0050] After obtaining multiple processing layers by layering, the processing sub-graphics on each processing layer can be intuitively displayed and the processing path of each processing layer can be determined, so as to realize the processing of the first processing graphic on the three-dimensional model of the object to be processed, avoid the situation where the processed graphics are distorted and deformed due to the influence of the three-dimensional surface on the graphics processing, and do not meet the actual requirements, so as to effectively optimize the processing effect; it is also convenient to control the processing, and avoid the need to adjust the processing position of the processing head multiple times due to unclear processing path planning, which affects the processing effect and processing progress; through layered processing, the thickness of the processing layer can be reduced, the processing speed of the processing head can be increased, three-axis linkage can be realized, the processing time can be reduced, and the processing accuracy and processing efficiency can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0052] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0053] Figure 1 A schematic diagram of a flow chart of an embodiment of a three-dimensional surface processing method of the present application;

[0054] Figure 2a A schematic diagram of an embodiment of a three-dimensional model of a three-dimensional surface processing method of the present application;

[0055] Figure 2b A schematic diagram of an embodiment of a first processing pattern of a three-dimensional surface processing method of the present application;

[0056] Figure 2c A schematic diagram of an embodiment of a second processing pattern of the three-dimensional surface processing method of the present application;

[0057] Figure 3 A schematic diagram of another embodiment of a second processing pattern of the three-dimensional surface processing method of the present application;

[0058] Figure 4 A schematic diagram showing the existence of an interlayer intersection point between adjacent processing layers in the three-dimensional surface processing method of the present application;

[0059] Figure 5 A specific flow chart of step S200 of an embodiment of the three-dimensional surface processing method of the present application is provided;

[0060] Figure 6A specific flow chart of step S200 of another embodiment of the three-dimensional surface processing method of the present application is provided;

[0061] Figure 7 A schematic diagram showing a preview of a three-dimensional surface processing method of the present application showing a plurality of processing layers according to an embodiment;

[0062] Figure 8 A specific flow chart of step S200 of another embodiment of the three-dimensional surface processing method of the present application is provided;

[0063] Fig. 9 A specific flow chart of step S100 of an embodiment of the three-dimensional surface processing method of the present application is provided;

[0064] Fig.10 One of the schematic diagrams of the calibration process of one embodiment of the three-dimensional surface processing method of the present application;

[0065] Fig.11 The second schematic diagram of the calibration process of one embodiment of the three-dimensional surface processing method of the present application;

[0066] Fig.12 One of the schematic diagrams of the measurement process of one embodiment of the three-dimensional surface processing method of the present application;

[0067] Fig.13 The second schematic diagram of the measurement process of one embodiment of the three-dimensional surface processing method of the present application;

[0068] Fig.14 One of the schematic diagrams of an embodiment of constructing a three-dimensional surface according to an embodiment of a three-dimensional surface processing method of the present application;

[0069] Fig.15 A second schematic diagram of an embodiment of constructing a three-dimensional surface according to an embodiment of the three-dimensional surface processing method of the present application;

[0070] Fig.16 A third schematic diagram of an embodiment of constructing a three-dimensional surface according to an embodiment of the three-dimensional surface processing method of the present application;

[0071] Fig.17 A fourth schematic diagram of an embodiment of constructing a three-dimensional surface according to an embodiment of the three-dimensional surface processing method of the present application;

[0072] Figures 18(a) to 18(e) A fifth schematic diagram of an embodiment of generating a three-dimensional model according to an embodiment of the three-dimensional surface processing method of the present application;

[0073] Fig.19 A schematic diagram of an embodiment of generating a processing instruction of an embodiment of a three-dimensional surface processing method of the present application;

[0074] Fig. 20 A schematic structural diagram of an embodiment of a three-dimensional surface processing device of the present application;

[0075] Fig.21 A schematic structural diagram of an embodiment of a processing device of the present application;

[0076] Fig. 22 It is a schematic diagram of an embodiment of a processing system of the present application.

[0077] Description of Figure Numbers:

[0078] 10. Laser processing equipment; 110. Processing components; 120. Lifting structure; 130. Bottom plate;

[0079] 20. Terminal equipment;

[0080] 301. Image acquisition module; 302. Layering module; 303. Path determination module.

[0081] The purpose, features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0082] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application and are not used to limit the present application.

[0083] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0084] In the related technologies, laser processing technology is mostly based on plane processing and lacks three-dimensional surface processing, where three-dimensional surfaces include but are not limited to curved surfaces, inclined surfaces, stepped surfaces, etc., which are not listed here one by one. Because it is impossible to design the processing path in combination with the processing graphics and the changes of the three-dimensional surface during the three-dimensional surface processing, it is easy for the three-dimensional surface to affect the graphics processing during processing, and the processed graphics are distorted due to the changes of the three-dimensional surface, affecting the processing effect.

[0085] In addition, the processing head of the processing equipment in the related technology has a large load in the Z-axis direction. When the processing thickness is too large, the movement speed and acceleration of the processing head in the Z-axis direction are significantly different from the movement speed and acceleration in the X-axis and Y-axis directions, and the three-axis linkage cannot be well realized, which seriously affects the processing efficiency.

[0086] The main solution of the embodiment of the present application is to optimize the processing effect while realizing three-dimensional surface processing, and avoid the technical problem of graphic distortion caused by the change of three-dimensional surface. The present application provides users with a three-dimensional surface processing method, device, equipment, system and storage medium. Figures 1 to 22First, the processing graphics are deformed according to the contour of the object to be processed, and then the deformed graphics are layered according to the height, and then processed layer by layer; and after the layers are divided, the processing head and other hardware are controlled by controlling the lifting and lowering of the processing head and the operation of the galvanometer or XY drive mechanism to realize the layered processing of the three-dimensional surface, so as to optimize the processing effect and processing efficiency while realizing the three-dimensional surface processing.

[0087] The three-dimensional surface processing method provided in the present application can be applied to processing equipment (such as laser processing equipment), or can be implemented by a control device such as an electronic device storing a three-dimensional surface processing program. Among them, the laser processing equipment can be but not limited to laser cutting equipment. The laser processing equipment includes a processing head, a communication component and a controller. Among them, the processing head can be but not limited to a laser head, a cutting head, a pen head, and a drill head; the laser processing equipment also includes a Z-axis lifting structure. Taking the laser head as an example, the laser head can scan and process the object to be processed along the X-axis and Y-axis directions, and the Z-axis lifting structure drives the laser head to move up and down to adjust the distance between the laser head and the object to be processed; or the laser head can be zoomed, and the focal position of the laser head in the Z-axis direction can be changed by adjusting the focal length. The communication component can be used to receive processing instructions obtained according to the steps of the three-dimensional surface processing method of the following embodiment. Based on the processing instructions, the controller controls the processing head to perform layered processing on the object to be processed.

[0088] The processing equipment may include a control module (such as a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) or a program loaded from a storage device into a random access memory (RAM). In the RAM, various programs and data required for the operation of the processing equipment are also stored. The control module and storage modules such as ROM and RAM are connected to each other through a bus; the storage module may also include storage devices such as magnetic tapes and hard disks. The input / output (I / O) interface is also connected to the bus. Generally, the following systems can be connected to the I / O interface: input devices such as touch screens, touch pads, keyboards, mice, image sensors, microphones, accelerometers, gyroscopes, etc. as input modules; output devices such as liquid crystal displays (LCDs), speakers, vibrators, etc. as output modules; and communication devices. The communication device can allow the processing equipment to communicate with other devices wirelessly or wired to exchange data.

[0089] Reference Figure 1 , Figure 2(a) to Figure 2(c) , Figure 3 The present application provides a three-dimensional surface processing method, comprising the following steps:

[0090] Step S100, obtaining a 3D model of the object to be processed and a first processing graphic, rendering the first processing graphic to the 3D model, and obtaining a second processing graphic. The 3D model of the object to be processed obtained mainly refers to a 3D model of the processing surface of the object to be processed.

