High-performance copper alloy for electronics

Abstract

The application discloses a high-performance copper alloy for electronics and relates to the technical field of electronic materials. The high-performance copper alloy for electronics is modified by nano-silver and nano-tin, under high-temperature conditions, molten metals penetrate each other, fill the gaps between particles, and make the connection more compact, so that the conductive performance and mechanical properties of the matrix are improved, then, under high oxygen pressure, alloy powders mainly containing aluminum, chromium and tungsten carbide are radiated by laser energy, melted and solidified, and metallurgically combined with the matrix, a chromium trioxide oxidation film is first generated on the surface of the matrix, the oxygen activity at the interface of the oxidation film is reduced, the formation of aluminum is promoted, a dense, complete and continuous aluminum oxide protective film is formed, then, tungsten carbide in the protective film forms a nucleation core, the surrounding structure is refined, the mechanical properties of the coating are improved, and the high-temperature oxidation resistance of the matrix is enhanced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic materials, in particular to a high-performance copper alloy for electronics. BACKGROUND

[0002] With the continuous progress of human understanding of nature and the ability to transform, we have entered a modern society with high development of electrification and electronic information. Integrated circuits, high-speed rail transportation, power transmission, and other aspects of cutting-edge industrial equipment closely related to social development and livelihood construction require the extensive participation of copper. Pure copper generally has good electrical conductivity, thermal conductivity, corrosion resistance, and easy processing performance. However, its strength often cannot meet the relevant use requirements, and thus needs to be strengthened. Traditional copper alloys are widely used in various industrial fields due to their excellent thermal conductivity, electrical conductivity, and corrosion resistance. However, when strengthened, they often partially sacrifice other properties such as electrical conductivity, thermal conductivity, and corrosion resistance, making it difficult to form good comprehensive use performance. In addition, under extreme conditions for a long time, copper alloys are prone to various wear and corrosion failure phenomena, and the failure of copper alloys can cause significant economic losses to engineering production and manufacturing. Therefore, it is particularly necessary to invent a high-performance copper alloy for electronics. SUMMARY

[0003] The purpose of the present application is to provide a high-performance copper alloy for electronics and a preparation method thereof to solve the problems in the prior art.

[0004] To solve the above technical problems, the present application provides the following technical scheme: a high-performance copper alloy for electronics, which is prepared by coating a modified copper alloy with an alloy powder through laser cladding.

[0005] Further, the modified copper alloy is prepared by modifying a copper alloy with nano-silver and nano-tin under high temperature conditions.

[0006] Further, a preparation method of a high-performance copper alloy for electronics includes the following preparation steps:

[0007] (1) Mix nano-silver, nano-tin, and a copper alloy, vacuum smelt, then pour into a mold, and cool to room temperature to obtain a modified copper alloy;

[0008] (2) Coat the modified copper alloy with an alloy powder through laser cladding under high oxygen pressure to obtain a high-performance copper alloy for electronics.

[0009] Further, the mass percentage of the copper alloy composition in step (1) is: zinc 29%, manganese 3%, iron 2%, and copper 66%.

[0010] Further, the vacuum degree in step (1) is 0.1 Pa.

[0011] Further, the smelting temperature of step (1) is 950-1100 DEG C, and the time is 3-6h.

[0012] Further, the mass ratio of the nano-silver, nano-tin and copper alloy in step (1) is 1:1-3:50.

[0013] Further, the high oxygen pressure in step (2) is 260-350kPa.

[0014] Further, the mass percentage of the alloy powder components in step (2) is: aluminum 30%, chromium 30%, tungsten carbide 15%, nickel 20%, and cobalt 5%.

[0015] Further, the laser cladding process parameters in step (2) are: laser power is 1500W, and the scanning speed is 2mm / s.

[0016] Compared with the prior art, the present application has the following beneficial effects:

[0017] The present application enhances the electrical conductivity of the copper alloy by adding nano-silver, and then adding tin particles. Under high temperature conditions, the molten metals penetrate each other, fill the gaps between the particles, and make the connection more compact, thereby improving the electrical conductivity. The silver oxide on the surface of the silver particles is decomposed into silver and oxygen, both of which react with tin. Part of the silver particles generates intermetallic compounds, which can limit the migration of silver ions and improve the stability of the matrix. The other part generates tin oxide, thereby enhancing the mechanical properties of the copper alloy and achieving the effect of high-temperature oxidation resistance. Then, under high oxygen pressure, the alloy powder mainly composed of aluminum, chromium and tungsten carbide is radiated by laser energy, melted and solidified, and metallurgically combined with the matrix. In the early stage of oxidation, a chromium trioxide oxidation film is first formed on the surface of the matrix, which reduces the oxygen activity at the interface of the oxidation film, promotes the formation of a dense, complete and continuous aluminum oxide protective film, and then the tungsten carbide in the film forms a nucleation core, which refines the surrounding tissue, improves the mechanical properties of the coating, and enhances the high-temperature oxidation resistance of the matrix. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0019] In order to more clearly illustrate the method provided by the present application, the following examples are used to illustrate in detail. In the following examples, the test methods of each index of the high-performance copper alloy for electronic devices are as follows:

[0020] Conductivity: Take the same size of the examples and the comparative example by four-terminal network method to obtain the resistance, and then according to the sample size, the conductivity is obtained.

