Solder paste printing equipment applied to printed circuit board

Abstract

The invention discloses solder paste printing equipment applied to a circuit board, and relates to the technical field of solder paste printing. The device comprises a base table, an electric sliding frame is fixedly connected to the top of the base table, a liquid storage pool is formed in the top of the base table, a discharging groove is formed in one end of the base table, a lifting table is slidably connected to the interior of the discharging groove, and a discharging frame is slidably connected to the interior of the lifting table. After the extrusion roller is started to drive the lifting platform to drive the discharging frame and the circuit board to move to the position below the printing template, the electric sliding frame is started to drive the solder paste guide head to drive the material distributing roller to be attached to the top of the printing template to move, and solder paste is guided to be accurately coated on the surface of the circuit board through the printing template; and then the movable mounting frame can be driven by starting the electric sliding rail to drive the printing template to form rolling extrusion with the sponge cleaning roller in the length direction of the base table, so that the sponge cleaning roller achieves rotary cleaning of the bottom of the printing template through cleaning liquid in the liquid storage pool.

Description

Technical Field

[0001] The present application relates to the technical field of solder paste printing, and in particular to a solder paste printing device applied to a printed circuit board. Background Art

[0002] With the rapid development of the electronics industry, the manufacturing quality and efficiency of printed circuit board assemblies (PCBAs), as the basic components of electronic devices, have a crucial impact on the performance and market competitiveness of the final products. In the production process of PCBA, solder paste printing, as a key link in SMT (surface mount technology), directly determines the welding quality and the reliability of the overall circuit board. As the core tool for achieving high-precision solder paste printing, the technical level and stability of solder paste printing equipment are directly related to the yield and production efficiency of PCBA products. Therefore, the development of an efficient, accurate and easy-to-maintain solder paste printing equipment is of great significance to improving the overall level of the electronics manufacturing industry.

[0003] The existing solder paste printing equipment used for printed circuit boards usually follows the following process for solder paste printing operations: First, the preparation work includes preparing key equipment and materials such as PCB boards, solder paste, printing templates (steel meshes) and printers. The printing template is made through processes such as laser drilling or chemical etching to ensure that its aperture corresponds accurately to the component pins on the PCB board. Subsequently, the printing parameters of the printer are set, such as solder paste thickness, scraper pressure, scraper speed, etc., to adapt to different PCB boards and component requirements. During the printing process, the PCB board is placed on the printer, and the solder paste is evenly printed on the pad position of the PCB board through the cooperation of the scraper and the printing template. After printing is completed, it is necessary to conduct an inspection to ensure that the printing effect meets the quality standards.

[0004] Although existing solder paste printing equipment can achieve relatively satisfactory printing effects in most cases, the solder paste tends to adhere to the surface of the printing plate (i.e., printing template or steel mesh) after printing, which has become a major problem that plagues the industry. This adhesion phenomenon may be caused by a variety of factors, such as excessive solder paste viscosity, incomplete template cleaning, severe scraper wear, or improper printing parameter settings. If the adhered solder paste is not completely removed during the next printing, it may be printed on the surface of the circuit board, resulting in printing errors, thereby reducing the printing accuracy and product yield of the device. Summary of the invention

[0005] The purpose of this application is to solve the problem that when the adhered solder paste is not completely removed during the next printing, it may be printed on the surface of the circuit board, resulting in printing errors, thereby reducing the printing accuracy and product yield of the device. This application provides a solder paste printing device for a printed circuit board.

[0006] In order to achieve the above-mentioned purpose, this application specifically adopts the following technical solutions: A solder paste printing device for printed circuit boards comprises a base, the top of the base is fixedly connected to an electric slide, the top of the base is provided with a liquid storage tank, one end of the base is provided with a material discharge trough, the inside of the material discharge trough is slidably connected to a lifting platform, the inside of the lifting platform is slidably connected to a material discharge frame, the top of the base is symmetrically fixedly connected to an electric slide rail, the tops of the two electric slide rails are slidably connected to a mobile mounting frame, a printing template is inserted into the mobile mounting frame, one end of the electric slide is slidably connected to a solder paste guide head, the inside of the solder paste guide head is A material distribution bin is provided, a material discharge trough is provided at the bottom of the material distribution bin, a material distribution roller is rotatably connected inside the material discharge trough, a sponge cleaning roller is rotatably connected inside the liquid storage tank, and an extrusion roller is rotatably connected inside the liquid storage tank, the extrusion roller forms an extrusion conflict with the bottom of the sponge cleaning roller, a lifting electric push rod is fixedly connected inside the material discharge trough, the output end of the lifting electric push rod is fixedly connected to the lifting platform, a transmission assembly for driving the sponge cleaning roller to rotate is installed at one end of the mobile mounting frame, and a locking mechanism for fixing the material discharge frame is installed at one end of the lifting platform.