[0091] Specifically, after importing the three-dimensional model of the object to be processed (as shown in Figure 2(a)), the three-dimensional model can be preprocessed. The preprocessing includes denoising to eliminate redundant data on the surface of the three-dimensional model, and smoothing to make the surface of the three-dimensional model more continuous and smooth. The first processed graphic (as shown in Figure 2(b)) is analyzed to determine whether its clarity and accuracy meet the requirements. The first processed graphic can be adjusted by scaling, rotating, or even moderate deformation to match the shape and size of the three-dimensional model. The precise position and orientation of the first processed graphic in three-dimensional space can be calculated to ensure that the first processed graphic can fit accurately on the surface of the three-dimensional model. Finally, after this series of steps, the rendered three-dimensional model and the second processed graphic (as shown in Figures 2(c) and Figure 3 In some embodiments, the first processing pattern can be processed based on the depth information of the three-dimensional model in the Z-axis direction to obtain the second processing pattern, and the second processing pattern is adapted to the surface contour of the three-dimensional model.

[0092] Step S200, layering the second processing pattern to obtain multiple processing layers arranged along the Z-axis direction and obtaining processing sub-patterns distributed on each processing layer. Specifically, the second processing pattern obtained after rendering is layered along the Z-axis direction to obtain multiple processing layers arranged along the Z-axis direction and processing sub-patterns located on each processing layer.

[0093] Step S300: Determine the processing path of each processing layer according to the processing sub-graphics on each processing layer, obtain the processing path of the second processing graphic, and perform layered processing on the object to be processed based on the processing path of the second processing graphic.

[0094] In this way, the first processing graphic can be processed in the three-dimensional model of the object to be processed, avoiding the situation where the processed graphic is distorted and does not meet the actual requirements due to the change of the three-dimensional surface, thereby effectively optimizing the processing effect.

[0095] In this application, the processing path of each processing layer is determined according to the processing sub-graph located on each processing layer, and the processing object is processed based on the processing path of the multi-layer processing layer, which can conveniently control the processing and avoid the need to adjust the processing position of the processing head multiple times due to unclear processing path planning, which affects the processing effect and processing progress. Through layered processing, the thickness of the processing layer can be reduced, the Z-axis processing speed of the processing head and other processing components can be increased, and three-axis linkage can be achieved, so that the processing time can be reduced, the processing accuracy and processing efficiency can be improved.

[0096] It should be noted that when determining the processing path of each processing layer shown in the present application, the processing sub-graph to be processed, the layer processing start point and the layer processing end point of the processing sub-graph to be processed are determined for each processing layer. In the present application, adjacent processing layers can be processing layers that are processed sequentially along the Z-axis direction and are adjacently arranged in space, or they can be processing layers that are processed sequentially in a specified order along the Z-axis direction.

[0097] Taking the layer-by-layer processing along the Z-axis direction as an example, the motion path of the processing head between adjacent processing layers is determined by the layer processing end point of the previous processing layer and the layer processing start point of the next processing layer. When the processing path of each processing layer is determined, the motion path of the processing head between adjacent processing layers is also determined (such as Figure 4 Taking layer-by-layer processing in a specified order as an example, the movement path of the processing head between adjacent processing layers is determined by the layer processing end point of the previous processing layer and the layer processing starting point of the next processing layer. When the processing path of each processing layer in the specified order is determined, the movement path of the processing head between adjacent processing layers is also determined.

[0098] It can be understood that in the present application, when executing step S200 to layer the second processing graphic, obtain multiple processing layers arranged along the Z-axis direction, and obtain processing sub-graphics distributed on each processing layer, the layering direction can be determined according to the Z-axis direction, and the layering can be performed in any one or multiple ways, such as specifying the layer height of each processing layer, the number of layers, the processing surfaces of the upper and lower processing layers, the layer processing path, etc., according to the set layering rules, layering setting information (such as layer height setting information, etc.), or layering can be performed according to actual processing needs through custom layering methods, according to the processing sub-graphics of the first processing graphic assigned to each processing layer, etc.; the specific method can be based on the actual setting and is not limited here.

[0099] In the present application, the processing direction is determined by the Z-axis direction, and the height direction of the second processing figure is set to be parallel to the processing direction. The three-dimensional surface processing method shown in the present application allows the second processing figure to be layered according to the selected or adjusted perspective when the model perspective is allowed to be customized or the perspective of the second processing figure is adjustable. Because the second processing figure shown in the present application is a processing model obtained by rendering the first processing figure to the three-dimensional model of the object to be processed, in order to achieve three-dimensional surface processing while optimizing the processing effect, and to avoid the processing being affected by the inability to adjust the view direction when processing features such as hollowing, hanging, grid, and arc appear, the three-dimensional surface processing method shown in the present application is mainly explained by the example of layering the three-dimensional surface toward the Z-axis direction.

[0100] Reference Figure 5 In one embodiment, the step of layering the second processing pattern in step S200 to obtain multiple processing layers arranged along the Z-axis direction specifically includes:

[0101] Step S211, obtaining floor height setting information;

[0102] Step S212: layering the second processing pattern according to the layer height setting information to obtain multiple processing layers arranged along the Z-axis direction.

[0103] Specifically, the layer height setting information can be determined according to the received layer height setting instruction. The layer height setting information can be, but is not limited to, specifying the layer heights of all processing layers (evenly divided into multiple layers), specifying the number of layered layers (evenly layering the layer heights according to the specified number of layers), specifying the layer heights of multiple layers (the layer heights of different processing layers may be different), specifying the processing layer positions (such as specifying the coordinate positions of any one or more processing layers in the Z-axis direction), specifying the processing sub-graphics on each processing layer, specifying the surface undulation of the three-dimensional model in the processing layer or other three-dimensional surface changes; and layering can be performed according to any one of the processing parameters such as the specified layer height, the number of layered layers, the distribution of the first processing graphic, the degree of undulation of the three-dimensional model, the Z-axis processing speed of processing components such as the processing head, or other multiple other methods.

[0104] Specifically, the correspondence between the second processing graphic and the object to be processed can also be determined by the ratio of actual data of the object to be processed (such as actual height, etc.) and modeling data of the three-dimensional model (such as model height), and the second processing graphic can be layered according to the layer height setting information, the height of the object to be processed and the correspondence between the second processing graphic and the object to be processed, so that when the second processing graphic obtained after rendering is layered, the actual layering situation on the object to be processed can be automatically obtained through proportional conversion and the like according to the correspondence between the second processing graphic and the object to be processed.

[0105] In this way, different requirements in processing can be integrated, and the second processing graphic can be layered by setting the layer height setting information. Then, according to the layering result (the processing sub-graphic on each processing layer), the processing head of the processing equipment is controlled to process each processing layer to further optimize the processing effect.

[0106] As some optional embodiments of the present application, at least one layering scheme may be preset, and each layering scheme includes at least one or more of the aforementioned layer height setting information, so as to select a desired layering scheme from the preset at least one layering scheme, and automatically generate the layer height setting information after selecting the layering scheme. Specifically, the user may select the desired layering scheme by himself through multiple scheme options, and the processing equipment may automatically generate the corresponding multiple processing layers after obtaining the layering scheme selected by the user; or the processing equipment (such as an electronic device storing a three-dimensional surface processing program) may determine the layering setting information after receiving the layering instruction input by the user, automatically select the layering scheme according to the model information of the second processing graphic, and automatically generate multiple processing layers; the specific settings may be based on the actual settings, and are not limited here.

[0107] To achieve three-axis linkage, avoid the large load on the Z-axis direction of the processing head, which causes the movement speed and acceleration of the processing head in the Z-axis direction to differ greatly from the movement speed and acceleration in the X-axis direction and the Y-axis direction, thus affecting the actual processing speed. In this application, the layer thickness is reduced by layered processing, the processing speed of the processing head and other processing components is improved, and the processing efficiency is further optimized by limiting the layer height of the processing layer. When executing the above steps S211 and S212, specifying the layer height or layer height range of the processing layer is used as a further embodiment:

[0108] As an optional example, specifically, layer height setting information is obtained, and the layer height of each processing layer is determined according to the layer height setting information; and the second processing pattern is layered according to the layer height of each processing layer. The determined layer height of each processing layer is specifically the layer thickness of each processing layer, and can also be the determined coordinate position of each processing layer along the Z-axis direction.

[0109] As another optional example, specifically, the layer height setting information is obtained, and the layer height range of each processing layer is determined according to the layer height setting information; the second processing pattern is layered according to the layer height range of each processing layer, so that the layer height of each processing layer is within the set layer height range. The determined layer height range of each processing layer is specifically the layer thickness range of each processing layer, and can also be the determined coordinate position range of each processing layer along the Z-axis direction.