[0021] High temperature oxidation resistance: Take the same size of the examples and the comparative example, bake at 300℃ for 5h under oxygen condition, take out, cool to room temperature, record the discoloration.

[0022] Mechanical properties: Take the same size of the examples and the comparative example, test the tensile strength of the sample according to JISZ2201 and JISZ2241.

[0023] Example 1

[0024] (1) Mix nano-silver, nano-tin and copper alloy, melt at 950℃ under 0.1Pa vacuum for 3h, then pour into a mold, cool to room temperature to obtain modified copper alloy; the mass ratio of the nano-silver, nano-tin and copper alloy is 1:1:50; the mass percentage of the copper alloy composition is: zinc 29%, manganese 3%, iron 2%, copper 66%;

[0025] (2) Coat the modified copper alloy with alloy powder by laser cladding under oxygen condition at 260kPa, the process parameters are: laser power is 1500W, scanning speed is 2mm / s, to obtain high-performance copper alloy for electronics; the mass percentage of the alloy powder composition is: aluminum 30%, chromium 30%, tungsten carbide 15%, nickel 20%, cobalt 5%.

[0026] Example 2

[0027] (1) Mix nano-silver, nano-tin and copper alloy, melt at 1025℃ under 0.1Pa vacuum for 4h, then pour into a mold, cool to room temperature to obtain modified copper alloy; the mass ratio of the nano-silver, nano-tin and copper alloy is 1:2:50; the mass percentage of the copper alloy composition is: zinc 29%, manganese 3%, iron 2%, copper 66%;

[0028] (2) Coat the modified copper alloy with alloy powder by laser cladding under oxygen condition at 310kPa, the process parameters are: laser power is 1500W, scanning speed is 2mm / s, to obtain high-performance copper alloy for electronics; the mass percentage of the alloy powder composition is: aluminum 30%, chromium 30%, tungsten carbide 15%, nickel 20%, cobalt 5%.

[0029] Example 3

[0030] (1) mixed nano-silver, nano-tin, copper alloy, melted at 1100℃ under vacuum degree of 0.1 Pa for 6h, then poured into a mold, cooled to room temperature to obtain modified copper alloy; the mass ratio of the nano-silver, nano-tin, copper alloy is 1:3:50; the mass percentage of the copper alloy composition is: zinc 29%, manganese 3%, iron 2%, copper 66%;

[0031] (2) under the condition of oxygen with a gas pressure of 350 kPa, alloy powder is coated with modified copper alloy by laser cladding, the process parameters are: laser power is 1500 W, scanning speed is 2 mm / s, to obtain high-performance copper alloy for electron; the mass percentage of the alloy powder composition is: aluminum 30%, chromium 30%, tungsten carbide 15%, nickel 20%, cobalt 5%.

[0032] Comparative Example 1

[0033] Comparative Example 1 and Example 2 differ in step (1), which is changed to: mixed nano-tin, copper alloy, melted at 1025℃ under vacuum degree of 0.1 Pa for 4h, then poured into a mold, cooled to room temperature to obtain modified copper alloy; the mass ratio of the nano-tin, copper alloy is 2:50; the mass percentage of the copper alloy composition is: zinc 29%, manganese 3%, iron 2%, copper 66%; the remaining steps are the same as Example 2.

[0034] Comparative Example 2

[0035] Comparative Example 2 and Example 2 differ in step (1), which is changed to: mixed nano-silver, copper alloy, melted at 1025℃ under vacuum degree of 0.1 Pa for 4h, then poured into a mold, cooled to room temperature to obtain modified copper alloy; the mass ratio of the nano-silver, copper alloy is 1:50; the mass percentage of the copper alloy composition is: zinc 29%, manganese 3%, iron 2%, copper 66%; the remaining steps are the same as Example 2.

[0036] Comparative Example 3

[0037] Comparative Example 3 and Example 2 differ in that there is no step (1); the remaining steps are the same as Example 2.

[0038] Comparative Example 4

[0039] Comparative Example 4 and Example 2 differ in step (2), which is changed to: under the condition of oxygen with a gas pressure of 310 kPa, alloy powder is coated with modified copper alloy by laser cladding, the process parameters are: laser power is 1500 W, scanning speed is 2 mm / s, to obtain high-performance copper alloy for electron; the mass percentage of the alloy powder composition is: chromium 45%, tungsten carbide 30%, nickel 20%, cobalt 5%; the remaining steps are the same as Example 2.