[0007] By adopting the above technical scheme and setting the locking mechanism and the transmission component for coordinated use, it is convenient to start the extrusion roller to drive the lifting platform to drive the material discharge frame and the circuit board to move to the bottom of the printing template, and then start the electric slide to drive the solder paste guide head to drive the cloth roller to move in contact with the top of the printing template, and guide the solder paste to be accurately coated on the surface of the circuit board through the printing template, and then start the electric slide to drive the mobile mounting frame to drive the printing template to form a rolling extrusion with the sponge cleaning roller along the length direction of the base, so that the sponge cleaning roller uses the cleaning liquid in the liquid storage tank to realize rotational cleaning of the bottom of the printing template, so as to reduce the adhesion of solder paste to the bottom of the printing template, effectively reduce the situation of printing errors caused by the adhesion of solder paste on the surface of the printing template, and improve the printing accuracy and product yield of the device.

[0008] Furthermore, the transmission assembly includes a transmission rack fixedly connected to one end of the mobile mounting frame, and one end of the sponge cleaning roller passes through the base and is fixedly connected to a transmission gear meshing with the transmission rack.

[0009] By adopting the above technical solution and setting the coordinated use of the transmission rack and the transmission gear, it is convenient to drive the mobile mounting frame to drive the printing template to move along the length direction of the electric slide rail, so that the mobile mounting frame drives the transmission rack to engage with the transmission gear, and the transmission gear drives the sponge cleaning roller to rotate, thereby effectively improving the cleaning efficiency of the sponge cleaning roller on one end of the printing template.

[0010] Furthermore, the locking mechanism includes a storage groove symmetrically opened at one end of the lifting platform, the interior of the storage groove is slidably connected with an arc-shaped slider, one end of the arc-shaped slider is evenly and fixedly connected with three locking springs, the locking springs are installed inside the storage groove, and an unlocking component is arranged inside the lifting platform.

[0011] By adopting the above technical solution, by setting the unlocking component for use with the arc-shaped slider and the locking spring, after the discharge frame is pushed to drive the circuit board to be inserted into the lifting platform, the rebound characteristics of the locking spring are used to push the arc-shaped slider out of the storage groove, and form a snap-fit ​​fixation with one end of the discharge frame to facilitate the fixed installation of the circuit board, thereby effectively improving the printing accuracy and stability of the circuit board.

[0012] Furthermore, the unlocking component includes an unlocking slide groove opened inside the lifting platform, the unlocking slide groove is connected to the storage groove, the bottom of the arc-shaped slider is fixedly connected to an inclined transmission rod, the inclined transmission rod is slidably connected to the inside of the unlocking slide groove, the middle section of the unlocking slide groove is slidably connected to an unlocking slider, one end of the unlocking slider is symmetrically rotatably connected to a resistance wheel, and the resistance wheel forms a rolling resistance with the inclined surface of the inclined transmission rod.

[0013] By adopting the above technical solution, by setting the unlocking slider in cooperation with the resistance wheel and the inclined transmission rod, pushing the unlocking slider can drive the resistance wheel and the inclined transmission rod to form a rolling resistance, and push the two inclined transmission rods to move away from each other along the length direction of the unlocking slide groove, thereby facilitating driving the inclined transmission rod to drive the arc-shaped slider to retract into the interior of the storage groove and release the fixation of the discharge frame, thereby improving the practicability of the device.

[0014] Furthermore, a plurality of arc-shaped material distribution grooves are evenly and symmetrically provided on the inner side of the material discharge groove.