[0110] As another optional example, specifically, the layer height setting information is obtained, and the number of layers (or the range of the number of layers) and the range of the layer height of each processing layer are determined according to the layer height setting information; the second processing pattern is layered according to the number of layers (or the range of the number of layers) and the range of the layer height of each processing layer, so that the number of layers and the layer height of each processing layer are within the set number of layers (or the range of the number of layers) and the range of the layer height. Among them, the determined range of the layer height of each processing layer is specifically the layer thickness range of each processing layer, and can also be the determined range of the coordinate position of each processing layer along the Z-axis direction.

[0111] By specifying the layer height or layer height range, the Z-axis processing speed of processing components such as the processing head can be increased, saving processing time and energy consumption, and improving processing efficiency.

[0112] In a further embodiment of the present application, the layer height and layer height range can be determined by any data between 0.1mm and 10.0mm (such as 0.1mm, 0.5mm, 0.8mm, 1.0mm, 3.0mm, 5.0mm, 8.0mm, 10.0mm, etc.), or by 0.1mm to 10.0mm and other arbitrary numerical ranges (such as 0.3 to 3.0mm, 3.0 to 5.0mm, 5.0 to 11.5mm, etc.), so as to avoid the layer height being too small or the number of layers being too large, resulting in more breakpoints between layers and affecting the processing effect; it can also avoid the problem of defocusing caused by excessive layer height, resulting in thicker processed lines, or discontinuous breakpoints.

[0113] When the determined layer height setting information is a specific value (such as layer height, number of layers), when performing the step of layering the second processing pattern in step S200 to obtain multiple processing layers arranged along the Z-axis direction, the multiple processing layers separated may fail to meet expectations due to uneven layering. To solve such problems, the present application proposes the following examples:

[0114] Reference Figure 6 In one example, step S200, the step of layering the second processed graphics specifically includes:

[0115] Step S221, pre-stratifying the second processed pattern with a first preset number of layers to obtain a multi-layer pre-stratification;

[0116] Step S222: If the middle processing layer in the multi-layer pre-layer does not correspond to the midpoint position of the second processing figure, adjust the height of each pre-layer and / or the first preset number of layers to make the middle processing layer correspond to the midpoint position of the second processing figure.

[0117] It can be understood that the layer height setting information includes a first preset number of layers. After pre-stratification according to the first preset number of layers, the middle processing layer in the multi-layer pre-stratification is adjusted to the midpoint position of the second processing pattern, so that the graphics of the first processing pattern are divided into multiple processing layers as evenly as possible or distributed as close to the middle processing layer as possible. Pre-stratification can reduce processing errors that may occur during the processing process, and can also avoid problems such as distortion and deformation of graphics that may occur after processing in advance, ensuring that the overall processing effect is more beautiful, so as to further optimize the processing effect.

[0118] The intermediate processing layer refers to a processing layer with a number of layers equal to (the first preset number of layers divided by 2) (for example, 10 is used as the first preset number of layers, and the second processing pattern is pre-layered by 10 to obtain 10 pre-layered layers, and the intermediate processing layers in the 10 pre-layered layers are the 5th and 6th layers; 9 is used as the first preset number of layers, and the second processing pattern is pre-layered by 9 to obtain 9 pre-layered layers, and the intermediate processing layer in the 9 pre-layered layers is the 5th layer). The midpoint position of the second processing pattern refers to 1 / 2 of the height of the second processing pattern in the Z-axis direction. For example, if the height value of the second processing pattern in the Z-axis direction is 300 mm, the midpoint position of the second processing pattern is 150 mm.

[0119] If the middle processing layer in the multi-layer pre-layer obtained after pre-layering the second processing figure by the first preset number of layers just corresponds to the midpoint position of the second processing figure, the multi-layer pre-layer obtained by pre-layering is used as the processing layer (taking 9 as the first preset number of layers as an example, if the height of the 5th layer in the Z-axis direction corresponds to the midpoint position of the second processing figure, or the midpoint position of the second processing figure is exactly located at the 5th layer, the multi-layer pre-layer obtained by pre-layering is used as the processing layer). If the middle processing layer in the multi-layer pre-layer obtained after pre-layering the second processing figure by the first preset number of layers does not correspond to the midpoint position of the second processing figure, then the height of each pre-layer is further adjusted on the basis of the divided multi-layer pre-layer, that is, the layer height of each pre-layer is specified and / or the first preset number of layers is re-specified and updated, and the second processing figure is pre-layered again with the specified layer height of each pre-layer and / or the re-specified and updated first preset number of layers as the new layer height setting information until the middle processing layer in the multi-layer pre-layer corresponds to the midpoint position of the second processing figure.

[0120] It should be noted that the second processing graphic is pre-layered again according to the specified layer height of each pre-layer, which may specifically be, but not limited to, specifying the layer heights of all pre-layers, specifying the layer heights of the intermediate processing layers in all pre-layers, or at least the multi-layer pre-layers close to the intermediate processing layers. The second processing graphic is pre-layered again according to the updated first preset number of layers, which may specifically be, but not limited to, pre-layering the second processing graphic according to the reset first preset number of layers. The second processing graphic is pre-layered again according to the specified layer height of each pre-layer and the updated first preset number of layers, which may specifically be, but not limited to, specifying the layer heights of the intermediate processing layers in all pre-layers, or at least the multi-layer pre-layers close to the intermediate processing layers, and then pre-layering the second processing graphic according to the reset first preset number of layers.

[0121] In addition, taking the specified processing layer height as an example, the layer height can also be specified according to the first preset layer height, that is, the first preset number of layers in the above example is replaced with the first preset layer height to realize the pre-layering of the second processing graphic, specifically:

[0122] Pre-layering the second processing pattern at a first preset layer height to obtain a multi-layer pre-layer;

[0123] When the middle processing layer in the multi-layer pre-layer does not correspond to the midpoint position of the second processing figure, the height of each pre-layer and / or the first preset layer height is adjusted until the middle processing layer corresponds to the midpoint position of the second processing figure.

[0124] As another example, step S200, the step of layering the second processed graphic, specifically includes:

[0125] The middle reference layer of the second processed pattern is determined according to the midpoint position of the second processed pattern, and the second processed pattern is pre-layered based on the middle reference layer.

[0126] It can be understood that in this example, the position of the processing layer used as a reference can be optionally determined first according to the midpoint position of the second processing figure, and the processing layer used as a reference can be determined as the intermediate reference layer. Specifically, the Z-axis coordinate position of the intermediate reference layer can be specified according to the midpoint position of the second processing figure, and based on the intermediate reference layer, the second processing figure can be pre-layered starting from both sides of the intermediate reference layer according to the set layer height, number of layers and other layer height setting information.

[0127] In the present application, the three-dimensional surface processing method is not limited to determining the processing layer position by the midpoint position of the second processing figure when it is implemented. Step S200, the step of layering the second processing figure to obtain multiple processing layers arranged along the Z-axis direction may specifically include:

[0128] The position of the designated processing layer of the second processing graphic is determined according to the designated position of the second processing graphic, and the second processing graphic is pre-layered based on the designated processing layer according to the designated layer height, the designated number of layers, etc.

[0129] In one embodiment, from top to bottom along the Z-axis direction, the processing surface of the next processing layer is not smaller than the processing surface of the previous processing layer.

[0130] In layered processing, if the processing surface area of ​​the next processing layer is smaller than that of the previous processing layer, the processing surface of the previous processing layer may cover the next processing layer, resulting in errors such as processing overlap. Therefore, when layering, it is necessary to proceed layer by layer from top to bottom along the Z-axis direction. Before processing each processing layer, it is necessary to calculate and compare the processing surface projections of each processing layer to ensure that the projection surface of the previous processing layer is not larger than that of the next processing layer to avoid overlap and errors. When the processing surface of the next processing layer is smaller than that of the previous processing layer, it can be, but not limited to, prompting the user by displaying the processing sub-graphics distributed on each processing layer; prompting the user by directly displaying prompt information; prompting the user to modify according to the preset layer height modification information including the recommended layer height, or automatically adjusting the layer height or number of layers. In this way, it can be used to timely adjust by re-obtaining the layer height setting information when the processing sub-graphics on different processing layers overlap and other problems. In order to intuitively display and verify the layering effect, the processing relationship between each processing layer is simulated by drawing tools, layered design software or processing simulation programs. After simulation through these tools, the multiple processing layers arranged along the Z-axis direction and the processing sub-graphs located on each processing layer are clearly displayed, thereby helping to verify the accuracy and rationality of the layering. In this way, the solution of layer-by-layer processing along the Z-axis direction or layer-by-layer processing in a specified order as shown in the above example can also be realized to expand the scope of application of processing equipment and meet different processing requirements.