[0040] Comparative Example 5

[0041] The difference between the comparative example 5 and the example 2 is that the step (2) is changed, and the step (2) is changed to: the alloy powder is coated and modified by laser cladding under the condition of oxygen with a gas pressure of 310 kPa, the process parameters are that the laser power is 1500 W and the scanning speed is 2 mm / s, and the high-performance copper alloy for electronic use is obtained; the mass percentage of the alloy powder composition is: aluminum 45%, tungsten carbide 30%, nickel 20%, and cobalt 5%; and the remaining steps are the same as those in the example 2.

[0042] Comparative example 6

[0043] The difference between the comparative example 6 and the example 2 is that the step (2) is changed, and the step (2) is changed to: the alloy powder is coated and modified by laser cladding under the condition of oxygen with a gas pressure of 310 kPa, the process parameters are that the laser power is 1500 W and the scanning speed is 2 mm / s, and the high-performance copper alloy for electronic use is obtained; the mass percentage of the alloy powder composition is: aluminum 40%, chromium 35%, nickel 20%, and cobalt 5%; and the remaining steps are the same as those in the example 2.

[0044] Comparative example 7

[0045] The difference between the comparative example 7 and the example 2 is that the step (2) is changed, and the step (2) is changed to: the alloy powder is coated and modified by laser cladding, the process parameters are that the laser power is 1500 W and the scanning speed is 2 mm / s, and the high-performance copper alloy for electronic use is obtained; the mass percentage of the alloy powder composition is: aluminum 30%, chromium 30%, tungsten carbide 15%, nickel 20%, and cobalt 5%; and the remaining steps are the same as those in the example 2.

[0046] Comparative example 8

[0047] The difference between the comparative example 8 and the example 2 is that there is no step (2); and the remaining steps are the same as those in the example 2.

[0048] Effect example

[0049] The performance analysis results of the high-performance copper alloy for electronic use in the examples 1 to 3 and the comparative examples 1 to 7 of the application are shown in the following table 1.

[0050] Table 1

[0051]

[0052] From the comparison of the experimental results of the examples and the comparative examples in Table 1, it can be found that, in the present application, the copper alloy is modified by nano-silver and nano-tin, under high temperature conditions, the molten metals penetrate each other, fill the gaps between the particles and make the connection more closely, thereby improving the electrical conductivity, wherein the silver oxide on the surface of the silver particles is decomposed into silver and oxygen, both of which react with tin, part of which generates intermetallic compounds, which can limit the migration of silver ions and improve the stability of the matrix, and the other part generates tin oxide, thereby enhancing the mechanical properties of the copper alloy and achieving the effect of high-temperature oxidation resistance, then, under the condition of high oxygen pressure, the alloy powder mainly composed of aluminum, chromium and tungsten carbide is melted and solidified by laser energy radiation and metallurgically combined with the matrix, first generating a chromium trioxide oxidation film, which reduces the oxygen activity at the interface of the oxidation film and promotes the formation of a dense, complete and continuous aluminum oxide protective film, then, the tungsten carbide in it forms a nucleation core, which refines the surrounding structure, improves the mechanical properties of the coating, and enhances the high-temperature oxidation resistance of the matrix.

[0053] It will be obvious to a person skilled in the art that the application is not limited to the details of the above-described exemplary embodiments, but that the application can be implemented in other concrete forms without departing from the spirit or essential characteristics of the application. Therefore, the embodiments should be considered in all respects as illustrative and not restrictive, the scope of the application being defined by the appended claims rather than the above description, and it is therefore intended that all changes that come within the meaning and range of equivalents of the claims are embraced therein. Any reference signs in the claims should not be construed as limiting the claims to the figures in which the reference signs are used.

Claims

1. A high-performance copper alloy for electronic applications, characterized in that, The preparation steps include the following: (1) Nano silver, nano tin and copper alloy are mixed and melted at 1025℃ and 0.1 Pa vacuum for 4 hours. Then the mixture is poured into a mold and cooled to room temperature to obtain a modified copper alloy. The mass ratio of nano silver, nano tin and copper alloy is 1:2:

50. The mass percentage of the copper alloy components is: zinc 29%, manganese 3%, iron 2% and copper 66%. (2) Under oxygen conditions with a pressure of 310 kPa, the alloy powder is coated with modified copper alloy by laser cladding. The process parameters are: laser power of 1500 W and scanning speed of 2 mm / s, to obtain high-performance copper alloy for electronic use; the mass percentage of the alloy powder composition is: aluminum 30%, chromium 30%, tungsten carbide 15%, nickel 20%, cobalt 5%.

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