[0015] By adopting the above technical solution and setting a plurality of arc-shaped feeding troughs, it is convenient to guide the solder paste inside the feeding bin to quickly pass through the feeding trough and the feeding roller, thereby effectively reducing the jamming of the solder paste and improving the practicality of the device.

[0016] Furthermore, a collecting net bag is fixedly connected to the interior of the material distribution bin, a driving rod is rotatably connected to the interior of the collecting net bag, one end of the driving rod is symmetrically fixedly connected to an auger with opposite rotation direction, one end of the base is fixedly connected to a distribution motor, and the output end of the distribution motor is fixedly connected to the driving rod.

[0017] By adopting the above technical solution, by setting up the collection net bag and the use of the auger, the distribution motor can be started to drive the two augers to evenly distribute the solder paste to the inside of the distribution bin, and guide the solder paste to evenly pass through the feed trough and the distribution roller, and coat the surface of the printing template, thereby effectively improving the printing accuracy of the solder paste.

[0018] Furthermore, one end of the solder paste guiding head is fixedly connected with a scraper.

[0019] By adopting the above technical solution, a scraper is provided to facilitate the flattening of the surface of the solder paste coated by the cloth roller, thereby further improving the coating accuracy of the solder paste.

[0020] Furthermore, a plurality of locking through slots are evenly formed at one end of the movable mounting frame, locking screws are inserted into the locking through slots, and a locking screw slot threadably connected to the locking screw is formed at one end of the printing template.

[0021] By adopting the above technical solution, by setting the locking screw and the locking through groove and the locking screw groove for coordinated use, it is convenient to achieve the fixed connection and separation of the printing template and the movable mounting frame by tightening or loosening the locking screw, thereby realizing the replacement of the printing template and effectively improving the practicality of the device.

[0022] In summary, the present application includes at least one of the following beneficial effects: 1. By setting up the locking mechanism and the transmission component for coordinated use, after starting the squeezing roller to drive the lifting platform to drive the material discharging frame and the circuit board to move to the bottom of the printing template, the electric slide can be started to drive the solder paste guide head to drive the cloth roller to move in contact with the top of the printing template, and guide the solder paste to be accurately coated on the surface of the circuit board through the printing template, and then the electric slide can be started to drive the mobile mounting frame to drive the printing template to form a rolling extrusion with the sponge cleaning roller along the length direction of the base, so that the sponge cleaning roller uses the cleaning liquid in the liquid reservoir to realize the rotational cleaning of the bottom of the printing template, so as to reduce the adhesion of solder paste to the bottom of the printing template, effectively reduce the situation of printing errors caused by the adhesion of solder paste on the surface of the printing template, and improve the printing accuracy and product yield of the device.

[0023] 2. By setting up the coordinated use of the transmission rack and the transmission gear, when the mobile mounting frame is driven to drive the printing template to move along the length direction of the electric slide rail, the mobile mounting frame drives the transmission rack to engage with the transmission gear, and the transmission gear drives the sponge cleaning roller to rotate, thereby effectively improving the cleaning efficiency of the sponge cleaning roller on one end of the printing template.

[0024] 3. By setting up the collection net bag and the auger for use, the distribution motor can be started to drive the two augers to evenly distribute the solder paste to the inside of the distribution bin, and guide the solder paste to evenly pass through the feed trough and the distribution roller, and coat the surface of the printing template, effectively improving the printing accuracy of the solder paste. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the three-dimensional structure of the device body in this application.

[0026] Figure 2 It is a schematic diagram of the connection relationship between the mobile mounting frame and the printing template in this application.

[0027] Figure 3 It is an exploded view of the internal structure of the material distribution bin in this application.

[0028] Figure 4 It is an exploded view of the internal structure of the discharge trough in this application.