[0131] In one embodiment, step S300, determining the processing path of each processing layer according to the processing sub-graphics on each processing layer, specifically includes:

[0132] According to the processing sub-graphics on each processing layer, the layer processing start point and the layer processing end point of each processing layer are determined, and the processing path is determined according to the layer processing start point and the layer processing end point.

[0133] It can be understood that the content to be processed in each layer can be determined based on the processing sub-graphics on each processing layer. In addition to determining the processing path of each processing layer, the layer processing starting point and layer processing end point can also be used to determine the movement path of the processing head between adjacent processing layers.

[0134] Reference Figure 7Further, after executing the step of obtaining the multiple processing layers arranged along the Z-axis direction and obtaining the processing sub-graphs distributed on each processing layer in step S200, the three-dimensional surface processing method further includes the following steps:

[0135] The interactive interface of the terminal previews and displays the effect of the processed sub-graphics on each processing layer on the three-dimensional model.

[0136] It is used to preview and intuitively display the processing sub-graphics distributed on each processing layer through a display interface and other display devices, helping users to intuitively see the processing paths of multiple processing layers, and facilitating timely adjustments by re-obtaining layer height setting information when problems such as overlap occur in processing sub-graphics on different processing layers, making the entire processing control process more intuitive, thereby improving user participation and improving processing yield.

[0137] In the present application, the second processing graphic is layered according to the layer height setting information in step S212 of the aforementioned embodiment to obtain a multi-layer processing layer arranged along the Z-axis direction. Specifically, the layer height setting information may include, but is not limited to, specifying the layer heights of all processing layers (evenly divided into multiple layers), specifying the number of layers (evenly layering the layer heights according to the specified number of layers), specifying the layer heights of multiple layers (the layer heights of different processing layers may be different), specifying the processing layer position (such as specifying the coordinate position of any one or more processing layers in the Z-axis direction), specifying the processing sub-graphics on each processing layer, and specifying the surface undulation of the three-dimensional model in the processing layer or other three-dimensional surface changes.

[0138] Take specifying the number of layers as an example, refer to Figure 7 Specifically, the second processing graphics can be layered according to the specified number of layers, the height of the object to be processed, and the corresponding relationship between the second processing graphics and the object to be processed. When the specified number of layers is 6, 6 processing layers arranged along the Z-axis direction are obtained, and the 6 processing layers and the processing sub-graphics located on each processing layer are displayed through a display interface. Specifically, the layers can be layered according to the actual layer height setting information, and the corresponding layering conditions are displayed, which will not be described one by one here.

[0139] In the present application, when executing step S100 to render the first processing graphic to a three-dimensional model to obtain the second processing graphic, it is necessary to align the first processing graphic with the three-dimensional model of the object to be processed to adjust the position of the first processing graphic in the three-dimensional model of the object to be processed so that the processing effect meets user requirements.

[0140] In addition, in some optional embodiments of the present application, after the processing path is determined, the preview display content includes but is not limited to the processing sub-graphs located on each processing layer, the current processing layer, and the processing parameters. After rendering the first processing graph to the three-dimensional model of the object to be processed, the result is as shown in Figure 2(c), Figure 3 The second processed pattern shown in FIG. 1 is obtained by layering the second processed pattern as described above. Figure 7 The processing sub-graphics of the multiple processing layers shown show the distribution of the first processing graphic in each processing layer by displaying the processing sub-graphics of each processing layer, and after determining the processing path, the processing sub-graphics of each processing layer are previewed to facilitate viewing the determined processing path of each processing layer, so as to further optimize the processing effect and avoid distortion and deformation of the processed graphics.

[0141] In addition, in the present application, the preview graphics can also be used to display the three-dimensional surface processing process, so that the processing performed by the processing equipment is the picture displayed by the preview graphics, so as to intuitively control the processing progress.

[0142] The three-dimensional surface processing method shown in the present application allows the position of the first processing figure to be adjusted when the step S100 of rendering the first processing figure to the three-dimensional model and obtaining the second processing figure is executed; it allows the second processing figure to be pre-layered when the second processing figure is layered in step S200 and returns to step S100 after pre-layering, and optimizes the processing effect by re-adjusting the position of the first processing figure, or by re-adjusting the layer height, number of layers, and position of each processing layer. The role of obtaining preview graphics of multiple processing layers is not only to preview the processing effect in advance, but also to verify the processing results in advance and assist in improving the processing when the position and layer height setting information of the first processing figure are allowed to be modified and adjusted.

[0143] Optionally, the present application allows receiving modification information set by the user after obtaining preview graphics of multiple processing layers, and the modification information shown may be, but is not limited to, layer setting information such as layer height setting information, and position setting information for adjusting the position of the first processing graphic, so as to adjust the layering and update the layering situation and preview graphics according to the obtained preview graphics before controlling the execution of processing, until the layering meets the required processing requirements. In this way, the processed product can meet the user's requirements.

[0144] In the field of CNC machining, when facing the processing of complex graphics, it is common to encounter problems such as the laser machining head and other machining components not moving properly and not being able to accurately dock, affecting machining accuracy and efficiency. Repeated adjustment of the moving machining components will not only increase machining time and affect machining efficiency, but will also cause equipment wear, affect machining accuracy and increase machining costs.

[0145] In order to reduce the motion path of laser processing head and other processing components, save processing time and processing cost, and improve processing quality, refer to Figure 4 In one embodiment, the following conditions are satisfied between two adjacent layers of processing paths:

[0146] The distance between the layer processing start point of the next processing layer and the layer processing end point of the previous processing layer is the smallest.

[0147] Specifically, the two points with the shortest distance between two processing layers along the Z-axis direction can be found as the layer processing starting point of the next processing layer and the layer processing end point of the previous processing layer; or the intersection point between layers can be found (there are intersection points or lines between the processing sub-graphs of two adjacent processing layers in the spatial Z-axis direction) as the layer processing end point of the previous processing layer and the layer processing starting point of the next processing layer to ensure that the distance between the layer processing end point of the previous processing layer and the layer processing starting point of the next processing layer is minimized.

[0148] Furthermore, the interlayer intersection point refers to the point or line where the first processing graphics distributed on the two processing layers intersect in the spatial Z-axis direction. The interlayer intersection point is used to determine the processing path of the current processing layer.

[0149] It can be understood that after dividing multiple processing layers according to the processing order, it is necessary to determine the processing sub-graphs on each processing layer, and then determine the processing path according to the processing sub-graphs on each processing layer, and determine the processing sub-graphs between the inter-layer intersections as the pattern to be processed in the current processing layer. Taking n1, n2, and n3 as examples, where n1 and n2, n2 and n3, etc. respectively represent three adjacent processing layers, there is at least one inter-layer intersection between n1 and n2, and n2 and n3, etc. The inter-layer intersection between n1 and n2 is determined as the first inter-layer intersection d1, and the inter-layer intersection between n2 and n3 is determined as the second inter-layer intersection d2, and the processing sub-graph of n2 located between d1 and d2 is determined as the processing path of n2. During processing, after completing the processing of the processing sub-graphic of n1, the laser processing head is controlled to move downward from the n1 layer to the n2 layer, and after completing the processing of the processing sub-graphic of the n2 layer located between the first interlayer intersection point d1 and the second interlayer intersection point d2 (that is, after completing the processing of the processing sub-graphic of the n2 layer), the laser processing head is controlled to move downward from the n2 layer to the n3 layer to further complete the processing of the n3 layer.

[0150] When controlling the processing, the laser processing head can be raised and lowered to move between different processing layers, and perform processing on each processing layer according to the determined processing path segment of each processing layer. In this way, the problem of needing to adjust the position of processing components such as the laser processing head multiple times when directly completing the individual processing of each processing layer layer by layer along the Z-axis direction can be avoided, thereby effectively improving the processing efficiency and processing accuracy.