[0029] Description of reference numerals: 1. Base; 2. Electric slide; 3. Liquid storage tank; 4. Discharge trough; 5. Lifting platform; 6. Discharge frame; 7. Electric slide rail; 8. Mobile mounting frame; 9. Printing template; 10. Solder paste guide head; 11. Distribution bin; 12. Discharge trough; 13. Distribution roller; 14. Sponge cleaning roller; 15. Extrusion roller; 16. Lifting electric push rod; 17. Transmission rack; 18. Transmission gear; 19. Storage slot; 20. Arc slider; 21. Locking spring; 22. Inclined transmission rod; 23. Unlocking slider; 24. Resistance wheel; 25. Arc distribution trough; 26. Collection net bag; 27. Auger; 28. Distribution motor; 29. ​​Scraper; 30. Locking slot; 31. Locking screw; 32. Locking screw groove; 33. Unlocking slide; 34. Drive rod. DETAILED DESCRIPTION

[0030] The following is combined with Figure 1-4 This application is described in further detail.

[0031] The embodiment of the present application discloses a solder paste printing device applied to a printed circuit board.

[0032] Reference Figure 1-Figure 4A solder paste printing device for printed circuit boards comprises a base 1, an electric slide 2 is fixedly connected to the top of the base 1, a liquid storage tank 3 is provided on the top of the base 1, a material discharge trough 4 is provided at one end of the base 1, a lifting platform 5 is slidably connected to the inside of the material discharge trough 4, a material discharge frame 6 is slidably connected to the inside of the lifting platform 5, an electric slide rail 7 is symmetrically fixedly connected to the top of the base 1, a mobile mounting frame 8 is slidably connected to the top of the two electric slide rails 7, a printing template 9 is inserted into the mobile mounting frame 8, a solder paste guide head 10 is slidably connected to one end of the electric slide 2, a cloth is provided inside the solder paste guide head 10 The bottom of the material distributing bin 11 is provided with a material distributing trough 12, the inside of the material distributing trough 12 is rotatably connected with a material distributing roller 13, the inside of the liquid storage tank 3 is rotatably connected with a sponge cleaning roller 14, and the inside of the liquid storage tank 3 is rotatably connected with an extrusion roller 15, the extrusion roller 15 forms an extrusion conflict with the bottom of the sponge cleaning roller 14, the inside of the material discharging trough 4 is fixedly connected with a jacking electric push rod 16, the output end of the jacking electric push rod 16 is fixedly connected with the lifting platform 5, one end of the mobile mounting frame 8 is installed with a transmission component for driving the sponge cleaning roller 14 to rotate, and one end of the lifting platform 5 is installed with a locking mechanism for fixing the material discharging frame 6; The transmission assembly includes a transmission rack 17 fixedly connected to one end of the mobile mounting frame 8, and one end of the sponge cleaning roller 14 passes through the base 1 and is fixedly connected to a transmission gear 18 meshing with the transmission rack 17; Moreover, the locking mechanism includes a receiving groove 19 symmetrically opened at one end of the lifting platform 5, an arc-shaped slider 20 is slidably connected inside the receiving groove 19, and three locking springs 21 are evenly fixedly connected to one end of the arc-shaped slider 20. The locking spring 21 is installed inside the receiving groove 19, and an unlocking component is arranged inside the lifting platform 5; In addition, the unlocking component includes an unlocking slide groove 33 opened inside the lifting platform 5, the unlocking slide groove 33 is connected to the storage groove 19, the bottom of the arc-shaped slider 20 is fixedly connected to the inclined transmission rod 22, the inclined transmission rod 22 is slidably connected to the inside of the unlocking slide groove 33, the middle section of the unlocking slide groove 33 is slidably connected to the unlocking slider 23, one end of the unlocking slider 23 is symmetrically rotatably connected to the contact wheel 24, and the contact wheel 24 forms a rolling contact with the inclined surface of the inclined transmission rod 22.

[0033] When in use, first place the circuit board to be printed on the top of the material discharging frame 6, and manually push the material discharging frame 6 to drive the circuit board to be inserted into the lifting platform 5, and at the same time, one end of the material discharging frame 6 pushes the arc-shaped slider 20 to squeeze the locking spring 21 to produce a contraction deformation, and the arc-shaped slider 20 is retracted into the storage groove 19, and then when the material discharging frame 6 drives the circuit board to move completely into the lifting platform 5, the locking spring 21 is caused to rebound and deform, and the two arc-shaped sliders 20 are pushed to move closer to each other along the length direction of the lifting platform 5, and at the same time, the arc-shaped slider 20 is in conflict with one side of the material discharging frame 6, and the material discharging frame 6 and the circuit board are fixed between the lifting platform 5 and the material discharging groove 4, so that the circuit board and the printing template 9 are fixedly aligned; Then, the lifting platform 5 is lifted by starting the lifting electric push rod 16, and the lifting platform 5 drives the material discharging frame 6 and the circuit board to lift and move to the bottom of the printing template 9. Then, the solder paste guide head 10 is set to be connected to the solder paste pump through the pipeline to draw the solder paste into the interior of the distribution bin 11. Then, the electric slide 2 is started to drive the solder paste guide head 10 to drive the distribution roller 13 to move in contact with the top of the printing template 9, and the distribution roller 13 and the printing template 9 form a rolling conflict, so that the distribution roller 13 pushes the solder paste inside the distribution bin 11 to pass through the gap between the material discharge trough 12 and the surface of the printing template 9, and then part of the solder paste passes through the positioning holes on the surface of the printing template 9 and is printed on the circuit board, so as to realize the solder paste printing on the surface of the circuit board; After the printing is completed, the lifting electric push rod 16 is started in the reverse direction to drive the lifting platform 5 to drive the material discharging frame 6 and the circuit board to move away from the printing template 9, and then the unlocking slider 23 is manually pressed to push the conflicting wheel 24 to form a rolling conflict with the inclined transmission rod 22, and the two inclined transmission rods 22 are pushed to drive the arc-shaped slider 20 to move away from each other, so that the arc-shaped slider 20 squeezes the locking spring 21 to produce a contraction deformation, and retracts into the storage groove 19, and at the same time, the arc-shaped slider 20 releases the lock on one end of the material discharging frame 6, and then the material discharging frame 6 is manually pulled to drive the circuit board out of the lifting platform 5; Then, the electric slide rail 7 is started to drive the movable mounting frame 8 to drive the printing template 9 to move along the length direction of the base 1 toward the top of the liquid storage tank 3, and at the same time, the printing template 9 is rolled and squeezed with the top of the sponge cleaning roller 14 along the length direction of the base 1. At the same time, the movable mounting frame 8 drives the printing template 9 to move along the length direction of the electric slide rail 7, so that the movable mounting frame 8 drives the transmission rack 17 to mesh with the transmission gear 18, and drives the transmission gear 18 to drive the sponge cleaning roller 14 to rotate, so that the printing template 9 is pressed against the sponge cleaning roller along the length direction of the base 1. When 14 forms rolling extrusion, the sponge cleaning roller 14 absorbs the cleaning liquid inside the liquid storage tank 3, and forms a rotational cleaning for the bottom of the printing template 9 to reduce the adhesion of solder paste to the bottom of the printing template 9, and while the sponge cleaning roller 14 rotates, the sponge cleaning roller 14 squeezes the squeezing roller 15 to produce a shrinkage deformation, and discharges the stains absorbed by the cleaning printing template 9 into the liquid storage tank 3, thereby facilitating the automatic cleaning of the bottom of the printing template 9, effectively reducing the situation where the solder paste on the surface of the printing template 9 adheres to the printing error, and improving the printing accuracy and product yield of the device.

[0034] Reference Figure 1 and Figure 3 A plurality of arc-shaped material distribution grooves 25 are evenly and symmetrically provided on the inner side of the material discharging groove 12; Among them, a collection net bag 26 is fixedly connected inside the material distribution bin 11, and a driving rod 34 is rotatably connected inside the collection net bag 26. One end of the driving rod 34 is symmetrically fixedly connected to an auger 27 with an opposite rotation direction. One end of the base 1 is fixedly connected to a distribution motor 28, and the output end of the distribution motor 28 is fixedly connected to the driving rod 34. Furthermore, a scraper 29 is fixedly connected to one end of the solder paste guiding head 10 .