[0151] Reference Figure 4 In one embodiment, the steps of determining the layer processing start point and the layer processing end point of each processing layer according to the processing sub-graphs on each processing layer, and determining the processing path according to the layer processing start point and the layer processing end point specifically include:

[0152] Determine whether there is an interlayer intersection point based on the processing sub-graphs on each processing layer. It can be understood that the interlayer intersection point refers to the point or line where the first processing graph distributed on the two processing layers intersect in the spatial Z-axis direction.

[0153] If there is an interlayer intersection point between adjacent processing layers, the processing end point of the previous processing layer and the processing starting point of the next processing layer are determined respectively according to the interlayer intersection point, so that the distance between the layer processing starting point of the next processing layer and the layer processing end point of the previous processing layer is minimized;

[0154] If there is no interlayer intersection between adjacent processing layers, the processing end point of the previous processing layer and the processing starting point of the next processing layer are determined according to the two closest graphic points in the adjacent processing layers along the Z-axis direction, so that the distance between the layer processing starting point of the next processing layer and the layer processing end point of the previous processing layer is minimized.

[0155] In this way, the movement path of the processing head between adjacent processing layers can be ensured to be the shortest, that is, the movement path of processing components such as the laser processing head during the processing process can be ensured to be the shortest, so as to reduce problems such as wear and processing errors that may occur due to the movement of the processing head.

[0156] Specifically, refer to Fig.19 When executing step S300 of determining the processing path of each processing layer according to the processing sub-graphics on each processing layer and obtaining the processing path of the second processing graphic, the processing path of each processing layer can be generated first, and the processing path of the second processing graphic can be generated by associating the processing paths of multiple processing layers. A gcode file (or gcode processing instructions) or a processing file in other formats containing processing instructions is generated according to the generated processing path of the second processing graphic, so as to control the processing equipment to perform layer-by-layer processing on the object to be processed based on the processing path of the second processing graphic.

[0157] In addition, the aforementioned processing paths of the associated multiple processing layers are used to generate the processing path of the second processing figure. When the processing path determined after the processing paths of the associated multiple processing layers is one, the processing path is determined as the processing path of the second processing figure;

[0158] When multiple working paths are determined after associating the processing paths of multiple processing layers, the working path with the largest number of interlayer intersections is determined as the processing path of the second processing graphic.

[0159] Reference Figure 4 , Figure 8 In one embodiment, obtaining the processing sub-patterns distributed on each processing layer in step S200 includes the following steps:

[0160] Step S231, obtaining the intersection of the second processing pattern and each processing layer;

[0161] Step S232: based on the intersection points between the second processing pattern and each processing layer, the second processing pattern is segmented to obtain processing sub-patterns distributed on each processing layer.

[0162] Through layered processing and intersection calculation, the specific position and shape of the second processing graphic on each processing layer can be accurately determined. Based on the intersection of the second processing graphic and each processing layer, an independent and complete processing sub-graphic located on each processing layer is obtained. The second processing graphic is segmented along the Z-axis direction. This graphic segmentation ensures that the processing path on each processing layer is clearly defined, which helps to improve processing precision, efficiency and accuracy. In addition, because it is suitable for complex 3D model processing, it also effectively expands the application scenarios of the three-dimensional surface processing method, making the entire processing process more stable and reliable.

[0163] Please refer to Figure 4 , assuming that S is the second processing figure or part of the second processing figure, layer n1 is the highest layer, the intersection point between layer n1 and S is d1, then the figures above point d1 are all processing sub-figures distributed on layer n1, the intersection point between layer n2 and S is d2, then the image of S between d2 and d1 is the processing sub-figure distributed on layer n1, and so on, the second processing figure is obtained to obtain the processing sub-figures distributed on each processing layer.

[0164] Reference Figure 9 to Figure 1 8. In one embodiment, the step of obtaining the three-dimensional model of the object to be processed in step S100 includes:

[0165] Step S110, acquiring multiple feature point data of the object to be processed, performing segmented fitting on the multiple feature point data, and obtaining a multi-segment line fitting line;

[0166] Step S120: Smoothing the multiple fitting lines to construct a three-dimensional model.

[0167] The generation of the three-dimensional model is realized by the least squares method MLS (Moving Lest Squares) and other methods, and then the segmented fitting and smoothing processing is performed for a single feature point or a discretely distributed feature point to obtain a three-dimensional model. The least squares method of fitting the line here refers to fitting a line that best fits the object to be processed between each adjacent feature point in the longitudinal or transverse direction. The least squares method calculates the line function parameters with the smallest error between the data points according to the coordinates of each feature point, and uses the line function parameters to achieve the best effect of line fitting. After the line fitting, the least squares method is used to fit the line again through the corresponding points on the two parallel lines, thereby forming countless fitting lines between the two parallel lines, thereby realizing the establishment of a three-dimensional model, wherein the lines include but are not limited to curves and straight lines. It is used to fit the obtained feature point data into a line or a surface, and the object composed of the line or the surface is the three-dimensional model corresponding to the surface to be processed.

[0168] The specific implementation process is as follows:

[0169] Fig.10 , Fig.11 The schematic diagram of the calibration process is shown. The processing equipment will be calibrated before leaving the factory. When calibrating each height, a set of parameters, namely the pixel position CX of the irradiation point and the spatial position (X, Y, Z) of the irradiation point, are obtained from the captured image, and then this set of parameters is regrouped. For example, when the calibration process is performed on a height, the obtained pixel position Cx of the irradiation point and the spatial position (X, Y, Z) of the irradiation point constitute a group. This group is regrouped in pairs with the pixel position of the irradiation point and each coordinate value to obtain three sets of parameters, namely (CX, Z), (X, Z), and (Y, Z). This is analogous to the case for each height, and three sets of parameters are obtained by regrouping. For all heights, the same set of parameters are grouped together, for example, all (CX, Z) are grouped together, and linear fitting is performed, such as performing linear fitting on (CX0, Z0), (CX3, Z3), (CX6, Z6), (CX9, Z9), (CX12, Z12) and (CX15, Z15), adapting the regrouping, and obtaining a mapping from the spatial position of the irradiation point to the coordinate value through the linear fitting. The mapping specifically includes a mapping of the spatial position to the Z-axis coordinate value, a mapping of the X-axis coordinate value to the Z-axis coordinate value, and a mapping of the Y-axis coordinate value to the Z-axis coordinate value, and so on, to obtain a mapping of the pixel position of the irradiation point to the spatial position of the irradiation point.

[0170] The mapping of the pixel position of the irradiation point to the spatial position of the irradiation point indicates the relationship between the pixel position of the irradiation point and the coordinate value in the spatial position of the irradiation point, and the coordinate value. This relationship can be represented by a linear function and its coefficients. Therefore, the linear fitting is used to obtain the coefficients used by the linear function corresponding to the pixel position of the irradiation point and the coordinate value of the spatial position of the irradiation point, and the coordinate value. The corresponding linear function can be determined by the coefficient, and then the relationship between the spatial position of the irradiation point mapped by the pixel position of the irradiation point is obtained.

[0171] The linear function obtained by linear fitting between the pixel position CX of the irradiation point and a coordinate value, namely the Z-axis coordinate value, is Z=a*CX+b; the linear function obtained by linear fitting between the X-axis coordinate value and the Z-axis coordinate value is X=c*Z+d; the linear function obtained by linear fitting between the Y-axis coordinate value and the Z-axis coordinate value is Y=e*Z+f. Among them, a, b, c, d, c are coefficients read from the calibration file obtained by executing the calibration process. Therefore, the coefficients obtained by linear fitting are extracted to form a calibration file. Correspondingly, in the measurement of the measuring point being performed, it is only necessary to call the calibration file to obtain the calibration relationship between the pixel position of the irradiation point and the spatial position of the irradiation point. Because the irradiation is located above the measuring point in the coordinate system of the CNC machine, the spatial position of the irradiation point is the same as the spatial position of the measuring point. Therefore, in the measurement of the measuring point performed in the embodiment, it is only necessary to substitute the pixel position of the irradiation point into the above calibration relationship to obtain the spatial position of the measuring point.

[0172] Fig.12 , Fig.13 A schematic diagram of the measurement process is shown. When performing specific calculations, the coefficients are first read from the calibration file, and a formula is constructed using the read coefficients, namely, the spatial position of the measurement point and a coordinate value Z=a*CX+b, as well as a linear function X=c*Z+d, Y=e*Z+f between the coordinate values.