[0035] When in use, when the solder paste guide head 10 is driven to drive the cloth roller 13 to move in contact with the top of the printing template 9, the solder paste introduced into the cloth bin 11 is buffered and intercepted by setting the collection net bag 26, so that the solder paste is gathered inside the collection net bag 26, and at the same time, the distribution motor 28 is started to drive the driving rod 34 to drive the two augers 27 to rotate synchronously, and the augers 27 push the solder paste gathered inside the cloth bin 11 to be evenly distributed along the length direction of the collection net bag 26, and then The solder paste passes through the collecting net bag 26 and enters the interior of the feeding trough 12 to contact the surface of the feeding roller 13, and then the solder paste is coated on the surface of the printing template 9 through the feeding roller 13. At the same time, a scraper 29 is provided to evenly spread the solder paste coated on the surface of the printing template 9, and an arc-shaped feeding trough 25 is provided to quickly guide the solder paste accumulated in the feeding bin 11 through the feeding trough 12, thereby reducing the jamming of the solder paste between the feeding trough 12 and the feeding roller 13, thereby effectively improving the uniformity of the distribution of the solder paste.

[0036] Reference Figure 1 and Figure 2 A plurality of locking through slots 30 are evenly formed at one end of the movable mounting frame 8 , a locking screw 31 is inserted into the locking through slot 30 , and a locking screw slot 32 threadedly connected to the locking screw 31 is formed at one end of the printing template 9 .

[0037] When in use, the fixed connection between the printing template 9 and the movable mounting frame 8 can be released by loosening the locking screw 31, thereby facilitating the replacement of a new printing template 9. Then, the locking screw 31 is pulled through the locking through slot 30 to form a threaded connection with the locking screw slot 32 at one end of the printing template 9, so as to achieve a fixed connection between the printing template 9 and the movable mounting frame 8, thereby facilitating the replacement of the printing template 9 and effectively improving the applicability of the device.

[0038] The implementation principle of the solder paste printing device applied to the printed circuit board of the present embodiment is as follows: first, the lifting platform 5 is lifted by starting the lifting electric push rod 16, and the lifting platform 5 drives the material discharging frame 6 and the circuit board to lift and move to the bottom of the printing template 9, and then the solder paste guide head 10 is set to be connected to the solder paste pump through the pipeline to draw the solder paste into the interior of the distribution bin 11, and at the same time, the distribution motor 28 is started to drive the driving rod 34 to drive the two augers 27 to rotate synchronously, and the augers 27 push the solder paste gathered in the distribution bin 11 to be evenly distributed along the length direction of the collection net bag 26, and then the electric slide 2 is started to drive the solder paste guide head 10 to drive the distribution roller 13 to move in contact with the top of the printing template 9, and the distribution roller 13 forms a rolling conflict with the printing template 9, so that the distribution roller 13 pushes the solder paste in the distribution bin 11 to pass through the gap between the material discharge trough 12 and the surface of the printing template 9, and then part of the solder paste passes through the positioning holes on the surface of the printing template 9 and is printed on the circuit board; After the printing is completed, the lifting electric push rod 16 is started in the reverse direction to drive the lifting platform 5 to drive the material discharging frame 6 and the circuit board to move away from the printing template 9, and then the unlocking slider 23 is manually pressed to push the conflicting wheel 24 to form a rolling conflict with the inclined transmission rod 22, and the two inclined transmission rods 22 are pushed to drive the arc-shaped slider 20 to move away from each other, so that the arc-shaped slider 20 squeezes the locking spring 21 to produce a contraction deformation, and retracts into the storage groove 19, and at the same time, the arc-shaped slider 20 releases the lock on one end of the material discharging frame 6; Then, the electric slide rail 7 is started to drive the movable mounting frame 8 to drive the printing template 9 to move toward the top of the liquid storage tank 3 along the length direction of the base 1. At the same time, the movable mounting frame 8 drives the transmission rack 17 to engage with the transmission gear 18, and drives the transmission gear 18 to drive the sponge cleaning roller 14 to rotate, so that the printing template 9 forms a rolling extrusion with the top of the sponge cleaning roller 14 along the length direction of the base 1, and the sponge cleaning roller 14 absorbs the cleaning liquid inside the liquid storage tank 3, so as to form a rotational cleaning on the bottom of the printing template 9.

Claims

1. A solder paste printing device for a printed circuit board, comprising a base (1), characterized in that: The top of the base (1) is fixedly connected to an electric slide (2), and a liquid storage tank (3) is provided on the top of the base (1); a material discharge trough (4) is provided at one end of the base (1); a lifting platform (5) is slidably connected to the inside of the material discharge trough (4); a material discharge frame (6) is slidably connected to the inside of the lifting platform (5); an electric slide rail (7) is symmetrically fixedly connected to the top of the base (1); a mobile mounting frame (8) is slidably connected to the top of the two electric slide rails (7); a printing template (9) is inserted into the inside of the mobile mounting frame (8); a solder paste guide head (10) is slidably connected to one end of the electric slide (2); a material distribution bin (11) is provided inside the solder paste guide head (10); the material distribution bin (11) is provided with a material distribution bin (11) and a material distribution bin (11) is provided with a material distribution bin (11). A feeding trough (12) is provided at the bottom of the feeding trough (11), a feeding roller (13) is rotatably connected inside the feeding trough (12), a sponge cleaning roller (14) is rotatably connected inside the liquid storage tank (3), and a squeezing roller (15) is rotatably connected inside the liquid storage tank (3), and the squeezing roller (15) forms a squeezing conflict with the bottom of the sponge cleaning roller (14), a lifting electric push rod (16) is fixedly connected inside the feeding trough (4), and the output end of the lifting electric push rod (16) is fixedly connected to the lifting platform (5), one end of the movable mounting frame (8) is installed with a transmission component for driving the sponge cleaning roller (14) to rotate, and one end of the lifting platform (5) is installed with a locking mechanism for fixing the feeding frame (6).

2. The solder paste printing device for printed circuit boards according to claim 1, characterized in that: The transmission assembly comprises a transmission rack (17) fixedly connected to one end of the mobile mounting frame (8); one end of the sponge cleaning roller (14) passes through the base (1) and is fixedly connected to a transmission gear (18) meshing with the transmission rack (17).

3. The solder paste printing device for printed circuit boards according to claim 1, characterized in that: The locking mechanism comprises a receiving groove (19) symmetrically arranged at one end of the lifting platform (5); an arc-shaped slider (20) is slidably connected inside the receiving groove (19); one end of the arc-shaped slider (20) is evenly and fixedly connected with three locking springs (21); the locking springs (21) are installed inside the receiving groove (19); and an unlocking component is arranged inside the lifting platform (5).

4. The solder paste printing device for a printed circuit board according to claim 3, characterized in that: The unlocking assembly comprises an unlocking slide groove (33) provided inside the lifting platform (5), the unlocking slide groove (33) being communicated with the storage groove (19), the bottom of the arc-shaped slider (20) being fixedly connected with an inclined transmission rod (22), the inclined transmission rod (22) being slidably connected inside the unlocking slide groove (33), the middle section of the unlocking slide groove (33) being slidably connected with the unlocking slider (23), one end of the unlocking slider (23) being symmetrically rotatably connected with a resistance wheel (24), the resistance wheel (24) forming a rolling resistance with the inclined surface of the inclined transmission rod (22).

5. The solder paste printing device for printed circuit boards according to claim 1, characterized in that: A plurality of arc-shaped material distribution grooves (25) are evenly and symmetrically formed on the inner side of the material discharge groove (12).

6. The solder paste printing device for a printed circuit board according to claim 1, characterized in that: The material distribution bin (11) is fixedly connected to a material collection net bag (26) inside, and the material collection net bag (26) is rotatably connected to a driving rod (34) inside, and one end of the driving rod (34) is symmetrically fixedly connected to an auger (27) with an opposite rotation direction, and one end of the base (1) is fixedly connected to a distribution motor (28), and the output end of the distribution motor (28) is fixedly connected to the driving rod (34).

7. The solder paste printing device for a printed circuit board according to claim 1, characterized in that: One end of the solder paste guiding head (10) is fixedly connected to a scraper (29).

8. The solder paste printing device for a printed circuit board according to claim 1, characterized in that: A plurality of locking through slots (30) are evenly formed at one end of the movable mounting frame (8), locking screws (31) are inserted into the locking through slots (30), and a locking screw slot (32) threadedly connected to the locking screw (31) is formed at one end of the printing template (9).

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