[0173] For the photo, the spatial position CX' is obtained by image recognition of the red dot, and then Z', Y' and x' are calculated in sequence by the constructed linear function; Z', Y' and x' constitute the spatial position of the measuring point. For obtaining the pixel position of the irradiation point based on the captured image, because the captured image is a content description of the irradiation point formed by the light beam captured by the camera in the CNC machine, and the captured irradiation point is expressed by pixels on the captured image, the captured image can be image recognized to obtain the pixel where the irradiation point is located, and finally the pixel position of the irradiation point is obtained by the pixel position where the captured irradiation point is located. This is the pixel position of one irradiation point. By analogy, the pixel positions of the irradiation points corresponding to the multi-point array are obtained through this process through the captured image. By measuring the dot matrix, the processing of the processing object can be carried out, the measurement of several measurement points can be achieved, and the spatial position of the area where the measurement points are located can be determined more accurately.

[0174] Figure 14 to Figure 1 8 shows a specific process from constructing a solid surface (such as constructing a curved surface or a curve) to generating a three-dimensional model: the feature point data corresponding to the surface to be processed is obtained, and the feature point data is used to indicate the position of the feature points arranged in an array on the surface to be processed. The feature point data is obtained by measuring the surface to be processed by infrared, structured light or other data acquisition equipment, and the feature point data includes the position data of multiple feature points, and the multiple feature points are arranged in an array on the surface to be processed.

[0175] According to the feature point data, the virtual feature point data in the specified direction in the feature point data is calculated; according to the virtual feature point data in the specified direction, the three-dimensional model corresponding to the surface to be processed is fitted. The specified direction includes the row direction and the column direction of the feature point array, and the virtual feature point data includes the first virtual feature point data corresponding to the row in the feature point data and the second virtual feature point data corresponding to the column in the feature point data. The three-dimensional model corresponding to the surface to be processed can be constructed by combining these two virtual feature point data.

[0176] Specifically, a virtual point creation function is obtained; the feature point data is divided into rows and columns, and each row and column in the feature point data is grouped based on a preset interval division unit; the feature point data of each group is substituted into the virtual point creation function, and the first virtual feature point data corresponding to the row in the feature point data and the second virtual feature point data corresponding to the column in the feature point data are calculated.

[0177] Among them, the virtual point creation function can be expressed according to the following 2D fitting calculation:

[0178]

[0179] Wherein, tension is a constant between 0 and 1 (e.g., 0.5), and its specific value can be adjusted according to the actual application scenario and is not specifically limited here. 0 、s 1 、s 2 、s 3 is the feature point data of each group corresponding to the row, then c is calculated by substituting the feature point data of each group corresponding to the row into the above virtual point creation function 0 、c 1 、c 2 、c 3 , so that we can get multiple groups of c corresponding to each row in the feature point data 0 、c 1 、c 2 、c 3 , thereby obtaining the first virtual feature point data; if s 0 、s 1 、s 2 、s 3 is the feature point data of each group corresponding to the column, then the corresponding c is calculated by substituting the feature point data of each group corresponding to the column into the virtual point creation function 0 、c 1 、c 2 、c 3 , so that we can get multiple groups of c corresponding to each column in the feature point data 0 、c 1 、c 2 、c 3 , thereby obtaining the second virtual feature point data.

[0180] For example, the characteristic points of each group corresponding to the row or column are PT1, PT2, PT3 and PT4, where s 0 =PT1,s 1 =PT2 s 2 =PT3s 3 =PT4

[0182] Among the four feature points in the group where the first feature point of each row and column is located, the first feature point is reused; among the four feature points in the group where the last feature point of each row and column is located, the last feature point is reused.

[0183] For example, the four feature points in the group where the first feature point of each row belongs are PT1, PT1, PT2, and PT3, where s 0 =PT1,s 1 =PT1,s 2 =PT2,s 3=PT3; the four feature points in the group where the last feature point of each row is located are PT2, PT3, PT4, PT4, where s 0 =PT2,s 1 =PT3,s 2 =PT4,s 3 =PT4.

[0185] The three-dimensional model is obtained by fitting the virtual feature point data in the specified direction, which means that the three-dimensional model corresponding to the surface to be processed is obtained by fitting the first virtual feature point data and the second virtual feature point data. Specifically, the first virtual feature point data and the second virtual point control data are respectively substituted into the following formula to fit the three-dimensional model corresponding to the surface to be processed:

[0186] f(t)=B 0 (t)*c 0 +B 1 (t)*c 1 +B 2 (t)*c 2 +B 3 (t)*c 3 (2)

[0187] In the formula, Among them, the value range of t is 0 to 1. The specific value is determined according to the actual application scenario and is not specifically limited here. f(t) is the fitted row two-dimensional curve or column two-dimensional curve. A three-dimensional model can be obtained by combining multiple row two-dimensional curves and multiple column two-dimensional curves.

[0188] The preset fitting coefficient value range is [0,1]. For example, when the subdivision parameter is 5, the values ​​of multiple fitting coefficients t can be: 0.0, 0.2, 0.4, 0.6, 0.8, 1.0; when the subdivision parameter is 10, the values ​​of multiple fitting coefficients t can be: 0.0, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1.0; and so on.

[0189] Fig.16 , Fig.17 The following are schematic diagrams of different tensions (the subdivisions are uniformly infinite) and different subdivisions (the tension is uniformly 0.5). Taking surface processing as an example, it can be seen from the attached figure that when other conditions remain unchanged, the 3D model becomes smoother when the tension increases, that is, the curvature decreases.

[0190] The steps for generating a 3D model from a 2D curve are as follows:

[0191] Step 1: As shown in Figure 18(a), the X-axis is fitted column by column to generate the src_x[] array;

[0192] Step 2: As shown in Figure 18(b), quantitative sampling is performed in the Y direction according to the number of subdivisions (subdivision in the Y direction);

[0193] Step 3: As shown in Figure 18(c), fit the Y axis row by row to generate the src_y[] array;

[0194] Step 4: As shown in Figure 18(d), quantitative sampling is performed in the X direction according to the number of subdivisions (X direction subdivision);

[0195] Step 5: As shown in Figure 18(e), all subdivision points are connected row by row and column by column to form a fitted three-dimensional surface mesh;

[0196] The three-dimensional model of the present application can be further obtained according to actual settings and specific solutions for creating three-dimensional models in related technologies, which are not limited here.

[0197] Reference Fig. 20 , Fig. 20 The three-dimensional surface processing device of one embodiment of the present application is shown. The three-dimensional surface processing device includes a graphics acquisition module 301, a layering module 302 and a path determination module 303, wherein:

[0198] The graphics acquisition module 301 is used to acquire a three-dimensional model of the object to be processed and a first processing graphic, and render the first processing graphic to the three-dimensional model to obtain a second processing graphic;

[0199] The layering module 302 is used to layer the second processing pattern to obtain multiple processing layers arranged along the Z-axis direction and obtain the processing sub-patterns distributed on each processing layer;

[0200] The path determination module 303 is used to determine the processing path of each processing layer according to the processing sub-graphics on each processing layer, obtain the processing path of the second processing graphic, and perform layered processing on the object to be processed based on the processing path of the second processing graphic.

[0201] The beneficial effects of the three-dimensional surface processing device provided in the present application are the same as the beneficial effects of the three-dimensional surface processing method provided in the above-mentioned embodiment, and other technical features in the three-dimensional surface processing device are the same as the features disclosed in the above-mentioned embodiment method, which will not be repeated here.

[0202] In addition, to achieve the above purpose, refer to Fig.21The present application also provides a processing device, which is a laser processing device 10. The laser processing device 10 may be, but is not limited to, a laser cutting device, a laser engraving device, a laser engraving and cutting all-in-one device, a laser welding device, etc. The laser processing device includes a processing head and other processing components 110, a communication component, and a controller. The processing head may be, but is not limited to, a laser head, a cutting head, a pen head, and a drill head.

[0203] Optionally, the laser processing equipment further includes a lifting structure 120 such as a Z-axis lifting structure. For example, if the processing head is a laser head, the laser head can scan and process the object to be processed along the X-axis and Y-axis directions, and the Z-axis lifting structure drives the laser head to move up and down to adjust the distance between the laser head and the object to be processed. Alternatively, in some embodiments, the laser head can be zoomed, and the focal position of the laser head in the Z-axis direction can be changed by adjusting the focal length.

[0204] Specifically, when the laser head can be driven to rise and fall by the lifting structure, the Z-axis lifting structure is used to drive the laser head to move up or down to adjust the distance between the laser head and the object to be processed, and the laser head is driven to move down by the Z-axis lifting structure to adjust the distance between the laser head and the object to be processed, so that the laser head moves from the previous processing layer to the next processing layer. In addition to driving the laser head up and down by the lifting structure, the focal length can also be changed and adjusted by increasing the focal length, reducing the focal length, etc., thereby changing the focal position of the laser head in the Z-axis direction, and the laser head is adjusted by increasing the focal length and adjusting the distance between the laser head and the object to be processed, so that the focus of the laser head moves from the previous processing layer to the next processing layer.

[0205] The communication component can be used to receive processing instructions obtained according to the steps of the three-dimensional surface processing method described in the above embodiment.

[0206] The processing instruction may be, but is not limited to, a Gcode instruction, which includes a processing path. For example, when the processing head needs to be moved for processing each processing layer, the G0 Z instruction is executed. The processing instruction may be presented in the following manner or in other manners:

[0207] "G0 Z100 / / Code for processing the first processing layer (the highest layer)

[0208] G0 XY

[0209] G1 XY

[0210] G1 XY

[0211] …

[0212] G0 Z95 / / Code for processing the second layer

[0213] G0 XY

[0214] G1 XY

[0215] G1 XY

[0216] …

[0217] G0 Z90 / / Code for processing the third layer

[0218] G0 XY

[0219] G1 XY

[0220] G1 XY

[0221] …”

[0222] Based on the above processing instructions, the controller controls the processing head to perform layered processing on the object to be processed.

[0223] In one embodiment, the processing method in the above embodiment further includes the following steps:

[0224] Controlling a processing head of a processing device to process a processing sub-graphic of a current processing layer on the object to be processed;

[0225] If the processing sub-pattern of the current processing layer is completed, the processing head is moved along the Z-axis direction or the focal length of the processing head is adjusted so that the focus of the processing head moves to the next processing layer;

[0226] The object to be processed is processed based on the processing sub-graph on the processing layer of the next layer.

[0227] In one embodiment, the controller is configured to:

[0228] Control the processing head to process the processing sub-graphics of the current processing layer on the object to be processed;

[0229] If the processing sub-graph of the current processing layer is completed, the processing head is moved along the Z-axis direction or the focal length of the processing head is adjusted so that the focus of the processing head moves to the next processing layer;

[0230] The object to be processed is processed based on the processing sub-graphics on the next processing layer.

[0231] In one embodiment, the laser processing equipment further includes a galvanometer system, which is a key component for realizing precise movement of the laser head in the X-axis direction and the Y-axis direction, and includes but is not limited to an X-mirror, a Y-mirror (both the X-mirror and the Y-mirror are reflectors), a motor for driving the X-mirror and the Y-mirror to swing, and other driving devices. The driving device drives the reflector to swing at a certain angle according to the control instruction received from the controller, thereby changing the propagation direction of the laser beam. By accurately controlling the swing angle of the two motors, arbitrary positioning scanning of the laser beam can be realized on the XY plane. The positioning scanning of the current processing layer is realized by the galvanometer system. After positioning to the layer processing starting point of the current processing layer, the controller will control the laser head to start processing the processing sub-graphic of the current processing layer on the object to be processed, and along the corresponding processing path, the processing starts from the layer processing starting point to the layer processing end point until the processing of the processing sub-graphic of the current processing layer is completed.

[0232] When it is necessary to move to the next processing layer, the processing head is moved along the Z-axis direction or the focal length of the processing head is adjusted so that the focus of the processing head moves from the previous processing layer to the next processing layer, and each processing layer is processed based on the processing sub-graphs on each processing layer. After processing the first processing layer, the processing head (such as a laser head, etc.) is moved down or the focus of the processing head (such as a laser head, etc.) is moved down to the next layer until all processing layers are processed.

[0233] The processing equipment provided by the present application adopts the three-dimensional surface processing method in the above embodiment to solve the technical problems of how to realize three-dimensional surface processing and how to avoid distortion and deformation of graphics and improve processing efficiency while realizing three-dimensional surface processing. Compared with the prior art, the beneficial effects of the processing equipment provided by the present application are the same as the beneficial effects of the three-dimensional surface processing method provided by the above embodiment, and other technical features in the processing equipment are the same as the features disclosed in the above embodiment method, which will not be repeated here.

[0234] Reference Fig. 22 The present application also provides a processing system, which includes a processing device (such as a laser processing device 10) and a terminal device 20 that communicates with the processing device. The terminal device 20 is connected to the processing device through a connection channel. The processing device includes a processing component such as a base plate 130 and a processing head. The base plate 130 includes a processing area for placing an object to be processed, and the processing head is used to process the object to be processed located in the processing area. The terminal device is used to execute the above three-dimensional surface processing method to generate a processing instruction, and send the processing instruction to the processing device.

[0235] Among them, the processing head is moved along the Z-axis direction or the focal length of the processing head is adjusted so that the focus of the processing head moves from the previous processing layer to the next processing layer, and each processing layer is processed based on the processing sub-graph on each processing layer. It is used to move to the next layer by moving the laser head down or the focus of the laser head down after processing the first processing layer until all processing layers are processed. Compared with the prior art, the beneficial effects of the processing system provided by the present application are the same as the beneficial effects of the three-dimensional surface processing method provided by the above-mentioned embodiment, and other technical features in the processing system are the same as the features disclosed in the above-mentioned embodiment method, which will not be repeated here.

[0236] The present application also provides an electronic device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores a three-dimensional surface processing program that can be executed by the at least one processor, and the three-dimensional surface processing program is executed by the at least one processor so that the at least one processor can execute the three-dimensional surface processing method in the above-mentioned embodiment.

[0237] The electronic device shown in this application is only an example and should not bring any limitation to the functions and scope of use of the embodiments of this application.

[0238] An electronic device may include a control component such as a processing device (e.g., a central processing unit, a graphics processing unit, etc.), which may perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) or a program loaded from a storage device into a random access memory (RAM). In the RAM, various programs and data required for the operation of the electronic device are also stored. The processing device, ROM, and RAM are connected to each other via a bus. An input / output (I / O) interface is also connected to the bus. Typically, the following systems may be connected to the I / O interface: input devices such as a touch screen, a touch pad, a keyboard, a mouse, an image sensor, a microphone, an accelerometer, a gyroscope, etc.; output devices such as a liquid crystal display (LCD), a speaker, a vibrator, etc.; storage devices such as a magnetic tape, a hard disk, etc.; and communication devices. The communication device may allow the electronic device to communicate with other devices wirelessly or by wire to exchange data.

[0239] In particular, according to the embodiments disclosed in the present application, the process described above with reference to the flowchart can be implemented as a computer software program. For example, the embodiments disclosed in the present application include a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes a program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through a communication device, or installed from a storage device, or installed from a ROM. When the computer program is executed by a processing device, the above-mentioned functions defined in the method of the embodiment disclosed in the present application are executed.

[0240] The electronic device provided by the present application adopts the three-dimensional surface processing method in the above embodiment to solve the technical problems of how to realize three-dimensional surface processing and how to avoid distortion and deformation of graphics and improve processing efficiency while realizing three-dimensional surface processing. Compared with the prior art, the beneficial effects of the electronic device provided by the present application are the same as the beneficial effects of the three-dimensional surface processing method provided by the above embodiment, and the other technical features in the electronic device are the same as the features disclosed in the method of the previous embodiment, which will not be repeated here.

[0241] It should be understood that the various parts disclosed in this application can be implemented by hardware, software, firmware or a combination thereof. In the description of the above embodiments, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0242] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0243] The present application provides a computer-readable storage medium having computer-readable program instructions (ie, computer programs) stored thereon, and the computer-readable program instructions are used to execute the three-dimensional surface processing method in the above-mentioned embodiment.

[0244] The computer-readable storage medium provided in the present application may be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, systems or devices, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, system or device. The program code contained on the computer-readable storage medium may be transmitted using any appropriate medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination of the above.

[0245] The computer-readable storage medium may be included in the electronic device, or may exist independently without being installed in the electronic device.

[0246] The computer-readable storage medium carries one or more programs. When the one or more programs are executed by an electronic device, the electronic device: obtains a three-dimensional model of an object to be processed and a first processing graphic, renders the first processing graphic to the three-dimensional model of the object to be processed, and obtains a second processing graphic; layers the second processing graphic to obtain multiple processing layers arranged along the Z-axis direction and processing sub-graphics located on each processing layer; determines a processing path for each processing layer according to the processing sub-graphics on each processing layer, obtains the processing path for the multiple processing layers, and performs layer-by-layer processing on the object to be processed based on the processing path for the multiple processing layers.

[0247] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0248] The flow chart and block diagram in the accompanying drawings illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present application. In this regard, each square box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the square box can also occur in a sequence different from that marked in the accompanying drawings. For example, two square boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each square box in the block diagram and / or flow chart, and the combination of the square boxes in the block diagram and / or flow chart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0249] The modules involved in the embodiments of the present application may be implemented by software or hardware, wherein the name of the module does not constitute a limitation on the unit itself in some cases.

[0250] The readable storage medium provided by the present application is a computer-readable storage medium, which stores computer-readable program instructions (i.e., computer programs) for executing the above-mentioned three-dimensional surface processing method, and can solve the technical problems of how to realize three-dimensional surface processing, and how to avoid distortion and deformation of graphics and improve processing efficiency while realizing three-dimensional surface processing. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided by the present application are the same as the beneficial effects of the three-dimensional surface processing method provided by the above-mentioned embodiment, and will not be repeated here.

[0251] An embodiment of the present application also provides a computer program product, including a computer program, which implements the steps of the above-mentioned three-dimensional surface processing method when executed by a processor.

[0252] The computer program product provided by the present application can solve the technical problems of how to realize three-dimensional surface processing, and how to avoid distortion and deformation of graphics and improve processing efficiency while realizing three-dimensional surface processing. Compared with the prior art, the beneficial effects of the computer program product provided by the embodiment of the present application are the same as the beneficial effects of the three-dimensional surface processing method provided by the above embodiment, and will not be repeated here.

[0253] The above descriptions are only some embodiments of the present application, and are not intended to limit the patent scope of the present application. All equivalent structural changes made using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect applications in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A three-dimensional surface processing method, characterized in that: The following steps are involved: Acquire a three-dimensional model of the object to be processed and a first processing graphic, render the first processing graphic to the three-dimensional model, and obtain a second processing graphic; The second processing pattern is layered to obtain multiple processing layers arranged along the Z-axis direction and the processing sub-patterns distributed on each processing layer; According to the processing sub-graphics on each processing layer, the processing path of each processing layer is determined, and the processing path of the second processing graphic is obtained, so as to perform layered processing on the object to be processed based on the processing path of the second processing graphic.

2. The three-dimensional surface processing method according to claim 1, characterized in that: The step of layering the second processing pattern to obtain multiple processing layers arranged along the Z-axis direction specifically includes: Get layer height setting information; The second processing pattern is layered according to the layer height setting information to obtain multiple processing layers arranged along the Z-axis direction.

3. The three-dimensional surface processing method according to claim 1, characterized in that: The step of layering the second processed pattern specifically includes: Pre-stratifying the second processing pattern with a first preset number of layers to obtain a multi-layer pre-stratification; if the middle processing layer in the multi-layer pre-stratification does not correspond to the midpoint position of the second processing pattern, adjusting the height of each layer of the pre-stratification and / or the first preset number of layers to make the middle processing layer correspond to the midpoint position of the second processing pattern; Alternatively, an intermediate reference layer of the second processed pattern is determined according to the midpoint position of the second processed pattern, and the second processed pattern is pre-layered based on the intermediate reference layer.

4. The three-dimensional surface processing method according to any one of claims 1 to 3, characterized in that: From top to bottom along the Z-axis direction, the processing surface of the next processing layer is not less than the processing surface of the previous processing layer.

5. The three-dimensional surface processing method according to any one of claims 1 to 3, characterized in that: After executing the steps of obtaining multiple processing layers arranged along the Z-axis direction and obtaining processing sub-graphs distributed on each processing layer, the three-dimensional surface processing method further includes the following steps: The interactive interface of the terminal previews and displays the effect of the processed sub-graphics on each processing layer on the three-dimensional model.

6. The three-dimensional surface processing method according to any one of claims 1 to 3, characterized in that: The step of determining the processing path of each processing layer according to the processing sub-graphs on each processing layer specifically includes: According to the processing sub-graphics on each processing layer, the layer processing start point and the layer processing end point of each processing layer are determined, and the processing path is determined according to the layer processing start point and the layer processing end point.

7. The three-dimensional surface processing method according to claim 6, characterized in that: The step of determining the layer processing start point and the layer processing end point of each processing layer according to the processing sub-graphs on each processing layer, and determining the processing path according to the layer processing start point and the layer processing end point specifically includes: If there is an interlayer intersection point between adjacent processing layers, determining the processing end point of the previous processing layer and the processing starting point of the next processing layer respectively according to the interlayer intersection point, so that the distance between the layer processing starting point of the next processing layer and the layer processing end point of the previous processing layer is minimized; If there is no interlayer intersection between adjacent processing layers, the processing end point of the previous processing layer and the processing starting point of the next processing layer are determined respectively according to the two graphic points in the adjacent processing layers that are closest in position along the Z-axis direction, so that the distance between the layer processing starting point of the next processing layer and the layer processing end point of the previous processing layer is minimized.

8. The three-dimensional surface processing method according to any one of claims 1 to 3, characterized in that: The obtaining of the processing sub-graphs distributed on each processing layer comprises the following steps: Obtaining the intersection of the second processing pattern and each processing layer; Based on the intersection points between the second processing pattern and each processing layer, the second processing pattern is segmented to obtain processing sub-patterns distributed on each processing layer.

9. The three-dimensional surface processing method according to any one of claims 1 to 3, characterized in that: The step of performing layered processing on the object to be processed based on the processing path of the second processing graphic comprises: Controlling a processing head of a processing device to process a processing sub-graphic of a current processing layer on the object to be processed; If the processing sub-pattern of the current processing layer is completed, the processing head is moved along the Z-axis direction or the focal length of the processing head is adjusted so that the focus of the processing head moves to the next processing layer; The object to be processed is processed based on the processing sub-graph on the processing layer of the next layer.

10. A three-dimensional surface processing device, characterized in that: include: A graphics acquisition module, used to acquire a three-dimensional model of the object to be processed and a first processing graphic, and render the first processing graphic to the three-dimensional model to obtain a second processing graphic; A layering module, used for layering the second processing pattern to obtain multiple processing layers arranged along the Z-axis direction and to obtain processing sub-patterns distributed on each processing layer; A path determination module is used to determine the processing path of each processing layer according to the processing sub-graphics on each processing layer, obtain the processing path of the second processing graphic, and perform layered processing on the object to be processed based on the processing path of the second processing graphic.

11. A processing equipment, characterized in that: include: Processing head; A communication component, the communication component is used to receive a processing instruction obtained according to the steps of the three-dimensional surface processing method according to any one of claims 1 to 9; A controller is used to control the processing head to perform layered processing on the object to be processed based on a processing instruction.

12. The processing equipment according to claim 11, characterized in that The controller is used to: Control the processing head to process a processing sub-graphic of a current processing layer on the object to be processed; If the processing sub-pattern of the current processing layer is completed, the processing head is moved along the Z-axis direction or the focal length of the processing head is adjusted so that the focus of the processing head moves to the next processing layer; The object to be processed is processed based on the processing sub-graph on the processing layer of the next layer.

13. A processing system, characterized in that: include: A processing device, the processing device comprising a base plate and a processing head, the base plate comprising a processing area for placing an object to be processed, and the processing head for processing the object to be processed located in the processing area; and A terminal device that communicates with the processing equipment, the terminal device is used to execute the processing instructions generated by the three-dimensional surface processing method described in any one of claims 1-9, and send the processing instructions to the processing equipment.

14. An electronic device comprising a memory, a processor and a three-dimensional surface processing program stored in the memory, characterized in that: The processor executes the three-dimensional surface processing program to implement the steps of the three-dimensional surface processing method described in any one of claims 1 to 9.

15. A computer-readable storage medium having a three-dimensional surface processing program stored thereon, characterized in that: When the three-dimensional surface processing program is executed by a processor, the steps of the three-dimensional surface processing method described in any one of claims 1 to 9 are implemented.

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